CN110149785A - A kind of integrated cooling device - Google Patents
A kind of integrated cooling device Download PDFInfo
- Publication number
- CN110149785A CN110149785A CN201910499463.XA CN201910499463A CN110149785A CN 110149785 A CN110149785 A CN 110149785A CN 201910499463 A CN201910499463 A CN 201910499463A CN 110149785 A CN110149785 A CN 110149785A
- Authority
- CN
- China
- Prior art keywords
- cabinet
- substrate
- cooling device
- coolant liquid
- air draft
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 51
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 239000007788 liquid Substances 0.000 claims abstract description 27
- 239000002826 coolant Substances 0.000 claims abstract description 26
- 230000017525 heat dissipation Effects 0.000 claims abstract description 6
- 238000003860 storage Methods 0.000 claims description 16
- 230000008676 import Effects 0.000 claims description 3
- 230000000712 assembly Effects 0.000 claims description 2
- 238000000429 assembly Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 5
- -1 cooling fin Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 208000032368 Device malfunction Diseases 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000037396 body weight Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000009527 percussion Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a kind of integrated cooling devices, including cabinet, substrate, cooling fin, coolant liquid recirculation assembly, heat conducting pipe and air draft part；The substrate is set in cabinet；The cooling fin is connected with the wall of the substrate and cabinet respectively；The heat conducting pipe extends through the substrate and cooling fin, and entrance and exit is connected with the coolant liquid recirculation assembly respectively；The air draft part is set in the cabinet, for the intracorporal heat of case to be discharged to outside cabinet.The present invention is effectively integrated air-cooled with water cooling, realizes whole device under totally-enclosed state, convenient for the heat dissipation of power device, not only has energy-saving effect, additionally it is possible to save space.
Description
Technical field
The invention belongs to cooling device technical fields, and in particular to a kind of integrated cooling device.
Background technique
With being constantly progressive for science and technology, the electromagnetic environment inside high-power electronic system becomes increasingly complex, and produces
Raw electromagnetic interference will cause communication system and go offline, equips malfunction, transformer life shortening, protective relaying device malfunction etc.,
Potential hazard is produced to the safe and reliable operation of itself and surrounding other equipment, exacerbates electromagnetic environmental pollution and high-frequency percussion
It influences.Required in modern industry system high-power electronic system can be conducive to heat dissipation, ultra-wide temperature width, and save space and
Material reduces production cost.
Summary of the invention
In view of the above-mentioned problems, the present invention proposes a kind of integrated cooling device, effectively collected air-cooled with water cooling
At realizing whole device under totally-enclosed state, convenient for the heat dissipation of power device, the design of ultra-wide temperature width not only has energy conservation
Effect, additionally it is possible to save space, reduce production cost, also meet different application scenarios.
In order to achieve the above technical purposes, reach above-mentioned technical effect, the invention is realized by the following technical scheme:
A kind of integrated cooling device, comprising:
Cabinet；
Substrate, the substrate are set in cabinet；
Cooling fin, the cooling fin are connected with the wall of the substrate and cabinet respectively；
Coolant liquid recirculation assembly；
Heat conducting pipe, the heat conducting pipe extend through the substrate and cooling fin, and entrance and exit is followed with the coolant liquid respectively
Ring assemblies are connected；
Air draft part, the air draft part is set in the cabinet, for the intracorporal heat of case to be discharged to outside cabinet.
Preferably, the integrated cooling device further includes expansion loop, the expansion loop be located at the outlet of heat conducting pipe with it is cold
But between the import of liquid recirculation assembly, the design of ultra-wide temperature width also meets different application scenarios.
Preferably, the air draft part is radiator fan.
Preferably, the cooling fin is connected with the bottom wall of the substrate and cabinet respectively；The top of the air draft part and cabinet
Wall is connected.
Preferably, when the quantity of the air draft part is more than or equal to 2, each air draft part is arranged at equal intervals.
Preferably, the heat conducting pipe is in detour shape in substrate and cooling fin.
Preferably, the coolant liquid recirculation assembly includes storage container and pump, and the storage container is used to store coolant liquid,
The entrance of the pump is connected with the storage container；The heat conducting pipe extends through the substrate and cooling fin, entrance and institute
The outlet for stating pump is connected, and outlet is connected with the entrance of the storage container.
Preferably, the coolant liquid recirculation assembly is set in the cabinet.
