CN110181898A - Bamboo fiber composite board and its manufacturing method - Google Patents
Bamboo fiber composite board and its manufacturing method Download PDFInfo
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- CN110181898A CN110181898A CN201810154570.4A CN201810154570A CN110181898A CN 110181898 A CN110181898 A CN 110181898A CN 201810154570 A CN201810154570 A CN 201810154570A CN 110181898 A CN110181898 A CN 110181898A
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- 235000017166 Bambusa arundinacea Nutrition 0.000 title claims abstract description 91
- 235000017491 Bambusa tulda Nutrition 0.000 title claims abstract description 91
- 241001330002 Bambuseae Species 0.000 title claims abstract description 91
- 235000015334 Phyllostachys viridis Nutrition 0.000 title claims abstract description 91
- 239000011425 bamboo Substances 0.000 title claims abstract description 91
- 239000000835 fiber Substances 0.000 title claims abstract description 90
- 239000002131 composite material Substances 0.000 title claims abstract description 70
- 238000004519 manufacturing process Methods 0.000 title claims description 18
- 239000000758 substrate Substances 0.000 claims abstract description 137
- 239000000463 material Substances 0.000 claims description 80
- 238000010438 heat treatment Methods 0.000 claims description 36
- 238000000034 method Methods 0.000 claims description 25
- 239000012530 fluid Substances 0.000 claims description 5
- 238000004891 communication Methods 0.000 claims description 4
- 229920000178 Acrylic resin Polymers 0.000 claims description 3
- 239000004925 Acrylic resin Substances 0.000 claims description 3
- 239000000088 plastic resin Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 144
- 238000010586 diagram Methods 0.000 description 12
- 229920005992 thermoplastic resin Polymers 0.000 description 9
- 239000003365 glass fiber Substances 0.000 description 7
- 239000002356 single layer Substances 0.000 description 7
- 238000012546 transfer Methods 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 4
- 230000007613 environmental effect Effects 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 239000002657 fibrous material Substances 0.000 description 3
- -1 polypropylene Polymers 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 2
- 230000003321 amplification Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 239000000805 composite resin Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R13/00—Elements for body-finishing, identifying, or decorating; Arrangements or adaptations for advertising purposes
- B60R13/02—Internal Trim mouldings ; Internal Ledges; Wall liners for passenger compartments; Roof liners
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/06—Vegetal fibres
- B32B2262/062—Cellulose fibres, e.g. cotton
- B32B2262/065—Lignocellulosic fibres, e.g. jute, sisal, hemp, flax, bamboo
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2323/00—Polyalkenes
- B32B2323/10—Polypropylene
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2605/00—Vehicles
- B32B2605/003—Interior finishings
Landscapes
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
- Dry Formation Of Fiberboard And The Like (AREA)
Abstract
The present invention provides a kind of bamboo fiber composite boards, include: the upper substrate layer including bamboo fibre；It is connected to the lower substrate layer that substrate layer includes bamboo fibre, wherein being provided with the air-flow guide through hole that multiple through-thickness extend on lower substrate layer so that upper substrate layer is led in air-flow guidance.
Description
Technical field
The present invention relates to a kind of bamboo fiber composite board and its manufacturing methods.
Background technique
With the raising of environmental requirement, vehicular manufacturer substitutes traditional glass fibers seeking a kind of natural environmental-protective material
Tie up polyester material.Natural-fiber composite material such as bamboo fiber composite material is a kind of reproducible material of green, with good
Good mechanical property and at low cost, is widely used to vehicle interior part.
Summary of the invention
According to an aspect of the present invention, a kind of bamboo fiber composite board is provided, includes: the upper substrate layer including bamboo fibre；Connection
Supreme substrate layer includes the lower substrate layer of bamboo fibre, wherein being provided with the air-flow that multiple through-thickness extend on lower substrate layer
Guide through hole is to lead to upper substrate layer for air-flow guidance.
In one embodiment, the aperture of the first air-flow guide through hole is 10mm, and the spacing between guide through hole is
150mm。
In another embodiment, the thickness of lower substrate layer is greater than upper substrate layer.
