CN110168807B - Antenna assembly and terminal - Google Patents
Antenna assembly and terminal Download PDFInfo
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- CN110168807B CN110168807B CN201780082202.7A CN201780082202A CN110168807B CN 110168807 B CN110168807 B CN 110168807B CN 201780082202 A CN201780082202 A CN 201780082202A CN 110168807 B CN110168807 B CN 110168807B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/44—Details of, or arrangements associated with, antennas using equipment having another main function to serve additionally as an antenna, e.g. means for giving an antenna an aesthetic aspect
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Abstract
The embodiment of the application provides an antenna assembly and a terminal, and relates to the technical field of antennas, wherein the terminal comprises a non-metal rear shell, a main board, a battery and a coupling coil layer, wherein a heat conductor layer is arranged on the inner surface of the non-metal rear shell, an NFC antenna coil is formed by slotting the heat conductor layer, the main board is opposite to the heat conductor layer, and a feeding point is arranged on the main board; the batteries and the mainboard are arranged along the direction parallel to the heat conductor layer; the coupling coil layer is arranged between the mainboard and the heat conductor layer and is arranged with the battery along the direction parallel to the heat conductor layer, the coupling coil layer is connected with the feed point on the mainboard, and space coupling can be formed between the coupling coil layer and the heat conductor layer, so that the heat conductor layer generates secondary radiation.
Description
Technical Field
The application relates to the technical field of antennas, in particular to an antenna assembly and a terminal.
Background
With the popularization and development of mobile payment technology, more and more terminals support the NFC (Near field communication) function, which is a non-contact identification and interconnection technology and can perform Near field wireless communication between mobile devices, consumer electronics, PCs and intelligent control tools. NFC provides a simple, touch-sensitive solution that allows consumers to exchange information, access content, and services simply and intuitively.
NFC is formed by an NFC module and an NFC antenna. The NFC module generally includes a high-speed single chip, a radio frequency chip, and a matching circuit. The NFC module is arranged in a mainboard of the terminal, and the NFC antenna is connected with a feed point of the mainboard. The NFC antenna is based on an RFID (Radio Frequency Identification) technology, a transformer common coupling matching is adopted as a hardware processing scheme for communication, the verification of a data transmission process is completed through a communication instruction of a processor, and the software and hardware environment is successfully designed and manufactured through RFID modulation processing and matching circuit adjustment. The working frequency of a common NFC antenna is 13.56Mhz, and the wavelength of the 13.56Mhz is very long, and the reading and writing distance is very short, so that the area size of the NFC antenna is very important for improving the user experience. The larger the NFC antenna area is, the larger its recognizable range is, and the better the user experience is. However, the NFC antenna with a large area needs to occupy a single layer of space, which may increase the thickness of the terminal and is not favorable for the terminal device to be light and thin.
Disclosure of Invention
The embodiment of the application provides an antenna assembly and a terminal, so that the thickness space occupied by an NFC antenna in the terminal is reduced.
In order to achieve the above purpose, the embodiment of the present application adopts the following technical solutions:
in a first aspect, the present application provides a terminal, including a non-metal rear case, a motherboard, a battery, and a coupling coil layer, where an inner surface of the non-metal rear case is provided with a heat conductor layer, a slot is formed in the heat conductor layer to form an NFC antenna coil, the motherboard is opposite to the heat conductor layer, and the motherboard is provided with a feeding point; the batteries and the mainboard are arranged along the direction parallel to the heat conductor layer; the coupling coil layer is arranged between the mainboard and the heat conductor layer and is arranged with the battery along the direction parallel to the heat conductor layer, the coupling coil layer is connected with the feed point on the mainboard, and space coupling can be formed between the coupling coil layer and the heat conductor layer, so that the heat conductor layer generates secondary radiation.
According to the terminal provided by the embodiment of the application, the heat conductor layer is formed into the NFC antenna coil, and the coupling coil layer and the heat conductor layer can form space coupling, so that induced current can be excited in the NFC antenna coil formed by the heat conductor layer, and secondary radiation can be generated by the induced current. This application embodiment has utilized the heat conduction body layer as the final radiating element of NFC antenna, and the area on heat conduction body layer can satisfy the demand of NFC antenna to the identification range, and the coupling coil layer only is used for the coupling heat conduction body layer, therefore the area on coupling coil layer can be done for a short time, makes the position setting of coupling coil layer correspondence mainboard and arrange along the direction that is on a parallel with the heat conduction body layer with the battery to not occupation thickness space makes the terminal product frivolous more.
In a possible implementation manner, the heat conductor layer is connected with a matching circuit module, the NFC antenna coil is an open antenna coil, and the matching circuit module is connected with the NFC antenna coil to form a closed loop current path. Therefore, the operating frequency of the NFC antenna coil can be adjusted by adjusting the matching circuit module, for example, the operating frequency of the NFC antenna can be adjusted to 13.56Mhz in common use. Because the thickness of the matching circuit module is slightly thicker than the heat conductor layer, in order to prevent the thickness of the whole machine from increasing, a part with smaller thickness on the mainboard can be arranged corresponding to the matching circuit module so as to avoid the thickness of the matching circuit module, and because the area of the matching circuit module is very small, the avoidance is easy to realize.
In a possible implementation, the matching circuit module may be disposed on the motherboard. At this time, a connecting wire needs to be provided between the main board and the heat conductor layer to connect the matching circuit module with the heat conductor layer. Specifically, can be connected connecting wire one end and the matching circuit module on the mainboard, pass through crimping structure crimping with the other end and the heat conductor layer of connecting wire to the nonmetal backshell is opened.
