CN110082494A - A kind of bonding wire quality determining method - Google Patents
A kind of bonding wire quality determining method Download PDFInfo
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- CN110082494A CN110082494A CN201910369085.3A CN201910369085A CN110082494A CN 110082494 A CN110082494 A CN 110082494A CN 201910369085 A CN201910369085 A CN 201910369085A CN 110082494 A CN110082494 A CN 110082494A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/08—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/60—Investigating resistance of materials, e.g. refractory materials, to rapid heat changes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/20—Metals
- G01N33/207—Welded or soldered joints; Solderability
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0014—Type of force applied
- G01N2203/0016—Tensile or compressive
- G01N2203/0017—Tensile
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0058—Kind of property studied
- G01N2203/006—Crack, flaws, fracture or rupture
- G01N2203/0067—Fracture or rupture
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/026—Specifications of the specimen
- G01N2203/0262—Shape of the specimen
- G01N2203/0278—Thin specimens
- G01N2203/028—One dimensional, e.g. filaments, wires, ropes or cables
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- Wire Bonding (AREA)
Abstract
The present invention relates to a kind of bonding wire quality determining methods, belong to bonding wire technical field, it is tested including stability test and reliability, by the bank broken string number being bonded to bearing wire rod and the time of shutdown adjustment is needed to detect, tensile test and cooling thermal impact test are carried out to bank, and then control the stability of bonding process, exclude the lower bonding wire of quality, screen the guaranteed bonding wire of mass, and it feeds back into the production of bonding wire, adjustment in time and improvement technique, guarantee bonding wire under mechanical force, extreme environment also has stable working condition.
Description
Technical field
The present invention relates to bonding wire technical fields, and in particular to a kind of bonding wire quality determining method.
Background technique
Semiconductor-sealing-purpose bonding gold wire is one of basic material of Packaging Industry, it decides the developing water of integrated circuit
Flat, alloy wire required for bonding wire needs to have that mechanical strength is good, and balling-up characteristic is good, and zygosity is good, is easy to operation and welding
Characteristic.
As sophisticated semiconductor encapsulation technology enters China's Mainland, to continent, bonding gold wire manufacturer also proposed higher want
Ask, bonding gold wire electrical parameter, intensive parameter, balling-up parameter etc. require it is higher and higher, due to the continuous reduction of packaging size,
Conventional bonding gold wire has had reached its capacity limit, and the performance requirement of this para-linkage silk is also higher and higher, needs diameter
Thinner, the higher bonding wire of intensity.
However, bonding wire diameter more carefully will lead to breakage ratio increase, bonding stability is reduced, and influences the working efficiency of bonding
And production capacity, the reduction of encapsulating products stability is also resulted in, more and more technologies are to improve the manufacturing process of bonding wire, with
The bonding wire more preferably excellent to performance, however, in actual application, in addition to the property of bonding wire itself, the sieve of bonding wire
Choosing and quality control can also significantly improve bonding efficiency and production capacity, so that the quality of encapsulating products is improved, in the prior art, bonding
The back end test technique of silk mainly includes Fracture Force test, and elongation percentage is tested, resistivity measurement and monopolization testing current, however mesh
For the preceding single shaft of bonding wire for packaging on the market length in 500-3000M, existing test method can not be to the stability of bearing line
It is tested and is screened.
Summary of the invention
Therefore, the present invention is low in order to solve prior art bonding technology production capacity, the bad technical problem of bonding rear stability,
Provide a kind of quality determining method of bonding wire.
It is described steady the invention discloses a kind of bonding wire quality determining method, including stability test and reliability test
Qualitative test includes, and is rounded axis material, and the length of the identical bank of weld length, the bank is 2.5mm, and weld interval is
12-15 hours, detection broken string number；Reliability test includes, and the bank is carried out tensile test and by the bank
Cooling thermal impact test is carried out after encapsulation, detects the data concentrations (CPK) of pulling force and the fraction defective of bank encapsulation respectively.
Preferably, further include rupture strength test, elongation percentage test, line after tested, push-pull effort test.
Preferably, it successively follows the steps below:
(4) rupture strength, elongation percentage and the line warp of bonding wire are successively detected；
(5) para-linkage silk carries out stability test；
(6) successively para-linkage silk carries out bank tensile test and cooling thermal impact test.
Preferably, the length of the bearing wire rod is 500-3000 meters.
Preferably, the bank length includes burning line used in ball, corresponding two solder joints of the every bank.
Preferably, ultrasonic wave hot pressing bonding apparatus is used when the bank welds.
