CN110140438B - Substrate for maintenance - Google Patents

Substrate for maintenance Download PDF

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Publication number
CN110140438B
CN110140438B CN201780082249.3A CN201780082249A CN110140438B CN 110140438 B CN110140438 B CN 110140438B CN 201780082249 A CN201780082249 A CN 201780082249A CN 110140438 B CN110140438 B CN 110140438B
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China
Prior art keywords
maintenance
nozzle
substrate
control device
cpu52
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CN201780082249.3A
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Chinese (zh)
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CN110140438A (en
Inventor
樱山岳史
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Fuji Corp
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Fuji Corp
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H05K13/0069—Holders for printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/0895—Maintenance systems or processes, e.g. indicating need for maintenance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0257—Brushing, e.g. cleaning the conductive pattern by brushing or wiping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0763—Treating individual holes or single row of holes, e.g. by nozzle

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

The invention provides a maintenance substrate which can be used for maintenance except static electricity removal of a component assembling device by being conveyed by a conveying device of the component assembling device. The maintenance substrate is conveyed by a conveying device of the component mounting device. The maintenance substrate includes at least one of a brush for brushing a maintenance object, a cleaning nozzle held to be attachable to a work head of the component mounting apparatus and blowing air to the maintenance object, a pressure sensor for measuring a load of attaching and detaching the component to and from a suction nozzle attached to the work head and an attachment load of the component to the substrate, and a blower for blowing air to the work head.

Description

Substrate for maintenance
Technical Field
The present disclosure relates to a maintenance substrate for maintaining a component mounting apparatus.
Background
Various techniques have been proposed for a maintenance substrate used for maintenance of a component mounting apparatus. For example, patent document 1 below describes a component mounting apparatus as follows: the circuit board is conveyed by a conveyor, and the component supplied from the feeder is sucked by a suction nozzle and mounted on the circuit board. In the component mounting apparatus, a first maintenance unit is disposed for performing static electricity removal of the suction nozzle, the component mounting apparatus periodically conveys a second maintenance unit having a different removal speed or effect duration from the first maintenance unit, the first maintenance unit performs static electricity removal in an emergency, and when the second maintenance unit is conveyed to a predetermined position by the conveyor, the suction nozzle is moved to a maintenance position, and the second maintenance unit performs static electricity removal of the suction nozzle preventively.
The second maintenance unit is mounted on a conveying plate having the same width as the circuit board, and the component mounting apparatus conveys the conveying plate by loading the conveying plate on the conveyor to convey the conveying plate to the predetermined position.
Documents of the prior art
Patent document
Patent document 1: japanese patent No. 5679432
Disclosure of Invention
Problems to be solved by the invention
That is, with the component mounting machine described in patent document 1, the maintenance unit for performing the static electricity removal can be carried by the conveyor. However, it is also desirable to convey the maintenance unit other than the static electricity removal by a conveyor.
Therefore, the present disclosure has been made in view of the above problems, and an object thereof is to provide a maintenance substrate that can be used for maintenance other than static electricity removal in a component mounter by being conveyed by a conveying device of the component mounter.
Means for solving the problems
The present specification discloses a maintenance board to be carried by a carrying device of a component mounting apparatus, the maintenance board including at least one of a brush that brushes a maintenance object, a cleaning nozzle that is held to be attachable to a work head of the component mounting apparatus and blows air to the maintenance object, a first sensor that measures a positive pressure of air blown out from a suction nozzle attached to the work head or a negative pressure of air sucked by the suction nozzle, a second sensor that measures a mounting load of a component to be mounted on the board by the suction nozzle attached to the work head, and a blower that blows air to the work head.
Effects of the invention
According to the present disclosure, the maintenance substrate can be used for maintenance other than static electricity removal in the component mounting apparatus by being conveyed by the conveying apparatus of the component mounting apparatus.
Drawings
Fig. 1 is a perspective view of the component mounting apparatus 10.
Fig. 2 is a block diagram showing the electrical connection of the control device 20 and the electrical connection of the maintenance board 100.
Fig. 3 is a perspective view of the maintenance substrate 100.
Fig. 4 is a schematic view showing a first maintenance operation of the maintenance substrate 100.
Fig. 5 is a flowchart for realizing the first maintenance operation of the maintenance substrate 100.
Fig. 6 is a schematic view showing a second maintenance operation of the maintenance substrate 100.
Fig. 7 is a flowchart for implementing the second maintenance operation of the maintenance substrate 100.
Fig. 8 is a schematic view showing a third maintenance operation of the maintenance substrate 100.
Fig. 9 is a flowchart for realizing the third maintenance operation of the maintenance substrate 100.
Fig. 10 is a schematic view showing a fourth maintenance operation of the maintenance substrate 100.
Fig. 11 is a flowchart for realizing a fourth maintenance operation of the maintenance substrate 100.
Fig. 12 is a schematic diagram showing a fifth maintenance operation of the maintenance substrate 100.
Fig. 13 is a flowchart for realizing a fifth maintenance operation of the maintenance substrate 100.
Fig. 14 is a schematic view showing a sixth maintenance operation of the maintenance substrate 100.
Fig. 15 is a flowchart for realizing a sixth maintenance operation of the maintenance substrate 100.
Fig. 16 is a schematic view showing a seventh maintenance operation of the maintenance substrate 100.
Fig. 17 is a flowchart for realizing a seventh maintenance operation of the maintenance substrate 100.
Fig. 18 is a schematic view showing an eighth maintenance operation of the maintenance substrate 100.
Fig. 19 is a flowchart for realizing an eighth maintenance operation of the maintenance substrate 100.
Detailed Description
Preferred embodiments of the present disclosure are described below with reference to the drawings. In the drawings, the left-right direction is the X-axis direction, the front-rear direction is the Y-axis direction, and the up-down direction is the Z-axis direction.
(1) Structure of component mounting apparatus 10
Fig. 1 shows a component mounting apparatus 10. The component mounting apparatus 10 is an apparatus for performing a mounting operation of a component with respect to a substrate S. The component mounting apparatus 10 includes a substrate conveyance/holding device 12, a component pickup device 14, a tape reel component supply device 16, a component camera 18, a control device 20, and the like. Examples of the substrate S include a printed wiring board and a printed circuit board.
The substrate transport and holding device 12 includes a transport device 22 and a clamping device 24. The conveying device 22 includes: support plates 26, 26 provided at intervals in the front-rear direction of fig. 1 and extending in the left-right direction; and conveyor belts 28, 28 provided on the surfaces of the two support plates 26, 26 facing each other. The conveyor belts 28, 28 are looped around drive wheels and driven wheels provided on the left and right of the support plates 26, 26. The substrate S is placed on the upper surfaces of the pair of conveyors 28, and is conveyed from left to right. The chucking device 24 is a device that holds the substrate S. Thus, the substrate conveyance holding device 12 conveys the substrate S and fixedly holds the substrate S at the working position.
The component pickup device 14 includes a work head 30 and a work head moving device 32. The work head 30 is mounted on the front surface of the work head moving device 32. The work head moving device 32 includes an X-axis slider 34, a Y-axis slider 36, a Z-axis motor 38, and the like. The X-axis slider 34 is attached slidably in the left-right direction to the front surface of a Y-axis slider 36 slidable in the front-rear direction. The Y-axis slider 36 is slidably attached to a pair of right and left guide rails 40, 40 extending in the front-rear direction. Further, the guide rails 40, 40 are fixed to the inside of the component mounting apparatus 10. A pair of upper and lower guide rails 42, 42 extending in the left-right direction are provided on the front surface of the Y-axis slider 36, and the X-axis slider 34 is attached to the guide rails 42, 42 so as to be slidable in the left-right direction. As the X-axis slider 34 moves in the left-right direction, the working head 30 moves in the left-right direction, and as the Y-axis slider 36 moves in the front-back direction, the working head 30 moves in the front-back direction. The sliders 34 and 36 are driven by drive motors, not shown. Further, position sensors, not shown, are provided to the sliders 34 and 36, and the control device 20 controls the drive motors of the sliders 34 and 36 while inputting position information from the position sensors.
