CN110093005A - A kind of 3D printing height adherency micro- warpage of bottom plate is without cracking ABS modified material - Google Patents

A kind of 3D printing height adherency micro- warpage of bottom plate is without cracking ABS modified material Download PDF

Info

Publication number
CN110093005A
CN110093005A CN201910487116.5A CN201910487116A CN110093005A CN 110093005 A CN110093005 A CN 110093005A CN 201910487116 A CN201910487116 A CN 201910487116A CN 110093005 A CN110093005 A CN 110093005A
Authority
CN
China
Prior art keywords
bottom plate
warpage
cracking
micro
abs
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910487116.5A
Other languages
Chinese (zh)
Inventor
王伟
刁雪峰
申应军
吴腾达
蒋士鹏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jinyoung Xiamen Advanced Materials Technology Co Ltd
Original Assignee
Jinyoung Xiamen Advanced Materials Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jinyoung Xiamen Advanced Materials Technology Co Ltd filed Critical Jinyoung Xiamen Advanced Materials Technology Co Ltd
Priority to CN201910487116.5A priority Critical patent/CN110093005A/en
Publication of CN110093005A publication Critical patent/CN110093005A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y70/00Materials specially adapted for additive manufacturing
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L55/00Compositions of homopolymers or copolymers, obtained by polymerisation reactions only involving carbon-to-carbon unsaturated bonds, not provided for in groups C08L23/00 - C08L53/00
    • C08L55/02ABS [Acrylonitrile-Butadiene-Styrene] polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/02Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/03Polymer mixtures characterised by other features containing three or more polymers in a blend
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/03Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)

Abstract

The invention discloses a kind of 3D printing height adherency micro- warpages of bottom plate without cracking ABS modified material.Each ingredient including following weight percent, ABS resin 69%-86.4%;Hot melt adhesive 8%-16%;Spherical inorganic powder 5%-15%;Antioxidant 0.3%-0.5%;Lubricant 0.3%-0.5%.3D printing, printer model and bottom plate are carried out without departing from model is easy to take out without cracking ABS modified material using the 3D printing height adherency micro- warpage of bottom plate, micro- warpage, without cracking, 180 DEG C of peel strength values (N/25mm) reach 18-35.8, meet the molding basic demand of 3D printing.