Preferably, in the tensile test, the head of the bank described in 25-35pcs, in, tail carry out tensile test respectively
It is tested with thrust, detects the data concentrations CPK of pulling force.
Preferably, reliability test the following steps are included:
Encapsulation: bank described in 100pcs is taken to be packaged to obtain encapsulating products at random；
Cooling thermal impact: acting on 15 minutes the bank of encapsulation with 100 DEG C, -40 DEG C is then cooled in 10 seconds, effect 15
Minute, 100-1000 bout is repeated, the fraction defective of encapsulating products is obtained.
Preferably, the rupture strength and elongation percentage test according to GB/T10573 non-ferrous metal wire stretching test method into
Row detection.
Preferably, line footpath test according to GB/T10577 noble metal and its alloy material set size measurement method into
Row detection.
The invention also discloses a kind of quality determining methods in bonding wire production, the application of application field.
Technical solution of the present invention has the advantages that
1. bonding wire quality determining method of the present invention, including stability test, disconnected to the bank of bearing wire rod bonding
Line number and the time of shutdown adjustment is needed to be detected, and then control the stability of bonding process, excludes the lower key of quality
Plying, and feed back into the production of bonding wire, adjustment in time and improvement technique, to finally reduce shutdown adjustment during bonding
Time, improve the production capacity and working efficiency of bonding；Reliability test of the present invention, including tensile test and cooling thermal impact
Test, the data concentrations for the pulling force that the bank can bear are detected by tensile test, are tested with husband's aunt's cooling thermal impact, with
It is bad judgement bonding wire in extreme high/low temperature change procedure that encapsulating material, which fails as LED lamp bead lacks bright, and resistance is expanded with heat and contract with cold
The ability of fracture screens the guaranteed bonding wire of mass, is used for the job stability after encapsulating products by it, guarantees bonding
Silk is under mechanical force, extreme environment also has stable working condition.
2. bonding wire quality determining method of the present invention further includes rupture strength test, elongation percentage test and line through surveying
Examination, the judgement strength test and extensibility test are tested according to GB/T10573 non-ferrous metal wire stretching test method,
Test result is directly related to the physical property of wire rod, and the line is after tested according to GB/T10577 noble metal and its alloy material
Set size measurement method is tested, and is guaranteed that bonding wire is passed through with uniform line, is maintained the stability of its physical property.
3. bonding wire control method of the present invention is applied to the production and application field of bonding wire, quality can be effectively excluded
Unstable product obtains having preferably bonding production capacity and bonding wire, guarantees that the function of the product prepared using bonding wire is steady
It is qualitative.
Specific embodiment
There is provided following embodiments is to preferably further understand the present invention, it is not limited to the best embodiment party
Formula is not construed as limiting the contents of the present invention and protection scope, anyone under the inspiration of the present invention or by the present invention and its
The feature of his prior art is combined and any and identical or similar product of the present invention for obtaining, all falls within of the invention
Within protection scope.
Specific experiment step or condition person are not specified in embodiment, according to the literature in the art described routine experiment
The operation of step or condition can carry out.Reagents or instruments used without specified manufacturer, being can be by commercially available acquisition
Conventional products.
Embodiment 1
With mass fraction be 80% gold medal (99.99% purity) and mass fraction is 20% silver medal (99.99% purity), by molten
Rough-thin drawing of refining-- ultra-fine drawing-annealing-coiling, it is 23 μm of alloy wires that line, which is made, and passes through, and is once tested.
Rupture strength and elongation percentage test: 10 above-mentioned alloy wire samples that market different batches have been put into are chosen respectively
Product, wherein batch 7-10 is after putting goods on the market, to occur that different degrees of bonding production capacity is low, and encapsulating products stability difference is asked after sale
Topic, the present embodiment are tested according to 10573 non-ferrous metal wire stretching test method of GB/T, are repeated 3 bouts, are averaged
As a result rupture strength and elongation percentage range illustrate that there are quality risks lower than 7.4Cn for mean break strengths as shown in table 1.
The stretch test result of 1 bonding wire sample of table
| Sample batch | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 |
| Mean break strengths (Cn) | 7.8 | 7.8 | 7.6 | 7.4 | 7.8 | 7.8 | 7.2 | 7.2 | 7.0 | 6.8 |
| Elongation percentage range (%) | 5~10 | 5~10 | 5~10 | 5~10 | 5~10 | 5~10 | 5~10 | 4~10 | 5~10 | 4~10 |
Embodiment 2
Line is after tested: according to GB/T15077 noble metal and its alloy material geometric dimension measurement method, choosing implement respectively
The sample of the bonding wire of 10 different batches, is tested described in example 1, obtains the line of bonding wire through floating range, such as 2 institute of table
Show, as a result illustrate, line is through in floating range, the difference of maximum value and minimum value is greater than 0.5 μm, and there are quality risks.