In another embodiment, upper substrate layer and lower substrate layer further include thermoplastic resin.
In another embodiment, upper substrate layer and lower substrate layer include about 40%~60% bamboo fibre and about 60%~
40% acrylic resin.
In another embodiment, the bamboo fibre content in lower substrate layer is lower than upper substrate layer.
In another embodiment, at least one intermediate base between upper substrate layer and lower substrate layer is further included
Material layer, includes multiple air-flow guiding grooves on intermediate base material layer, and air-flow guiding groove extends in the plane of the intermediate base material layer, runs through
The thickness of the intermediate base material layer simultaneously is connected to form airflow path with the air-flow guide through hole on lower backing material plate.
In another embodiment, the air-flow guide through hole of lower substrate layer is substantially circular, the air-flow gas of intermediate base material layer
Flowing guiding groove is the elongate slot being set parallel to each other, and air-flow guide through hole and air-flow guiding groove are least partially overlapped.
In another embodiment, at least one intermediate base material layer include the first intermediate base material layer of neighbouring lower substrate layer with
And the second intermediate base material layer of neighbouring upper substrate layer, the first intermediate base material layer are equipped with multiple first air-flow guiding grooves, in second
Between substrate layer be equipped with multiple second air-flow guiding grooves, the first air-flow guiding groove and the second air-flow guidance fluid communication.
In another embodiment, the first air-flow guiding groove and the second air-flow guiding groove are projected as handing on upper substrate layer
Fork setting.
In another embodiment, the first air-flow guiding groove is at least partly aligned with air-flow guide through hole.
In another embodiment, multiple guide through hole form multiple rows, and the spacing of multiple rows is substantially equal to the first guidance
Spacing between slot.
In another embodiment, the thickness of upper substrate layer, lower substrate layer and at least one intermediate base material layer substantially phase
Together.
According to another aspect of the present invention, a kind of manufacturing method of bamboo fiber composite board is provided, includes: base in offer
Material layer；Lower substrate layer is provided；The air-flow guide through hole that multiple through-thickness extend is formed on lower substrate layer；Heating plate is provided
Upper substrate layer and lower substrate layer are heated so that thermal current flows to upper substrate layer via air-flow guide through hole.
In one embodiment, heating plate includes upper heating plate and lower heating plate, and the temperature of upper heating plate is lower than lower heating
The temperature of plate.
In another embodiment, this method further provides at least one intermediate base material layer, and intermediate base material layer is equipped with more
The air-flow guide through hole of a elongated air-flow guiding groove, air-flow guiding groove and lower substrate layer is in fluid communication.
In another embodiment, at least one intermediate base material layer includes the first intermediate base material layer and the second intermediate base material
Layer, the first intermediate base material layer are equipped with multiple first air-flow guiding grooves, and the second intermediate base material layer is equipped with multiple second air-flows and draws
Guide groove, the first air-flow guiding groove and the second air-flow guiding groove being projected as on upper substrate layer are arranged in a crossed manner.
In another embodiment, this method is further included upper substrate layer, lower substrate layer and at least through heating
One intermediate base material layer links together.
In another embodiment, this method further comprise formed by needling process upper substrate layer, lower substrate layer with
And at least one intermediate base material layer.
In another embodiment, this method, which further includes, provides mold to upper substrate layer and the forming of lower substrate layer.
In conjunction with attached drawing according to the one or more embodiments being described below in detail, one or more features of the invention and/or
Advantage can be apparent.
Detailed description of the invention
Fig. 1 describes the enlarged diagram of an example bamboo fibre.
Fig. 2A describes the perspective view exploded view of the bamboo fiber composite board of one or more embodiments according to the present invention.
Fig. 2 B describes the partial enlargement diagram of the bamboo fiber composite board in Fig. 2A.
Fig. 3 A describes the schematic diagram for providing mold to shape guide through hole on lower substrate layer.
Fig. 3 B describes the schematic diagram for providing heating plate to be heated to upper backing material plate and lower backing material plate.
