CN110091027A - Nozzle - Google Patents
Nozzle Download PDFInfo
- Publication number
- CN110091027A CN110091027A CN201810094766.9A CN201810094766A CN110091027A CN 110091027 A CN110091027 A CN 110091027A CN 201810094766 A CN201810094766 A CN 201810094766A CN 110091027 A CN110091027 A CN 110091027A
- Authority
- CN
- China
- Prior art keywords
- nozzle
- ontology
- soldered ball
- deposition
- ejection section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
Abstract
The present invention provides a kind of nozzle, including ontology, and the ontology includes: hollow portion, and soldered ball is enable to flow into and move；Ejection section is arranged in the end of ontology, and the spray-hole of the soldered ball flowed into is less than with size；Stage portion is arranged from the inner surface of ontology to ejection section；And deposition portion, the residue of the soldered ball of melting can be accumulated on the inside of stage portion, and connect with the pipeline of more than one connection, be arranged as ejection section and separate and can replace with ontology.
Description
Technical field
One embodiment of the invention is related to a kind of nozzle.
Background technique
Device of the common welder as the component connection for making electrical connection using conductive material, in a variety of electronics systems
It is used in the manufacture of product.For example, needing to connect semiconductor chip and substrate, previous connection side when manufacturing integrated circuit
Formula has used in the way of the wire bonding of Au lead.But there are wire bonding portions due to machinery for this wire bonding mode
The thermal dilation difference of adhesive surface caused by impact or thermal shock, and the problem of so that bonding face is fallen off or is broken.
In order to develop the ball grid array (BGA:Ball the problem of solving existing bonding pattern as described above
Grid Array) encapsulation, and equipped with the soldered ball of the external connection terminals as packaging part.The ball grid array mode is for general
There is no the stator element part of pin to be attached at circuit board and uses following welding manner, the weldering that will be formed by metal (or unleaded)
Ball chuck is set between circuit board and stator element part, later, which is heated and is melted, to be bonded the electricity by soldered ball
Road plate and stator element part.
The soldered ball for being placed in the back side of this semiconductor package part must be accurately placed in required position, in the past, when making
When soldered ball is placed in the back side of semiconductor package part, soldered ball is placed using craft one by one, or using tweezers (Tweezer) or clamped
Sub (pincette) is placed.Accordingly, there exist following problems, and a large amount of activity duration is consumed when placing multiple soldered balls and makes productivity
Decline, and soldered ball cannot be accurately placed in packaging part, to cause a large amount of bad.
[existing technical literature]
[patent document]
Korean Patent Publication No. 10-0332378 (2002.03.30)
Summary of the invention
The embodiment of the present invention is designed to provide a kind of following nozzle: including the residue of soldered ball can be made to deposit
In the deposition portion of nozzle, and the inclination to spray-hole direction is formed by the deposition of residue.
In addition, purpose, which also resides in, provides a kind of following nozzle: arrangement deposition guide portion makes it for guiding residue
It can obliquely deposit.
In addition, purpose, which also resides in, provides a kind of following nozzle: being placed in soldered ball on spray-hole by the deposition of residue
Portion, so that soldered ball be made to be fused to the more accurate position on substrate.
In addition, purpose, which also resides in, provides a kind of following nozzle: laser beam can be irradiated along the direction perpendicular to soldered ball, and
Make its outflow by compressed gas.
An embodiment according to the present invention provides a kind of nozzle, including ontology, and the ontology includes: hollow portion, makes soldered ball
It flows into and mobile；Ejection section is provided to the end of ontology, and the spray-hole of the soldered ball flowed into is less than with size；Stage portion, from this
The inner surface of body is with ejection section to the utmost；And deposition portion, it is arranged on the inside of stage portion, makes the residue accumulation of the soldered ball of melting,
And the ontology is connect with the pipeline that more than one is connected to, and ejection section can be separated from ontology and be replaced.
It can be disposed with deposition guide portion in the deposition portion, the deposition guide portion is used to guide the remnants of the soldered ball
The deposition of object.
The deposition guide portion can be arranged as ring-shaped along the inner surface perimeter of the ontology.
The area of the deposition guide portion can be gradually reduced from the end to the central part of the perimeter of the ontology.
The deposition guide portion can be respectively arranged in the inner surface two sides and toward each other of the ontology.
Length direction section from a side to the spray-hole side of the inflow soldered ball of the ontology may include breaking
Mouth section.
