CN110112156A - A kind of dot structure, cmos image sensor and terminal - Google Patents

A kind of dot structure, cmos image sensor and terminal Download PDF

Info

Publication number
CN110112156A
CN110112156A CN201910330862.3A CN201910330862A CN110112156A CN 110112156 A CN110112156 A CN 110112156A CN 201910330862 A CN201910330862 A CN 201910330862A CN 110112156 A CN110112156 A CN 110112156A
Authority
CN
China
Prior art keywords
photodiode
light
dot structure
receiving surface
light receiving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201910330862.3A
Other languages
Chinese (zh)
Other versions
CN110112156B (en
Inventor
杨鑫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Oppo Mobile Telecommunications Corp Ltd
Original Assignee
Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong Oppo Mobile Telecommunications Corp Ltd filed Critical Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority to CN201910330862.3A priority Critical patent/CN110112156B/en
Publication of CN110112156A publication Critical patent/CN110112156A/en
Application granted granted Critical
Publication of CN110112156B publication Critical patent/CN110112156B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/14603Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
    • H01L27/14605Structural or functional details relating to the position of the pixel elements, e.g. smaller pixel elements in the center of the imager compared to pixel elements at the periphery
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/1462Coatings
    • H01L27/14621Colour filter arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/14625Optical elements or arrangements associated with the device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14643Photodiode arrays; MOS imagers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/71Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
    • H04N25/75Circuitry for providing, modifying or processing image signals from the pixel array
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Light Receiving Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Abstract

The embodiment of the present application discloses a kind of dot structure, wherein, the dot structure includes optical filter, photodiode and reading circuit, wherein, optical filter is for being filtered the incident light received, obtain the light of specific wavelength, photodiode is placed in optical filter back to the side on the surface of incident light, it is staggered relatively back to the surface of incident light in the light receiving surface and optical filter of photodiode, photodiode is used for when the side length of light receiving surface square in dot structure is less than specific wavelength, according to the resonant wavelength of the light receiving surface of photodiode, it is absorbed to specific wavelength is received, and the light being absorbed into is converted into electric signal, reading circuit is connected with the cathode of photodiode, for reading electric signal.The embodiment of the present application also provides a kind of cmos image sensor and terminal simultaneously.

