CN110164802A - A kind of triode packaging system based on embedded Control - Google Patents
A kind of triode packaging system based on embedded Control Download PDFInfo
- Publication number
- CN110164802A CN110164802A CN201910541669.4A CN201910541669A CN110164802A CN 110164802 A CN110164802 A CN 110164802A CN 201910541669 A CN201910541669 A CN 201910541669A CN 110164802 A CN110164802 A CN 110164802A
- Authority
- CN
- China
- Prior art keywords
- pipe
- solenoid valve
- sealing machine
- triode
- embedded controller
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 17
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 65
- 238000007789 sealing Methods 0.000 claims abstract description 35
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 33
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 10
- 238000005265 energy consumption Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000005538 encapsulation Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000007789 gas Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- -1 metals ion Chemical class 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 235000013290 Sagittaria latifolia Nutrition 0.000 description 1
- FKNQFGJONOIPTF-UHFFFAOYSA-N Sodium cation Chemical compound [Na+] FKNQFGJONOIPTF-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 235000015246 common arrowhead Nutrition 0.000 description 1
- 239000000306 component Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011897 real-time detection Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910001415 sodium ion Inorganic materials 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacture Of Switches (AREA)
Abstract
The invention discloses a kind of triode packaging system based on embedded Control, including embedded controller, sealing machine, nitrogen cylinder, the first solenoid valve, second solenoid valve, first pipe, second pipe, vacuum pump, vacuumize mold；Mold is vacuumized to be placed in sealing machine, nitrogen cylinder is connect by first pipe with sealing machine, first pipe is equipped with second solenoid valve, one end of second pipe is controlled to a vacuum pump, the other end and first pipe of second pipe connect and connector is between second solenoid valve and sealing machine, second pipe is equipped with the first solenoid valve, and the embedded controller is connect with the first solenoid valve, second solenoid valve, vacuum pump respectively.The present invention can make inside triode when packaged full of a kind of high-purity inert gas-nitrogen, have the advantages that small in size, low in energy consumption, manipulation is convenient, cost can be saved, labor intensity is reduced, improves working efficiency, and has reached the requirement of military project, Aeronautics and Astronautics rank.
Description
Technical field
The present invention relates to a kind of triode packaging system based on embedded Control.
Background technique
Triode is commonly referred to as transistor, and effect is small-signal to be zoomed into the biggish telecommunications of range value
Number, it is also possible to make oncontacting electric switch, is the core component of electronic circuit.The base current of transistor is to collector electricity
Stream has control action, so being a kind of current control device.
There are two types of forms for triode on the market at present, and one is NPN types, and one is positive-negative-positives.Pass through certain manufacture work
Two PN junctions are combined by skill, and triode is made to have amplification.Although their shapes are different, various in style, they
Common trait is identical: being all three subregions, two PN junctions and three electrodes (base stage, collector, emitter) drawn outward；And
And the purposes that different model is had nothing in common with each other, triode are mostly Plastic Package or Metal Packaging, wherein Metal Packaging is commonly used in
On military product.The appearance of common triode, the electrode of arrow are emitters, arrow outwardly be NPN type triode, and arrow
Head inwardly be positive-negative-positive, the direction of practical upward arrow meaning is exactly sense of current.Three poles of the last century 80's manufacture
Pipe, since packaging technology is immature, the cavity of triode contains air, and in air includes electrically conductive steam, micro-
Grain, impurity etc., it is possible to cause mutually to be conducted between collector, base stage and emitter, or influence the service life of triode, stabilization
Property；It can be used only in some low sides or equipment of less demanding.Unstable factor in application process can make aerospace equipment
Forced landing, guided missile mistakenly launch, burn the major accidents such as circuit board.
The triode encapsulation raw material of Metal Packaging are wafer, that is, usually said silicon wafer, on silicon may be used
With the various circuit component structures of processing and fabricating, the material as circuit link is usually copper, carried out sometimes above it is silver-plated,
The materials such as Ni, Pd, Au.But these materials are oxidizable, unstable when humidity is less than 40%RH, welding gold thread uses 99.99%
It is high-purity gold-plated, consider cost it is currently used be copper wire or aluminum steel technique.The requirement of semiconductor fabrication environment is that prevention is main
Pollution sources: the light metals ion such as dust particale, heavy metal ion, organic substance residues, sodium ion.Production environment requires to be super
The clean room production of 10000 grades of (lustration class mainly has dust particale number/m3) or more between net.Presently, there are the problem of be,
Between ultra-clean, since oxygen-containing tolerance of the moisture content in atmosphere centainly and in atmosphere is fixed as 21% or so, and oxygen is
A kind of active gases is extremely easy to occur oxidation reaction with other materials, and military project, boat are extremely difficult to encapsulating between ultra-clean
Empty, space flight rank requirement.