The work head 30 includes a nozzle holding portion 46, and the nozzle holding portion 46 supports the plurality of suction nozzles 44 for sucking the components so as to be movable up and down. The nozzle holding portion 46 is configured to be rotatable about an axis parallel to the Z axis. In the present embodiment, the work head 30 includes eight suction nozzles 44. The suction nozzle 44 sucks the component at the nozzle tip or releases the component sucked by the nozzle tip by pressure. The suction nozzle 44 is positioned at a predetermined phase of the rotational phase of the nozzle holding portion 46 by a holder lifting device using the Z-axis motor 38 as a driving source, and is engaged with the holder lifting device. Thereby, the suction nozzle 44 is moved up and down in the Z-axis direction (vertical direction) orthogonal to the X-axis and Y-axis directions.
The reel component supply device 16 includes a reel 48 around which a tape containing components is wound, and is detachably attached to the front of the component mounting device 10. The tape is wound off from the tape reel 48 and fed by the feeder section 50 to a pickup position where the tape can be picked up by the work head 30. The component camera 18 is disposed in front of the support plate 26 on the front side of the conveying device 22. The shooting range of the part camera 18 is above the part camera 18. When the suction nozzle 44 having sucked the component passes above the component camera 18, the component camera 18 captures an image of the state of the component sucked by the suction nozzle 44 and outputs the image data to the control device 20.
As shown in fig. 2, the control device 20 is configured as a microprocessor including a cpu (central Processing unit)52 as a center, and includes a rom (read Only memory)54 storing a Processing program and the like, an hdd (hard disk drive)56 storing various data, a ram (random Access memory)58 used as a work area, an input/output interface 60 for exchanging an electric signal with an external device, and the like, which are connected via a bus 62. The ROM54 stores processing programs for realizing flowcharts of fig. 5, 7, 9, 11, 13, 15, 17, and 19, which will be described later.
The control device 20 is connected to the conveying device 22, the gripping device 24, the work head 30, the work head moving device 32, the tape reel component supplying device 16, and the component camera 18 so as to be capable of bidirectional communication. Further, the control device 20 is connected to the Q-direction moving device 64, the positive/negative pressure supply device 66, the marker camera 68, the side camera 70, and the communication device 72 so as to be capable of bidirectional communication.
The Q-direction moving device 64 is a device that rotates the nozzle holding portion 46 around an axis parallel to the Z-axis, and is incorporated in the work head 30. The positive/negative pressure supply device 66 is a device that communicates the suction nozzle 44 with the negative pressure air passage and the positive pressure air passage, and has a structure in which the suction nozzle 44 sucks and holds the component by the negative pressure and the component is detached from the suction nozzle 44 by supplying a slight positive pressure. Further, the Q-direction moving device 64 and the positive/negative pressure supply device 66 constitute the component pickup device 14.
The marking camera 68 is attached to the work head 30 in a downward state, and moves in the X direction, the Y direction, and the Z direction together with the work head 30. In this way, mark camera 68 images an arbitrary position on the pickup position of feeder unit 50, on substrate S, or the like, and outputs the image data to control device 20. The side camera 70 is attached to the work head 30 in a state of being oriented in a direction parallel to a plane including the X axis and the Y axis. The side camera 70 includes, for example, a ccd (charge Coupled device) image sensor or the like, receives light reflected by a reflector 80 described later, and outputs image data of the side surface of the component sucked by the suction nozzle 44 to the control device 20. The communication device 72 performs bidirectional communication with a maintenance board 100, which will be described later, by wireless.
The control device 20 includes an image processing unit 74. The image processing unit 74 processes image data obtained by the part camera 18, the mark camera 68, and the side camera 70, and the control device 20 acquires various information from the image data.
(2) Action of the component mounting apparatus 10
In the component mounting apparatus 10, the component mounting operation is performed on the substrate S held by the substrate transport and holding apparatus 12 by the above-described configuration. Specifically, the substrate S is conveyed to the working position by the conveying device 22, and is fixedly held by the holding device 24 at the working position. Next, the mark camera 68 moves upward of the substrate S to photograph the substrate S. Thereby, information on the working position of the substrate S and the like is obtained. In addition, the reel component supplying device 16 supplies the components at the pickup position. The work head 30 moves above the component pickup position, and holds the component by the suction nozzle 44. Next, the suction nozzle 44 is photographed by the side camera 70. Further, the work head 30 holding the component is moved upward of the component camera 18, and the component held by the suction nozzle 44 is imaged by the component camera 18. Thereby, information on the holding position of the component and the like is obtained. Next, the working head 30 holding the elements is moved upward of the substrate S, and the error in the holding position of the substrate S, the error in the holding position of the elements, and the like are corrected. Then, the component is mounted on the substrate S by detaching the suction nozzle 44 from the component.
(3) Structure of substrate 100 for maintenance
Fig. 3 shows a maintenance substrate 100. The maintenance substrate 100 is a substrate used for maintenance of the component mounting apparatus 10, and is conveyed to the working position by the conveying apparatus 22 at the time of the maintenance, and is fixedly held at the working position by the holding apparatus 24.
The maintenance substrate 100 includes a substrate main body 102. The substrate main body 102 is a flat plate having a rectangular shape in plan view, and has a width L1 in the front-rear direction equal to the width of the substrate S. Thus, the maintenance substrate 100 is conveyed and held by the substrate conveyance holding device 12, similarly to the substrate S. The substrate body 102 is provided with a first hole 104, a second hole 106, a third hole 108, a fourth hole 110, and a fifth hole 112.
The first hole 104 is a stepped through hole. In the first hole 104, the lens cleaning nozzle 114 is held so as to be removable from the nozzle holding portion 46 of the work head 30. The lens cleaning nozzle 114 includes a nozzle body 116, a holding pipe 118, a flange 120, a lens cleaning brush 122, and the like. The nozzle body 116 is formed in a cylindrical shape. In a state where the lens cleaning nozzle 114 is held by the first hole 104, the longitudinal direction of the nozzle body 116 is aligned in the vertical direction. The holding tube 118 is provided to protrude from the first end surface of the nozzle body 116, and the lens cleaning nozzle 114 faces upward while being held by the first hole 104. An air passage is formed in the holding tube 118 to communicate with a second end surface of the nozzle body 116 opposite to the first end surface (the end surface on which the holding tube 118 is provided). The flange 120 is provided to protrude from the outer periphery of the first end surface (end surface provided with the holding tube 118) of the nozzle body 116 to form a flange of the first end surface (end surface provided with the holding tube 118) of the nozzle body 116. The flange 120 is loosely fitted into the first hole 104 in a state where the lens cleaning nozzle 114 is held by the first hole 104, and is locked to a step of the first hole 104. The lens cleaning brush 122 is provided on a second end surface of the nozzle body 116 opposite to the first end surface (the end surface on which the holding tube 118 is provided), and the lens cleaning nozzle 114 faces downward while being held by the first hole 104.
Thus, the lens cleaning nozzle 114 can be removed from the first hole 104 by moving the work head 30 upward after the holding pipe 118 of the lens cleaning nozzle 114 is held by the nozzle holding portion 46 of the work head 30. When the holding tube 118 of the lens cleaning nozzle 114 is held by the nozzle holding portion 46 of the work head 30, the air passage of the lens cleaning nozzle 114 communicates with the positive pressure air passage of the work head 30 via the positive/negative pressure supply device 66. Thus, in the lens cleaning nozzle 114, positive pressure air can be blown out from the second end surface (the end surface provided with the lens cleaning brush 122) of the nozzle body 116 on the opposite side of the first end surface (the end surface provided with the holding tube 118). Further, by moving the lens cleaning nozzle 114 held by the nozzle holding portion 46 of the work head 30 to above the first hole 104 and then moving the work head 30 downward, the lens cleaning nozzle 114 can be held again in the first hole 104 by simply inserting the lens cleaning nozzle 114 into the first hole 104.