In another possible implementation manner, the matching circuit module may also be disposed on the inner surface of the non-metal rear case, and at this time, it is only necessary to connect the heat conductor layer and the matching circuit module into a loop on the non-metal rear case, and it is not necessary to connect the heat conductor layer and the matching circuit module to the main board, and this connection structure is convenient to implement and does not affect the opening of the non-metal rear case.
In a possible implementation manner, since the heat conductor layer is usually provided with an avoidance hole for avoiding the camera, the avoidance hole can be used as a part of the NFC antenna coil, specifically, the heat conductor layer is provided with a long groove, one end of the long groove penetrates through the first edge of the heat conductor layer, the other end of the long groove penetrates through the avoidance hole, two sides of the long groove are respectively provided with a connection point, and the two connection points are respectively connected with two interfaces of the matching circuit module. Thereby simplifying the grooving process. The magnetic flux near the camera can be larger, the camera can be used as the central position when the card is swiped when the card reader is used, the reference is convenient, and the identification speed and the identification precision are improved.
In a possible implementation, the NFC antenna coil is a closed antenna coil, and the closed antenna coil forms a closed loop current path inside the heat conductor layer. This structure need adjust NFC antenna coil's operating frequency through the structure of adjusting closed antenna coil, need not connect the matching circuit module, can simplify the manufacture craft, and does not have between heat conductor layer and the mainboard to be connected, can not influence the nonmetal backshell and open.
In a possible implementation manner, an avoidance hole for avoiding the camera is formed in the heat conductor layer, a first long groove and a second long groove which are perpendicular to each other are formed in the heat conductor layer, the first long groove is arranged close to the first edge of the heat conductor layer and is parallel to the first edge of the heat conductor layer, one end of the second long groove is communicated with the first long groove, and the other end of the second long groove is communicated with the avoidance hole. The structure can adjust the working frequency of the NFC antenna coil by only changing the length and the width of the first long groove, and achieves the purpose of adjusting the working frequency by changing the structure as little as possible, thereby preventing excessive waste.
In a possible implementation, the surface of the coupling coil layer adjacent to the heat conductor layer is flush with the surface of the battery adjacent to the heat conductor layer. Therefore, the coupling coil layer can be far away from the mainboard as far as possible on the premise of not exceeding the thickness range of the battery, and therefore the influence on the heat dissipation of the mainboard is avoided.
In a possible implementation, the coupling coil layer includes an FPC (Flexible Printed Circuit) and a coupling coil disposed inside the FPC. The FPC is thin, small in occupied space and low in cost.
In a possible implementation manner, the projection of the slotted region of the heat conductor layer on the motherboard is staggered with the element needing heat dissipation on the motherboard, and the projection of the coupling coil layer on the motherboard is staggered with the element needing heat dissipation on the motherboard. Therefore, the slotting of the heat conductor layer and the coupling coil layer can be prevented from influencing the heat dissipation of the high-heat element on the mainboard.
In a possible implementation manner, the gap between the heat conductor layer and the coupling coil layer is 0.2-0.3 mm. This gap range may allow for better coupling between the thermal conductor layer and the coupling coil layer.
In a possible implementation, a ferrite layer is provided on the surface of the coupling coil layer facing the main board. The ferrite layer can prevent eddy current generated on the surface of the inner conductor of the mainboard from weakening the magnetic field of the coupling coil layer, thereby increasing magnetic flux and improving the coupling effect between the heat conductor layer and the coupling coil layer.
In a second aspect, the present application provides another terminal, including a non-metal rear case and a motherboard, wherein a heat conductor layer is disposed on an inner surface of the non-metal rear case, and a slot is formed in the heat conductor layer to form an NFC antenna coil; the mainboard is opposite to the heat conductor layer, is equipped with the feed point on the mainboard, and NFC antenna coil is connected with the feed point on the mainboard.
The terminal that this application embodiment provided is connected the direct feed point with on mainboard of heat conduction body layer, utilizes the heat conduction body layer as the radiating element of NFC antenna, and the area on heat conduction body layer can satisfy the demand of NFC antenna to the identification range to do not increase other devices, complete machine thickness does not change, thereby has avoided the thickness space that the NFC antenna took the complete machine.
In a possible implementation of the second aspect, a ferrite layer is provided on a surface of the heat conductor layer facing the motherboard. The ferrite layer can prevent eddy currents generated on the surface of the inner conductor of the mainboard from weakening the magnetic field of the heat conductor layer, so that the performance of the NFC antenna is improved.
In a third aspect, the present application provides a mobile phone, including a non-metal rear case, wherein a heat conductor layer is disposed on an inner surface of the non-metal rear case, and a slot is formed in the heat conductor layer to form an NFC antenna coil; the mainboard and the heat conductor layer are arranged along the thickness direction of the mobile phone, and a feed point is arranged on the mainboard; the battery and the mainboard are arranged along the length direction of the mobile phone; the antenna coil in the FPC is connected with a feed point on the mainboard, and space coupling can be formed between the antenna coil in the FPC and the heat conductor layer, so that the NFC antenna coil of the heat conductor layer generates secondary radiation; the matching circuit module is arranged on the inner surface of the non-metal rear shell, the NFC antenna coil is an open antenna coil, and the matching circuit module is connected with the NFC antenna coil to form a closed annular current path.