Description

A kind of 3D printing height adherency micro- warpage of bottom plate is without cracking ABS modified material
Technical field
The present invention relates to 3D printing field of material technology more particularly to a kind of 3D printing height adherency micro- warpage of bottom plate without opening Split ABS modified material.
Background technique
Fused glass pellet (FDM) 3D printing technique is more universal technology, and FDM-3D printing technique mainly includes beating Molding machine and material are printed, the hardware of printer mainly includes the platform floor component for carrying model, and heating system component is gone up and down flat Component etc. is moved, the material of insole board is broadly divided into high molecular material material, metal material material, inorganic material material etc., mould The printing of type must could be completed in substrate, so the adhesiveness of material and bottom plate is the most important condition, influence material and bottom The factor of plate adhesiveness mainly includes the viscosity of material itself and the molding shrinkage of material itself, if the viscosity of itself is poor, Then high shrinking percentage can reduce the viscosity of material itself, in FDM-3D printing shaping process, if the poor adhesion of material, Printer model will appear be detached from bottom plate the phenomenon that, if be partially disengaged, can there is a situation where buckling deformations, can also go out when serious Now because of warping and cracking the phenomenon that, will affect the progress of printing, this, which is belonged to, is unable to satisfy printing shaping if be all detached from It is required that the basic demand of printing shaping be summarized simply as follows can normal print and forming model appearance and size it is good, show as Nothing or micro- warpage are without cracking phenomena.
Industry is printed in FDM-3D at present, PLA material is to need not move through modification to meet the molding requirement of 3D printing, Along with material has Biodegradable environment protection, so that in the early stage of development of FDM-3D printing technique, PLA material is taken as head Material selection occupies 60% or more the market share, due to the brittleness and poor heat resistance of PLA material, leads to answering for its printed product It is relatively narrow with range, it is main at present or based on ornamental class model printing, with the development of 3D printing technique and the demand in market, Requirement of the people to printing material property is gradually in terms of close to industrial applications.
The copolymer that ABS material is made of acrylonitrile-butadiene-styrene (ABS) has excellent impact resistance, heat-resisting Property, lower temperature resistance etc., also have the characteristics that easy processing, easy coating, easy coloring, in traditional industries, be widely used in mechanical, vapour The industrial circles such as vehicle, electronic apparatus are a kind of thermoplastics that purposes is extremely wide.Due to ABS material itself and printing machine bottom board Adhesiveness it is weaker, along with the molding shrinkage (0.4%~0.7%) of ABS material is than PLA material (0.2%~0.4%) Greatly, high molding shrinkage can weaken material to the adhesiveness of bottom plate again, so process of the common ABS material in printer model In, easily there is the phenomenon that impression block completely disengages or is partially disengaged bottom plate, completely disengage, influences the progress of printing, be partially disengaged It is serious or the phenomenon that because of warping and cracking then to show as warpage, in other words, common ABS material is to be unable to satisfy wanting for printing shaping It asks, seriously limits popularization and application of the ABS material in 3D printing technique.
In the patented technology of existing ABS printed material, the overwhelming majority be for the purpose of certain performances of modified optimization material, Influence of the modification to file printing mouldability, typically toughening modifying, heat resistance modified, enhancing modification etc., publication date are not considered For on 01 19th, 2018 Chinese patent application CN107603181A, a kind of 3D printing ABS material and its preparation are disclosed Method, by adding PC material, although improving the heat resistance and toughness of ABS modified material, the adherency of PC material itself Property it is also poorer than ABS material, eventually reduce ABS modified material to printing machine bottom board adhesiveness.There is only a few patented technology It is that optimization is modified to material for the purpose of meeting printing shaping requirement, typically by the way that inorganic particle or low is added The material of shrinking percentage reduces the shrinking percentage of ABS modified material, and the final ABS modified material that reduces is because shrinking to bottom plate adhesiveness It influences, publication date is that on 09 15th, 2017 Chinese patent application CN107163426A disclose a kind of low warpage of 3D printing ABS material and preparation method thereof, although wherein the inorganic