CN110177653B - Polishing material and method for producing polishing material - Google Patents
Polishing material and method for producing polishing material Download PDFInfo
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- CN110177653B CN110177653B CN201880003034.2A CN201880003034A CN110177653B CN 110177653 B CN110177653 B CN 110177653B CN 201880003034 A CN201880003034 A CN 201880003034A CN 110177653 B CN110177653 B CN 110177653B
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- polishing
- base material
- fumed silica
- layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
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Abstract
The invention aims to provide a polishing material and a method for manufacturing the polishing material, wherein the polishing part can be thickened while the reduction of the polishing rate is restrained. The polishing material (1) comprises a base material (10) and a polishing layer (20) laminated on the surface side of the base material (10) and containing polishing particles (21) and a binder (22), wherein the polishing layer (20) has a plurality of columnar polishing parts (20a), the polishing parts (20a) contain fumed silica, and the base material (10) contains a heat-resistant resin as a main component.
Description
Technical Field
The present invention relates to an abrasive and a method for producing an abrasive.
Background
For example, in processing a glass substrate used for an electronic device such as a hard disk (hard disk), an abrasive material for fixing abrasive grains is generally used. As such a polishing material, a polishing material is known in which a polishing layer containing abrasive grains and a binder is laminated on the surface of a base material.
In the polishing material for fixing the polishing particles, the polishing layer is composed of a plurality of polishing portions. By constituting the polishing layer by a plurality of polishing portions in this manner, the occupancy rate of the area in contact with the object to be polished is reduced, and the surface pressure during polishing is increased, so that a high polishing rate can be exhibited. Further, since the grinding chips can be discharged by the grooves formed between the plurality of grinding portions, a decrease in the grinding rate due to clogging of the grinding material can be suppressed.
In such a polishing material, since the polishing layer is gradually worn away along with the processing of the glass substrate, it is required to thicken the polishing portion in order to increase the lifetime of the polishing material. The polishing layer is generally formed using a printing method. In the case of using the printing method, when the polishing portion is thickened, the aspect ratio (aspect ratio) increases, so that dripping is likely to occur at the time of printing, and it is difficult to form each polishing portion into a columnar shape. Therefore, in a conventional polishing material having a thick polishing portion, a cone-shaped polishing portion or a polishing portion having a large top surface area is used (see, for example, japanese patent laid-open No. 2014-18893).
However, when the polishing portion is tapered, the area of the top surface of the polishing portion increases as the polishing layer is worn away, and therefore the surface pressure during polishing may decrease, and the polishing rate may decrease. In addition, when the area of the polishing portions is increased, the width of the grooves between the polishing portions needs to be increased in order to reduce the area occupancy. If the width of the groove is increased, the object to be polished is likely to fall into the groove, and hence there is a risk that the object to be polished will be scratched. Therefore, when the area of the polishing portion is increased, it is difficult to reduce the area occupancy, and therefore the surface pressure during polishing may be reduced, which may reduce the polishing rate.
[ Prior art documents ]
[ patent document ]
[ patent document 1] Japanese patent laid-open No. 2014-18893
Disclosure of Invention
[ problems to be solved by the invention ]
The present invention has been made in view of such a problem, and an object thereof is to provide a polishing material capable of thickening a polishing portion while suppressing a decrease in polishing rate, and a method for producing the polishing material
[ means for solving problems ]
The present inventors have made diligent studies on a method for producing an abrasive material capable of forming each polishing portion into a columnar shape even if the polishing portion is thickened, and as a result, they have paid attention to: by containing fumed silica (fumed silica) in the polishing portion, dripping during formation of a polishing layer by printing is suppressed, and each polishing portion can be easily formed into a columnar shape. When the polishing portion contains fumed silica, the adhesion between the base and the polishing portion may be reduced, and peeling may easily occur. The present inventors have found that the easy releasability between a base material and a polishing portion can be achieved by using a base material containing a heat-resistant resin as a main component, and have completed the present invention.
That is, the invention to solve the above-mentioned problems is an abrasive material comprising a base material and a polishing layer laminated on the surface side of the base material and containing abrasive grains and a binder, wherein the polishing layer has a plurality of columnar polishing portions, the polishing portions contain fumed silica, and the base material contains a heat-resistant resin as a main component.
In this polishing material, since the polishing portion contains fumed silica, the polishing portion can be formed into a columnar shape even if it is thick. Therefore, the polishing material does not need to have a tapered polishing portion or to increase the area of the top surface of the polishing portion, and therefore, even if the polishing layer is worn, the polishing rate is not easily decreased. In addition, in this polishing material, since the base material is mainly composed of a heat-resistant resin, it is possible to suppress a decrease in adhesion between the base material and the polishing portion due to the fumed silica contained in the polishing portion. Therefore, the base material of the polishing material and the polishing portion are not easily peeled off. Therefore, the polishing material can thicken the polishing portion while suppressing a decrease in polishing rate.
The content of the fumed silica in the polishing portion is preferably 0.1 vol% or more and 20 vol% or less. By setting the content of the fumed silica in the polishing portion within the above range, a decrease in adhesion due to the inclusion of fumed silica when producing a polishing material can be suppressed, and a columnar polishing portion can be stably formed, so that a stable polishing rate can be further exhibited.
