CN110116212A - A kind of sealed sintering device of composite polycrystal-diamond - Google Patents
A kind of sealed sintering device of composite polycrystal-diamond Download PDFInfo
- Publication number
- CN110116212A CN110116212A CN201910453007.1A CN201910453007A CN110116212A CN 110116212 A CN110116212 A CN 110116212A CN 201910453007 A CN201910453007 A CN 201910453007A CN 110116212 A CN110116212 A CN 110116212A
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- CN
- China
- Prior art keywords
- cup
- diamond
- cup lid
- layer
- composite polycrystal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 34
- 239000010432 diamond Substances 0.000 title claims abstract description 34
- 239000002131 composite material Substances 0.000 title claims abstract description 24
- 238000005245 sintering Methods 0.000 title claims abstract description 23
- 229910000679 solder Inorganic materials 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims abstract description 10
- 239000000843 powder Substances 0.000 claims abstract description 10
- 150000001875 compounds Chemical class 0.000 claims abstract description 7
- 230000000903 blocking effect Effects 0.000 claims abstract description 6
- 238000002955 isolation Methods 0.000 claims description 21
- 229910045601 alloy Inorganic materials 0.000 claims description 15
- 239000000956 alloy Substances 0.000 claims description 15
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 8
- 239000010955 niobium Substances 0.000 claims description 8
- 229910052758 niobium Inorganic materials 0.000 claims description 8
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 8
- 229910000323 aluminium silicate Inorganic materials 0.000 claims description 7
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 239000000155 melt Substances 0.000 claims description 3
- 239000007921 spray Substances 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 240000006409 Acacia auriculiformis Species 0.000 claims description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- 239000004411 aluminium Substances 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052796 boron Inorganic materials 0.000 claims description 2
- 229910052793 cadmium Inorganic materials 0.000 claims description 2
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 239000011651 chromium Substances 0.000 claims description 2
- 229910017052 cobalt Inorganic materials 0.000 claims description 2
- 239000010941 cobalt Substances 0.000 claims description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 2
- 230000006835 compression Effects 0.000 claims description 2
- 238000007906 compression Methods 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 229910052698 phosphorus Inorganic materials 0.000 claims description 2
- 239000011574 phosphorus Substances 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 229910052715 tantalum Inorganic materials 0.000 claims description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 239000007800 oxidant agent Substances 0.000 claims 1
- 230000001590 oxidative effect Effects 0.000 claims 1
- 239000011135 tin Substances 0.000 claims 1
- 239000012535 impurity Substances 0.000 abstract description 5
- 239000000463 material Substances 0.000 abstract description 3
- 238000002844 melting Methods 0.000 abstract description 3
- 230000008018 melting Effects 0.000 abstract description 3
- 239000007789 gas Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910001021 Ferroalloy Inorganic materials 0.000 description 1
- 229910000592 Ferroniobium Inorganic materials 0.000 description 1
- 229910001257 Nb alloy Inorganic materials 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005087 graphitization Methods 0.000 description 1
- ZFGFKQDDQUAJQP-UHFFFAOYSA-N iron niobium Chemical compound [Fe].[Fe].[Nb] ZFGFKQDDQUAJQP-UHFFFAOYSA-N 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/12—Both compacting and sintering
- B22F3/14—Both compacting and sintering simultaneously
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
- B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
- B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
- B22F2007/042—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal characterised by the layer forming method
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Materials Engineering (AREA)
- Ceramic Products (AREA)
- Powder Metallurgy (AREA)
Abstract
The invention belongs to super-hard compound material fields, more particularly to a kind of sealed sintering device of composite polycrystal-diamond, cup body including open top, the cup top inner wall radial integrated, which extends, is equipped with flange, described device further includes bottom opening and the cup lid for blocking cup top opening, cup lid top inner wall, which attaches, is equipped with solder layer, and under cup lid and cup body assembled state, solder layer covers flange top surface.The present invention carries out vacuum, welded seal processing by setting solder layer and to device before high temperature and pressure is sintered, so that solder layer melting is to close cup lid and the intracorporal space of cup, it ensure that consistency and stability of the space environment in subsequent high temperature high pressure sintering processes, diamond powder inner space prevented to be mixed into impurity and gas；It is vacuum-treated simultaneously and welded seal is handled while being carried out, also improve efficiency.
Description
Technical field
The invention belongs to a kind of sealed sintering of super-hard compound material field more particularly to composite polycrystal-diamond dresses
It sets.
Background technique
Composite polycrystal-diamond is to be combined by diamond powder and hard alloy substrate by high temperature and pressure, due to
It not only has the high rigidity, high-wearing feature and thermal conductivity of diamond, but also the intensity with hard alloy and shock resistance are tough
Property, it is the ideal material for manufacturing wear resistant tools, is widely used in the fields such as petroleum, geological drilling.
High-end composite polycrystal-diamond needs to carry out at high-temperature vacuum heat treatment and sealing before by high temperature and pressure
Reason to increase the degree of graphitization of diamond powder, while removing internal impurity and air, with the stability inside raising.
In current composite sheet production process, mostly it is progress high-temperature vacuum heat treatment after assembling, is carried out after heat treatment close
The shortcomings that envelope operation, this method is that cannot be sealed in time to diamond powder, so that the internal environment of diamond powder
It cannot ensure there is the phenomenon that gas and impurity are mixed into, and then reduce the overall performance of composite polycrystal-diamond.
Summary of the invention
The object of the present invention is to provide a kind of sealed sintering device of composite polycrystal-diamond, device knot of the present invention
Structure is simple, can be sealed before high temperature and pressure is sintered to diamond powder, gas and impurity is prevented to be mixed into wherein.
In order to solve the above technical problems, The technical solution adopted by the invention is as follows:
A kind of sealed sintering device of composite polycrystal-diamond, the cup body including open top, the cup top inner wall diameter
Extend to one and be equipped with flange, described device further includes bottom opening and the cup lid for blocking cup top opening, cup lid top
Portion's inner wall, which attaches, is equipped with solder layer, and under cup lid and cup body assembled state, solder layer covers flange top surface.
Preferably, also clearance fit has the first isolation layer in the cup body, and the first isolation layer covers flange bottom surface and blocks
The top notch of cup body.
Preferably, the solder layer attaches the setting of cup lid inner wall, and the cup lid axial height is 3-5mm.
Preferably, also clearance fit has the second isolation layer in the cup lid, and the second isolation layer solder layer bottom surface that reclines is set
It sets.
Preferably, it is additionally provided with the second isolation layer in the cup lid, the second isolation layer reclines bottom surface setting at the top of solder layer
And with the solder layer clearance fit on cup lid circumferential direction inner sidewall.
Preferably, the isolation layer is simple substance, mixture or the alloy and alloy mixture of iron or niobium, such as niobium simple substance, niobium
Alloy, iron, ferroalloy, ferro-niobium mixture or combination.
Preferably, the solder layer by copper, nickel, cobalt, gold, silver, manganese, palladium, titanium, niobium, zinc, phosphorus, boron, aluminium, cadmium, chromium, tin,
The alloy or compound of silicon or tantalum are made.
The application method of the sealed sintering device of the composite polycrystal-diamond, steps are as follows:
1) cup body of open top is taken, inserts one layer of diamond powder and alloy substrate one after another thereto and to compression, is being closed
Above auri body after the first insulating layer of assembly, to the flanging of cup top open end to form flange, then by the cup lid and cup
Assembly at the top of body；
2) it will be installed under vacuum environment obtained by step 1) and be heated to 1000-1200 DEG C, so that solder layer melts.
Preferably, in step 1), before assembling the first insulating layer, item alloy substrate top surface sprays alumino-silicate to formation
The aluminosilicate layer of 0.4-0.8mm.
Compared with the prior art, the invention has the following advantages:
1) present invention carries out vacuum, welded seal processing by setting solder layer and to device before high temperature and pressure is sintered, and makes
Solder layer melting is obtained to close cup lid and the intracorporal space of cup, ensure that the space environment in subsequent high temperature high pressure sintering processes
In consistency and stability, prevent diamond powder inner space to be mixed into impurity and gas；It is vacuum-treated and welds simultaneously and is close
Envelope is handled while being carried out, and also improves efficiency.
2) rationally, melting can be effectively prevented in the setting of the first, second insulating layer for apparatus structure design of the present invention
State welding compound enters cup body inner space and pollutes, while aluminosilicate layer plays the role of preventing bonding, prevents later period height
In warm high pressure sintering processes, the first insulating layer and alloy substrate adhesion.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the sealed sintering device of composite polycrystal-diamond described in embodiment 1；
Fig. 2 is the structural schematic diagram of the sealed sintering device of composite polycrystal-diamond described in embodiment 2.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
Embodiment 1
A kind of sealed sintering device of composite polycrystal-diamond, the cup body 101 including open top, 101 top of cup body
Inner wall radial integrated, which extends, is equipped with flange, and described device further includes bottom opening and the cup lid for blocking cup top opening
108,108 top inner wall of cup lid, which attaches, is equipped with solder layer 107, and under cup lid 108 and cup body assembled state, solder layer 107 is hidden
Cover flange top surface.101 go back the first isolation layer 105 that clearance fit has niobium in the cup body, and the first isolation layer 105 covers flange
Bottom surface and the top notch for blocking cup body 101.
Also clearance fit the second isolation layer 106 for having niobium in the cup lid 108, the second isolation layer 106 recline welding compound
The setting of 107 bottom surface of layer.108 axial height of cup lid is 3-5mm.
Embodiment 2
A kind of sealed sintering device of composite polycrystal-diamond, the cup body 101 including open top, 101 top of cup body
Inner wall radial integrated, which extends, is equipped with flange, and described device further includes bottom opening and the cup lid for blocking cup top opening
108, the inner wall of cup lid 108, which attaches, is equipped with solder layer 107, and under cup lid 108 and cup body assembled state, solder layer 107 is covered
101 top exterior walls of cup body.The first isolation layer 105 that clearance fit has niobium is gone back in the cup body 101, the first isolation layer 105 hides
It covers flange bottom surface and blocks the top notch of cup body 101.
It is additionally provided with the second isolation layer 106 made of iron in the cup lid 108, the second isolation layer 106 reclines the top of solder layer 107
The setting of portion bottom surface and with 107 clearance fit of solder layer on the circumferential inner sidewall of cup lid 108.108 axial height of cup lid is
3-5mm。
The application method of Examples 1 and 2 described device is as follows:
1) cup body 101 of open top is taken, inserts one layer of diamond powder 102 and alloy substrate 103 and right one after another thereto
It compresses, sprays alumino-silicate to the aluminosilicate layer 104 for forming 0.4-0.8mm, then in sial in alloy substrate top surface
It, then will be described to 101 open top side pressure side of cup body to form flange after assembling the first insulating layer 105 above silicate layer 104
It is assembled at the top of cup lid 108 and cup body 107；
2) it will be installed under vacuum environment obtained by step 1) and be heated to 1000-1200 DEG C, so that solder layer 107 melts.
Claims (9)
1. a kind of sealed sintering device of composite polycrystal-diamond, the cup body including open top, which is characterized in that the cup
Body top inner wall radial integrated, which extends, is equipped with flange, and described device further includes that bottom is open and open for blocking cup top
Cup lid, cup lid top inner wall, which attaches, is equipped with solder layer, and under cup lid and cup body assembled state, solder layer covers flange top surface.
2. the sealed sintering device of composite polycrystal-diamond as described in claim 1, which is characterized in that in the cup body also
Clearance fit has the first isolation layer, and the first isolation layer covers flange bottom surface and blocks the top notch of cup body.
3. the sealed sintering device of composite polycrystal-diamond as described in claim 1, which is characterized in that the solder layer
The setting of cup lid inner wall is attached, the cup lid axial height is 3-5mm.
4. the sealed sintering device of composite polycrystal-diamond as described in claim 1, which is characterized in that in the cup lid also
Clearance fit has the second isolation layer, and the second isolation layer reclines the setting of solder layer bottom surface.
5. the sealed sintering device of composite polycrystal-diamond as claimed in claim 3, which is characterized in that in the cup lid also
Equipped with the second isolation layer, the second isolation layer recline at the top of solder layer bottom surface setting and with the welding compound on cup lid circumferential direction inner sidewall
Lamellar spacing cooperation.
6. the sealed sintering device of the composite polycrystal-diamond as described in claim 2,4 or 5, which is characterized in that it is described every
Exhausted layer is simple substance, mixture or the alloy and alloy mixture of iron or niobium.
7. the sealed sintering device of composite polycrystal-diamond a method as claimed in any one of claims 1 to 5, which is characterized in that the weldering
Oxidant layer is connect by the alloy or compound of copper, nickel, cobalt, gold, silver, manganese, palladium, titanium, niobium, zinc, phosphorus, boron, aluminium, cadmium, chromium, tin, silicon or tantalum
It is made.
8. the application method of the sealed sintering device of any composite polycrystal-diamond of claim 1-7, which is characterized in that
Steps are as follows:
1) cup body of open top is taken, inserts one layer of diamond powder and alloy substrate one after another thereto and to compression, is being closed
Above auri body after the first insulating layer of assembly, to the flanging of cup top open end to form flange, then by the cup lid and cup
Assembly at the top of body；
2) it will be installed under vacuum environment obtained by step 1) and be heated to 1000-1200 DEG C, so that solder layer melts.
9. the application method of the sealed sintering device of composite polycrystal-diamond as claimed in claim 8, is characterized in that, step
1) in, before assembling the first insulating layer, item alloy substrate top surface sprays alumino-silicate to the alumino-silicate for forming 0.4-0.8mm
Layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910453007.1A CN110116212A (en) | 2019-05-28 | 2019-05-28 | A kind of sealed sintering device of composite polycrystal-diamond |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910453007.1A CN110116212A (en) | 2019-05-28 | 2019-05-28 | A kind of sealed sintering device of composite polycrystal-diamond |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110116212A true CN110116212A (en) | 2019-08-13 |
Family
ID=67523409
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910453007.1A Pending CN110116212A (en) | 2019-05-28 | 2019-05-28 | A kind of sealed sintering device of composite polycrystal-diamond |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110116212A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111850335A (en) * | 2020-07-27 | 2020-10-30 | 深圳市海明润超硬材料股份有限公司 | Diamond composite sheet easy to remove cobalt and preparation method thereof |
| CN113245545A (en) * | 2021-04-15 | 2021-08-13 | 中石化江钻石油机械有限公司 | Diamond composite sheet inner synthesis mold packaging structure and packaging method |
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| CN105798312A (en) * | 2016-03-16 | 2016-07-27 | 郑州新亚复合超硬材料有限公司 | Sintering process for diamond composite piece used for petroleum drill bit |
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