CN110181371A - A kind of solder joint grinding apparatus - Google Patents
A kind of solder joint grinding apparatus Download PDFInfo
- Publication number
- CN110181371A CN110181371A CN201910291953.0A CN201910291953A CN110181371A CN 110181371 A CN110181371 A CN 110181371A CN 201910291953 A CN201910291953 A CN 201910291953A CN 110181371 A CN110181371 A CN 110181371A
- Authority
- CN
- China
- Prior art keywords
- solder joint
- grinding apparatus
- unit
- plate
- pedestal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 38
- 238000000227 grinding Methods 0.000 title claims abstract description 35
- 238000005498 polishing Methods 0.000 claims abstract description 46
- 239000000428 dust Substances 0.000 claims abstract description 23
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 28
- 238000003825 pressing Methods 0.000 claims description 9
- 210000004209 hair Anatomy 0.000 claims description 6
- 238000005086 pumping Methods 0.000 claims description 6
- 230000006835 compression Effects 0.000 claims 2
- 238000007906 compression Methods 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 8
- 239000002699 waste material Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- BVPWJMCABCPUQY-UHFFFAOYSA-N 4-amino-5-chloro-2-methoxy-N-[1-(phenylmethyl)-4-piperidinyl]benzamide Chemical compound COC1=CC(N)=C(Cl)C=C1C(=O)NC1CCN(CC=2C=CC=CC=2)CC1 BVPWJMCABCPUQY-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 210000003739 neck Anatomy 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0092—Grinding attachments for lathes or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a kind of solder joint grinding apparatus, comprising: compressing unit, sanding unit, dust removing units, the compressing unit are set to the top of the sanding unit, and the dust removing units are connected with the sanding unit.By the above-mentioned means, a kind of solder joint grinding apparatus of the present invention, can simultaneously polish to interiors of products many places solder joint, work efficiency is high, and polishing quality is stable and precision is high.
Description
Technical field
The present invention relates to solder joint grinding apparatus fields, more particularly to a kind of solder joint grinding apparatus.
Background technique
When welding other widgets on the products such as plate in mobile phone, solder joint outstanding can be left, solder joint not only will affect production
The quality and performance of product, nor it is beautiful, so butt welding point is needed to polish.Existing solder joint grinding technology is mostly artificial hand
Dynamic polishing, labor intensive, low efficiency, unstable quality of polishing, precision are low.
Summary of the invention
The invention mainly solves the technical problem of providing a kind of solder joint grinding apparatus, have unfailing performance height, positioning accurate
Really, the advantages that compact-sized, at the same the application of solder joint grinding apparatus and it is universal on have extensive market prospects.
In order to solve the above technical problems, one technical scheme adopted by the invention is that:
A kind of solder joint grinding apparatus is provided comprising: compressing unit, sanding unit, dust removing units, the compressing unit are set to
The top of the sanding unit, the dust removing units are connected with the sanding unit,
The sanding unit includes pedestal, transfer positioning plate, product orientation plate, fixed block, locating piece, sharpening unit, it is described in
Turn positioning plate to be set on the pedestal, locating slot is provided on the transfer positioning plate, the product orientation plate is set to institute
It states in locating slot, the fixed block is set on the transfer positioning plate of the locating slot two sides, and the locating piece is set to
On the product orientation plate, polishing hole is provided on the transfer positioning plate and the product orientation plate, the sharpening unit is set
It is placed in the pedestal and is flexibly connected with the polishing hole,
The compressing unit includes stand, pressing plate, lifting drive, and the stand is set on the pedestal, the lifting
Driving device drives the pressing plate to move up and down, and the bottom surface of the pressing plate is provided with pressure head.
In a preferred embodiment of the present invention, the sharpening unit includes polishing knife, collet, driving motor and is used for
The apparatus for adjusting position of driving motor movement is adjusted, the polishing knife is set in the collet, and the polishing knife is described
Polishing moves in hole, and the collet is flexibly connected with the driving motor, the driving motor and the apparatus for adjusting position phase
Connection.