particle added has certain reduction to act on the shrinking percentage of material, The addition of inorganic particle can reduce the adhesiveness of ABS modified material, cause printer model to printing machine bottom board and printer model layer Adhesiveness between layer sharply declines, and is unable to satisfy the requirement of printing shaping.Only first meet the forming requirements of 3D printing, The advantage of modification technology can preferably be played.The Chinese patent application CN109206832A that publication date is on 01 15th, 2019, A kind of ABS material and preparation method thereof of the extremely low warpage of 3D printing without cracking is disclosed, the copolyesters and drop of low-shrinkage are added The inorganic particle of low material shrinkage, this is the general principle of the prior art, is in addition added to auxiliary crack resistence adhesive, including PCL, EVA, PE etc., the problem of relating to bottom plate adhesiveness, but these crack resistence adhesives are one-components, with multiple groups The hot melt adhesive of mixed system is divided to compare, adhesiveness is nothing like, so only booster action, the printing effect that play also are Extremely low warpage, buckling deformation amount is greater than 1, rather than the effect of micro- warpage.
It is high to disclose a kind of 3D printing by the Chinese patent application CN108148250A that publication date is on 06 12nd, 2018 Intensity exempts from support polymer ripple silk material and preparation method, and the method is to use ripple wire drawing machine for polymer melting and squeeze out, Be made with it is equidistant, etc. deep ripple polymer silk material, then polymer silk material obtained is immersed by book clay, inorganic crystalline substance Must and the paste mixture of solvent composition in, so that paste is filled up each trough of silk material, using solvent is removed by suction filtration under vacuum, and Laser welding is carried out using solid-state hot melt adhesive immediately, is firmly secured to book clay and inorganic crystal whisker in the trough of silk material, is made The polymer silk material of filler must be loaded.The effect of hot melt adhesive is intended merely to inorganic particle is adhered to ripple silk material in this document Surface, influence of the quantitative or qualitative research hot melt adhesive to printing shaping, has not done the modification of activeness and quietness only to material, More without reference to printing machine bottom board adhesiveness the problem of.In addition the method it is difficult to ensure that silk material line footpath stability, be difficult full The requirement of sufficient FDM-3D printing shaping.
Summary of the invention
The purpose of the present invention is to provide a kind of 3D printing height adherency micro- warpages of bottom plate without cracking ABS modified material.
To achieve the above object, the present invention provides a kind of 3D printing height adherency micro- warpage of bottom plate and changes without cracking ABS Property material, which is characterized in that each ingredient including following weight percent,
Further, including each ingredient of following weight percent,
Further, it is greater than 15g/10min for (220 DEG C/10Kg) of the melt index of the ABS material.Because of hot melt adhesive material Melting means compare it is lower, in order to guarantee excellent processability, it is desirable that the melting means of ABS material wants high point.
Further, the hot melt adhesive be polyolefins, ethylene and its copolymer analog, styrene and its block copolymerization species, One of polyamide-based, polyurethanes is a variety of.Because hot melt adhesive and the caking property of metal material are stronger, it is added to ABS material In material, the adhesiveness of ABS modified material Yu metal material bottom plate can be improved.
Hot melt adhesive is a kind of binder of plasticity, mainly by fluoropolymer resin, tackifier, viscosity modifier, anti-oxidant The groups such as agent are grouped as, and belong to multi-component mixed system, are at room temperature in solid-state, and heating melting soaks adherend at liquid Afterwards, it is cooled down through pressing, close cohesive force can be formed with adherend in several seconds has adhesiveness in other words.With polyethylene (PE) for, PE hot melt adhesive, the work that chemical bond can be passed through with metal material are formed after grafted maleic anhydride isopolarity group With firm bonding is formed, the schematic diagram of bonding effect is as shown in Figure 1.Figure left end is maleic anhydride grafted polyethylene hot melt adhesive Schematic arrangement, middle section be metal material schematic arrangement, right end be both by chemical bond work With the schematic arrangement of formation, it can be seen that the two will form firm adherency.
Further, the spherical inorganic powder is glass microballoon, barium sulfate, one of calcium carbonate or a variety of.Spherical powder The addition of body can be played the role of reducing shrinking percentage, can also reduce the viscosity between hot melt adhesive, play the work of anti-blocking agent With preventing hot melt adhesive self-adhesive in the high temperature environment.
Further, the antioxidant be β-(3,5- di-tert-butyl-hydroxy phenyl) propionic acid n-octadecyl alcohol ester and three [2, 4- di-tert-butyl-phenyl] phosphite ester compounds to obtain;Preferably, the antioxidant is β-(3,5- di-t-butyl -4- hydroxy benzenes Base) the compounding weight ratio of propionic acid n-octadecyl alcohol ester and three [2,4- di-tert-butyl-phenyl] phosphite esters is 2:1.
Further, the lubricant be white oil, polyethylene wax, paraffin it is one or more.Inside and outside lubrication can be played Effect, the effect of viscosity modifier is also acted as in hot melt adhesive, the mobility and wetability of hot melt adhesive material can be improved, thus Material is improved to the adhesiveness of adherend, while reducing the viscosity between hot melt adhesive, prevents the tacky agglomeration of hot melt adhesive.
Further, preparation method is as follows,
Raw material prepare: weighing each component by mass percentage, and by weighed ABS material in 80~100 DEG C of temperature Lower drying, drying time are at least 4 hours;
Mixture preparation: hot melt adhesive is first put into high mixer with lubricant, 3~5min is stirred at 10~30 DEG C, then ABS material, inorganic particle and antioxidant are added, 5~10min is stirred at 10~30 DEG C, obtains mixture;
The preparation of ABS modified material: it during the material that gained mixture is added to double screw extruder is disclosed, is squeezed through melt blending Out, water cooling, air-dry to get to the 3D printing height adherency the micro- warpage of bottom plate without cracking ABS modified material.
Further, in ABS modified material preparation step, the temperature setting of the double screw extruder an are as follows: area: 160~ 180℃;2nd area: 180~190 DEG C;3rd area: 190~200 DEG C;4th area: 200~210 DEG C;5th area: 210~220 DEG C;6th area: 215~220 DEG C;7th area: 215~220 DEG C;8th area: 210~215 DEG C;The head temperature of the double screw extruder be 190~ 200℃;
The screw speed of the double screw extruder is 250~400r/min.
The present invention also provides the 3D printing height adherency micro- warpage of bottom plate without cracking ABS modified material for 3D printing Purposes, which is characterized in that by the 3D printing height adherency bottom plate without warpage without cracking ABS modified material in 80~100 DEG C of temperature Spend lower drying time 4 hours or more, then using 3D guy-line equipment 180 DEG C~220 DEG C at a temperature of be produced into standard specification Lines, line footpath be 1.75 ± 0.03MM, 3D printing can be carried out.
Present invention seek to address that formation problems of the ABS material in 3D printing.ABS is improved by addition hot melt adhesive ingredient The adhesiveness of material and metal material is adhered to printer model firmly on printing machine bottom board, will not go out It now completely disengages bottom plate or because of the phenomenon that being partially disengaged bottom plate warping and cracking, the present invention is suitable for the printing that bottom plate is metal material Machine.
The present invention adds hot melt adhesive ingredient in ABS material, can greatly improve material and print the bonding of machine bottom board Intensity would not also occur terminating the progress of printing because of model disengaging bottom plate, simultaneously so that printer model is not easily disconnected from bottom plate The phenomenon that serious warpage will not occur or cracking because of warpage.By improving the adhesiveness of material and metal base plate, so that changing Property material can satisfy the basic demand of printing shaping.
By adding hot melt adhesive, the adhesiveness of ABS modified material and printer metal base plate is improved, is stuck up to solve material Qu Yanchong and because of the situation that cracks caused by warpage;Spherical inorganic particle is added, the addition because of hot melt adhesive can be offset to ABS material Expect the influence that intensity and heat resistance reduce, while the viscosity between hot melt adhesive can also be reduced, plays the role of anti-blocking agent, keep away Exempt from hot melt adhesive self-adhesive in the high temperature environment;It joined the work that lubricant of the invention plays viscosity modifier to hot melt adhesive ingredient With can be improved the mobility and wetability of hot melt adhesive ingredient, high mobility and wetability help to improve the viscous of hot melt adhesive Attached property to improve ABS modified material to the adhesiveness of metal material bottom plate, while reducing the viscosity between hot melt adhesive, prevents The tacky agglomeration of hot melt adhesive.
Detailed description of the invention
Fig. 1 is the hot melt adhesive formed with the groups such as maleic anhydride grafting PE, the work that can pass through chemical bond with metal material With the schematic diagram for forming firm bonding effect.
Specific embodiment
