CN110183101B - Processing method of glass product - Google Patents
Processing method of glass product Download PDFInfo
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- CN110183101B CN110183101B CN201910482790.4A CN201910482790A CN110183101B CN 110183101 B CN110183101 B CN 110183101B CN 201910482790 A CN201910482790 A CN 201910482790A CN 110183101 B CN110183101 B CN 110183101B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/14—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by boring or drilling
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B23/00—Re-forming shaped glass
- C03B23/02—Re-forming glass sheets
- C03B23/023—Re-forming glass sheets by bending
- C03B23/025—Re-forming glass sheets by bending by gravity
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B29/00—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C21/00—Treatment of glass, not in the form of fibres or filaments, by diffusing ions or metals in the surface
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Mining & Mineral Resources (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
The invention provides a processing method of a glass product, which comprises the following steps: 1) cutting the appearance and the inner through hole required by the product on the incoming glass by utilizing picosecond laser, wherein the cut product is still connected with the residual material; 2) performing acid pickling thinning and strengthening treatment on the product and the residual materials; 3) by using CO2The laser marks the center of the inner through hole of the product in a centralized way, the excess glass material of the inner through hole is heated and softened, protrudes downwards and extends under the action of gravity, and then naturally breaks away from the product due to cooling shrinkage; 4) and applying external force to completely separate the product from other glass remnants. The method overcomes the problems of low processing efficiency and easy damage to the surface of the glass in the traditional CNC punching process, ensures that the hole wall of the through hole in the product is smooth, and has the advantages of high strength, high yield and difficult fragmentation.
Description
Technical Field
The invention relates to the technical field of glass product processing, in particular to a processing method of a glass product.
Background
In the current society, the development trend of electronic products such as smart phones, liquid crystal displays, tablet computers and the like tends to develop in the direction of thinner volume, lighter weight and higher technological content of the products. The common point of the products lies in that the glass cover plate structurally comprises an integrated forming structure, and because the internal components (such as an outward convex camera module, a fingerprint identification module and the like) covered by the existing electronic product need to be provided with holes on the integrated forming glass cover plate during installation, the processing difficulty and the processing precision of the integrated forming glass cover plate are greatly improved.
The existing processing method for the glass with the inner through hole mainly comprises a CNC milling processing method and a laser cutting processing method.
1. CNC milling processing method: and grinding the glass surface by adopting a finishing impression device and a grinding wheel rod running at a high rotating speed, penetrating the glass to form a through hole, and trimming the inner wall of the through hole, so that the requirements of the product on dimensional precision and appearance are met.
However, this method has the following problems: most of the existing glass raw materials are free of grinding, the precision engraving equipment is easy to slightly scratch products when the glass raw materials are processed, the scratch percentage is over 50%, the mass production of the products is seriously affected, the scratches can be amplified in the subsequent chemical reduction and polishing process to cause the product to be scrapped, or the aperture of a through hole in the product is changed to cause the size of the product to be difficult to control. In addition, the processing efficiency of the method is too low and the cost for producing auxiliary materials is high; taking the example of processing a circular inner through hole with the diameter of 7 mm: the average processing time of each through hole is 72-75 seconds, and only 20 through holes can be processed by one grinding wheel rod, so that the grinding wheel rod is frequently replaced, the vacuum adsorption of the equipment base is ensured by single-side film coating in the processing process, and the additional cost is increased by adding one film coating process.
2. Laser cutting machining method: and (3) directly performing cyclic processing on the glass raw material in a galvanometer ablation mode by adopting infrared picosecond laser equipment, hollowing the inner part of the through hole layer by layer and enabling the residual material at the position to fall off so as to achieve the effect of forming the through hole.
Although the method has high processing efficiency, the inner wall of the processed through hole is rough, tiny cracks are easy to generate on the hole wall during processing, and the tiny fragments can be amplified in the subsequent ultrasonic cleaning process to cause the strength reduction and even the breakage of the product. In addition, this processing method cannot be applied to the strengthened glass product, and the laser cutting process may cause the glass product to be broken in a whole piece due to the change of the material structure inside the chemically strengthened glass.
