CN110157146A - A kind of modifying phenolic resin composition and preparation method thereof - Google Patents
A kind of modifying phenolic resin composition and preparation method thereof Download PDFInfo
- Publication number
- CN110157146A CN110157146A CN201910387321.4A CN201910387321A CN110157146A CN 110157146 A CN110157146 A CN 110157146A CN 201910387321 A CN201910387321 A CN 201910387321A CN 110157146 A CN110157146 A CN 110157146A
- Authority
- CN
- China
- Prior art keywords
- phenolic resin
- resin composition
- parts
- modifying phenolic
- modifying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/02—Organic and inorganic ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/15—Heterocyclic compounds having oxygen in the ring
- C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
- C08K5/1535—Five-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2312/00—Crosslinking
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The present invention relates to a kind of modifying phenolic resin compositions and preparation method thereof, and the composition consists of the following parts by weight: 30-100 parts of resol resins, 5-20 parts of waterglass, 5-10 parts of sericite, 0.5-2 parts of copper powder, 1-5 parts of curing agent, 0.01-0.5 parts of wetting agent, 5-25 parts of furfuryl alcohol.Compared with prior art, modifying phenolic resin composition storage time of the invention is longer, has excellent anti-flammability and toughness, can be used for the industries such as coating, impregnating agent, electronics, timber.
Description
Technical field
The present invention relates to phenol resin composition fields, excellent more particularly, to a kind of Storage period limit for length, anti-flammability and toughness
Good modifying phenolic resin composition and preparation method thereof.
Background technique
Product of the phenolic resin after stable, raw material is easy to get, is low in cost, cured with its performance have it is good heat-resisting and
The advantages that mechanical property, becomes and realizes industrialized synthetic resin earliest in the world, and is widely used.But phenolic aldehyde tree
There are oxidizable phenolic hydroxyl group and methylene in rouge structure, it is restricted its heat resistance and flame retardant property.In addition, due to methylene
Closely piling up for the rigid aromatic ring of base phase even, causes the tensile elongation of phenolic resin and toughness poor.Resol resins are with water
It is at low cost, free from environmental pollution for solvent, meet current economic, environmental protection demand for development, has broad application prospects and well
Social value.But viscosity can be gradually increased after resol resins storage a period of time at present, or even lose exploitation value
Value, limits it in the application of the industries such as coating, impregnating agent.
Summary of the invention
It is an object of the present invention to overcome the above-mentioned drawbacks of the prior art and provide a kind of storage time is longer,
There is the modifying phenolic resin composition and preparation method thereof of excellent anti-flammability and toughness.
The purpose of the present invention can be achieved through the following technical solutions:
A kind of modifying phenolic resin composition, consists of the following parts by weight:
The resol resins include common water borne phenol formaldehyde resin, organic matter as a preferred technical solution,
Modified water-soluble phenolic resin, mineral-modified resol resins, nanometer modified aqueous phenolic resin.
The modulus of water glass is the liquid glass of 1-2.5 as a preferred technical solution,.
The sericite is nanoscale sericite particle as a preferred technical solution,.
The copper powder is Micron-Sized Copper Powders Coated particle as a preferred technical solution,.
The curing agent is hexamethylenetetramine as a preferred technical solution,
As a preferred technical solution, the wetting agent be selected from fatty alcohol polyoxyethylene ether, nonylphenol polyoxyethylene ether,
At least one of polyethenoxy ether class phosphate, sodium alginate, Negel and neopelex.
The present invention also provides a kind of preparation methods of modifying phenolic resin composition, comprising the following steps:
(1) curing agent, wetting agent, sericite and copper powder are added to according to the proportion and are preheated to 45~55 DEG C of aqueous phenolic aldehyde
In resin and high force dispersion 20-50min, mixture A is formed；
(2) waterglass is added in mixture A according to the proportion and mixes 10-30min, form mixture B；
(3) furfuryl alcohol is added in mixture B and stirs 10-30min, obtain the modifying phenolic resin composition.
The additional amount of furfuryl alcohol guarantees -4 glasss of viscosity of painting at 22 DEG C of composition in step (3) as a preferred technical solution,
For 10-60s.
Compared with prior art, modifying phenolic resin composition provided by the invention, by adding in hydrotropism's phenolic resin
Add low modulus liquid glass, i.e., increase inorganic silicon materials resistant to high temperature thereto, improve phenolic resin heat resistance and
Anti-flammability, nanometer sericite and copper powder are full of elasticity, flexible, wear resistence and wearability are good, can be in resol resins
Even dispersion, so as to add the hardness and toughness of phenolic resin；Furfuryl alcohol molecule contains active methylol and furan nucleus, wherein furans
Ring, with phenolic resin molecule cross-link, forms insoluble insoluble normal substance, to improve phenolic aldehyde in Analysis on Curing Process of Phenolic
The heat resistance and alkali resistance of resin, and furfuryl alcohol is viscosity < 15s liquid at normal temperature, moreover it is possible to for adjusting phenolic resin
Viscosity makes it store renewal.Modifying phenolic resin composition of the invention can be used for coating, impregnating agent, electronics, timber etc.