Compared with prior art, beneficial effects of the present invention:
The present invention proposes a kind of integrated cooling device, cooperates substrate and cooling fin using coolant liquid recirculation assembly, realizes water cooling
Circulation, at the same it is air-cooled using the intracorporal exhaust fan realization of case is set to, whole device is realized under totally-enclosed state, is convenient for power
The heat dissipation of device not only has energy-saving effect, additionally it is possible to save space, have good popularization and application foreground.
Detailed description of the invention
In order that the present invention can be more clearly and readily understood, right below according to specific embodiment and in conjunction with attached drawing
The present invention is described in further detail, in which:
Fig. 1 is one of the structural schematic diagram of an embodiment of the present invention；
Fig. 2 is the second structural representation of an embodiment of the present invention；
Fig. 3 is the heat transfer flow diagram of an embodiment of the present invention；
Fig. 4 is the coolant liquid circulation process schematic diagram of an embodiment of the present invention；
Wherein: 1- cabinet, 101- bottom wall, 2- substrate, 3- cooling fin, 4- coolant liquid recirculation assembly, 401- storage container, 402-
Pump, 5- heat conducting pipe, 6- air draft part, 7- expansion loop, 8- heat generating member.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to embodiments, to the present invention
It is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, it is not used to
It limits the scope of protection of the present invention.
Application principle of the invention is explained in detail with reference to the accompanying drawing.
Embodiment 1
As shown in Figs. 1-2, a kind of integrated cooling device is provided in the present embodiment, comprising: cabinet 1, substrate 2, cooling fin 3,
Coolant liquid recirculation assembly 4, heat conducting pipe 5 and air draft part 6；
There is cavity inside the cabinet 1；In a kind of specific embodiment of the present embodiment, the cabinet 1 is hexahedron case
Body, 1 outer surface of cabinet are all made of aluminium product；
The substrate 2 is set in the cabinet 1, it is preferable that the substrate 2 is made using metallic aluminum material；Actually make
With in the process, the substrate 2 is therebetween plane-type contact for placing heat generating member 8；
The coolant liquid recirculation assembly 4 includes storage container 401 and pump 402, and the storage container 401 is for storing coolant liquid
The entrance of (such as water), the pump 402 is connected with the storage container 401；Preferably, the coolant liquid recirculation assembly 4 is set to
In the cabinet 1；
The cooling fin 3 is connected with the wall of the substrate 2 and cabinet 1 respectively；In a kind of specific embodiment of the present embodiment,
The cooling fin 3 is connected with the bottom wall 101 of the substrate 2 and cabinet 1 respectively；
The heat conducting pipe 5 extends through the substrate 2 and cooling fin 3, entrance and exit respectively with the coolant liquid circulation group
Part 4 is connected, i.e., the entrance of the described heat conducting pipe 5 is connected with the outlet of the pump 402, and outlet enters with the storage container 401
Mouth is connected；In a kind of specific embodiment of the present embodiment, the heat conducting pipe 5 is in detour in substrate 2 and cooling fin 3
Shape, to improve heat dissipation effect；The heat conducting pipe is necessary for seamless pipe, and product is after the completion according to 1.5 times of air-tightness pressures of actual use
Power detection, detecting qualified rear can be used；
The air draft part 6 is set in the cabinet 1, for the heat in cabinet 1 to be discharged to outside cabinet 1；In the present embodiment
In a kind of specific embodiment, the air draft part 6 is radiator fan, is connected with the roof of cabinet 1, when the air draft part 6
Quantity is more than or equal to 2 constantly, and each air draft part 6 is arranged at equal intervals.
The integrated cooling device is for being mounted in high-voltage electromagnetic isolation cabinet, the case in each integrated cooling device
Body 1, which can according to need, is designed to same or different height, to complete same or different work, so that collection of the invention
The compatible isolation cabinet of the high-voltage electromagnetic that accepted way of doing sth cooling device is suitable for, is suitable for Modular design system.
In conclusion the heat transfer principle of the integrated cooling device in the present embodiment are as follows:
The heat of heater 8 is passed to substrate 2, and heat is discharged to outside cabinet 1 by the air draft part 6；
Coolant liquid (such as water) is stored in storage container 401, the coolant liquid recirculation assembly 4 is started, is provided and is followed by pump 402
Gyration power, coolant liquid sequentially flow through on heat conducting pipe 5 be located at substrate 2 and cooling fin 3 in part, realize heat from substrate 2 → dissipate
Backing 3, the coolant liquid of fever finally flow in storage container 401 again, since 1 bottom plate of cabinet is connected with cooling fin 3, for this purpose,
Heat on cooling fin 3 can be partially passed on 1 bottom plate of cabinet, radiated using tank surface, be based ultimately upon air draft part 6
It realizes that heat is expelled to outside cabinet 1 through moving air, has both saved space and material, also mitigate cabinet body weight, referring specifically to Fig. 3
With 4.
