CN110176550A - Preparation method, encapsulation cover plate, display panel and the display device of encapsulation cover plate - Google Patents
Preparation method, encapsulation cover plate, display panel and the display device of encapsulation cover plate Download PDFInfo
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- CN110176550A CN110176550A CN201910527303.1A CN201910527303A CN110176550A CN 110176550 A CN110176550 A CN 110176550A CN 201910527303 A CN201910527303 A CN 201910527303A CN 110176550 A CN110176550 A CN 110176550A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/82—Cathodes
- H10K50/824—Cathodes combined with auxiliary electrodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/87—Arrangements for heating or cooling
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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Abstract
This application provides a kind of preparation method of encapsulation cover plate, encapsulation cover plate, display panel and display devices, applied to display panel, the display panel further includes the display base plate that box is arranged with the encapsulation cover plate, pixel defining layer and cathode layer are formed on the display base plate, the encapsulation cover plate includes: substrate；It is stacked transparent heat-conducting layer and auxiliary cathode layer on the substrate；Wherein, there are discrete multiple first protrusions towards the cathode layer on the auxiliary cathode layer, the one side of first protrusion towards the cathode layer is exposed, to be in electrical contact with the cathode layer being located in the pixel defining layer, it is affected by temperature with solving OLED device, thus the problem for causing the jaundice of OLED screen curtain edge, periphery dimmed.
Description
Technical field
This application involves field of display technology, more particularly to a kind of preparation method of encapsulation cover plate, encapsulation cover plate, display
Panel and display device.
Background technique
With flourishing for display technology, organic electroluminescent diode apparatus (Organic Light Emitting
Diode, OLED) it is used as a kind of current mode luminescent device, because of its self-luminous, quick response, wide viewing angle and can be used for
The features such as Flexible Displays and be applied in high-performance display field more and more.
Existing OLED device, for luminous material layer between anode and cathode, luminous material layer is easy the shadow by temperature
It rings, to cause the jaundice of OLED screen curtain edge, periphery dimmed, and then influences the life of product of OLED device.
Summary of the invention
This application provides a kind of preparation method of encapsulation cover plate, encapsulation cover plate, display panel and display devices, to solve
OLED device is affected by temperature, thus the problem for causing the jaundice of OLED screen curtain edge, periphery dimmed.
To solve the above-mentioned problems, this application discloses a kind of encapsulation cover plates, are applied to display panel, the display panel
Further include the display base plate that box is arranged with the encapsulation cover plate, is formed with pixel defining layer and cathode on the display base plate
Layer, the encapsulation cover plate include:
Substrate；
It is stacked transparent heat-conducting layer and auxiliary cathode layer on the substrate；
Wherein, there are discrete multiple first protrusions towards the cathode layer on the auxiliary cathode layer, described the
The one side of one protrusion towards the cathode layer is exposed, to be in electrical contact with the cathode layer being located in the pixel defining layer.
Optionally, the transparent heat-conducting layer is between the auxiliary cathode layer and the substrate, the transparent heat-conducting layer
With discrete multiple second protrusions towards the cathode layer, the side wall of the first protrusion cladding second protrusion,
And the one side towards the cathode layer of first protrusion with the cathode layer being located in the pixel defining layer to connect
Touching.
Optionally, the auxiliary cathode layer is between the transparent heat-conducting layer and the substrate, the transparent heat-conducting layer
With discrete multiple second protrusions towards the cathode layer, the side wall of the second protrusion cladding first protrusion,
And it is described second protrusion towards the cathode layer one side it is exposed, to be located at the pixel defining layer on the cathode layer
Contact.
To solve the above-mentioned problems, disclosed herein as well is a kind of preparation methods of encapsulation cover plate, are applied to display panel,
The display panel further includes the display base plate that box is arranged with the encapsulation cover plate, is formed with pixel circle on the display base plate
The preparation method of given layer and cathode layer, the encapsulation cover plate includes:
The transparent heat-conducting layer and auxiliary cathode layer being stacked are formed on substrate, wherein stating has on auxiliary cathode layer
Towards discrete multiple first protrusions of the cathode layer, the one side of first protrusion towards the cathode layer is exposed, uses
To be in electrical contact with the cathode layer being located in the pixel defining layer.
