CN110082861A - A kind of combined type optical branch device and manufacturing process - Google Patents

A kind of combined type optical branch device and manufacturing process Download PDF

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Publication number
CN110082861A
CN110082861A CN201910472652.8A CN201910472652A CN110082861A CN 110082861 A CN110082861 A CN 110082861A CN 201910472652 A CN201910472652 A CN 201910472652A CN 110082861 A CN110082861 A CN 110082861A
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CN
China
Prior art keywords
optical fiber
optical
array board
array
fiber
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Pending
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CN201910472652.8A
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Chinese (zh)
Inventor
许宏松
林熙峰
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Tumen Shun Feng Photoelectric Technology Co Ltd
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Tumen Shun Feng Photoelectric Technology Co Ltd
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Application filed by Tumen Shun Feng Photoelectric Technology Co Ltd filed Critical Tumen Shun Feng Photoelectric Technology Co Ltd
Priority to CN201910472652.8A priority Critical patent/CN110082861A/en
Publication of CN110082861A publication Critical patent/CN110082861A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/245Removing protective coverings of light guides before coupling
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/25Preparing the ends of light guides for coupling, e.g. cutting
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/255Splicing of light guides, e.g. by fusion or bonding
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/255Splicing of light guides, e.g. by fusion or bonding
    • G02B6/2552Splicing of light guides, e.g. by fusion or bonding reshaping or reforming of light guides for coupling using thermal heating, e.g. tapering, forming of a lens on light guide ends
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/26Optical coupling means
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/44Mechanical structures for providing tensile strength and external protection for fibres, e.g. optical transmission cables

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

The embodiment of the present invention discloses a kind of combined type optical branch device and manufacturing process, tray interior is equipped with fused biconical taper optical splitter, fused biconical taper optical splitter includes input optical fibre, output optical fibre and monitoring optical fiber, is intersected in an optical fiber fusing point between input optical fibre, output optical fibre and monitoring optical fiber;Output optical fibre is connected with the first optical fiber array plate, and the first optical fiber array plate is connected with optical plane waveguide chip, and optical plane waveguide chip is connected with the second optical fiber array plate, and several optical fiber output channels are formed on the second optical fiber array plate.Manufacturing process includes array board cleaning;Optical fiber peeling;Array board arranges optical fiber;Array board dispensing, solidification and aging;The grinding of array board optical fiber head;Fiber end inspection;Array board coupling;Semi-finished product solidification and aging;Semi-finished product Data Detection;Optical fiber connects;Testing package.Change the wavelength characteristic of device and monitor the variation of splitting ratio in real time, meets light splitting required precision, realize lower added loss, low Polarization Dependent Loss, any splitting ratio.

Description

A kind of combined type optical branch device and manufacturing process
Technical field
The present embodiments relate to technical field of optical fiber communication, and in particular to a kind of combined type optical branch device and manufacture work Skill.
Background technique
Optical splitter can be divided into fused tapered and planar waveguide-type by principle.Fused tapered is by two (or two It is more than root) remove coat optical fiber in certain method by disturbing, melt at high temperature heat, while to two side stretchings, finally The special waveguiding structure of bicone form is formed in heating zone, by controlling the angle of optic fibre turning and the length of stretching, can be obtained To different light splitting ratios.The area La Zhui is solidificated on quartz substrate with solidification glue finally and is inserted into stainless copper pipe.Fused biconical taper The light splitting principle of type optical splitter is intercoupled (degree of coupling, coupling length) and changes by the evanescent field between change optical fiber Fiber radius come realize different size branch measure, otherwise multipath light signal can also be combined into signal all the way.
Optical splitter has 1/2 input terminal and N number of output as one of component most important in passive optical network End is based on quartz base plate integrated waveguide optical power technique, in conjunction with accurate reliable array fibre, by high-precision alignment processing procedure Optical power divider provides the optical splitter solution of uniformly light splitting, small size and high reliability.Prior art is not Can monitoring device issue unlike signal, can only by any signal, power, energy etc. divide equally emit, added losses and polarization phase It is high to close loss, is not able to satisfy any splitting ratio.
Summary of the invention
For this purpose, the embodiment of the present invention provides a kind of combined type optical branch device and manufacturing process, bandwidth expansion technique is utilized (asymmetric technique) makes it can be full in bandwidth range to change the wavelength characteristic of device and monitor the variation of splitting ratio in real time The features such as being divided the requirement of precision enough, and meeting lower added loss, low Polarization Dependent Loss, any splitting ratio.
To achieve the goals above, the embodiment of the present invention provides the following technical solutions: a kind of combined type optical branch device, packet Box body is included, the tray interior is equipped with fused biconical taper optical splitter, and the fused biconical taper optical splitter includes input optical fibre, output Optical fiber and monitoring optical fiber are intersected in an optical fiber fusing point between the input optical fibre, output optical fibre and monitoring optical fiber;The output Optical fiber is connected with the first optical fiber array plate, and first optical fiber array plate is connected with optical plane waveguide chip, the optical plane wave It leads chip and is connected with the second optical fiber array plate, several optical fiber output channels are formed on second optical fiber array plate.
As the preferred embodiment of combined type optical branch device, described box body one end is formed with the first rubber plug, and box body is another Outer one end is formed with the second rubber plug, is formed with the first port on first rubber plug, on second rubber plug It is formed with the second port and third connectivity mouth, the monitoring optical fiber is drawn out to the outside of the box body by first port;Institute State the inside that input optical fibre is introduced into the box body by second port;The output optical fibre is drawn by the third connectivity mouth The outside of the box body is arrived out.