The embodiment of the present invention is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached The embodiment of figure description is exemplary, it is intended to is used to explain the present invention, and is not considered as limiting the invention.Embodiment In particular technique or condition person is not specified, described technology or conditions or according to the description of product according to the literature in the art Book carries out.Reagents or instruments used without specified manufacturer, being can be with conventional products that are commercially available.
High preparation of the adherency micro- warpage of bottom plate without cracking ABS modified material of embodiment 1:3D printing
Raw material: it is shown in Table 1.
Preparation method:
Raw material prepare: weighing each component by mass percentage, and by weighed ABS material in 80~100 DEG C of temperature Lower drying, drying time are at least 4 hours;
Mixture preparation: hot melt adhesive is first put into high mixer with lubricant, 3~5min is stirred at 10~30 DEG C, then ABS material, inorganic particle and antioxidant are added, 5~10min is stirred at 10~30 DEG C, obtains mixture;
The preparation of ABS modified material: it during the material that gained mixture is added to double screw extruder is disclosed, is squeezed through melt blending Out, water cooling, air-dry to get to the 3D printing height adherency the micro- warpage of bottom plate without cracking ABS modified material.
The temperature setting of the double screw extruder an are as follows: area: 160~180 DEG C;2nd area: 180~190 DEG C;3rd area: 190 ~200 DEG C;4th area: 200~210 DEG C;5th area: 210~220 DEG C;6th area: 215~220 DEG C;7th area: 215~220 DEG C;8th area: 210~215 DEG C;The head temperature of the double screw extruder is 190~200 DEG C;
The screw speed of the double screw extruder is 250~400r/min.
By the adherency micro- warpage of bottom plate of 3D printing height made from the above method without cracking ABS modified material, 80~ Drying time 4 hours or more at a temperature of 100 DEG C, then using 3D guy-line equipment 180 DEG C~220 DEG C at a temperature of be produced into mark The 3D printing lines of quasi- specification, line footpath are 1.75 ± 0.03MM, and effect is seen in last 3D printing detection.
Effect detection the results are shown in Table 2.
High preparation of the adherency micro- warpage of bottom plate without cracking ABS modified material of embodiment 2:3D printing
Raw material: it is shown in Table 1.
Preparation method: with embodiment 1.
Effect detection the results are shown in Table 2.
High preparation of the adherency micro- warpage of bottom plate without cracking ABS modified material of embodiment 3:3D printing
Raw material: it is shown in Table 1.
Preparation method: with embodiment 1.
Effect detection the results are shown in Table 2.
High preparation of the adherency micro- warpage of bottom plate without cracking ABS modified material of embodiment 4:3D printing
Raw material: it is shown in Table 1.
Preparation method: with embodiment 1.
Effect detection the results are shown in Table 2.
High preparation of the adherency micro- warpage of bottom plate without cracking ABS modified material of embodiment 5:3D printing
Raw material: it is shown in Table 1.
Preparation method: with embodiment 1.
Effect detection the results are shown in Table 2.
Comparative example 1: the preparation of printed material
Raw material: it is shown in Table 1.
Preparation method: with embodiment 1.
Effect detection the results are shown in Table 2.
Comparative example 2: the preparation of printed material
Raw material: it is shown in Table 1.
Preparation method: with embodiment 1.
Effect detection the results are shown in Table 2.
Comparative example 3: the preparation of printed material
Raw material: it is shown in Table 1.
Preparation method: with embodiment 1.
Effect detection the results are shown in Table 2.
Comparative example 4: the preparation of printed material
Raw material: it is shown in Table 1.
Preparation method: with embodiment 1.
Effect detection the results are shown in Table 2.
Comparative example 5: the preparation of printed material
Raw material: it is shown in Table 1.
Preparation method: with embodiment 1.
Effect detection the results are shown in Table 2.
Comparative example 6: the preparation of printed material
Raw material: it is shown in Table 1.
Preparation method: with embodiment 1.
Effect detection the results are shown in Table 2.
Table 1 embodiment 1-5's and comparative example 1-6 uses scale
The effect table of table 2 embodiment 1-5 and comparative example
By embodiment 1-5 and the preparation-obtained material of comparative example 1-6 drying time 4 hours at a temperature of 80~100 DEG C More than, then using 3D guy-line equipment 180 DEG C~220 DEG C at a temperature of be produced into the lines of standard specification, line footpath 1.75 Then ± 0.03MM carries out 3D printing.
In the performance test table of above each embodiment and comparative example, the bottom plate of 3D printer is metal material and puts down Face, print temperature are as follows: 230 DEG C~250 DEG C, baseplate temp is 90 DEG C, and nozzle print speed is 60mm/s, and nozzle sky moves speed and is 150mm/s;
ABS modified material and the adhesion strength of metal material can be characterized with 180 DEG C of peel strength values, referring to GB/ T2790-1995 detection;When the value is within the scope of 18-35.8, model is easy to take out, and means to adhere to when higher than this value range Property it is higher, will lead to model difficulty taking-up;Mean that adhesiveness is weaker when lower than this value range, it is meant that model is easily separated from bottom Plate.
