CN110134988A - A kind of multi-stress reinforced test profile of device level product based on the physics of failure determines method - Google Patents
A kind of multi-stress reinforced test profile of device level product based on the physics of failure determines method Download PDFInfo
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Abstract
The present invention relates to a kind of multi-stress reinforced test profiles of device level product based on the physics of failure to determine method, the following steps are included: step 1: determining product weak link using the method for component FMEA in conjunction with failure case, and combine expert graded identified sign type；Step 2: referring to strenuous test specification, determine that the parameter of each proof stress section of device level product and its value are horizontal；Step 3: utilizing orthogonal test method, determine the multi-parameter of device level product strenuous test stress profile, multilevel orthogonal test table；Step 4: utilizing physics of failure method, the damage ratio under the conditions of calculating device grade product difference group test profile；Step 5: the damage ratio under the conditions of comparison different tests section determines the optimal multi-stress reinforced test profile of device level product.The present invention relates to a kind of multi-stress reinforced test profiles of device level product based on the physics of failure to determine method, it is based primarily upon physics of failure method evaluation method, carry out the selection of test type and the determination of test profile parameter quantities, the effectively weak link of discovery product, belongs to component reliability experimental technique field.
Description
(1) technical field:
The present invention relates to a kind of multi-stress reinforced test profiles of device level product to determine method, is based primarily upon the physics of failure
Method evaluation method carries out the selection of test type and the determination of test profile parameter quantities, effectively finds the weak ring of product
Section, belongs to component reliability experimental technique field.
(2) background technique:
Currently, in the high reliability such as aerospace field, the failure of device level product is device level product or even system-level
The principal element of product failure.Based on such background, the reliability for improving device level product is particularly important.Environment and reliability
Test is the necessary means of raising device level product quality and reliability, and according to relevant technical specification or technical conditions system
Fixed.The foundation of reliability test sectional plane is according to the extreme use environment combination of the normal use environment of device level product and part
Design.Device level product failure is excited by the means of test, finds the weak link of product, then product is improved by design
Reliability.Multi-stress reinforced test profile of the present invention determines that method is the strenuous test in accelerating experiment technology.Pass through
The environmental stress (high temperature, low temperature, vibration, damp and hot) and electric stress for promoting device level product testing, can send out in a short time
The function of existing product and the weak link of performance, and then improved technology, improve reliability.
There are such problems for similar test at present.It is specific that the field studied lacks multi-stress reinforced test profile method
Executable test method and technical basis.In the development of multi-stress reinforced test the selection of stress often fully rely on judgement and
Specific use environment determines that traditional determination method lacks the quantitative assessment to different stress sensitivities, can not rationally determine more
The stress types of stress test are superimposed.The selection of setting and proof stress to experimental condition often relies on the warp of testing crew
It tests, there is very big randomness.
Therefore, sectional parameter optimum design method is used for the multi-stress reinforced test of device level product, and test is cutd open
Face is designed optimization, obtains a kind of multi-stress reinforced test profile method of device level product, effectively carries out device level product
Physics of failure evaluation can have higher test efficiency and lower experimentation cost with efficiency test.
(3) summary of the invention:
1, purpose: the present invention is to find product function and property to solve how to design multi-stress reinforced test profile method
The technical issues of weak link of energy, reduction experimentation cost.It is emulated based on the physics of failure and carries out sectional parameter design optimization, passed through
It studies and defines more targetedly respectively with the test profile of higher test efficiency, obtains better test effect.To obtain one
The multi-stress reinforced test profile of kind device level product determines method.
2, technical solution: in order to solve the above technical problems, the present invention provides a kind of more stress of device level product are strong
Change test profile determine method, it the following steps are included:
Step 1: product weak link is determined using the method for component FMEA in conjunction with failure case, and is beaten in conjunction with expert
Point-score identified sign type.
Step 2: strenuous test specification is referred to, determines the parameter and its value water of each proof stress section of device level product
It is flat；
Step 3: utilizing orthogonal test method, determines the multi-parameter, multilevel of device level product strenuous test stress profile
Orthogonal test table；
Step 4: physics of failure method, the damage ratio under the conditions of calculating device grade product difference group test profile are utilized；
Step 5: the damage ratio under the conditions of comparison different tests section determines that optimal device level product is multi-stress reinforced
Test profile.