As the preferred embodiment of combined type optical branch device, the fused biconical taper optical splitter is drawn using the melting of one-to-two formula Bore optical splitter.
As the preferred embodiment of combined type optical branch device, first optical fiber array plate is single fiber array board or double light Fibre array plate, first optical fiber array plate are ribbon fiber array plate.
As the preferred embodiment of combined type optical branch device, the tray interior is filled with damping silica gel.
The embodiment of the present invention also provides a kind of combined type optical branch device manufacturing process, comprising the following steps:
1) array board cleans: being put into shake in the beaker equipped with cleaning solution and washes, places into the beaker equipped with pure water and clean;
2) optical fiber peeling: the control of peeling length glues alcohol cleaning peeling region in 15 ± 3mm, with dust-free paper;
3) array board arranges optical fiber: being arranged on glass-board surface with tweezers by clean array board is neat, each other Away from 10~15cm;
4) array board dispensing, solidification and aging: the point glue at the horn mouth of array board, array board for dispensing glue one by one The good optical fiber of insertion process, enters back into oven cooking cycle after solidification;
5) array board optical fiber head is ground: the abrasive disk for installing product being placed in the porcelain ring of grinder and is ground;
6) fiber end inspection: angle, scratch and foreign matter, alligatoring, excessive glue, viscose glue, bubble, optical fiber angle are broken in detection end face Degree, light passing, polishing direction and optical fiber presentation quality;
7) array board couples: by array board and the alignment coupling of optical plane waveguide chip;
8) semi-finished product solidification and aging: solidified under the conditions of 40~80 DEG C of temperature, carried out under the conditions of 110 ± 5 DEG C of temperature Aging;
9) Insertion Loss, return loss, directionality, polarization loss and the uniformity of semi-finished product semi-finished product Data Detection: are detected;
10) optical fiber connects: optical fiber being penetrated in each blank pipe, fixes optical fiber with adhesive tape;
11) testing package: detecting Insertion Loss, return loss, directionality, polarization loss and the uniformity of finished product, to qualified products into Row packaging.
As the preferred embodiment of combined type optical branch device manufacturing process, the step 1) includes:
101) it checks the material that will be cleaned and confirms whether clean in cleaning jig;
102) array version to be cleaned is sandwiched into cleaning jig one by one;
103) cleaning jig for installing material is put into shake in the beaker equipped with cleaning solution to wash 10 minutes, is placed into equipped with pure It is cleaned 5 minutes in the beaker of water purification;
104) cleaned material is put into clean culture dish together with folder cleaning tool, is put into 85 degree of oven cooking cycles 30 and divides Clock;
105) after toasting, cleaned material is pressed from both sides out one by one in cleaning jig, is put into clean culture dish In, place into drying box keeping.
As the preferred embodiment of combined type optical branch device manufacturing process, the step 3) includes:
301) bare optical fiber cleaned up is scattered upward, is sticked on baking rack one by one with 10-15cm spacing;
302) optical fiber coil part is arranged neatly again, is fixed on baking rack foundation with gummed paper;
303) clean array board is arranged on glass-board surface with tweezers, the temperature for controlling heating dish is 40-50 °;
The step 4) includes:
401) the point glue at the horn mouth of array board, the prominent horn mouth of dispensing amount, is stayed in pore to glue;
402) array board for dispensing glue is clamped with tweezers, be inserted on the optical fiber handled well one by one, fiber stripping mouth is inserted into taper hole Size be 0.3~0.8mm;
403) solidify 5 minutes, enter back into 85 degree of oven cooking cycles 2 hours.
As the preferred embodiment of combined type optical branch device manufacturing process, the step 7) includes:
701) it is packed into end array board;
702) it is packed into optical plane waveguide chip;
703) array board and the alignment of optical plane waveguide chip;
704) hot spot is adjusted;
705) dress output end FA and adjustment;
706) to array board and optical plane waveguide chip dispensing;
707) accurate adjustment output end FA after dispensing;
708) array board and optical plane waveguide chip are solidified.
As the preferred embodiment of combined type optical branch device manufacturing process, the step 10) includes:
1001) 0.9mm blank pipe is penetrated in rubber plug, is fixed with Instant cement, blank pipe extension elongation is 2mm, and room temperature is certainly It is so 5 minutes dry;
1002) point one drips Instant cement at isolated edge 5mm in box body, and semi-finished product are fixed in the above, and room temperature does 5 points naturally Zhong Hou, one drop Instant cement of point at both ends isolated edge 2mm, rubber plug is pasted, room temperature is waited to do 5 points naturally in box body Clock;
1003) along box body coiled fiber, optical fiber is penetrated in each blank pipe, fixes optical fiber with adhesive tape;
1004) it is smeared, product is carried out close along the intracorporal product bottom of box and two sides rubber plug bottom with 704 silica gel Envelope.
