CN110160383B - Chip heat exchanger and variable frequency air conditioner - Google Patents

Chip heat exchanger and variable frequency air conditioner Download PDF

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Publication number
CN110160383B
CN110160383B CN201910027097.8A CN201910027097A CN110160383B CN 110160383 B CN110160383 B CN 110160383B CN 201910027097 A CN201910027097 A CN 201910027097A CN 110160383 B CN110160383 B CN 110160383B
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China
Prior art keywords
chip
section
air conditioner
condensation
heat exchanger
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CN201910027097.8A
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CN110160383A (en
Inventor
董旭
王飞
王定远
徐佳
罗荣邦
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Qingdao Haier Air Conditioner Gen Corp Ltd
Haier Smart Home Co Ltd
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Qingdao Haier Air Conditioner Gen Corp Ltd
Qingdao Haier Co Ltd
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Priority to CN201910027097.8A priority Critical patent/CN110160383B/en
Publication of CN110160383A publication Critical patent/CN110160383A/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F1/00—Room units for air-conditioning, e.g. separate or self-contained units or units receiving primary air from a central station
    • F24F1/06—Separate outdoor units, e.g. outdoor unit to be linked to a separate room comprising a compressor and a heat exchanger
    • F24F1/20—Electric components for separate outdoor units
    • F24F1/24—Cooling of electric components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B41/00—Fluid-circulation arrangements
    • F25B41/30—Expansion means; Dispositions thereof
    • F25B41/37—Capillary tubes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
    • Y02B30/70—Efficient control or regulation technologies, e.g. for control of refrigerant flow, motor or heating

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Thermal Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Human Computer Interaction (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention discloses a chip heat exchanger and a variable frequency air conditioner, belonging to the technical field of chip heat dissipation, wherein the chip heat exchanger comprises a heat pipe and a heat pipe; a blown-up plate condenser and a capillary tube; the evaporation section of the heat pipe is arranged below a chip of a computer board of an air conditioner, the condensation section of the heat pipe is connected with the evaporation section through the capillary tube, the condensation section is connected with the inflation plate condenser, and the inflation plate condenser is bent towards the lower portion of the plane where the evaporation section is located. In this scheme, the blowing board condenser is buckled the setting to the plane below at evaporation zone place, with the trend coincidence of air condensing units inner fan support, neither shelters from fan amount of wind and wind speed, can promote the condensation heat dissipation of refrigerant in the blowing board with the help of the amount of wind again, improves heat exchange efficiency, has reduced chip operating temperature, and the chip heat dissipation of solving high temperature environment down-conversion air conditioner computer board in summer leads to the refrigeration to rise frequently slowly, difficultly, and control logic easily reports wrong problem.