Summary of the invention
In order to solve the above-mentioned technical problem, the triode envelope the present invention relates to a kind of structure simply based on embedded Control
Assembling device.
Technical proposal that the invention solves the above-mentioned problems is: including embedded controller, sealing machine, nitrogen cylinder, first
Solenoid valve, first pipe, second pipe, vacuum pump, vacuumizes mold at second solenoid valve；The mold that vacuumizes is placed on envelope
In installation, nitrogen cylinder is connect by first pipe with sealing machine, and first pipe is equipped with second solenoid valve, the second pipe
One end be controlled to a vacuum pump, the other end of second pipe is connect with first pipe and connector be located at second solenoid valve and encapsulation
Between machine, second pipe be equipped with the first solenoid valve, the embedded controller respectively with the first solenoid valve, second solenoid valve,
Vacuum pump connection.
The above-mentioned triode packaging system based on embedded Control is set at nitrogen cylinder position in the first pipe
There is the first digital vacuum meter, close vacuumize is equipped with the second digital vacuum meter in first pipe at die location, and the first number is true
Empty table, the second digital vacuum meter are connect with embedded controller.
The above-mentioned triode packaging system based on embedded Control, the sealing machine include sealing cap and the pedestal with pin,
Sealing cap is welded together with the pedestal with pin.
The above-mentioned triode packaging system based on embedded Control, the outer dimension for vacuumizing mold and sealing machine bottom
Seat size matches.
The above-mentioned triode packaging system based on embedded Control, the embedded controller are supplied using 12V DC power supply
Electricity is equipped with phaselocked loop in power supply circuit.
The beneficial effects of the present invention are:
1, the present invention is equipped with embedded controller, nitrogen cylinder, digital vacuum meter, the first solenoid valve, second solenoid valve, vacuum
Pump, embedded controller, which receives, to be controlled the first solenoid valve after the signal of the second digital vacuum meter and opens vacuum pump work simultaneously,
When vacuumize reach preset value when the second digital vacuum meter send a signal to embedded controller, embedded controller receives letter
It closes the first solenoid valve and vacuum pump after number, opens second solenoid valve, the nitrogen in nitrogen cylinder enters triode, when reaching the
It repeats the above steps after the preset value of two digital vacuum meters, thus adjusts gas in triode cavity, make internal full of one kind
High-purity inert gas-nitrogen has the advantages that small in size, low in energy consumption, manipulation is convenient, can save into realize encapsulation
Originally, reduce labor intensity, improve working efficiency, and reach the requirement of military project, Aeronautics and Astronautics rank.
2, embedded controller of the invention uses 12V DC power supply power supply, is equipped with phaselocked loop in power supply circuit, presses out
System starts and latches behind pass.
3, sealing machine of the invention includes sealing cap and the pedestal with pin, by heavy current sealing cap and with the pedestal of pin
It is welded together, so that sealing cap has good leakproofness not fall off securely with pedestal, entire encapsulation process is in a closed ring
It is carried out in border.
4, the outer dimension for vacuumizing mold of the invention and sealing machine base dimensions match；Purpose be confined space with
Shorten the time vacuumized with inflated with nitrogen, will not misplace when placing triode, substantially increase the efficiency of operator, it should
The seal of mold is lined with rubber cushion rubber, to improve the sealing performance for vacuumizing mold.
Detailed description of the invention
Fig. 1 is the structural diagram of the present invention.
Specific embodiment
The present invention is further illustrated with reference to the accompanying drawings and examples.
As shown in Figure 1, a kind of triode packaging system based on embedded Control, including embedded controller 1, sealing machine
2, nitrogen cylinder 3, the first solenoid valve 5, second solenoid valve 6, first pipe 7, second pipe 8, vacuum pump 9, vacuumize mold 10；
Embedded controller 1 uses single chip computer AT M89C52, and the mold 10 that vacuumizes is placed in sealing machine 2, and nitrogen cylinder 3 passes through
First pipe 7 is connect with sealing machine 2, and first pipe 7 is equipped with second solenoid valve 6, one end of the second pipe 8 and vacuum pump
9 connections, the other end and first pipe 7 of second pipe 8 connect and connector is between second solenoid valve 6 and sealing machine 2, the
Two pipelines 8 are equipped with the first solenoid valve 5, and 36 pins of the embedded controller 1 are connect with second solenoid valve 6, embedded control
37 pins of device 1 processed are connect with the first solenoid valve 5, and 38 pins of embedded controller 1 are connect with vacuum pump 9.
The first digital vacuum meter 41 is equipped in the first pipe 7 at 3 position of nitrogen cylinder, is leaned in first pipe 7
It closely vacuumizes and is equipped with the second digital vacuum meter 42 at 10 position of mold, the first digital vacuum meter 41 and the 34 of embedded controller 1
Pin connection, the second digital vacuum meter 42 are connect with 35 pins of embedded controller 1, wherein the first digital vacuum meter 41 is used for
Measure pressure values.