The cell-phone that this application embodiment provided, with heat conductor layer fluting form NFC antenna coil, and can form space coupling between antenna coil in the FPC and the heat conductor layer, make the heat conductor layer produce secondary radiation, therefore, the heat conductor layer has been utilized as the final radiating element of NFC antenna, the area on heat conductor layer can satisfy the demand of NFC antenna to the identification range, and antenna coil in the FPC only is used for coupling heat conductor layer, consequently, FPC's area can be done for a short time, make FPC correspond the position setting of mainboard and arrange with the length direction of battery cell-phone, thereby do not occupy the thickness space of cell-phone, make the cell-phone more frivolous.
In a fourth aspect, the present application provides an antenna assembly, including a non-metallic rear housing, an inner surface of the non-metallic rear housing being provided with a heat conductor layer, the heat conductor layer being grooved to form an NFC antenna coil; the coupling coil layer is parallel to the heat conductor layer and arranged at intervals, and space coupling can be formed between the coupling coil layer and the heat conductor layer, so that the heat conductor layer generates secondary radiation.
The antenna module that this application embodiment provided, with heat conductor layer fluting form NFC antenna coil, and can form space coupling between coupling coil layer and the heat conductor layer, make the heat conductor layer produce secondary radiation, consequently, utilized the heat conductor layer as the final radiating element of NFC antenna, the demand of NFC antenna to the identification range can be satisfied to the area of heat conductor layer, and the coupling coil layer only is used for coupling heat conductor layer, consequently the area on coupling coil layer can be done for a short time, make the coupling coil layer not occupy the thickness space.
In a possible implementation manner of the fourth aspect, the heat conductor layer is connected to a matching circuit module, the NFC antenna coil is an open antenna coil, and the matching circuit module is connected to the NFC antenna coil to form a closed loop current path. Therefore, the operating frequency of the NFC antenna coil can be adjusted by adjusting the matching circuit module, for example, the operating frequency of the NFC antenna can be adjusted to 13.56Mhz in common use. Specifically, the matching circuit module may be a fixed value inductor, and the operating frequency of the NFC antenna coil is adjusted by replacing fixed value inductors of different models.
In a possible implementation manner of the fourth aspect, the matching circuit module may be disposed on an inner surface of the non-metal rear case, and at this time, only the heat conductor layer and the matching circuit module need to be connected to form a loop on the non-metal rear case, and the connection structure is convenient to implement and does not affect opening of the non-metal rear case.
In a possible implementation manner of the fourth aspect, since the heat conductor layer is usually provided with an avoidance hole for avoiding the camera, the avoidance hole can be used as a part of the NFC antenna coil, specifically, the heat conductor layer is provided with a long groove, one end of the long groove penetrates through the first edge of the heat conductor layer, the other end of the long groove penetrates through the avoidance hole, two sides of the long groove are respectively provided with one connection point, and the two connection points are respectively connected with two interfaces of the matching circuit module. Thereby simplifying the grooving process. The magnetic flux near the camera can be larger, the camera can be used as the central position when the card is swiped when the card reader is used, the reference is convenient, and the identification speed and the identification precision are improved.
In a possible implementation manner of the fourth aspect, the NFC antenna coil is a closed antenna coil, and the closed antenna coil forms a closed loop current path inside the heat conductor layer. The structure needs to adjust the working frequency of the NFC antenna coil through adjusting the structure of the closed antenna coil, does not need to be connected with a matching circuit module, can simplify the manufacturing process, and does not influence the opening of the nonmetal rear shell.
In a possible implementation manner of the fourth aspect, an avoidance hole for avoiding the camera is formed in the heat conductor layer, a first elongated slot and a second elongated slot which are perpendicular to each other are formed in the heat conductor layer, the first elongated slot is disposed near the first edge of the heat conductor layer and is parallel to the first edge of the heat conductor layer, one end of the second elongated slot is communicated with the first elongated slot, and the other end of the second elongated slot is communicated with the avoidance hole. The structure can adjust the working frequency of the NFC antenna coil by only changing the length and the width of the first long groove, and achieves the purpose of adjusting the working frequency by changing the structure as little as possible, thereby preventing excessive waste.
In a possible implementation manner of the fourth aspect, the coupling coil layer includes an FPC and a coupling coil disposed inside the FPC. The FPC is thin, small in occupied space and low in cost.
In a possible implementation manner of the fourth aspect, the gap between the heat conductor layer and the coupling coil layer is 0.2-0.3 mm. This gap range may allow for better coupling between the thermal conductor layer and the coupling coil layer.
In a possible implementation of the fourth aspect, a ferrite layer is provided on a surface of the coupling coil layer facing the motherboard. When the antenna component is used in the terminal, the ferrite layer can prevent eddy current generated on the surface of the conductor in the main board of the terminal from weakening the magnetic field of the coupling coil layer, thereby increasing the magnetic flux and improving the coupling effect between the heat conductor layer and the coupling coil layer.