The second hole 106 is a stepped through hole. Feeder cleaning nozzle 124 is held in second hole 106 so as to be removable from nozzle holding portion 46 of work head 30. Feeder cleaning nozzle 124 includes nozzle body 126, holding tube 128, flange 130, nozzle tip 132, and the like. Feeder cleaning nozzle 124 has the same structure as that of lens cleaning nozzle 114 described above except for nozzle tip 132. Further, the state in which feeder cleaning nozzle 124 is held by second hole 106 is the same as the state in which lens cleaning nozzle 114 is held by first hole 104.
That is, nozzle body 126, holding tube 128, and flange 130 of feeder cleaning nozzle 124 correspond to nozzle body 116, holding tube 118, and flange 120 of lens cleaning nozzle 114. Further, second hole 106 holding feeder cleaning nozzle 124 corresponds to first hole 104 holding lens cleaning nozzle 114. Therefore, in the description of feeder cleaning nozzle 124, the description of the portion substantially common to lens cleaning nozzle 114 is omitted.
Nozzle tip 132 is provided on a second end surface of nozzle body 126 on the opposite side of the first end surface (the end surface on which holding tube 128 is provided), and feeder cleaning nozzle 124 faces downward while being held by second hole 106. Nozzle tip 132 communicates with the air passage of feeder cleaning nozzle 124. Thus, when the holding pipe 128 of the feeder cleaning nozzle 124 is held by the nozzle holding portion 46 of the work head 30, the air passage of the feeder cleaning nozzle 124 communicates with the positive pressure air passage and the negative pressure air passage of the work head 30 via the positive/negative pressure supply device 66. Thus, in feeder cleaning nozzle 124, positive pressure air can be blown out from nozzle head 132 provided on the second end surface of nozzle body 126 opposite to the first end surface (the end surface provided with holding tube 128) and negative pressure air can be sucked into nozzle head 132.
The third hole 108 is a longitudinal hole having a predetermined depth. A load sensor 154, which will be described later, is provided in the third hole 108, and the spherical seat 134 having the load sensor is vertically slidably fitted therein. The fourth hole 110 is a through hole. An ejection port of a blower 156 described later communicates with the lower opening of the fourth hole 110. The fifth hole 112 is a through hole. A transducer 158 described later is provided at the lower opening of the fifth hole 112.
The maintenance substrate 100 includes a first arm 136 and a second arm 138 on the right side surface thereof. The first arm 136 and the second arm 138 are elongated. A first end portion in the longitudinal direction of the first arm portion 136 is pivotally supported by an output shaft 142 of the first motor 140 so as to be rotatable. Thereby, the first arm 136 can be shifted between the inverted state and the erected state with respect to the maintenance substrate 100. The first arm 136 of fig. 3 shows an inverted state, in which it is coplanar with the substrate main body 102. The first motor 140 is fixedly disposed on the lower surface of the substrate main body 102.
In the first arm 136, a first brush 144 and a second brush 146 are provided at a second end portion on the opposite side of the first end portion (the end portion pivotally supported by the output shaft 142 of the first motor 140) in the longitudinal direction thereof. The first brush 144 is provided on a surface of the first arm 136 facing upward in the upside-down state, among the six surfaces constituting the first arm 136, so as to face upward from the maintenance substrate 100. The second brush 146 is provided on a surface of the first arm 136 facing downward in the inverted state, among the six surfaces constituting the first arm 136, and faces downward from the maintenance substrate 100. That is, the two brushes 144 and 146 are erected on the two side surfaces facing each other in the short side direction of the first arm portion 136 (the vertical direction of the first arm portion 136 in the inverted state) at the second end portion of the first arm portion 136. The distance L2 from the two brushes 144 and 146 to the shaft support point of the output shaft 142 of the first motor 140 corresponds to the distance from the maintenance substrate 100 to the maintenance object when maintenance is performed by the first brush 144 or the second brush 146. Examples of the maintenance target include the suction nozzle 44, the side camera 70, and the reflector 80.
A first end portion in the longitudinal direction of the second arm portion 138 is pivotally supported by an output shaft 150 of the second motor 148 so as to be rotatable. Thereby, the second arm portion 138 can be shifted between the inverted state and the erected state with respect to the maintenance substrate 100. The second arm portion 138 of fig. 3 shows an inverted state, in which it is coplanar with the substrate main body 102. The second motor 148 is fixedly disposed on the lower surface of the substrate main body 102.
In the second arm portion 138, a third brush 152 is provided on an end surface of a second end portion on the opposite side of the first end portion (the end portion pivotally supported by the output shaft 150 of the second motor 148) in the longitudinal direction thereof. The third brush 152 is provided on a surface of the second arm portion 138 that faces forward in the inverted state, among the six surfaces constituting the second arm portion 138, and faces forward from the surface. The distance L3 from the third brush 152 to the shaft support point of the output shaft 150 of the second motor 148 corresponds to the distance from the maintenance substrate 100 to the maintenance object when the maintenance is performed by the third brush 152. As the maintenance target object, for example, there is a marker camera 68 or the like.
The first motor 140 is located rearward of the front side surface of the substrate main body 102. Further, the front side surface of the first arm 136 in the inverted state is also located rearward of the front side surface of the substrate main body 102. The second motor 148 is located forward of the rear side surface of the substrate main body 102. Further, the rear side surface of the second arm portion 138 in the inverted state is also located forward of the rear side surface of the substrate main body 102. With such a configuration, the front and rear end portions of the substrate main body 102 can be placed on the upper surfaces of the pair of conveyors 28, 28. Thus, the maintenance substrate 100 can be conveyed and held by the substrate conveyance holder 12, as in the case of the substrate S.
As shown in fig. 2, in addition to the first motor 140 and the second motor 148, the load sensor 154, the blower 156, the converter 158, the storage device 160, the battery 162, and the communication device 164 are also connected to the maintenance board 100 via the bus 166.
The load sensor 154 is provided in the third hole 108 of the base plate main body 102, and can measure a load applied from above to the spherical seat 134 in the vicinity of the upper opening of the third hole 108. The blower 156 is fixedly provided on the lower surface of the substrate main body 102 such that its discharge port communicates with the lower opening of the fourth hole 110 of the substrate main body 102. Thereby, the blower 156 can blow out strong wind upward from the upper opening of the fourth hole 110. The transducer 158 is fixedly provided on the lower surface of the substrate main body 102 such that the sensor portion thereof is disposed at the lower opening of the fifth hole 112 of the substrate main body 102. Thus, the transducer 158 can measure the positive pressure of the air blown out into the fifth hole 112 from the upper opening of the fifth hole 112 or the negative pressure of the air sucked in from the fifth hole 112 through the upper opening of the fifth hole 112. The storage device 160 is an HDD, a RAM, or the like, and can store various data. The battery 162 is a power source for the maintenance substrate 100. The communication device 164 can perform bidirectional communication with the communication device 72 of the control device 20 by wireless.
The maintenance board 100 may be electrically configured to be self-controllable by including a CPU, a ROM, and the like.
(4) Maintenance operations of the maintenance substrate 100
Next, an example of each maintenance operation of the maintenance substrate 100 will be described with reference to fig. 4 to 19. When each maintenance operation of the maintenance substrate 100 is performed, the maintenance substrate 100 is conveyed to the working position by the conveying device 22 as described above, and is fixedly held at the working position by the holding device 24. In fig. 4, 6, 8, 10, 12, 14, 16, and 18, a part of the drawing structure may be omitted, and the dimensional ratio of each drawn part may not be accurate.
(4-1) first maintenance operation of the maintenance substrate 100
As shown in fig. 4, the first maintenance operation of the maintenance substrate 100 refers to an operation of cleaning the suction nozzle 44 by brushing the suction nozzle 44 with the first brush 144 of the first arm 136. In the first maintenance operation of the maintenance substrate 100, the first arm 136 is in the inverted state. Thereby, the first brush 144 is directed upward from the substrate main body 102, and the suction nozzle 44 moves among the first brush 144 directed upward.