Fig. 3 C describes the schematic diagram for providing mold so that backing material plate to be formed.
Fig. 4 describes the manufacturing method flow chart of the bamboo fiber composite board of one or more embodiments according to the present invention.
Fig. 5 describe one or more embodiment according to the present invention bamboo fiber composite board and traditional bamboo fibre it is compound
The heating efficiency comparison diagram of plate.
Fig. 6 describes the perspective view exploded view of the bamboo fiber composite board of alternate embodiment according to the present invention.
Fig. 7 describes section enlarged diagram of the bamboo fiber composite board in Fig. 6 along line B-B.
Fig. 8 describes the manufacturing method flow chart of the bamboo fiber composite board of alternate embodiment according to the present invention.
Fig. 9 describes the bamboo fiber composite board of alternate embodiment according to the present invention and adding for traditional bamboo fiber composite board
Thermal efficiency comparison diagram.
Specific embodiment
As needed, specific embodiment of the present invention is disclosed in this specification；It however, it should be understood that disclosed embodiment only
It can be implemented for example of the invention and with a variety of alternative forms.Attached drawing is not necessarily to scale；Some spies can be zoomed in or out
Levy the details to show particular elements.So specific structural and functional details disclosed herein should not be construed as limiting, and only
To instruct those skilled in the art to implement representative basis of the invention in a variety of forms.
Automotive upholstery is usually formed by glass fibre and resin composite materials, such as glass fibre and polyacrylic compound
Material.However the composite material is difficult to degrade and is unfavorable for environmental protection.With the raising of environmental requirement, industry is being researched and developed naturally
Fibrous composite substitutes glass fibre, such as bamboo fibre.It is able to produce out by processing bamboo fibre with resin material high-strength
Degree low cost and the bamboo fiber composite material of environmental protection.Bamboo fiber composite material can be widely used for vehicle interior part, such as after
Windowsill, luggage compartment carpet etc..In process, it needs to toast bamboo fiber composite material to reduce moisture.It please join
Fig. 1 is examined, Fig. 1 describes the schematic diagram of the amplification of bamboo fiber material 100.Due to the natural characteristic of bamboo fibre, with multiple micro-
Pore structure 102, these microcellular structures 102 can store heat and be unfavorable for heat transfer.Meanwhile having about compared to glass fibre
The thickness of 0.012mm, the thickness of bamboo fibre is thicker to have reached 0.12mm.The thermal conductivity of glass fibre is 1.46W/Mk and bamboo fibre
Thermal conductivity be 0.1W/Mk.Therefore, compared to glass fiber compound material, how to improve the heating side of bamboo fiber composite material
Method and heating efficiency are at a problem.
The bamboo fiber composite board 200 of one or more embodiments according to the present invention is described with reference to Fig. 2A and 2B, Fig. 2A
Perspective view exploded view.Fig. 2 B describes the partial enlargement diagram of the bamboo fiber composite board 200 in Fig. 2A.One or more real
It applies in example, bamboo fiber composite board 200 includes upper substrate layer 202 and is connected to the lower substrate layer 204 of substrate layer 202, wherein
The air-flow guide through hole 206 that multiple through-thickness W extend is provided on lower substrate layer 204 so that upper substrate is led in air-flow guidance
Layer 202.In one or more embodiments, the diameter D of guide through hole 206 can be about 10mm, and between guide through hole 206
Spacing can be set as about 150mm.Certainly, the diameter D of air-flow guide through hole 206 and interval S can be adjusted according to specific application
Section is to obtain balance between the intensity and heating efficiency of composite plate.In one or more embodiments, bamboo fiber composite board 200
Upper substrate layer 202 and lower substrate layer 204 further include thermoplastic resin.In one or more embodiments, thermoplastic resin
Include, but not limited to, e.g. polypropylene, polyethylene etc..In one or more embodiments, upper substrate layer and lower substrate layer include about
40%~60% bamboo fibre and about 60%~40% acrylic resin.In order to preferably improve heating efficiency, at one or
In multiple embodiments, the bamboo fibre content in lower substrate layer can be passed lower than the bamboo fibre content in upper substrate layer in favor of heat
It leads.
