CN110086901B - Frame seal structure and display device - Google Patents
Frame seal structure and display device Download PDFInfo
- Publication number
- CN110086901B CN110086901B CN201910260431.4A CN201910260431A CN110086901B CN 110086901 B CN110086901 B CN 110086901B CN 201910260431 A CN201910260431 A CN 201910260431A CN 110086901 B CN110086901 B CN 110086901B
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- CN
- China
- Prior art keywords
- cover plate
- light guide
- packaging cover
- lapping
- guide column
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0017—Casings, cabinets or drawers for electric apparatus with operator interface units
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/065—Hermetically-sealed casings sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Signal Processing (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention relates to the technical field of display, and discloses a frame sealing structure and a display device, wherein the frame sealing structure comprises: the light guide column comprises a front shell, a light guide column and a packaging cover plate, wherein a lapping table is formed on the inner side of the front shell, and a first lapping surface is formed on one side surface of the lapping table facing the packaging cover plate; the light guide column is arranged in the accommodating space formed by the front shell, and a second lapping surface is formed on the surface of one side, facing the packaging cover plate, of the light guide column; the packaging cover plate is bonded with the first lapping surface and the second lapping surface through optical cement. The frame sealing structure provided by the invention adopts the optical cement to bond the first lapping surface of the packaging cover plate and the front shell and adopts the optical cement to bond the second lapping surface of the packaging cover plate and the light guide column, the structure not only ensures the sealing performance of the frame, but also can reduce the bonding size between the packaging cover plate and the front shell, thereby reducing the upper forehead limit size of the electronic equipment.
Description
Technical Field
The invention relates to the technical field of display, in particular to a frame sealing structure and a display device.
Background
In the case that the current electronic equipment screen occupation ratio is higher, the size of the upper forehead becomes a hot spot for competition of various manufacturers. The last forehead light distance of current electronic equipment feels the module sealed mainly relies on some glue or bubble celloidin to seal, and these two kinds of sealed modes all need certain effective width (some glue narrowest 0.60mm, bubble celloidin narrowest 0.8mm), and this structure has restricted the extreme dimension of last forehead, influences product appearance effect.
Disclosure of Invention
The invention provides a frame sealing structure and a display device, wherein the frame sealing structure is beneficial to reducing the limit size of the upper forehead of electronic equipment by changing the sealing structure.
In order to achieve the purpose, the invention provides the following technical scheme:
a bezel sealing configuration comprising: the light guide column comprises a front shell, a light guide column and a packaging cover plate, wherein a lapping table is formed on the inner side of the front shell, and a first lapping surface is formed on one side surface of the lapping table facing the packaging cover plate; the light guide column is arranged in the accommodating space formed by the front shell, and a second lapping surface is formed on the surface of one side, facing the packaging cover plate, of the light guide column; the packaging cover plate is bonded with the first lapping surface and the second lapping surface through optical cement.
Among the above-mentioned frame seal structure, frame seal structure includes preceding shell, leaded light post and encapsulation apron, adopts the optical cement to bond between the first faying surface of encapsulation apron and preceding shell and the second faying surface of leaded light post. Because the optical cement is adopted, based on the light transmission of the optical cement, the bonding structure between the second lap joint surfaces of the packaging cover plate and the light guide column does not influence the light guide performance of the light guide column, and the optical cement is adopted to bond the packaging cover plate and the front shell, and the optical cement is adopted to bond the top ends of the packaging cover plate and the light guide column, so that the bonding strength of the packaging cover plate can be ensured.
The frame sealing structure provided by the invention adopts the optical cement to bond the first lapping surface of the packaging cover plate and the front shell and adopts the optical cement to bond the second lapping surface of the packaging cover plate and the light guide column, the structure not only ensures the sealing performance of the frame, but also can reduce the bonding size between the packaging cover plate and the front shell, thereby reducing the upper forehead limit size of the electronic equipment.
Therefore, the frame sealing structure is beneficial to reducing the limit size of the upper forehead of the electronic equipment by changing the sealing structure.
Preferably, the overlapping width between the encapsulation cover plate and the first overlapping surface along the extending direction of the encapsulation cover plate ranges from 0.15mm to 0.5 mm.
Preferably, the overlapping width between the encapsulation cover plate and the first overlapping surface along the extending direction of the encapsulation cover plate is 0.15 mm.
Preferably, along the extending direction of the package cover plate, a first gap is formed between the light guide column and the front shell.
Preferably, the optical adhesive bonding the package cover plate and the first and second overlapping surfaces has an integral structure.
Preferably, the width of the first gap is 0.1 mm.
Preferably, the width of the light guide pillar is 0.8mm along the extending direction of the package cover plate.
Preferably, the first overlapping surface and the second overlapping surface are located on the same plane.
The invention also provides a display device which comprises any frame sealing structure provided by the technical scheme.