Wherein, step 1 is according to GJB/Z-1391-2006 fault mode, influence and HAZAN guide, with FMEA
Analytical technology analyzes component invalidation mode and weak link.To find device level product weak link, using technique
FMEA analytical technology is analyzed, and according to GJB/Z-1391-2006 failure criterion, determines the severity classification of device level product
And definition.Cause the grade of the severity of component failure to be classified, scored different stress, the classification of severity grade with
And scoring is as shown in table 1.
The 1 device level product severity criteria for classifying of table
It is expected that the job failure crash rate of component should be taken into account the factors pair such as credit rating, stress level, environmental condition
The influence of failure, it is also contemplated that the factors such as working method, working time, major function under different task section.It is analyzing
In the process, it is based on purpose, " minimum agreement time " i.e. device level that we are more concerned about in FMEA indenture level is analyzed.It is being embodied
In the process, the product (generally component) of initial indenture level is analyzed first, the source for distinguishing component is i.e. domestic
Component or import component, GJB/Z-299C-2006 " the estimated handbook of reliability of electronic equipment " is middle to provide domestic and imported
Component it is different using standard.Secondly it according to requiring to list all possible failure mode, determines that failure mechanism is corresponding and answers
Power and stress combination (such as temperature, electricity, vibration, humidity modification etc.), and classification processing is carried out, finally obtain FMEA worksheet.
According to FNEA fault mode, the probability of happening of various fault modes is determined.It is to generally use qualitative analysis when lacking fault data
Method needs to evaluate the grade of fault rate, but since each mechanism is different to the fault mode probability levels criteria for classifying,
It is more difficult to be judged, therefore relative value is not used to determine in practical applications, and it is general to use absolute figure failure definition to occur
Rate.Absolute figure failure definition probability levels are shown in Table 2.
The scoring criterion of 2 fault mode probability of happening grade (OPR) of table
| OPR grading system | A possibility that fault mode occurs | Fault mode probability of happening PmTerm of reference |
| 1,2 | It is low | Pm≤10-6 |
| 3,4,5, | In | 10-6≤Pm≤10-4 |
| 6,7,8 | It is higher | 10-4≤Pm≤10-2 |
| 9,10 | It is high | Pm> 10-2 |
According to " expert graded " identified sign type.According to component failure type and weak link, set by expert
System of Comprehensive Evaluation establishes device level product testing stress and chooses evaluation rubric, and expert carries out according to fault rate
Scoring, gives a mark for the severity of component failure mechanism, quantitative evaluation result, as shown in table 3.
3 typical failure mechanism of table/model F MEA and appraisal result (example)
Go out stress or stress combination based on FMEA Analysis result calculation.Circular is as follows.The RPN etc. of fault mode
In the product of the probability of happening grade (OPR) of the severity grade (ESR) and fault mode of the fault mode, expression formula is such as
Under.
RPN=ESR × OPR
In formula: RPN number is higher, then its harmfulness is bigger, and wherein the scoring criterion of ESR and OPR is as follows:
A) ESR scoring criterion: ESR is the final effect for evaluating some fault mode.Table 1 gives commenting for ESR
Divide criterion.The scoring criterion is integrated the actual conditions specified in more detail as far as possible of analyzed product by expert in analysis.
B) OPR scoring criterion: OPR is to evaluate a possibility that some fault mode actually occurs.Table 2 gives commenting for OPR
Divide criterion, " fault mode probability of happening P in tablemTerm of reference " is that estimated fault mode that corresponding each grading system provides exists
The probability occurred in the life cycle of product, the value can regard feelings definition in a particular application.
To obtain the risk priority number score value of stress or stress combination, by same stress or the numerical value of stress combination
Summation, i.e. RPN=∑ RPNi.According to its numerical value have it is high arrange on earth, risk of selection priority number, corresponding stress or stress group
Conjunction is exactly the proof stress type of the component.
With device work in the temperature most frequently born, humidity, vibration and four kinds of stress of electric stress are as evaluation object
It is illustrated.According to component FMEA analysis method, under the premise of different failure type factor weights are identical, RPN is evaluated
As a result all situations that may be present are calculated, the sequence of available stress sensitive type, relatively reasonably description stress or
The sensitivity level of stress combination.