The manufacturing method stream of bamboo fiber composite board is described with further reference to Fig. 4 and with reference to Fig. 2A -2B and Fig. 3 A-3C, Fig. 4
Journey Figure 70 0.Method 700 starts at 702, at 702, provides substrate layer 202 and lower substrate layer 204.In one or more
In embodiment, bamboo fiber material and thermoplastic resin can be processed as to the upper base of bamboo fiber composite board 200 by needling process
Material layer 202 and lower substrate layer 204.At 704, method 700 shapes multiple air-flow guide through hole 206 on lower substrate layer 204.
The molding of air-flow guide through hole can carry out in any technique.For example, with reference to Fig. 3 A, the molding of air-flow guide through hole can in mold or
Press machine 300 carries out.Press machine 300 includes upper stamping die 302 and lower mold 304.Upper mold 302 has multiple moldings
The protrusion 306 of air-flow guide through hole.Although figure protrusion 306 is cylinder to form cylindrical hole, it should be understood that raised 306 can be
Any suitable shape, such as frustum of a cone is to form the through-hole with frusto-conical.
At 706, method 700 heats upper substrate layer 202 and lower substrate layer 204 by heating device 400.One
In a or multiple embodiments, heating device 400 includes upper heating plate 402 and lower heating plate 404.In one or more embodiments
In, in order to save energy, the temperature of lower heating plate 404 can be higher than upper heating plate 402.It is more due to having on lower substrate layer 204
A air-flow guide through hole 206, when heating to upper substrate layer 202 and lower substrate layer 204, stream of hot air is from lower backing material plate
204 flow to upper backing material plate 202 by multiple air-flow guide through hole 206, increase heat transfer.
In one or more embodiments, due in substrate layer there is thermoplastic resin to be such as, but not limited to polypropylene,
Thermoplastic resin melts and upper substrate layer 202 and lower substrate layer 204 links together in heating process.That is, at 706, side
Method 700 includes connecting upper substrate layer 202 and lower substrate layer 204.
Next, method 700 provides mold system 500 to upper substrate layer 202 and the molding of lower substrate layer 204 at 708
Forming.Mold system 500 includes that bamboo fiber composite board 200 is pressed into any desired shape by upper mold 502 and lower mold 504
Shape.
The bamboo fiber composite board 200 and tradition of one or more embodiments according to the present invention are shown with reference to Fig. 5, Fig. 5
Single layer bamboo fiber composite board heating efficiency comparison diagram.The density of traditional single layer bamboo fiber composite board be 1700gsm (gram/
Square metre).Such as in one embodiment of the invention, bamboo fiber composite board 200 has upper substrate layer 202 and lower substrate layer
204.Each layer all has the density of about 850gsm, and the density of bamboo fiber composite board is about 1700gsm.Air-flow on lower substrate layer
The diameter D of guide through hole 206 is about 10mm, and the spacing between air-flow guide through hole 206 is 150mm.It is being heated to 200 DEG C of temperature
When, it is about 160 seconds and when bamboo fiber composite board of the invention needs to heat that the bamboo fiber composite board of single layer, which needs heating time,
Between about 110 seconds.Bamboo fiber composite board 200 provided by the invention can shorten the hot-working time significantly to improve manufacture effect
Rate.
It is decomposed with reference to Fig. 6, Fig. 6 perspective view for describing the bamboo fiber composite board 600 of alternate embodiment according to the present invention
Figure.In one or more embodiments, bamboo fiber composite board 600 includes upper substrate layer 602, lower substrate layer 604 and is located at upper
At least one intermediate base material layer 606 between substrate layer 602 and lower substrate layer.In one or more embodiments, lower substrate layer
The air-flow guide through hole 608 that multiple through-thickness W extend is provided on 602 so that upper substrate layer 602 is led in air-flow guidance.Into
One step, it include multiple air-flow guiding grooves 610 on intermediate base material layer 606, and on air-flow guiding groove 610 and lower backing material plate 602
Air-flow guide through hole 608 connection form airflow path.In one or more embodiments, 608 base of air-flow guide through hole
This is circle, and air-flow guiding groove 610 is the elongate slot being set parallel to each other.Further, air-flow guide through hole 608 is drawn with air-flow
Guide groove 610 is least partially overlapped to form airflow path.
