CN110125827A - A kind of production technology of novel diamond tool - Google Patents
A kind of production technology of novel diamond tool Download PDFInfo
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- CN110125827A CN110125827A CN201910369638.5A CN201910369638A CN110125827A CN 110125827 A CN110125827 A CN 110125827A CN 201910369638 A CN201910369638 A CN 201910369638A CN 110125827 A CN110125827 A CN 110125827A
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- brazing
- diamond
- production technology
- abrasive
- solder
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/009—Tools not otherwise provided for
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
A kind of production technology of novel diamond tool, 1) production technology is the following steps are included: blend together compound material for diluted material and solder；2) diamond abrasive grain is subjected to granulation package, and is adhesively fixed with acetone binder；3) complex of diamond abrasive after package is uniformly mixed with packing material, brazing solder, acetone binder；4) it is put into mould pressurizing sizing；5) by molding embryo block heating soldering.This technique indirectly controls the soldering strength of single abrasive particle by the size of the brazing area of control brazing diamond grinding, and the structure matching for passing through packing material, the sustainable processing performance of multilayer of multi-layered brazing is realized, the service life of brazing diamond grinding tool is improved；And simple production process, quality are stablized easy to control, process can standardize, and be suitable for industrialized mass production.
Description
Technical field
The present invention relates to a kind of production technologies of novel diamond tool.
Background technique
Traditional can be divided into plating tool and sintering tool two by the diamond abrasive tool of representative of diamond tool
Major class, they have his own strong points.But due to diamond surface there are higher surface can, it is difficult to be infiltrated with common metal, abrasive grain with
Firm metallurgical bonding layer is not present in the intermetallic interface of carcass.Carcass is small to the holding power of abrasive grain, easily due to tyre body abrasion
Make Grain Falling Off, utilization rate is not high；On the other hand, since diamond particles are mechanical embeddings, therefore the height of its exposure is smaller,
Stock-removing efficiency is not high.
Brazed diamond tool of new generation is to be welded on diamond abrasive and workpiece substrate in the way of solder fusing
It produces together.It is excellent that doctor holds intensity, sharpness height and service life length etc. since it is high with abrasive material exposure, high
Gesture, cutting, grinding in fields such as metal material, hard brittle materials have obtained more and more applications, and have replaced in many fields
For traditional plating tool.Brazing diamond grinding tool is widely used in the cutting of each metalloid material, grinding,
The cutting processing of the hard brittle materials such as stone material, devitrified glass, plastics, carbon fiber.And it is opened in highway maintenance, geological drilling, mine
Adopt, the fields such as public safety have obtained more and more applications, the market demand gradually increases.
Since brazing diamond grinding technology is just to start the emerging technology of further investigation in recent years.Relevant doctor
Manufacturer is less, and to the production of brazed diamond tool still in the stage produced in research and development.Currently, American-European, Korea Spro
The production technology of certain brazed diamond tool has been grasped in state's a few countries and China Taiwan.
The problem commonly queried by traditional processing industry in doctor application process is: the abrasive material work of single layer
Whether tool, service life can reach very high, and whether product has very high cost performance.Although single-layer soldering tool compares electroplated diamond
The service life of tool, which has, significantly improves, but comprehensively considers the factors such as cost, market, and single layer soldering diamond tool is some
Traditional field does not simultaneously have very big advantage, and compared to mature conventional sintering diamond tool, substitutability is still not
By force.This is also that current brazing diamond grinding tool encounters one of main problem in exploiting market.
Domestic and international experts and scholars also expand a series of research aiming at the problem that single layer soldering diamond abrasive tool.Always
From the point of view of knot, mainly carried out by following two aspect.First is that the improvement of brazing diamond grinding tool base structure,
By the design and creation of shape, make the distribution of single layer abrasive material is in continuously distributed shape in the direction of the machine.For being brazed drill bit,
The straight line plane of drill end is changed to zigzag, in this way after the abrasive material of serration tips polishes, next layer of abrasive material will go out
Dew, continues to participate in processing, realizes the purpose of multilayer processing.For being brazed diamond saw blade, then saw blade outer end can be processed into
Zigzag is wavy, can equally obtain said effect.Such technique multi-layered brazing effect produced is by improving base
The physical structure of body is realized, although achieving certain effect in application process, due to that can encounter matrix and abrasive grain
Service life reduction that synchronous abrasion mismatches, single layer is averaged, the problems such as machined surface quality is poor, lead to the application range of such tool
It has certain limitations.Therefore, it is considered that such mode can only regard " quasi- multi-layered brazing " as, it is substantially still a kind of single layer soldering technique.