The ontology may include the top for flowing into the soldered ball；And including the spray-hole and the stage portion
Lower part, wherein the top and the lower part are detachable, and can replace the top or the lower part.
The angle of the stage portion may include 90 degree.
The one side of the ontology can be connected to the first pipe for supplying the soldered ball.
The another side of the ontology can be connected to the second pipe for making gas flow into the hollow portion.
The nozzle can use hybrid ceramic powder and the mixed-powder of metal powder is formed.
The nozzle can use ceramic powders or metal powder is formed.
The nozzle can pass through compression and being put at least one of ceramic powders and metal powder in a mold
At least one of moulding process and sintering process and formed.
The nozzle can use superhard powder and be formed.
In accordance with embodiments of the present invention it is possible to provide following nozzle, may include that the residue of soldered ball can be made to deposit
In the deposition portion of nozzle, and the inclination to spray-hole direction is formed by the deposition of residue.
In addition, being capable of providing following nozzle, arrangement deposition guide portion can be obliquely for guiding residue
Deposition.
In addition, being capable of providing following nozzle, soldered ball is set to be placed in spray-hole top by the deposition of residue, to make to weld
Ball is fused to the more accurate position on substrate.
In addition, being capable of providing following nozzle, laser beam can be irradiated along the direction perpendicular to soldered ball, and pass through compressed gas
Body makes its outflow.
Detailed description of the invention
Fig. 1 is the attached drawing for illustrating the section of nozzle of an embodiment according to the present invention.
Fig. 2 is the attached drawing for illustrating the section of nozzle of an embodiment according to the present invention.
Fig. 3 is the attached drawing for illustrating the section of the nozzle including deposition portion of an embodiment according to the present invention.
Fig. 4 is the attached of the section of the nozzle including forming indent and convex deposition portion of a diagram embodiment according to the present invention
Figure.
Fig. 5 is the attached drawing for illustrating the section shape of nozzle of an embodiment according to the present invention.
Fig. 6 is the attached drawing for illustrating the nozzle that pipeline is connected to an embodiment according to the present invention.
Fig. 7 be illustrate an embodiment according to the present invention nozzle be separated into top and lower part section attached drawing.
Symbol description
10: ontology 10a: lower part
10b: top 11: hollow portion
12: ejection section 13: stage portion
14: deposition portion 15: deposition guide portion
16: bumps 20: laser aid
30: first pipe 40: second pipe
41: valve 1: soldered ball
2: substrate 3: residue
Specific embodiment
Hereinafter, being illustrated referring to attached drawing to specific implementation form of the invention.But these are merely illustrative, the present invention is simultaneously
It is not limited to this.
In the course of describing the present invention, if it is determined that being illustrated to well-known technique for the present invention
It is possible that causing unnecessary confusion to purport of the invention, then description is omitted.In addition, aftermentioned term is to consider
Function into the present invention and the term defined, may according to user, intention or convention for transporting user etc. and it is different.Cause
This, needs to give a definition to it based on through the content of this specification entirety.
Technical idea of the invention determines that embodiment below is only used for institute of the present invention by scope of the claims
The those of ordinary skill in category field effectively explains a kind of means of technical concept of the invention.
Fig. 1 to Fig. 2 is the attached drawing for illustrating the section of nozzle of an embodiment according to the present invention.
Fig. 1 is the attached drawing for illustrating the state that soldered ball 1 flows into ontology 10, and Fig. 2 is that diagram soldered ball 1 melts and is fused to substrate 2
On situation attached drawing.
Referring to figs. 1 to Fig. 2, nozzle according to the present invention may include ontology 10, and ontology 10 includes hollow portion 11, ejection section
12 and stage portion 13.Could be formed in the inside of ontology 10 can make the inflow of soldered ball 1 and mobile hollow portion 11, in ontology 10
End can be formed can make soldered ball 1 melt and spray ejection section 12.When soldered ball 1 flows into 10 inside of ontology, Ke Yixiang
10 internal irradiation laser beam of ontology and compressed gas and be fused to soldered ball 1 on substrate 2.