Optionally, described to include: the step of forming the transparent heat-conducting layer and auxiliary cathode layer that are stacked on substrate
Form the transparent heat-conducting layer on the substrate by way of magnetron sputtering；
Discrete multiple are formed in the direction of transparent heat-conducting layer towards the cathode layer by the way of etching
Two protrusions；
Auxiliary cathode layer is formed in discrete multiple second protrusions；
It is upwardly formed by the way of etching in the side of auxiliary cathode layer towards the cathode layer discrete multiple
First protrusion, wherein the side wall of the first protrusion cladding second protrusion, and first protrusion towards the cathode
The one side of layer with the cathode layer being located in the pixel defining layer to contact.
Optionally, described to include: the step of forming the transparent heat-conducting layer and auxiliary cathode layer that are stacked on substrate
Auxiliary cathode layer is formed on the substrate；
It is upwardly formed by the way of etching in the side of auxiliary cathode layer towards the cathode layer discrete multiple
First protrusion；
The transparent heat-conducting layer is formed in discrete multiple first protrusions by way of magnetron sputtering；
Discrete multiple are formed in the direction of transparent heat-conducting layer towards the cathode layer by the way of etching
Two protrusions, wherein the side wall of the second protrusion cladding first protrusion, and described second is raised towards the cathode layer
It is exposed on one side, to be contacted with the cathode layer being located in the pixel defining layer.
To solve the above-mentioned problems, disclosed herein as well is a kind of display panels, including described in claim any one of 1-3
Encapsulation cover plate.
To solve the above-mentioned problems, this application discloses a kind of display devices, including display surface as claimed in claim 7
Plate.
Compared with prior art, the application includes following advantages:
The encapsulation cover plate of the application includes: substrate and is stacked transparent heat-conducting layer and auxiliary cathode on the substrate
Layer；Wherein, there is discrete multiple first protrusions towards the cathode layer, first protrusion on the auxiliary cathode layer
One side towards the cathode layer is exposed, to be located at the pixel defining layer on the cathode layer be in electrical contact, by
Transparent heat-conducting layer is arranged on substrate can distribute the heat generated in display panel, avoid amount of localized heat in display panel poly-
Collection, changes so as to cause luminescent material attribute, causes locally to turn to be yellow in display screen, the dimmed problem in periphery.
Certainly, any product for implementing the application is not necessarily required to reach all the above advantage simultaneously.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of encapsulation cover plate described in the embodiment of the present application one；
Fig. 2 is a kind of structural schematic diagram of encapsulation cover plate described in present application example two；
Fig. 3 is a kind of flow chart of the preparation method of encapsulation cover plate described in present application example three；
Fig. 4 is a kind of flow chart of the preparation method of encapsulation cover plate described in present application example four.
Specific embodiment
In order to make the above objects, features, and advantages of the present application more apparent, with reference to the accompanying drawing and it is specific real
Applying mode, the present application will be further described in detail.
Embodiment one
Referring to Fig.1, it illustrates a kind of structural schematic diagrams of encapsulation cover plate described in the embodiment of the present application one, are applied to display
Panel.
Wherein, the display panel further includes the display base plate 2 that box is arranged with the encapsulation cover plate 1, in the display
Anode layer 3, pixel defining layer 4, organic layer 5 and cathode layer 6 are formed on substrate 2.
The encapsulation cover plate 1 specifically includes:
Substrate 7.
It is stacked transparent heat-conducting layer 8 and auxiliary cathode layer 9 on the substrate 7.
Wherein, there are discrete multiple first protrusions 10 towards the cathode layer 6 on the auxiliary cathode layer 9.
One of which is stacked implementation are as follows:
Between the auxiliary cathode layer 9 and the substrate 7, the transparent heat-conducting layer 8 has the transparent heat-conducting layer 8
Towards discrete multiple second protrusions 11 of the cathode layer, the side of 10 cladding second protrusion 11 of the first protrusion
Wall, and first protrusion 10 towards the cathode layer 6 one side to be located at the pixel defining layer 4 on the cathode
Layer 6 is in electrical contact.
Transparent thermally conductive layer material includes any of the following: beryllium oxide BeO, aluminium nitride AlN, aluminum oxynitride AlON, organic
Composite material, such as: cellulose nano-fibrous (CNFs) and boron nitride nano-tube composite material, or other materials, it is right
This application is not particularly limited.