Description

Chip heat exchanger and variable frequency air conditioner
Technical Field
The invention relates to the technical field of chip heat dissipation, in particular to a chip heat exchanger and a variable frequency air conditioner.
Background
At present, in a high-temperature environment in summer, the chip of the computer board of the variable-frequency air conditioner has poor heat dissipation, so that the frequency rise of refrigeration is slow and difficult, the control logic is easy to report errors, the refrigerating capacity is insufficient, the running power consumption is large, and the complaint of users is caused. The environment temperature is T3 under the working condition (53 ℃) or higher, the ambient air temperature of the frequency conversion chip is plus 10 ℃ (63 ℃), the difference value between the heat source temperature (68-120 ℃) of the computer board and the environment temperature (5-57 ℃) is reduced, the heat dissipation power is reduced, even the computer board is burnt, the system is down, and hardware faults are caused.
Disclosure of Invention
The embodiment of the invention provides a chip heat exchanger and a variable frequency air conditioner, which at least solve one of the technical problems in the prior art. The following presents a simplified summary in order to provide a basic understanding of some aspects of the disclosed embodiments. This summary is not an extensive overview and is intended to neither identify key/critical elements nor delineate the scope of such embodiments. Its sole purpose is to present some concepts in a simplified form as a prelude to the more detailed description that is presented later.
According to a first aspect of embodiments of the present invention, there is provided a chip heat exchanger;
in some optional embodiments, the chip heat exchanger comprises a heat pipe, and further comprises; a blown-up plate condenser and a capillary tube;
the evaporation section of the heat pipe is arranged below a chip of a computer board of an air conditioner, the condensation section of the heat pipe is connected with the evaporation section through the capillary tube, the condensation section is connected with the inflation plate condenser, and the inflation plate condenser is bent towards the lower portion of the plane where the evaporation section is located.
In some optional embodiments, further, the capillary tube is disposed on the pipeline between the refrigerant entering the evaporation section in the condensation section.
In some optional embodiments, further, a flow passage is arranged on the blown-up plate condenser, and the flow passage is communicated with the condensing section.
In some optional embodiments, further, the flow path channel is composed of a plurality of rectangular channels and is communicated with the condensing section.
In some optional embodiments, further, a hollow structure is arranged at the intersection of each rectangular channel.
In some optional embodiments, further, the flow path channel is composed of a plurality of U-shaped channels, and one end of the U-shaped channel on one side communicates with one end of the condensation section, and one end of the U-shaped channel on the other side communicates with the other end of the condensation section.
In some optional embodiments, further, a hollow structure is arranged at a joint of adjacent U-shaped channels.
In some optional embodiments, further, the evaporation section is disposed along a length direction of the chip.
In some optional embodiments, further, the area of the evaporation section is 5/6 of the area of the chip.
According to a second aspect of the embodiments of the present invention, there is provided an inverter air conditioner;
in some optional embodiments, the inverter air conditioner comprises the chip heat exchanger in any one of the optional embodiments.
The technical scheme provided by the embodiment of the invention has the following beneficial effects:
the evaporation section of the heat pipe is arranged below a chip of an air conditioner computer board, the condensation section of the heat pipe is connected with the evaporation section through the capillary tube, the condensation section is connected with the blowing plate condenser to enable the refrigerant to fully release heat and condense, the condensation section is connected with the evaporation section through the capillary tube section, the circulation power of the refrigerant is promoted to be improved, the heat absorption capacity of the evaporation section is increased, the heat dissipation effect is improved, the liquid refrigerant is converted into gas-liquid two phases due to the throttling effect of the capillary tube section, the gas refrigerant promotes the fluidity, the condensation section of the blowing plate condenser can be arranged at any position relative to the evaporation section, the technical short plate that the condensation section of the existing heat pipe cannot be lower than the evaporation section is improved, the blowing plate condenser is bent towards the lower part of the plane where the evaporation section is located and is overlapped with the trend of a fan support in an air conditioner outdoor unit, and the, the heat pipe does not need to be driven by electricity, self circulation of the refrigerant with poor density can be realized, the running temperature of a chip is reduced, and the problems that the frequency rising of refrigeration is slow and difficult, control logic is easy to report errors, the refrigerating capacity is insufficient, the running power consumption is large, and the complaint of users is caused due to poor heat dissipation of the chip of the down-conversion air conditioner computer board in the high-temperature environment in summer are solved.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention, as claimed.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is a schematic diagram illustrating a chip heat exchanger according to an exemplary embodiment.
Reference numerals:
1-computer board; 2-chip; 3-a capillary tube; 4-a blown-sheet condenser; 5-a heat pipe; 51-an evaporation section; 52-condensation section.
Detailed Description
The following description and the drawings sufficiently illustrate specific embodiments of the invention to enable those skilled in the art to practice them. Other embodiments may incorporate structural, logical, electrical, process, and other changes. The examples merely typify possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in or substituted for those of others. The scope of embodiments of the invention encompasses the full ambit of the claims, as well as all available equivalents of the claims. Embodiments may be referred to herein, individually or collectively, by the term "invention" merely for convenience and without intending to voluntarily limit the scope of this application to any single invention or inventive concept if more than one is in fact disclosed. Herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method or apparatus that comprises the element. The embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. As for the methods, products and the like disclosed by the embodiments, the description is simple because the methods correspond to the method parts disclosed by the embodiments, and the related parts can be referred to the method parts for description.
According to a first aspect of embodiments of the present invention, there is provided a chip heat exchanger;
as shown in fig. 1, in some alternative embodiments, the chip heat exchanger includes a heat pipe 5; a blown plate condenser 4 and a capillary tube 3;
the evaporation section 51 of the heat pipe 5 is arranged below the chip 2 of the computer board 1 of the air conditioner, the condensation section 52 of the heat pipe 5 is connected with the evaporation section 51 through the capillary tube 3, the condensation section 52 is connected with the expansion plate condenser 4, and the expansion plate condenser 4 is bent towards the lower part of the plane where the evaporation section 51 is located.