The sealing machine 2 includes sealing cap and the pedestal with pin, by heavy current sealing cap and the pedestal melting welding with pin
Together.So that sealing cap has good leakproofness not fall off securely with pedestal, entire encapsulation process is in a closed environment
It carries out.
The outer dimension for vacuumizing mold 10 matches with 2 base dimensions of sealing machine, it is therefore an objective to which confined space is to contract
The short time vacuumized with inflated with nitrogen will not misplace when placing triode, substantially increase the efficiency of operator, the mould
The seal of tool is lined with rubber cushion rubber, to improve the sealing performance for vacuumizing mold 10.
The embedded controller 1 uses 12V DC power supply power supply, phaselocked loop is equipped in power supply circuit, after lower switch
System starts and latches.
The course of work of the invention is as follows:
(1) it first has to power to embedded controller 1, connects all external equipments, embedded controller 1 after closure switch
It brings into operation, 6 original state of second solenoid valve is closed, and vacuum pump 9 brings into operation while opening the first solenoid valve 5, vacuum pump 9
Start to vacuumize, the air vacuumized in mold 10 is extracted out, the pressure in the second 42 real-time detection second pipe 8 of digital vacuum meter
Intensity values, if reaching -0.08MPa, the second digital vacuum meter 42 sends a signal to embedded controller 1, and embedded controller 1 connects
It receives and is closed the first solenoid valve 5 after signal and simultaneously closes off vacuum pump 9, open second solenoid valve 6.At this time due to second solenoid valve 6
Side is the High Purity Nitrogen of High Voltage, and the other side is in low pressure vacuum state.Due to pressure difference, nitrogen is filled with automatically and vacuumizes
In mold 10.
(2) it is connected due to second solenoid valve 6 with nitrogen cylinder 3, vacuumizes mold from trend under the action of pressure difference
Nitrogen is filled in 10 and because the mould inside space very little vacuumize it is very of short duration with the time of inflated with nitrogen, it is true to ensure to take out
It has been filled with nitrogen inside empty mold 10, has been mounted with the second digital vacuum meter 42 in the inlet for vacuumizing mold 10, it can be seen that
Situation of change when mould inside pumping inflation, sends signal, embedded Control after the pressure value 0.08MPa for reaching setting
Device 1 receives the signal of transmission, starts to act and closes second solenoid valve 6 in time.Vacuumizing at this time fills in mold 10
The mixed gas of nitrogen and air.
(3) in order to reduce the air content for vacuumizing 10 the inside of mold, nitrogen gas concn is improved, above-mentioned (1) step behaviour is repeated
Make, i.e., the second digital vacuum meter 42 shows that embedded controller 1 is touched when 0.08MPa to be started to signal to vacuum pump 9 and first
Solenoid valve 5, when vacuum pump 9 and the first solenoid valve 5 receive 1 signal of embedded controller, the first solenoid valve 5 is opened, vacuum pump 9
The mixed gas for starting to take out nitrogen and air is sent a signal to when the second digital vacuum meter 42 reaches setting value -0.08MPa
Embedded controller 1 controls the first solenoid valve 5 of closing by embedded controller 1 and simultaneously closes off vacuum pump 9, opens second at this time
Solenoid valve 6, nitrogen are filled under the action of pressure difference vacuumize in mold 10 again, when the second digital vacuum meter 42 shows number
When value reaches the 0.08MPa set, the second digital vacuum meter 42 sends a signal to embedded controller 1, embedded Control
Device 1 starts movement according to the signal received and closes second solenoid valve 6, vacuumize at this time had been filled in mold 10 it is highly concentrated
The inert gas (nitrogen) of degree.It compared to nitrogen is filled with for the first time, is operated on the basis of being built upon first for the second time, so this moment
Vacuumize the concentration that the nitrogen gas concn in mold 10 is higher than first time inflated with nitrogen.
(4) in view of above 2 step, a vacuum pumping is repeated on the basis of step 3 operation.Purpose is to allow production
Moral character can reach the requirement of special occasions.Startup power supply is switched and is powered to embedded controller 1, and embedded controller 1 is allowed to transport
Row, 6 original state of second solenoid valve are to close, and opening the first solenoid valve 5, vacuum pump 9 brings into operation simultaneously, and vacuum pump 9 starts to take out
Vacuum extracts the air vacuumized in mold 10 out, when reaching the second number 42 preset value -0.08MPa of vacuum meter, the second number
Word vacuum meter 42 sends a signal to embedded controller 1, controls the first solenoid valve 5 of closure by embedded controller 1 and closes simultaneously
Vacuum pump 9 is closed, second solenoid valve 6 is opened.Nitrogen is vacuumized since pressure difference automatically flows into mold 10, when the second digital vacuum
When table 42 reaches preset value 0.08MPa, the second 42 trigger signal of digital vacuum meter after embedded controller 1 receives signal, is closed
Close second solenoid valve 6.At this time vacuumize be in mold 10 high purity concentrations nitrogen.By repeating to vacuumize above three times
Inflated with nitrogen operation, so that the intracorporal air of triode chamber, steam, oxygen, micronic dust etc. may influence triode stability factor drop
To minimum.Triode metal cap is melted using triode cap sealing machine with the metab forceful electric power with electrode pin finally and is soldered to
Together.