Wherein, the parameter of the proof stress section in step 2 refers to the test element under each proof stress, these sections
The setting value of parameter is to test institute's identified sign to apply magnitude.Reasonable proof stress application value is multi-stress reinforced test
The key of success or not.It is built according to current standard GB/T-29309-2012 electron and electrician product Highly Accelerated Life Test (HALT)
The stress factors and its uneven table of vertical sensitive stress and stress combination, tentatively formulate each stress factors environment section, according to
The estimated handbook of GJB/Z-299 reliability of electronic equipment, the regulation coefficient that varying environment stress influences component failure rate, and root
Test institute's identified sign is set according to element stress analysis method for predicting reliability and applies magnitude.For the quick of device level product
Induction force or stress combination, can carry out experiment of knowing the real situation, verify the working limit of sensitive stress.It is as shown in table 4 four kinds of stress
Sectional parameter and uneven citing.
The different sectional parameter water-glasses of table 4
It is attached with 1:THIndicate specified maximum temperature, TH' indicate the limit of rupture tested and obtained of knowing the real situation
It is attached with 2:TLIndicate specified minimum temperature, TL' indicate the limit of rupture tested and obtained of knowing the real situation
It is attached with 3:VHIndicate rated operational voltage, VH' indicate the limit of rupture tested and obtained of knowing the real situation
It is attached with 4:GH' indicate the random vibration limit of rupture
Wherein, it is analyzed, is tested for the multilevel value of more sectional parameters using the method for orthogonal test in step 3
Number is few, and analysis is easy.Since this strenuous test has more sectional parameters (relating generally to temperature, vibration, electric stress, humidity), and
And the factor level number of each sectional parameter is related to multiple, therefore when being analyzed using orthogonal test, needs to consider
Multifactor multilevel test design, therefore there are two kinds of situations.One is the equal situations of each factor level number, can design
Orthogonal test factor level table, to reach the effect of " uniformly dispersed, neat comparable "；Another each factor level number is endless
Complete equal situation can design mixed-level orthogonal test table, or horizontal few factor is included into water using pseudo level method
It puts down in more way crossover tables.In addition, for there is interactive factor, such as temperature stress influences the variation of electric stress, and
And combine collocation simultaneously and have an impact to test index, each factor and each reciprocation cannot arbitrarily arrange (such as temperature stress and
The reciprocation of mechanical stress), assortment need to be carried out in strict accordance with reciprocation list, the interaction that can be denoted as factor A and factor B is made
With for A × B, according to interactive how many selection L tables that are horizontal and needing to investigate.Specific orthogonal test table can according to table 5 into
Row selection.The analysis to multifactor multilevel value can be fast implemented using the method for simulation evaluation according to orthogonal test feature
Optimization.
5 orthogonal test of table selects schematic table
Illustrate: n is experiment number, i.e. orthogonal arrage line number, and t is factor level number, and q is at most to arrange because of prime number.
Wherein, step 4 is the influence for embodying different factors to defect excitation ability, is ground by carrying out physics of failure emulation
Study carefully, testing program is evaluated according to simulation result, the reinforcing trial tapping face of the key factor and optimization that determine test is to open
Exhibition test.
Failure physical model describes in product failure and work by temperature, the influence of electricity, machinery, chemical iso-stress
Journey.The biggish failure physical model that is in progress in device level product research at present and application mainly includes chip exhaustion fracture, grid oxygen
Change between layer time breakdown, the fatigue failure of die bonding layer, the failure of bonding line flexural fatigue, pad fatigue failure, electromigration, metal
Golden aluminium compound, solder joint heat fatigue, random vibration fatigue, impact vibration, corrosion etc..The physics of failure simulation software of mainstream at present
It is often as shown in table 6 with failure physical model for device level product in CALCE.Model is chosen first according to identified sensitivity
Stress types are chosen, and the failure physical model for secondly finally determining that evaluation is selected according to stress types and product structure is carried out
Emulation.
6 failure physical model table of table
Failure physical model determines method.Due to needing to input the parameters such as chip temperature in physics of failure emulation, first may be used
The finite element simulation that temperature power-up is carried out to designed orthogonal test scheme obtains answering under the test profile device and chip
Power distribution, stress distribution result is inputted in physics of failure simulation software CALCE, different sections is obtained and makees in different failure mechanisms
With the evaluation of the time to failure of lower device.
