CN110129628A - Electronic component manufacture high-intensitive anti-interference alumel and its preparation process - Google Patents

Electronic component manufacture high-intensitive anti-interference alumel and its preparation process Download PDF

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Publication number
CN110129628A
CN110129628A CN201910489115.4A CN201910489115A CN110129628A CN 110129628 A CN110129628 A CN 110129628A CN 201910489115 A CN201910489115 A CN 201910489115A CN 110129628 A CN110129628 A CN 110129628A
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Prior art keywords
alumel
interference
temperature
electronic component
intensitive anti
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CN201910489115.4A
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Chinese (zh)
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王静
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Yangzhou Good Housekeeper Technology Information Consulting Co Ltd
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Yangzhou Good Housekeeper Technology Information Consulting Co Ltd
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Priority to CN201910489115.4A priority Critical patent/CN110129628A/en
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/02—Making non-ferrous alloys by melting
    • C22C1/026—Alloys based on aluminium
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C21/00—Alloys based on aluminium
    • C22C21/02—Alloys based on aluminium with silicon as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C21/00—Alloys based on aluminium
    • C22C21/12—Alloys based on aluminium with copper as the next major constituent
    • C22C21/14—Alloys based on aluminium with copper as the next major constituent with silicon
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/04—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
    • C22F1/043—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon of alloys with silicon as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/04—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
    • C22F1/057—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon of alloys with copper as the next major constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0075—Magnetic shielding materials

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)

Abstract

The invention discloses a kind of electronic components to manufacture with high-intensitive anti-interference alumel, including following component (by mass percentage): Al:20~30%, Ni:3~5%, CU:15~18%, Ti:1~3%, Si:17~21%, Zn:8~10%, surplus Al.The invention also discloses a kind of electronic components to manufacture the preparation process with high-intensitive anti-interference alumel, comprising the following steps: step 1: ingredient, step 2: melting, step 3: homo genizing annelaing, step 4: forging, step 5: hot rolling and cold rolling and step 6: quenching.Suitable nickel is added in the present invention in alfer, can improve its processing performance, reduces Ball-milling Time, saves production cost, while magnetic conductivity also can be improved, and improves Magnetic Shielding Effectiveness；The high-temperature behavior for improving alloy carries out Metamorphism treatment to aluminum melt when casting, not only ensure that the wear-resisting property of aluminium nickel alumin(i)um alloy, but also improve tensile strength and fatigue resistance.