The embodiment of the present invention has the advantages that optical fiber array plate is produced on above drawing cone splitter output, directly adopts With draw cone splitter online with optical plane waveguide chip, ribbon fiber array plate coupling.After data test is qualified, it will combine Formula splitter disk enters in box body such as rectangular stainless steel box.Seal rubber plug is added at stainless steel box body both ends, and clicks and enters and subtracts Silica gel and sealing glue are shaken, double-layer seal and cushioning effect are played.By carrying out fusion drawn on drawing cone machine, expanded using bandwidth Art of giving full play to one's skill (asymmetric technique) makes it in bandwidth range to change the wavelength characteristic of device and monitor the variation of splitting ratio in real time It is able to satisfy the requirement for being divided precision, is met and is divided equally simultaneously in using and monitor splitting ratio, energy, signal, power etc., Er Qieman The features such as sufficient lower added loss, low Polarization Dependent Loss, any splitting ratio.
Detailed description of the invention
It, below will be to embodiment party in order to illustrate more clearly of embodiments of the present invention or technical solution in the prior art Formula or attached drawing needed to be used in the description of the prior art are briefly described.It should be evident that the accompanying drawings in the following description is only It is merely exemplary, it for those of ordinary skill in the art, without creative efforts, can also basis The attached drawing of offer, which is extended, obtains other implementation attached drawings.
Structure depicted in this specification, ratio, size etc., only to cooperate the revealed content of specification, for Those skilled in the art understands and reads, and is not intended to limit the invention enforceable qualifications, therefore does not have technical Essential meaning, the modification of any structure, the change of proportionate relationship or the adjustment of size are not influencing the function of the invention that can be generated Under effect and the purpose that can reach, should all still it fall in the range of disclosed technology contents obtain and can cover.
Fig. 1 is a kind of combined type optical branch device structural schematic diagram provided in the embodiment of the present invention;
Fig. 2 is a kind of combined type optical branch device manufacturing process flow schematic diagram provided in the embodiment of the present invention;
In figure: 1, box body;2, fused biconical taper optical splitter;3, input optical fibre;4, output optical fibre;5, optical fiber is monitored;6, light Fine fusing point;7, the first optical fiber array plate;8, optical plane waveguide chip;9, the second optical fiber array plate;10, optical fiber output channel;11, First rubber plug;12, the second rubber plug;13, the first port;14, the second port;15, third connectivity mouth.
Specific embodiment
Embodiments of the present invention are illustrated by particular specific embodiment below, those skilled in the art can be by this explanation Content disclosed by book is understood other advantages and efficacy of the present invention easily, it is clear that described embodiment is the present invention one Section Example, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not doing Every other embodiment obtained under the premise of creative work out, shall fall within the protection scope of the present invention.
Referring to Fig. 1, a kind of combined type optical branch device, including box body 1 are provided, are equipped with fused biconical taper inside the box body 1 Optical splitter 2, the fused biconical taper optical splitter 2 include input optical fibre 3, output optical fibre 4 and monitoring optical fiber 5, the input light An optical fiber fusing point 6 is intersected between fibre 3, output optical fibre 4 and monitoring optical fiber 5;The output optical fibre 4 is connected with the first optical fiber array Strake 7, first optical fiber array plate 7 are connected with optical plane waveguide chip 8, and the optical plane waveguide chip 8 is connected with second Optical fiber array plate 9 is formed with several optical fiber output channels 10 on second optical fiber array plate 9.Input optical fibre 3 is used for input light Fine 3 signals, output optical fibre 4 are used to the fiber-optic signal removed after being divided monitoring signal being input to optical plane waveguide chip 8, monitor Optical fiber 5 is for the monitoring such as optical fibre light splitting ratio, energy, signal and power.
Specifically, the fused biconical taper optical splitter 2 uses one-to-two formula fused biconical taper optical splitter 2.First light Fibre array plate 7 is single fiber array board or double optical fiber array plates, and first optical fiber array plate 7 is ribbon fiber array plate.Light Fibre array is that one optical fiber, a branch of optical fiber or a fibre ribbon are mounted on array substrate using V-shaped groove.Fiber array is to remove The nuditing fiber part of fibre coating is gone to be placed in V-shaped groove, pressurized device component pressurizes and bonded by adhesive.Preceding End, which is accurately positioned, and to be connected on PLC, the joint portion of different optical fiber is installed on array substrate.
In one embodiment of combined type optical branch device, described 1 one end of box body is formed with the first rubber plug 11, box body 1 other end is formed with the second rubber plug 12, and the first port 13, second rubber are formed on first rubber plug 11 The second port 14 and third connectivity mouth 15 are formed on glue plug 12, the monitoring optical fiber 5 is drawn out to by first port 13 The outside of the box body 1;The input optical fibre 3 is introduced into the inside of the box body 1 by second port 14;The output Optical fiber 4 is drawn out to the outside of the box body 1 by the third connectivity mouth 15.Damping silica gel is filled with inside the box body 1.Rubber Plug plays the role of fixed optical fiber, and damping silica gel preferably 704 silica gel play the role of shock-absorbing protecting inside box body 1.
Referring to fig. 2, the embodiment of the present invention also provides a kind of combined type optical branch device manufacturing process, comprising the following steps:
1) array board cleans: being put into shake in the beaker equipped with cleaning solution and washes, places into the beaker equipped with pure water and clean;
2) optical fiber peeling: the control of peeling length glues alcohol cleaning peeling region in 15 ± 3mm, with dust-free paper;
3) array board arranges optical fiber: being arranged on glass-board surface with tweezers by clean array board is neat, each other Away from 10~15cm;
4) array board dispensing, solidification and aging: the point glue at the horn mouth of array board, array board for dispensing glue one by one The good optical fiber of insertion process, enters back into oven cooking cycle after solidification;
5) array board optical fiber head is ground: the abrasive disk for installing product being placed in the porcelain ring of grinder and is ground;
6) fiber end inspection: angle, scratch and foreign matter, alligatoring, excessive glue, viscose glue, bubble, optical fiber angle are broken in detection end face Degree, light passing, polishing direction and optical fiber presentation quality;
7) array board couples: by array board and the alignment coupling of optical plane waveguide chip;
8) semi-finished product solidification and aging: solidified under the conditions of 40~80 DEG C of temperature, carried out under the conditions of 110 ± 5 DEG C of temperature Aging;
9) Insertion Loss, return loss, directionality, polarization loss and the uniformity of semi-finished product semi-finished product Data Detection: are detected;
10) optical fiber connects: optical fiber being penetrated in each blank pipe, fixes optical fiber with adhesive tape;
11) testing package: detecting Insertion Loss, return loss, directionality, polarization loss and the uniformity of finished product, to qualified products into Row packaging.
In one embodiment of combined type optical branch device manufacturing process, the step 1) includes:
101) it checks the material that will be cleaned and confirms whether clean in cleaning jig;
102) array version to be cleaned is sandwiched into cleaning jig one by one;
103) cleaning jig for installing material is put into shake in the beaker equipped with cleaning solution to wash 10 minutes, is placed into equipped with pure It is cleaned 5 minutes in the beaker of water purification;
104) cleaned material is put into clean culture dish together with folder cleaning tool, is put into 85 degree of oven cooking cycles 30 and divides Clock;
105) after toasting, cleaned material is pressed from both sides out one by one in cleaning jig, is put into clean culture dish In, place into drying box keeping.
Specifically, check will cleaning material, confirmation model, quantity and effective time, and whether clean in gauging fixture. The array version for needing to clean with plastic tweezer folder, sandwiches corresponding cleaning jig one by one.The fixture of material will be installed, is put into dress There is shake in the beaker of cleaning solution to wash 10 minutes, places into the beaker equipped with pure water and clean 5 minutes.By cleaned material, It is put into together with fixture in clean culture dish, is put into 85 degree of oven cooking cycles 30 minutes.After baking, by cleaned material from It presss from both sides out, is put into clean culture dish one by one in fixture, be put into drying box keeping.
Specifically, by optical fiber around tail portion about 20~30cm, putting on the silica gel sleeve pipe of dimension, light in step 2) Fine directly to carry out peeling with wire stripper, the control of peeling length glues alcohol cleaning peeling region in 15 ± 3mm, with dust-free paper.
In one embodiment of combined type optical branch device manufacturing process, the step 3) includes:
301) bare optical fiber cleaned up is scattered upward, is sticked on baking rack one by one with 10-15cm spacing;
302) optical fiber coil part is arranged neatly again, is fixed on baking rack foundation with gummed paper;
303) clean array board is arranged on glass-board surface with tweezers, the temperature for controlling heating dish is 40-50 °.
The step 4) includes:
401) the point glue at the horn mouth of array board, the prominent horn mouth of dispensing amount, is stayed in pore to glue;
402) array board for dispensing glue is clamped with tweezers, be inserted on the optical fiber handled well one by one, fiber stripping mouth is inserted into taper hole Size be 0.3~0.8mm;
403) solidify 5 minutes, enter back into 85 degree of oven cooking cycles 2 hours.
Specifically, upward by the bare optical fiber cleaned up, being sticked to baking rack one by one after slightly scattering with 10-15cm spacing On require naked fibre to be higher by baking rack 15cm or so, then steadily cemented with dark brown high tempreture tape.Baking rack two sides, the quantity of single side 50 are not allowed more than.Optical fiber coil part is arranged neatly again, is fixed on baking rack foundation with yellow gummed paper.Use tweezer Son is arranged in clean array board is neat on glass-board surface, and mutual spacing is in 10mm or so, and 10 every time.Heating dish Temperature is 40-50 °.For the suitable glue of point at the horn mouth of array board, glue amount will slightly protrude horn mouth, stay to glue into hair In pore.Array board for dispensing glue is clamped with tweezers, is inserted on processed optical fiber one by one, fiber stripping mouth is inserted into the ruler of taper hole Very little is 0.3~0.8mm.Whether horn mouth at have bubble, whether there is or not residual glue on cylinder and tail portion optical fiber if observing.If any bubble, Tail portion glue blotted only with wiping paper angle, goes after bubble removing glue again, if having glue on array board cylinder and tail portion optical fiber, use Cleansing tissue wiped clean.Product UV (radiation curing) 5 minutes of the good glue of point, enter back into 85 degree of oven cooking cycles 2 hours.