Industry.
Specific embodiment
The present invention is described in detail combined with specific embodiments below.
Embodiment 1
A kind of modifying phenolic resin composition is made of the raw material of following parts by weight:
5 parts of sericite that 10 parts of waterglass that 70 parts of aqueous phenol formaldehyde resin, modulus are 1.2, partial size are 10nm, partial size
For 1 μm of 1.5 parts of copper powder, 1 part of curing agent, 0.2 part of wetting agent and 5 parts of furfuryl alcohol.
Preparation step are as follows:
1) curing agent, wetting agent, sericite and copper powder are added in the aqueous phenol formaldehyde resin of 50 DEG C or so of preheating
And 30min is stirred, form mixture A；
2) waterglass is added in mixture A and stirs 20min, form mixture B；
3) furfuryl alcohol is added in mixture B and stirs 20min, modifying phenolic resin composition is made.
The phenol resin composition viscosity of embodiment preparation is 37s, and four months viscosity is placed under room temperature and is risen without obvious,
Compared with common water borne phenolic resin；Thermal weight loss improves 15% at 300 DEG C, and alkali resistance and toughness are improved.
Embodiment 2
A kind of modifying phenolic resin composition is made of the raw material of following parts by weight:
5 parts of sericite that 15 parts of waterglass that 90 parts of aqueous phenol formaldehyde resin, modulus are 1.2, partial size are 10nm, partial size
For 1 μm of 1.5 parts of copper powder, 1 part of curing agent, 0.3 part of wetting agent and 8 parts of furfuryl alcohol.
Preparation step are as follows:
1) curing agent, wetting agent, sericite and copper powder are added in the resol resins of 50 DEG C or so of preheating and are stirred
30min is mixed, mixture A is formed；
2) waterglass is added in mixture A and stirs 20min, form mixture B；
3) furfuryl alcohol is added in mixture B and stirs 20min, modifying phenolic resin composition is made.
The phenol resin composition viscosity of embodiment preparation is 25s, and four months viscosity is placed under room temperature and is risen without obvious,
Compared with common water borne phenolic resin；Thermal weight loss improves 18% at 300 DEG C, and alkali resistance and toughness are improved.
Embodiment 3
A kind of modifying phenolic resin composition is made of the raw material of following parts by weight:
5 parts of sericite that 20 parts of waterglass that 80 parts of aqueous phenol formaldehyde resin, modulus are 2.0, partial size are 10nm, partial size
For 1 μm of 2 parts of copper powder, 1 part of curing agent, 0.3 part of wetting agent and 10 parts of furfuryl alcohol.
Combination step are as follows:
1) curing agent, wetting agent, sericite and copper powder are added in the resol resins of 50 DEG C or so of preheating and are stirred
50min is mixed, mixture A is formed；
2) waterglass is added in mixture A and stirs 20min, form mixture B；
3) furfuryl alcohol is added in mixture B and stirs 30min, modifying phenolic resin composition is made.
The phenol resin composition viscosity of embodiment preparation is 42s, and four months viscosity is placed under room temperature and is risen without obvious,
Compared with common water borne phenolic resin；Thermal weight loss improves 15% at 300 DEG C, and alkali resistance and toughness are improved.
Embodiment 4
The modifying phenolic resin composition of the present embodiment is made of the raw material of following parts by weight:
10 parts of sericite that 10 parts of waterglass that 100 parts of aqueous phenol formaldehyde resin, modulus are 1, partial size are 10nm, partial size
For 1 μm of 1 part of copper powder, 5 parts of curing agent, 0.5 part of wetting agent and 15 parts of furfuryl alcohol.The additional amount of furfuryl alcohol guarantees at 22 DEG C of composition
Applying -4 glasss of viscosity is 10-60s.
Combination step are as follows:
1) curing agent, wetting agent, sericite and copper powder are added in the resol resins of 55 DEG C or so of preheating and are stirred
20min is mixed, mixture A is formed；
2) waterglass is added in mixture A and stirs 10min, form mixture B；
3) furfuryl alcohol is added in mixture B and stirs 30min, modifying phenolic resin composition is made.
The composition storage time being prepared is longer, has excellent anti-flammability and toughness.
Embodiment 5
The modifying phenolic resin composition of the present embodiment is made of the raw material of following parts by weight:
8 parts of sericite that 5 parts of waterglass that 30 parts of aqueous phenol formaldehyde resin, modulus are 2.5, partial size are 10nm, partial size
For 1 μm of 0.5 part of copper powder, 2 parts of curing agent, 0.01 part of wetting agent and 6 parts of furfuryl alcohol.The additional amount of furfuryl alcohol guarantees at 22 DEG C of composition
- 4 glasss of viscosity of painting be 10-60s.
Combination step are as follows:
1) curing agent, wetting agent, sericite and copper powder are added in the resol resins of 45 DEG C or so of preheating and are stirred
40min is mixed, mixture A is formed；
2) waterglass is added in mixture A and stirs 30min, form mixture B；
3) furfuryl alcohol is added in mixture B and stirs 10min, modifying phenolic resin composition is made.
The composition storage time being prepared is longer, has excellent anti-flammability and toughness.
Above-mentioned resol resins can be common water borne phenol formaldehyde resin, organics modifications resol resins, nothing
Any one of machine object modified water-soluble phenolic resin, nanometer modified aqueous phenolic resin.
Above-mentioned wetting agent is selected from fatty alcohol polyoxyethylene ether, nonylphenol polyoxyethylene ether, polyethenoxy ether class phosphate, sea
At least one of mosanom, Negel and neopelex.
The above-mentioned description to embodiment is for ease of ordinary skill in the art to understand and use the invention.It is ripe
The personnel for knowing art technology obviously easily can make various modifications to these embodiments, and general original described herein
It ought to use in other embodiments without having to go through creative labor.Therefore, the present invention is not limited to the above embodiments, this field
Technical staff's announcement according to the present invention, improvement and modification made without departing from the scope of the present invention all should be in guarantors of the invention
Within the scope of shield.
Claims (9)
1. a kind of modifying phenolic resin composition, which is characterized in that consist of the following parts by weight:
2. a kind of modifying phenolic resin composition according to claim 1, which is characterized in that the resol resins
Including common water borne phenol formaldehyde resin, organics modifications resol resins, mineral-modified resol resins or nanometer
Modified water-soluble phenolic resin.
3. a kind of modifying phenolic resin composition according to claim 1, which is characterized in that the modulus of water glass is
The liquid glass of 1-2.5.
4. a kind of modifying phenolic resin composition according to claim 1, which is characterized in that the sericite is nanometer
Grade sericite particle.
5. a kind of modifying phenolic resin composition according to claim 1, which is characterized in that the copper powder is micron order
Copper powder particle.
6. a kind of modifying phenolic resin composition according to claim 1, which is characterized in that the curing agent is six times
Tetramine
7. a kind of modifying phenolic resin composition according to claim 1, which is characterized in that the wetting agent is selected from rouge
Fat alcohol polyoxyethylene ether, nonylphenol polyoxyethylene ether, polyethenoxy ether class phosphate, sodium alginate, Negel and ten
At least one of dialkyl benzene sulfonic acids sodium.
8. the preparation method of the modifying phenolic resin composition as described in claim 1~7 is any, which is characterized in that including with
Lower step:
(1) curing agent, wetting agent, sericite and copper powder are added to according to the proportion and are preheated to 45~55 DEG C of resol resins
In and high force dispersion 20-50min, formed mixture A；
(2) waterglass is added in mixture A according to the proportion and mixes 10-30min, form mixture B；
(3) furfuryl alcohol is added in mixture B and stirs 10-30min, obtain the modifying phenolic resin composition.