Description

Electronic component manufacture high-intensitive anti-interference alumel and its preparation process
Technical field
The present invention relates to alumel correlative technology field, in particular to a kind of electronic component manufacture is anti-dry with high intensity Disturb alumel and its preparation process.
Background technique
Due to aluminium alloy have density is low, intensity is high, corrosion-resistant, conductive and good heat conductivity, may be cast as, can weld and The fine qualities such as processing performance is good and develop very fast, be widely used in national economy and daily life, share amount It is more, range is is extensively only second to steel, become the second largest metal, yield accounts for 1/3 or more of entire metal production.But it is general Aluminium alloy diamagnetism interference performance is poor, it is impossible to be used in and electronics industry, limitation is very big, it has been investigated that, alumel resists Jamming performance is fine, but the tensile strength of general alumel and fatigue resistance are not good enough, also has certain limitation Property.Therefore, a kind of manufacture of electronic component is invented with the anti-interference alumel of high intensity and its preparation process to solve above-mentioned ask It inscribes necessary.
Summary of the invention
The purpose of the present invention is to provide a kind of electronic components to manufacture with high-intensitive anti-interference alumel and its preparation Technique, to solve the problems mentioned in the above background technology.
To achieve the above object, the invention provides the following technical scheme: a kind of manufacture of electronic component is anti-dry with high intensity Disturb alumel, including following component (by mass percentage): Al:20~30%, Ni:3~5%, CU:15~18%, Ti:1 ~3%, Si:17~21%, Zn:8~10%, surplus Al.
Preferably, including following component (by mass percentage): Al:20%, Ni:5%, CU:15%, Ti:3%, Si: 17%, Zn:10%, surplus Al.
Preferably, including following component (by mass percentage): Al:25%, Ni:4%, CU:16%, Ti:2%, Si: 19%, Zn:9%, surplus Al.
Preferably, including following component (by mass percentage): Al:30%, Ni:3%, CU:18%, Ti:1%, Si: 21%, Zn:8%, surplus Al.
A kind of preparation process of the high-intensitive anti-interference alumel of electronic component manufacture, comprising the following steps:
Step 1: ingredient ingredient: is carried out according to the component of alumel material；
Step 2: melting: it will be put into vacuum consumable electrode arc furnace, be warming up to the high purity titanium and metallic aluminium got ready first 1700~1800 DEG C, monocrystalline silicon, pure iron and high purity nickel are sequentially added, keeps the temperature 30~50min, after pure iron is completely melt, then Metallic copper is added, adjusts the temperature to 1100~1200 DEG C, metallic zinc is added after metallic copper is completely melt, is then stirred using electromagnetism It mixes, stirs molten bath, mixing time is 35~45min, then fusant is cast to high-speed rotating water cooling roller, obtains aluminium nickel Alloy cast ingot；
Step 3: homo genizing annelaing: alloy cast ingot is heated to 1000~1060 DEG C first, soaking time is 10~20 small When, after be cooled to 850~950 DEG C, soaking time is 9~11 hours, later with 80~100 DEG C/h of slow coolings to room temperature；
Step 4: forging: the alloy cast ingot after annealing is forged, and initial forging temperature is 900~930 DEG C, final forging temperature It is 940~960 DEG C, alloy cast ingot keeps the temperature 5~15 hours at 850~880 DEG C after forging；
Step 5: above-mentioned ingot casting: being put into press machine carry out 3~5 hot rollings and cold rolling respectively first by hot rolling and cold rolling, Hot-rolled temperature is 800~900 DEG C, is cooled to room temperature after hot rolling, then carry out cold-rolling treatment.
Step 6: plate quenching: is reached into 950~1050 DEG C of progress water quenchings with 130~150 DEG C/h of heating rate Processing is then cooled to 400~450 DEG C with 50~70 DEG C/h and keeps the temperature 2~4 hours, then is cooled to 20~40 DEG C/h 200~250 DEG C keep the temperature 1~3 hour, after cool to room temperature with the furnace and obtain final alumel plate.
Preferably, cold and hot in the step 3 is rolled alternately.
Technical effect and advantage of the invention: suitable nickel is added in the present invention in alfer, can improve its processing Performance reduces Ball-milling Time, saves production cost, while magnetic conductivity also can be improved, and improves Magnetic Shielding Effectiveness；Higher silicon is added Amount is to form a large amount of primary silicon, and copper and silicon combine, and improves the high-temperature behavior of alloy, and when casting becomes aluminum melt Matter processing, not only ensure that the wear-resisting property of aluminium nickel alumin(i)um alloy, but also improve tensile strength and fatigue resistance.
Specific embodiment
The technical scheme in the embodiments of the invention will be clearly and completely described below, it is clear that described implementation Example is only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, this field is common Technical staff's every other embodiment obtained without making creative work belongs to the model that the present invention protects It encloses.
Embodiment 1:
A kind of electronic component manufacture high-intensitive anti-interference alumel, including following component (by mass percentage): Al:20%, Ni:5%, CU:15%, Ti:3%, Si:17%, Zn:10%, surplus Al.
A kind of preparation process of the high-intensitive anti-interference alumel of electronic component manufacture, which is characterized in that including with Lower step:
Step 1: ingredient ingredient: is carried out according to the component of alumel material；
Step 2: melting: it will be put into vacuum consumable electrode arc furnace, be warming up to the high purity titanium and metallic aluminium got ready first 1700 DEG C, monocrystalline silicon, pure iron and high purity nickel are sequentially added, heat preservation 30min adds metallic copper after pure iron is completely melt, 1100 DEG C are adjusted the temperature to, metallic zinc is added after metallic copper is completely melt, then uses electromagnetic agitation, stirs molten bath, stirring Time is 35min, then fusant is cast to high-speed rotating water cooling roller, obtains alumel ingot casting；
Step 3: homo genizing annelaing: being heated to 1000 DEG C for alloy cast ingot first, and soaking time is 10 hours, after be cooled to 850 DEG C, soaking time is 911 hours, later with 80 DEG C/h of slow coolings to room temperature；
Step 4: forging: the alloy cast ingot after annealing is forged, and initial forging temperature is 900 DEG C, final forging temperature 940 DEG C, alloy cast ingot keeps the temperature 5 hours at 850 DEG C after forging；
Step 5: above-mentioned ingot casting: being put into press machine carry out 3 hot rollings and cold rolling respectively first by hot rolling and cold rolling, heat Rolling temperature is 800 DEG C, is cooled to room temperature after hot rolling, then carry out cold-rolling treatment.
Step 6: quenching: plate is reached into 950 DEG C of progress Water Quenchings with 130 DEG C/h of heating rate, then with 50 DEG C/h be cooled to 400 DEG C keep the temperature 2 hours, then with 20 DEG C/h be cooled to 200 DEG C keep the temperature 1 hour, after cool to the furnace Room temperature obtains final alumel plate.
Embodiment 2:
A kind of electronic component manufacture high-intensitive anti-interference alumel, including following component (by mass percentage): Al:25%, Ni:4%, CU:16%, Ti:2%, Si:19%, Zn:9%, surplus Al.
A kind of preparation process of the high-intensitive anti-interference alumel of electronic component manufacture, comprising the following steps:
Step 1: ingredient ingredient: is carried out according to the component of alumel material；
Step 2: melting: it will be put into vacuum consumable electrode arc furnace, be warming up to the high purity titanium and metallic aluminium got ready first 1750 DEG C, monocrystalline silicon, pure iron and high purity nickel are sequentially added, heat preservation 40min adds metallic copper after pure iron is completely melt, 1150 DEG C are adjusted the temperature to, metallic zinc is added after metallic copper is completely melt, then uses electromagnetic agitation, stirs molten bath, stirring Time is 40min, then fusant is cast to high-speed rotating water cooling roller, obtains alumel ingot casting；
Step 3: homo genizing annelaing: being heated to 1030 DEG C for alloy cast ingot first, and soaking time is 15 hours, after be cooled to 900 DEG C, soaking time is 10 hours, later with 90 DEG C/h of slow coolings to room temperature；