The average thickness of the polishing portion is preferably 300 μm or more and 5000 μm or less. When the average thickness of the polishing portion is within the above range, the effect of expressing a stable polishing rate due to the fumed silica contained in the polishing portion is easily exhibited.
The substrate may be polycarbonate or biaxially stretched polyethylene terephthalate. By using polycarbonate or biaxially stretched polyethylene terephthalate as the base material, the adhesion between the base material and the polishing portion is improved, and the base material and the polishing portion are less likely to peel off.
Another invention made to solve the above problems is a method for producing an abrasive material comprising a base material and a polishing layer laminated on the surface side of the base material and containing abrasive grains and a binder, the method comprising a step of forming the polishing layer by printing a composition for a polishing layer having a plurality of columnar polishing portions, the composition for a polishing layer containing fumed silica, and the base material containing a heat-resistant resin as a main component.
In the method for producing an abrasive material, since the polishing layer composition contains fumed silica, the fumed silica provides thixotropy (thixocopy) to the polishing layer composition when the polishing layer is formed by printing, and thus the dripping can be suppressed. Therefore, by using the method for producing a polishing material, a columnar polishing portion can be formed even in the case of a thick polishing portion. In addition, in the method for producing a polishing material, since the base material contains a heat-resistant resin as a main component, even when the polishing layer composition contains fumed silica, the base material and the polishing portion are not easily peeled off. Therefore, by using this method for producing an abrasive, an abrasive having a thick polishing portion while suppressing a decrease in polishing rate can be produced.
Here, the "main component" refers to a component having the largest content, and refers to a component having a content of preferably 50% by mass or more, more preferably 90% by mass or more.
[ Effect of the invention ]
As described above, the polishing material of the present invention and the polishing material produced by the method for producing a polishing material of the present invention can thicken the polishing portion while suppressing a decrease in polishing rate. Therefore, the polishing material of the present invention and the polishing material produced by the method for producing a polishing material of the present invention can exhibit a stable polishing rate and have a long life.
Drawings
FIG. 1 is a schematic partial plan view showing a polishing material according to an embodiment of the present invention.
Fig. 2 is a schematic partial cross-sectional view at line a-a of fig. 1.
FIG. 3 is a flowchart showing a method for producing a polishing material according to an embodiment of the present invention.
FIG. 4 is a schematic partial cross-sectional view showing a polishing material according to an embodiment different from that of FIG. 2.
[ description of symbols ]
1. 2: grinding material
10: base material
20: polishing layer
20 a: grinding part
20 b: trough
21: abrasive grain
22: adhesive agent
23: fumed silica
30: adhesive layer
31: 2 nd adhesive layer
40: support body
S1: preparation procedure
S2: step of forming polishing layer
S3: then the step of laminating
Detailed Description
Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings as appropriate.
[ abrasive Material ]
The polishing material 1 shown in fig. 1 and 2 includes: a substrate 10; a polishing layer 20 laminated on the surface side of the base material 10; and an adhesive layer 30 laminated on the back surface side of the base material 10. The polishing layer 20 has a plurality of polishing portions 20a and grooves 20b arranged between the polishing portions 20 a.
The polishing material 1 can be suitably used as a fixed abrasive polishing material used for polishing the surface of a glass material, particularly the surface of an aluminosilicate glass substrate used for a cover glass (cover glass), a hard disk, or the like.
< substrate >
The substrate 10 is a plate-like or sheet-like member for supporting the polishing layer 20.
The base material 10 contains a heat-resistant resin as a main component. Examples of such a heat-resistant resin include: polycarbonate, biaxially stretched polyethylene terephthalate, polyimide, polyamide, and the like. Of these, polycarbonate and biaxially stretched polyethylene terephthalate are preferred, and polycarbonate is more preferred. By using polycarbonate or biaxially stretched polyethylene terephthalate as the substrate 10, the adhesion between the substrate 10 and the polishing portion 20a is increased, and the substrate 10 and the polishing portion 20a are less likely to peel.
The lower limit of the glass transition temperature of the substrate 10 is preferably 60 ℃, more preferably 80 ℃, and still more preferably 100 ℃. If the glass transition temperature of the substrate 10 is less than the lower limit, the heat resistance is insufficient, and the substrate 10 is easily deformed by heat generated when the polishing portion 20a is formed. Therefore, the adhesion between the substrate 10 and the polishing portion 20a may be reduced. On the other hand, the upper limit of the glass transition temperature of the substrate 10 is not particularly limited, and for example, the glass transition temperature of the substrate 10 may be 500 ℃.
In addition, the substrate 10 may have flexibility. By providing the base material 10 with flexibility in this manner, the polishing material 1 follows the surface shape of the object to be polished, and the contact area between the polishing surface and the object to be polished is increased, so that the polishing rate can be increased.
The surface of the substrate 10 may be subjected to a treatment for improving adhesion, such as a chemical treatment, a corona treatment, or a primer treatment.
The shape and size of the base 10 are not particularly limited, and may be, for example, a square shape having one side of 140mm or more and 160mm or less, a disk shape having a diameter of 200mm or more and 2022mm or less, an annular shape having an outer diameter of 200mm or more and 2022mm or less, and an inner diameter of 100mm or more and 658mm or less. Further, a plurality of substrates 10 arranged in parallel on a plane may be supported by a single support.