Hollow portion 11, which can be formed to have, can make the inflow of soldered ball 1 and mobile width.For example, in the diameter of hollow portion 11
Be formed as in circular situation to section, the radial section of hollow portion 11 can be formed larger than the diameter of soldered ball 1.Therefore, it welds
Ball 1 can be moved freely through in hollow portion 11.It is located at ejection section 12 to make soldered ball 1 flow into hollow portion 11, soldered ball 1 needs energy
Enough length directions (from the upper end (that is, side close with laser aid 20) of hollow portion 11) along ontology 10 to lower end (that is, with
The close side of substrate 2), the side close with laser aid 20 is known as to the upper end of ontology 10 below, and will be close with substrate 2
Side be known as the lower end of ontology 10) it is mobile.Therefore, the width of hollow portion 11 can be greater than the diameter of soldered ball 1.Hollow portion 11 can
To be formed as the shapes such as circle, and the shape that soldered ball 1 can be mobile to ejection section 12 can be formed as according to the shape of soldered ball 1.
Ejection section 12 can be arranged in the end of ontology 10, and size is less than the soldered ball 1 flowed into.Size is, for example,
The radial section (that is, perpendicular to direction of the length direction) for being formed in the spray-hole of ejection section 12 is formed as round situation
Under, the radial section of the spray-hole can be formed as less than the diameter of soldered ball 1.Therefore, soldered ball 1 can be stuck in spray-hole, and
Irradiate laser beam to soldered ball 1.But the radial section of spray-hole is not limited to circle, may include tetragonal section, five
The various shapes such as side shape section.
Ejection section 12 can be formed in the end of nozzle from hollow portion 11 along the center position extension of 10 end of ontology.
Ejection section 12 can make to flow out by the soldered ball 1 of laser-light beam melts.The soldered ball 1 flowed out by ejection section 12 can be fused to substrate
On 2.In other words, in the state that soldered ball 1 is stuck in spray-hole, can irradiate laser beam to soldered ball 1 make its melting, and by means of
Compressed gas makes the outflow of soldered ball 1 of melting and is fused to it on substrate 2.
Stage portion 13 can be arranged in from the inner surface of ontology 10 to ejection section 12.Stage portion 13 can be in ontology 10
The part for being connected to spray-hole on surface forms step and is formed.Due to stage portion 13, from the upper end of ontology 10 to the length of lower end
The section for spending direction may include stepped profile.The end that stage portion 13 can be formed in the ontology 10 where ejection section 12 is attached
Closely.Stage portion 13 can be formed by the width of hollow portion 11 and the size difference of spray-hole.Specifically, the width of hollow portion 11
It is that can make the inflow of soldered ball 1 and mobile width, the width of spray-hole can be the width of the diameter less than soldered ball 1, and make to weld
Ball 1 can block.The width of hollow portion 11 and the width of spray-hole can be formed in proportion to the diameter of soldered ball 1.Therefore, may be used
To form step according to the width difference of the width of hollow portion 11 and spray-hole.Stage portion 13 can be vertical from the inner surface of ontology 10
Ground is formed.Moreover, scheduled angle can be formed to have.But it is not limited to angle, stage portion 13 can also be with shape
As with curved surface.Stage portion 13 can be for 90 degree or less and more than 0 degree.Preferably, spray is connected to from the inner surface of ontology 10
The angle of the stage portion 13 of perforation can be 90 degree.
Also, when soldered ball 1 is located at stage portion 13, stage portion 13 and ejection section 12, which can be formed as not generating, can make to swash
Light beam passes through spray-hole from the gap that ontology 10 is revealed.Therefore, the soldered ball 1 for flowing into the hollow portion 11 inside ontology 10 can be with card
Laser beam and compressed gas are received in the state of stage portion 13.The soldered ball 1 for being stuck in the state of stage portion 13 can be by laser beam
Melting.The soldered ball 1 of melting can be flowed out from spray-hole by compressed gas and is fused on substrate 2.
It may include the deposition portion 14 that the residue 3 of the soldered ball 1 of melting can be made to accumulate on the inside of stage portion 13.
Fig. 3 is the attached drawing for illustrating the section of the nozzle including deposition portion of an embodiment according to the present invention.
Fig. 3 a is the attached drawing for being shown in the situation in inside formation deposition portion 14 of stage portion 13, and Fig. 3 b is to be shown in deposition portion
14 form the attached drawing of the situation of deposition guide portion 15, and Fig. 3 c is that the residue 3 of diagram soldered ball 1 is deposited on the feelings of deposition guide portion 15
The attached drawing of shape.