Therefore, a new method for processing a glass product with an inner through hole is needed in the industry, and the technical problems of low processing efficiency, high cost loss, more scratches and cracks on the surface of the product and further influence on the strength of the product in the traditional method can be solved.
Disclosure of Invention
The invention aims to provide a processing method which is high in processing efficiency, small in surface damage and excellent in product strength and is suitable for glass products with inner through holes, so as to solve the problems in the background technology.
In order to achieve the above object, the present invention provides a method for processing a glass product, comprising the steps of:
step 1) cutting the appearance and the inner through hole required by a product on incoming glass by utilizing picosecond laser, wherein the cut product is still connected with the residual material;
step 2) strengthening the product and the residual materials;
step 3) utilization of CO2The laser marks the center of the inner through hole of the product in a centralized way, the excess glass material of the inner through hole is heated and softened, protrudes downwards and extends under the action of gravity, and then naturally breaks away from the product due to cooling shrinkage;
and 4) applying external force to completely separate the product from other glass excess materials.
Preferably, the step 2) further comprises a chemical polishing reducing process, namely, before the strengthening treatment, the whole surface thinning of the cut product and the remainder in the thickness direction is realized by carrying out acid pickling etching on the cut product and the remainder. Specifically, the pickling solution can slowly permeate into the glass along the cutting direction of picosecond laser, a chamfering effect is etched on a cutting line between a product and a residual material, and the chamfering structure can be used for assisting the subsequent separation operation of the product and the residual material.
Preferably, the strengthening method adopted in the step 2) is a low-temperature ion exchange method. The low-temperature ion exchange method can form a compressive stress layer on the surface of the glass product, and when the glass product is acted by external force, the compressive stress layer can counteract partial tensile stress, so that the aims of improving the strength of the product and reducing the edge breakage and breakage probability of the product are fulfilled.
Preferably, the acid pickling agent used in step 2) is hydrofluoric acid with a mass fraction of 5%, and the acid pickling and etching process includes soaking the cut product and the remainder in the acid pickling agent.
Preferably, the incoming glass is a glass raw material made of non-alumina materials, the thickness range of the incoming glass after acid washing and thinning treatment is 0.4 mm-1.3 mm, and the thinned thickness is 0.1-0.15 mm. Since hydrofluoric acid cannot react with alumina glass, alumina glass is typically strengthened by annealing.
Preferably, the pickling temperature is 25-35 ℃ and the pickling time is 3-7 min.
Preferably, the picosecond laser in the step 1) has the wavelength of 355-1064 nm, the spot diameter of 0.003-0.004 mm, the duty ratio of 60-100%, the cyclic cutting speed of 60-100 mm/s and the dot spacing of 4-7 μm. The parameters are selected according to the glass thickness and the glass material of the product during actual processing.
Preferably, the focusing point of the picosecond laser in the step 1) during cutting is located at a height of 0.03-0.1 mm above the surface of the glass. From which the glass can be more efficiently transmitted and through the entire glass layer.
Preferably, CO in said step 3)2The laser has the wavelength of 10590-10640 nm, the diameter of a light spot of 1.2-1.5 mm, the marking times of 25-35, the laser frequency of 20-35 Hz and the duty ratio of 30-70%.
Preferably, when a plurality of inner through holes of the glass product to be processed are processed, the on-light delay time of the laser is 100-500 mus, the off-light delay time is 50-200 mus, and the end delay time is 100-500 mus. Because the device has a tiny delay error in the light emission and track movement of the laser, the complete and unrepeated processing effect needs to be adjusted by setting the delay parameters of the light on and off.
The technical scheme provided by the invention at least has the following beneficial effects:
1. the invention provides a novel laser processing technology which can make up the defects of the traditional technology in processing the through hole in the glass product, thereby not only avoiding the problems of poor glass appearance, low processing efficiency, overhigh processing cost and the like caused by the CNC punching technology, but also avoiding the problems of rough inner wall of the through hole, insufficient product strength and the like caused by the laser galvanometer ablation technology; the processing method can be suitable for processing glass products with different thicknesses and different apertures, greatly improves the product yield of the glass panel with the through hole and is beneficial to expanding the scale of mass production.