The production of another multi-layered brazing tool is the technique with reference to conventional sintering diamond tool, by diamond, solder,
Pore creating material is compounded by a certain percentage, and cold pressing, sintering production form.Such technique tool produced is mostly precision grinding tools.Abrasive material
Granularity is small, is applied to grinding, although and by related data according to the analysis, such tool produces centainly in abrasive surface more
Chemical reaction, make abrasive material that there is certain soldering effect, but the holding intensity of the exposure of its abrasive material, abrasive grain in conjunction with carcass,
Multilayer grindability etc. still deposits big bigger difficulty, and abrasive grain is easy to fall off greatly, and abrasive material exposure is low, and chip removal effect is poor,
The ground effect of multilayer is unobvious or even can not continue.Therefore, it is considered that such technique is not fundamentally to multi-layered brazing abrasive material
Structure is designed optimization, it is difficult to the stereotype beyond conventional sintering diamond tool.
In summary, the production of diamond tool is really realized, it is required to solve the problems, such as to include: the processing of 1, single layer soldering
Service life conventional brazing single layer tools compared with effect should be at least up to more than half of its performance；2, have what multilayer was persistently processed
Ability；3, not less than the machined surface quality of conventional monolayers doctor.Therefore, to reach above-mentioned multi-layered brazing requirement always
It is those skilled in the art's technical problem to be solved.
Summary of the invention
Its purpose of the invention is that the production technology for providing a kind of novel diamond tool with the deficiency that solves the above problems
Place, the size for realizing the brazing area by controlling brazing diamond grinding are strong come the soldering for indirectly controlling single abrasive particle
Degree, and by the structure matching of packing material, it is truly realized the sustainable processing performance of multilayer of multi-layered brazing.
It adopts the technical scheme that achieve the above object, a kind of production technology of novel diamond tool, the production
Technique the following steps are included:
Step 1: the production of compound material: by diluted material and brazing solder by volume 1:10~5:1 with blending together compound material；
Step 2: granulation package: granulation package is carried out to diamond abrasive using the compound material of step 1 production, abrasive material package makes
It is adhesively fixed with 3%~15% acetone binder of volumetric concentration；
Step 3: by the complex of diamond abrasive after package and packing material, brazing solder, 3%~15% volumetric concentration third
Ketone binder is uniformly mixed；
Step 4: mixture made from above-mentioned steps three is put into mold, pressurization sizing；
Step 5: embryo block molding in step 4 is subjected to heating soldering.
Beneficial effect
The present invention has the following advantages that compared with prior art.
1) applied widely: the present invention is applicable to natural diamond, diamond, polycrystalline diamond particle；
2) production is stablized, and various processes can be standardized, quantization operation, artificial influence factors are small；
3) process is simple, good economy performance；The brazing solder that certain volume ratio is added is and to improve weldering to improve pressure embryo forming rate
Expect mobility；And the structure matching by packing material, it is truly realized the sustainable processing performance of multilayer of multi-layered brazing；
4) bonding area on diamond abrasive surface is controlled by diluted material and the ratio of solder, and then indirectly controls abrasive grain
With the soldering combination degree of solder, and due to the soldering of abrasive grain hold intensity be directly proportional to response area of the solder to abrasive grain
, therefore indirectly controlled the weld strength of abrasive material；Abrasive material exposure is good, and holding power is controllable；Abrasive grain gap determines that chip space can
Control ensure that the ability that continues working of abrasive material, and machined surface quality is stablized；
5) be suitable for industrialized production: in conjunction with granulation, cold pressing device, the present invention can carry out mass, standardization industrial production；
6) technique of the invention is widely used in producing multi-layered brazing diamond saw blade, the more brazed diamond drill bits of layer, multilayer pricker
Weld diamond-impregnated wheel, special-shape diamond tool；It can be applied to processing of stone, gold using the diamond abrasive tool that the technique produces
The fields such as category or nonmetallic processing, mining.