In one or more embodiments, at least one intermediate base material layer 606 includes include neighbouring lower substrate layer 604 the
The second intermediate base material layer 606b of one intermediate base material layer 606a and neighbouring upper substrate layer 602.Wherein the first intermediate base material layer
606a is equipped with multiple first air-flow guiding groove 610a, and the second intermediate base material layer 606b is equipped with multiple second air-flow guiding grooves
610b, the first air-flow guiding groove 610a and the second air-flow guiding groove 610b are in fluid communication.
With reference to Fig. 7 and Fig. 6, Fig. 7 is combined to describe the bamboo fiber composite board 600 in Fig. 6 along the amplification signal of the section of line B-B
Figure.In one or more embodiments, the first air-flow guiding groove 610a be at least partly aligned with air-flow guide through hole 608 so that
Stream of hot air can be transmitted to the first guiding groove 610a from air-flow guide through hole 608.In the illustrated embodiment, air-flow guidance is logical
Hole 608 is conical butt.The circulation that the area of frustum of a cone reduces along airflow direction in favor of air-flow.It should be understood that air-flow draws
Via hole 608 can have any suitable shape for example cylindrical.First air-flow guiding groove 610a and the second air-flow guiding groove
610b connection.Further, multiple air-flow guide through hole 608 can form multiple rows, and the interval S 1 of multiple rows is substantially equal to first
Interval S 2 between air-flow guiding groove 610a is so that the first air-flow guiding groove 610a and at least one or more air-flow guide through hole
608 alignment are connected to improve the efficiency of transmission hot-air.In one or more embodiments, the first air-flow guiding groove 610a with
Second air-flow guiding groove 610b can be arranged in a crossed manner, i.e., the projection intersection on upper substrate layer 602.In this way, being passed through in hot-air
Heat transfer can be carried out over a greater surface area after being transmitted to middle layer 606 by air-flow guide through hole 608, and finally via
Two air-flow guiding groove 610b are transmitted to substrate layer 602.In addition, multiple first air-flows on the first intermediate base material layer 606a guide
Multiple second air-flow guiding groove 610b on slot 610a and the second intermediate base material layer 606b are arranged in a crossed manner in the feelings for improving Heat transmission
The integral strength of bamboo fiber composite board 600 is maintained under condition.Further, due to multiple on the first intermediate base material layer 606a
Multiple second air-flow guiding groove 610b on one air-flow guiding groove 610a and the second intermediate base material layer 606b are arranged in a crossed manner, at one
Or in multiple embodiments, the interval S 3 between the second air-flow guiding groove 610b is unnecessary equal to interval S 1 or S2, can basis
Concrete application and adjust.For example, in order to increase efficiency of thermal transfer, interval S 3 can be less than interval S 1 and S2.In order to force fiber
The integral strength of composite plate 600, interval S 3 can be greater than interval S 1 and S2.
The manufacturing method 800 of the bamboo fiber composite board 600 of alternate embodiment according to the present invention is described with reference to Fig. 8, Fig. 8
Flow chart.It should be understood that method 800 can the forming through holes system similar with method 700, heating system and mold system into
Row.In one or more embodiments, at 802, method 800 provides upper substrate layer 602, lower substrate layer 604 and at least one
A intermediate base material layer 606.It in one or more embodiments, can be by needling process by bamboo fiber material and thermoplastic resin
It is processed as the upper substrate layer 602, lower substrate layer 604 and at least one intermediate base material layer 606 of bamboo fiber composite board 600.804
Place, method 800 shape multiple air-flow guide through hole 608 by mold on lower substrate layer 604.Next, at 806, method
800 shape multiple air-flow guiding grooves 610 by mold at least one intermediate base material layer 606.Further, at 808, side
Method 800 heats upper substrate layer 602 and lower substrate layer 604 by heating plate.Since stream of hot air is logical from lower backing material plate 604
Cross multiple air-flow guide through hole 608 and multiple air-flow guiding grooves 610 flow to backing material plate 202, airflow path increase to
Improve heat transfer efficiency.In one or more embodiments, due in substrate layer there is thermoplastic resin to be such as, but not limited to poly- third
Alkene, during heating thermoplastic resin fusing and by upper substrate layer 602, lower substrate layer 604 and at least one intermediate base material
Layer 606 links together.That is, at 808, method 800 includes connecting upper substrate layer 602, lower substrate layer 604 and at least one
Intermediate base material layer 606.