When the first maintenance operation of the maintenance substrate 100 is performed, the CPU52 of the control device 20 executes a processing program for realizing the flowchart of fig. 5. When this processing routine is executed, as shown in fig. 5, the CPU52 of the control device 20 performs the pre-cleaning image acquisition processing (step S100). In this process, the suction nozzle 44 of the cleaning target is imaged by the component camera 18. This obtains image data obtained by imaging the suction nozzle 44 before cleaning.
When the image data is acquired, the CPU52 of the control device 20 performs the cleaning process (step S102). In this process, the suction nozzle 44 to be cleaned is moved within the first brush 144, and the suction nozzle 44 is cleaned by the first brush 144. The movement of the suction nozzle 44 is performed by moving the work head 30 in the X direction (left-right direction) or the Y direction (front-back direction), or by moving the nozzle holding portion 46 in the Q direction (direction rotated about an axis parallel to the Z axis).
As shown in fig. 4, a projection 76 is provided in the center of the lower surface of the nozzle holding portion 46 of the working head 30 so as to project downward, and a head position recognition mark 78 is provided in the center of the lower surface of the projection 76. Since the head position recognition mark 78 can move within the first brush 144 by the movement of the work head 30 or the nozzle holding portion 46, similarly to the suction nozzle 44, cleaning can be performed by the first brush 144.
Returning to fig. 5, when the process of step S102 is performed, the CPU52 of the control device 20 performs the post-cleaning image acquisition process (step S104). In this process, the suction nozzle 44 of the cleaning target is imaged by the component camera 18. Thereby, image data obtained by imaging the cleaned suction nozzle 44 is acquired.
When the image data is acquired, the CPU52 of the control device 20 determines whether or not foreign matter is present in the suction nozzle 44 as the cleaning target (step S106). This determination is performed by comparing and comparing the image data before cleaning obtained in the process of step S100 with the image data after cleaning obtained in the process of step S104 by the image processing unit 74.
Here, when foreign matter is present in the nozzle 44 to be cleaned (yes in step S106), the CPU52 of the control device 20 performs the stop process (step S108). In this process, the CPU52 of the control device 20 ends the processing routine. However, the CPU52 of the control device 20 may repeatedly execute the processes of step S100 to step S106 in this process. Further, the number of repetitions is limited to a predetermined number of times determined in advance.
On the other hand, when there is no foreign object in the suction nozzle 44 as the cleaning target (no in step S106), the CPU52 of the control device 20 performs the side view image acquisition process (step S110). In this process, the side camera 70 images the side of the suction nozzle 44 to be cleaned. Thereby, image data obtained by imaging the side surface of the cleaned suction nozzle 44 is acquired. As shown in fig. 4, the side camera 70 receives the light reflected by the reflector 80 and outputs image data of the side surface of the suction nozzle 44 to the control device 20. Reflector 80 is mounted to work head 30.
Returning to fig. 5, when the processing of step S110 is performed, the CPU52 of the control device 20 determines whether or not the suction nozzle 44 to be cleaned is bent (step S112). This determination is performed based on the image data of the side surface of the suction nozzle 44 acquired in the processing of step S110.
Here, when the suction nozzle 44 to be cleaned is bent (yes in step S112), the CPU52 of the control device 20 performs the stop processing (step S108). On the other hand, if the suction nozzle 44 to be cleaned is not bent (no in step S112), the CPU52 of the control device 20 performs the history processing (step S114). In this process, the CPU52 of the control device 20 associates the image data acquired in each of the steps S100, S104, and S110 with the nozzle id (identification number) of the cleaning target nozzle 44 and stores the image data in the HDD56 or the like. However, by transmitting the image data and the nozzle ID to the maintenance board 100 via the communication devices 72 and 164, the image data and the nozzle ID may be stored in the storage device 160 of the maintenance board 100 in association with each other, or the image data and the nozzle ID may be stored in a pc (personal computer) or the like connected to the component mounting apparatus 10 in association with each other.
When the image data is stored, the CPU52 of the control device 20 determines whether all the suction nozzles 44 have been cleaned by the first brush 144 (step S116). This determination is made based on, for example, the nozzle ID of the suction nozzle 44 to be cleaned. Here, when all the suction nozzles 44 are not cleaned by the first brush 144 (no in step S116), the CPU52 of the control device 20 returns to step S100 and repeats the processes after step S100. On the other hand, when all the suction nozzles 44 have been cleaned by the first brush 144 (step S116: YES), the CPU52 of the control device 20 ends the processing routine.
As described above in detail, since the first brush 144 of the maintenance substrate 100 conveyed by the conveyance device 22 in the first maintenance operation of the maintenance substrate 100 is used in the first maintenance operation, it is not necessary to always secure a space for installing the first brush 144 in the component mounter 10, and therefore, the cost performance is high.
(4-2) second maintenance operation of the maintenance substrate 100
As shown in fig. 6, the second maintenance operation of the maintenance substrate 100 is an operation of cleaning the reflector 80 or the side camera 70 by brushing the reflector 80 with the first brush 144 of the first arm 136 and by brushing the side camera 70 with the second brush 146 of the first arm 136. In the second maintenance operation of the maintenance substrate 100, the first arm 136 is in the standing state. Thereby, the first brush 144 faces forward in a state of being separated from the substrate body 102, and the reflector 80 moves among the first brush 144 facing forward. Further, the second brush 146 is directed rearward in a state of being separated from the substrate main body 102, and the side camera 70 moves among the second brush 146 directed rearward.
In fig. 6, the suction nozzle 44 is not held by the nozzle holding portion 46, but the suction nozzle 44 may be held by the nozzle holding portion 46 when the first arm 136 does not contact the suction nozzle 44 when brushing the reflector 80 or the side camera 70.
When the second maintenance operation of the maintenance substrate 100 is performed, the CPU52 of the control device 20 executes a processing program for realizing the flowchart of fig. 7. When this processing routine is executed, as shown in fig. 7, the CPU52 of the control device 20 performs the pre-cleaning image acquisition processing (step S200). In this process, the reflector 80 is photographed by the side camera 70. Thus, image data obtained by imaging the reflector 80 before cleaning by the side camera 70 before cleaning is acquired.
When the image data is acquired, the CPU52 of the control device 20 performs the setup processing (step S202). In this process, the CPU52 of the control device 20 transmits a control signal to the maintenance board 100 via the communication devices 72 and 164, and drives the first motor 140 to set the first arm 136 in the standing state.
When the first arm 136 is in the standing state, the CPU52 of the control device 20 performs the cleaning process (step S204). In this process, the reflector 80 is moved among the first brushes 144, and the reflector 80 is cleaned by the first brushes 144. Further, the side camera 70 is moved within the second brush 146 and the side camera 70 is cleaned by the second brush 146. The movement of the reflector 80 and the side camera 70 is performed by moving the work head 30 in the X direction (left-right direction), the Y direction (front-back direction), or the Z direction (up-down direction).
When cleaning is performed, the CPU52 of the control device 20 performs a reverse process (step S206). In this process, the CPU52 of the control device 20 transmits a control signal to the maintenance board 100 via the communication devices 72 and 164, and drives the first motor 140 to set the first arm 136 in the inverted state.
When the first arm 136 is in the inverted state, the CPU52 of the control device 20 performs the post-cleaning image acquisition process (step S208). In this process, the reflector 80 is photographed by the side camera 70. Thereby, image data obtained by imaging the cleaned reflector 80 with the cleaned side camera 70 is acquired.
When the image data is acquired, the CPU52 of the control device 20 determines whether or not a foreign object is present on the reflector 80 or the side camera 70 (step S210). This determination is performed by comparing and comparing the image data before cleaning obtained in the process of step S200 with the image data after cleaning obtained in the process of step S208 by the image processing unit 74.
If there is a foreign object on the reflector 80 or the side camera 70 (yes in step S210), the CPU52 of the control device 20 performs the stop process (step S212). In this process, the CPU52 of the control device 20 ends the processing routine. However, in this process, the CPU52 of the control device 20 may repeatedly execute the processes of step S200 to step S210. Further, the number of repetitions is limited to a predetermined number of times determined in advance.