Drawings
Fig. 1 is a schematic structural diagram of a frame sealing structure according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a frame sealing structure according to an embodiment of the present invention;
icon: 1-a front shell; 2-a light guide column; 3-packaging the cover plate; 4-optical glue; 5-inductor.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, the present invention provides a frame sealing structure, including: the light guide structure comprises a front shell 1, a light guide column 2 (used for guiding light for an inductor 5) and a packaging cover plate 3, wherein a lapping table is formed on the inner side of the front shell 1, and a first lapping surface is formed on one side surface of the lapping table facing the packaging cover plate 3; the light guide column 2 is arranged in the accommodating space formed by the front shell 1, and a second lapping surface is formed on the surface of one side, facing the packaging cover plate 3, of the light guide column 2; the package cover plate 3 is bonded to the first and second overlapping surfaces by the optical adhesive 4.
Among the above-mentioned frame seal structure, frame seal structure includes preceding shell 1, leaded light post 2 and encapsulation apron 3, adopts optical cement 4 to bond between the first faying surface of encapsulation apron 3 and preceding shell 1 and the second faying surface of leaded light post 2. Owing to adopted optical cement 4, based on the light transmissivity of optical cement 4, the bonding structure between the second faying surface of encapsulation apron 3 and leaded light post 2 can not influence leaded light performance of leaded light post 2, and when adopting optical cement 4 to bond encapsulation apron 3 and preceding shell 1, adopts optical cement 4 to bond encapsulation apron 3 and the top of leaded light post 2, can guarantee the bonding strength of encapsulation apron 3.
The frame sealing structure provided by the invention adopts the optical cement 4 to bond the first lapping surface of the packaging cover plate 3 and the front shell 1, and adopts the optical cement 4 to bond the second lapping surface of the packaging cover plate 3 and the light guide column 2, so that the structure not only ensures the sealing performance of the frame, but also can reduce the bonding size between the packaging cover plate 3 and the front shell 1, thereby reducing the upper forehead limit size of the electronic equipment.
Therefore, the frame sealing structure is beneficial to reducing the limit size of the upper forehead of the electronic equipment by changing the sealing structure.
On the basis of the technical scheme, the lapping width range between the packaging cover plate 3 and the first lapping surface is 0.15mm-0.5mm along the extension direction of the packaging cover plate 3.
Obviously, compared with a structure of sealing by means of dispensing or foam adhesive in the prior art, the frame sealing structure provided by the invention reduces the bonding size between the packaging cover plate 3 and the front shell 1, and is beneficial to reducing the width of the first lap joint surface of the front shell 1 along the packaging cover plate 3 direction in the production and manufacturing process, thereby being beneficial to reducing the upper forehead limit size of the electronic equipment.
As a preferred embodiment, the following are selected: along the extending direction of the package cover plate 3, the overlapping width between the package cover plate 3 and the first overlapping surface is 0.15mm (as shown in the dimension a in fig. 2), that is, the sealing width of the optical cement 4 between the package cover plate 3 and the front shell 1 is 0.15mm, which is obviously 0.45mm less than the dispensing sealing (0.6mm) and 0.65mm less than the foam sealing (0.8 mm).
On the basis of the above technical solution, as an optional implementation manner, a first gap is formed between the light guide column 2 and the front shell 1 along the extending direction of the package cover plate 3.
On the basis of the above technical solution, the optical cement 4 bonding the package cover plate 3 and the first and second overlapping surfaces has an integrated structure, in other words, the optical cement 4 is also disposed on the top of the first gap between the light guide pillar 2 and the front housing 1.
It should be noted that the optical adhesive 4 adhering the package cover plate 3 to the first overlapping surface and the second overlapping surface has an integrated structure, which facilitates the adhering operation of the optical adhesive 4, and specifically, the package cover plate 3 adhered with the optical adhesive 4 can be fixed to the front case 1 and the light guide bar 2.
It should be noted that the optical adhesive 4 adhered to the package cover plate 3 may be in a solid state or a liquid state, and is not limited in this respect.
Specifically, referring to fig. 2, in order to avoid the housing, the width of the first gap is generally set to 0.1mm (as shown by a dimension b in fig. 2).
Specifically, the width of the light guide bar 2 along the extending direction of the cover plate 3 is generally 0.8mm (as shown by the dimension c in fig. 2).
It should be noted that, other structures such as a display module are disposed in the electronic device, and a second gap exists between the light guide pillar 2 and the display module along the extending direction of the cover plate 3 for avoiding the gap, and the size of the second gap is generally 0.4mm (as shown by a dimension d in fig. 2).
When the overlapping width between the package cover 3 and the first overlapping surface is 0.15mm, the width of the first gap is 0.1mm, the width of the light guide column 2 is 0.8mm, and the width of the second gap is 0.4mm along the extending direction of the package cover 3, the upper forehead limit size of the electronic device is 1.45mm (as shown in dimension e in fig. 2), which is 0.15mm +0.1mm +0.8mm +0.4 mm.