In a preferred embodiment of the present invention, the apparatus for adjusting position is connected using thousand parted hairs and with thousand parted hairs
Guiding device.
In a preferred embodiment of the present invention, the tool changing list for positioning polishing knife is movably set on the pedestal
Member.
In a preferred embodiment of the present invention, the tool changing unit includes altitude location block, positioning clamping plate, lower part
Hole, positioning column, the positioning clamping plate are movably set on the pedestal, and the positioning column is set to the positioning clamping plate
Bottom surface, is provided with the bottom hole for positioning polishing knife on the positioning plate, the top surface of the pedestal be provided with it is described
The location hole that positioning column matches.
In a preferred embodiment of the present invention, one or more sanding units are set on the board, each
The position in the polishing hole on transfer positioning plate described in the sanding unit is not identical.
In a preferred embodiment of the present invention, be provided on the pedestal for testing product whether sensing in place
Device.
In a preferred embodiment of the present invention, the top surface of the pedestal is provided with a through slot, and the through slot is removed with described
Dirt unit is connected.
In a preferred embodiment of the present invention, the dust removing units include taking out dirt mouth, dust tank, air inlet, blower, institute
It states pumping dirt mouth to be connected with the sanding unit, the pumping dirt mouth is connected with the dust tank, and the air inlet is set to institute
It states on dust tank and is connected with the blower.
In a preferred embodiment of the present invention, shield is provided with around the sanding unit and the compressing unit.
The beneficial effects of the present invention are: can polish simultaneously interiors of products many places solder joint, work efficiency is high, polishing
Quality is stable and precision is high.
Detailed description of the invention
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings other
Attached drawing, in which:
Fig. 1 is a kind of overall structure diagram of one preferred embodiment of solder joint grinding apparatus of the invention；
Fig. 2 is the structural schematic diagram of compressing unit in a kind of one preferred embodiment of solder joint grinding apparatus of the invention；
Fig. 3 is the structural schematic diagram of sanding unit in a kind of one preferred embodiment of solder joint grinding apparatus of the invention；
Fig. 4 is the structural schematic diagram of transfer positioning plate A in a kind of one preferred embodiment of solder joint grinding apparatus of the invention；
Fig. 5 is the structural schematic diagram of transfer positioning plate B in a kind of one preferred embodiment of solder joint grinding apparatus of the invention；
Fig. 6 is the structural schematic diagram of sharpening unit in a kind of one preferred embodiment of solder joint grinding apparatus of the invention；
Fig. 7 is the structural schematic diagram of tool changing unit in a kind of one preferred embodiment of solder joint grinding apparatus of the invention；
Fig. 8 is the structural schematic diagram of dust removing units in a kind of one preferred embodiment of solder joint grinding apparatus of the invention.
Specific embodiment
The technical scheme in the embodiments of the invention will be clearly and completely described below, it is clear that described implementation
Example is only a part of the embodiments of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, this field is common
Technical staff's all other embodiment obtained without making creative work belongs to the model that the present invention protects
It encloses.
Fig. 1-8 is please referred to, the embodiment of the present invention includes:
A kind of solder joint grinding apparatus is mainly used for the solder joint of the products 99 and widgets weld such as plate in polishing mobile phone, specifically
It include: compressing unit 1, sanding unit 2, dust removing units, tool changing unit 4, the compressing unit is set to the sanding unit
Top, the dust removing units are connected with the sanding unit.The sanding unit and the compressing unit are set to the machine
On platform 5, and shield is provided with around it.
Two or more sanding units processed for different polishing positions, Mei Gesuo are provided on the board
The other structures stated in sanding unit are the same, and the position in the polishing hole on the only described transfer positioning plate is not identical, this
Sample can carry out multiple polishing operations simultaneously on a machine, improve working efficiency and product quality.