Specifically, first remove the extra optical fiber head of array board in the step 5), check glue either with or without flowing to product The upper surface of and side, such as useful blade remove.The scale of torque screwdrivers is adjusted, the surface of material clamp in cleaning.First is ground The screw of grinding jig unclamps, and the array board end face that puts in is adjacent to the surface of upper material clamp, left hand tightens the screw, right hand toothpick Product is headed on, the right side of product is allowed to be adjacent to the side of fixture, pays attention to checking whether product is adjacent to.The abrasive disk for installing product is put In the porcelain ring of grinder, the revolving speed for adjusting machine is 5 turns, and the time is 15 minutes, then adjusts within every lattice 10 seconds lower revolving speed, often Secondary 5 turns of adjustment, is transferred to always 20 and switchs to stop, and whether holds angle successfully under checking after the completion of grinding, does not lengthen milling time such as.It holds successfully The product of angle is placed under clear water and rinses, and dries up after being scrubbed clean with hairbrush.Be put on polishing machine porcelain ring (and grinding When it is the same), adjust machine revolving speed be 20 turns, the time be 18-20 minutes.Polished product is hung on ultrasonic wave, cleaning 1 Minute after product is unloaded down above fixture, then clean 3 minutes (attention: the surface of product cannot contact in cleaning process Ultrasonic wave chassis).Cleaned product is put into pallet, waits and detecting in next step.
Specifically, in the step 6), with the optical microscopy project of testing include end face break angle, scratch and foreign matter, Alligatoring, excessive glue, viscose glue, bubble and fiber angle;Additionally detect light passing, polishing direction and optical fiber presentation quality.End face Core segment cannot have scratch, pollution and foreign matter;Other parts allow to have scratch, length≤1mm, must not exceed 2 broken angles Being not greater than 0.3mm may not exceed 2 angles.Each surface does not allow slight crack occur, and burnishing surface, bottom surface, cover board face do not allow There are excessive glue or viscose glue, side allows to have glue, but glue surface height≤0.1mm;Nearly array board end optical fiber allows excessive glue≤0.5mm.Permit Permitted have diameter≤1/3 naked fibre diameter circular bubble, adds up no more than 3.The glue contraction for not forming cavity is not calculated as bubble. Measurement Allowance is ± 0.3 °.Light passing performance, each channel light passing are detected with feux rouges pen, and array board position is without light leakage.With putting Big mirror observes optical fiber bright spot, bright block, and the bright spot on optical fiber can permit receipts without apparent breakage, single bright block length no more than 2mm, At sum no more than 3.Feel, visual, magnifying glass observe light loss, cannot there is damaged, fluffing, band optical fiber table in shipment length Face is without apparent skin effect phenomenon.
In one embodiment of combined type optical branch device manufacturing process, the step 7) includes:
701) it is packed into end array board;
702) it is packed into optical plane waveguide chip;
703) array board and the alignment of optical plane waveguide chip;
704) hot spot is adjusted;
705) dress output end FA and adjustment;
706) to array board and optical plane waveguide chip dispensing;
707) accurate adjustment output end FA after dispensing;
708) array board and optical plane waveguide chip are solidified.
Specifically, step 701) is packed into during the array board of end, the optical fiber of single fiber array board is 1. held on the other hand, it will be single Fiber array is placed in the fixture of input terminal;2. gently pushing the surface of monochromatic light fibre array with toothpick, make single fiber array board Bottom surface is adjacent to fixture bottom surface;3. the face for gently pressing against single fiber array board upper end with toothpick is motionless, another hand, which is twisted, adjusts rotation Button keeps single fiber array board fixed, and single fiber array board can be flipped with toothpick and determines whether to fix, if single fiber battle array Column do not shake, the fixation of instruction sheet optical fiber array plate.In fixed monochromatic light fibre array, cannot firmly turn round adjusting knob with Exempt to oppress monochromatic light fibre array;The optical fiber of single fiber array board will be wound, and avoid generating light loss.
Step 702) is packed into during optical plane waveguide chip: optical plane waveguide chip is 1. taken out out of chip cartridges with tweezers It is placed on adjusting bracket center bearing bracket, guarantees that optical plane waveguide chip end face polishing angle matches with single fiber polishing angle, and light The angle that center bearing bracket two sides are stretched out at planar waveguide chip both ends is roughly equal;2. with table in the light press polish planar waveguide chip of toothpick Face, another hand tighten adjusting knob, until optical plane waveguide chip touches the fixed side of briquetting, make optical plane waveguide chip It is fixed.In fixed optical plane waveguide chip, adjusting knob cannot be firmly turned round, in order to avoid damage optical plane waveguide chip.Check core Whether piece input, output end are installed correctly.CCD show medium wave conducting bar line it is few be input on one side, more than waveguide striped is on one side Output.
In step 703) array board and optical plane waveguide chip alignment procedures;1. input terminal Y-axis is adjusted, until single fiber It is close with chip;2. checking the front of single fiber and chip, side situation;3. adjusting knob makes the front of single fiber and chip, side It coincide.
In step 704) hot spot adjustment process, 1. to good input terminal a front surface and a side surface after, it is defeated to chip to adjust CCD camera lens Outlet;2. pulling open output end, reflecting mirror is put in output end fixture.CCD clarity is adjusted, so that the white wire in reflecting mirror is most Clearly;It is cut flat with 3. the optical fiber of single fiber is placed on cutter, is put into clamper, be inserted into white light source socket, white light source is transferred to It is most bright;4. first adjusting input terminal upper and lower axle, then antero posterior axis is adjusted, until showing 8 bright spots (by specific channel on display It is fixed), output end regulating system is removed, reflective mirror is taken down, the optical fiber of single fiber and the light source line welding of monitoring light source is good.