To evaluation result, according to Miner linear cumulative damage law, carry out linear accumulation, by different stress types and
Damage caused by different stress levels carries out the mode of linear accumulation, realizes the evaluation that different stress act on device synthesis.
Finally, the accumulated damage ratio being calculated under different sections, compares to obtain to the accumulated damage ratio of product under different sections
Optimal section, on the section of orthogonal test carry out evaluation analysis can also test in influence the key factor tested, finally
Formulate effect more preferably testing program.
Miner theory damage accumulation is theoretical, it is believed that the generation of damage is different unrelated from working environment, various stress types
The damage of product can be superimposed by way of linear accumulation with what is generated under stress level, it is believed that each of different stress
Cyclic Stress can all generate some damages.Its mathematic(al) representation such as following formula:
In formula, niIndicate the application time of i-th group of section；NijTable
Show under i-th group of section, the time to failure under jth kind failure mechanism；RiAs Miner accumulated damage ratio.
For the different sections in orthogonal test scheme, by component failure physical simulation as a result, linearly tiring out according to Miner
Product defect theory, carries out linear accumulation.And test profile is evaluated according to accumulation results.Pass through physics of failure emulation and line
The evaluation result of the property available orthogonal test of Cumulative Damage, both the accumulated damage ratio of each test profile.
Wherein, step 5 is the analysis of test profile damage ratio.In the analysis to test profile, accumulated damage ratio is higher
Represent excites ability stronger the defect of device under the section, as Wogvily Mining Way, it is desirable to which its accumulated damage ratio is the bigger the better.
To test result in such a way that two kinds of analysis methods combine, i.e., first is that intiutive analysis method, second is that range analysis
Method.
Firstly, with intiutive analysis method intuitively comparing sequence will be carried out to the simulation result of each section, Wogvily Mining Way is found
Preferably, both accumulated damage than highest section, it is believed that this section efficiency highest in strenuous test, excite product latent defect
Ability it is most strong, therefore multi-stress reinforced test will be carried out according to optimal orthogonal test section.
Secondly, with extremum difference analysis by calculating the very poor of same factor different level value, then it is more different because
The very poor value of element, what is applied in strenuous test is the stress increased, therefore the Gao Shui of each sectional parameter is paid close attention in analysis
Flat value.The key factor for influencing test can be found by range analysis, and then finds more preferably testing program.Range analysis
For using the accumulated damage of the high-level value test group of each factor than the sum of subtract the accumulation of low-level value test group
The sum of damage ratio, very poor maximum two factors are the key factor in testing.Very poor calculation formula such as following formula:
In formulaIndicate that the test of i-th of factor is very poor, ∑ HiIndicate accumulated damage under the high-level value of i-th of factor
The sum of than, ∑ LiIndicate the sum of accumulated damage ratio under the low-level value of i-th of factor.
To orthogonal experiments simultaneously using the intiutive analysis method of different sections and the range analysis to different sectional parameters
Method successively formulates the optimal section based on intiutive analysis method and the optimal section of test key factor based on extremum difference analysis, needle
Targetedly carry out the research of strenuous test to the section of the two optimizations.And then determine optimal strenuous test section, system
Determine strenuous test scheme of the component under the conventional stress such as temperature, vibration, humidity, electricity and the combination of other stress.
(4) Detailed description of the invention:
Fig. 1 is implementation steps flow diagram of the invention, and the simulation result of Fig. 2 section 5, the power-up of Fig. 3 temperature cycles is by force
Change test profile, Fig. 4 high temperature is powered on strenuous test section.
(5) specific embodiment:
Below with reference to specific case study on implementation, the more stress reliability intensifyings of specific electronic product are directed to of the present invention
The optimization analysis of sectional parameter is described in detail in test.
Case: the domestic A/D converter of Mr. Yu's type is applied
The present invention illustrates that the multi-stress reinforced test profile of device level product is true by taking the domestic A/D converter of certain model as an example
Determine method.