Warpage properties indicate with buckling deformation amount, measuring method are as follows: to print 10cm × 10cm × 10cm square mould Subject to type, the average height value from base plate plane is stuck up at four angles in square contact base plate face, and buckling deformation amount is characterized with Δ H, Δ H is smaller, illustrates that warpage properties are smaller, and material adhesiveness of model and bottom plate in printing is better, and adhesion strength is higher.0 < Δ H When≤1.0mm, it is believed that model and bottom plate are without departing from showing as micro- warpage, close to the degree of no warpage;1 < Δ H < 10, Think that model and bottom plate are partially disengaged and shows as low warpage;Δ H >=10.0mm printer model can completely disengage bottom plate, so that beating Print can not carry out;According to the forming requirements of 3D printing: can normal print and forming model appearance and size it is good, show as nothing Or micro- warpage is without cracking phenomena.If adhesion strength is excessively high, printer model be difficult it is intact from bottom plate take off, may be right Bottom plate and model cause to damage, and in addition with the raising of hot melt adhesive content, the compatibility poor of hot melt adhesive and ABS material can go out The phenomenon that now cracking, but this cracking is not because of caused by warpage.
As can be seen from Table 1 and Table 2,3D printing, printing are carried out using the preparation-obtained 3D printing material of embodiment 1-5 The adherency situation of model and bottom plate can be just in without departing from state, while model is easy to take out, micro- warpage, no cracking, 180 DEG C of strippings Reach 18-35.8 from intensity value (N/25mm), meets the molding basic demand of 3D printing.
Comparative example 1 does not have hot melt adhesive, and printer model is completely disengaged with bottom plate, and amount of warpage is up to 12.2mm, serious to crack, 180 DEG C of peel strength values (N/25mm) only have 2, do not meet the molding basic demand of 3D printing.
The ABS material amount of comparative example 2 is too many, is 87.4% higher than the 69-86.4% that technical solution of the present invention requires, heat Melten gel only has 2%, and printer model and the bottom plate of resulting materials completely disengage, and amount of warpage is up to 10.5mm, serious to crack, and 180 DEG C Peel strength value (N/25mm) only has 4.6, does not meet the molding basic demand of 3D printing.
The ABS material amount of comparative example 3 is too many, is 90.3% higher than the 69-86.4% that technical solution of the present invention requires, heat Melten gel only has 4%, and the printer model and bottom parts of resulting materials are detached from, and amount of warpage is up to 6.5mm, serious to crack, 180 DEG C of strippings There was only 9 from intensity value (N/25mm), does not meet the molding basic demand of 3D printing.
The hot melt adhesive of comparative example 4 only has 6%, and the printer model and bottom parts of resulting materials are detached from, amount of warpage position 3.4mm, slight to crack, 180 DEG C of peel strength values (N/25mm) are 13.5, do not meet the molding basic demand of 3D printing.
The ABS material amount of comparative example 5 is few, is 67% lower than the 69-86.4% that technical solution of the present invention requires, hot melt adhesive It is 18% more than the 8-16% that technical solution of the present invention requires, the adherency situation just meeting of the printer model and bottom plate of resulting materials In without departing from state, but model difficulty is taken out, micro- warpage, and no cracking, 180 DEG C of peel strength values (N/25mm) are 41.4, are not inconsistent Close the molding basic demand of 3D printing.
The hot melt adhesive of comparative example 6 is more than the 8-16% that technical solution of the present invention requires, and is 20%, the impression block of resulting materials The adherency situation of type and bottom plate can be just in without departing from state, but model difficulty is taken out, and micro- warpage is slight to crack, and 180 DEG C of removings are by force Angle value (N/25mm) is 45, does not meet the molding basic demand of 3D printing.
In conclusion the 3D printing height adherency micro- warpage of bottom plate being only prepared using technical solution of the present invention without Crack ABS modified material, and the adherency situation of printer model and bottom plate is in without departing from state, while model is easy to take out, micro- to stick up Song, no cracking, 180 DEG C of peel strength values (N/25mm) reach 18-35.8, meet the requirement of 3D printing material.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example Property, it is not considered as limiting the invention, those skilled in the art are not departing from the principle of the present invention and objective In the case where can make changes, modifications, alterations, and variations to the above described embodiments within the scope of the invention.