Step 705) fills during output end FA and adjustment;FA is put on output end adjusting bracket, keeps FA and light flat The end plane angle of face waveguide chip matches, and in fixed battle array FA, firmly cannot turn round adjusting knob in order to avoid damaging FA, ribbon fiber It hangs up properly, in order to avoid cause light loss and peeling, then carries out output end initial adjustment (including output end front, side alignment, and preliminary insert Damage is turned down):
1. adjusting output end Y-axis, keep FA close with chip;2. checking the front of FA and chip, side situation;3. adjusting Section knob makes the front of FA and chip, side-anastomosis;4. CCD is adjusted to optical plane waveguide behind the side of good output end front The output end of chip;5. adjusting output end Y-axis, ribbon fiber FA is pulled open at a distance from chip;6. adjusting output end upper and lower axle Knob, then output end antero posterior axis is adjusted, until the Insertion Loss value in two channels reaches -30dB or less on light power meter;7. gradual Output end Y-axis is promoted, allows FA close to chip, and adjusting output end upper and lower axle and antero posterior axis gradually, adjusts Insertion Loss value gradually It is small, complete preliminary adjustment.Using a channel as standard, by the channel, numerical value is transferred to minimum, in adjustment, repeats the 1st work Make, until the numerical value that is monitored reaches technique requirement: the channel numerical value that is monitored while increasing and decreasing, and when difference is less than 0.5dB Then it is believed that balance, when balancing, pulls open a distance for the FA of output end, avoid damage to waveguide chip, by output end tune When section balance, input terminal is not transferred, when input terminal is promoted and adjusted, output end must not be adjusted again.
During step 706) is to array board and optical plane waveguide chip dispensing;1. adjusting the Y-axis of input terminal, pull open Single fiber with about 15 millimeters of chip, the right hand hold a plastic pin on the central point of chip end face one drop UV glue;2. adjusting a left side for input terminal Right axle makes single fiber slowly close to chip, allow UV glue to be squeezed between both ends of the surface and spread and form one layer of uniform UV glue thin layer;③ To avoid displacement from may cause influence, input terminal upper and lower axle and antero posterior axis are adjusted, until Insertion Loss value is transferred to minimum and (is generally transferred to ratio The big right and left 1.0dB can dispensing in " UV photocuring insertion loss standard value referring to table ");4. adjusting the Y-axis of output end, draw FA and about 15 millimeters of chip are opened, the right hand holds plastic pin drop UV glue on the central point of chip end face, (has to draw when dispensing It opens, by glue point on chip end face, main points are not on chip and the front FA);5. adjusting the Y-axis of output end, lean on FA slowly Nearly chip allows UV glue to be squeezed between both ends of the surface and spreads and form one layer of uniform UV glue thin layer;6. to avoid displacement that from may making At influence, input terminal upper and lower axle and antero posterior axis are adjusted, until two output end waveguides of optical plane waveguide chip ragged edge are corresponding FA absolute reading it is minimum until.Whole process avoids skin contact UV glue, after taking glue, from having to close the lid, and avoids UV glue Decline into dust, decline the performance of glue, each gluing is appropriate.Point plastic pin takes a droplet UV glue, puts in optical plane wave It leads at the center of chip end face.
After step 707) dispensing during accurate adjustment output end FA;1. adjusting the antero posterior axis of the accurate adjustment of output end and upper Lower axle makes monitor channel reading be transferred to minimum value;2. continuing next procedure if institute's monitor channel reading is less than standard value (standard value is referring to table);3. removing bad component from fixture if institute's monitor channel has one to be greater than standard value, UV is removed Glue records relevant flame with gummed paper on the FA or chip retracted, transfers to cleaning to save, retracts warehouse;4. by two The Insertion Loss value of a input terminal is adjusted, and two corresponding Insertion Loss values meet UV solidification insertion loss standard value referring to table. After dispensing, if cannot turn down, UV glue, returned materials are removed;Cannot be extruded optical plane waveguide chip energetically.
1. step 708) opens ultraviolet lamp, setting time 200 in array board and optical plane waveguide chip solidification process Second;2. ultraviolet lamp is moved on optical plane waveguide chip, UV hot spot will impinge upon single fiber and chip interface, chip and the interface FA are hit exactly Between;3. carrying out ultraviolet light irradiation by lower switch, 1x2/1x4/1x8/1x16/1x32 is according to primary (each time is 200 seconds), 1x64 It need to be according to secondary, first according to centre, afterwards according to two sides (time is 400 seconds);4. successively back-outing center bearing bracket after complete UV light, inputs, is defeated Outlet;5. semi-finished product are removed from bracket, two monitoring datas on light power meter are checked, if Insertion Loss value does not change, pinch Disconnected light source line, removes the semi-finished product good to light, disconnected glue-line is broken if becoming larger beyond upper table specification again to light;6. then by around Line requirement winds both ends optical fiber with fibre, sticks the date on band fibre.When UV irradiates, hot spot will be grasped at the junction of chip and FA When making, parts of body not directly irradiating ultraviolet light line.