Description

A kind of dot structure, cmos image sensor and terminal
Technical field
This application involves (CMOS, Complementary the Metal Oxide of complementary metal oxide semiconductor in terminal Semiconductor) dot structure of imaging sensor schemes the absorption techniques of light more particularly to a kind of dot structure, CMOS As sensor and terminal.
Background technique
In the product that cmos image sensor is widely used in photography and vedio recording because its manufacturing cost is low and low in energy consumption, for For cmos image sensor, higher sensitivity, shorter exposure time and the Pixel Dimensions increasingly reduced have become CMOS figure As the development trend of sensor.
Currently, the Pixel Dimensions of traditional dot structure are about 800nm, still, when Pixel Dimensions are contracted to lower than certainly The wavelength of right light, for example, photodiode sharply declines the absorptivity of light in dot structure when Pixel Dimensions are lower than 200nm, Cause absorptivity very low, in this way, being unfavorable for the imaging of cmos image sensor;It can thus be seen that existing small-sized pixel There is the very low technical problem of the absorptivity to light in structure.
Summary of the invention
The embodiment of the present application is intended to provide a kind of dot structure, cmos image sensor and terminal, it is intended to improve small size Absorptivity of the dot structure to light.
The technical solution of the application is achieved in that
The embodiment of the present application provides a kind of dot structure, and the dot structure includes optical filter, photodiode and reading Circuit out;Wherein,
The optical filter obtains the light of specific wavelength for being filtered to the incident light received;
The photodiode is placed in the optical filter back to the side on the surface of the incident light, the photoelectricity two The light receiving surface of pole pipe with it is staggered relatively back to the surface of the incident light in the optical filter, the photodiode is for working as When the side length of square light receiving surface is less than the specific wavelength in the dot structure, according to the light of the photodiode The resonant wavelength of receiving plane absorbs the specific wavelength, and the light being absorbed into is converted to electric signal;Wherein, described Wavelength when resonant wavelength is the light receiving surface generation RESONANCE ABSORPTION of the photodiode;
The reading circuit is connected with the cathode of the photodiode, for reading the electric signal.
In above-mentioned dot structure, the specific wavelength is within the scope of the resonant wavelength.
In above-mentioned dot structure, the specific wavelength includes following any one: red light wavelength, yellow wavelengths, blue light Wavelength.
In above-mentioned dot structure, the area of the light receiving surface of the photodiode is less than in the dot structure in just The area of rectangular light receiving surface.
In above-mentioned dot structure, the shape of the light receiving surface of the photodiode includes following any one: round, Square, triangle, pentagon and hexagon.
In above-mentioned dot structure, the volume of the photodiode is cylindrical body;Wherein, the light of the photodiode Receiving plane is one of rounded bottom surface of the cylindrical body.
In above-mentioned dot structure, when the light receiving surface of the photodiode is round, the photodiode The resonant wavelength of light receiving surface and circular the being positively correlated property of diameter.
In above-mentioned dot structure, when the specific wavelength is blue light wavelength, and square light in the dot structure When the side length of receiving plane is 100nm, the diameter of the round light receiving surface of the photodiode is 70nm.
The embodiment of the present application also provides a kind of cmos image sensor, the cmos image sensor includes said one Or dot structure described in multiple embodiments.
The embodiment of the present application also provides a kind of terminal, the terminal includes the sensing of cmos image described in above-described embodiment Device.
The embodiment of the present application provides a kind of dot structure, cmos image sensor and terminal, which includes filter Mating plate, photodiode and reading circuit, wherein optical filter obtains certain wave for being filtered to the incident light received Long light, photodiode are placed in optical filter back to the side on the surface of incident light, the light receiving surface of photodiode with Surface in optical filter back to incident light is staggered relatively, and photodiode is used for when square light receiving surface in dot structure When side length is less than specific wavelength, according to the resonant wavelength of the light receiving surface of photodiode, specific wavelength is absorbed, and will The light being absorbed into is converted to electric signal, wherein wave when resonant wavelength is the light receiving surface generation RESONANCE ABSORPTION of photodiode Long, reading circuit is connected with the cathode of photodiode, for reading electric signal;That is, in the embodiment of the present application, After monochromatic light is obtained by filtration in optical filter, when dot structure size is less than the monochromatic wavelength, photodiode is utilized The resonant wavelength of light receiving surface is realized to monochromatic absorption, in this way, it is only necessary to adjust being total to for the light receiving surface of photodiode Vibration wave is long, and monochromatic light is absorbed by way of RESONANCE ABSORPTION by photodiode, so as to avoid due to pixel knot Low absorptivity caused by structure is smaller, improves small-sized pixel structure to the absorptivity of light, and then be conducive to the imaging of light.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of dot structure;
Fig. 2 is a kind of structural schematic diagram of optional dot structure provided by the embodiments of the present application;
Fig. 3 is a kind of top view of optional dot structure provided by the embodiments of the present application;
Fig. 4 is a kind of absorption spectra line chart of the photodiode of optional cylindrical body provided by the embodiments of the present application;
Fig. 5 is that a kind of structure of photodiode optionally with round light receiving surface provided by the embodiments of the present application is shown It is intended to;
Fig. 6 is the arrangement schematic diagram of the polarization direction of the light of specific wavelength corresponding with Fig. 5 provided by the embodiments of the present application;