Embodiment 2
The difference of the present embodiment and embodiment is:
In low temperature, there may be icing condition volumetric expansions, volume to increase, lead to heat conducting pipe 5 and deposit for cooling water in order to prevent
Storage container 401 is damaged, to can not work, the integrated cooling device further includes expansion loop 7, and the expansion loop 7 is located at
Between the outlet of heat conducting pipe 5 and the import of coolant liquid recirculation assembly 4.Expansion loop 7 in the present invention is expansion in the prior art
Ring is made of nonmetallic materials, low-temperature resistance, has certain dilatancy, cooling water is in icing condition lower volume when low temperature
When expansion, expansion space extension is acted on, cyclic annular or arch bridge shape is shaped to.
The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention.The technology of the industry
Personnel are it should be appreciated that the present invention is not limited to the above embodiments, and the above embodiments and description only describe this
The principle of invention, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these changes
Change and improvement all fall within the protetion scope of the claimed invention.The claimed scope of the invention by appended claims and its
Equivalent thereof.
Claims (8)
1. a kind of integrated cooling device characterized by comprising
Cabinet；
Substrate, the substrate are set in cabinet；
Cooling fin, the cooling fin are connected with the wall of the substrate and cabinet respectively；
Coolant liquid recirculation assembly；
Heat conducting pipe, the heat conducting pipe extend through the substrate and cooling fin, and entrance and exit is followed with the coolant liquid respectively
Ring assemblies are connected；
Air draft part, the air draft part is set in the cabinet, for the intracorporal heat of case to be discharged to outside cabinet.
2. a kind of integrated cooling device according to claim 1, it is characterised in that: the integrated cooling device also wraps
Expansion loop is included, the expansion loop is located between the outlet of heat conducting pipe and the import of coolant liquid recirculation assembly.
3. a kind of integrated cooling device according to claim 1, it is characterised in that: the air draft part is radiator fan.
4. a kind of integrated cooling device according to claim 1, it is characterised in that: the cooling fin respectively with the base
Plate is connected with the bottom wall of cabinet；The air draft part is connected with the roof of cabinet.
5. a kind of integrated cooling device according to claim 1, it is characterised in that: when the quantity of the air draft part is greater than
Or when being equal to 2, each air draft part is arranged at equal intervals.
6. a kind of integrated cooling device according to claim 1, it is characterised in that: the heat conducting pipe is in substrate and heat dissipation
It is in detour shape in piece.
7. a kind of integrated cooling device according to claim 1, it is characterised in that: the coolant liquid recirculation assembly includes
Storage container and pump, for storing coolant liquid, the entrance of the pump is connected the storage container with the storage container；
The heat conducting pipe extends through the substrate and cooling fin, and entrance is connected with the outlet of the pump, outlet with it is described
The entrance of storage container is connected.
8. a kind of integrated cooling device according to claim 1, it is characterised in that: the coolant liquid recirculation assembly is set to
In the cabinet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910499463.XA CN110149785A (en) | 2019-06-11 | 2019-06-11 | A kind of integrated cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910499463.XA CN110149785A (en) | 2019-06-11 | 2019-06-11 | A kind of integrated cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110149785A true CN110149785A (en) | 2019-08-20 |
Family
ID=67590843
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910499463.XA Pending CN110149785A (en) | 2019-06-11 | 2019-06-11 | A kind of integrated cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110149785A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1980562A (en) * | 2006-12-07 | 2007-06-13 | 华南理工大学 | Liquid-cooling type electronic-device radiator |
| CN203446167U (en) * | 2013-08-20 | 2014-02-19 | 广东大飞洋游艇设备有限公司 | Water-cooling electric control box |
| CN210351965U (en) * | 2019-06-11 | 2020-04-17 | 浙江大学昆山创新中心 | Integrated cooling device |
-
2019
- 2019-06-11 CN CN201910499463.XA patent/CN110149785A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1980562A (en) * | 2006-12-07 | 2007-06-13 | 华南理工大学 | Liquid-cooling type electronic-device radiator |
| CN203446167U (en) * | 2013-08-20 | 2014-02-19 | 广东大飞洋游艇设备有限公司 | Water-cooling electric control box |
| CN210351965U (en) * | 2019-06-11 | 2020-04-17 | 浙江大学昆山创新中心 | Integrated cooling device |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |