CN110148369B - Impedance test pressure head - Google Patents
Impedance test pressure head Download PDFInfo
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- CN110148369B CN110148369B CN201910515470.4A CN201910515470A CN110148369B CN 110148369 B CN110148369 B CN 110148369B CN 201910515470 A CN201910515470 A CN 201910515470A CN 110148369 B CN110148369 B CN 110148369B
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- testing
- pressing block
- fpc board
- indenter
- assembly
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/006—Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays
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Abstract
The invention relates to the technical field of display panel testing, and discloses an impedance testing pressure head which comprises a testing component and a pressing block, wherein the testing component comprises a connecting component and a measuring head component, the measuring head component is arranged on the connecting component, the measuring head component is an FPC (flexible printed circuit) board with a testing conduction part, and the FPC board can be obliquely cut into a piece to be tested and is contacted with the piece to be tested; the press block is configured to secure the test assembly. The FPC board is obliquely cut into the part to be measured to be contacted with the part to be measured, the contact area of the golden finger of the FPC board and the metal contact of the display panel is increased in an oblique contact mode, the contact effect of the golden finger and the metal contact is ensured, the possibility of floating contact is avoided, and therefore accurate impedance value measurement can be conducted on the display panel.
Description
Technical Field
The invention relates to the technical field of display panel testing, in particular to an impedance testing pressure head.
Background
In the field of display technology, the Organic Light-Emitting Diode (OLED) display technology has the advantages of self-luminescence, wide viewing angle, almost infinite contrast, low power consumption, and very high response speed, and is generally applied to display panels of televisions, mobile phones, tablet computers, and the like. With the increasing control demand of people for electronic devices, display panels with touch control function are receiving more and more attention.
For a display panel using the OLED technology, in the production process of the display panel, a plurality of parameters, such as color saturation, impedance value, etc., need to be detected for the display panel. The impedance value is an important index for judging whether the display panel is qualified, and the impedance value is the ratio of the voltage value applied to the display panel to the current value introduced.
When the impedance value of the display panel is detected in the prior art, a mode that a pressure head is pressed against the display panel is mainly adopted for testing, and a control signal is generally transmitted into the display panel through an external Circuit such as a Flexible Printed Circuit (FPC), which requires binding (bonding) the Flexible Circuit board and the display panel, that is, a PIN (i.e., a gold finger) on the Flexible Circuit board is bound with a corresponding metal contact (PAD point) on the display panel, so that the signal is transmitted into the display panel from the Flexible Circuit board.
In the process of pressing the pressure head to press the display panel, the contact effect of the golden finger and the metal contact can influence the accuracy of the detected impedance value. When the existing pressure head is used for pressing and connecting a display panel, a golden finger is just opposite to a metal contact to be contacted, the contact area of the golden finger and the metal contact is small or the golden finger and the metal contact are not completely contacted, and the measured impedance value is inaccurate.
In view of the above-mentioned drawbacks, the present designer is actively making research and innovation to create an impedance testing indenter with a novel structure, so that the indenter has a higher industrial utility value.
Disclosure of Invention
The invention aims to provide an impedance testing pressure head which can increase the contact area of a golden finger of an FPC board and a metal contact of a display panel and realize accurate measurement of an impedance value of the display panel.
In order to achieve the purpose, the invention adopts the following technical scheme:
an impedance test indenter, includes test assembly and briquetting, wherein:
the test assembly comprises a connecting assembly and a measuring head assembly, the measuring head assembly is arranged on the connecting assembly, the measuring head assembly is an FPC board with a test conduction part, and a conduction surface of the test conduction part of the FPC board and a compression joint surface of a piece to be tested form an inclined included angle;
the press block is configured to secure the test assembly.
The connection surface of the test connection part of the FPC board and the compression joint of the piece to be tested form an inclined included angle, namely, the impedance test pressure head can enable the FPC board to be obliquely cut into the piece to be tested to be contacted with the piece to be tested, the contact area of the golden finger of the FPC board and the metal contact of the display panel is increased in an inclined contact mode, the contact effect of the golden finger and the metal contact is ensured, the possibility of floating contact is avoided, and therefore accurate impedance value measurement can be carried out on the display panel.
As a preferable scheme of the above impedance testing pressure head, the pressure block includes a first pressure block and a second pressure block, the second pressure block fixes the probe assembly, and the second pressure block is connected to the first pressure block and can move relative to the first pressure block. Because the displacement volume that the crimping tested, FPC board required is very little, consequently, only need make the relative first briquetting of second briquetting micromovement, through making the relative first briquetting micromovement of second briquetting to satisfy the displacement volume that gauge head subassembly needs when the crimping.
As a preferable scheme of the impedance test indenter, a supporting portion for supporting the test assembly is arranged at the top of the second pressing block, and a supporting surface of the supporting portion is an inclined surface. The supporting surface of the supporting part is set to be an inclined surface, so that the FPC board can be obliquely cut into the piece to be tested to be contacted with the piece to be tested.
As a preferable mode of the above-mentioned resistance test indenter, an inclination angle of the inclined surface with respect to the crimping surface is 10 ° to 40 °. The inclination angle can meet the requirement that the contact area between the golden finger of the FPC board and the metal contact of the display panel is larger.
As a preferable mode of the above-mentioned resistance test indenter, the connection assembly includes a pressing plate that presses the FPC board against the inclined surface. The pressing plate can prevent the FPC board from moving during crimping, and the crimping accuracy is ensured.
As a preferable scheme of the impedance test indenter, the pressure plate is in magnetic attraction fit with the inclined surface. The magnetic attraction matching structure is simple and easy to process.
As a preferable aspect of the above-described resistance test indenter, the support portion may rest on top of the first pressing block. The top of the first pressing block can be abutted against the supporting portion, the supporting portion is prevented from moving continuously, and the display panel is prevented from being damaged due to over-head pressure welding.
As a preferable mode of the above impedance testing indenter, the second pressing block is connected to the first pressing block through a micro-guide. The structure of the micro guide rail can realize the micro movement of the second pressing block relative to the first pressing block.
As a preferable scheme of the above impedance testing indenter, a return spring is connected between the second pressing block and the first pressing block. By means of the reset spring, the second pressing block can be quickly reset after being pressed and connected.
As a preferable scheme of the above impedance test indenter, an insulating soft pad is connected to the FPC board near the test conduction part. The insulating soft cushion can avoid the damage of the display panel in the crimping process.
The beneficial effects of the invention are as follows: the conduction surface of the test conduction part of the FPC board is in an inclined included angle with the compression joint surface of the piece to be tested, namely, the impedance test pressure head can enable the FPC board to be obliquely cut into the piece to be tested to be contacted with the piece to be tested, the contact area of a golden finger of the FPC board and a metal contact of the display panel is increased in an inclined contact mode, meanwhile, the contact effect of the golden finger and the metal contact is ensured, the possibility of floating contact is avoided, and therefore accurate impedance value measurement can be carried out on the display panel.
Drawings
FIG. 1 is a schematic diagram of a configuration of an impedance testing indenter provided by an embodiment of the present invention;
figure 2 is an exploded view of the configuration of a resistance testing indenter provided by an embodiment of the present invention.
In the figure: 10-pressing plate, 20-measuring head component, 21-insulating cushion, 30-pressing block, 31-first pressing block, 32-second pressing block, 33-supporting part, 34-inclined plane and 35-micro guide rail.
Detailed Description
In order to make the technical problems solved, technical solutions adopted and technical effects achieved by the present invention clearer, the technical solutions of the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, removably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood in a specific case to those of ordinary skill in the art.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature "on," "above" and "over" the second feature may include the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
As shown in fig. 1 to 2, the impedance testing pressure head of the present invention is used for testing the crimping impedance of a display panel, and the impedance testing pressure head includes a testing component and a pressing block 30, wherein the testing component includes a connecting component and a probe component 20, the probe component 20 is disposed on the connecting component, the probe component 20 is an FPC board having a testing conduction part, and a conduction surface of the testing conduction part of the FPC board and a crimping surface of a to-be-tested member form an inclined included angle; the press block 30 is configured to hold the test assembly. The connection surface of the test connection part of the FPC board and the compression joint of the piece to be tested form an inclined included angle, namely, the impedance test pressure head can enable the FPC board to be obliquely cut into the piece to be tested to be contacted with the piece to be tested, the contact area of the golden finger of the FPC board and the metal contact of the display panel is increased in an inclined contact mode, the contact effect of the golden finger and the metal contact is ensured, the possibility of floating contact is avoided, and therefore accurate impedance value measurement can be carried out on the display panel.
For the pressing block 30 structure for fixing the test component, in the invention, the pressing block 30 comprises a first pressing block 31 and a second pressing block 32, the second pressing block 32 fixes the measuring head component 20, and the second pressing block 32 is connected with the first pressing block 31 and can move relative to the first pressing block 31. Since the displacement required by the FPC board is small during the crimping test, it is only necessary to slightly move the second pressing piece 32 with respect to the first pressing piece 31, and the second pressing piece 32 is slightly moved with respect to the first pressing piece 31, so as to satisfy the displacement required by the probe assembly 20 during the crimping. Specifically, the second pressing block 32 is connected to the first pressing block 31 through a micro guide rail 35, and a return spring is connected between the second pressing block 32 and the first pressing block 31. The structure of the micro-guide 35 can realize the micro-movement of the second press block 32 relative to the first press block 31. For the connection of the return spring, the return spring may be fixed on the first pressing piece 31, and the second pressing piece 32 may be connected with the return spring. By using the return spring, the second press block 32 can be quickly returned after crimping.
For the connection mode of the pressing block 30 and the testing component, the top of the second pressing block 32 is provided with a supporting part 33 for supporting the testing component, and the supporting surface of the supporting part 33 is an inclined surface 34. By providing the support surface of the support portion 33 as the inclined surface 34, the FPC board can be obliquely cut into the test object to be in contact with the test object. Preferably, the inclined surface 34 is inclined at an angle of 10 ° to 40 ° with respect to the pressure contact surface. The inclination angle can meet the requirement that the contact area between the golden finger of the FPC board and the metal contact of the display panel is larger. In addition, the connecting assembly comprises a pressing plate 10 for pressing the FPC board to the inclined surface 34, and the pressing plate 10 can prevent the FPC board from moving during crimping, so that the crimping accuracy is ensured. For the fixation of the pressing plate 10, in the present invention, the pressing plate 10 is magnetically engaged with the inclined surface 34. The magnetic attraction matching structure is simple and easy to process. For example, the platen 10 can be fixed by attaching a plurality of magnets for attracting the platen 10 to the inclined surface 34.
In order to limit the displacement of the support part 33 carrying the FPC board, the support part 33 in the present invention can rest on top of the first presser piece 31. That is, the top of the first pressing block 31 can abut against the supporting portion 33, so as to prevent the supporting portion 33 from moving continuously, and prevent the display panel from being damaged due to over-head pressure welding.
In the invention, the insulating soft cushion 21 is connected to the FPC board close to the test conduction part, the insulating soft cushion 21 is made of polyurethane, and the insulating soft cushion 21 can prevent the display panel from being damaged in the process of pressure welding.
In conclusion, the impedance test pressure head can increase the contact area between the golden finger of the FPC board and the metal contact of the display panel, and realize accurate measurement of the impedance value of the display panel.
The technical principles of the present invention have been described above with reference to specific embodiments. The description is made for the purpose of illustrating the principles of the invention and should not be taken in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without inventive step, and these embodiments will fall within the scope of the present invention.
Claims (9)
1. An impedance testing indenter comprising a testing assembly and a pressure block (30), wherein:
the testing assembly comprises a connecting assembly and a measuring head assembly (20), the measuring head assembly (20) is arranged on the connecting assembly, the measuring head assembly (20) is an FPC board with a testing conduction part, a conduction surface of the testing conduction part of the FPC board and a compression joint surface of a piece to be tested form an inclined included angle, and an insulating cushion (21) is connected to a position, close to the testing conduction part, of the FPC board;
the press block (30) is configured to secure the test assembly.
2. Impedance testing ram according to claim 1, characterized in that said pressing block (30) comprises a first pressing block (31) and a second pressing block (32), said second pressing block (32) fixing said probe assembly (20), said second pressing block (32) being connected to said first pressing block (31) and being able to move with respect to said first pressing block (31).
3. The resistance testing indenter of claim 2, wherein a support portion (33) supporting the test assembly is provided on top of the second press piece (32), and the support surface of the support portion (33) is a ramp (34).
4. The indenter of claim 3 wherein the angle of inclination of the ramp (34) with respect to the crimp face is between 10 ° and 40 °.
5. Impedance testing indenter according to claim 3, characterized in that the connection assembly comprises a pressure plate (10) pressing the FPC board against the inclined surface (34).
6. An impedance testing indenter according to claim 5, wherein the platen (10) is in magnetic attraction engagement with the ramp (34).
7. The resistance testing indenter of claim 3, wherein the support portion (33) is adapted to rest on top of the first pressure piece (31).
8. The impedance testing indenter of claim 2, wherein the second press block (32) is connected to the first press block (31) by a micro-guide (35).
9. The resistance testing indenter of claim 8, wherein a return spring is connected between the second pressure piece (32) and the first pressure piece (31).
Priority Applications (1)
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CN201910515470.4A CN110148369B (en) | 2019-06-14 | 2019-06-14 | Impedance test pressure head |
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CN201910515470.4A CN110148369B (en) | 2019-06-14 | 2019-06-14 | Impedance test pressure head |
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CN110148369A CN110148369A (en) | 2019-08-20 |
CN110148369B true CN110148369B (en) | 2022-10-25 |
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CN111244719A (en) * | 2020-03-06 | 2020-06-05 | 深圳精智达技术股份有限公司 | Crimping tool and check out test set |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN108562766A (en) * | 2018-03-15 | 2018-09-21 | 昆山精讯电子技术有限公司 | Chip testing crimp head and its probe mechanism |
CN208026762U (en) * | 2018-01-08 | 2018-10-30 | 深圳市立德通讯器材有限公司 | A kind of liquid crystal module testing impedance fixture |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US6940301B2 (en) * | 2003-12-12 | 2005-09-06 | Au Optronics Corporation | Test pad array for contact resistance measuring of ACF bonds on a liquid crystal display panel |
CN106940976B (en) * | 2016-12-23 | 2020-08-04 | 武汉精测电子集团股份有限公司 | Automatic crimping structure of FOG LCD screen |
CN109406934A (en) * | 2018-12-03 | 2019-03-01 | 武汉精毅通电子技术有限公司 | A kind of conducting tooling suitable for large scale display panel screen test |
CN109830198B (en) * | 2019-04-09 | 2024-04-16 | 苏州精濑光电有限公司 | Impedance detection device |
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN208026762U (en) * | 2018-01-08 | 2018-10-30 | 深圳市立德通讯器材有限公司 | A kind of liquid crystal module testing impedance fixture |
CN108562766A (en) * | 2018-03-15 | 2018-09-21 | 昆山精讯电子技术有限公司 | Chip testing crimp head and its probe mechanism |
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