The lower limit of the average thickness of the substrate 10 is preferably 70 μm, more preferably 300 μm, and still more preferably 500 μm. On the other hand, the upper limit of the average thickness of the substrate 10 is preferably 3000 μm, and more preferably 2000 μm. If the average thickness of the substrate 10 is less than the lower limit, the substrate 10 may be easily warped when the polishing portion 20a is thick. On the other hand, if the average thickness of the base material 10 exceeds the upper limit, the base material 10 may hardly follow the surface shape of the object to be polished, and the polishing rate may decrease.
< polishing layer >
The polishing layer 20 contains abrasive grains 21, a binder 22, and fumed silica 23 in a polishing portion 20 a. The polishing portion 20a contains a filler (not shown).
(abrasive grain)
As the abrasive grains 21, there can be mentioned: diamond abrasive grains, alumina abrasive grains, silica abrasive grains, cerium oxide abrasive grains, silicon carbide abrasive grains, and the like. Among them, preferred is a diamond abrasive grain that is harder than other abrasive grains. The polishing force is increased by using diamond abrasive grains as the abrasive grains 21, and the polishing rate can be further increased.
Further, diamond as the diamond abrasive grain may be single crystal or polycrystalline, or diamond treated with Ni coating or the like. Among them, single crystal diamond and polycrystalline diamond are preferable. Single crystal diamond is harder and has a higher grinding force than other diamonds. Further, polycrystalline diamond is easily cleaved in units of crystallites constituting polycrystals and hardly passivated, and therefore, even when polishing is performed for a long period of time, the polishing rate is less decreased.
The average particle diameter of the abrasive grains 21 is appropriately selected from the viewpoint of the polishing rate and the surface roughness of the polished object after polishing. The lower limit of the average particle diameter of the abrasive grains 21 is preferably 2 μm, more preferably 10 μm, and still more preferably 15 μm. On the other hand, the upper limit of the average particle diameter of the abrasive grains 21 is preferably 150 μm, more preferably 125 μm, and still more preferably 100 μm. If the average particle diameter of the abrasive grains 21 is less than the lower limit, the polishing force of the polishing material 1 may be insufficient, and the polishing rate may be lowered. On the other hand, if the average particle diameter of the abrasive grains 21 exceeds the upper limit, the polishing accuracy may be lowered. Here, the "average particle diameter" refers to a 50% value (50% particle diameter, D50) of a volume-based cumulative particle size distribution curve measured by a laser diffraction method or the like.
The lower limit of the content of the abrasive grains 21 in the polishing portion 20a is preferably 0.5 vol%, more preferably 2 vol%, and still more preferably 4 vol%. On the other hand, the upper limit of the content of the abrasive grains 21 is preferably 55 vol%, more preferably 45 vol%, and still more preferably 35 vol%. If the content of the abrasive grains 21 is less than the lower limit, the polishing force of the polishing layer 20 may be insufficient. On the other hand, if the content of the abrasive grains 21 exceeds the upper limit, the polishing layer 20 may not hold the abrasive grains 21.
(Binder)
The main component of the binder 22 is not particularly limited, and examples thereof include resins and inorganic substances. Among them, a resin is preferable from the viewpoint of adhesiveness to the substrate 10.
As the resin, there may be mentioned: resins such as polyurethane, polyphenol, epoxy resin, polyester, cellulose, ethylene copolymer, polyvinyl acetal, polyacrylic acid and its salt, polyacrylate, polyvinyl alcohol, polyvinyl chloride, polyvinyl acetate, and polyamide. Among them, preferred are polyacrylate, epoxy resin, polyester, and polyurethane, which easily ensure good adhesion to a substrate. Furthermore, the resin may also be at least partially crosslinked.
Further, examples of the inorganic substance include: silicates, phosphates, polyvalent metal alkoxides, and the like. Among them, silicates having high abrasive grain retention are preferable. Examples of the silicate include sodium silicate and potassium silicate.
The binder 22 may also contain various additives and additives such as a dispersant, a coupling agent, a surfactant, a lubricant, an antifoaming agent, and a colorant, as appropriate according to the purpose.
(fumed silica)
The fumed silica 23 is one of dry silica and is a fine particle (powder). The composition is amorphous silicon dioxide or high-purity glass.
The lower limit of the average primary particle diameter of the fumed silica 23 is preferably 5nm, and more preferably 7 nm. On the other hand, the upper limit of the average primary particle diameter of the fumed silica 23 is preferably 100nm, more preferably 60nm, and still more preferably 40 nm. If the average primary particle size of the fumed silica 23 is less than the lower limit, the fumed silica is likely to fly, and the operation in producing the abrasive material 1 may be difficult. On the other hand, if the average primary particle size of the fumed silica 23 exceeds the upper limit, the thixotropic property of the fumed silica 23 in producing the polishing material 1 may be insufficient, and the polishing portion 20a may not be formed into a columnar shape.
The lower limit of the content of the fumed silica 23 in the polishing portion 20a is preferably 0.1 vol%, and more preferably 1 vol%. On the other hand, the upper limit of the content of the fumed silica 23 is preferably 20 vol%, more preferably 10 vol%, and still more preferably 8 vol%. If the content of the fumed silica 23 is less than the lower limit, thixotropy due to the fumed silica 23 may be insufficient in producing the polishing material 1, and the polishing portion 20a may not be formed into a columnar shape. On the other hand, if the content of the fumed silica 23 exceeds the upper limit, the abrasion of the polishing portion 20a tends to increase, and the lifetime of the polishing material 1 may decrease, or the adhesion between the substrate 10 and the polishing portion 20a may decrease.
(Filler)
Examples of the filler include: oxides such as alumina, silica, ceria (ceria), magnesia, zirconia, and titania, and composite oxides such as silica-alumina, silica-zirconia, and silica-magnesia. These oxides may be used alone or in combination of two or more as required. Among them, alumina, which can obtain a high grinding force, is preferable.
The average particle diameter of the filler also depends on the average particle diameter of the abrasive grains 21, but the lower limit of the average particle diameter of the filler is preferably 0.01 μm, and more preferably 2 μm. On the other hand, the upper limit of the average particle diameter of the filler is preferably 40 μm, more preferably 20 μm, and still more preferably 15 μm. If the average particle diameter of the filler is less than the lower limit, the effect of improving the elastic modulus of the binder 22 by the filler may be insufficient, and the polishing rate may be reduced. On the other hand, if the average particle diameter of the filler exceeds the upper limit, the filler may interfere with the polishing force of the polishing particles 21.
In addition, the average particle diameter of the filler may be smaller than the average particle diameter of the abrasive grains 21. The lower limit of the ratio of the average particle size of the filler to the average particle size of the abrasive grains 21 is preferably 0.01, more preferably 0.05, and still more preferably 0.1. On the other hand, the upper limit of the ratio of the average particle size of the filler to the average particle size of the abrasive grains 21 is preferably 0.8, and more preferably 0.6. If the ratio of the average particle diameter of the filler to the average particle diameter of the abrasive grains 21 is less than the lower limit, the effect of improving the elastic modulus of the binder 22 by the filler may be insufficient, and the polishing rate may be decreased. On the other hand, if the ratio of the average particle diameter of the filler to the average particle diameter of the abrasive grains 21 exceeds the upper limit, the filler may interfere with the polishing force of the abrasive grains 21.
The content of the filler in the polishing portion 20a also depends on the content of the abrasive grains 21, but the lower limit of the content of the filler in the polishing portion 20a is preferably 15 vol%, and more preferably 30 vol%. On the other hand, the upper limit of the content of the filler is preferably 75% by volume, and more preferably 72% by volume. If the content of the filler is less than the lower limit, the effect of improving the elastic modulus of the binder 22 by the filler may be insufficient, and the polishing rate may be reduced. On the other hand, if the content of the filler exceeds the upper limit, the filler may interfere with the polishing force of the abrasive grains 21.
(grinding part)
The polishing portion 20a has a columnar shape. That is, the area of the bottom surface of the polishing portion 20a is 0.9 times or more and 1.5 times or less, preferably 0.93 times or more and 1.2 times or less, and more preferably 0.95 times or more and 1.05 times or less the area of the top surface of the polishing portion 20 a.
The plurality of polishing units 20a are in the shape of a block pattern (blockpattern) in which the polishing units are regularly arranged in the same shape. The shape of the top surface of the polishing portion 20a is not particularly limited, and may be a square as shown in fig. 1, or may be a circle, a polygon, or the like.
The lower limit of the average area of the top surface of the polishing portion 20a is preferably 1mm2More preferably 2mm2. On the other hand, the upper limit of the average area of the top surface of the polishing portion 20a is preferably 150mm2More preferably 130mm2. If the average area of the top surface of the polishing portion 20a is smaller than the lower limit, the polishing portion 20a may be peeled off from the substrate 10. On the other hand, if the average area of the top surface of the polishing portion 20a exceeds the upper limit, the contact area of the polishing layer 20 with the object to be polished during polishing increases, and thus the polishing rate may decrease due to frictional resistance.
The lower limit of the area occupancy of the plurality of polishing portions 20a with respect to the entire polishing layer 20 is preferably 5%, and more preferably 10%. On the other hand, the upper limit of the area occupancy of the polishing portion 20a is preferably 60%, and more preferably 55%. If the area occupancy of the polishing portion 20a is less than the lower limit, the pressure applied during polishing may be excessively concentrated on the narrow polishing portion 20a, and the polishing portion 20a may be peeled off from the substrate 10. On the other hand, if the area occupancy of the polishing portion 20a exceeds the upper limit, the contact area of the polishing layer 20 with the object to be polished during polishing increases, and thus the polishing rate may decrease due to frictional resistance. The term "the total area of the polishing layer" is a concept including the area of the grooves of the polishing layer.
The lower limit of the average thickness of the polishing portion 20a is preferably 300 μm, and more preferably 500 μm. On the other hand, the upper limit of the average thickness of the polishing portion 20a is preferably 5000 μm, and more preferably 3000 μm. If the average thickness of the polishing portion 20a is less than the lower limit, the life may be insufficient, or the effect of stabilizing the shape of the polishing portion 20a during production may not be sufficiently exhibited due to the fumed silica 23 contained in the polishing portion 20 a. On the other hand, if the average thickness of the polishing portion 20a exceeds the upper limit, the polishing portion 20a may not be formed in a columnar shape.
(tank)
The bottom surface of the groove 20b is formed by the surface of the substrate 10.
The average width of the grooves 20b is determined by the area or the area occupancy of the top surface of the polishing portion 20a, but the lower limit of the average width of the grooves 20b is preferably 0.3mm, and more preferably 0.5 mm. On the other hand, the upper limit of the average width of the groove 20b is preferably 10mm, and more preferably 8 mm. If the average width of the grooves 20b is less than the lower limit, the grooves 20b may be clogged with the polishing powder generated by polishing. On the other hand, if the average width of the grooves 20b exceeds the upper limit, the object to be polished is likely to fall into the grooves 20b during polishing, and thus the object to be polished may be damaged.
< adhesion layer >
The adhesive layer 30 is a layer for fixing the polishing material 1 on a support mounted on a polishing apparatus for supporting the polishing material 1.
The adhesive used in the adhesive layer 30 is not particularly limited, and examples thereof include: reactive adhesives, instant adhesives, hot melt adhesives, adhesives as repositionable adhesives, and the like.
The adhesive used for the adhesive layer 30 is preferably an adhesive. By using a pressure-sensitive adhesive as the pressure-sensitive adhesive used for the pressure-sensitive adhesive layer 30, the polishing material 1 can be peeled off from the support and attached again, and therefore, the polishing material 1 and the support can be easily reused. Such an adhesive is not particularly limited, and examples thereof include: acrylic adhesives, acrylic-rubber adhesives, natural rubber adhesives, synthetic rubber adhesives such as butyl rubber adhesives, silicone adhesives, polyurethane adhesives, and the like.
The lower limit of the average thickness of the adhesive layer 30 is preferably 0.05mm, and more preferably 0.1 mm. On the other hand, the upper limit of the average thickness of the adhesive layer 30 is preferably 0.3mm, and more preferably 0.2 mm. If the average thickness of the adhesive layer 30 is less than the lower limit, the adhesive force may be insufficient, and the polishing material 1 may be peeled off from the support. On the other hand, if the average thickness of the adhesive layer 30 exceeds the upper limit, workability may be deteriorated, for example, when the abrasive material 1 is cut into a desired shape, due to the thickness of the adhesive layer 30.
< advantage >
In this polishing material 1, since the polishing portion 20a contains fumed silica 23, the polishing portion 20a can be formed into a columnar shape even if the polishing portion 20a is thick. Therefore, in the polishing material 1, since the polishing portion 20a does not need to be tapered or the area of the top surface of the polishing portion 20a does not need to be increased, the polishing rate is not easily decreased even if the polishing layer 20 is worn away. In addition, in the polishing material 1, since the base material 10 mainly contains a heat-resistant resin, it is possible to suppress a decrease in the adhesion between the base material 10 and the polishing portion 20a due to the fumed silica 23 contained in the polishing portion 20 a. Therefore, the base 10 and the polishing portion 20a of the polishing material 1 are not easily peeled off. Therefore, the polishing material 1 can thicken the polishing portion 20a while suppressing a decrease in polishing rate.
[ method for producing polishing Material ]
The method for manufacturing the abrasive shown in FIG. 3 mainly includes a preparation step S1, an abrasive layer forming step S2, and a subsequent layer attaching step S3. By using this method for producing an abrasive, for example, the following abrasive 1 can be produced: the polishing material 1 includes a base material 10 shown in fig. 1 and 2; and a polishing layer 20 laminated on the surface side of the base material 10 and containing abrasive grains 21 and a binder 22.
< preparation step >
In preparation step S1, a polishing layer composition containing abrasive grains 21, binder 22, and fumed silica 23 is prepared.
Specifically, a polishing layer composition containing the abrasive grains 21, the fumed silica 23, and the binder 22 as a material for forming the coating liquid is prepared. Since the contents of the abrasive grains 21 and the fumed silica 23 in the solid content are the contents of the abrasive grains 21 and the fumed silica 23, respectively, in the polishing section 20a after production, the amount of the solid content is appropriately determined so that the content in the polishing section 20a becomes a desired value.
In addition, a diluent such as water or alcohol is added to control the viscosity or fluidity of the coating liquid. By this dilution, a part of the abrasive grains 21 contained in the polishing section 20a can be protruded from the surface of the adhesive 22. That is, by adding the diluent, the thickness of the binder 22 is reduced when the polishing layer composition is dried in the polishing layer forming step S2, and the amount of protrusion of the abrasive grains 21 can be increased. Therefore, by this dilution, a high polishing rate can be exhibited from the initial stage of polishing.
< step of Forming polishing layer >
In the polishing layer forming step S2, the polishing layer 20 is formed by printing of the polishing layer composition prepared in the preparation step S1. The polishing layer forming step S2 includes a coating step and a drying step.
(coating step)
In the coating step, the polishing layer composition is applied to the surface of the substrate 10. As the substrate 10, a substrate containing a heat-resistant resin as a main component is used.
Specifically, the polishing layer 20 having the plurality of polishing portions 20a and the grooves 20b arranged between the polishing portions 20a is formed on the surface of the base material 10 by a printing method using the coating liquid prepared in the preparation step S1. In order to form the grooves 20b, a mask (mask) having a shape corresponding to the shape of the grooves 20b is prepared, and the coating liquid is printed through the mask. As the printing method, for example, screen printing, metal mask printing, or the like can be used.