Fig. 7 is a kind of structure of optionally photodiode with square light receiving plane provided by the embodiments of the present application Schematic diagram;
Fig. 8 is the knot of another optionally photodiode with square light receiving plane provided by the embodiments of the present application Structure schematic diagram;
Fig. 9 is a kind of structural schematic diagram of optional cmos image sensor provided by the embodiments of the present application;
Figure 10 is a kind of structural schematic diagram of optional terminal provided by the embodiments of the present application.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present application, technical solutions in the embodiments of the present application carries out clear, complete Site preparation description.
Embodiment one
The embodiment of the present application provides a kind of dot structure.
Currently, in practical applications, important component of the dot structure as cmos image sensor can be completed pair The natural light received carries out photoelectric conversion, so that electric signal is obtained, however, the Pixel Dimensions of dot structure are about 800nm When left and right, dot structure can satisfy requirement to the absorptivity of natural light, still, when the Pixel Dimensions of dot structure are about When 200nm, the dot structure is extremely low to the absorptivity of natural light, to influence the imaging of cmos image sensor.
Specifically, Fig. 1 is the structural schematic diagram of dot structure, refering to what is shown in Fig. 1, traditional dot structure is generally by three Part form, be optical filter, photodiode and metal winding displacement respectively, wherein photodiode be placed in optical filter back to The side on the surface of incident light, also, the photodiode for generally CMOS technology being used to produce is in a rectangular parallelepiped shape, and photoelectricity , the light receiving surface of photodiode and optical filtering staggered relatively back to the surface of incident light in the light receiving surface and optical filter of diode The piece big similar shape such as substantially, and the light receiving surface of photodiode is the anode of photodiode, the cathode of photodiode is located at The lower surface of photodiode, and the cathode of photodiode is connected with metal winding displacement enables metal winding displacement by telecommunications Number read.
In Fig. 1, optical filter is for being filtered natural light, so that monochromatic light is filtered out, then, when dot structure is in When the side length (being equivalent to above-mentioned Pixel Dimensions) of square light receiving plane is more than or equal to monochromatic wavelength, photodiode can To by monochromatic light absorption, and by the light being absorbed into be converted to electric signal, read using metal winding displacement, thus realize to light at Picture.
But when the side length of light receiving surface square in dot structure is less than monochromatic wavelength, natural light is injected Optical filter, after filtering, since the side length that monochromatic wavelength is greater than dot structure can be diffracted, to can not absorb Light, so that cmos image sensor can not be imaged.
In order to improve small-sized pixel structure to the absorptivity of light, the embodiment of the present application provides a kind of dot structure, Fig. 2 For a kind of structural schematic diagram of optional dot structure provided by the embodiments of the present application, refering to what is shown in Fig. 2, the dot structure can be with Including optical filter 21, photodiode 22 and reading circuit 23;Wherein,
Optical filter 21 obtains the light of specific wavelength for being filtered to the incident light received;
Photodiode 22 is placed in optical filter 21 back to the side on the surface of incident light, and the light of photodiode 22 connects Receipts face with it is staggered relatively back to the surface of incident light in optical filter 21, photodiode 22 is used for square in the dot structure When the side length of light receiving surface is less than specific wavelength, according to the resonant wavelength of the light receiving surface of photodiode 22, to specific wavelength It is absorbed, and the light being absorbed into is converted into electric signal;
Reading circuit 23 is connected with the cathode of photodiode 22, for reading electric signal.
Wherein, wavelength when resonant wavelength is the light receiving surface generation RESONANCE ABSORPTION of photodiode 22.
Specifically, after optical filter is filtered natural light, the light of specific wavelength is obtained, when being in dot structure When the side length of square light receiving plane is less than specific wavelength, specific wavelength is diffracted in order to prevent, here, utilizes two pole of photoelectricity The Resonance Absorption Properties of the light receiving surface of pipe so that photodiode according to the resonant wavelength of its light receiving surface to specific wavelength into Row absorbs.
Wherein, the refractive index and light of the light receiving surface of the resonant wavelength and photodiode of the light receiving surface of photodiode The size of the light receiving surface of electric diode is related, so, can by adjusting the refractive index of the light receiving surface of photodiode, And/or adjust the size of the light receiving surface of photodiode, come adjust photodiode light receiving surface resonant wavelength.
In general, being total to by adjusting the size of the light receiving surface of photodiode to adjust the light receiving surface of photodiode Vibration wave is long, so that specific wavelength is within the scope of the resonant wavelength of the light receiving surface of photodiode, so that photoelectricity The light receiving surface of diode realizes RESONANCE ABSORPTION to the light of specific wavelength.
That is, in the embodiment of the present application, using the characteristic of the light receiving surface RESONANCE ABSORPTION of photodiode, so that With the light of specific wavelength RESONANCE ABSORPTION can occur for photodiode, to improve absorption of the small-sized pixel structure to light Rate.
In order to improve the absorptivity to the light of specific wavelength, in an alternative embodiment, specific wavelength is in resonance wave Within the scope of length.