2. The method comprises the steps of firstly forming a circle of crack points in the glass through first laser cutting, then enabling the product to meet the strength requirement and be convenient for later separation from the excess material through chemical polishing reduction and strengthening treatment, and finally enabling the excess material of the glass to be gradually softened through second laser marking on the surface of the glass and naturally fall off under the action of cooling shrinkage and gravity so as to realize through hole forming.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, it is obvious that the drawings described below are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without inventive efforts, wherein:
FIG. 1 is a schematic representation of the CO processing of the product of example 1 of the present invention2A schematic diagram of laser stamping;
FIG. 2 is a schematic representation of the product of example 1 of the present invention after processing;
wherein: 1 incoming glass, 2 products, 3 through holes, 4CO2And marking the position by laser.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
Referring to fig. 1 and 2, a method of processing a glass product includes the steps of:
step 1) cutting an appearance and an inner through hole 3 required by a product on incoming glass 1 with the thickness of 0.6mm +/-0.03 mm by utilizing picosecond laser, wherein the cut product 2 is still connected with the residual material;
step 2) soaking the cut product 2 and the residual material in hydrofluoric acid with the mass fraction of 5%, reducing the thickness of the product 2 and the residual material to between 0.48mm and 0.51mm through acid cleaning, etching a chamfered edge with the chamfer angle of 0.05mm +/-0.05 mm along two sides of a cutting line, and then performing strengthening treatment on the product and the residual material after chemical polishing by adopting a low-temperature ion exchange method;
step 3) utilization of CO2The laser carries on the circulation marking to its surface in the inner through hole 3 central position of the product, the excess glass material of the inner through hole is heated and softened and is projected and extended downward under the action of gravity, shrink and drop from the product 2 after the natural cooling;
step 4) completely separating the product 2 from the other glass remnants by hand or by soft glue sticks with large contact surface.
In the above process:
in the step 1), the wavelength of the picosecond laser is 1030nm, the diameter of a light spot is 0.003mm, the cutting power is 8W, the duty ratio is 90%, the circulating cutting speed is 80mm/s, the point spacing is 5.5 mu m, and the focusing point of the picosecond laser is positioned at the height of 0.05mm above the surface of the glass.
The pickling temperature in the step 2) is 30 ℃ and the pickling time is 5 min; the preheating furnace is used for preheating during glass strengthening and the manual strengthening furnace is pressurized, wherein, the tapping stress standard has: CS is more than or equal to 720MPA, DOL is more than or equal to 37um, CT is less than or equal to 106MPA, the temperature change of the preheating furnace is required to be controlled within plus or minus 20 ℃, the temperature change of the manual strengthening furnace is required to be controlled within plus or minus 2 ℃, the furnace water depth of the manual strengthening furnace is required to be more than 50mm higher than the product, and the pressurized environment temperature is controlled to be more than 45 ℃.
CO in step 3)2The laser wavelength is 10640nm, the spot diameter is 1.5mm, the marking speed is 30 times, the laser frequency is 30Hz, and the duty ratio is 50%. In this embodiment, since a plurality of glass products are processed on the same glass frit, the on-delay, the off-delay, and the end-delay of the laser are set to 200 μ s, 100 μ s, and 150 μ s, respectively.
The method comprises the steps of firstly cutting the appearance and the through hole of a product by using a picosecond cutting machine, then carrying out acid cleaning thinning and pressure strengthening, and finally passing through CO with high energy density2Laser beam to via location in glass (i.e. CO)2Irradiating the surface of the laser marking position 4), melting and deforming the glass excess material at the through hole part in the product by the generated high temperature, and naturally falling off after cooling by utilizing the good plasticity and ductility of the glass. The method makes full use of the natural characteristics of the glass, ensures the required strength of the processed product, avoids the problem of poor appearance caused by the traditional process, and greatly improves the yield and the processing efficiency of the product.
The above description is only a preferred embodiment of the present invention and is not intended to limit the scope of the present invention, and various modifications and changes may be made by those skilled in the art. Any improvement or equivalent replacement directly or indirectly applied to other related technical fields within the spirit and principle of the invention and the contents of the specification and the drawings of the invention shall be included in the protection scope of the invention.