9. the preparation method of modifying phenolic resin composition according to claim 8, which is characterized in that chaff in step (3)
The additional amount of alcohol guarantees that -4 glasss of viscosity of painting at 22 DEG C of composition are 10-60s.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910387321.4A CN110157146A (en) | 2019-05-10 | 2019-05-10 | A kind of modifying phenolic resin composition and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910387321.4A CN110157146A (en) | 2019-05-10 | 2019-05-10 | A kind of modifying phenolic resin composition and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110157146A true CN110157146A (en) | 2019-08-23 |
Family
ID=67633936
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910387321.4A Pending CN110157146A (en) | 2019-05-10 | 2019-05-10 | A kind of modifying phenolic resin composition and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110157146A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3950802A1 (en) * | 2020-08-05 | 2022-02-09 | Metadynea Austria GmbH | Adhesive composition for making wood laminates |
| CN115247040A (en) * | 2022-08-25 | 2022-10-28 | 常熟东南塑料有限公司 | Phenolic resin for adhesive |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070272338A1 (en) * | 2003-10-31 | 2007-11-29 | Maurizio Galimberti | Tire and Crosslinkable Elastomeric Composition |
| CN101293990A (en) * | 2008-06-19 | 2008-10-29 | 武汉理工大学 | Method for synthesizing soluble glass modified phenolic resin with suspending method |
| CN101974200A (en) * | 2010-11-03 | 2011-02-16 | 哈尔滨工业大学 | Method for improving heat resistance of phenolic resin |
| CN103030922A (en) * | 2012-12-03 | 2013-04-10 | 中国科学院宁波材料技术与工程研究所 | Water-soluble phenolic resin solution for woven friction materials and preparation method thereof |
| CN105885343A (en) * | 2016-05-19 | 2016-08-24 | 东南大学 | Heat-resistant composite material and preparation method thereof |
-
2019
- 2019-05-10 CN CN201910387321.4A patent/CN110157146A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070272338A1 (en) * | 2003-10-31 | 2007-11-29 | Maurizio Galimberti | Tire and Crosslinkable Elastomeric Composition |
| CN101293990A (en) * | 2008-06-19 | 2008-10-29 | 武汉理工大学 | Method for synthesizing soluble glass modified phenolic resin with suspending method |
| CN101974200A (en) * | 2010-11-03 | 2011-02-16 | 哈尔滨工业大学 | Method for improving heat resistance of phenolic resin |
| CN103030922A (en) * | 2012-12-03 | 2013-04-10 | 中国科学院宁波材料技术与工程研究所 | Water-soluble phenolic resin solution for woven friction materials and preparation method thereof |
| CN105885343A (en) * | 2016-05-19 | 2016-08-24 | 东南大学 | Heat-resistant composite material and preparation method thereof |
Non-Patent Citations (3)
| Title |
|---|
| 朱凤琴: "糠醇改性酚醛树脂及其应用", 《粘合剂》 * |
| 赵元艺等: "《德兴铜矿生产过程中Re等元素分布规律研究》", 30 April 2018, 地质出版社 * |
| 郭群等: "《砂浆实验及检测培训教材》", 30 September 2014, 中国建材工业出版社 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3950802A1 (en) * | 2020-08-05 | 2022-02-09 | Metadynea Austria GmbH | Adhesive composition for making wood laminates |
| WO2022029215A1 (en) | 2020-08-05 | 2022-02-10 | Metadynea Austria Gmbh | Adhesive composition for making wood laminates, wood laminates and processes for the preparation thereof |
| CN115247040A (en) * | 2022-08-25 | 2022-10-28 | 常熟东南塑料有限公司 | Phenolic resin for adhesive |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100569826C (en) | A kind of self-emulsifying type aqueous latex of epoxy hardener and preparation method thereof | |
| Cardona et al. | Novel phenolic resins with improved mechanical and toughness properties | |
| CN110157146A (en) | A kind of modifying phenolic resin composition and preparation method thereof | |
| CN102993898B (en) | Epoxy protective coating and preparation method for same | |
| CN106753134B (en) | Epoxy structural adhesive for die assembly and bonding of salt mist-resistant and damp-heat-resistant wind power generation blade and preparation method thereof | |
| CN1984958B (en) | Phenolic resin compositions containing etherified hardeners | |
| CN101982484B (en) | Alcoholichydroxyl-containing benzoxazine resin and preparation method thereof | |
| CN101003664B (en) | Latex of epoxy resin of aqueous phenolic aldehyde, and preparation method | |
| CN107586504A (en) | Color sand self-leveling floor coating of one kind floating and preparation method thereof | |
| CN109321223A (en) | A kind of sand control agent, preparation method and the purposes for sand control | |
| CN101967268B (en) | Halogen-free flame-retardant epoxy resin and preparation method thereof | |
| CN105518060A (en) | Fiber-reinforced resin and method for producing same, and molded article | |
| Weng et al. | Thermal property of epoxy/SiO2 hybrid material synthesized by the sol–gel process | |
| CN103382345A (en) | Preparation method of high temperature resistant epoxy insulating coating | |
| CN110028762B (en) | Preparation method of artemisia annua volatile oil/epoxy resin composite material | |
| CN113308209B (en) | Mixed diluent, environment-friendly high-permeability epoxy grouting material prepared from mixed diluent and preparation method of environment-friendly high-permeability epoxy grouting material | |
| CN107973899A (en) | A kind of preparation method of the modified epoxy curing agent based on anacardol | |
| CN105754451A (en) | Konjac fly powder based epoxy resin, preparation method thereof and coating prepared from konjac fly powder based epoxy resin | |
| CN105859991B (en) | A kind of phenol-formaldehyde resin modified | |
| CN101440192B (en) | Conductive / heat insulating composite material | |
| EP1100674B1 (en) | Resin transfer moulding | |
| CN101679644B (en) | Resin dispersion | |
| CN105174819A (en) | Waterproof epoxy mortar and preparation method thereof | |
| CN102993636B (en) | Preparation method of modified phenolic resin | |
| CN116023837B (en) | Anti-scaling coating for civil heating heat exchanger and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190823 |