CN110137524A - A kind of metal-based compound bipolar plates substrate and preparation method thereof - Google Patents
A kind of metal-based compound bipolar plates substrate and preparation method thereof Download PDFInfo
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- CN110137524A CN110137524A CN201910345287.4A CN201910345287A CN110137524A CN 110137524 A CN110137524 A CN 110137524A CN 201910345287 A CN201910345287 A CN 201910345287A CN 110137524 A CN110137524 A CN 110137524A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M8/00—Fuel cells; Manufacture thereof
- H01M8/02—Details
- H01M8/0202—Collectors; Separators, e.g. bipolar separators; Interconnectors
- H01M8/0204—Non-porous and characterised by the material
- H01M8/0206—Metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M8/00—Fuel cells; Manufacture thereof
- H01M8/02—Details
- H01M8/0202—Collectors; Separators, e.g. bipolar separators; Interconnectors
- H01M8/0204—Non-porous and characterised by the material
- H01M8/0213—Gas-impermeable carbon-containing materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M8/00—Fuel cells; Manufacture thereof
- H01M8/02—Details
- H01M8/0202—Collectors; Separators, e.g. bipolar separators; Interconnectors
- H01M8/0204—Non-porous and characterised by the material
- H01M8/0221—Organic resins; Organic polymers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M8/00—Fuel cells; Manufacture thereof
- H01M8/02—Details
- H01M8/0202—Collectors; Separators, e.g. bipolar separators; Interconnectors
- H01M8/0204—Non-porous and characterised by the material
- H01M8/0223—Composites
- H01M8/0226—Composites in the form of mixtures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M8/00—Fuel cells; Manufacture thereof
- H01M8/02—Details
- H01M8/0202—Collectors; Separators, e.g. bipolar separators; Interconnectors
- H01M8/0204—Non-porous and characterised by the material
- H01M8/0223—Composites
- H01M8/0228—Composites in the form of layered or coated products
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/30—Hydrogen technology
- Y02E60/50—Fuel cells
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The present invention provides metal-based compound bipolar plates substrates of a kind of low contact resistance and preparation method thereof, and preparation method is the following steps are included: S1) prepares coating electrocondution slurry；S2) coated conductive slurry is coated with to simultaneously precuring on the metallic substrate；S3 it) adds transition zone and carries out curing process, to form the polymer-matrix electric conduction glue-line of covering on the metallic substrate.Using technical solution of the present invention, the super thin metal composite dual-electrode plates substrate with low contact resistance can be prepared, while this method overcomes solid phase method demoulding difficulty, the low disadvantage of production efficiency can carry out serialization large-scale production.
Description
Technical field
The present invention relates to the technical field of fuel cell, it is specifically related to a kind of metal-based compound bipolar plates substrate and one
The preparation method of kind metal-based compound bipolar plates substrate.
Technical background
Proton Exchange Membrane Fuel Cells (PEMFC) has high power density, high-energy conversion efficiency, cold-starting, environment
The advantages that friendly is a kind of fuel cell for most promising to be the power source of electric car.PEMFC is restricted at present is difficult to business
Change the principal element of application first is that its cost is too high；Second is that its gravimetric specific power and volumetric specific power are lower.Branch is played in PEMFC
Support, afflux, segmentation oxidant and reducing agent act on and guide the Oxidizing and Reducing Agents conduction that electrode surface flows in battery
Partition is called bipolar plates, accounts for about the 70-80% of entire PEMFC total weight and the 40-50% of totle drilling cost.Therefore have excellent performance and
Low-cost bipolar plates can help to the commercial applications of PEMFC.Three kinds of bipolar plates common in PEMFC include stone at present
The advantages of black plate, metal plate and composite dual-electrode plates, wherein composite dual-electrode plates combine pure graphite plate and metal double polar plates, has resistance to
The features such as burn into is small in size, light weight, high intensity is the trend of the following bipolar plates development.U.S.'s Los Alamos National Laboratory
The advantages of room develops a kind of metal-based compound bipolar plates, combines the materials such as porous graphite, polycarbonate, stainless steel；Davis
A kind of preparation method for manufacturing metal-based compound bipolar plates is proposed, is suppressed using material injections such as aluminium sheet, powdered carbon and polypropylene
It forms；V.Mehta etc. using multi-step technique, which includes processes such as punching press, hot pressing, baking, silk-screen printing, cold pressings,
Develop the compound bipolar plates using stainless steel as substrate.
Composite dual-electrode plates combine the advantages of pure graphite plate and metal double polar plates, and battery summation watt rating also has clear improvement,
But for the non-metallic part of Composite Double plate (C-base composte material), solid phase method heat-die compaction mostly is used with solid powder raw material
Standby technique, demoulding is difficult, and production efficiency is relatively low.Meanwhile the C-base composte material of this technique preparation, contact resistance is bigger than normal, leads
It causes internal resistance of cell loss excessive, reduces energy content of battery efficiency.Therefore, the bipolar plates of conductivity high (contact resistance is small) how to be prepared
Material is that the preparation field of composite dual-electrode plates needs key problems-solving.
Summary of the invention
To solve the problems, such as current composite dual-electrode plates, the present invention provides a kind of metal-based compound bipolar plates of low contact resistance
Substrate and a kind of preparation method that metal-based compound bipolar plates substrate is prepared with wet process method coating technique, not only can effectively drop
Low material resistance, and have it is at low cost, can scale serialization preparation the characteristics of.
The technical solution of first aspect present invention provides a kind of metal-based compound bipolar plates substrate of low contact resistance, gold
Belong to base composite dual-electrode plates substrate to be made of the polymer-matrix electric conduction glue-line of metallic substrate layer and covering on the metallic substrate.
The technical solution of second aspect of the present invention provides a kind of metal-based compound bipolar plates substrate of low contact resistance
Preparation method, comprising the following steps:
S1) prepares coating electrocondution slurry；
S2) coated conductive slurry is coated with to simultaneously precuring on the metallic substrate；
S3 it) adds transition zone and carries out curing process, to form the polymer-matrix electric conduction glue-line of covering on the metallic substrate.
Floating coat electrocondution slurry is by binder, conductive material and dispersion in the above-mentioned technical solutions, it is preferable that step S1)
Agent composition, the configuration method of coated conductive slurry includes: S1-1) configuration binder solution: the binder of certain mass is weighed, is pressed
Plan binder shared by mass ratio be added calculate quality dispersing agent, by the two mix and binder all dissolution after to
With；S1-2 it) configures coated conductive slurry: the conductive material of three kinds of different-grain diameters being weighed respectively in calculating ratio, then by S1-
1) conductive material of the binder solution and three kinds of different-grain diameters prepared in is mixed in calculating ratio, and uniform coated conductive is made
Slurry.
In any of the above-described technical solution, it is preferable that step S2) it include: to starch the coated conductive prepared in S1) step
Material, after being coated with out 100-1000 micron thickness coating on the metallic substrate, is placed in 60-100 DEG C of baking oven, carries out removing solvent cures
Processing；By weight method, weight-loss ratio is calculated, when weightlessness is 70-90%, conductive adhesive layer is in semi-cured state, takes out coating
Sheet material is spare.
In any of the above-described technical solution, it is preferable that the preparation method of low contact resistance metal-based compound bipolar plates substrate,
It is characterized in that, step S3) include: S3-1) configuration transition zone slurry；S3-2) to S2) step is through semi-solid preparation obtained by precuring
Configured transition zone slurry is spread evenly across coated sheet surface by coated sheet, and coating thickness is not more than 10 μm, then will
Coated sheet is placed in baking oven, after heat treatment 0.5-1 hours, carries out concora crush processing with press in 60-100 DEG C；Finally, by sheet material in
Solidify 1-2 hours under the conditions of 100-120 DEG C of temperature, polymer-matrix electric conduction glue-line with good conductivity is finally made.
In any of the above-described technical solution, it is preferable that metallic substrate layer is with a thickness of 50-500 microns and metallic substrate layer is
Metal foil, metal foil are one of the following: stainless steel foil, aluminium foil, titanium foil, copper foil, silver foil.
In any of the above-described technical solution, it is preferable that the particle size range of three kinds of conductive materials is respectively 10-60 μm, 1-5 μm
And 20-100nm.Conductive material be following material one of or combination: natural blocky graphite, crystalline flake graphite, composite graphite, centre
Phase carbon microspheres, silver powder, bronze, copper powder, conductive powdered carbon (such as acetylene black, Ketjen black), carbon nanotube, carbon fiber, graphene.
Wherein, above-mentioned " combination " refer to enumerate it is any several in material.
The proportional region of several partial size conductive materials are as follows: 10-20 μm of partial size of conductive material ratio is 70-90%；Partial size
1-5 μm of conductive material ratio is 5-15%；The conductive material ratio of partial size 20-100nm is 5-15%；Conductive material, bonding
Agent, dispersing agent mass ratio are 100:(10-30): (300-900).
In any of the above-described technical solution, it is preferable that transition zone slurry is made of conductive material, binder and dispersing agent,
Transition zone slurry configuration method includes: by the conductive material of high conductivity (conductivity is greater than 50S/cm), partial size small (less than 1 μm)
It is weighed respectively in calculating ratio, the binder solution prepared in S1-1) and conductive material is mixed in calculating ratio then, used
Various materials are mixed and are mixed by the modes such as grinding, ball milling, homogenate or stirring, and it is spare that exquisiteness, uniform coating sizing-agent is made.
In any of the above-described technical solution, it is preferable that step S3) in transition zone wet end furnish be conductive material, bonding
Agent, dispersing agent mass ratio are 100:(1-5): (800-900)；Step S3) in prepare the conductive material of transition zone slurry as height
The conductive material of electric conductivity (conductivity is greater than 50S/cm), partial size small (less than 1 μm), graphite powder, acetylene such as partial size lower than 1 μm
The combination of one or more of black, Ketjen black, carbon nanotube, graphene etc..
In any of the above-described technical solution, it is preferable that the coating method of the transition zone slurry in step S3 be selection blade coating,
The modes such as spraying, brushing, dip-coating, silk-screen printing, micro- intaglio plate coating, extrusion coated.
In any of the above-described technical solution, it is preferable that binder is common high polymer binder in step S1, including but
Be not limited to polyvinyl alcohol (PVA), polytetrafluoroethylene (PTFE) (PTFE), sodium carboxymethylcellulose (CMC), polyolefins (PP, PE and other
Copolymer), Kynoar (PVDF), modified SBR rubber, one or more of polyurethane etc. mixture.
In any of the above-described technical solution, it is preferable that dispersing agent described in step S1 is common organic solvent, including hexamethylene
Alkane, ethyl alcohol, acetone, N, dinethylformamide (DMF), such as N, N- dimethyl acetamide (DMF), N- first class pyrrolidones, stone
The mixture of one or more of oily ether or dimethylbenzene etc..
In any of the above-described technical solution, it is preferable that step S2) described in coating method include but is not limited to scratch, spray
Painting, brushing, dip-coating, silk-screen printing, extrusion coated, micro- intaglio plate coating etc..
In any of the above-described technical solution, it is preferable that step S3) described in prepare the conductive material of transition zone slurry as height
The conductive material of electric conductivity (conductivity is greater than 50S/cm), partial size small (less than 1 μm), graphite powder, acetylene such as partial size lower than 1 μm
The combination of one or more of black, Ketjen black, carbon nanotube, graphene etc..
Compared with prior art, the beneficial effects of the invention are as follows technical solution of the present invention is used, can prepare has
The super thin metal composite dual-electrode plates substrate of low contact resistance, while this method overcomes solid phase method demoulding difficulty, production efficiency is low
The shortcomings that, serialization large-scale production can be carried out.
Specific embodiment
Below by Application Example, the invention will be further elaborated.