The sanding unit 2 includes A jig and B jig, and two jigs are set on the board, and to product difference position
The solder joint set is polished.
The A jig includes pedestal A21, transfer positioning plate A22, product orientation plate A23, fixed block 24, locating piece 25, mill
Knife unit 26, the transfer positioning plate A are set on two pedestals, are provided with locating slot 27 on the transfer positioning plate A,
The product orientation plate is set in the locating slot, and the fixed block is set to the transfer positioning of the locating slot two sides
On plate A, the locating piece is set to the centre of the product orientation plate, is arranged on the locating slot and the product orientation plate A
There is the first polishing hole 28, the sharpening unit is set in the pedestal and is flexibly connected with first polishing hole.
The B jig includes pedestal B, transfer positioning plate B, product orientation plate B, fixed block, locating piece, sharpening unit, institute
It states transfer positioning plate B to be respectively arranged on two pedestals, is provided with locating slot, the product on the transfer positioning plate B
Positioning plate B is set in the locating slot, and the fixed block for fixing product is set to described in the locating slot two sides
On transfer positioning plate B, the locating piece is set on the product orientation plate, on the locating slot and the product orientation plate B
It is provided with the second polishing hole, the sharpening unit is set in the pedestal and is flexibly connected with second polishing hole 29.
According to the structure snd size of different product, the transfer positioning plate of different size can be selected, on transfer positioning plate
Locating slot fits with product, when product being placed into jig getting on, using locating slot, product orientation plate and locating piece to production
Product are positioned, then the both ends of product are covered with fixed block, are prevented product movement in polishing, are improved the accuracy of product processing
And processing quality.
The sharpening unit 26 includes polishing knife 261, collet 262, spindle motor 263 and transports for adjusting spindle motor
Dynamic apparatus for adjusting position 264(such as thousand is separately), the polishing knife includes milling cutter or grinding head, and the polishing knife is set to
In the collet, and the grinding head moves in the polishing hole, and the collet is flexibly connected with the spindle motor, described
Spindle motor is connected with thousand parted hair, and the mobile guide dress for controlling spindle motor position is connected on thousand parted hair
266 are set, it thus can more accurate, the quick position for adjusting polishing knife, raising working efficiency and precision.
When widgets are welded on product, there is solder joint, spindle motor band cutter butt welding point in the weld of product external surfaces
It polishes, variable collet facilitates the installation and removal of polishing knife, and client can voluntarily select suitable cutter as needed.
The compressing unit 1 include stand 11, pressing plate 12, leading truck 13, lifting drive 14(such as cylinder), pressure head
15, the stand is set to the surface of the jig, and the leading truck is movably set in the top of the stand, the cylinder
It is fixedly installed on the top of the stand, and the leading truck is driven to move up and down, the pressing plate is set to the leading truck
Bottom, and the bottom surface of the pressing plate is provided with the pressure head for guaranteeing grinding accuracy, preventing deformation of products.
Be movably set on the pedestal tool changing unit for positioning polishing knife and for testing product whether in place
Sensor.The tool changing unit 4 includes altitude location block 41, positioning clamping plate 42, bottom hole 43, positioning column 44, the positioning
Clamping plate is movably set on the pedestal, and the positioning column is set to the bottom surface of the positioning clamping plate, on the positioning plate
It is provided with the bottom hole for positioning polishing knife, the top surface of the pedestal is provided with the positioning matched with the positioning column
Hole 45.
When needing tool changing, polishing knife is inserted into collet, and locking chuck, it is different according to product polishing position selection
The positioning clamping plate of specification, the lower part hole site in positioning clamping plate is exactly the position that product needs to polish, by altitude location block
It is placed on bottom hole, then entire positioning clamping plate is placed on the pedestal, when placing, positioning column is needed across pedestal
On location hole, there is deviation in placement positioning position, adjust horizontal distances separately with thousand so that grinding head aligned with lower hole, then
The height for adjusting polishing knife, when grinding head protrudes into bottom hole and altitude location block is arrived on top, then cutter position of polishing has been adjusted
Correctly, as long as at this time manually taking off tool changing unit, the components such as transfer positioning plate are put.