Specifically, in the step 8): point inspection UV solidification case as required, and fill in an inspection record sheet.Naked fibre product is whole Neat is placed in iron pan (specification 445*345mm), and balance quantity is determined according to product type, and product arrangement width is no more than 170mm is spaced the distance of 1mm or more between each product, avoids touching between product single fiber and squeeze.During balance, 1. 1 block of bottom liner glass (size: 170*15*3mm) is fixed with double faced adhesive tape in iron pan center;2. double faced adhesive tape is sticked on glass, High temperature gummed tape (viscous face-up) is sticked on double-sided adhesive again;3. the band fibre of product is sticked on high temperature gummed tape one by one;Use high temperature The fixed product with of adhesive tape is fine, adhesive tape both ends doubling, convenient for retracting.Product optical fiber is covered with two masking foils, and is pressed from both sides with clip Firmly two sides cannot cover coupling surface when covering optical fiber.UV case power supply is opened, chamber door is opened, is put into the product to UV exposure, and will Coupling surface moves to the most bright position of illumination, closes chamber door, and the temperature inside the box is 40~80 DEG C, exposes 60 ± 2 minutes, exposure finishes Afterwards, power supply is closed, product is taken out.In ageing process, it is 110 ± 5 DEG C by temperature setting, opens chamber door, be put into production to be baked Product, every disk, which is put, may not exceed 200, when iron pan stacks, can not be pressed onto optical fiber.
Specifically, the step 9) and 11) test process, light source line peeling 5cm are put into above cutter and cut off, it is inserted into System loss is zeroed in equipment.The source ends of zero are put into input terminal on the left of aligner, product input terminal peeling to be measured 5cm is put into above cutter and cuts off, and is then placed in output end on the right side of aligner, and the right hand locks aligner, records test data.
In one embodiment of combined type optical branch device manufacturing process, the step 10) includes:
1001) 0.9mm blank pipe is penetrated in rubber plug, is fixed with Instant cement, blank pipe extension elongation is 2mm, and room temperature is certainly It is so 5 minutes dry;
1002) point one drips Instant cement at isolated edge 5mm in box body, and semi-finished product are fixed in the above, and room temperature does 5 points naturally Zhong Hou, one drop Instant cement of point at both ends isolated edge 2mm, rubber plug is pasted, room temperature is waited to do 5 points naturally in box body Clock;
1003) along box body coiled fiber, optical fiber is penetrated in each blank pipe, fixes optical fiber with adhesive tape;
1004) it is smeared, product is carried out close along the intracorporal product bottom of box and two sides rubber plug bottom with 704 silica gel Envelope.
Specifically, first penetrating 0.9mm blank pipe in rubber plug, to be fixed with Instant cement, blank pipe extension elongation is 2mm, Room temperature can be used for dry 5 minutes naturally.One drop Instant cement of point at isolated edge 5mm, semi-finished product are fixed in the above in box, room temperature It is naturally dry that one drop Instant cement of point at both ends isolated edge 2mm, the rubber plug previously made is pasted in box after five minutes, etc. It is done 5 minutes naturally to room temperature.One circle optical fiber of coiling, optical fiber is penetrated in each blank pipe, high-temp. tea coloring agent is then used in box Band fixes optical fiber.It is smeared with product bottom of 704 silica gel in box, is smeared along two sides rubber plug bottom, guaranteed The damping of product and sealing function.
Optical fiber array plate of the embodiment of the present invention is produced on above drawing cone splitter output, is directlyed adopt drawing cone splitter and is existed Line and optical plane waveguide chip, the coupling of ribbon fiber array plate.After data test is qualified, combined type splitter disk is entered into box In body such as rectangular stainless steel box.Seal rubber plug is added at stainless steel box body both ends, and clicks and enters damping silica gel and sealant Water plays double-layer seal and cushioning effect.It is (asymmetric using bandwidth expansion technique by carrying out fusion drawn on drawing cone machine Technique) to change the wavelength characteristic of device and monitor the variation of splitting ratio in real time, so that it is able to satisfy light splitting in bandwidth range The requirement of precision meets and divides equally simultaneously in using and monitor splitting ratio, energy, signal, power etc., and meets low additional damage The features such as consumption, low Polarization Dependent Loss, any splitting ratio.
Although above having used general explanation and specific embodiment, the present invention is described in detail, at this On the basis of invention, it can be made some modifications or improvements, this will be apparent to those skilled in the art.Therefore, These modifications or improvements without departing from theon the basis of the spirit of the present invention are fallen within the scope of the claimed invention.

Claims (10)

1. a kind of combined type optical branch device, which is characterized in that including box body (1), fused biconical taper is equipped with inside the box body (1) Optical splitter (2), the fused biconical taper optical splitter (2) include input optical fibre (3), output optical fibre (4) and monitor optical fiber (5), An optical fiber fusing point (6) is intersected between the input optical fibre (3), output optical fibre (4) and monitoring optical fiber (5);The output light Fine (4) are connected with the first optical fiber array plate (7), and first optical fiber array plate (7) is connected with optical plane waveguide chip (8), institute It states optical plane waveguide chip (8) to be connected with the second optical fiber array plate (9), be formed on second optical fiber array plate (9) several Optical fiber output channel (10).
2. a kind of combined type optical branch device according to claim 1, which is characterized in that described box body (1) one end is formed Have the first rubber plug (11), box body (1) other end is formed with the second rubber plug (12), first rubber plug (11) On be formed with the first port (13), be formed with the second port (14) and third connectivity mouth (15) on second rubber plug (12), Monitoring optical fiber (5) is drawn out to the outside of the box body (1) by first port (13);The input optical fibre (3) is logical Cross the inside that second port (14) is introduced into the box body (1);The output optical fibre (4) passes through the third connectivity mouth (15) It is drawn out to the outside of the box body (1).
3. a kind of combined type optical branch device according to claim 1, which is characterized in that the fused biconical taper optical splitter (2) one-to-two formula fused biconical taper optical splitter (2) is used.