Drawings
FIG. 1 is a schematic cross-sectional view of a mobile phone;
FIG. 2 is a front view of a handset according to an embodiment of the present application;
fig. 3 is a schematic cross-sectional structure diagram of a mobile phone according to a first embodiment of the present application;
fig. 4 is an exploded schematic structural diagram of a main board, a coupling coil layer and a heat conductor layer in a mobile phone according to a first embodiment of the present application;
fig. 5 is an exploded schematic view of a matching circuit module in a mobile phone according to a first embodiment of the present application, when the matching circuit module is disposed on a non-metal rear case;
fig. 6 is an exploded schematic view of an NFC antenna coil in a mobile phone according to a first embodiment of the present application when the NFC antenna coil is closed;
fig. 7 is an exploded schematic structural diagram of a main board, a coupling coil layer and a heat conductor layer in a mobile phone according to a second embodiment of the present application;
fig. 8 is a schematic structural diagram of an antenna assembly according to a fourth embodiment of the present application.
Detailed Description
The embodiment of the application relates to a terminal, which may be a mobile terminal, and the mobile terminal may include a mobile phone, a tablet computer, a PDA (Personal Digital Assistant), a POS (Point of Sales), a vehicle-mounted computer, and the like. The embodiment of the present invention does not specially limit the specific form of the terminal.
The mobile terminal may include a main board, a rear case, a thermal conductor layer, and an NFC antenna, which are briefly described below.
Mainboard: the main board is also called a main control circuit board, a main board, a system board, a logic board, a mother board, a bottom board, etc., and may include an NFC module, a feeding point, etc. The NFC module generally includes a high-speed single chip, a radio frequency chip, and a matching circuit, where the matching circuit is used to adjust the operating frequency of the NFC antenna.
A rear shell: the shell is covered on the back of the mobile phone and used for protecting the internal elements of the mobile phone.
A heat conductor layer: the heat conductor material layer formed on the inner surface of the mobile phone rear shell can be a good conductor such as double-layer graphite, graphite plus copper foil or graphene. The heat dissipation device is used for uniformly dispersing the heat of the mobile phone rear shell and preventing the local overheating of the mobile phone rear shell.
NFC antenna: based on the RFID technology, the transformer common coupling matching is adopted as a hardware processing scheme for communication, the communication instruction of a processor is used for completing the verification of the data transmission process, and the software and hardware environment is successfully designed and manufactured through the RFID modulation processing and the matching circuit adjustment. NFC antennas are typically composed of a circuit coil made by a wire winding/printing/etching process and a ferrite material with interference immunity.
In addition, the mobile terminal may further include: RF (Radio Frequency) circuit, memory, other input devices, display screen, sensor, I/O subsystem, processor, power management chip, camera, bluetooth module, virtual key, and physical key, which are not described herein again.
Those skilled in the art will appreciate that the above-described architecture of the mobile terminal is not intended to be limiting, and may include more or fewer components than those shown, or may combine some components, or split some components, or arranged in different components. Those skilled in the art will appreciate that the display belongs to a User Interface (UI) and that the handset may include fewer than or the same User Interface as illustrated.
In the following embodiments, the terminal may be a mobile phone as an example, and of course, the electronic device according to the embodiments of the present application is not limited to the mobile phone. With the increasing integration of electronic components, mobile phones are developing to be thinner and lighter, and the requirements on the architecture and performance of NFC antennas are higher and higher.
Fig. 1 is a partial structural schematic view of a cross section of a mobile phone. Referring to fig. 1, the mobile phone includes a main board 01 and a battery 02 arranged along an X direction shown in fig. 1, an NFC antenna 03 is disposed above the battery 02 and the main board 01, the thickness of the battery 02 is greater than that of the main board 01, and a bracket 04 is disposed between the NFC antenna 03 and the main board, so that the bracket 04 can increase the strength of the whole mobile phone and provide buffer protection for the main board 01. The applicant finds that in the scheme, because the area of the NFC antenna 03 is large, the NFC antenna 03 can only be stacked with the battery 02 in the thickness direction, so that the thickness of the whole mobile phone is increased, and the mobile phone is not light and thin.
In the first embodiment, the first step is,
in order to solve the above problem, an embodiment of the present application provides a structural design scheme of a mobile phone, as shown in fig. 2 to 3. The mobile phone 100 of the embodiment of the application includes a non-metal rear case 1, a main board 2, a battery 3, and a coupling coil layer 4, wherein a heat conductor layer 5 is disposed on an inner surface of the non-metal rear case 1, the heat conductor layer 5 is grooved to form an NFC antenna coil, the main board 2 is opposite to the heat conductor layer 5, and a feeding point (not shown in the figure) is disposed on the main board 2; the batteries 3 and the main board 2 are arranged along the direction parallel to the heat conductor layer 5; the coupling coil layer 4 is disposed between the main board 2 and the heat conductor layer 5, and is arranged in a direction parallel to the heat conductor layer 5 with the battery 3, the coupling coil layer 4 is connected to a feeding point on the main board 2, and a spatial coupling can be formed between the coupling coil layer 4 and the heat conductor layer 5, so that the heat conductor layer 5 generates secondary radiation.
According to the mobile phone provided by the embodiment of the application, the heat conductor layer 5 is grooved to form the NFC antenna coil, and the coupling coil layer 4 and the heat conductor layer 5 can form space coupling, so that induced current can be excited in the NFC antenna coil formed by the heat conductor layer 5, and the induced current can emit secondary radiation. From this, utilized heat conductor layer 5 as the final radiating element of NFC antenna, the thickness of heat conductor layer 5 can not be increased to the fluting technology, the demand of NFC antenna to the identification range can be satisfied in the area of heat conductor layer 5, and coupling coil layer 4 only is used for coupling heat conductor layer 5, consequently coupling coil layer 4's area can be done for a short time, make coupling coil layer 4 correspond the position setting of mainboard 2 and arrange along the direction that is on a parallel with heat conductor layer 5 with battery 3, thereby not occupation thickness space, make the terminal product more frivolous.