The line of 2 bonding wire sample of table is through floating range test result
| Sample batch | 1 | 2 | 3 | 4 | 5 |
| Line is through floating range (μm) | 22.7-23.2 | 22.8-23.2 | 22.8-23.1 | 22.7-23.1 | 22.9-23.3 |
| Sample batch | 6 | 7 | 8 | 9 | 10 |
| Line is through floating range (μm) | 22.9-23.2 | 22.7-23.3 | 22.5-23.3 | 22.5-23.1 | 22.6-23.4 |
Embodiment 3
Stability test: bearing wire rod (500M/ axis) sample of the bonding wire of 10 different batches described in Example 1 is taken
Product (use the bonding wire of 3000M/ axis) in some embodiments, and using ultrasonic wave hot pressing bonding apparatus, (KS-CONNX high speed is certainly
Dynamic bonding apparatus), identical 200000 banks of weld length, every bank length is 2.5mm, and the bank includes burning ball institute
With line, corresponding two solder joints of the every bank, weld interval is 12-15 hours, detection broken string number and shutdown adjustment time,
As shown in table 3, as a result illustrate, broken string number is greater than 5 times, and there are quality risks for bonding wire of the shutdown adjustment time greater than 30min.
The stability test result of 3 bonding wire sample of table
| Sample batch | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 |
| Break number | 1 | 0 | 2 | 5 | 1 | 3 | 9 | 13 | 11 | 25 |
| The shutdown adjustment time (min) | 10 | 0 | 15 | 25 | 10 | 15 | 50 | 60 | 60 | 120 |
Embodiment 4
Process capability test: choose bank 25pcs, 30pcs and 35pcs, respectively to the head of the bank, in, tail carry out
Tensile test and thrust test, wherein " in " it is highest point among bank, pulling force and thrust needed for bank breaks are detected, and calculate
Data concentrations, thrust standard method reference: EIA/JESD22-B116, pulling force MIL-STD-883G method reference: calculation formula
It is as follows:
CPK:Cpk=Cp (1- | Ca |)
Ca (Capability of Accuracy): process accuracy；
Cp (Capability of Precision): processing procedure precision；
Calculated result is as shown in table 4 below, as a result illustrates, there are quality risks for bonding wire of the GPK less than 1.33.
4 bonding wire sample pulling force of table and thrust range
| Sample batch | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 |
| Thrust CPK (25pcs) | 1.35 | 1.40 | 1.38 | 1.45 | 1.46 | 1.44 | 0.92 | 0.55 | 0.62 | 0.68 |
| Pulling force CPK (25pcs) | 1.56 | 1.42 | 1.48 | 1.38 | 1.48 | 1.55 | 0.85 | 0.65 | 0.54 | 0.65 |
| Thrust CPK (30pcs) | 1.36 | 1.39 | 1.36 | 1.47 | 1.49 | 1.41 | 0.89 | 0.58 | 0.82 | 0.65 |
| Pulling force CPK (30pcs) | 1.54 | 1.43 | 1.49 | 1.35 | 1.43 | 1.54 | 0.91 | 0.69 | 0.74 | 0.63 |
| Thrust CPK (35pcs) | 1.37 | 1.41 | 1.39 | 1.47 | 1.44 | 1.46 | 0.92 | 0.50 | 0.64 | 0.58 |
| Pulling force CPK (35pcs) | 1.52 | 1.41 | 1.47 | 1.39 | 1.48 | 1.45 | 0.88 | 0.75 | 0.64 | 0.69 |
Embodiment 5
Cooling thermal impact test: 100pcs bank described in random Example 3, which is packaged, is made LED light；To packaged
Bank is acted on 15 minutes with 100 DEG C, is then cooled to -40 DEG C in 10 seconds, acts on 15 minutes, so repeatedly 100,200,300,
400,500 bouts (repeating 800 or 1000 bouts in some embodiments), it is bad for not worked with LED light, obtains bank fracture and leads
The fraction defective of cause, as shown in table 5.
The cooling thermal impact test result of 5 bonding wire sample of table
| Sample batch | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 |
| Fraction defective (100 bout) | 0% | 0% | 0% | 0% | 0% | 0% | 0% | 0% | 0% | 0% |
| Fraction defective (200 bout) | 0% | 0% | 0% | 0% | 0% | 0% | 0% | 0% | 0% | 0% |
| Fraction defective (300 bout) | 0% | 0% | 0% | 0% | 0% | 0% | 0% | 0% | 0% | 0% |
| Fraction defective (400 bout) | 0% | 0% | 0% | 0% | 0% | 0% | 5% | 10% | 11% | 8% |
| Fraction defective (500 bout) | 0% | 0% | 0% | 0% | 0% | 0% | 15% | 20% | 30% | 26% |
Embodiment 6
Quality control to non-shipment product: 10 batch samples of non-shipment sample of bonding wire described in selection example 1,
Quality control is carried out to sample with detection method described in embodiment 1-5, test result is as described in Table 6:
The Quality Control results of 6 bonding wire sample of table
By test, it is believed that No. 2 batch samples deposit quality risk in use, are excluded, remaining product is thrown
Do not occur the feedback of quality problems after putting market.
The above embodiments are merely examples for clarifying the description, and does not limit the embodiments.For institute
For the those of ordinary skill in category field, other various forms of variations or change can also be made on the basis of the above description
It is dynamic.There is no necessity and possibility to exhaust all the enbodiments.And obvious variation extended from this or change
It moves still within the protection scope of the invention.
Claims (11)
1. a kind of bonding wire quality determining method, which is characterized in that tested including stability test and reliability, the stability
Test includes being rounded axis material, and the identical bank of weld length, the length of the bank is 2.5mm, weld interval 12-15
Hour, detection broken string number；Reliability test includes, and the bank is carried out tensile test and will be after bank encapsulation
Cooling thermal impact test is carried out, detects the data concentrations (CPK) of pulling force and the fraction defective of bank encapsulation respectively.
2. bonding wire quality determining method according to claim 1, which is characterized in that further include rupture strength test, prolong
Stretch rate test, line after tested, push-pull effort test.
3. bonding wire quality determining method according to claim 2, which is characterized in that successively follow the steps below:
(1) rupture strength, elongation percentage and the line warp of bonding wire are successively detected；
(2) para-linkage silk carries out stability test；
(3) successively para-linkage silk carries out bank tensile test and cooling thermal impact test.
4. bonding wire quality determining method according to claim 1 or 2, which is characterized in that the length of the bearing wire rod
It is 500-3000 meters.
5. bonding wire quality determining method according to claim 1 or 2, which is characterized in that the bank length includes burning
Line used in ball, corresponding two solder joints of the every bank.
6. bonding wire quality determining method according to claim 1-5, which is characterized in that when the bank welds
Using ultrasonic wave hot pressing bonding apparatus.
7. bonding wire quality determining method according to claim 1-6, which is characterized in that in the tensile test
In, the head of the bank described in 25-35pcs, in, tail carry out respectively tensile test and thrust test, detect in the data set of pulling force
Spend CPK.
8. bonding wire quality determining method according to claim 1-7, which is characterized in that the reliability test
The following steps are included:
Encapsulation: bank described in 100pcs is taken to be packaged to obtain encapsulating products at random；
Cooling thermal impact: the bank of encapsulation is acted on 15 minutes with 100 DEG C, -40 DEG C are then cooled in 10 seconds, acts on 15 points
Clock repeats 100-1000 bout, obtains the fraction defective of encapsulating products.
9. bonding wire quality determining method according to claim 2, which is characterized in that the rupture strength and elongation percentage are surveyed
Examination is detected according to GB/T10573 non-ferrous metal wire stretching test method.
10. bonding wire quality determining method according to claim 2, which is characterized in that the line footpath test is according to GB/
T10577 noble metal and its alloy material set size measurement method are detected.
11. a kind of any one of claim 1-10 quality determining method is in bonding wire production, the application of application field.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113702202A (en) * | 2021-07-29 | 2021-11-26 | 贵研铂业股份有限公司 | Method and device for testing tensile property of bonding wire heat affected zone |
| CN118090438A (en) * | 2024-04-26 | 2024-05-28 | 烟台一诺电子材料有限公司 | Bonding wire tensile testing device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113702202A (en) * | 2021-07-29 | 2021-11-26 | 贵研铂业股份有限公司 | Method and device for testing tensile property of bonding wire heat affected zone |
| CN118090438A (en) * | 2024-04-26 | 2024-05-28 | 烟台一诺电子材料有限公司 | Bonding wire tensile testing device |
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