Referring to Fig. 3 a, the deposition portion that the residue 3 of the soldered ball 1 of melting can be made to deposit can be formed on the inside of stage portion 13
14.The deposition portion 14 for being formed in 13 inside of stage portion can be the space that residue 3 can be accumulated.It is remaining when soldered ball 1 melts
Object 3 may remain on 13 inside of stage portion.Therefore, if soldered ball 1 melts repeatedly, the residue 3 of soldered ball 1 can be piled up in step
Portion 13.The residue 3 of the soldered ball 1 of melting is deposited on deposition portion 14, so that stage portion 13 can tilt naturally.Since deposition is
It gradually deposits from the bottom to the top, therefore, more residues 3 are deposited on lower end, and can gradually deposit to upper end.Therefore,
It can be gradually reduced from the lower end of ontology 10 to upper end by the inclined width that the deposition of residue 3 is formed.
It, then can be by soldered ball 1 to spray so that stage portion 13 be made gradually to tilt if forming inclination by being deposited on deposition portion 14
Perforation guidance.By the inclination formed along 12 side direction of ejection section, soldered ball 1 can more stably be placed in ejection section 12.
Referring to Fig. 3 b, deposition guide portion 15 can be disposed in deposition portion 14.Deposition guide portion 15 is used to guide melting
The deposition of the residue 3 of soldered ball 1.When the residue 3 of soldered ball 1 deposits, can be inclined by deposition guide portion 15 with more desirable
Oblique state deposition.Deposition guide portion 15 can be arranged as ring-shaped along the inner surface perimeter of ontology 10.Also, deposit guide portion
15 can also be along the length direction (from the downward extreme direction in the upper end of ontology 10) of ontology 10 in the inner surface two sides of ontology 10 point
It does not arrange towards each other.
The residue 3 of soldered ball 1 can be deposited along the inclination of deposition guide portion 15.In order to make residue 3 be deposited as having
There is the oblique inclination from the downward extreme direction in the upper end of ontology 10, and can arrange deposition guide portion 15.Deposit the interior of guide portion 15
The diameter in side space can be formed as the shape smaller closer to the end of ontology 10.Deposit the straight of the inner space of guide portion 15
Diameter can be smaller closer to the end of ontology 10, bigger further away from the end of ontology 10.Since the diameter of hollow portion 11 is got over
It is smaller close to spray-hole side, therefore, soldered ball 1 can be made to be placed in the upper end of ejection section 12.
Due to the deposition guide portion 15 closer to the end of ontology 10 and narrower shape, ontology is being intercepted along its length
It may include tapered section in the end of ontology 10 in 10 section.
It, can be with deposition residues 3 depositing guide portion 15 referring to Fig. 3 c.Residue 3 is deposited along deposition guide portion 15, thus
The gradient inclination oblique to spray-hole side can be being formed from the downward extreme direction in the upper end of ontology 10.Therefore, in ontology 10
Portion can form the section of conical by its shape by the deposition of residue 3.
Residue 3 may be formed so that in the inclination that deposition guide portion 15 deposition is formed to be less than in the end side of ontology 10
The diameter of soldered ball 1, tends to the upper end side of ontology 10, and diameter becomes bigger than the diameter of soldered ball 1.Inclination can guide soldered ball 1 to make it
It is placed in 12 upper end of ejection section.Therefore, soldered ball 1 can be made to be fused to the more accurate position on substrate 2 by laser.
Fig. 4 is the attached of the section of the nozzle including forming concave-convex deposition portion of a diagram embodiment according to the present invention
Figure.
Referring to Fig. 4, bumps 16 can be formed in deposition guide portion 15.In the inside of deposition guide portion 15 (that is, hollow portion 11
Side) face can be formed bumps 16.Bumps 16 can guide the deposition of residue 3.By bumps 16, residue 3 can be more firm
Ground is deposited on deposition guide portion 15.
Fig. 5 is the attached drawing for illustrating the section of nozzle of an embodiment according to the present invention.
Fig. 5 a to Fig. 5 c is the attached drawing for the ontology 10 that diagram forms hollow portion 11 of different shapes.