On the other hand, if there is no foreign object on the reflector 80 and the side camera 70 (no in step S210), the CPU52 of the control device 20 determines whether or not the suction nozzle 44 is bent (step S214). This determination is made based on the cleaned image data acquired in the processing of step S208. When the suction nozzles 44 are not held by the nozzle holding portion 46, the process of step S216, which will be described later, is executed without executing the process.
When the nozzle 44 is bent (yes in step S214), the CPU52 of the control device 20 performs the stop process (step S212). On the other hand, if the suction nozzle 44 is not bent (no in step S214), the CPU52 of the control device 20 performs the history processing (step S216). In this process, the CPU52 of the control device 20 stores the image data acquired in each of the above steps S200 and S208 in the HDD56 or the like. However, by transmitting the image data to the maintenance board 100 via the communication devices 72 and 164, the image data may be stored in the storage device 160 of the maintenance board 100, or may be stored in a PC or the like connected to the component mounting apparatus 10. After that, the CPU52 of the control device 20 ends the processing routine.
As described above in detail, since the first brush 144 and the second brush 146 of the maintenance substrate 100 conveyed by the conveyance device 22 during the second maintenance operation of the maintenance substrate 100 are used, it is not necessary to always secure a space for installing the first brush 144 and the second brush 146 in the component mounter 10, and therefore, the cost performance is high. Further, by performing the second maintenance operation of the maintenance substrate 100, cleaning by the operator can be omitted.
(4-3) third maintenance operation of the maintenance substrate 100
As shown in fig. 8, the third maintenance operation of the maintenance board 100 is an operation of brushing the part camera 18 with the lens cleaning brush 122 of the lens cleaning nozzle 114 and cleaning the part camera 18 by blowing positive pressure air to the part camera 18 through the air passage 168 provided in the lens cleaning nozzle 114. The third maintenance operation of the maintenance substrate 100 is performed in a state where the lens cleaning nozzle 114 is held by the nozzle holding portion 46 of the work head 30.
When the third maintenance operation of the maintenance substrate 100 is performed, the CPU52 of the control device 20 executes a processing program for realizing the flowchart of fig. 9. When this processing routine is executed, as shown in fig. 9, the CPU52 of the control device 20 performs the pre-cleaning image acquisition processing (step S300). In this process, the part camera 18 performs imaging before cleaning. Thereby, image data captured by the part camera 18 before cleaning is acquired.
When the image data is acquired, the CPU52 of the control device 20 performs the cleaning nozzle attachment process (step S302). In this process, the CPU52 of the control device 20 causes the nozzle holding portion 46 of the work head 30 to hold the lens cleaning nozzle 114 positioned in the first hole 104 of the maintenance substrate 100. When the lens cleaning nozzle 114 is held by the nozzle holding portion 46 of the work head 30, the air passage 168 of the lens cleaning nozzle 114 communicates with the positive pressure air passage of the work head 30 via the positive/negative pressure supply device 66, as described above.
After that, the CPU52 of the control device 20 performs the cleaning process (step S304). In this process, the part camera 18 is brushed by the lens cleaning brush 122 by moving the lens cleaning nozzle 114, and positive pressure air is blown from the lens cleaning nozzle 114 to the part camera 18 by driving the positive/negative pressure supply device 66. Thus, the component camera 18 is cleaned by the lens cleaning nozzle 114. The movement of the lens cleaning nozzle 114 is performed by moving the working head 30 in the X direction (left-right direction) or the Y direction (front-back direction), or by moving the nozzle holding portion 46 in the Q direction (direction of rotation about an axis parallel to the Z axis).
When the cleaning is performed, the CPU52 of the control device 20 performs post-cleaning image acquisition processing (step S306). In this process, the image of the cleaned part camera 18 is taken. Thereby, image data captured by the cleaned part camera 18 is acquired. In this process, in order to meet the imaging conditions in the process of step S300, the lens cleaning nozzle 114 is moved so that the lens cleaning nozzle 114 is not imaged by the component camera 18.
When the image data is acquired, the CPU52 of the control device 20 determines whether or not a foreign object is present in the part camera 18 (step S308). This determination is performed by comparing and comparing the image data before cleaning obtained in the process of step S300 and the image data after cleaning obtained in the process of step S306 with each other by the image processing unit 74.
Here, when there is a foreign object in the part camera 18 (yes in step S308), the CPU52 of the control device 20 performs the stop process (step S310). In this process, the CPU52 of the control device 20 ends the processing routine. However, in this process, the CPU52 of the control device 20 may repeatedly execute the processes of step S300 to step S308. Further, the number of repetitions is limited to a predetermined number of times determined in advance.
On the other hand, if there is no foreign object in the part camera 18 (no in step S308), the CPU52 of the control device 20 performs the cleaning nozzle return processing (step S312). In this process, the CPU52 of the control device 20 returns the lens cleaning nozzle 114 held by the nozzle holding portion 46 of the work head 30 to the first hole 104 of the maintenance substrate 100.
Thereafter, the CPU52 of the control device 20 performs history processing (step S314). In this process, the CPU52 of the control device 20 stores the image data acquired in each of the above steps S300 and S306 in the HDD56 or the like. However, by transmitting the image data to the maintenance board 100 via the communication devices 72 and 164, the image data may be stored in the storage device 160 of the maintenance board 100, or may be stored in a PC or the like connected to the component mounting apparatus 10. After that, the CPU52 of the control device 20 ends the processing routine.
As described above in detail, since the lens cleaning nozzle 114 of the maintenance substrate 100 conveyed by the conveying device 22 during the third maintenance operation of the maintenance substrate 100 is used in the third maintenance operation, it is not necessary to always secure a space for providing the lens cleaning nozzle 114 in the component mounter 10, and therefore, the cost performance is high. Further, by performing the third maintenance operation of the maintenance substrate 100, the component camera 18 can be cleaned by using the positive pressure air and the brush cleaning at the same time.
(4-4) fourth maintenance operation of the maintenance substrate 100
As shown in fig. 10, the fourth maintenance operation of the maintenance substrate 100 is an operation of blowing positive pressure air from the air passage 170 provided in the feeder cleaning nozzle 124 or sucking negative pressure air into the feeder unit 50 of the reel component supply device 16 through the air passage 170 by the feeder cleaning nozzle 124. The fourth maintenance operation of maintenance substrate 100 is performed in a state where feeder cleaning nozzle 124 is held by nozzle holding portion 46 of work head 30.
In the tape reel component supply device 16, the tape 82 wound off the tape reel 48 is passed through the guide 84 of the feeder section 50. If the edges of the belt 82 are cut off during this passage, belt wear debris 86 accumulates on the guide 84. Therefore, in the fourth maintenance operation of the maintenance substrate 100, the feeder unit 50 of the reel component supply device 16 is cleaned by blowing the belt wear debris 86 with positive pressure air from the feeder cleaning nozzle 124 or sucking the belt wear debris 86 with negative pressure air from the feeder cleaning nozzle 124. In the case of sucking the worn debris 86, the worn debris 86 is collected in the work head 30 by a cyclone type, a paper bag type, a filter, or the like.
In the fourth maintenance operation of the maintenance substrate 100, the CPU52 of the control device 20 executes a processing program for realizing the flowchart of fig. 11. When this processing routine is executed, as shown in fig. 11, the CPU52 of the control device 20 performs the cleaning nozzle attachment process (step S400). In this process, CPU52 of control device 20 causes nozzle holding unit 46 of work head 30 to hold feeder cleaning nozzle 124 positioned in second hole 106 of maintenance substrate 100. When the feeder cleaning nozzle 124 is held by the nozzle holding portion 46 of the work head 30, the air passage 170 of the feeder cleaning nozzle 124 communicates with the positive pressure air passage and the negative pressure air passage of the work head 30 via the positive/negative pressure supply device 66, as described above.