The dust removing units include taking out dirt mouth 31, dust tank 32, air inlet 33, blower 34, the top surface setting of the pedestal
Have a through slot, the pumping dirt mouth is connected with the sanding unit, the pumping dirt mouth respectively with the dust tank and the through slot
It is connected, the air inlet is set on the dust tank and is connected with the blower, generates when in this way can be by polishing
The waste materials such as dust, clast timely extract away, can not only prevent the excessive pollution environment of waste material, but also can prevent waste material from inhaling
It is attached on product and hinders being normally carried out for polishing, improve working efficiency and quality.
A kind of beneficial effect of solder joint grinding apparatus of the present invention is: can beat simultaneously interiors of products many places solder joint
Mill, work efficiency is high, and polishing quality is stable and precision is high.
The above description is only an embodiment of the present invention, is not intended to limit the scope of the invention, all to utilize this hair
Equivalent structure or equivalent flow shift made by bright description is applied directly or indirectly in other relevant technology necks
Domain is included within the scope of the present invention.
Claims (10)
1. a kind of solder joint grinding apparatus characterized by comprising compressing unit, sanding unit, dust removing units, the compression are single
Member is set to the top of the sanding unit, and the dust removing units are connected with the sanding unit,
The sanding unit includes pedestal, transfer positioning plate, product orientation plate, fixed block, locating piece, sharpening unit, it is described in
Turn positioning plate to be set on the pedestal, locating slot is provided on the transfer positioning plate, the product orientation plate is set to institute
It states in locating slot, the fixed block is set on the transfer positioning plate of the locating slot two sides, and the locating piece is set to
On the product orientation plate, polishing hole is provided on the transfer positioning plate and the product orientation plate, the sharpening unit is set
It is placed in the pedestal and is flexibly connected with the polishing hole,
The compressing unit includes stand, pressing plate, lifting drive, and the stand is set on the pedestal, the lifting
Driving device drives the pressing plate to move up and down, and the bottom surface of the pressing plate is provided with pressure head.
2. a kind of solder joint grinding apparatus according to claim 1, which is characterized in that the sharpening unit include polishing knife,
Collet, driving motor and the apparatus for adjusting position for adjusting driving motor movement, the polishing knife are set to the collet
It is interior, and the polishing knife moves in the polishing hole, the collet is flexibly connected with the driving motor, the driving motor
It is connected with the apparatus for adjusting position.
3. a kind of solder joint grinding apparatus according to claim 2, which is characterized in that the apparatus for adjusting position uses thousand points
Head and the guiding device being connected with thousand parted hairs.
4. a kind of solder joint grinding apparatus according to claim 2, which is characterized in that be movably set with and be used on the pedestal
The tool changing unit of positioning polishing knife.
5. a kind of solder joint grinding apparatus according to claim 4, which is characterized in that the tool changing unit includes altitude location
Block, positioning clamping plate, bottom hole, positioning column, the positioning clamping plate are movably set on the pedestal, the positioning column setting
In be provided on the bottom surface of the positioning clamping plate, the positioning plate for position polishing knife the bottom hole, the pedestal
Top surface be provided with the location hole matched with the positioning column.
6. a kind of solder joint grinding apparatus according to claim 1, which is characterized in that one or more sanding units are set
It is placed on the board, the position in the polishing hole on transfer positioning plate described in each sanding unit is not identical.
7. a kind of solder joint grinding apparatus according to claim 1, which is characterized in that be provided on the pedestal for detecting
Product whether sensor in place.
8. a kind of solder joint grinding apparatus according to claim 1, which is characterized in that it is logical that the top surface of the pedestal is provided with one
Slot, the through slot are connected with the dust removing units.
9. a kind of solder joint grinding apparatus according to claim 1, which is characterized in that the dust removing units include take out dirt mouth,
Dust tank, air inlet, blower, the pumping dirt mouth are connected with the sanding unit, and the pumping dirt mouth is connected with the dust tank
It connects, the air inlet is set on the dust tank and is connected with the blower.
10. a kind of solder joint grinding apparatus according to claim 1, which is characterized in that the sanding unit and the compression
Shield is provided with around unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910291953.0A CN110181371A (en) | 2019-04-12 | 2019-04-12 | A kind of solder joint grinding apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910291953.0A CN110181371A (en) | 2019-04-12 | 2019-04-12 | A kind of solder joint grinding apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110181371A true CN110181371A (en) | 2019-08-30 |
Family
ID=67714118
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910291953.0A Pending CN110181371A (en) | 2019-04-12 | 2019-04-12 | A kind of solder joint grinding apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110181371A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040203319A1 (en) * | 2002-03-23 | 2004-10-14 | Yoon Sang-Dae | Polishing machine |
| KR20110016105A (en) * | 2009-08-11 | 2011-02-17 | 양광열 | Handphone case buffing machine and method |
| CN105364658A (en) * | 2015-12-09 | 2016-03-02 | 苏州研高自动化科技有限公司 | Welding spot polishing device of vehicle vibration reducer |
| CN105729292A (en) * | 2016-04-24 | 2016-07-06 | 天津市森鑫科技有限公司 | Pneumatic polisher for mobile phone shell joint line |
| CN107866714A (en) * | 2017-11-09 | 2018-04-03 | 科森科技东台有限公司 | Polishing tool for mobile phone part |
| CN108296910A (en) * | 2017-12-29 | 2018-07-20 | 惠州阿瑞斯智能装备有限公司 | Mobile phone center grinding apparatus |
| CN208034411U (en) * | 2017-12-25 | 2018-11-02 | 比亚迪精密制造有限公司 | Polishing jig |
| CN108890300A (en) * | 2018-07-06 | 2018-11-27 | 宋宏亮 | Steel drum weld seam periphery solder joint polishing automation safety and environmental protection dedusting robot |
| CN209954412U (en) * | 2019-04-12 | 2020-01-17 | 苏州德机自动化科技有限公司 | Welding spot polishing equipment |
-
2019
- 2019-04-12 CN CN201910291953.0A patent/CN110181371A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040203319A1 (en) * | 2002-03-23 | 2004-10-14 | Yoon Sang-Dae | Polishing machine |
| KR20110016105A (en) * | 2009-08-11 | 2011-02-17 | 양광열 | Handphone case buffing machine and method |
| CN105364658A (en) * | 2015-12-09 | 2016-03-02 | 苏州研高自动化科技有限公司 | Welding spot polishing device of vehicle vibration reducer |
| CN105729292A (en) * | 2016-04-24 | 2016-07-06 | 天津市森鑫科技有限公司 | Pneumatic polisher for mobile phone shell joint line |
| CN107866714A (en) * | 2017-11-09 | 2018-04-03 | 科森科技东台有限公司 | Polishing tool for mobile phone part |
| CN208034411U (en) * | 2017-12-25 | 2018-11-02 | 比亚迪精密制造有限公司 | Polishing jig |
| CN108296910A (en) * | 2017-12-29 | 2018-07-20 | 惠州阿瑞斯智能装备有限公司 | Mobile phone center grinding apparatus |
| CN108890300A (en) * | 2018-07-06 | 2018-11-27 | 宋宏亮 | Steel drum weld seam periphery solder joint polishing automation safety and environmental protection dedusting robot |
| CN209954412U (en) * | 2019-04-12 | 2020-01-17 | 苏州德机自动化科技有限公司 | Welding spot polishing equipment |
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