Claims (10)
1. A method for processing a glass product, comprising the steps of:
step 1) cutting the appearance and the inner through hole required by a product on incoming glass by utilizing picosecond laser, wherein the cut product is still connected with the residual material;
step 2) strengthening the product and the residual materials;
step 3) utilization of CO2The laser marks the central position of the inner through hole of the product in a centralized way, the excess glass material of the inner through hole is heated and softened, and is protruded downwards and extended under the action of gravity, and then the excess glass material is drawn outNaturally separating from the product after cooling and shrinking;
and 4) applying external force to completely separate the product from other glass excess materials.
2. A method for processing a glass product according to claim 1, wherein the step 2) further comprises a chemical reduction polishing process of performing acid pickling etching on the cut product and the remainder to reduce the thickness of the product and the remainder in the whole surface before the strengthening treatment.
3. The method as claimed in claim 2, wherein the pickling agent used in step 2) is hydrofluoric acid with a mass fraction of 5%, and the pickling etching process comprises immersing the cut product and the remainder in the pickling agent.
4. The method according to claim 3, wherein the incoming glass is a glass raw material made of a non-alumina material, and the incoming glass is subjected to the acid washing and thinning treatment to have a thickness of 0.4mm to 1.3mm and a thinned thickness of 0.1mm to 0.15 mm.
5. The method according to claim 4, wherein the pickling temperature is 25 to 35 ℃ and the pickling time is 3 to 7 min.
6. The method for processing a glass product according to claim 4, wherein the picosecond laser in the step 1) has a wavelength of 1010 to 1064nm, a spot diameter of 0.003 to 0.004mm, a duty ratio of 60 to 100%, a cyclic cutting speed of 60 to 100mm/s, and a dot pitch of 4 to 7 μm.
7. The method for processing a glass product according to claim 6, wherein the focusing point of the picosecond laser in step 1) during cutting is located at a height of 0.03-0.1 mm above the surface of the glass.
8. A method of processing a glass product according to claim 7, wherein the CO in step 3) is2The laser has the wavelength of 10590-10640 nm, the diameter of a light spot of 1.2-1.5 mm, the marking times of 25-35, the laser frequency of 20-35 Hz and the duty ratio of 30-70%.
9. The method according to any one of claims 1 to 8, wherein the laser has an on-delay of 100 to 500 μ s, an off-delay of 50 to 200 μ s, and an off-delay of 100 to 500 μ s when processing the plurality of inner through holes of the glass product to be processed.
10. Use of a glass product prepared by the processing method of any one of claims 1 to 9 in an electronic product.
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| CN201910482790.4A CN110183101B (en) | 2019-06-04 | 2019-06-04 | Processing method of glass product |
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| CN201910482790.4A CN110183101B (en) | 2019-06-04 | 2019-06-04 | Processing method of glass product |
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| CN110183101B true CN110183101B (en) | 2022-02-01 |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110526564A (en) * | 2019-09-16 | 2019-12-03 | 蓝思科技（长沙）有限公司 | A kind of glass splinter method |
| CN111777322A (en) * | 2020-07-27 | 2020-10-16 | 苏州新吴光电科技有限公司 | Glass cover plate and processing method thereof |
| CN115385578B (en) * | 2022-07-29 | 2023-11-28 | 惠州市清洋实业有限公司 | Chemical perforation manufacturing process for camera lens |
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| US9919380B2 (en) * | 2013-02-23 | 2018-03-20 | Coherent, Inc. | Shaping of brittle materials with controlled surface and bulk properties |
| KR102467419B1 (en) * | 2016-05-13 | 2022-11-16 | 삼성디스플레이 주식회사 | Method for manufacturing display apparatus |
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| CN102229466A (en) * | 2011-06-03 | 2011-11-02 | 深圳光韵达光电科技股份有限公司 | Method and device for performing nano-second laser cutting on glass |
| CN105392593A (en) * | 2013-03-21 | 2016-03-09 | 康宁激光技术有限公司 | Device and method for cutting out contours from planar substrates by means of a laser |
| CN106029589A (en) * | 2013-12-17 | 2016-10-12 | 康宁股份有限公司 | Laser cutting composite glass article and method of cutting |
| CN106946444A (en) * | 2016-09-12 | 2017-07-14 | 关键应用科技股份有限公司 | 3D glass-making processes |
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