The embodiment of first aspect present invention provides a kind of metal-based compound bipolar plates substrate of low contact resistance, metal
Base composite dual-electrode plates substrate is made of metallic substrate layer and polymer-matrix electric conduction glue-line.
The embodiment of second aspect of the present invention provides a kind of system of the metal-based compound bipolar plates substrate of low contact resistance
Preparation Method, comprising the following steps: S1) prepares coating electrocondution slurry；
S2) coated conductive slurry is coated with to simultaneously precuring on the metallic substrate；
S3 it) adds transition zone and carries out curing process, to form the polymer-matrix electric conduction glue-line of covering on the metallic substrate.
The preparation method of metal-based compound bipolar plates substrate of the present invention, using metallic substrate layer as supporting layer (gold
Category base layer thickness is 50-500 microns and metallic substrate layer is metal foil), one layer of electric conductivity is coated on the metal foil
The good coated conductive slurry of energy is coated the transition zone of one layer of high conductivity in coated conductive slurry semi-cured state to reduce
Material resistance.Specific preparation process is as follows:
S1) the preparation of coated conductive slurry:
The coated conductive slurry is made of binder, conductive material, dispersing agent.
S1-1 it) configures binder solution: weighing the binder solid powder of certain mass, according to plan quality shared by binder
The dispersing agent for calculating quality is added in ratio, and after the two is sufficiently mixed, to be bonded dose of powder is stand-by after all dissolving.
S1-2 it) configures coating paste: the conductive material of three kinds of different-grain diameters is weighed respectively in calculating ratio, then will
S1-1 the binder solution and conductive material prepared in) are mixed in calculating ratio, using the side such as grinding, ball milling, homogenate or stirring
Various materials are mixed and are mixed by formula, and it is spare that exquisiteness, uniform coating sizing-agent is made.
Above-mentioned S1-1) in step:
The binder is common high polymer binder, including but not limited to polyvinyl alcohol (PVA), polytetrafluoroethylene (PTFE)
(PTFE), sodium carboxymethylcellulose (CMC), polyolefins (PP, PE and other copolymers), Kynoar (PVDF), modification
SBR rubber, polyurethane etc..
The dispersing agent is common organic solvent, including hexamethylene, ethyl alcohol, acetone, N, dinethylformamide (DMF),
The mixing of one or more of such as N, N- dimethyl acetamide (DMF), N- first class pyrrolidones, petroleum ether or dimethylbenzene
Object.
Above-mentioned S1-2) in step:
The conductive material is the combination of the conductive material of three kinds of different-grain diameters, and particle size range is respectively 10-60 μm, 1-
5 μm and 20-100nm.The conductive material can be natural blocky graphite, crystalline flake graphite, composite graphite, mesocarbon microspheres, silver
Powder, bronze, copper powder, one or more of conductive powdered carbon (such as acetylene black, Ketjen black), carbon nanotube, carbon fiber, graphene
Combination.The proportional region of several partial size conductive materials are as follows: 10-20 μm of bulky grain conductive material ratio of partial size is 70-
90%；Granular conducting material ratio is 5-15% in 1-5 μm of partial size；Partial size 20-100nm little particle conductive material ratio is 5-
15%.
The conductive material, binder, dispersing agent mass ratio are 100:(10-30): (300-900).
S2) the coating and prebake of coated conductive slurry on the metallic substrate
The coated conductive slurry that will be prepared in S1) step, is coated with out 100-1000 micron thickness on super thin metal foil
Coating.The sample that coating is finished, is placed in baking oven, and carrying out removing solvent cures processing treatment temperature is 60-100 DEG C, passes through title
Weight method, calculates weight-loss ratio, and when weightlessness is 70-90%, conducting resinl is in semi-cured state, and it is spare to take out coated sheet.
Above-mentioned steps S2) in, metal foil has been mainly support, has obstructed the effects of gas infiltration, including but not limited to not
Become rusty steel foil, aluminium foil, titanium foil, copper foil, silver foil etc., and the metallic substrate layer is with a thickness of 50-500 microns.
Above-mentioned steps S2) in, the coating method includes but is not limited to blade coating, spraying, silk-screen printing, extrusion coated, micro-
Intaglio plate coating etc..
S3 it) adds transition zone and carries out curing process
In order to further decrease the contact resistance of bipolar plate coating, in coated sample solidification process, using increase transition
The method of layer is modified processing.Can be played the role of by increasing transition zone by two, first is that increasing " effective " contact, second is that increasing surface
Electric conductivity can inevitably occur " to be segregated " in the curing process because of the conductive slurries being grouped as by solid-liquid multiple groups
Inevitably there is slight sinking in phenomenon, conductive solid particles, high molecular component moves to coating surface, material is caused to connect
Resistive of getting an electric shock is big, by adding the transition zone of one layer of high conductivity, can improve problem above.
Specific step is as follows:
Taking out above-mentioned S2) configured transition zone slurry is spread evenly across piece by the coated sheet of precuring obtained by step
Material surface, coating thickness control within 10 μm, sheet material are then placed in baking oven, in 60-100 DEG C of heat treatment 0.5-1 Hour
Afterwards, concora crush processing is carried out with press；Finally, sheet material is solidified 1-2 Hour at 100-120 DEG C, finally obtained electric conductivity is good
Polymer-matrix electric conduction glue-line.
The transition zone slurry composition is similar with S1) step coated conductive slurry, by conductive material, binder and dispersing agent
Composition.
The conductive material of high conductivity (conductivity is greater than 50S/cm), partial size small (less than 1 μm) is distinguished in calculating ratio
It weighs, then mixes the binder solution prepared in S1-1) and conductive material in calculating ratio, using grinding, ball milling, homogenate
Or the modes such as stirring, various materials are mixed and are mixed, it is spare that exquisiteness, uniform coating sizing-agent is made.
Transition zone slurry composition and S1) step coated conductive slurry difference be:
1) conductive material of the transition zone slurry conductive material small using high conductivity (conductivity is greater than 50S/cm), partial size
For, such as the combination of one or more of graphite powder of the partial size lower than 1 μm, acetylene black, Ketjen black, carbon nanotube, graphene.
2) binder proportion is lower than S1) step floating coat electrocondution slurry ratio, as far as possible raising conductive material ratio, to improve
Electric conductivity.The transition zone wet end furnish is that conductive material, binder, dispersing agent mass ratio are 100:(1-5): (800-
900)。
Binder, dispersing agent S1 in transition zone slurry) material described in step floating coat electrocondution slurry.
The modes such as blade coating, spraying, brushing, dip-coating, micro- intaglio plate coating, extrusion coated may be selected in the method for adding transition zone,
With uniformly preferential.Opportunity of coating selects in S1) stage of step floating coat semi-solid preparation, coating surface situation can be destroyed too early,
Will lead to sprayed particle too late can not effectively bond with coating；After coating, concora crush is carried out under spreader bar, is embedded in conductive particle
Coating further improves interface cohesion, reduces contact resistance.
In one particular embodiment of the present invention, the preparation method of the metal-based compound bipolar plates substrate of low contact resistance
Include:
1. the coating allotment of conductive slurries
A configures binder solution: weighing 30 grams of Kynoar (PVDF) solid powders, 270g N- first class pyrroles is added
Alkanone (NMP) solvent after the two is sufficiently mixed, after PVDF powder all dissolution, obtains the PVDF solution that concentration is 10%.
B configures conductive coating slurry: weighing composite graphite 80g, Ketjen black 10g and conduction charcoal 10g is placed in into reaction kettle, add
Enter PVDF solution 300g, add NMP 100g, opening stirring mixes binder tentatively with conductive material, then by gained
Mixture is transferred to ball mill, and ball milling 6 hours, the slurries after mixing should be without obvious distribution of particles, and slurries are fine and smooth and uniform；
2. being coated with
100 μm of stainless steel band of thickness is cut into suitable size, is laid on film applicator；Scraper is adjusted to 300 microns；
Suitable deployed conductive slurries are added to metallic substrates one end；Starting film applicator is scratched, and coating finishes.
3. spraying is modified and carries out curing process
Coated sample is placed in baking oven, the rear temperature that is arranged is 60 DEG C, and is started to warm up；When oven temperature reaches
At 100 DEG C, coating quality variation is recorded at any time, when reaching dispersing agent NMP weight-loss ratio 80% or so, coating surface is begun to change into
State is solidified, sprays configured good transition zone slurry-carbon nano tube dispersion liquid (configuration method: in step 1. A at this time
1 gram of PVDF solution, the carbon nanotube and 90gNMP, ultrasonic mixing of 10 grams of addition are uniform), coating thickness is controlled at 10 μm.Spraying
Finish to continue to be put into 120 DEG C of baking ovens by bipolar plate sample and keep the temperature 30 minutes, coating surface is allowed to harden, it is rear using 10 tons of pressure into
Row concora crush；It is fully cured 2 hours after concora crush at 150 DEG C.In order to compare, the another production sample modified without spraying, front
Reason process is the same as the 1. 2. and 3. part other than spraying.
4. properties of sample characterizes
The detection of contact resistance uses (GB/T 20042.6-2011) the method
1 different disposal process combining bipolar plates contact resistance of table
Relative to the thickness of graphite bi-polar plate millimeter magnitude, the thickness range of coating can be controlled by the way of blade coating
Tens to hundreds of microns, to realize the preparation of ultra-thin bipolar plate material.
The present invention is not limited to the above embodiments, on the basis of technical solution disclosed by the invention, to therein one
The replacement and deformation that a little technical characteristics are made, are within the scope of the invention.
Claims (10)
1. a kind of metal-based compound bipolar plates substrate of low contact resistance, which is characterized in that the metal-based compound bipolar plates base
Material is made of metallic substrates and the polymer-matrix electric conduction glue-line being covered in the metallic substrates.
2. a kind of preparation method of the metal-based compound bipolar plates substrate of low contact resistance, which comprises the steps of:
S1) prepares coating electrocondution slurry；
S2) coated conductive slurry is coated with to simultaneously precuring on the metallic substrate；
S3 it) adds transition zone and carries out curing process, to form the polymer-matrix electric conduction glue-line being covered in the metallic substrates.
3. the preparation method of the metal-based compound bipolar plates substrate of low contact resistance according to claim 2, feature exist
The coated conductive slurry described in the step S1) is made of binder, conductive material and dispersing agent, coated conductive slurry
Configuration method includes:
S1-1 it) configures binder solution: weighing the binder of certain mass, mass ratio shared by binder, which is added, according to plan calculates
The dispersing agent of quality mixes the two and stand-by after binder all dissolution；
S1-2 it) configures coated conductive slurry: the conductive material of three kinds of different-grain diameters is weighed respectively in calculating ratio, then will
S1-1 the conductive material of the binder solution and three kinds of different-grain diameters prepared in) is mixed in calculating ratio, and uniform coating is made
Electrocondution slurry.
4. the preparation method of the metal-based compound bipolar plates substrate of low contact resistance according to claim 2, feature exist
Include: in the step S2)
The coated conductive slurry that will be prepared in S1) step is set after being coated with out 100-1000 micron thickness coating on the metallic substrate
In 60-100 DEG C of baking oven, removing solvent cures processing is carried out；By weight method, weight-loss ratio is calculated, when weightlessness is 70-90%,
It is spare to take out coated sheet.
5. the preparation method of the metal-based compound bipolar plates substrate of low contact resistance according to claim 2, feature exist
Include: in the step S3)
S3-1 transition zone slurry) is configured；
S3-2) to S2) coated sheet of the step through semi-solid preparation obtained by precuring, configured transition zone slurry is spread evenly across
Coated sheet surface, coating thickness are not more than 10 μm, the coated sheet are then placed in baking oven, are heat-treated in 60-100 DEG C
After 0.5-1 hours, concora crush processing is carried out with press；Finally, sheet material is solidified 1-2 hours under the conditions of 100-120 DEG C of temperature, most
Obtained polymer-matrix electric conduction glue-line eventually.
6. the preparation method of low contact resistance metal-based compound bipolar plates substrate according to claim 2 or 4, feature exist
In, the metallic substrate layer with a thickness of 50-500 microns and the metallic substrate layer is metal foil, the metal foil be with
It is one of lower: stainless steel foil, aluminium foil, titanium foil, copper foil, silver foil.
7. the preparation method of low contact resistance metal-based compound bipolar plates substrate according to claim 3, which is characterized in that three
The particle size range of kind conductive material is respectively 10-60 μm, 1-5 μm and 20-100nm；
The conductive material be following material one of or combination: natural blocky graphite, crystalline flake graphite, composite graphite, interphase
Carbon microspheres, silver powder, bronze, copper powder, conductive powdered carbon, carbon nanotube, carbon fiber, graphene；
The proportional region of the conductive material of three kinds of partial sizes are as follows: 10-20 μm of partial size of the conductive material ratio is 70-
90%；1-5 μm of partial size of the conductive material ratio is 5-15%；The conductive material ratio of partial size 20-100nm is 5-
15%；
The conductive material, binder, dispersing agent mass ratio are 100:(10-30): (300-900).
8. the preparation method of low contact resistance metal-based compound bipolar plates substrate according to claim 5, which is characterized in that
The transition zone slurry is made of conductive material, binder and dispersing agent, and the transition zone slurry configuration method includes:
Conductivity is greater than 50S/cm, conductive material of the partial size less than 1 μm to weigh respectively in calculating ratio, it then will be in S1-1)
The binder solution and conductive material of preparation are mixed in calculating ratio, and uniform transition zone slurry is made.
9. the preparation method of low contact resistance metal-based compound bipolar plates substrate according to claim 8, which is characterized in that
Step S3) described in transition zone wet end furnish be, conductive material, binder, dispersing agent mass ratio be 100:(1-5):
(800-900)。
10. the preparation method of low contact resistance metal-based compound bipolar plates substrate according to claim 4 or 5, feature
Be, the coating method of the transition zone slurry includes following one or combination: blade coating, spraying, brushing, dip-coating, silk-screen printing,
Micro- intaglio plate coating and extrusion coated.
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| CN201910345287.4A CN110137524B (en) | 2019-04-26 | 2019-04-26 | Metal-based composite bipolar plate base material and preparation method thereof |
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| CN111900426A (en) * | 2020-07-29 | 2020-11-06 | 上海交通大学 | Fuel cell bipolar plate anticorrosive coating and preparation method thereof |
| CN111934030A (en) * | 2020-07-25 | 2020-11-13 | 浙江理工大学 | Flexible planar micro energy storage device and preparation method thereof |
| CN112635098A (en) * | 2020-12-16 | 2021-04-09 | 东莞市华芯联科技有限公司 | Ceramic resistance type sensor transition layer slurry and preparation method thereof |
| CN113644288A (en) * | 2020-04-27 | 2021-11-12 | 恒大新能源技术(深圳)有限公司 | Composite bipolar plate and preparation method thereof |
| CN113717598A (en) * | 2021-07-20 | 2021-11-30 | 南通大学 | Preparation method of organic conductive anticorrosive coating on surface of stainless steel bipolar plate |
| CN113913097A (en) * | 2021-10-24 | 2022-01-11 | 杭州巨力绝缘材料有限公司 | Method for manufacturing nano-copper film-coated aluminum foil and production line |
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| CN115000441A (en) * | 2022-05-12 | 2022-09-02 | 上海安池科技有限公司 | Preparation method of precoat on stainless steel band for preparing fuel cell bipolar plate |
| CN115000441B (en) * | 2022-05-12 | 2024-02-06 | 上海安池科技有限公司 | Preparation method of precoating layer on stainless steel belt for preparing bipolar plate of fuel cell |
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