Step 4: forging: the alloy cast ingot after annealing is forged, and initial forging temperature is 920 DEG C, final forging temperature 950 DEG C, alloy cast ingot keeps the temperature 10 hours at 860 DEG C after forging；
Step 5: above-mentioned ingot casting: being put into press machine carry out 4 hot rollings and cold rolling respectively first by hot rolling and cold rolling, heat Rolling temperature is 850 DEG C, is cooled to room temperature after hot rolling, then carry out cold-rolling treatment.
Step 6: quenching: plate is reached into 1000 DEG C of progress Water Quenchings with 140 DEG C/h of heating rate, then with 60 DEG C/h be cooled to 430 DEG C keep the temperature 3 hours, then with 30 DEG C/h be cooled to 220 DEG C keep the temperature 2 hours, after cool to the furnace Room temperature obtains final alumel plate.
Embodiment 3:
A kind of electronic component manufacture high-intensitive anti-interference alumel, including following component (by mass percentage): Al:30%, Ni:3%, CU:18%, Ti:1%, Si:21%, Zn:8%, surplus Al.
A kind of preparation process of the high-intensitive anti-interference alumel of electronic component manufacture, comprising the following steps:
Step 1: ingredient ingredient: is carried out according to the component of alumel material；
Step 2: melting: it will be put into vacuum consumable electrode arc furnace, be warming up to the high purity titanium and metallic aluminium got ready first 1800 DEG C, monocrystalline silicon, pure iron and high purity nickel are sequentially added, heat preservation 50min adds metallic copper after pure iron is completely melt, 1200 DEG C are adjusted the temperature to, metallic zinc is added after metallic copper is completely melt, then uses electromagnetic agitation, stirs molten bath, stirring Time is 45min, then fusant is cast to high-speed rotating water cooling roller, obtains alumel ingot casting；
Step 3: homo genizing annelaing: being heated to 1060 DEG C for alloy cast ingot first, and soaking time is 20 hours, after be cooled to 950 DEG C, soaking time is 11 hours, later with 100 DEG C/h of slow coolings to room temperature；
Step 4: forging: the alloy cast ingot after annealing is forged, and initial forging temperature is 930 DEG C, final forging temperature 960 DEG C, alloy cast ingot keeps the temperature 15 hours at 880 DEG C after forging；
Step 5: above-mentioned ingot casting: being put into press machine carry out 5 hot rollings and cold rolling respectively first by hot rolling and cold rolling, heat Rolling temperature is 900 DEG C, is cooled to room temperature after hot rolling, then carry out cold-rolling treatment.
Step 6: quenching: plate is reached into 1050 DEG C of progress Water Quenchings with 150 DEG C/h of heating rate, then with 70 DEG C/h be cooled to 450 DEG C keep the temperature 4 hours, then with 40 DEG C/h be cooled to 250 DEG C keep the temperature 3 hours, after cool to the furnace Room temperature obtains final alumel plate.
The high-intensitive anti-interference alumel of electronic component manufacture can be made by above four groups of embodiments, wherein The manufacture of electronic component made from second group of embodiment is best with high-intensitive anti-interference alumel effect, and the present invention is closed in ferro-aluminum Suitable nickel is added in gold, its processing performance can be improved, reduces Ball-milling Time, saves production cost, while magnetic also can be improved Conductance improves Magnetic Shielding Effectiveness；It is to form a large amount of primary silicon that higher silicon amount, which is added, and copper and silicon combine, and improves and closes The high-temperature behavior of gold carries out Metamorphism treatment to aluminum melt when casting, not only ensure that the wear-resisting property of aluminium nickel alumin(i)um alloy, but also improve Tensile strength and fatigue resistance.
Finally, it should be noted that the foregoing is only a preferred embodiment of the present invention, it is not intended to restrict the invention, Although the present invention is described in detail referring to the foregoing embodiments, for those skilled in the art, still may be used To modify the technical solutions described in the foregoing embodiments or equivalent replacement of some of the technical features, All within the spirits and principles of the present invention, any modification, equivalent replacement, improvement and so on should be included in of the invention Within protection scope.

Claims (6)

1. a kind of high-intensitive anti-interference alumel of electronic component manufacture, which is characterized in that (press quality including following component Percentage): Al:20~30%, Ni:3~5%, CU:15~18%, Ti:1~3%, Si:17~21%, Zn:8~10%, it is remaining Amount is Al.
2. a kind of high-intensitive anti-interference alumel of electronic component manufacture according to claim 1, which is characterized in that Including following component (by mass percentage): Al:20%, Ni:5%, CU:15%, Ti:3%, Si:17%, Zn:10%, surplus For Al.
3. a kind of high-intensitive anti-interference alumel of electronic component manufacture according to claim 1, which is characterized in that Including following component (by mass percentage): Al:25%, Ni:4%, CU:16%, Ti:2%, Si:19%, Zn:9%, surplus For Al.
4. a kind of high-intensitive anti-interference alumel of electronic component manufacture according to claim 1, which is characterized in that Including following component (by mass percentage): Al:30%, Ni:3%, CU:18%, Ti:1%, Si:21%, Zn:8%, surplus For Al.
5. a kind of preparation process of the high-intensitive anti-interference alumel of electronic component manufacture as described in claim 1-4, Characterized by comprising the following steps:
Step 1: ingredient ingredient: is carried out according to the component of alumel material；
Step 2: melting: will be put into vacuum consumable electrode arc furnace first with the high purity titanium got ready and metallic aluminium, it is warming up to 1700~ 1800 DEG C, monocrystalline silicon, pure iron and high purity nickel are sequentially added, 30~50min of heat preservation adds gold after pure iron is completely melt Belong to copper, adjust the temperature to 1100~1200 DEG C, metallic zinc is added after metallic copper is completely melt, then uses electromagnetic agitation, stir Dynamic molten bath, mixing time is 35~45min, then fusant is cast to high-speed rotating water cooling roller, obtains alumel Ingot casting；
Step 3: homo genizing annelaing: being heated to 1000~1060 DEG C for alloy cast ingot first, and soaking time is 10~20 hours, after 850~950 DEG C are cooled to, soaking time is 9~11 hours, later with 80~100 DEG C/h of slow coolings to room temperature；
Step 4: forging: the alloy cast ingot after annealing is forged, and initial forging temperature is 900~930 DEG C, final forging temperature 940 ~960 DEG C, alloy cast ingot keeps the temperature 5~15 hours at 850~880 DEG C after forging；
Step 5: hot rolling and cold rolling: above-mentioned ingot casting is put into press machine carries out 3~5 hot rollings and cold rolling, hot rolling respectively first Temperature is 800~900 DEG C, is cooled to room temperature after hot rolling, then carry out cold-rolling treatment.
Step 6: quenching: reaching 950~1050 DEG C of progress Water Quenchings for plate with 130~150 DEG C/h of heating rate, 400~450 DEG C then, which are cooled to, with 50~70 DEG C/h keeps the temperature 2~4 hours, then 200 are cooled to 20~40 DEG C/h~ 250 DEG C keep the temperature 1~3 hour, after cool to room temperature with the furnace and obtain final alumel plate.
6. a kind of high-intensitive anti-interference alumel of electronic component manufacture according to claim 5 and its preparation work Skill, it is characterised in that: cold and hot in the step 3 is rolled alternately.
CN201910489115.4A 2019-06-06 2019-06-06 Electronic component manufacture high-intensitive anti-interference alumel and its preparation process Pending CN110129628A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111690886A (en) * 2020-05-15 2020-09-22 江苏理工学院 Treatment method for improving comprehensive mechanical property of Al-Zn alloy with high zinc content

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1718808A (en) * 2005-07-18 2006-01-11 西安工业学院 High strength heat resistant alloy
CN103710595A (en) * 2014-01-16 2014-04-09 张霞 Hot rolled aluminum-zinc alloy plate and preparation method thereof
JP2015519475A (en) * 2012-05-15 2015-07-09 コンステリウム エクストルージョンズ ジェチーン エス．アール．オー．Ｃｏｎｓｔｅｌｌｉｕｍ Ｅｘｔｒｕｓｉｏｎｓ Ｄｅｃｉｎ Ｓ．Ｒ．Ｏ． Improved free-cutting forged aluminum alloy product and manufacturing method thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1718808A (en) * 2005-07-18 2006-01-11 西安工业学院 High strength heat resistant alloy
JP2015519475A (en) * 2012-05-15 2015-07-09 コンステリウム エクストルージョンズ ジェチーン エス．アール．オー．Ｃｏｎｓｔｅｌｌｉｕｍ Ｅｘｔｒｕｓｉｏｎｓ Ｄｅｃｉｎ Ｓ．Ｒ．Ｏ． Improved free-cutting forged aluminum alloy product and manufacturing method thereof
CN103710595A (en) * 2014-01-16 2014-04-09 张霞 Hot rolled aluminum-zinc alloy plate and preparation method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111690886A (en) * 2020-05-15 2020-09-22 江苏理工学院 Treatment method for improving comprehensive mechanical property of Al-Zn alloy with high zinc content
CN111690886B (en) * 2020-05-15 2021-06-29 江苏理工学院 Treatment method for improving comprehensive mechanical property of Al-Zn alloy with high zinc content

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Application publication date: 20190816