Here, specific wavelength can be a wave-length coverage, for example, blue light wavelength, due to the light-receiving of photodiode Face resonant wavelength is related with the shape of light receiving surface, and the resonant wavelength of the light receiving surface of different shapes can be a wavelength model It encloses, wherein a part that can be specific wavelength is located within the scope of resonant wavelength, is also possible to specific wavelength all altogether Within the scope of vibration wave is long, it should be noted that in the light of specific wavelength, the light that can be realized RESONANCE ABSORPTION is more, absorbs Rate is higher.
For above-mentioned specific wavelength, in an alternative embodiment, the light of specific wavelength includes following any one : red light wavelength, yellow wavelengths, blue light wavelength.
In practical applications, specific wavelength can be any wavelength of visible light.
Wherein, above-mentioned optical filter can be the Red lightscreening plate for filtering feux rouges, be also possible to for filtering yellow light Yellow filter can also be the blue color filter for filter blue light, and here, the embodiment of the present application is not especially limited.
In order to enable specific wavelength is within the scope of resonant wavelength, and in an alternative embodiment, photodiode Light receiving surface area be less than dot structure in square light receiving surface area.
Specifically, in traditional dot structure, the light receiving surface of photodiode and the optical filter big similar shape such as substantially, However, for the structure for using traditional photodiode for small-sized pixel structure, it is extremely low to the absorptivity of light, in order to mention High absorptivity can mainly reduce light by adjusting the mode of the resonant wavelength of the light receiving surface of photodiode, here The area of the light receiving surface of electric diode, the area of the light receiving surface by reducing photodiode, so that being incident on photoelectricity two The light of specific wavelength on the light receiving surface of pole pipe is by RESONANCE ABSORPTION.
Wherein, the shape of the light receiving surface of photodiode includes following any one: circle, square, triangle, five Side shape and hexagon.
It, can also be with for example, regular polygon that is, the light receiving surface of photodiode can be well-regulated shape For random shape, here, the embodiment of the present application is not especially limited.
Light receiving surface for photodiode is regular shape, can be round and square etc. shape,
Fig. 3 is a kind of top view of optional dot structure provided by the embodiments of the present application, refering to what is shown in Fig. 3, periphery Square be dot structure light receiving surface, in order to adjust photodiode light receiving surface resonant wavelength, by two pole of photoelectricity The light receiving surface of pipe is fabricated to circle, and the resonance wave of the light receiving surface of photodiode is adjusted by adjusting circular diameter It is long.
In order to reduce the coupling between photodiode, in an alternative embodiment, photodiode is cylindrical body;
Wherein, the light receiving surface of photodiode is one of rounded bottom surface of cylindrical body.
That is, being the photodiode needed by each dot structure and phase in production cmos image sensor It is spaced between the photodiode of adjacent dot structure, since fringing field can be made very when RESONANCE ABSORPTION occurs for photodiode By force, increase the mutual crosstalk that interval is light between the photodiode of adjacent pixel structure in order to prevent.So in practical application In, the RESONANCE ABSORPTION to light not only may be implemented using the structure of cylindrical body in technique, can also preferably control adjacent two The interval of a photodiode.
Fig. 4 is a kind of absorption spectra line chart of the photodiode of optional cylindrical body provided by the embodiments of the present application, such as Fig. 4 Shown, abscissa is absorbing wavelength, and ordinate is absorptivity, and the different bottom surface radiuses of cylinder correspond to different absorption lines, In, such as radius r=30nm (short dash line in Fig. 4) in Fig. 4, r=35nm (the alternate dotted line of length in Fig. 4), r=40nm (solid line in Fig. 4) and r=45nm (the alternate dotted line of dotted line in Fig. 4), further include the structure pair of traditional photodiode The absorption line (the long dotted line in Fig. 4) answered;Simulation in Fig. 4 is the simulation based on linearly polarized light.
In order to preferably adjust photodiode light receiving surface resonant wavelength, in an alternative embodiment, when When the light receiving surface of photodiode is round, the resonant wavelength of the light receiving surface of photodiode and circular diameter are in positive Guan Xing.
It specifically, is for circle for the light receiving surface of photodiode, Fig. 5 is provided by the embodiments of the present application one Kind optionally has the structural schematic diagram of the photodiode of round light receiving surface, as shown in figure 5, the light-receiving of photodiode Face is circle;Fig. 6 is the arrangement signal of the polarization direction of the light of specific wavelength corresponding with Fig. 5 provided by the embodiments of the present application Figure, as shown in fig. 6, the polarization in all directions has in other words since the opinion of nature does not polarize, so, for circle For the photodiode of light receiving surface, all directions are the same sexes, so, the photodiode of round light receiving surface and common Light absorption as.
In addition, for photodiode light receiving surface be square for, Fig. 7 be one kind provided by the embodiments of the present application The structural schematic diagram of the optional photodiode with square light receiving plane, as shown in fig. 7, the light-receiving of photodiode Face is square;Assuming that being determined as 100nm for the side length of square light receiving surface in dot structure, photodiode is in The side length of the light receiving surface of square is 70nm, for the polarization for being parallel to square side length light (in Fig. 7 with double-head arrow Shown in straight line) for, the circle of resonant position and diameter 70nm should be much the same.
Fig. 8 is the knot of another optionally photodiode with square light receiving plane provided by the embodiments of the present application Structure schematic diagram, as shown in figure 8, when the polarization of light diagonally (shown in the straight line with double-head arrow in Fig. 8) when, it is right Red shift occurs for diagonal length about 100nm, corresponding resonant position, and maximum absorption position is mobile (similar in Fig. 4 toward long wavelength Change absorption peak red shift caused by the diameter of bottom cylindrical face), when natural lighting is got on, final absorption should be class It is similar to be equivalent to the overlaying state absorbed from r=35nm to r=45nm, can be broadened compared to original spectral line, absorption originally Peak half-peak breadth may be in 50nm or so, and square may widen 100nm to the absorption peak of natural light.But there is optical filtering It is this not influence in the case where piece.