As shown in fig. 4, the NFC chip 21 and the matching circuit 22 are disposed on the main board 2, the feeding point on the main board 2 is connected to the matching circuit 22, and the connection mode between the coupling coil layer 4 and the feeding point may be a differential feeding mode or a non-differential single-ended feeding mode, which is not limited herein.
It should be noted that: the NFC antenna coil is formed by notching the heat conductor layer 5, wherein the notching may be performed by an etching process, i.e. a part of the material of the heat conductor layer 5 may be removed by using a chemical reaction or a physical impact method, and finally the NFC antenna coil structure is formed. The specific process is not limited. The shape of the slot of the heat conductor layer 5 may also be various shapes, such as a circle, an ellipse, a square, a triangle, etc., which are not limited herein, and the antenna coil formed after the slot may be a closed structure or an open structure.
Fig. 4 shows an embodiment of an open antenna coil, the NFC antenna coil shown in fig. 4 is an open antenna coil, and the matching circuit module 6 is connected with the NFC antenna coil to form a closed loop current path. The arrows in fig. 4 show one possible flow path of the induced current, whereby the operating frequency of the NFC antenna coil can be adjusted by adjusting the matching circuit module 6, for example to a commonly used 13.56 Mhz. Specifically, the matching circuit module 6 may be a fixed value inductor, and the operating frequency of the NFC antenna coil is adjusted by replacing fixed value inductors of different models. Since the thickness of the matching circuit module 6 is slightly thicker than that of the heat conductor layer 5, in order to prevent the increase of the thickness of the whole device, a component with smaller thickness on the main board 2 can be arranged corresponding to the matching circuit module 6 to avoid the thickness of the matching circuit module 6, and since the area of the matching circuit module 6 is small (generally smaller than 1mmx2mm), the avoidance can be easily realized.
It should be noted that, a common operating frequency of an NFC antenna at present is 13.56Mhz, but 13.56Mhz is not a limitation to the operating frequency of the NFC antenna in the present application, and the operating frequency of the NFC antenna may also be 13.56Mhz ± 7kHz, or 13.56Mhz ± 678Hz, and the operating frequency applicable to the NFC antenna is within the protection range of the present application.
As shown in fig. 4, the matching circuit module 6 may be disposed on the motherboard 2. In this case, it is necessary to provide a connection line between the main board 2 and the heat conductor layer 5 and connect the matching circuit module 6 and the heat conductor layer 5. Specifically, one end of the connecting wire may be fixedly connected to the matching circuit module 6 on the main board 2, and the other end of the connecting wire may be detachably connected to the heat conductor layer 5 (e.g., by crimping) so that the non-metal rear case 1 is opened.
In another possible implementation manner, as shown in fig. 5, the matching circuit module 6 may also be disposed on the inner surface of the non-metal rear case 1, and at this time, only the heat conductor layer 5 and the matching circuit module 6 need to be connected to form a loop on the non-metal rear case 1, and do not need to be connected to the main board 2, and this connection structure is convenient to implement and does not affect the opening of the non-metal rear case 1.
Because the NFC antenna is coupled through the magnetic field of coil radiation, and the distribution of magnetic field has density change, and the magnetic field density of coil central zone is great usually, when using the NFC function to carry out short distance wireless communication, because the back lid does not have the regional index mark of coil central zone, can't refer to, consequently the user can't learn the magnetic field density of where great, just also can't accurate use the strongest part of magnetic field. To solve the above problem, as shown in fig. 4, since the heat conductor layer 5 is usually provided with an avoidance hole 51 for avoiding the camera, the avoidance hole 51 may be used as a part of the groove of the heat conductor layer 5, specifically, the heat conductor layer 5 is further provided with a long groove 52, one end of the long groove 52 penetrates through the first edge of the heat conductor layer 5, the other end of the long groove 52 penetrates through the avoidance hole 51, two sides of the long groove 52 are respectively provided with a connection point, and the two connection points are respectively connected with two interfaces of the matching circuit module 6. Therefore, the avoiding hole 51 can be used as a part of the NFC antenna coil, so that the magnetic flux near the camera is larger, the camera can be used as the central position when a card is swiped when the NFC function is used, the reference is convenient, and the identification speed and the identification precision are improved.
As shown in fig. 6, the NFC antenna coil formed after the heat conductor layer 5 is grooved may also be a closed antenna coil, and the closed antenna coil forms a closed loop current path inside the heat conductor layer 5. The arrows in fig. 6 show a possible flow path of the induced current, which requires adjusting the operating frequency of the NFC antenna coil by adjusting the structure of the closed antenna coil without connecting the matching circuit module 6, so that the manufacturing process can be simplified, and the non-connection between the heat conductor layer 5 and the main board 2 does not affect the opening of the non-metal rear case 1.
In the above embodiment, the avoidance hole 51 may also be used as a part of the NFC antenna coil, specifically, as shown in fig. 6, the heat conductor layer 5 is provided with an avoidance hole 51 for avoiding the camera, the heat conductor layer 5 is provided with a first long groove 53 and a second long groove 54 which are perpendicular to each other, the first long groove 53 is disposed near the first edge 55 of the heat conductor layer 5 and is parallel to the first edge 55 of the heat conductor layer 5, one end of the second long groove 54 is through the first long groove 53, and the other end is through the avoidance hole 51. Therefore, the avoiding hole 51 can be used as a part of the NFC antenna coil, so that the magnetic flux near the camera is larger, the camera can be used as the central position when a card is swiped when the NFC function is used, the reference is convenient, and the identification speed and the identification precision are improved. In addition, the structure can adjust the working frequency of the NFC antenna coil by changing the length and width of the first long groove 53, and the purpose of adjusting the working frequency is achieved by changing the structure as little as possible, thereby preventing excessive waste.
In order not to increase the thickness of the whole machine, the coupling coil layer 4 can be below the upper surface of the battery 3 or flush with the upper surface of the battery 3 when being arranged, and when the surface of the coupling coil layer 4 close to the heat conductor layer 5 is flush with the surface of the battery 3 close to the heat conductor layer 5, the coupling coil layer 4 can be far away from the main board 2 as far as possible on the premise of not exceeding the thickness range of the battery 3, so that the influence on the heat dissipation of the main board 2 is avoided.
In the scheme shown in fig. 4, for example, a flexible circuit board 41 may be disposed on the support 7 on the motherboard 2, and a coupling coil 42 is formed inside the flexible circuit board 41, or the coupling coil may be directly formed on the plastic portion of the support 7 by an LDS (laser direct Structuring) process or a spraying process, and the scheme of the flexible circuit board is low in cost and easy to implement.
In order to ensure good heat dissipation of the elements with higher heat on the motherboard 2, the projection of the grooved area of the heat conductor layer 5 on the motherboard 2 is staggered with the elements needing heat dissipation on the motherboard 2, that is, the elements needing heat dissipation on the motherboard 2 can be avoided as much as possible during grooving, so that the heat conductor can be ensured to conduct heat in the rear shell area corresponding to the elements needing heat dissipation, and the local heat in the area is prevented from being too high. Similarly, in order to prevent the coupling coil layer 4 from affecting the heat dissipation of the components requiring heat dissipation on the motherboard 2, the projection range of the coupling coil layer 4 on the motherboard 2 may be shifted from the components requiring heat dissipation on the motherboard 2, so that the components have a sufficient heat dissipation space. Therefore, the good heat dissipation of the elements needing heat dissipation on the mainboard 2 can be ensured. The components to be cooled on the motherboard 2 may be components with higher heat on the motherboard 2 or components with cooling requirements, such as a CPU.
The gap between the heat conductor layer 5 and the coupling coil layer 4 is an important parameter affecting the coupling effect, and when the gap between the heat conductor layer 5 and the coupling coil layer 4 is 0.2 mm to 0.3 mm. The coupling effect between the heat conductor layer 5 and the coupling coil layer 4 can be made better.
In order to prevent the eddy currents on the surface of the main board 2 from influencing the magnetic field of the antenna, a ferrite layer may be provided on the surface of the coupling coil layer 4 facing the main board 2. The ferrite layer can prevent eddy current generated on the surface of the inner conductor of the main board 2 from weakening the magnetic field of the coupling coil layer 4, thereby increasing the magnetic flux and improving the coupling effect between the heat conductor layer 5 and the coupling coil layer 4.
In the second embodiment, the first embodiment of the method,
the embodiment of the present application provides another structural design scheme of a mobile phone, as shown in fig. 7. The mobile phone 100 of the embodiment of the application includes a non-metal rear case 1 (not shown in the figure) and a main board 2, wherein a heat conductor layer 5 is arranged on the inner surface of the non-metal rear case 1, and the heat conductor layer 5 is grooved to form an NFC antenna coil; mainboard 2 is relative with heat conductor layer 5, is equipped with the feed point on the mainboard 2, and NFC antenna coil is connected with the feed point on the mainboard 2.
The cell-phone that this application embodiment provided, directly be connected heat conductor layer 5 with the feed point on mainboard 2, utilize heat conductor layer 5 as the radiating element of NFC antenna, the demand of NFC antenna to the discernment scope can be satisfied to the area on heat conductor layer 5 to do not increase other devices, complete machine thickness does not change, thereby has avoided the thickness space that the NFC antenna took the complete machine.
In order to prevent the influence of eddy currents on the surface of the main board 2 on the magnetic field of the antenna, a ferrite layer may be provided on the surface of the heat conductor layer 5 facing the main board 2. The ferrite layer can prevent eddy currents generated on the surface of the inner conductor of the main board 2 from weakening the magnetic field of the heat conductor layer 5, thereby increasing the magnetic flux and improving the performance of the NFC antenna.
In the third embodiment, the first step is that,
as shown in fig. 2, 3, and 5, an embodiment of the present application further provides a mobile phone 100, which includes a non-metal rear case 1, a main board 2, a battery 3, an FPC, and a matching circuit module 6, wherein a heat conductor layer 5 is disposed on an inner surface of the non-metal rear case 1, and a slot is formed in the heat conductor layer 5 to form an NFC antenna coil; the mainboard 2 and the heat conductor layer 5 are arranged along the thickness direction of the mobile phone, and the mainboard 2 is provided with a feed point; the battery 3 and the mainboard 2 are arranged along the length direction of the mobile phone; an antenna coil is formed in the FPC, the FPC is arranged between the main board 2 and the heat conductor layer 5, the FPC and the battery 3 are arranged along the length direction of the mobile phone, the antenna coil in the FPC is connected with a feed point on the main board 2, and space coupling can be formed between the antenna coil in the FPC and the heat conductor layer 5, so that the NFC antenna coil of the heat conductor layer 5 generates secondary radiation; the matching circuit module 6 is arranged on the inner surface of the non-metal rear shell 1, the NFC antenna coil is an open antenna coil, and the matching circuit module 6 is connected with the NFC antenna coil to form a closed annular current path.