Claims (10)

1. a kind of 3D printing height adherency micro- warpage of bottom plate is without cracking ABS modified material, which is characterized in that including following weight hundred Divide each ingredient of ratio,
2. the 3D printing height adherency micro- warpage of bottom plate as described in claim 1 is without cracking ABS modified material, which is characterized in that packet Each ingredient of following weight percent is included,
3. the 3D printing height adherency micro- warpage of bottom plate as described in claim 1 is without cracking ABS modified material, which is characterized in that institute It states and is greater than 15g/10min under the conditions of the 220 DEG C/10Kg of melt index of ABS material.
4. the 3D printing height adherency micro- warpage of bottom plate as described in claim 1 is without cracking ABS modified material, which is characterized in that institute Stating hot melt adhesive is polyolefins, ethylene and its copolymer analog, styrene and its block copolymerization species, polyamide-based, polyurethanes One of or it is a variety of.
5. the 3D printing height adherency micro- warpage of bottom plate as described in claim 1 is without cracking ABS modified material, which is characterized in that institute Stating spherical inorganic powder is glass microballoon, barium sulfate, one of calcium carbonate or a variety of.
6. the 3D printing height adherency micro- warpage of bottom plate as described in claim 1 is without cracking ABS modified material, which is characterized in that institute Stating antioxidant is that β-(3,5- di-tert-butyl-hydroxy phenyl) propionic acid n-octadecyl alcohol ester and three [2,4- di-tert-butyl-phenyls] are sub- Phosphate compounds to obtain;Preferably, the antioxidant is β-(3,5- di-tert-butyl-hydroxy phenyl) propionic acid n-octadecyl alcohol ester Compounding weight ratio with three [2,4- di-tert-butyl-phenyl] phosphite esters is 2:1.
7. the 3D printing height adherency micro- warpage of bottom plate as described in claim 1 is without cracking ABS modified material, which is characterized in that institute State lubricant be white oil, polyethylene wax, paraffin it is one or more.
8. the 3D printing height adherency micro- warpage of bottom plate as described in claim 1 is without cracking ABS modified material, which is characterized in that system Preparation Method is as follows,
Raw material prepare: weighing each component by mass percentage, and weighed ABS material is done at a temperature of 80~100 DEG C Dry, drying time is at least 4 hours;
Mixture preparation: hot melt adhesive is first put into high mixer with lubricant, 3~5min is stirred at 10~30 DEG C, is then added again Enter ABS material, inorganic particle and antioxidant, is stirred for 5~10min at 10~30 DEG C, obtains mixture;
The preparation of ABS modified material: it during the material that gained mixture is added to double screw extruder is disclosed, is squeezed out through melt blending, water It is cold, air-dried to adhere to the micro- warpage of bottom plate without cracking ABS modified material to get to the 3D printing height.
9. the 3D printing height adherency micro- warpage of bottom plate as described in claim 1 is without cracking ABS modified material, which is characterized in that ABS In modified material preparation step, the temperature setting of the double screw extruder an are as follows: area: 160~180 DEG C;2nd area: 180~190 ℃;3rd area: 190~200 DEG C;4th area: 200~210 DEG C;5th area: 210~220 DEG C;6th area: 215~220 DEG C;7th area: 215~ 220℃;8th area: 210~215 DEG C;The head temperature of the double screw extruder is 190~200 DEG C;
The screw speed of the double screw extruder is 250~400r/min.
10. any one of the claim 1-9 3D printing height adherency micro- warpage of bottom plate is beaten without cracking ABS modified material for 3D The purposes of print, which is characterized in that by the 3D printing height adherency micro- warpage of bottom plate without cracking ABS modified material 80~100 Drying time 4 hours or more at a temperature of DEG C, then using 3D guy-line equipment 180 DEG C~220 DEG C at a temperature of be produced into standard The lines of specification, line footpath are 1.75 ± 0.03MM, can carry out 3D printing.
CN201910487116.5A 2019-06-05 2019-06-05 A kind of 3D printing height adherency micro- warpage of bottom plate is without cracking ABS modified material Pending CN110093005A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910487116.5A CN110093005A (en) 2019-06-05 2019-06-05 A kind of 3D printing height adherency micro- warpage of bottom plate is without cracking ABS modified material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910487116.5A CN110093005A (en) 2019-06-05 2019-06-05 A kind of 3D printing height adherency micro- warpage of bottom plate is without cracking ABS modified material