For the photodiode of round light receiving surface, the refractive index of resonant wavelength=photodiode light receiving surface × Round diameter+constant, wherein the constant is a constant related with the structure of photodiode.
In order to enable RESONANCE ABSORPTION is better achieved in photodiode, in an alternative embodiment, work as specific wavelength For blue light wavelength, and when the side length of square light receiving surface is 100nm in dot structure, the round light-receiving of photodiode The diameter in face is 70nm.
In practical applications, however, it is determined that the side length of square light receiving surface is determined as 100nm in dot structure, in order to make The wavelength of blue light is obtained within the scope of resonant wavelength, the diameter of the round light receiving surface of photodiode can be set to 70nm so that the small-sized pixel structure produced can preferably absorb light, and then is preferably imaged.
In one example, the side length of square light receiving surface is determined as 100nm in dot structure, using the light of cylindrical body Electric diode structure, 95% blue light can be absorbed using 70nm for the diameter of bottom cylindrical face, so as to realize blue light monochromatic light Imaging.
The embodiment of the present application provides a kind of dot structure, which includes optical filter, photodiode and reading Circuit, wherein optical filter obtains the light of specific wavelength, the photodiode for being filtered to the incident light received It is placed in the optical filter back to the side on the surface of the incident light, is carried on the back in the light receiving surface and optical filter of photodiode Staggered relatively to the surface of incident light, photodiode is used to be less than spy when the side length of square light receiving surface in dot structure When standing wave is long, according to the resonant wavelength of the light receiving surface of photodiode, specific wavelength is absorbed, and will be absorbed into light Be converted to electric signal, wherein wavelength when resonant wavelength is the light receiving surface generation RESONANCE ABSORPTION of photodiode, reading circuit It is connected with the cathode of photodiode, for reading electric signal;That is, in the embodiment of the present application, by optical filter After monochromatic light is obtained by filtration, when dot structure size is less than the monochromatic wavelength, the light receiving surface of photodiode is utilized Resonant wavelength is realized to monochromatic absorption, in this way, it is only necessary to the resonant wavelength of the light receiving surface of photodiode is adjusted, so that Monochromatic light can be absorbed by way of RESONANCE ABSORPTION by photodiode, so as to avoid due to dot structure it is smaller caused by Low absorptivity improves small-sized pixel structure to the absorptivity of light, and then is conducive to the imaging of light.
Embodiment two
Fig. 9 is a kind of structural schematic diagram of optional cmos image sensor provided by the embodiments of the present application, such as Fig. 9 institute Show, the embodiment of the present application provides a kind of cmos image sensor 900, and cmos image sensor 900 includes said one or more Dot structure described in a embodiment.
Figure 10 is a kind of structural schematic diagram of optional terminal provided by the embodiments of the present application, as shown in Figure 10, the application Embodiment provides a kind of terminal 1000, and terminal 1000 includes cmos image sensor described in above-described embodiment.
It should be understood by those skilled in the art that, embodiments herein can provide as method, system or computer program Product.Therefore, the shape of hardware embodiment, software implementation or embodiment combining software and hardware aspects can be used in the application Formula.Moreover, the application, which can be used, can use storage in the computer that one or more wherein includes computer usable program code The form for the computer program product implemented on medium (including but not limited to magnetic disk storage and optical memory etc.).
The application is referring to method, the process of equipment (system) and computer program product according to the embodiment of the present application Figure and/or block diagram describe.It should be understood that every one stream in flowchart and/or the block diagram can be realized by computer program instructions The combination of process and/or box in journey and/or box and flowchart and/or the block diagram.It can provide these computer programs Instruct the processor of general purpose computer, special purpose computer, Embedded Processor or other programmable data processing devices to produce A raw machine, so that being generated by the instruction that computer or the processor of other programmable data processing devices execute for real The device for the function of being specified in present one or more flows of the flowchart and/or one or more blocks of the block diagram.
These computer program instructions, which may also be stored in, is able to guide computer or other programmable data processing devices with spy Determine in the computer-readable memory that mode works, so that it includes referring to that instruction stored in the computer readable memory, which generates, Enable the manufacture of device, the command device realize in one box of one or more flows of the flowchart and/or block diagram or The function of being specified in multiple boxes.
These computer program instructions also can be loaded onto a computer or other programmable data processing device, so that counting Series of operation steps are executed on calculation machine or other programmable devices to generate computer implemented processing, thus in computer or The instruction executed on other programmable devices is provided for realizing in one or more flows of the flowchart and/or block diagram one The step of function of being specified in a box or multiple boxes.
The above, the only preferred embodiment of the application, are not intended to limit the protection scope of the application.