Detailed description of the invention
Below in conjunction with attached drawing, the invention will be further described.
Fig. 1 is a kind of diamond abrasive granulation structural schematic diagram of production technology of novel diamond tool of the present invention；
Fig. 2 is a kind of multi-layered brazing structural model of the production technology of novel diamond tool of the present invention；
As shown in the figure: 1- diluted material, 2- brazing solder, 3- diamond abrasive, diamond abrasive after 4- is wrapped up, 5- fill material
Material.
Specific embodiment
A kind of production technology of novel diamond tool, the production technology the following steps are included:
Step 1: the production of compound material: by diluted material and brazing solder by volume 1:10~5:1 with blending together compound material；
Step 2: granulation package: granulation package is carried out to diamond abrasive using the compound material of step 1 production, abrasive material package makes
It is adhesively fixed with 3%~15% acetone binder of volumetric concentration；
Step 3: by the complex of diamond abrasive after package and packing material, brazing solder, 3%~15% volumetric concentration third
Ketone binder is uniformly mixed；
Step 4: mixture made from above-mentioned steps three is put into mold, pressurization sizing；
Step 5: embryo block molding in step 4 is subjected to heating soldering.
Diluted material in the step one is Al2O3。
Brazing solder in the step one is Ni-Cr-B-Si-Cu alloy, Cu-Sn-Ti-Ni alloy, prealloy powder
The mixing of end or elemental metals, elemental metals are the mixture of Cu powder, Sn powder, Ti powder, and the average particle size of brazing solder is 20
Mesh~300 mesh.
The addition volume of the brazing solder is 2%~65% of the geometric volume of embryo block after mold is suppressed.
The diluted material brazing solder fineness ratio 0.5~1.6.
The diamond abrasive includes one or both of natural diamond, diamond, polycrystalline diamond, more
The mixture of kind, the granularity of diamond abrasive are 10 mesh~400 mesh.
The acetone binder is polyvinyl alcohol solvent adhesive, vinyl acetate esters solvent adhesive glutinous agent, propylene
Acids solvent adhesive, polyurethanes solvent adhesive, epoxy solvent adhesive, phenolic aldehyde solvent adhesive, organic silicon solvent
One or both of adhesive, rubber solvent adhesive and two or more mixtures.
Abrasive grain after the packing material and granulation is than 0.6~1.4.
The heating soldering mode includes vacuum resistance soldering, vacuum induction soldering, high-frequency induction brazing, flame pricker
Weldering, brazing in controlled atmosphere.
Below with reference to examples and drawings, the invention will be further described.
(1) bonding area on diamond abrasive surface is controlled by diluted material and the ratio of solder.Due to dilute
It releases material and is not involved in reaction, be diluted material occupied area after brazing solder fusing and be not chemically combined, be not diluted material
Expect that shared some solder is chemically combined with abrasive grain.Therefore by controlling the volume ratio of diluted material and brazing solder,
It to control the soldering combination degree of abrasive grain and solder, and is the reaction surface with solder to abrasive grain since the soldering of abrasive grain holds intensity
Product is directly proportional, therefore has indirectly controlled the weld strength of abrasive material.In addition, in order to mix diluted material with brazing solder
Even, the fineness ratio of the two is preferably close, and optimal proportion controls between 0.5~1.6.
(2) the package granulation of diamond abrasive can be obtained by machinery granulate technique, can also be pelletized by hand.By normal
The art for coating of rule can produce the package effect of diamond abrasive, as shown in Figure 1.The solder that wherein wraps up and diluted material
Mixing with solidification is realized by acetone binder.This binder should be acetone binder, volatile, and residual is few.
(3) granularity of packing material should be approximately equal to the wear particle size after granulation, the two fineness ratio 0.6~1.4.Due to multilayer
Doctor does not require nothing more than certain sharpness, and crucial advantage is continually and steadily participate in processing, therefore in order to make
The high exposure of abrasive grain, chip space is big, and falls off after preceding layer abrasive wear and smoothly expose next layer of abrasive grain, the filling being added
Material particle size should be consistent with the wear particle size after granulation.Packing material can make uniformly to wait ratios after being mixed in a certain ratio in this way
Example is present in after granulation in abrasive grain interval, as shown in Figure 2.
(4) when mold forms, the brazing solder that certain volume ratio is added is and to improve weldering to improve pressure embryo forming rate
Expect mobility.There are certain gaps after being mixed due to the abrasive grain after granulation with packing material, as shown in Fig. 2, if directly applying
Pressure forming will lead to embryo material Hole and occur and irregular, and causes ratio of briquetting lower, and be unfavorable for welding during the brazing process
The trickling of material, it is therefore desirable to apply a certain proportion of brazing solder, volume ratio is 3%~30%.
By the above Creative Design and synthesis, the production procedure of following production diamond tool can be obtained.
As depicted in figs. 1 and 2, by diluted material 1,1:10~5:1 is compound with blending together by volume with brazing solder 2 first
Material；Diamond abrasive grain 3 is subjected to granulation package again, is rolled into the compound material for being divided into step 1 production, abrasive material package uses volume
3%~15% acetone binder of concentration is adhesively fixed；Then by the complex of diamond abrasive 4 after package and packing material 5,3%
The brazing solder 6 of~30% volume ratio, the acetone binder of 3%~15% volumetric concentration are uniformly mixed；Then by the mixed of back
It closes material and is put into mold, pressurization sizing；Finally by molding embryo block heating soldering under certain condition.Above-mentioned volume ratio refer to
The geometric volume of embryo block is what total volume calculated after mold compacting.
Specific embodiment is as follows:
Embodiment 1
A multi-layered brazing mill is now needed, is polished metal material surface.Mill specification 125mm passes through production 10
Then length × width × height=40mm × 10mm × 4mm multi-layered brazing embryo block passes through vacuum brazing furnace and is brazed.Production stage:
The first step determines that diluted material is Al2O3Particle, granularity are 120 mesh, and brazing solder is copper-based solder, and ingredient is
Copper-tin-titanium, percentage composition are as follows: copper 60%~65%, tin 19%~24%, titanium 16%~26%, nickel 1 ~ 3%.Granularity is 120 mesh.
Diamond abrasive selects diamond, and grade is high grade wear-resisting type, and granularity is 40/50 mesh.Diluted material and soldering are welded
Expect that 1:2 matches by volume and blendes together compound material.
Diamond abrasive grain is carried out granulation package by second step, is rolled into the compound material for being divided into step 1 production, abrasive material package
It is adhesively fixed using 15% acetone binder of volumetric concentration (polyvinyl alcohol solvent adhesive).Since this tool is for being ground
Metal material, it is desirable that exposure is higher, chip removal good heat dissipation effect, therefore can determine Jacket thickness in 0.15mm.
Third step, packing material select Al2O3Particle, granularity is determined by previous step enwrapped granule granularity, is computed and is determined as
25/30 mesh.By the complex of diamond abrasive after package and packing material Al2O3The copper of particle (volume ratio 45%), 8% volume ratio
Base brazing solder, the acetone binder (polyvinyl alcohol solvent adhesive) of 15% volumetric concentration are uniformly mixed.
The mixture of back is put into the mold cavity that design processes, pressure 200Mpa, compression moulding by the 4th step.
5th step, molding embryo block is dried after place vacuum brazing furnace in carry out vacuum brazing.935 degree of brazing temperature.
Heat preservation 20 minutes.
Embodiment 2
A multi-layered brazing mill is now needed, is polished metal material surface.Mill specification 125mm passes through production 10
Then length × width × height=40mm × 10mm × 4mm multi-layered brazing embryo block passes through vacuum brazing furnace and is brazed.Production stage:
The first step determines that diluted material is Al2O3Particle, granularity are 120 mesh, and brazing solder is copper-based solder, and ingredient is
Copper-tin-titanium, percentage composition are as follows: copper 60%~65%, tin 19%~24%, titanium 16%~26%, nickel 1 ~ 3%.Granularity is 120 mesh.
Diamond abrasive selects silicon carbide, by diluted material and brazing solder by volume 2:1 with blending together compound material.
Diamond abrasive grain is carried out granulation package by second step, is rolled into the compound material for being divided into step 1 production, abrasive material package
It is adhesively fixed using 80% acetone binder of volumetric concentration (polyurethanes solvent adhesive).
Third step, packing material select Al2O3Particle, granularity is determined by previous step enwrapped granule granularity, is computed and is determined as
25/30 mesh.By the complex of diamond abrasive after package and packing material Al2O3The copper of particle (volume ratio 45%), 10% volume ratio
Base brazing solder, the acetone binder (polyurethanes solvent adhesive) of 10% volumetric concentration are uniformly mixed.
The mixture of back is put into the mold cavity that design processes, pressure 200Mpa, compression moulding by the 4th step.
5th step, molding embryo block is dried after place vacuum brazing furnace in carry out vacuum brazing.935 degree of brazing temperature.
Heat preservation 20 minutes.
Embodiment 3
A multi-layered brazing mill is now needed, is polished metal material surface.Mill specification 125mm passes through production 10
Then length × width × height=40mm × 10mm × 4mm multi-layered brazing embryo block passes through vacuum brazing furnace and is brazed.Production stage:
The first step determines that diluted material is Al2O3Particle, granularity are 120 mesh, and brazing solder is copper-based solder, and ingredient is
Copper-tin-titanium, percentage composition are as follows: copper 60%~65%, tin 19%~24%, titanium 16%~26%, nickel 1 ~ 3%.Granularity is 120 mesh.
Diamond abrasive selects diamond and polycrystalline diamond, and by diluted material and brazing solder, 1:5 matches and blendes together by volume
Compound material.
Diamond abrasive grain is carried out granulation package by second step, is rolled into the compound material for being divided into step 1 production, abrasive material package
It is adhesively fixed using 10% acetone binder of volumetric concentration (acrylic solvent adhesive).
Third step, packing material select Al2O3Particle, granularity is determined by previous step enwrapped granule granularity, is computed and is determined as
25/30 mesh.By the complex of diamond abrasive after package and packing material Al2O3 particle (volume ratio 45%), 30% volume ratio
Copper base brazing solder, the acetone binder (acrylic solvent adhesive) of 3% volumetric concentration are uniformly mixed, diluted material pricker
Weld solder fineness ratio 0.5~1.6.
The mixture of back is put into the mold cavity that design processes, pressure 200Mpa, compression moulding by the 4th step.
5th step, molding embryo block is dried after place vacuum brazing furnace in carry out vacuum brazing.935 degree of brazing temperature.
Heat preservation 20 minutes.
Embodiment 4
A multi-layered brazing mill is now needed, is polished metal material surface.Mill specification 125mm passes through production 10
Then length × width × height=40mm × 10mm × 4mm multi-layered brazing embryo block passes through vacuum brazing furnace and is brazed.Production stage:
The first step determines that diluted material is Al2O3Particle, granularity are 120 mesh, and brazing solder is copper-based solder, and ingredient is
Copper-tin-titanium, percentage composition are as follows: copper 60%~65%, tin 19%~24%, titanium 16%~26%, nickel 1 ~ 3%.Granularity is 120 mesh.
Diamond abrasive selects silicon carbide, by diluted material and brazing solder by volume 2:1 with blending together compound material.
Diamond abrasive grain is carried out granulation package by second step, is rolled into the compound material for being divided into step 1 production, abrasive material package
It is adhesively fixed using 12% acetone binder of volumetric concentration.
Third step, packing material select Al2O3Particle, granularity is determined by previous step enwrapped granule granularity, is computed and is determined as
25/30 mesh.By the complex of diamond abrasive after package and packing material Al2O3 particle (volume ratio 45%), 10% volume ratio
Copper base brazing solder, the acetone binder of 12% volumetric concentration are uniformly mixed.
The mixture of back is put into the mold cavity that design processes, pressure 200Mpa, compression moulding by the 4th step.
5th step, molding embryo block is dried after place vacuum brazing furnace in carry out vacuum brazing.935 degree of brazing temperature.
Heat preservation 20 minutes.
Claims (9)
1. a kind of production technology of novel diamond tool, which is characterized in that the production technology the following steps are included:
Step 1: the production of compound material: by diluted material and brazing solder by volume 1:10~5:1 with blending together compound material；
Step 2: granulation package: granulation package is carried out to diamond abrasive using the compound material of step 1 production, abrasive material package makes
It is adhesively fixed with 3%~15% acetone binder of volumetric concentration；
Step 3: by the complex of diamond abrasive after package and packing material, brazing solder, 3%~15% volumetric concentration third
Ketone binder is uniformly mixed；
Step 4: mixture made from above-mentioned steps three is put into mold, pressurization sizing；
Step 5: embryo block molding in step 4 is subjected to heating soldering.
2. a kind of production technology of novel diamond tool according to claim 1, which is characterized in that the step one
In diluted material be Al2O3。
3. a kind of production technology of novel diamond tool according to claim 1, which is characterized in that the step one
In brazing solder be Ni-Cr-B-Si-Cu alloy, Cu-Sn-Ti-Ni alloy, pre-alloyed powder or elemental metals mixing,
Elemental metals are the mixture of Cu powder, Sn powder, Ti powder, and the average particle size of brazing solder is 20 mesh~300 mesh.
4. a kind of production technology of novel diamond tool according to claim 1, which is characterized in that the soldering weldering
The addition volume of material is 2%~65% of the geometric volume of embryo block after mold is suppressed.
5. a kind of production technology of novel diamond tool according to claim 1, which is characterized in that the dilution material
Expect brazing solder fineness ratio 0.5~1.6.
6. a kind of production technology of novel diamond tool according to claim 1, which is characterized in that the diamond
Abrasive material includes one or both of natural diamond, diamond, polycrystalline diamond, a variety of mixtures, Buddha's warrior attendant stone mill
The granularity of material is 10 mesh~400 mesh.
7. a kind of production technology of novel diamond tool according to claim 1, which is characterized in that the acetone
Binder is polyvinyl alcohol solvent adhesive, vinyl acetate esters solvent adhesive glutinous agent, acrylic solvent adhesive, polyurethane
Class solvent adhesive, epoxy solvent adhesive, phenolic aldehyde solvent adhesive, organic silicon solvent adhesive, rubber solvent gluing
One or both of agent and two or more mixtures.
8. a kind of production technology of novel diamond tool according to claim 1, which is characterized in that the filling material
Material is with the abrasive grain after granulation than 0.6~1.4.
9. a kind of production technology of novel diamond tool according to claim 1, which is characterized in that the heating pricker
Weldering mode includes vacuum resistance soldering, vacuum induction soldering, high-frequency induction brazing, gas brazing, brazing in controlled atmosphere.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112453763A (en) * | 2020-12-03 | 2021-03-09 | 广东省石油化工职业技术学校 | Preparation method of diamond grinding tool |
| CN113084719A (en) * | 2021-05-10 | 2021-07-09 | 江苏锋菱超硬工具有限公司 | Production process of multilayer brazed diamond hole drill |
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| CN104875132A (en) * | 2015-04-29 | 2015-09-02 | 上海科弗新材料科技有限公司 | Brazed superhard grinding tool and production method thereof |
| CN108161781A (en) * | 2017-12-19 | 2018-06-15 | 南京航空航天大学 | A kind of preparation method of novel multi-layer Study on Brazed Superabrasive Tools |
| CN108527176A (en) * | 2018-05-09 | 2018-09-14 | 南京固华机电科技有限公司 | A kind of production method of novel diamond tool |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104875132A (en) * | 2015-04-29 | 2015-09-02 | 上海科弗新材料科技有限公司 | Brazed superhard grinding tool and production method thereof |
| CN108161781A (en) * | 2017-12-19 | 2018-06-15 | 南京航空航天大学 | A kind of preparation method of novel multi-layer Study on Brazed Superabrasive Tools |
| CN108527176A (en) * | 2018-05-09 | 2018-09-14 | 南京固华机电科技有限公司 | A kind of production method of novel diamond tool |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112453763A (en) * | 2020-12-03 | 2021-03-09 | 广东省石油化工职业技术学校 | Preparation method of diamond grinding tool |
| CN113084719A (en) * | 2021-05-10 | 2021-07-09 | 江苏锋菱超硬工具有限公司 | Production process of multilayer brazed diamond hole drill |
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Application publication date: 20190816 |