The cell-phone that the embodiment of the application provided, fluting heat conductor layer 5 has formed NFC antenna coil, and can form space coupling between antenna coil in the FPC and the heat conductor layer 5, make heat conductor layer 5 produce the secondary radiation, therefore, utilized heat conductor layer 5 as the final radiating element of NFC antenna, the demand of NFC antenna to the identification range can be satisfied to the area of heat conductor layer 5, and antenna coil in the FPC only is used for coupling heat conductor layer 5, consequently, FPC's area can be done for a short time, make the FPC correspond the position setting of mainboard 2 and arrange with the length direction of 3 cell-phones of battery, thereby do not occupy the thickness space of cell-phone, make the cell-phone more frivolous.
In the fourth embodiment, the first step is that,
as shown in fig. 8, an antenna assembly is further provided in the embodiments of the present application, and includes a non-metal rear shell 1 (not shown in the figure) and a coupling coil layer 4, where a heat conductor layer 5 is disposed on an inner surface of the non-metal rear shell 1, the heat conductor layer 5 is grooved to form an NFC antenna coil, the coupling coil layer 4 and the heat conductor layer 5 are disposed in parallel and at an interval, and a spatial coupling can be formed between the coupling coil layer 4 and the heat conductor layer 5, so that the heat conductor layer 5 generates secondary radiation.
The antenna module that this application embodiment provided, slotted NFC antenna coil has been formed with heat conductor layer 5, and can form space coupling between coupling coil layer 4 and the heat conductor layer 5, make heat conductor layer 5 produce the secondary radiation, therefore, utilized heat conductor layer 5 as the final radiating element of NFC antenna, the demand of NFC antenna to the identification range can be satisfied to the area of heat conductor layer 5, and coupling coil layer 4 only is used for coupling heat conductor layer 5, consequently, the area of coupling coil layer 4 can be done for a short time, make coupling coil layer 4 not occupy the thickness space.
In the description herein, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (22)
1. A terminal, comprising:
the inner surface of the non-metal rear shell is provided with a heat conductor layer, and the heat conductor layer is grooved to form an NFC antenna coil; the heat conductor layer is double-layer graphite, graphite plus copper foil or graphene;
the mainboard is opposite to the heat conductor layer, and a feeding point is arranged on the mainboard;
a battery arranged with the motherboard in a direction parallel to the thermal conductor layer;
the coupling coil layer is arranged between the mainboard and the heat conductor layer and is arranged with the battery along the direction parallel to the heat conductor layer, the coupling coil layer is connected with a feeding point on the mainboard, and space coupling can be formed between the coupling coil layer and the heat conductor layer so that the heat conductor layer generates secondary radiation;
the surface of the coupling coil layer near the heat conductor layer is flush with the surface of the battery near the heat conductor layer.
2. The terminal of claim 1, wherein the heat conducting layer is connected with a matching circuit module, the NFC antenna coil is an open antenna coil, and the matching circuit module and the NFC antenna coil are connected to form a closed loop current path.
3. A terminal according to claim 2, wherein the matching circuit module is disposed on the motherboard.
4. A terminal according to claim 2, wherein the matching circuit module is disposed on an inner surface of the non-metallic rear housing.
5. A terminal according to any one of claims 2 to 4, wherein an avoidance hole for avoiding a camera is formed in the heat conductor layer, a long groove is formed in the heat conductor layer, one end of the long groove penetrates through the first edge of the heat conductor layer, the other end of the long groove penetrates through the avoidance hole, two sides of the long groove are respectively provided with a connection point, and the two connection points are respectively connected with two interfaces of the matching circuit module.
6. The terminal of claim 1, wherein the NFC antenna coil is a closed antenna coil, and wherein the closed antenna coil forms a closed loop current path inside the heat conductor layer.
7. A terminal according to claim 6, wherein the heat conductor layer is provided with an avoidance hole for avoiding a camera, the heat conductor layer is provided with a first elongated slot and a second elongated slot which are perpendicular to each other, the first elongated slot is arranged near the first edge of the heat conductor layer and is parallel to the first edge of the heat conductor layer, one end of the second elongated slot is communicated with the first elongated slot, and the other end of the second elongated slot is communicated with the avoidance hole.
8. A terminal as claimed in any of claims 1-4, 6-7, wherein the coupling coil layer comprises an FPC and a coupling coil formed inside the FPC.
9. A terminal according to any one of claims 1 to 4 and 6 to 7, wherein the projection of the slotted region of the heat conductor layer on the main board is staggered with respect to the components to be cooled on the main board, and the projection of the coupling coil layer on the main board is staggered with respect to the components to be cooled on the main board.
10. A terminal according to any of claims 1 to 4 and 6 to 7, wherein the area of the heat conductor layer is adapted to the area of the inner surface of the non-metallic back shell.
11. A termination according to any one of claims 1 to 4, 6 to 7, characterised in that the gap between the heat conductor layer and the coupling coil layer is between 0.2 mm and 0.3 mm.
12. A terminal according to any of claims 1 to 4 and 6 to 7, wherein a ferrite layer is provided on the surface of the coupling coil layer facing the main board.
13. A terminal as claimed in claim 5, wherein the coupling coil layer comprises an FPC and a coupling coil formed inside the FPC.
14. A terminal according to claim 5, wherein the projection of the slotted region of the heat conductor layer on the main board is offset from the component requiring heat dissipation on the main board, and the projection of the coupling coil layer on the main board is offset from the component requiring heat dissipation on the main board.
15. A terminal according to claim 5, characterized in that the area of the heat conductor layer is adapted to the area of the inner surface of the non-metallic back shell.
16. A termination according to claim 5, wherein the gap between the heat conductor layer and the coupling coil layer is between 0.2 mm and 0.3 mm.
17. A terminal as claimed in claim 5, characterised in that a ferrite layer is provided on the surface of the coupling coil layer facing the main board.
18. A cellular phone, comprising:
the inner surface of the non-metal rear shell is provided with a heat conductor layer, and the heat conductor layer is grooved to form an NFC antenna coil; the heat conductor layer is double-layer graphite, graphite plus copper foil or graphene;
the mainboard and the heat conductor layer are arranged along the thickness direction of the mobile phone, and a feed point is arranged on the mainboard;
the battery and the mainboard are arranged along the length direction of the mobile phone;
the antenna coil in the FPC is connected with a feed point on the mainboard, and spatial coupling can be formed between the antenna coil in the FPC and the heat conductor layer, so that the NFC antenna coil of the heat conductor layer generates secondary radiation;
the surface of the FPC close to the heat conductor layer is flush with the surface of the battery close to the heat conductor layer;
the matching circuit module is arranged on the inner surface of the non-metal rear shell, the NFC antenna coil is an open antenna coil, and the matching circuit module and the NFC antenna coil are connected to form a closed annular current path.
19. An antenna assembly, comprising:
the inner surface of the non-metal rear shell is provided with a heat conductor layer, and the heat conductor layer is grooved to form an NFC antenna coil; the heat conductor layer is double-layer graphite, graphite plus copper foil or graphene;
the coupling coil layer is parallel to the heat conductor layer and is arranged at intervals, and space coupling can be formed between the coupling coil layer and the heat conductor layer, so that the heat conductor layer generates secondary radiation;
the surface of the coupling coil layer close to the heat conductor layer is flush with the surface of the battery close to the heat conductor layer.
20. The antenna assembly of claim 19, wherein the heat conducting layer has a matching circuit module attached thereto, wherein the NFC antenna coil is an open antenna coil, and wherein the matching circuit module is attached to the NFC antenna coil to form a closed loop current path.
21. The antenna assembly of claim 20, wherein the matching circuit module is disposed on an inner surface of the non-metallic rear housing.
22. The antenna assembly of claim 19, wherein the NFC antenna coil is an enclosed antenna coil that forms an enclosed loop current path inside the thermal conductor layer.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2017/096447 WO2019028678A1 (en) | 2017-08-08 | 2017-08-08 | Antenna assembly and terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110168807A CN110168807A (en) | 2019-08-23 |
| CN110168807B true CN110168807B (en) | 2020-11-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201780082202.7A Active CN110168807B (en) | 2017-08-08 | 2017-08-08 | Antenna assembly and terminal |
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| CN (1) | CN110168807B (en) |
| WO (1) | WO2019028678A1 (en) |
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|---|---|---|---|---|
| CN112566440A (en) * | 2019-09-25 | 2021-03-26 | 中兴通讯股份有限公司 | Electronic component and terminal equipment |
| WO2021096310A1 (en) * | 2019-11-14 | 2021-05-20 | Samsung Electronics Co., Ltd. | Electronic device including antenna |
| CN111987453B (en) * | 2020-09-17 | 2021-05-25 | 广州郝舜科技有限公司 | Near field communication antenna device |
| CN112909475B (en) * | 2021-01-15 | 2023-12-12 | Oppo广东移动通信有限公司 | Antenna assembly and electronic equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| FI112982B (en) * | 1999-08-25 | 2004-02-13 | Filtronic Lk Oy | Level Antenna Structure |
| CN102074788A (en) * | 2010-11-23 | 2011-05-25 | 惠州Tcl移动通信有限公司 | NFC (Near Field Communication) antenna and mobile phone using same |
| CN103219579B (en) * | 2013-04-11 | 2015-05-06 | 上海安费诺永亿通讯电子有限公司 | Novel near field communication (NFC) antenna structure |
| US20150009077A1 (en) * | 2013-07-03 | 2015-01-08 | Samsung Electronics Co., Ltd. | Cover of a mobile device and mobile device including the same |
| JP2016201580A (en) * | 2013-10-01 | 2016-12-01 | 古河電気工業株式会社 | Mobile electronic device case |
| US10381875B2 (en) * | 2014-07-07 | 2019-08-13 | Qualcomm Incorporated | Wireless power transfer through a metal object |
| KR20160046187A (en) * | 2014-10-20 | 2016-04-28 | 삼성전자주식회사 | Antenna Structure and Electronic Device with the same |
| CN104466346B (en) * | 2014-12-05 | 2019-02-05 | Oppo广东移动通信有限公司 | Mobile terminal |
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- 2017-08-08 CN CN201780082202.7A patent/CN110168807B/en active Active
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| CN110168807A (en) | 2019-08-23 |
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