Claims (5)
1. a kind of triode packaging system based on embedded Control, it is characterised in that: including embedded controller, sealing machine,
Nitrogen cylinder, second solenoid valve, first pipe, second pipe, vacuum pump, vacuumizes mold at the first solenoid valve；It is described to vacuumize
Mold is placed in sealing machine, and nitrogen cylinder is connect by first pipe with sealing machine, and first pipe is equipped with second solenoid valve,
One end of the second pipe is controlled to a vacuum pump, and the other end of second pipe is connect with first pipe and connector is located at second
Between solenoid valve and sealing machine, second pipe be equipped with the first solenoid valve, the embedded controller respectively with the first solenoid valve,
Second solenoid valve, vacuum pump connection.
2. the triode packaging system according to claim 1 based on embedded Control, it is characterised in that: first pipe
It is equipped with the first digital vacuum meter on road at the nitrogen cylinder position, is equipped with the at die location close to vacuumizing in first pipe
Two digital vacuum meters, the first digital vacuum meter, the second digital vacuum meter are connect with embedded controller.
3. the triode packaging system according to claim 1 based on embedded Control, it is characterised in that: the sealing machine
Including sealing cap and with the pedestal of pin, sealing cap is welded together with the pedestal with pin.
4. the triode packaging system according to claim 1 based on embedded Control, it is characterised in that: described to vacuumize
The outer dimension of mold matches with sealing machine base dimensions.
5. the triode packaging system according to claim 1 based on embedded Control, it is characterised in that: described embedded
Controller uses 12V DC power supply power supply, is equipped with phaselocked loop in power supply circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910541669.4A CN110164802A (en) | 2019-06-21 | 2019-06-21 | A kind of triode packaging system based on embedded Control |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910541669.4A CN110164802A (en) | 2019-06-21 | 2019-06-21 | A kind of triode packaging system based on embedded Control |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110164802A true CN110164802A (en) | 2019-08-23 |
Family
ID=67626467
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910541669.4A Pending CN110164802A (en) | 2019-06-21 | 2019-06-21 | A kind of triode packaging system based on embedded Control |
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| Country | Link |
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| CN (1) | CN110164802A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101567517A (en) * | 2009-06-02 | 2009-10-28 | 江苏飞格光电有限公司 | Method for improving optical power stability of semiconductor laser |
| CN203063074U (en) * | 2012-11-06 | 2013-07-17 | 科一工程有限公司 | Vacuuming device connected with die |
| JP2013226679A (en) * | 2012-04-25 | 2013-11-07 | Kaken Geneqs:Kk | Mold vacuum method and vacuum device |
| CN107037776A (en) * | 2017-06-01 | 2017-08-11 | 广东瑞谷光网通信股份有限公司 | Cap sealing machine is vacuumized and nitrogen charging device |
| CN208637504U (en) * | 2018-07-27 | 2019-03-22 | 南通新宙邦电子材料有限公司 | A kind of pail pack automatic vacuum displacement apparatus |
| CN209747481U (en) * | 2019-06-21 | 2019-12-06 | 湘潭市锦程半导体科技有限公司 | Triode packaging hardware based on embedded control |
-
2019
- 2019-06-21 CN CN201910541669.4A patent/CN110164802A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101567517A (en) * | 2009-06-02 | 2009-10-28 | 江苏飞格光电有限公司 | Method for improving optical power stability of semiconductor laser |
| JP2013226679A (en) * | 2012-04-25 | 2013-11-07 | Kaken Geneqs:Kk | Mold vacuum method and vacuum device |
| CN203063074U (en) * | 2012-11-06 | 2013-07-17 | 科一工程有限公司 | Vacuuming device connected with die |
| CN107037776A (en) * | 2017-06-01 | 2017-08-11 | 广东瑞谷光网通信股份有限公司 | Cap sealing machine is vacuumized and nitrogen charging device |
| CN208637504U (en) * | 2018-07-27 | 2019-03-22 | 南通新宙邦电子材料有限公司 | A kind of pail pack automatic vacuum displacement apparatus |
| CN209747481U (en) * | 2019-06-21 | 2019-12-06 | 湘潭市锦程半导体科技有限公司 | Triode packaging hardware based on embedded control |
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