Finally, at 810, method 800 provide mold with to upper substrate layer 602, lower substrate layer 604 and at least one in
Between 606 die forming of substrate layer to form final component.
Bamboo fiber composite board 600 according to the present invention and traditional single layer bamboo fiber composite board are described with reference to Fig. 9, Fig. 9
Heating efficiency comparison diagram.The density of traditional single layer bamboo fiber composite board is 2600gsm (gram/m).Bamboo fibre is compound
Plate 600 has upper substrate layer 602, lower substrate layer 604 and at least one intermediate base material layer 606.Each layer all has 650gsm
Density.The density of entire bamboo fiber composite board is 2600gsm.And the diameter D of the air-flow guide through hole 608 on lower substrate layer
About 10mm is spaced about 150mm between air-flow guide through hole 608.When being heated to 160 DEG C of temperature, the bamboo fibre of single layer
It is about 145 seconds that composite plate, which needs heating time,.It is about 115 seconds that bamboo fiber composite board 600 of the invention, which needs heating time,.Cause
This, bamboo fiber composite board 600 provided by the invention can shorten the hot-working time to improve manufacture efficiency.
Although in the above embodiments, each substrate layer of bamboo fiber composite board has roughly equal thickness.However, bamboo
Each substrate layer of fiber composite plate also can have different thickness.Such as in one or more embodiments, due to lower base
It is provided with air-flow guide through hole and air-flow guiding groove on material layer and/or intermediate base material layer, lower substrate layer and/or intermediate base material layer
Thickness can be greater than the thickness of upper substrate layer without influencing the thermal efficiency.
In one or more embodiments, the present invention is by being divided into several layers knot for traditional single layer bamboo fiber composite board
Structure, and go to a grassroots level and/or intermediate base material layer in air-flow guide through hole and/or air-flow guiding groove are provided can effectively increase
Efficiency is toasted, improves production efficiency significantly.
These are only the preferred embodiment of the present invention, is not intended to restrict the invention, for those skilled in the art
For member, the invention may be variously modified and varied.All within the spirits and principles of the present invention, it is made it is any modification,
Equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (20)
1. a kind of bamboo fiber composite board, includes:
Upper substrate layer including bamboo fibre；
It is connected to the lower substrate layer that the upper substrate layer includes bamboo fibre, wherein being provided on the lower substrate layer multiple along thickness
The air-flow guide through hole that degree direction extends is to lead to the upper substrate layer for air-flow guidance.
2. bamboo fiber composite board according to claim 1, wherein the aperture of the air-flow guide through hole is 10mm, and institute
Stating the spacing between air-flow guide through hole is 150mm.
3. bamboo fiber composite board according to claim 1, wherein the thickness of the lower substrate layer is greater than the upper substrate layer.
4. bamboo fiber composite board according to claim 1, wherein the upper substrate layer and the lower substrate layer further include heat
Plastic resin.
5. bamboo fiber composite board according to claim 2 is set, wherein the upper substrate layer and lower substrate layer include about 40%
~60% bamboo fibre and about 60%~40% acrylic resin.
6. bamboo fiber composite board according to claim 5, wherein the bamboo fibre content in the lower substrate layer is lower than described
Upper substrate layer.