The mask for printing is preferably made of SUS or fluororesin. The SUS or fluororesin mask can be thickened, and thus the polishing portion 20a having a large average thickness can be easily produced.
The thickness of the polishing portion 20a can be adjusted mainly by the thickness of the mask and the coating amount. Therefore, in this coating step, the coating amount of the polishing layer composition can be adjusted so that the average thickness of the polishing portion 20a becomes 300 μm or more, more preferably 500 μm or more. By adjusting the coating amount so that the average thickness of the polishing portion 20a becomes equal to or more than the lower limit, the life of the polishing material 1 can be increased. On the other hand, the upper limit of the average thickness of the polishing portion 20a adjusted by the coating step is not particularly limited, and is preferably 5000 μm, and more preferably 3000 μm from the viewpoint of the production cost.
(drying step)
In the drying step, the coating liquid (polishing layer composition) after the coating step is dried by heating. By this heat drying, the coating liquid is hardened to form the polishing layer 20.
The drying step is performed by removing the mask. In this method for producing an abrasive material, since the composition for an abrasive layer contains fumed silica 23, the fumed silica 23 provides thixotropy to the composition for an abrasive layer. Therefore, the viscosity of the polishing layer composition during heating is appropriately controlled, and dripping can be suppressed. Therefore, even when the polishing portion 20a is thick, the columnar polishing portion 20a can be formed.
The lower limit of the heating temperature in the drying step is preferably 80 ℃ and more preferably 100 ℃. On the other hand, the upper limit of the heating temperature is preferably 300 ℃ and more preferably 200 ℃. If the heating temperature is less than the lower limit, the polishing layer composition is not sufficiently cured, the amount of abrasion increases, and the life of the polishing material 1 may be shortened. On the other hand, if the heating temperature exceeds the upper limit, the polishing portion 20a may be thermally deteriorated.
The heating time in the drying step also depends on the heating temperature, but as the lower limit of the heating time, 2 hours is preferable, and 2.5 hours is more preferable. On the other hand, the upper limit of the heating time is preferably 40 hours, more preferably 32 hours, and still more preferably 20 hours. If the heating time is less than the lower limit, the polishing layer composition is not sufficiently cured, the amount of abrasion increases, and the life of the polishing material 1 may be shortened. Conversely, if the heating time exceeds the upper limit, the production efficiency may decrease.
< adhesion of adhesive layer >
In the adhesive layer attaching step S3, the adhesive layer 30 is laminated on the back surface side of the base material 10. Specifically, for example, a tape-like adhesive layer 30 formed in advance is attached to the back surface of the base material 10.
< advantage >
In the method for producing the polishing material, since the composition for a polishing layer contains the fumed silica 23, the fumed silica 23 provides thixotropy to the composition for a polishing layer when the polishing layer 20 is formed by printing, and thus dropping can be suppressed. Therefore, by using this method for producing a polishing material, it is possible to form the columnar polishing portion 20a even with a thick polishing portion 20 a. In addition, in this method for producing a polishing material, since the base 10 mainly contains a heat-resistant resin, even when the polishing layer composition contains fumed silica 23, the base 10 and the polishing portion 20a are not easily peeled off. Therefore, by using this method for producing an abrasive, an abrasive having a thick polishing portion 20a while suppressing a decrease in polishing rate can be produced.
[ other embodiments ]
The present invention is not limited to the above embodiments, and various modifications and improvements other than the above embodiments may be implemented.
In the above embodiment, the case where the polishing portion has a square pattern was described, but the polishing portion is not limited to the square pattern. That is, the plurality of polishing portions may have different shapes or may be arranged irregularly. However, the polishing portion is preferably in a square pattern from the viewpoint of reducing anisotropy of polishing.
In the above-described embodiment, the case where the polishing section contains the filler has been described, but the filler is not essential, and a polishing material having a polishing section containing no filler is also within the scope of the present invention.
In the above embodiment, the case where the polishing material has the adhesion layer is described, but the adhesion layer is not essential and may be omitted. In the case where the polishing material does not have an adhesive layer, the adhesive layer application step of the polishing material production method is omitted.
Alternatively, as shown in fig. 4, the polishing material 2 may include: a support 40 laminated with the adhesive layer 30 on the back side therebetween, and a 2 nd adhesive layer 31 laminated on the back side of the support 40. Since the polishing material 2 includes the support 40, the operation of the polishing material 2 can be easily performed.
As the main components of the support 40, there can be mentioned: thermoplastic resins such as polypropylene, polyethylene, polytetrafluoroethylene and polyvinyl chloride, and engineering plastics (engineering plastics) such as polycarbonate, polyamide and polyethylene terephthalate. By using such a material for the main component of the support 40, the support 40 has flexibility, and the polishing material 2 follows the surface shape of the object to be polished, and the polishing surface and the object to be polished are easily brought into contact with each other, so that the polishing rate is further improved.
The average thickness of the support 40 may be, for example, 0.5mm to 3 mm. If the average thickness of the support 40 is less than the lower limit, the strength of the polishing material 2 may be insufficient. On the other hand, if the average thickness of the support 40 exceeds the upper limit, it may be difficult to attach the support 40 to a polishing apparatus or the flexibility of the support 40 may be insufficient.
The 2 nd adhesive layer 31 may use the same adhesive as the adhesive layer 30. The 2 nd adhesive layer 31 may have the same average thickness as the adhesive layer 30.
