CN110137129A - 一种取芯片机 - Google Patents
一种取芯片机 Download PDFInfo
- Publication number
- CN110137129A CN110137129A CN201910462420.4A CN201910462420A CN110137129A CN 110137129 A CN110137129 A CN 110137129A CN 201910462420 A CN201910462420 A CN 201910462420A CN 110137129 A CN110137129 A CN 110137129A
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- support frame
- piece machine
- coring piece
- machine according
- coring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Specific Conveyance Elements (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910462420.4A CN110137129B (zh) | 2019-05-30 | 2019-05-30 | 一种取芯片机 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910462420.4A CN110137129B (zh) | 2019-05-30 | 2019-05-30 | 一种取芯片机 |
Publications (2)
Publication Number | Publication Date |
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CN110137129A true CN110137129A (zh) | 2019-08-16 |
CN110137129B CN110137129B (zh) | 2021-04-30 |
Family
ID=67583040
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201910462420.4A Active CN110137129B (zh) | 2019-05-30 | 2019-05-30 | 一种取芯片机 |
Country Status (1)
Country | Link |
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CN (1) | CN110137129B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110730572A (zh) * | 2019-09-12 | 2020-01-24 | 张自明 | 一种倒流式电路板绝缘加工设备 |
CN110854051A (zh) * | 2019-09-11 | 2020-02-28 | 芜湖德锐电子技术有限公司 | 一种芯片拾取装置 |
CN111315203A (zh) * | 2020-04-07 | 2020-06-19 | 孟辉 | 一种新型芯片加工用贴装设备 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4271129A (en) * | 1979-03-06 | 1981-06-02 | Rca Corporation | Heat radiation deflectors within an EFG crucible |
CN101752204A (zh) * | 2008-12-19 | 2010-06-23 | 均豪精密工业股份有限公司 | 芯片与胶膜分离方法与芯片取出方法 |
CN204257592U (zh) * | 2014-11-21 | 2015-04-08 | 格兰达技术(深圳)有限公司 | 一种用于ic料盘芯片自动转移机的小料盘传送模组装置 |
CN105510357A (zh) * | 2015-10-15 | 2016-04-20 | 无锡百立德自动化有限公司 | 芯片缺陷智能检查机 |
CN206030043U (zh) * | 2016-08-31 | 2017-03-22 | 重庆凯成科技有限公司 | 一种具有废料清除功能的模切机 |
CN107170699A (zh) * | 2017-06-05 | 2017-09-15 | 深圳格兰达智能装备股份有限公司 | 一种全自动芯片剥离机及其工作方法 |
CN207446886U (zh) * | 2017-10-30 | 2018-06-05 | 贵州维讯光电科技有限公司 | 用于图像处理芯片的自动除尘设备 |
CN109494148A (zh) * | 2018-12-28 | 2019-03-19 | 苏州邱伦智能科技有限公司 | 一种晶圆刮边机及其使用方法 |
-
2019
- 2019-05-30 CN CN201910462420.4A patent/CN110137129B/zh active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4271129A (en) * | 1979-03-06 | 1981-06-02 | Rca Corporation | Heat radiation deflectors within an EFG crucible |
CN101752204A (zh) * | 2008-12-19 | 2010-06-23 | 均豪精密工业股份有限公司 | 芯片与胶膜分离方法与芯片取出方法 |
CN204257592U (zh) * | 2014-11-21 | 2015-04-08 | 格兰达技术(深圳)有限公司 | 一种用于ic料盘芯片自动转移机的小料盘传送模组装置 |
CN105510357A (zh) * | 2015-10-15 | 2016-04-20 | 无锡百立德自动化有限公司 | 芯片缺陷智能检查机 |
CN206030043U (zh) * | 2016-08-31 | 2017-03-22 | 重庆凯成科技有限公司 | 一种具有废料清除功能的模切机 |
CN107170699A (zh) * | 2017-06-05 | 2017-09-15 | 深圳格兰达智能装备股份有限公司 | 一种全自动芯片剥离机及其工作方法 |
CN207446886U (zh) * | 2017-10-30 | 2018-06-05 | 贵州维讯光电科技有限公司 | 用于图像处理芯片的自动除尘设备 |
CN109494148A (zh) * | 2018-12-28 | 2019-03-19 | 苏州邱伦智能科技有限公司 | 一种晶圆刮边机及其使用方法 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110854051A (zh) * | 2019-09-11 | 2020-02-28 | 芜湖德锐电子技术有限公司 | 一种芯片拾取装置 |
CN110854051B (zh) * | 2019-09-11 | 2022-03-01 | 深圳市奥维特机电有限公司 | 一种芯片拾取装置 |
CN110730572A (zh) * | 2019-09-12 | 2020-01-24 | 张自明 | 一种倒流式电路板绝缘加工设备 |
CN110730572B (zh) * | 2019-09-12 | 2020-08-28 | 潍坊市力北电子科技有限公司 | 一种倒流式电路板绝缘加工设备 |
CN111315203A (zh) * | 2020-04-07 | 2020-06-19 | 孟辉 | 一种新型芯片加工用贴装设备 |
Also Published As
Publication number | Publication date |
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CN110137129B (zh) | 2021-04-30 |
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Legal Events
Date | Code | Title | Description |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20210330 Address after: 201615 Room 101, building 3, no.1589, Lianfu Road, Jiuting Town, Songjiang District, Shanghai Applicant after: SHANGHAI SHIYU PRECISION MACHINERY Co.,Ltd. Address before: 313000 Huzhou Jingyuan Information Technology Co., Ltd., building 2, Saige Digital City, Huzhou Economic and Technological Development Zone, Huzhou City, Zhejiang Province Applicant before: HUZHOU JINGYUAN INFORMATION TECHNOLOGY Co.,Ltd. |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 201615 Room 101, building 3, no.1589, Lianfu Road, Jiuting Town, Songjiang District, Shanghai Patentee after: Shanghai Shiyu Precision Equipment Co.,Ltd. Address before: 201615 Room 101, building 3, no.1589, Lianfu Road, Jiuting Town, Songjiang District, Shanghai Patentee before: SHANGHAI SHIYU PRECISION MACHINERY Co.,Ltd. |