In this embodiment, the condensation section 52 of the heat pipe 5 is connected with the evaporation section 51 through the capillary tube 3, the condensation section 52 is connected with the blowing plate condenser 4, so that the refrigerant can fully release heat and condense, the condensation section 52 is connected with the evaporation section 51 through the capillary tube 3, thereby promoting the circulation power of the refrigerant to be improved and the heat absorption capacity of the evaporation section 51 to be increased, and improving the heat dissipation effect, because of the throttling effect of the capillary tube 3, the liquid refrigerant is converted into gas-liquid two phases, the gas refrigerant promotes the fluidity, meanwhile, the blowing plate condenser 4 is bent towards the lower part of the plane where the evaporation section 51 is located, and is superposed with the trend of a fan bracket in an air conditioner outdoor unit, thereby not shielding the air volume and the air speed of the fan, but also promoting the condensation and heat dissipation of the refrigerant in the blowing plate by virtue of the air volume, improving the heat exchange efficiency, meanwhile, the heat pipe 5 does not, the problem of poor heat dissipation of chip 2 of the high temperature environment down conversion air conditioner computer board 1 in summer leads to the refrigeration to rise frequently slowly, difficultly, and control logic easily reports wrong, and the refrigerating output is not enough, and the operation power consumption is big, causes the user to complain about.
In some alternative embodiments, further, as shown in fig. 1, the capillary tube 3 is disposed on the pipeline between the refrigerant entering the evaporation section 51 in the condensation section 52.
In this embodiment, the condensation section 52 and the evaporation section 51 are connected by the capillary tube 3, so as to promote the circulation power of the refrigerant to be increased and the heat absorption capacity of the evaporation section 51 to be increased. As the diameter of the section 3 of the capillary tube is very small, the refrigerant in the evaporation section 51 is difficult to enter the section 3 of the capillary tube and can only enter the blowing plate condenser 4 through the connecting tube, the one-way valve is saved, and the one-way flow of the refrigerant in the heat pipe 5 is naturally formed.
In some alternative embodiments, further as shown in fig. 1, the flow path channel is disposed on the expansion plate condenser 4 and is in communication with the condenser section 52.
In this embodiment, the flow channel increases the flowing space of the refrigerant, so that the condensing section 52 can fully radiate heat and condense.
In addition to the above-described embodiment, as shown in fig. 1, the flow path channel is formed of a plurality of rectangular channels and communicates with the condensation section 52.
In this embodiment, the flow channel may be formed by a plurality of rectangular channels, which can further increase the heat dissipation effect of the refrigerant, so as to make it condense more quickly.
On the basis of the above embodiment, further, as shown in fig. 1, a hollow structure is disposed at the intersection of each of the rectangular channels.
In this embodiment, the hollow structure increases the heat release space when the refrigerant flows, so that the heat release and condensation are faster, and the condensation efficiency is improved.
In some optional embodiments, further, the flow path channel is composed of a plurality of U-shaped channels, and one end of the U-shaped channel on one side communicates with one end of the condensation section 52, and one end of the U-shaped channel on the other side communicates with the other end of the condensation section 52.
In this embodiment, the flow channel may also adopt a plurality of U-shaped channels, which can further increase the heat dissipation effect of the refrigerant, so as to make it condense more quickly.
On the basis of the above embodiment, further, a hollow structure is arranged at the joint of the adjacent U-shaped channels.
In this embodiment, the hollow structure increases the heat release space when the refrigerant flows, so that the heat release and condensation are faster, and the condensation efficiency is improved.
In some optional embodiments, further, the evaporation section 51 is disposed along the length direction of the chip 2.
In this embodiment, the evaporation section 51 is disposed along the length direction of the chip 2, so that the contact area between the evaporation section 51 and the chip 2 is increased, and the heat dissipation efficiency of the chip 2 is further improved.
In some alternative embodiments, further, the area of the evaporation section 51 is 5/6 of the area of the chip 2.
In this embodiment, the evaporation section 51 is disposed so as to be close to the area of the chip 2, thereby increasing the heat absorption of the chip 2 during evaporation and improving the heat dissipation effect.
In a specific embodiment, as shown in fig. 1, the evaporation section 51 of the heat pipe 5 is disposed below the chip 2 of the computer board 1 of the air conditioner, the condensation section 52 of the heat pipe 5 is connected to the evaporation section 51 through the capillary 3, the condensation section 52 is connected to the expansion plate condenser 4, the expansion plate condenser 4 is provided with a flow channel, the flow channel is communicated with the condensation section 52, the flow channel is composed of a plurality of rectangular channels and is communicated with the condensation section 52, a hollow structure is disposed at an intersection point of each of the rectangular channels, and the evaporation section 51 is disposed along a length direction of the chip 2. The blowing plate condenser 4 is bent towards the lower part of the plane where the evaporation section 51 is located, the blowing plate condenser 4 is overlapped with the trend of a fan bracket in an air conditioner outdoor unit, the air quantity and the air speed of a fan are not blocked, the condensation and heat dissipation of a refrigerant in the blowing plate can be promoted by means of the air quantity, the heat exchange efficiency is improved, the condensation section 52 is connected with the blowing plate condenser 4, the refrigerant is fully subjected to heat release and condensation, the condensation section 52 is connected with the evaporation section 51 through the capillary tube 3 section, the circulation power of the refrigerant is promoted to be improved, the heat absorption capacity of the evaporation section 51 is increased, the heat dissipation effect is improved, due to the throttling effect of the capillary tube 3 section, the liquid refrigerant is converted into a gas phase and a liquid phase, the gas refrigerant promotes the fluidity, the condensation section 52 of the blowing plate condenser 4 can be arranged at any position relative to the evaporation section 51, the technical short plate that the condensation section 52, the self-circulation of the density difference of the refrigerant can be realized.
According to a second aspect of the embodiments of the present invention, there is provided an inverter air conditioner;
in some optional embodiments, the inverter air conditioner comprises the chip heat exchanger in any one of the optional embodiments.
The inverter air conditioner that the second aspect provided has the chip heat exchanger that the first aspect provided, consequently has the whole beneficial effect of the chip heat exchanger that the first aspect provided, and it is not repeated here.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention. Furthermore, those skilled in the art will appreciate that while some embodiments described herein include some features included in other embodiments, rather than other features, combinations of features of different embodiments are meant to be within the scope of the invention and form different embodiments. For example, in the claims above, any of the claimed embodiments may be used in any combination. The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person skilled in the art.