Referring to Fig. 5 a, the width of hollow portion 11 can be formed as from upper end (that is, close to side of laser aid 20) under
End (that is, close to side of substrate 2) is identical.Referring to Fig. 5 b, the width of hollow portion 11 can also be formed as wide from upper end to lower end
Spend the form being gradually increased.Referring to Fig. 5 c, the width of hollow portion 11 can also be formed as being gradually reduced from upper end to lower end width
Form.The shape of the length direction (from the downward extreme direction in upper end) of nozzle is unrestricted.It can be with the shape of nozzle independently
Deposition portion 14 is formed, and can arrange deposition guide portion 15 in deposition portion 14.The deposition guide portion 15 for being arranged in deposition portion 14 can
With the shape with nozzle, independently from upper end, downward extreme direction forms inclination.Therefore, can independently make to weld with the shape of nozzle
Ball 1 is placed in 12 top of ejection section.Therefore, substrate 2 can be steadily fused to by ejection section 12 by the soldered ball of laser melting 1
On.
Fig. 6 is the attached drawing for illustrating the situation for the nozzle that pipeline is connected to an embodiment according to the present invention.
Referring to Fig. 6, ontology 10 can be connected to first pipe 30 and second pipe 40.The one side of the upper end of ontology 10 can
To be connected to first pipe 30, the first pipe 30 flows into soldered ball 1 and is supplied to inside ontology 10.The upper end of ontology 10
Another side can be connected to second pipe 40, and the second pipe 40 is for flowing into compressed gas inside ontology 10.
Soldered ball 1 can flow into 11 inside of hollow portion by first pipe 30 and is fixed with the state across spray-hole.If
In this case using laser aid 20 to 10 internal irradiation laser beam of ontology, then soldered ball 1 melts, and can open the second pipe
The valve 41 in road 40 and spray compressed gas.The soldered ball 1 of melting can be made to flowing outside spray-hole by spraying compressed gas
It is fused on substrate 2 out.
Fig. 7 be illustrate an embodiment according to the present invention nozzle be separated into top and lower part situation attached drawing.
Referring to Fig. 7, ontology 10 can be divided into the top 10b for flowing into soldered ball 1 and including ejection section 12 and stage portion 13
Lower part 10a.Top 10b can be dismantled with lower part 10a, so as to replace top 10b or lower part 10a.For example, soldered ball 1 is residual
Excess is piled up in soldered ball 1 and melts and discharged ejection section 12, therefore when residue causes nozzle that can not normally execute function
When, it can also only replace the lower part 10a of nozzle.In turn, ejection section 12 is configured to separate with ontology 10 and replace.
The nozzle of embodiment according to the present invention can use metal powder or ceramic powders and pass through compression forming and burning
Tie technique manufacture.Alternatively, the mixed-powder that can use mixed metal powder and ceramic powders passes through compression forming and agglomerant
Skill and manufacture nozzle.It can be superalloy or exceptional hardness alloy by the alloy that compression forming and/or sintering process manufacture.Example
Such as, the sintering process that nozzle can be manufactured by compressing powder is made.Also, nozzle can use the ceramics containing zirconium powder
Powder and be put into mold and compression forming.
It can use compression forming and sintering process and form stepped profile.It, can be with expectation when manufacturing metal die
Angle (for example, 90 degree) manufacture stage portion 13, and in a mold by dies compress technique and sintering process by metal powder,
The nozzle including stepped profile is made at least one of ceramic powders, mixed-powder powder.Therefore, can manufacture can make to have
The soldered ball 1 for having some tens of pm to hundreds of microns size is fused to the nozzle on substrate.For example, following nozzle can be manufactured, comprising:
Hollow portion 11 has the inflow of soldered ball 1 and mobile width that can make to have some tens of pm to hundreds of microns size；And injection
Portion 12, width is less than soldered ball 1, and enables that there is some tens of pm to the soldered ball 1 of hundreds of microns size to be stuck.
More than, representative embodiment of the invention is described in detail, however belonging to the present invention
Personnel in technical field with basic knowledge are understood that the above embodiments can be in the limit for not departing from the scope of the present invention
Interior realization various deformation.Therefore, interest field of the invention should not be limited to the above embodiments, and interest field of the invention needs
It to be determined according to the range of claims and with the range of claims equalization.
Claims (14)
1. a kind of nozzle, wherein including ontology,
The ontology includes:
Hollow portion makes soldered ball inflow and movement；
Ejection section is provided to the end of the ontology, and the spray-hole of the soldered ball flowed into is less than with size；
Stage portion matches the ejection section described to the utmost from the inner surface of the ontology；And
Deposition portion is arranged on the inside of the stage portion, makes the residue accumulation of the soldered ball of melting,
The ontology is connect with the pipeline that more than one is connected to, and the ejection section can be separated from the ontology and be replaced.