After that, the CPU52 of the control device 20 performs the cleaning process (step S402). In this process, (the nozzle head 132 of) the feeder cleaning nozzle 124 is moved to the upper side of the guide 84 of the feeder part 50 of the tape cartridge component supply device 16 to be cleaned by the movement of the working head 30 or the nozzle holding part 46, and the positive pressure supply device 66 is driven to blow out the positive pressure air from (the nozzle head 132 of) the feeder cleaning nozzle 124 or suck the negative pressure air into (the nozzle head 132 of) the feeder cleaning nozzle 124. Thereby, the feeder section 50 of the reel component supply device 16 is cleaned by the feeder cleaning nozzle 124. Further, since the belt abrasion debris 86 is easily sucked when the feeder cleaning nozzle 124 is caused to suck the negative pressure air, it is desirable to form the interval from the guide 84 of the feeder section 50 to the nozzle head 132 of the feeder cleaning nozzle 124 to be a predetermined distance.
When cleaning is performed, the CPU52 of the control device 20 performs a cleaning nozzle return process (step S404). In this process, CPU52 of control device 20 returns feeder cleaning nozzle 124 held by nozzle holding unit 46 of work head 30 to second hole 106 of maintenance substrate 100.
Thereafter, the CPU52 of the control device 20 performs history processing (step S406). In this processing, the CPU52 of the control device 20 associates a log indicating that the feeder unit 50 of the reel component supply device 16 to be cleaned is cleaned with the feeder ID of the reel component supply device 16 to be cleaned, and stores the log in the HDD56 or the like. However, by transmitting the log to the maintenance board 100 via the communication devices 72 and 164, the log may be stored in the storage device 160 of the maintenance board 100, or may be stored in a PC or the like connected to the component mounting apparatus 10. After that, the CPU52 of the control device 20 ends the processing routine.
As described above in detail, since the feeder cleaning nozzle 124 of the maintenance substrate 100 conveyed by the conveying device 22 at the time of the fourth maintenance operation is used in the fourth maintenance operation of the maintenance substrate 100, it is not necessary to always secure a space for providing the feeder cleaning nozzle 124 in the component mounter 10, and therefore, the performance is relatively high. Further, by performing the fourth maintenance operation of the maintenance substrate 100, cleaning by the operator can be omitted.
(4-5) fifth maintenance operation of the maintenance substrate 100
As shown in fig. 12, the fifth maintenance operation of the maintenance substrate 100 is an operation of acquiring load data of the suction nozzle 44 by the load sensor 154 in the third hole 108 by bringing the suction nozzle 44 into contact with the spherical seat 134 in the third hole 108.
In the work head 30, the suction nozzle 44 is configured to be movable relative to the nozzle holding portion 46 in the Z direction (vertical direction). Thus, even if the work head 30 is lowered after the suction nozzle 44 comes into contact with the component when the component is sucked from the tape component supply device 16, the lowering operation is absorbed by the relative movement of the suction nozzle 44 with respect to the nozzle holding portion 46. Further, even if the work head 30 is lowered after the component comes into contact with the substrate S when the component is mounted on the substrate S, the lowering operation is absorbed by the relative movement of the suction nozzle 44 with respect to the nozzle holding portion 46. Therefore, in the fifth maintenance operation of the maintenance substrate 100, the sliding resistance when the suction nozzle 44 moves relative to the nozzle holding portion 46 is acquired as the load data of the suction nozzle 44.
When the fifth maintenance operation of the maintenance substrate 100 is performed, the CPU52 of the control device 20 executes a processing program for realizing the flowchart of fig. 13. When this processing routine is executed, as shown in fig. 13, the CPU52 of the control device 20 performs the nozzle attachment process (step S500). In this process, the CPU52 of the control device 20 recognizes the nozzle ID of the suction nozzle 44 used for actual component mounting, and then causes the nozzle holding portion 46 of the work head 30 to hold the suction nozzle 44. The identification of the nozzle ID is performed by, for example, reading a QR code (registered trademark) or the like attached to the suction nozzle 44 by the marking camera 68 before the suction nozzle 44 is held by the nozzle holding portion 46. Further, the CPU52 of the control device 20 may be configured to cause the nozzle holding portion 46 of the work head 30 to hold the load measuring dedicated nozzle after recognizing the nozzle ID of the load measuring dedicated nozzle.
Thereafter, the CPU52 of the control device 20 performs a load measurement process (step S502). In this process, the CPU52 of the control device 20 lowers the suction nozzle 44 toward the spherical seat 134 of the maintenance substrate 100 by performing component suction of the suction nozzle 44 or component mounting of the suction nozzle 44, and brings the suction nozzle 44 into contact with the spherical seat 134. Such contact is performed based on the setting of a production program stored in the ROM54 or the like. Thus, the load sensor 154 acquires load data of the suction nozzle 44 and confirms the sliding operation or the stacking operation of the suction nozzle 44. When the load measuring nozzle is held by the nozzle holding portion 46 of the working head 30, the load measuring nozzle is brought into contact with the spherical seat 134 based on a measuring program stored in the ROM54 or the like. Thus, the load sensor 154 obtains load data of the load measuring nozzle.
When the load data is acquired, the CPU52 of the control device 20 performs image processing (step S504). In this process, the suction nozzle 44 or the load measurement-dedicated nozzle (hereinafter referred to as a measurement target nozzle) from which the load data is acquired is imaged by the component camera 18 or the side camera 70. Thus, image data obtained by imaging the mouth of the measurement object is obtained.
Thereafter, the CPU52 of the control device 20 determines whether or not there is a fracture in the measurement target mouth (step S506). This determination is performed based on the image data acquired in the processing of step S504.
Here, when the measurement target mouth is broken (yes in step S506), the CPU52 of the control device 20 performs the stop process (step S508). In this process, the CPU52 of the control device 20 ends the processing routine. On the other hand, if the measurement target mouth is not broken (no in step S506), the CPU52 of the control device 20 performs the mouth return process (step S510). In this process, the CPU52 of the control device 20 returns the measurement target nozzle held by the nozzle holding portion 46 of the work head 30 to the nozzle tray or the like.
Thereafter, the CPU52 of the control device 20 performs history processing (step S512). In this process, the CPU52 of the control device 20 acquires load data from the maintenance board 100 via the communication devices 72 and 164, associates the load data with the nozzle ID of the measurement target nozzle, and stores the load data in the HDD56 or the like. Further, the load data may be associated with the mouth ID and stored in a PC or the like connected to the component mounting apparatus 10. On the other hand, by transmitting the nozzle ID to the maintenance board 100 via the communication devices 72 and 164, the nozzle ID and the load data may be stored in the storage device 160 of the maintenance board 100 in association with each other. After that, the CPU52 of the control device 20 ends the processing routine.
As described above in detail, since the load sensor 154 of the maintenance substrate 100 conveyed by the conveyance device 22 during the fifth maintenance operation of the maintenance substrate 100 is used in the fifth maintenance operation, it is not necessary to always secure a space for providing the load sensor 154 in the component mounter 10, and therefore, the cost performance is high. Further, by performing the fifth maintenance operation of the maintenance substrate 100, the load data of the measurement target nozzle and the nozzle ID of the measurement target nozzle can be stored in association with each other.
(4-6) sixth maintenance operation of the maintenance substrate 100
As shown in fig. 14, the sixth maintenance operation of the maintenance substrate 100 is an operation of cleaning the nozzle holding portion 46 of the work head 30 by strong wind of the blower 156 blown upward from the fourth hole 110. When the suction nozzle 44 is held by the nozzle holding portion 46, the cleaning of the suction nozzle 44 is also performed by the sixth maintenance operation of the maintenance substrate 100.
In the sixth maintenance operation of the maintenance substrate 100, the CPU52 of the control device 20 executes a processing program for realizing the flowchart of fig. 15. When this processing routine is executed, as shown in fig. 15, the CPU52 of the control device 20 performs the pre-cleaning image acquisition processing (step S600). In this process, the component camera 18 images the nozzle holding portion 46 of the work head 30. Thereby, image data obtained by imaging the nozzle holding portion 46 of the working head 30 before cleaning is acquired.