Step 1: product weak link is determined using the method for component FMECA in conjunction with failure case first.Foundation
GJB/Z-1391-2006 failure criterion determines domestic A/D converter severity.Divided using technique FMECA analytical technology
Analysis, obtains FMECA worksheet.As shown in table 7
7 typical failure mechanism of table/model F MEA and appraisal result
Secondly expert graded identified sign type is combined.According to the severity grade of domestic A/D converter fault mode
(ESR) and probability of happening grade (OPR) standards of grading of fault mode, the weight of the RPN of fault mode is determined.Formula
Calculated, stress sensitivity can be obtained and successively represented: temperature, electric stress, humidity, vibration responsive parameter.Finally determine certain
The sensitive stress or stress of domestic A/D converter combine, as shown in table 8.
Table 8 determines certain domestic A/D converter sensitive stress or stress combination
According to institute's identified sign test type, we test for most important stress types.Use orthogonal test
Influence of the method to temperature with electric stress comprehensive testing method and different tests condition to device performance conduct a research.Comprehensive examination
The relevant parameter tested includes: that maximum temperature, minimum temperature, high/low temperature immerse time, warm variable Rate, supply voltage value, with reference to electricity
Flat-shake, input voltage pulse amplitude, input voltage pulse frequency.Herein according to test result and the strenuous test scheme of knowing the real situation
The value horizontal to different parameter settings two, low temperature take recommended work temperature and equipment pole since working limit is indefinite
Limit low temperature is configured, and the uneven setting of temperature factor and useful resistivity parameter is as shown in table 9.
9 temperature of table follows power-up test profile parameter level table
Step 2: using the method for orthogonal test, the examination of ten factors, two horizontal quadrature is formulated for above-mentioned ten sectional parameters
Table is tested, test number (TN) is chosen 16 times.Testing program is as shown in table 10, and A, B, C, D, E, F, G, H, J, K successively represent above-mentioned section
Parameter, -1 represents the low-level value of the factor, and 1 represents high-level value.By dividing different tests scheme simulation result
Analysis can find the better testing program of effect, while find out the principal element for influencing test.
10 temperature of table follows the orthogonal test scheme of power-up
Step 3: successively carrying out finite element simulation for designed orthogonal test scheme, emulation screenshot as shown in Fig. 2,
FEM Numerical Simulation extracting parameter input physics of failure simulation software is obtained into the time to failure under different failure mechanisms such as
Shown in table 11.
11 physics of failure simulation result of table
Step 4: it to the above results, is analyzed using the method for linear cumulative damage.The knot that linear cumulative damage calculates
Fruit and its sequence are as shown in table 12.
12 linear cumulative damage result of table
| Test number | Trauma time (h) | Accumulated damage ratio (h/h) | Sequence |
| 1 | 383.3333 | 2.35E-02 | 11 |
| 2 | 766.6667 | 1.99E-02 | 14 |
| 3 | 427.7778 | 2.45E-02 | 10 |
| 4 | 527.7778 | 2.78E-02 | 9 |
| 5 | 822.2222 | 3.72E-02 | 5 |
| 6 | 777.7778 | 5.75E-02 | 2 |
| 7 | 361.1111 | 1.88E-02 | 15 |
| 8 | 722.2222 | 2.86E-02 | 11 |
| 9 | 611.1111 | 6.08E-02 | 1 |
| 10 | 600 | 2.33E-02 | 12 |
| 11 | 577.7778 | 3.51E-02 | 6 |
| 12 | 555.5556 | 2.18E-02 | 13 |
| 13 | 550 | 1.85E-02 | 16 |
| 14 | 655.5556 | 3.16E-02 | 7 |
| 15 | 555.5556 | 4.33E-02 | 4 |
| 16 | 388.8889 | 4.95E-02 | 3 |
Step 5: it is final, it is successively intuitively analyzed for the result of simulation analysis and range analysis, according to linear accumulation
The result of breakdown diagnosis is it is found that the 9th group of accumulated damage is than highest in 16 groups of current orthogonal test sections, and both the group was tried
The damage effect for testing section is best, is equally considered as this section efficiency highest in strenuous test, excites product latent defect
Ability it is most strong.Multifactor multiple strengthening test profile is designed based on section 9, utilizes optimization designed by intiutive analysis method
Test profile is as shown in Figure 3.
Range analysis is carried out according to the method for range analysis, while for 10 kinds of sectional parameters in strenuous test section,
The range analysis of physics of failure simulation result is as shown in table 13.