Obviously, compared with a structure of foam cotton glue sealing and dispensing sealing, the frame sealing structure provided by the invention reduces the limit size of the upper forehead of the electronic equipment.
On the basis of the above technical solution, in order to further improve the sealing stability between the package cover plate 3 and the front case 1 and between the package cover plate and the light guide bar 2, as a preferred embodiment, the first overlapping surface and the second overlapping surface are located on the same plane.
And, set up to the structure that first faying face and second faying face are located the coplanar can be convenient for on the encapsulation apron 3 optical cement 4 to the bonding operation of first faying face and second faying face.
The invention also provides a display device which comprises any frame sealing structure provided by the technical scheme.
It will be apparent to those skilled in the art that various changes and modifications may be made in the embodiments of the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (8)
1. A frame sealing structure, comprising: the light guide column comprises a front shell, a light guide column and a packaging cover plate, wherein a lapping table is formed on the inner side of the front shell, and a first lapping surface is formed on one side surface of the lapping table facing the packaging cover plate; the light guide column is arranged in the accommodating space formed by the front shell, and a second lapping surface is formed on the surface of one side, facing the packaging cover plate, of the light guide column; the packaging cover plate is bonded with the first lapping surface and the second lapping surface through optical cement;
along the extension direction of the packaging cover plate, the overlapping width range between the packaging cover plate and the first overlapping surface is 0.15mm-0.5 mm;
the leaded light post deviates from encapsulation apron one side is equipped with the orientation the bellying of preceding shell, so that the bellying deviates from preceding shell one side forms the holding tank that is used for holding the inductor, just preceding shell is equipped with dodges the groove of dodging of bellying.
2. The bezel seal configuration according to claim 1, wherein a width of an overlap between said package cover and said first overlapping surface in an extending direction of said package cover is 0.15 mm.
3. The bezel-sealing structure of claim 1, wherein a first gap is provided between said light guide bar and said front case along an extending direction of said package cover plate.
4. The bezel seal configuration of claim 3, wherein the optical glue bonding said package cover plate to said first and second strap surfaces has an integral construction.
5. The bezel sealing configuration as recited in claim 4, wherein said first gap has a width of 0.1 mm.
6. The bezel sealing structure of claim 1, wherein a width of said light guiding pillar is 0.8mm in an extending direction of said package cover plate.
7. The bezel seal configuration of any of claims 1-6, wherein said first strap face and said second strap face are in the same plane.
8. A display device comprising the bezel sealing structure according to any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910260431.4A CN110086901B (en) | 2019-04-02 | 2019-04-02 | Frame seal structure and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910260431.4A CN110086901B (en) | 2019-04-02 | 2019-04-02 | Frame seal structure and display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110086901A CN110086901A (en) | 2019-08-02 |
| CN110086901B true CN110086901B (en) | 2021-06-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910260431.4A Active CN110086901B (en) | 2019-04-02 | 2019-04-02 | Frame seal structure and display device |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108322577A (en) * | 2018-04-13 | 2018-07-24 | 维沃移动通信有限公司 | Mobile terminal |
| CN108513465A (en) * | 2018-04-13 | 2018-09-07 | 维沃移动通信有限公司 | A kind of mobile terminal |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20140002191A (en) * | 2012-06-28 | 2014-01-08 | 삼성전자주식회사 | Strength-reinforced dual display module using a transparent sheet |
| EP3346355B1 (en) * | 2017-01-09 | 2020-06-10 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Display screen assembly, assembling method thereof and electronic device |
| CN108600446B (en) * | 2018-04-13 | 2020-04-21 | 维沃移动通信有限公司 | Mobile terminal |
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2019
- 2019-04-02 CN CN201910260431.4A patent/CN110086901B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108322577A (en) * | 2018-04-13 | 2018-07-24 | 维沃移动通信有限公司 | Mobile terminal |
| CN108513465A (en) * | 2018-04-13 | 2018-09-07 | 维沃移动通信有限公司 | A kind of mobile terminal |
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| Publication number | Publication date |
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| CN110086901A (en) | 2019-08-02 |
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Address after: 201210 Building 1, 399 Keyuan Road, Zhangjiang High Tech Park, Pudong New Area, Shanghai Applicant after: Huaqin Technology Co.,Ltd. Address before: 201210 Building 1, 399 Keyuan Road, Zhangjiang High Tech Park, Pudong New Area, Shanghai Applicant before: Huaqin Technology Co.,Ltd. Address after: 201210 Building 1, 399 Keyuan Road, Zhangjiang High Tech Park, Pudong New Area, Shanghai Applicant after: Huaqin Technology Co.,Ltd. Address before: 201210 Building 1, 399 Keyuan Road, Zhangjiang High Tech Park, Pudong New Area, Shanghai Applicant before: HUAQIN TELECOM TECHNOLOGY Co.,Ltd. |
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