4. a kind of combined type optical branch device according to claim 1, which is characterized in that first optical fiber array plate It (7) is single fiber array board or double optical fiber array plates, first optical fiber array plate (7) is ribbon fiber array plate.
5. a kind of combined type optical branch device according to claim 1, which is characterized in that filling inside the box body (1) There is damping silica gel.
6. a kind of combined type optical branch device manufacturing process, which comprises the following steps:
1) array board cleans: being put into shake in the beaker equipped with cleaning solution and washes, places into the beaker equipped with pure water and clean;
2) optical fiber peeling: the control of peeling length glues alcohol cleaning peeling region in 15 ± 3mm, with dust-free paper;
3) array board arranges optical fiber: being arranged on glass-board surface with tweezers by clean array board is neat, mutual spacing exists 10~15cm;
4) array board dispensing, solidification and aging: the point glue at the horn mouth of array board is inserted into one by one in array board for dispensing glue The optical fiber handled well enters back into oven cooking cycle after solidification;
5) array board optical fiber head is ground: the abrasive disk for installing product being placed in the porcelain ring of grinder and is ground;
6) fiber end inspection: detection end face break angle, scratch and foreign matter, alligatoring, excessive glue, viscose glue, bubble, fiber angle, Light passing, polishing direction and optical fiber presentation quality;
7) array board couples: by array board and the alignment coupling of optical plane waveguide chip;
8) semi-finished product solidification and aging: solidified under the conditions of 40~80 DEG C of temperature, carry out aging under the conditions of 110 ± 5 DEG C of temperature;
9) Insertion Loss, return loss, directionality, polarization loss and the uniformity of semi-finished product semi-finished product Data Detection: are detected;
10) optical fiber connects: optical fiber being penetrated in each blank pipe, fixes optical fiber with adhesive tape;
11) testing package: Insertion Loss, return loss, directionality, polarization loss and the uniformity of finished product are detected, qualified products are wrapped Dress.
7. a kind of combined type optical branch device manufacturing process according to claim 6, which is characterized in that the step 1) packet It includes:
101) it checks the material that will be cleaned and confirms whether clean in cleaning jig;
102) array version to be cleaned is sandwiched into cleaning jig one by one;
103) cleaning jig for installing material is put into shake in the beaker equipped with cleaning solution to wash 10 minutes, is placed into equipped with pure water Beaker in clean 5 minutes;
104) cleaned material is put into clean culture dish together with folder cleaning tool, is put into 85 degree of oven cooking cycles 30 minutes;
105) after toasting, cleaned material is pressed from both sides out one by one in cleaning jig, is put into clean culture dish, then It is put into drying box keeping.
8. a kind of combined type optical branch device manufacturing process according to claim 6, which is characterized in that the step 3) packet It includes:
301) bare optical fiber cleaned up is scattered upward, is sticked on baking rack one by one with 10-15cm spacing;
302) optical fiber coil part is arranged neatly again, is fixed on baking rack foundation with gummed paper;
303) clean array board is arranged on glass-board surface with tweezers, the temperature for controlling heating dish is 40-50 °;
The step 4) includes:
401) the point glue at the horn mouth of array board, the prominent horn mouth of dispensing amount, is stayed in pore to glue;
402) array board for dispensing glue is clamped with tweezers, be inserted on the optical fiber handled well one by one, fiber stripping mouth is inserted into the ruler of taper hole Very little is 0.3~0.8mm;
403) solidify 5 minutes, enter back into 85 degree of oven cooking cycles 2 hours.
9. a kind of combined type optical branch device manufacturing process according to claim 6, which is characterized in that the step 7) packet It includes:
701) it is packed into end array board;
702) it is packed into optical plane waveguide chip;
703) array board and the alignment of optical plane waveguide chip;
704) hot spot is adjusted;
705) dress output end FA and adjustment;
706) to array board and optical plane waveguide chip dispensing;
707) accurate adjustment output end FA after dispensing;
708) array board and optical plane waveguide chip are solidified.
10. a kind of combined type optical branch device manufacturing process according to claim 6, which is characterized in that the step 10) Include:
1001) 0.9mm blank pipe is penetrated in rubber plug, is fixed with Instant cement, blank pipe extension elongation is 2mm, and room temperature does 5 naturally Minute;
1002) point one drips Instant cement at isolated edge 5mm in box body, and semi-finished product are fixed in the above, and room temperature is done 5 minutes naturally Afterwards, point one drips Instant cement at both ends isolated edge 2mm in box body, and rubber plug is pasted, and room temperature is waited to do 5 minutes naturally;
1003) along box body coiled fiber, optical fiber is penetrated in each blank pipe, fixes optical fiber with adhesive tape;
1004) it is smeared with 704 silica gel along the intracorporal product bottom of box and two sides rubber plug bottom, product is sealed.
CN201910472652.8A 2019-05-31 2019-05-31 A kind of combined type optical branch device and manufacturing process Pending CN110082861A (en)

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CN112099142A (en) * 2020-09-21 2020-12-18 四川天邑康和通信股份有限公司 Optical division ratio adjustable optical splitter device based on FBT fusion PLC and production process
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CN113567970A (en) * 2021-07-23 2021-10-29 深圳市国天电子股份有限公司 Radar shell
CN114200579A (en) * 2021-12-20 2022-03-18 四川天邑康和通信股份有限公司 Automatic production method of array waveguide grating
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