When the image data is acquired, the CPU52 of the control device 20 performs the cleaning process (step S602). In this process, the CPU52 of the control device 20 transmits a control signal to the maintenance board 100 via the communication devices 72 and 164, and drives the blower 156. Further, the CPU52 of the control device 20 moves the work head 30 in the X direction (left-right direction) or the Y direction (front-back direction), or moves the nozzle holding portion 46 in the Q direction (direction of rotation about an axis parallel to the Z axis), so that the entire area of the nozzle holding portion 46 of the work head 30 passes above the fourth hole 110 of the maintenance substrate 100. Therefore, the strong wind of the blower 156 blown upward from the fourth hole 110 of the maintenance substrate 100 contacts the entire area of the nozzle holding portion 46 of the work head 30. Thus, the blower 156 cleans the nozzle holding portion 46 of the work head 30.
Then, the CPU52 of the control device 20 performs post-cleaning image acquisition processing (step S604). In this process, first, the CPU52 of the control device 20 transmits a control signal to the maintenance board 100 via the communication devices 72 and 164, and stops the blower 156. Further, the CPU52 of the control device 20 images the nozzle holding portion 46 of the work head 30 with the part camera 18. Thereby, image data obtained by imaging the nozzle holding portion 46 of the working head 30 after cleaning is obtained. The blower 156 may be stopped when the processing routine is ended.
When the image data is acquired, the CPU52 of the control device 20 determines whether or not a foreign object is present in the nozzle holding portion 46 of the work head 30 (step S606). This determination is performed by comparing and comparing the image data before cleaning obtained in the process of step S600 with the image data after cleaning obtained in the process of step S604 by the image processing unit 74.
Here, when foreign matter is present in the nozzle holding portion 46 of the work head 30 (yes in step S606), the CPU52 of the control device 20 performs the stop process (step S608). In this process, the CPU52 of the control device 20 ends the processing routine. However, in this process, the CPU52 of the control device 20 may repeatedly execute the processes of step S600 to step S606. Further, the number of repetitions is limited to a predetermined number of times determined in advance.
On the other hand, if there is no foreign object in the nozzle holding portion 46 of the work head 30 (no in step S606), the CPU52 of the control device 20 performs the history processing (step S610). In this process, the CPU52 of the control device 20 stores the image data acquired in each of the above steps S600 and S604 in the HDD56 or the like. However, by transmitting the image data to the maintenance board 100 via the communication devices 72 and 164, the image data may be stored in the storage device 160 of the maintenance board 100, or may be stored in a PC or the like connected to the component mounting apparatus 10. After that, the CPU52 of the control device 20 ends the processing routine.
As described above in detail, since the blower 156 of the maintenance substrate 100 conveyed by the conveying device 22 in the sixth maintenance operation of the maintenance substrate 100 is used in the sixth maintenance operation, it is not necessary to always secure a space for installing the blower 156 in the component mounter 10, and therefore, the cost performance is high. Further, by performing the sixth maintenance operation of the maintenance substrate 100, cleaning by the operator can be omitted.
(4-7) seventh maintenance operation of the maintenance substrate 100
As shown in fig. 16, the seventh maintenance operation of the maintenance board 100 is an operation of acquiring air pressure data of the suction nozzle 44 by the converter 158 connected to the lower opening of the fifth hole 112 by inserting the suction nozzle 44 into the fifth hole 112 from the upper opening of the fifth hole 112.
In the suction nozzle 44, the component is sucked and held by negative pressure at the time of component pickup, and the component is separated by slight positive pressure at the time of component mounting. Therefore, in the seventh maintenance operation of the maintenance substrate 100, the negative pressure data and the positive pressure data of the suction nozzle 44 are acquired as the air pressure data of the suction nozzle 44.
When the seventh maintenance operation of the maintenance substrate 100 is performed, the CPU52 of the control device 20 executes a processing program for realizing the flowchart of fig. 17. When this processing routine is executed, as shown in fig. 17, the CPU52 of the control device 20 performs the nozzle attachment process (step S700). In this process, the CPU52 of the control device 20 recognizes the nozzle ID of the suction nozzle 44 used for actual component mounting, and then causes the nozzle holding portion 46 of the work head 30 to hold the suction nozzle 44. When the suction nozzle 44 is held by the nozzle holding portion 46 of the work head 30, the suction nozzle 44 communicates with the negative pressure air passage and the positive pressure air passage of the work head 30 via the positive/negative pressure supply device 66, as described above. The nozzle ID is identified, for example, in the same manner as in the fifth maintenance operation of the maintenance substrate 100.
After that, the CPU52 of the control device 20 performs an air pressure measurement process (step S702). In this process, the CPU52 of the control device 20 lowers the suction nozzle 44 toward the fifth hole 112 of the maintenance board 100, so that the suction nozzle 44 is inserted into the fifth hole 112 and brought into close contact with the converter 158. Further, the CPU52 of the control device 20 drives the positive-negative pressure supply device 66 to blow out positive pressure air from the suction nozzle 44 or cause the suction nozzle 44 to suck negative pressure air. Thereby, the air pressure data of the suction nozzle 44 is acquired by the converter 158.
When the air pressure data is acquired, the CPU52 of the control device 20 performs image processing (step S704). In this process, the suction nozzle 44 (hereinafter, referred to as a measurement target nozzle) from which the air pressure data is acquired is imaged by the component camera 18 or the side camera 70. Thus, image data obtained by imaging the mouth of the measurement object is obtained.
Thereafter, the CPU52 of the control device 20 determines whether or not there is a fracture in the measurement target mouth (step S706). This determination is performed based on the image data acquired in the processing of step S704.
Here, when the measurement target mouth is broken (yes in step S706), the CPU52 of the control device 20 performs the stop processing (step S708). In this process, the CPU52 of the control device 20 ends the processing routine. On the other hand, if the measurement target mouth is not broken (no in step S706), the CPU52 of the control device 20 performs the mouth return process (step S710). In this process, the CPU52 of the control device 20 returns the measurement target nozzle held by the nozzle holding portion 46 of the work head 30 to the nozzle tray or the like.
Thereafter, the CPU52 of the control device 20 performs history processing (step S712). In this process, the CPU52 of the control device 20 acquires air pressure data from the maintenance board 100 via the communication devices 72 and 164, and stores the air pressure data in the HDD56 or the like in association with the nozzle ID of the measurement target nozzle. Further, it is also possible to associate the air pressure data with the nozzle ID and store it in a PC or the like connected to the component mounting apparatus 10. On the other hand, by transmitting the nozzle ID to the maintenance substrate 100 via the communication devices 72 and 164, the nozzle ID and the air pressure data may be stored in the storage device 160 of the maintenance substrate 100 in association with each other. After that, the CPU52 of the control device 20 ends the processing routine.
As described above in detail, since the converter 158 of the maintenance substrate 100 conveyed by the conveying device 22 at the time of the seventh maintenance operation is used in the seventh maintenance operation of the maintenance substrate 100, it is not necessary to always secure a space for providing the converter 158 in the component mounter 10, and therefore, the cost performance is high. Further, by performing the seventh maintenance operation of the maintenance substrate 100, the air pressure data of the measurement target nozzle can be stored in association with the nozzle ID of the measurement target nozzle.
In the seventh maintenance operation of the maintenance substrate 100, even when a nozzle necessary for acquiring air pressure data is held in the nozzle holding part 46 of the work head 30 in place of the nozzle 44, the air pressure data is acquired in the same manner as the nozzle 44.
(4-8) eighth maintenance operation of the maintenance substrate 100
As shown in fig. 18, the eighth maintenance operation of the maintenance substrate 100 is an operation of brushing the marker camera 68 with the third brush 152 of the second arm portion 138, blowing the strong wind of the blower 156 blown upward from the fourth hole 110 toward the marker camera 68, and cleaning the marker camera 68. In the eighth maintenance operation of the maintenance substrate 100, the second arm 138 is in the standing state. Thereby, the third brush 152 faces upward in a state of being separated from the substrate main body 102, and the marker camera 68 moves among the third brush 152 facing upward.
When the eighth maintenance operation of the maintenance substrate 100 is performed, the CPU52 of the control device 20 executes a processing program for realizing the flowchart of fig. 19. When this processing routine is executed, as shown in fig. 19, the CPU52 of the control device 20 performs the pre-cleaning image acquisition processing (step S800). In this process, the photographing by the marker camera 68 is performed. This obtains the image data before cleaning captured by the marker camera 68.