Claims (5)

1. A chip heat exchanger comprises a heat pipe and is characterized by also comprising a heat pipe; a blown-up plate condenser and a capillary tube;
the evaporation section of the heat pipe is arranged below a chip of a computer board of an air conditioner, the condensation section of the heat pipe is connected with the evaporation section through the capillary tube, the condensation section is connected with the inflation plate condenser, and the inflation plate condenser is bent towards the lower part of the plane where the evaporation section is located;
the blowing plate condenser is provided with a flow path channel which is communicated with the condensing section;
the flow channel consists of a plurality of rectangular channels and is communicated with the condensation section, and a hollow structure is arranged at the intersection point of the rectangular channels; or the flow path channel consists of a plurality of U-shaped channels, one end of the U-shaped channel on one side is communicated with one end of the condensation section, one end of the U-shaped channel on the other side is communicated with the other end of the condensation section, and a hollow structure is arranged at the joint of the adjacent U-shaped channels.
2. The chip heat exchanger according to claim 1,
the capillary tube is arranged on a pipeline between the refrigerant entering the evaporation section in the condensation section.
3. The chip heat exchanger according to claim 1 or 2,
the evaporation section is arranged along the length direction of the chip.
4. The chip heat exchanger according to claim 3,
the area of the evaporation section is 5/6 of the area of the chip.
5. An inverter air conditioner, characterized in that, comprises the chip heat exchanger of any one of claims 1-4.
CN201910027097.8A 2019-01-11 2019-01-11 Chip heat exchanger and variable frequency air conditioner Active CN110160383B (en)

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Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
CN201910027097.8A CN110160383B (en) 2019-01-11 2019-01-11 Chip heat exchanger and variable frequency air conditioner

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CN110160383B true CN110160383B (en) 2020-11-03

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Publication number Priority date Publication date Assignee Title
CN211822831U (en) * 2020-01-15 2020-10-30 青岛海尔空调器有限总公司 Heat dissipation component and air condensing units

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US5671808A (en) * 1995-07-26 1997-09-30 Kleyn; Hendrik Polymeric radiators
CN103033014B (en) * 2012-12-27 2015-08-26 合肥美的电冰箱有限公司 Refrigeration plant
CN103017422A (en) * 2012-12-28 2013-04-03 合肥美的荣事达电冰箱有限公司 Roll-bond evaporator and refrigerator with same
CN103488266A (en) * 2013-10-14 2014-01-01 浙江嘉熙光电设备制造有限公司 Thin sheet type CPU heat dissipation device and machining method thereof
CN107027278A (en) * 2017-06-07 2017-08-08 珠海格力电器股份有限公司 A kind of air-conditioning and its controller heat elimination assembly
CN107195766B (en) * 2017-07-05 2018-11-20 四川凯润电器有限公司 A kind of LED radiator
CN108253829B (en) * 2018-01-30 2024-03-15 中国科学院理化技术研究所 Loop heat pipe driven by micro-channel array

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Address after: 266101 Haier Industrial Park, Haier Road, Laoshan District, Shandong, Qingdao, China

Patentee after: QINGDAO HAIER AIR CONDITIONER GENERAL Corp.,Ltd.

Patentee after: Haier Zhijia Co.,Ltd.

Address before: 266101 Haier Industrial Park, Haier Road, Laoshan District, Shandong, Qingdao, China

Patentee before: QINGDAO HAIER AIR CONDITIONER GENERAL Corp.,Ltd.

Patentee before: Qingdao Haier Joint Stock Co.,Ltd.

CP01 Change in the name or title of a patent holder