Publications (1)

Publication Number Publication Date
CN110093005A true CN110093005A (en) 2019-08-06

Family

ID=67450341

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910487116.5A Pending CN110093005A (en) 2019-06-05 2019-06-05 A kind of 3D printing height adherency micro- warpage of bottom plate is without cracking ABS modified material

Country Status (1)

Country Link
CN (1) CN110093005A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107603121A (en) * 2017-09-20 2018-01-19 福建师范大学 A kind of ABS3D printing wire rods of resistance to warpage crack resistence and preparation method thereof
CN109206832A (en) * 2018-09-30 2019-01-15 金旸(厦门)新材料科技有限公司 A kind of ABS material and preparation method thereof of the extremely low warpage of 3D printing without cracking

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107603121A (en) * 2017-09-20 2018-01-19 福建师范大学 A kind of ABS3D printing wire rods of resistance to warpage crack resistence and preparation method thereof
CN109206832A (en) * 2018-09-30 2019-01-15 金旸(厦门)新材料科技有限公司 A kind of ABS material and preparation method thereof of the extremely low warpage of 3D printing without cracking

Similar Documents

Publication Publication Date Title
CN101864259B (en) SIS (Styrene-Isoprene-Styrene) hot melt adhesive for car light adhesion and preparation method thereof
CN1246410C (en) Devices, compositions, and methods incorporating adhesives whose preformance is enhanced by organophilic clay constitutents
CN101580680B (en) Crosslinkable polyethylene hot-melt adhesive composition and preparation method and application thereof
CN108949046B (en) EVA hot melt adhesive film for wall cloth and preparation method thereof
JPH11510841A (en) Polystyrene binder
CN103030914A (en) Acrylic ester composition, preparation method of acrylic ester composition, and adhesive tape applying composition
CN110157175A (en) A kind of 3D printing height adherency micro- warpage of bottom plate is without cracking PC modified material
CN102190985A (en) Method for producing general-purpose hot melt adhesive
WO2010061759A1 (en) Moisture-curable hot melt adhesive
CN114410246A (en) Hot melt adhesive composition and preparation method and application thereof
JPH05247318A (en) Resin composition and adhesive using the same
CN110093005A (en) A kind of 3D printing height adherency micro- warpage of bottom plate is without cracking ABS modified material
CN106833514B (en) A kind of hot melt adhesive and preparation method thereof
JPH10231409A (en) Plastisol composition, coating material and molded product
CN110144119A (en) A kind of 3D printing height adherency micro- warpage of bottom plate is without cracking PA modified material
US20040038025A1 (en) Highly heat-resistant label
US4299934A (en) Hot melt adhesive composition
CN108239510A (en) Composition of polyester hot-melt adhesive and preparation method thereof
CN106634775A (en) High-temperature-resistant conductive silver colloid
KR930009215B1 (en) Hot melt adhesive compositions
KR102112750B1 (en) Hot melt adhesive improved heat-resistance and adhesive properties and manufacturing method thereof
CN110305453A (en) A kind of resistance to PBT 3D printing wire rod and preparation method thereof for shrinking warpage
CN106928482A (en) A kind of high temperature resistant printing label and preparation method thereof
KR20130084728A (en) Environment-friendly acrylic copolymer latex having excellent storage stability and impact strength and acryl sol comprising the same
CN115073789B (en) PVC composite material for edge banding and preparation method thereof

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20190806

RJ01 Rejection of invention patent application after publication