When the image data is acquired, the CPU52 of the control device 20 performs the setup processing (step S802). In this process, the CPU52 of the control device 20 transmits a control signal to the maintenance board 100 via the communication devices 72 and 164, drives the second motor 148, and sets the second arm 138 in the standing state.
When the second arm 138 is set upright, the CPU52 of the control device 20 performs the cleaning process (step S804). In this process, the cleaning of the marking camera 68 is performed by the third brush 152 by moving the marking camera 68 within the third brush 152. The movement of the mark camera 68 is performed by moving the work head 30 in the X direction (left-right direction) or the Y direction (front-back direction). Further, the CPU52 of the control device 20 transmits a control signal to the maintenance board 100 via the communication devices 72 and 164, and drives the blower 156. Further, the CPU52 of the control device 20 moves the work head 30 in the X direction (left-right direction) or the Y direction (front-back direction) to pass the entire area of the mark camera 68 above the fourth hole 110 of the maintenance board 100. In the fourth hole 110 of the maintenance substrate 100, strong wind of the blower 156 is blown upward. Thus, the strong wind of the blower 156 comes into contact with the entire area of the marker camera 68. Thus, the marker camera 68 is cleaned by the blower 156.
When the cleaning is performed, the CPU52 of the control device 20 performs post-cleaning image acquisition processing (step S806). In this process, first, the CPU52 of the control device 20 transmits a control signal to the maintenance board 100 via the communication devices 72 and 164, and stops the blower 156. Further, the CPU52 of the control device 20 performs shooting by the mark camera 68. Thereby, the cleaned image data captured by the marker camera 68 is acquired. The blower 156 may be stopped when the processing routine is ended.
When the image data is acquired, the CPU52 of the control device 20 determines whether or not a foreign object is present in the mark camera 68 (step S808). This determination is performed by comparing and comparing the image data before cleaning obtained in the process of step S800 with the image data after cleaning obtained in the process of step S806 by the image processing unit 74.
Here, when the marker camera 68 has a foreign object (yes in step S808), the CPU52 of the control device 20 performs the stop process (step S810). In this process, the CPU52 of the control device 20 ends the processing routine. However, in this process, the CPU52 of the control device 20 may repeatedly execute the processes of step S800 to step S808. Further, the number of repetitions is limited to a predetermined number of times determined in advance.
On the other hand, if no foreign object is present in the mark camera 68 (no in step S808), the CPU52 of the control device 20 performs the inversion process (step S812). In this process, the CPU52 of the control device 20 transmits a control signal to the maintenance board 100 via the communication devices 72 and 164, and drives the second motor 148 to set the second arm 138 in the inverted state.
When the second arm 138 is in the inverted state, the CPU52 of the control device 20 performs history processing (step S814). In this process, the CPU52 of the control device 20 stores the image data acquired in each of the above steps S800 and S806 in the HDD56 or the like. However, by transmitting the image data to the maintenance board 100 via the communication devices 72 and 164, the image data may be stored in the storage device 160 of the maintenance board 100, or may be stored in a PC or the like connected to the component mounting apparatus 10. After that, the CPU52 of the control device 20 ends the processing routine.
As described above in detail, since the third brush 152 and the blower 156 of the maintenance substrate 100 conveyed by the conveyance device 22 during the eighth maintenance operation are used in the eighth maintenance operation of the maintenance substrate 100, it is not necessary to always secure a space for installing the third brush 152 and the blower 156 in the component mounter 10, and therefore, the cost performance is high. Further, by performing the eighth maintenance operation of the maintenance substrate 100, the marker camera 68 can be cleaned by using both strong wind and brushing, and the cleaning by the operator can be omitted.
(5) Summary of the invention
As described above in detail, the maintenance substrate 100 can be used for maintenance other than static electricity removal in the component mounter 10 by being conveyed by the conveying device 22 of the component mounter 10. Further, in each maintenance operation of the maintenance substrate 100, it is possible to construct a structure in which cleaning records and various data traces can be automatically acquired by performing history processing (step S114, step S216, step S314, step S406, step S512, step S610, step S712, and step S814).
Incidentally, in the present embodiment, the lens cleaning nozzle 114 or the feeder cleaning nozzle 124 is an example of a cleaning nozzle. The first arm 136 or the second arm 138 exemplifies an arm. The first brush 144, the second brush 146, or the third brush 152 is an example of a brush. The converter 158 is an example of a first pressure sensor. The load sensor 154 is an example of the second pressure sensor.
(6) Others
The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention.
For example, the suction nozzle 44 for sucking components and releasing suction is not particularly limited to this, and may be a mechanical chuck, for example. In this case, the first maintenance operation of the maintenance substrate 100, the fifth maintenance operation of the maintenance substrate 100, or the sixth maintenance operation of the maintenance substrate 100 can be applied.
Further, if a configuration is provided in which a button provided on the maintenance board 100 is pressed by the working head 30 or the like, a control signal for starting maintenance, ending maintenance, or stopping maintenance can be input to the maintenance board 100 by pressing the button, and therefore the communication devices 72 and 164 can be omitted.
Description of the reference numerals
10 element assembling device
18 parts camera
22 conveying device
30 working head
46 mouth holding part
44 suction nozzle
68 mark camera
70 side camera
80 reflector
84 guide member
100 substrate for maintenance
114 lens cleaning nozzle
124 feeder cleaning nozzle
136 first arm portion
138 second arm portion
144 first brush
146 second brush
152 third brush
154 load cell
156 blower
158 converter
164 communication device
S substrate
Width of L1 maintenance substrate
L2 distance from the axle support point of the first arm to the first and second brushes
L3 is the distance from the shaft support point of the second arm to the third brush.

Claims (4)

1. A maintenance substrate to be carried by a carrying device of a component mounting apparatus, the maintenance substrate being characterized in that,
the surface of the maintenance substrate is provided with a hole capable of being provided with at least one of a cleaning nozzle, a first sensor, a second sensor and a blower,
an elongated arm portion is provided on a side surface of the maintenance board, a first end portion which is one end portion of the elongated arm portion is pivotally supported by the maintenance board so as to be rotatable, and the elongated arm portion is movable between an inverted state and an upright state with respect to the maintenance board, a brush for brushing a maintenance object is provided on a second end portion which is an end portion of the arm portion opposite to the first end portion,
the cleaning nozzle is held to be attachable to a work head of the component mounting apparatus and blows air to a maintenance object,
the first sensor measures a positive pressure of air blown out from a suction nozzle attached to the work head or a negative pressure of air sucked by the suction nozzle,
the second sensor measures a mounting load of a component to a substrate, the mounting load being generated by a suction nozzle attached to the work head,
the blower blows air to the work head.
2. The maintenance substrate according to claim 1,
the brush is erected upward from the maintenance substrate.
3. The maintenance substrate according to claim 1,
the brush is erected from at least one of an end surface in a longitudinal direction and two opposing side surfaces in a short-side direction of the arm portion at the second end portion of the arm portion,
the distance from the shaft support point of the arm portion to the brush corresponds to the distance from the maintenance substrate to the maintenance object.
4. The maintenance substrate according to any one of claims 1 to 3,
the maintenance board includes a communication device for transmitting a maintenance history to the outside.
CN201780082249.3A 2017-01-17 2017-01-17 Substrate for maintenance Active CN110140438B (en)

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PCT/JP2017/001344 WO2018134867A1 (en) 2017-01-17 2017-01-17 Maintenance board

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CN110140438B true CN110140438B (en) 2020-11-13

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US20190335630A1 (en) 2019-10-31
EP3573440B1 (en) 2023-06-21
JPWO2018134867A1 (en) 2019-11-07
EP3573440A4 (en) 2020-01-01
JP6903078B2 (en) 2021-07-14
EP3573440A1 (en) 2019-11-27
WO2018134867A1 (en) 2018-07-26
US11432443B2 (en) 2022-08-30
CN110140438A (en) 2019-08-16

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