13 range analysis result of table
The very poor value for comparing different tests sectional parameter can see the key factor of influence test effect successively are as follows: highest
Temperature, supply voltage and input voltage pulse amplitude.It will be directed in strenuous test Section Design and obtain imitating test in analysis
Fruit influences maximum sectional parameter: maximum temperature, supply voltage and input pulse voltage carry out strenuous test Section Design, to this
A little sectional parameters take high-level value design experiment section 2 as shown in figure 4, as high temperature and electric stress compbined test.
Claims (6)
1. a kind of multi-stress reinforced test profile of device level product based on the physics of failure determines method, it is characterised in that: failure
Physical method and fuzzy grade evaluation method carry out the selection of test type and the determination of test profile parameter quantities.This method
Specific step is as follows:
Step 1: product weak link is determined using the method for component FMEA in conjunction with failure case, and combines expert graded
Identified sign type；
Step 2: referring to strenuous test specification, determines that the parameter of each proof stress section of device level product and its value are horizontal；
Step 3: utilizing orthogonal test method, determines the multi-parameter, multilevel orthogonal of device level product strenuous test stress profile
Test table；
Step 4: physics of failure method, the damage ratio under the conditions of calculating device grade product difference group test profile are utilized；
Step 5: the damage ratio under the conditions of comparison different tests section determines the optimal multi-stress reinforced test of device level product
Section.
2. being used according to claim 1 according to GJB/Z-1391-2006 fault mode, influence and HAZAN guide
FMEA analytical technology analyzes component invalidation mode and weak link, and determines device level product in conjunction with expert graded
Proof stress type.It is analyzed using technique FMEA analytical technology, determines the severity classification and definition of device level product.It is right
Different stress cause the grade of the severity of component failure to be classified, scored.According to " expert graded " identified sign class
Type, expert score according to fault rate, give a mark for the severity of component failure mechanism, quantitatively evaluating knot
Fruit.Go out stress or stress built-up sequence based on FMEA Analysis result calculation, describes the sensitivity level of stress or stress combination.
3. according to claim 1 refer to strenuous test specification, the parameter of each proof stress section of device level product is determined
And its value is horizontal, the parameter of proof stress section refers to the test element under each proof stress, the setting of these sectional parameters
Value is to test institute's identified sign to apply magnitude.This method is to analyze each sectional parameter difference magnitude by the method for emulation
Defect launching efficiency, carry out accordingly test magnitude determination.
4. according to claim 1 utilize orthogonal test method, more for more sectional parameters using the method for orthogonal test
Horizontal value is analyzed, and has experiment number few, analyzes easy advantage.Orthogonal test feature is that each column of every a line are different
Hydraulic test number is identical, and wherein different tests are numbered, generally selection minimum number, and different sectional parameters, -1 represents low-level,
1 represents high-level value.It can be fast implemented using the method for simulation evaluation to multifactor multilevel according to orthogonal test feature
The analysis optimization of value.
5. according to claim 1 utilize physics of failure method, under the conditions of calculating device grade product difference group test profile
Damage ratio, the influence of ability is excited to embody different factors to defect, passes through and carries out physics of failure simulation study, according to emulation
As a result testing program is evaluated, the reinforcing trial tapping face of the key factor and optimization that determine test is to carry out test.
6. the damage ratio under the conditions of comparison different tests section according to claim 1, determines optimal device level product
Multi-stress reinforced test profile, in the analysis to test profile, accumulated damage is represent under the section than higher to device
Defect excites ability stronger, as Wogvily Mining Way, it is desirable to which its accumulated damage ratio is the bigger the better.To there are two types of the analyses of test result
Method: first is that intiutive analysis method, second is that extremum difference analysis.It successively formulates the optimal section based on intiutive analysis method and is based on very poor
The optimal section of test key factor of analytic approach targetedly carries out grinding for strenuous test for the section of the two optimizations
Study carefully.And then determine optimal strenuous test section, formulate component the conventional stress such as temperature, vibration, humidity, electricity and other answer
Strenuous test scheme under power combination.
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| CN114384365A (en) * | 2022-03-24 | 2022-04-22 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Method, device and equipment for determining weak link test scheme of exposed product |
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