2. nozzle as described in claim 1, wherein
It is disposed with deposition guide portion in the deposition portion, the deposition guide portion is used to guide the heavy of the residue of the soldered ball
Product.
3. nozzle as claimed in claim 2, wherein
The deposition guide portion is arranged as ring-shaped along the inner surface perimeter of the ontology.
4. nozzle as claimed in claim 2, wherein
The diameter of the inner space of the deposition guide portion is then smaller closer to the end of the ontology.
5. nozzle as claimed in claim 2, wherein
The deposition guide portion is arranged in the inner surface two sides and toward each other of the ontology respectively.
6. nozzle as described in claim 1, wherein
Length direction section from a side to the ejection section side of the inflow soldered ball of the ontology includes stepped profile.
7. nozzle as described in claim 1, wherein
The ontology further includes the top for flowing into the soldered ball and the lower part for having the ejection section and the stage portion,
Wherein, the top and the lower part are detachable, and can replace the top or the lower part.
8. nozzle as described in claim 1, wherein
The angle of the stage portion includes 90 degree.
9. nozzle as described in claim 1, wherein
The one side of the ontology is communicated with the first pipe for supplying the soldered ball.
10. nozzle as described in claim 1, wherein
The another side of the ontology is communicated with the second pipe for making gas flow into the hollow portion.
11. nozzle as described in claim 1, wherein
The nozzle is formed using the mixed-powder of hybrid ceramic powder and metal powder.
12. nozzle as described in claim 1, wherein
The nozzle is formed using ceramic powders or metal powder.
13. nozzle as claimed in claim 11, wherein
The nozzle passes through compressing and forming process and being put at least one of ceramic powders and metal powder in a mold
And at least one of sintering process and formed.
14. nozzle as described in claim 1, wherein
The nozzle is formed using superhard powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810094766.9A CN110091027A (en) | 2018-01-31 | 2018-01-31 | Nozzle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810094766.9A CN110091027A (en) | 2018-01-31 | 2018-01-31 | Nozzle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110091027A true CN110091027A (en) | 2019-08-06 |
Family
ID=67442579
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810094766.9A Pending CN110091027A (en) | 2018-01-31 | 2018-01-31 | Nozzle |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110091027A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101038986A (en) * | 2006-03-16 | 2007-09-19 | Tdk株式会社 | Adjoining apparatus and nozzle unit therefor |
| CN102085590A (en) * | 2009-12-08 | 2011-06-08 | 日立环球储存科技荷兰有限公司 | Method of manufacturing head gimbal assembly and device for connecting magnetic head gimbal assemblies |
| CN205032825U (en) * | 2015-10-08 | 2016-02-17 | 天津电气科学研究院有限公司 | Automatic welder of circuit board welding machine |
| JP2016087692A (en) * | 2014-10-29 | 2016-05-23 | エイチジーエスティーネザーランドビーブイ | Solder ball jet nozzle with improved reliability |
| CN105792971A (en) * | 2013-12-05 | 2016-07-20 | 富士机械制造株式会社 | Solder supply device |
| CN107427857A (en) * | 2015-01-13 | 2017-12-01 | 千住金属工业株式会社 | Device for draining fluid, fluid discharging method and coating fluid device |
-
2018
- 2018-01-31 CN CN201810094766.9A patent/CN110091027A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101038986A (en) * | 2006-03-16 | 2007-09-19 | Tdk株式会社 | Adjoining apparatus and nozzle unit therefor |
| CN102085590A (en) * | 2009-12-08 | 2011-06-08 | 日立环球储存科技荷兰有限公司 | Method of manufacturing head gimbal assembly and device for connecting magnetic head gimbal assemblies |
| CN105792971A (en) * | 2013-12-05 | 2016-07-20 | 富士机械制造株式会社 | Solder supply device |
| JP2016087692A (en) * | 2014-10-29 | 2016-05-23 | エイチジーエスティーネザーランドビーブイ | Solder ball jet nozzle with improved reliability |
| CN107427857A (en) * | 2015-01-13 | 2017-12-01 | 千住金属工业株式会社 | Device for draining fluid, fluid discharging method and coating fluid device |
| CN205032825U (en) * | 2015-10-08 | 2016-02-17 | 天津电气科学研究院有限公司 | Automatic welder of circuit board welding machine |
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