Further, encapsulation cover plate is carried out being bonded completion encapsulation with display base plate, it in practical applications can be using such as
Under type is packaged, and first in the edge-coating sealant of encapsulation cover plate, fills filler glue material, after UV precuring and aobvious
Show that substrate is bonded, particularly, transparent heat-conducting layer is in contact with cathode layer with auxiliary cathode.
The present embodiment, encapsulation cover plate include: substrate and are stacked transparent heat-conducting layer on the substrate and assist yin
Pole layer；Wherein, there are discrete multiple first protrusions towards the cathode layer, described first is convex on the auxiliary cathode layer
Rise towards the cathode layer one side it is exposed, to be located at the pixel defining layer on the cathode layer be in electrical contact, pass through
Transparent heat-conducting layer is arranged on substrate can distribute the heat generated in display panel, avoid amount of localized heat in display panel poly-
Collection, changes so as to cause luminescent material attribute, causes locally to turn to be yellow in display screen, the dimmed problem in periphery.
Embodiment two
Referring to Fig. 2, it illustrates a kind of structural schematic diagrams of encapsulation cover plate described in the embodiment of the present application two, are applied to display
Panel.
Wherein, the display panel further includes the display base plate 2 that box is arranged with the encapsulation cover plate 1, in the display
Anode layer 3, pixel defining layer 4, organic layer 5 and cathode layer 6 are formed on substrate 2.
The encapsulation cover plate 1 specifically includes:
Substrate 7.
It is stacked transparent heat-conducting layer 8 and auxiliary cathode layer 9 on the substrate 7.
Wherein, there are discrete multiple first protrusions 10 towards the cathode layer 6 on the auxiliary cathode layer 9.
One of which is stacked implementation are as follows:
Between the transparent heat-conducting layer 8 and the substrate 7, the transparent heat-conducting layer 8 has the auxiliary cathode layer 9
Towards discrete multiple second protrusions 11 of the cathode layer, the side of 11 cladding first protrusion 10 of the second protrusion
Wall, and the one side of second protrusion 11 towards the cathode layer 6 is exposed, to the institute that is located in the pixel defining layer 4
State the electrical contact of cathode layer 6.
Transparent thermally conductive layer material includes any of the following: beryllium oxide BeO, aluminium nitride AlN, aluminum oxynitride AlON, organic
Composite material, such as: cellulose nano-fibrous (CNFs) and boron nitride nano-tube composite material, or other materials, it is right
This application is not particularly limited.
Further, encapsulation cover plate is carried out being bonded completion encapsulation with display base plate, it in practical applications can be using such as
Under type is packaged, and first in the edge-coating sealant of encapsulation cover plate, fills filler glue material, after UV precuring and aobvious
Show that substrate is bonded, particularly, transparent heat-conducting layer is in contact with cathode layer with auxiliary cathode.
The present embodiment, encapsulation cover plate include: substrate and are stacked transparent heat-conducting layer on the substrate and assist yin
Pole layer；Wherein, there are discrete multiple first protrusions towards the cathode layer, described first is convex on the auxiliary cathode layer
Rise towards the cathode layer one side it is exposed, to be located at the pixel defining layer on the cathode layer be in electrical contact, pass through
Transparent heat-conducting layer is arranged on substrate can distribute the heat generated in display panel, avoid amount of localized heat in display panel poly-
Collection, changes so as to cause luminescent material attribute, causes locally to turn to be yellow in display screen, the dimmed problem in periphery.
Embodiment three
Referring to Fig. 3, it illustrates a kind of flow diagram of the preparation method of encapsulation cover plate described in the embodiment of the present application three,
Applied to display panel, the display panel further includes the display base plate that box is arranged with the encapsulation cover plate, the display base
Pixel defining layer and cathode layer are formed on plate, the preparation method of the encapsulation cover plate includes:
Step 301: the transparent heat-conducting layer and auxiliary cathode layer being stacked are formed on substrate.
Wherein, state on auxiliary cathode layer have towards the cathode layer it is discrete it is multiple first protrusion, described first
The one side of protrusion towards the cathode layer is exposed, to be in electrical contact with the cathode layer being located in the pixel defining layer.
As one of implementation: step 301 includes following sub-step:
Sub-step 3011: the transparent heat-conducting layer is formed on the substrate by way of magnetron sputtering.
Form the continuous transparent heat-conducting layer on the substrate by way of magnetron sputtering.