[ examples ]
The present invention will be described in further detail below with reference to examples and comparative examples, but the present invention is not limited to the following examples.
[ example 1]
Diamond abrasive grains ("SCMD-C12-22" having an average particle diameter of 16 μm, manufactured by Sino Crystal Diamond corporation) and alumina (Al) as a filler were used2O3"LA 4000" by Pacific bluebottle (Pacific rudum) corporation, average particle size 4 μm, "Aerosil" 200 by Aerosil corporation, and an epoxy resin ("JER 828" by mitsubishi chemical corporation) as a binder were mixed, and adjusted so that the content of diamond abrasive grains in the solid content became 3 volume%, the content of filler became 71 volume%, and the content of fumed silica became 5 volume%, to obtain a coating liquid.
A substrate (average thickness 300 μm) containing polycarbonate as a main component as a heat-resistant resin was prepared as a substrate, and the surface of the substrate was coated by printing using the coating liquid. As the printed pattern, the area occupancy rate is used44% have a circular shape with a diameter of 6mm in plan view (average area 28.27 mm)2) And an average thickness of 1000 μm. Further, the opening is in a square pattern. The coating amount was adjusted so that the average thickness of the polished section became 1000 μm. The coating solution was dried in an oven at 120 ℃ for 16 hours to cure the coating solution.
As a support for supporting and fixing the base material to the polishing apparatus, a hard vinyl chloride resin plate having an average thickness of 1mm was used, and a pressure-sensitive adhesive having an average thickness of 130 μm was bonded between the back surface of the base material and the front surface of the support, and between the back surface of the support and a platen of a polishing machine described later, respectively. As the adhesive, a double-sided tape ("# 5605 HGD" by water chemistry ltd) was used.
The abrasive of example 1 was obtained in this manner.
[ example 2]
The polishing material of example 2 was obtained in the same manner as in example 1 except that the coating amount was adjusted so that the average thickness of the polished section became 300 μm.
[ example 3]
The abrasive of example 3 was obtained in the same manner as in example 1 except that a base material (average thickness of 75 μm) mainly composed of biaxially stretched polyethylene terephthalate as a heat-resistant resin was prepared as the base material.
Comparative example 1
The polishing material of comparative example 1 was obtained in the same manner as in example 1 except that the coating liquid of example 1 did not contain fumed silica, and the content of diamond abrasive grains in the solid content was adjusted to 3 vol% and the content of filler was adjusted to 76 vol%.
Comparative example 2
The abrasive of comparative example 2 was obtained in the same manner as in comparative example 1 except that a base material (average thickness 300 μm) containing biaxially stretched polyethylene terephthalate as a main component was prepared as the base material.
Comparative example 3
The abrasive material of comparative example 3 was obtained in the same manner as in comparative example 1 except that an aluminum plate (average thickness 300 μm) was prepared as a base material.
Comparative example 4
An abrasive material of comparative example 4 was obtained in the same manner as in example 1 except that an aluminum plate (average thickness 300 μm) was prepared as a base material.
[ evaluation ]
The polishing materials of examples 1 to 3 and comparative examples 1 to 4 were evaluated for the life, the peeling between the base material and the polishing portion, and the dripping during printing, based on the following criteria. The results are shown in Table 1.
< life of abrasive material >
It is considered that the life of the polishing material is determined by the average thickness of the polishing portion. Therefore, the following criteria are set.
A: the average thickness of the polishing portion was 1000 μm, and the life was long.
B: the average thickness of the polished section was 300 μm, and the life was slightly short.
< peeling of substrate from polishing part >
After the obtained polishing material was flexed, it was visually checked whether or not the base material and the polishing portion were peeled off.
A: peeling of the base material from the polishing portion was confirmed.
B: peeling between the base material and the polishing portion was not observed.
< dropping liquid at printing >
When a drop occurs during printing, the drop deforms with respect to the print pattern after drying and curing. Whether or not the deformation occurred was judged by visual observation of the obtained abrasive.
A: no deformation of the printed pattern was confirmed after drying and hardening.
B: deformation of the printed pattern was confirmed after drying and hardening.
[ Table 1]
| Example 1 | Example 2 | Example 3 | Comparative example 1 | Comparative example 2 | Comparative example 3 | Comparative example 4 | |
| Fumed silica | Is provided with | Is provided with | Is provided with | Is free of | Is free of | Is free of | Is provided with |
| Base material | PC | PC | PET | PC | PET | Al | Al |
| Thickness of grinding part (μm) | 1000 | 300 | 1000 | 1000 | 1000 | 1000 | 1000 |
| Life span | A | B | A | A | A | A | A |
| Peeling off | A | A | A | A | A | A | B |
| Dropping liquid | A | A | A | B | B | B | A |
In table 1, "PC" of the substrate means polycarbonate, "PET" means biaxially stretched polyethylene terephthalate, "Al" means aluminum plate.
From table 1, in the polishing materials of examples 1 to 3, peeling between the base material and the polishing portion and deformation of the print pattern after drying and hardening due to the dropping were not observed regardless of the thickness of the polishing portion. On the other hand, deformation of the printed pattern after drying and curing due to the dropping liquid was observed in the polishing materials of comparative examples 1 to 3, and peeling between the base material and the polishing portion was observed in the polishing material of comparative example 4.