7. bamboo fiber composite board according to claim 1, further include positioned at the upper substrate layer and lower substrate layer it
Between at least one intermediate base material layer, include multiple air-flow guiding grooves on the intermediate base material layer, the air-flow guiding groove is in institute
The plane for stating intermediate base material layer extends, through the intermediate base material layer thickness and with the guidance on the lower backing material plate it is logical
Hole is connected to form airflow path.
8. bamboo fiber composite board according to claim 7, wherein the air-flow guide through hole of the lower substrate layer is essentially justified
Shape, the air-flow guiding groove of the intermediate base material layer are the elongate slot being set parallel to each other, the air-flow guide through hole and the gas
It is least partially overlapped to flow guiding groove.
9. bamboo fiber composite board according to claim 7, wherein at least one described intermediate base material layer includes neighbouring described
Second intermediate base material layer of the first intermediate base material layer of lower substrate layer and the neighbouring upper substrate layer, first intermediate base material
Layer is equipped with multiple first air-flow guiding grooves, and the second intermediate base material layer is equipped with multiple second air-flow guiding grooves, and described the
One air-flow guiding groove and second air-flow guide fluid communication.
10. bamboo fiber composite board according to claim 9, wherein the first air-flow guiding groove and second air-flow draw
Guide groove being projected as on the upper substrate layer is arranged in a crossed manner.
11. bamboo fiber composite board according to claim 10, wherein the first air-flow guiding groove and the air-flow guide
Through-hole is at least partly aligned.
12. bamboo fiber composite board according to claim 11, wherein the multiple guide through hole forms multiple rows, Duo Gehang
Spacing be substantially equal to the spacing between the first guiding groove.
13. bamboo fiber composite board according to claim 7, wherein the upper substrate layer, lower substrate layer and at least one
The thickness of intermediate base material layer is roughly the same.
14. a kind of manufacturing method of bamboo fiber composite board, includes:
Upper substrate layer including bamboo fibre is provided；
Lower substrate layer including bamboo fibre is provided；
The air-flow guide through hole that multiple a through-thickness extend is formed on the lower substrate layer；
Heating plate is to the upper substrate layer and the lower substrate layer is heated so that thermal current is guided via the air-flow for offer
Through-hole flows to the upper substrate layer.
15. manufacturing method according to claim 14, wherein the heating plate includes upper heating plate and lower heating plate, it is described
The temperature of upper heating plate is lower than the temperature of lower heating plate.
16. manufacturing method according to claim 14, it is further provided at least one intermediate base material layer, the intermediate base material
Layer is equipped with multiple elongated air-flow guiding grooves, the air-flow guide through hole fluid company of the air-flow guiding groove and the lower substrate layer
It is logical.
17. the manufacturing method according to claim 16, wherein at least one described intermediate base material layer includes the first intermediate base
Material layer and the second intermediate base material layer, the first intermediate base material layer is equipped with multiple first air-flow guiding grooves, among described second
Substrate layer is equipped with multiple second air-flow guiding grooves, and the first air-flow guiding groove and the second air-flow guiding groove are on described
Being projected as on substrate layer is arranged in a crossed manner.
18. the manufacturing method according to claim 16, further include the upper substrate layer, lower base through the heating
Material layer and at least one intermediate base material layer link together.
19. the manufacturing method according to claim 16 further comprises forming the upper substrate layer, institute by needling process
State lower substrate layer and at least one described intermediate base material layer.
20. manufacturing method according to claim 14 further includes and provides mold to the upper substrate layer and lower base
The forming of material layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810154570.4A CN110181898A (en) | 2018-02-23 | 2018-02-23 | Bamboo fiber composite board and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810154570.4A CN110181898A (en) | 2018-02-23 | 2018-02-23 | Bamboo fiber composite board and its manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110181898A true CN110181898A (en) | 2019-08-30 |
Family
ID=67713382
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810154570.4A Pending CN110181898A (en) | 2018-02-23 | 2018-02-23 | Bamboo fiber composite board and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110181898A (en) |
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2018
- 2018-02-23 CN CN201810154570.4A patent/CN110181898A/en active Pending
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