Transparent thermally conductive layer material includes any of the following: beryllium oxide BeO, aluminium nitride AlN, aluminum oxynitride AlON, organic
Composite material, such as: cellulose nano-fibrous (CNFs) and boron nitride nano-tube composite material, or other materials, it is right
This application is not particularly limited.
Further, encapsulation cover plate is carried out being bonded completion encapsulation with display base plate, it in practical applications can be using such as
Under type is packaged, and first in the edge-coating sealant of encapsulation cover plate, fills filler glue material, after UV precuring and aobvious
Show that substrate is bonded, particularly, transparent heat-conducting layer is in contact with cathode layer with auxiliary cathode.
Sub-step 3012: non-company is formed in the direction of transparent heat-conducting layer towards the cathode layer by the way of etching
Continuous multiple second protrusions.
Sub-step 3013: auxiliary cathode layer is formed in discrete multiple second protrusions.
Sub-step 3014: it is upwardly formed by the way of etching in the side of auxiliary cathode layer towards the cathode layer non-
Continuous multiple first protrusions.
Wherein, the side wall of the first protrusion cladding second protrusion, and first protrusion towards the cathode
The one side of layer with the cathode layer being located in the pixel defining layer to contact.
The present embodiment, encapsulation cover plate include: substrate and are stacked transparent heat-conducting layer on the substrate and assist yin
Pole layer；Wherein, there are discrete multiple first protrusions towards the cathode layer, described first is convex on the auxiliary cathode layer
Rise towards the cathode layer one side it is exposed, to be located at the pixel defining layer on the cathode layer be in electrical contact, pass through
Transparent heat-conducting layer is arranged on substrate can distribute the heat generated in display panel, avoid amount of localized heat in display panel poly-
Collection, changes so as to cause luminescent material attribute, causes locally to turn to be yellow in display screen, the dimmed problem in periphery.
Example IV
Referring to Fig. 4, it illustrates a kind of flow diagram of the preparation method of encapsulation cover plate described in the embodiment of the present application four,
Applied to display panel, the display panel further includes the display base plate that box is arranged with the encapsulation cover plate, the display base
Pixel defining layer and cathode layer are formed on plate, the preparation method of the encapsulation cover plate includes:
Step 401: the transparent heat-conducting layer and auxiliary cathode layer being stacked are formed on substrate.
Wherein, state on auxiliary cathode layer have towards the cathode layer it is discrete it is multiple first protrusion, described first
The one side of protrusion towards the cathode layer is exposed, to be in electrical contact with the cathode layer being located in the pixel defining layer.
As one of implementation: step 401 includes following sub-step:
Sub-step 4011: auxiliary cathode layer is formed on the substrate.
Sub-step 4012: it is upwardly formed by the way of etching in the side of auxiliary cathode layer towards the cathode layer non-
Continuous multiple first protrusions.
Sub-step 4013: it is formed in discrete multiple first protrusions by way of magnetron sputtering described transparent
Heat-conducting layer.
Form the continuous transparent heat-conducting layer on the substrate by way of magnetron sputtering.
Transparent thermally conductive layer material includes any of the following: beryllium oxide BeO, aluminium nitride AlN, aluminum oxynitride AlON, organic
Composite material, such as: cellulose nano-fibrous (CNFs) and boron nitride nano-tube composite material, or other materials, it is right
This application is not particularly limited.
Sub-step 4014: non-company is formed in the direction of transparent heat-conducting layer towards the cathode layer by the way of etching
Continuous multiple second protrusions.
Wherein, the side wall of the second protrusion cladding first protrusion, and described second is raised towards the cathode layer
One side it is exposed, to be located at the pixel defining layer on the cathode layer contact.
The present embodiment, encapsulation cover plate include: substrate and are stacked transparent heat-conducting layer on the substrate and assist yin
Pole layer；Wherein, there are discrete multiple first protrusions towards the cathode layer, described first is convex on the auxiliary cathode layer
Rise towards the cathode layer one side it is exposed, to be located at the pixel defining layer on the cathode layer be in electrical contact, pass through
Transparent heat-conducting layer is arranged on substrate can distribute the heat generated in display panel, avoid amount of localized heat in display panel poly-
Collection, changes so as to cause luminescent material attribute, causes locally to turn to be yellow in display screen, the dimmed problem in periphery.
It should be noted that for the aforementioned method embodiment, for simple description, therefore, it is stated as a series of
Combination of actions, but those skilled in the art should understand that, the application is not limited by the described action sequence, because according to
According to the application, some steps may be performed in other sequences or simultaneously.Secondly, those skilled in the art should also know that,
The embodiments described in the specification are all preferred embodiments, necessary to related movement not necessarily the application.
Embodiment five
Disclosed herein as well is a kind of display panels, including the encapsulation cover plate in embodiment one and embodiment two.
The display panel has the advantages that all of above-described embodiment one and the encapsulation cover plate in embodiment two, herein no longer
It repeats.
Embodiment six
Disclosed herein as well is a kind of display devices, including the display base plate in embodiment five.
The display device has the advantages that all of display base plate in above-described embodiment five, and details are not described herein.
All the embodiments in this specification are described in a progressive manner, the highlights of each of the examples are with
The difference of other embodiments, the same or similar parts between the embodiments can be referred to each other.
It would have readily occurred to a person skilled in the art that: any combination application of above-mentioned each embodiment is all feasible, therefore
Any combination between above-mentioned each embodiment is all the embodiment of the application, but this specification exists as space is limited,
This is not just detailed one by one.
Although the preferred embodiment of the application has been described, it is created once a person skilled in the art knows basic
Property concept, then additional changes and modifications can be made to these embodiments.So it includes excellent that the following claims are intended to be interpreted as
It selects embodiment and falls into all change and modification of the application range.
A kind of preparation method of encapsulation cover plate provided herein, encapsulation cover plate, display panel and display are filled above
It sets, is described in detail, specific examples are used herein to illustrate the principle and implementation manner of the present application, above
The explanation of embodiment is merely used to help understand the present processes and its core concept；Meanwhile for the general skill of this field
Art personnel, according to the thought of the application, there will be changes in the specific implementation manner and application range, in conclusion this
Description should not be construed as the limitation to the application.
Claims (8)
1. a kind of encapsulation cover plate, which is characterized in that be applied to display panel, the display panel further includes and the encapsulation cover plate
To the display base plate of box setting, it is formed with pixel defining layer and cathode layer on the display base plate, the encapsulation cover plate includes:
Substrate；
It is stacked transparent heat-conducting layer and auxiliary cathode layer on the substrate；
Wherein, there are discrete multiple first protrusions towards the cathode layer, described first is convex on the auxiliary cathode layer
Rise towards the cathode layer one side it is exposed, to be located at the pixel defining layer on the cathode layer be in electrical contact.
2. encapsulation cover plate according to claim 1, which is characterized in that the transparent heat-conducting layer is located at the auxiliary cathode layer
Between the substrate, the transparent heat-conducting layer has discrete multiple second protrusions towards the cathode layer, and described the
One protrusion cladding it is described second protrusion side wall, and it is described first protrusion the one side towards the cathode layer to be located at institute
State the cathode layer contact in pixel defining layer.
3. encapsulation cover plate according to claim 1, which is characterized in that the auxiliary cathode layer is located at the transparent heat-conducting layer
Between the substrate, the transparent heat-conducting layer has discrete multiple second protrusions towards the cathode layer, and described the
Two protrusion cladding it is described first protrusion side walls, and it is described second protrusion towards the cathode layer one side it is exposed, to position
In the cathode layer contact in the pixel defining layer.
4. a kind of preparation method of encapsulation cover plate, which is characterized in that be applied to display panel, the display panel further includes and institute
The display base plate that box is arranged in encapsulation cover plate is stated, pixel defining layer and cathode layer, the encapsulation are formed on the display base plate
The preparation method of cover board includes:
The transparent heat-conducting layer and auxiliary cathode layer being stacked are formed on substrate, wherein stating has direction on auxiliary cathode layer
The cathode layer it is discrete it is multiple first protrusion, it is described first protrusion towards the cathode layer one side it is exposed, to
Cathode layer electrical contact in the pixel defining layer.
5. the preparation method according to claim 4, which is characterized in that be stacked transparent of being formed on substrate is led
The step of thermosphere and auxiliary cathode layer include:
Form the transparent heat-conducting layer on the substrate by way of magnetron sputtering；
It is convex that in the direction of transparent heat-conducting layer towards the cathode layer discrete multiple second are formed by the way of etching
It rises；
Auxiliary cathode layer is formed in discrete multiple second protrusions；
Discrete multiple first are upwardly formed in the side of auxiliary cathode layer towards the cathode layer by the way of etching
Protrusion, wherein the side wall of the first protrusion cladding second protrusion, and first protrusion towards the cathode layer
On one side to be contacted with the cathode layer being located in the pixel defining layer.
6. the preparation method according to claim 4, which is characterized in that be stacked transparent of being formed on substrate is led
The step of thermosphere and auxiliary cathode layer include:
Auxiliary cathode layer is formed on the substrate；
Discrete multiple first are upwardly formed in the side of auxiliary cathode layer towards the cathode layer by the way of etching
Protrusion；
The transparent heat-conducting layer is formed in discrete multiple first protrusions by way of magnetron sputtering；
It is convex that in the direction of transparent heat-conducting layer towards the cathode layer discrete multiple second are formed by the way of etching
It rises, wherein the side wall of the second protrusion cladding first protrusion, and the described second raised one side towards the cathode layer
It is exposed, to be contacted with the cathode layer being located in the pixel defining layer.
7. a kind of display panel, which is characterized in that including the described in any item encapsulation cover plates of claim 1-3.
8. a kind of display device, which is characterized in that including display panel as claimed in claim 7.
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| CN201910527303.1A CN110176550B (en) | 2019-06-18 | 2019-06-18 | Preparation method of packaging cover plate, display panel and display device |
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| CN201910527303.1A CN110176550B (en) | 2019-06-18 | 2019-06-18 | Preparation method of packaging cover plate, display panel and display device |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110534554A (en) * | 2019-09-12 | 2019-12-03 | 云谷（固安）科技有限公司 | Display panel and display device |
| CN110675760A (en) * | 2019-09-30 | 2020-01-10 | 云谷（固安）科技有限公司 | Display panel and display device |
| CN110911583A (en) * | 2019-11-28 | 2020-03-24 | 京东方科技集团股份有限公司 | Organic light-emitting display cover plate, manufacturing method and display device |
| CN111180600A (en) * | 2020-01-06 | 2020-05-19 | 武汉华星光电半导体显示技术有限公司 | Organic light emitting diode device structure and manufacturing method thereof |
| WO2022237096A1 (en) * | 2021-05-13 | 2022-11-17 | 京东方科技集团股份有限公司 | Light-emitting substrate and light-emitting device |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060267030A1 (en) * | 2002-04-24 | 2006-11-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of manufacturing same |
| CN101968948A (en) * | 2010-09-20 | 2011-02-09 | 四川虹视显示技术有限公司 | Auxiliary electrode structure for organic light emitting diode (OLED) illuminating panel |
| CN102709480A (en) * | 2011-11-25 | 2012-10-03 | 京东方科技集团股份有限公司 | Organic electrogenerated luminescent device and display |
| KR20170038598A (en) * | 2015-09-30 | 2017-04-07 | 엘지디스플레이 주식회사 | Organic light emitting display |
| CN106601928A (en) * | 2016-12-02 | 2017-04-26 | 深圳市华星光电技术有限公司 | Oled display device |
| CN107221607A (en) * | 2017-05-25 | 2017-09-29 | 京东方科技集团股份有限公司 | A kind of encapsulating structure of display device and preparation method thereof, display device |
| CN107565048A (en) * | 2017-08-24 | 2018-01-09 | 京东方科技集团股份有限公司 | A kind of preparation method of array base palte, array base palte and display device |
| CN107611164A (en) * | 2017-09-25 | 2018-01-19 | 京东方科技集团股份有限公司 | A kind of oled panel and preparation method thereof |
| CN107623084A (en) * | 2017-10-13 | 2018-01-23 | 京东方科技集团股份有限公司 | Encapsulation cover plate and preparation method thereof |
| CN108987608A (en) * | 2018-07-24 | 2018-12-11 | 京东方科技集团股份有限公司 | OLED display panel and its manufacturing method, display device |
-
2019
- 2019-06-18 CN CN201910527303.1A patent/CN110176550B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060267030A1 (en) * | 2002-04-24 | 2006-11-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of manufacturing same |
| CN101968948A (en) * | 2010-09-20 | 2011-02-09 | 四川虹视显示技术有限公司 | Auxiliary electrode structure for organic light emitting diode (OLED) illuminating panel |
| CN102709480A (en) * | 2011-11-25 | 2012-10-03 | 京东方科技集团股份有限公司 | Organic electrogenerated luminescent device and display |
| KR20170038598A (en) * | 2015-09-30 | 2017-04-07 | 엘지디스플레이 주식회사 | Organic light emitting display |
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