Claims (10)

1. a kind of dot structure, which is characterized in that the dot structure includes optical filter, photodiode and reading circuit;Its In,
The optical filter obtains the light of specific wavelength for being filtered to the incident light received;
The photodiode is placed in the optical filter back to the side on the surface of the incident light, the photodiode Light receiving surface with it is staggered relatively back to the surface of the incident light in the optical filter, the photodiode is used for when described When the side length of square light receiving surface is less than the specific wavelength in dot structure, according to the light-receiving of the photodiode The resonant wavelength in face absorbs the specific wavelength, and the light being absorbed into is converted to electric signal;Wherein, the resonance Wavelength when wavelength is the light receiving surface generation RESONANCE ABSORPTION of the photodiode;
The reading circuit is connected with the cathode of the photodiode, for reading the electric signal.
2. dot structure according to claim 1, which is characterized in that range of the specific wavelength in the resonant wavelength Within.
3. dot structure according to claim 1, which is characterized in that the specific wavelength includes following any one: red Optical wavelength, yellow wavelengths, blue light wavelength.
4. dot structure according to claim 3, which is characterized in that the area of the light receiving surface of the photodiode is small The area of square light receiving surface in the dot structure.
5. dot structure according to claim 4, which is characterized in that the shape packet of the light receiving surface of the photodiode Include following any one: circle, square, triangle, pentagon and hexagon.
6. dot structure according to claim 5, which is characterized in that the volume of the photodiode is cylindrical body;Its In, the light receiving surface of the photodiode is one of rounded bottom surface of the cylindrical body.
7. dot structure according to claim 5 or 6, which is characterized in that when the light receiving surface of the photodiode is When round, the resonant wavelength of the light receiving surface of the photodiode and circular the being positively correlated property of diameter.
8. dot structure according to claim 5 or 6, which is characterized in that when the specific wavelength is blue light wavelength, and institute State square light receiving surface in dot structure side length be 100nm when, the round light receiving surface of the photodiode it is straight Diameter is 70nm.
9. a kind of complementary metal oxide semiconductor cmos image sensor, which is characterized in that the cmos image sensor packet Include dot structure described in any one of the claims 1 to 8.
10. a kind of terminal, which is characterized in that the terminal includes cmos image sensor described in the claims 9.
CN201910330862.3A 2019-04-23 2019-04-23 Pixel structure, CMOS image sensor and terminal Active CN110112156B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910330862.3A CN110112156B (en) 2019-04-23 2019-04-23 Pixel structure, CMOS image sensor and terminal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910330862.3A CN110112156B (en) 2019-04-23 2019-04-23 Pixel structure, CMOS image sensor and terminal