It is considered that the abrasives of comparative examples 1 to 3 did not contain fumed silica and therefore, it was confirmed that droplets were generated and that the printed pattern was deformed after drying and curing. In the polishing material of comparative example 4, it is considered that the fumed silica contained can suppress deformation of the printed pattern after drying and curing by the dropping, but the base material is an aluminum plate, and therefore, peeling between the base material and the polishing portion occurs.
From the above results, it is understood that by including fumed silica in the polishing portion and using a heat-resistant resin as the main component of the base material, it is possible to suppress dripping and form a columnar thick polishing portion, and therefore, it is possible to achieve a longer life while suppressing a decrease in polishing rate.
[ industrial applicability ]
The polishing material of the present invention and the polishing material produced by the method for producing a polishing material of the present invention can thicken the polishing portion while suppressing a decrease in polishing rate. Therefore, the polishing material of the present invention and the polishing material produced by the method for producing a polishing material of the present invention can exhibit a stable polishing rate and have a long life.
Claims (4)
1. A polishing material comprising a base material and a polishing layer laminated on the surface side of the base material and containing polishing particles and a binder, wherein
The polishing layer has a plurality of columnar polishing portions, the area of the bottom surface of each polishing portion is 0.93 to 1.05 times the area of the top surface of each polishing portion,
the average thickness of the polishing part is 500 to 5000 [ mu ] m,
the average area of the top surface of the grinding part is 1mm2Above, 150mm2In the following, the following description is given,
the polishing section contains fumed silica, and the polishing section contains fumed silica,
the fumed silica has an average primary particle diameter of 5nm to 100nm,
the base material contains a heat-resistant resin as a main component.
2. The abrasive according to claim 1, wherein the content of the fumed silica in the polishing portion is 0.1 vol% or more and 20 vol% or less.
3. The abrasive material according to claim 1, wherein the substrate is polycarbonate or biaxially stretched polyethylene terephthalate.
4. A method for producing an abrasive material, the abrasive material comprising a base material; and a polishing layer laminated on a surface side of the base material and containing polishing particles and a binder, the method for producing the polishing material comprising:
a step of forming the polishing layer by printing of a composition for a polishing layer,
the polishing layer has a plurality of columnar polishing portions, the area of the bottom surface of each polishing portion is 0.93 to 1.05 times the area of the top surface of each polishing portion,
wherein the average thickness of the polishing section is 500 to 5000 [ mu ] m, the polishing layer composition contains fumed silica,
the average area of the top surface of the grinding part is 1mm2Above, 150mm2In the following, the following description is given,
the fumed silica has an average primary particle diameter of 5nm to 100nm,
the base material contains a heat-resistant resin as a main component.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017243295 | 2017-12-19 | ||
| JP2017-243295 | 2017-12-19 | ||
| JP2018009930 | 2018-01-24 | ||
| JP2018-009930 | 2018-01-24 | ||
| PCT/JP2018/042368 WO2019123922A1 (en) | 2017-12-19 | 2018-11-15 | Polishing material and method for manufacturing polishing material |
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| CN110177653B true CN110177653B (en) | 2021-08-17 |
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| JP (1) | JPWO2019123922A1 (en) |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002337053A (en) * | 2001-05-11 | 2002-11-26 | Dainippon Printing Co Ltd | Polishing film |
| CN100343019C (en) * | 2000-04-28 | 2007-10-17 | 3M创新有限公司 | Abrasive article and methods for grinding glass |
| CN104139346A (en) * | 2014-07-23 | 2014-11-12 | 上虞市自远磨具有限公司 | Anti-blocking grinding tool and manufacturing method thereof |
| CN105722643A (en) * | 2013-11-12 | 2016-06-29 | 3M创新有限公司 | Structured abrasive articles and methods of using the same |
| CN107073688A (en) * | 2014-10-28 | 2017-08-18 | 阪东化学株式会社 | Grind material and grind the manufacture method of material |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6833014B2 (en) * | 2002-07-26 | 2004-12-21 | 3M Innovative Properties Company | Abrasive product, method of making and using the same, and apparatus for making the same |
-
2018
- 2018-11-15 WO PCT/JP2018/042368 patent/WO2019123922A1/en active Application Filing
- 2018-11-15 JP JP2018560923A patent/JPWO2019123922A1/en active Pending
- 2018-11-15 CN CN201880003034.2A patent/CN110177653B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100343019C (en) * | 2000-04-28 | 2007-10-17 | 3M创新有限公司 | Abrasive article and methods for grinding glass |
| JP2002337053A (en) * | 2001-05-11 | 2002-11-26 | Dainippon Printing Co Ltd | Polishing film |
| CN105722643A (en) * | 2013-11-12 | 2016-06-29 | 3M创新有限公司 | Structured abrasive articles and methods of using the same |
| CN104139346A (en) * | 2014-07-23 | 2014-11-12 | 上虞市自远磨具有限公司 | Anti-blocking grinding tool and manufacturing method thereof |
| CN107073688A (en) * | 2014-10-28 | 2017-08-18 | 阪东化学株式会社 | Grind material and grind the manufacture method of material |
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| CN110177653A (en) | 2019-08-27 |
| JPWO2019123922A1 (en) | 2019-12-19 |
| WO2019123922A1 (en) | 2019-06-27 |
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