Publications (2)

Publication Number Publication Date
CN110112156A true CN110112156A (en) 2019-08-09
CN110112156B CN110112156B (en) 2021-06-01

Family

ID=67486348

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910330862.3A Active CN110112156B (en) 2019-04-23 2019-04-23 Pixel structure, CMOS image sensor and terminal

Country Status (1)

Country Link
CN (1) CN110112156B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110418087A (en) * 2019-08-13 2019-11-05 Oppo广东移动通信有限公司 Imaging sensor, image processing method and device and storage medium
CN110475083A (en) * 2019-08-26 2019-11-19 Oppo广东移动通信有限公司 A kind of dot structure, imaging sensor and terminal
CN110797366A (en) * 2019-11-14 2020-02-14 Oppo广东移动通信有限公司 Pixel structure, complementary metal oxide semiconductor image sensor and terminal

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101592751A (en) * 2008-05-30 2009-12-02 佳能株式会社 Light filter
CN101894849A (en) * 2009-05-19 2010-11-24 索尼公司 Two-dimensional solid-state imaging device
CN108281452A (en) * 2017-02-03 2018-07-13 思特威电子科技(美国)有限公司 Pixel unit and forming method and imaging system components

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101592751A (en) * 2008-05-30 2009-12-02 佳能株式会社 Light filter
CN101894849A (en) * 2009-05-19 2010-11-24 索尼公司 Two-dimensional solid-state imaging device
CN108281452A (en) * 2017-02-03 2018-07-13 思特威电子科技(美国)有限公司 Pixel unit and forming method and imaging system components

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110418087A (en) * 2019-08-13 2019-11-05 Oppo广东移动通信有限公司 Imaging sensor, image processing method and device and storage medium
CN110418087B (en) * 2019-08-13 2022-05-06 Oppo广东移动通信有限公司 Image sensor, image processing method and apparatus, and storage medium
CN110475083A (en) * 2019-08-26 2019-11-19 Oppo广东移动通信有限公司 A kind of dot structure, imaging sensor and terminal
CN110797366A (en) * 2019-11-14 2020-02-14 Oppo广东移动通信有限公司 Pixel structure, complementary metal oxide semiconductor image sensor and terminal

Also Published As

Publication number Publication date
CN110112156B (en) 2021-06-01

Similar Documents

Publication Publication Date Title
CN110087005B (en) Color polarization CIS, image processing method and storage medium
CN110112156A (en) A kind of dot structure, cmos image sensor and terminal
CN202750183U (en) Parallax imaging apparatus and parallax imaging system
CN109951660A (en) A kind of dot structure, cmos image sensor, image-signal processor and terminal
CN110112155B (en) Pixel unit, image sensor, image processing method, and storage medium
CN104517982B (en) Solid-state imaging device, the manufacturing method of solid-state imaging device and electronic equipment
CN110085611B (en) Pixel unit, image sensor, image processing method, and storage medium
CN110504279A (en) A kind of polarization type CIS, image processing method and storage medium and terminal device
CN110061019A (en) Complementary metal oxide image sensor, image processing method and storage medium
EP3968378B1 (en) Complementary metal oxide image sensor, image processing method, and storage medium
CN110087004B (en) Monochromatic polarization type CIS, image processing method and storage medium
US11503192B2 (en) Imaging device and image sensing method
CN110611778B (en) Image sensor, image processing method and apparatus, and storage medium
EP3981143A1 (en) Light field imaging device and method for 3d sensing
CN110505422A (en) A kind of CIS and terminal
CN110278376A (en) Focusing method, complementary metal oxide image sensor, terminal and storage medium
CN110445998B (en) Color polarization CIS, image processing method and storage medium
WO2014006929A1 (en) Color imaging element and imaging device
CN110085610B (en) Image sensor, image processing method, and computer storage medium
CN110740277A (en) Image sensor, electronic device and imaging method
CN110290328A (en) A kind of focusing method, device, terminal and computer storage medium
US9398218B2 (en) Image capturing apparatus
CN110099230B (en) Image processing method and apparatus, and storage medium
CN110071130A (en) Complementary metal oxide image sensor, image processing method and storage medium
CN110418055B (en) Focusing method, image sensor and computer storage medium

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant