CN110072349B - Device for selective wave soldering of electric energy meter module and using method thereof - Google Patents
Device for selective wave soldering of electric energy meter module and using method thereof Download PDFInfo
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- CN110072349B CN110072349B CN201910456008.1A CN201910456008A CN110072349B CN 110072349 B CN110072349 B CN 110072349B CN 201910456008 A CN201910456008 A CN 201910456008A CN 110072349 B CN110072349 B CN 110072349B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
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- Microelectronics & Electronic Packaging (AREA)
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a device for selective wave soldering of an electric energy meter module and a using method thereof, wherein the device comprises a jig and a die, wherein the jig comprises a bottom plate and a cover plate; the cover plate is covered on the bottom plate, and the bottom plate is fixedly connected with the cover plate through the buckles on the two sides of the bottom plate; the bottom plate is provided with a plurality of positioning frames, spray holes, grooves and patches; a plurality of spring components are detachably arranged on the cover plate; the mould is provided with a plurality of hollow columnar nozzles corresponding to the positions of the nozzles, and the height of each nozzle is 10-50 mm; a temperature sensor is arranged on the die; the mould is fixedly arranged in the tin furnace, and the jig is arranged on the mould. The positioning frame, the groove and the patch are arranged on the jig bottom plate, so that the components are protected, and the components are prevented from being damaged when the wave crest passes; meanwhile, the spring columns on the cover plate press the components, so that the components are prevented from floating high due to the fact that the components are washed by the wave peaks when the wave peaks are crossed; and the temperature monitoring and alarming device is arranged on the die, so that an operator can maintain the device in time and the normal operation of the device is guaranteed.
Description
Technical Field
The invention relates to the technical field of electronic module welding processing, in particular to a device for selective wave soldering of an electric energy meter module and a using method thereof.
Background
Selective wave soldering is also called selective soldering, and equipment applying the PCB plug-in through hole soldering field has a popular trend gradually becoming through hole soldering in the recent PCB through hole soldering field due to different soldering advantages, and the application range is not limited to: and (3) welding the multilayer PCB through holes with high welding requirements and complex process, such as military electronics, space ship electronics, automotive electronics, digital cameras, printers and the like. The selective wave soldering is divided into two off-line selective wave soldering and on-line selective wave soldering: off-line promptly indicates the off-line mode with the production line, and group welding agent flush coater and selective welding machine are split type 1+1, and wherein preheat the module and follow the welding part, manual transmission, man-machine combines, and equipment occupation space is less. On-line selective wave soldering: the online system can receive the full-automatic butt joint of production line data in real time, and the welding agent module preheats the module and welds the module integral type structure, and the characteristics are full-automatic chain transmission, and equipment occupation space is great, are fit for the higher production mode of automation requirement.
The automation degree of the current electronic module processing field is higher and higher, and under the condition of large-batch order operation, the welding function of the common wave soldering equipment can meet the production requirement of the plug-in component which passes through a wave crest PCB on a single side and a double-sided PCB and has the height of a component less than 10 mm; however, for components with a thickness of more than 10mm on a double-sided PCB, such as a liquid crystal display, a pin header, a board header connector and the like, automatic welding cannot be performed by using a common wave crest welder, manual welding is required by personnel, production efficiency is low, labor cost is high, and welding quality consistency is poor. And the design of the sorting type wave soldering worker on the upper part of the existing market lacks flexibility, the welding performance of the product is not considered, the situations of body floating height, deflection and the like occur after the welding of the plug-in component, and the selective welding temperature cannot be monitored and reported in real time, so that the performance of an electronic module is unstable.
Therefore, an equipment tool which can realize automatic wave soldering of components even if the flat wave soldering capability is exceeded needs to be adopted.
Disclosure of Invention
Aiming at the defects, the invention aims to provide a device for selective wave soldering of an electric energy meter module and a using method thereof, wherein the module with components inserted in both sides can also be subjected to selective wave soldering through the protection of a jig bottom plate and a cover plate, and a positioning frame, a groove and a patch are arranged on the jig bottom plate to protect the components which need to be soldered and are fixed, so that the components are prevented from being damaged when passing through wave peaks; setting the height of the upper nozzle of the die to be 10-50 mm, so that the requirement of selective wave soldering of components (with the maximum height of 50mm) with the length of more than 10mm on the double-sided PCB is met; meanwhile, the spring assembly on the cover plate can press the components fixed on the other surface, so that the components are prevented from floating high when passing through the wave crest and cannot be punched by the wave crest, the tightness for pressing the components can be finely adjusted, and the components are prevented from being damaged by stress due to over-tight pressing; and the temperature monitoring and alarming device is arranged on the die, and when the wave soldering temperature exceeds the range, a sound control alarming signal can be automatically sent out, so that an operator can maintain the equipment in time, and the normal operation of the equipment is guaranteed.
In order to achieve the purpose, the technical scheme provided by the invention is as follows:
a device for selective wave soldering of an electric energy meter module comprises a jig and a die, wherein the jig comprises a bottom plate and a cover plate; the cover plate covers the bottom plate, and the bottom plate is fixedly connected with the cover plate through buckles on two sides of the bottom plate; the bottom plate is provided with a plurality of positioning frames, spray holes, grooves and patches; a plurality of spring assemblies are detachably arranged on the cover plate; the mould is provided with a plurality of hollow columnar nozzles corresponding to the positions of the spray holes, and the height of each nozzle is 10-50 mm; a temperature sensor is arranged on the die; the mould is fixedly arranged in a tin furnace, and the jig is arranged on the mould.
The invention adopts a tool jig with mutually combined front and back surfaces, the tool comprises a bottom plate and a cover plate, and the tool jig is mainly used for selective wave soldering of components with the thickness of more than 10mm on a double-sided PCB. The bottom plate is used for protecting components which are required to be mounted on the PCB in selective wave soldering, a plurality of positioning frames, grooves and patches are arranged on the bottom plate according to the size of the template, the sizes and the heights of the positioning frames, the grooves and the patches are matched with the sizes and the heights of the components on the template, spray holes are further formed in the bottom plate according to the positions where the components are required to be soldered, and the positions of the spray holes correspond to the positions of the spray ports on the mold. Therefore, the base plate protects the patch welded on one surface of the double-sided PCB and the flat wave welding connector component, and prevents the patch from falling off or being damaged by heating when wave soldering is selected. And the apron is used for protecting the back of two-sided PCB board, need not carry out the components and parts that have installed on this one side PCB board of selectivity wave-soldering promptly, and the apron lid closes on this template, and the spring unit on the apron can press the components and parts that the cartridge is good evenly hard firmly, avoids the buoyancy of soldering tin wave peak to cause components and parts to be floated high and crooked by the jack-up when the welding, and spring unit has the pressure fine setting function moreover, and protection components and parts can not take place the damage because of pressing too tightly the stress. The welding function of the conventional common wave soldering equipment mainly aims at the plug-in components with the single-side wave-crest PCB and the double-side PCB, the height of the components is lower than 10mm, and the components with the height of more than 10mm on the double-side PCB cannot be automatically soldered by using a common wave soldering machine. The die is provided with a nozzle with a corresponding size according to the jig, the whole nozzle is in a hollow column shape, the height of the nozzle is 10 mm-50 mm, only tin spraying is arranged at the nozzle to weld a point needing to be welded when a wave peak is formed, so that components with the height higher than 10mm on the double-sided PCB can be machined, and the maximum machinable components can reach 50mm in height. A temperature monitoring and alarming device is designed on the die, and when the wave soldering temperature exceeds the range, a sound control alarming signal can be automatically sent out, so that an operator can timely maintain the equipment, and the normal operation of the equipment is guaranteed.
Preferably, the spring assembly comprises an installation rod, a spring and a pressing cap, the spring is sleeved on the installation rod, and the pressing cap is arranged at the top end of the installation rod through threads. The spring assembly is detachably fixed on the cover plate through bolts and nuts, and the position and the number of the spring assembly on the cover plate can be adjusted according to the positions of the components on the template. The position of the pressing cap is finely adjusted through the threads, so that the pressure applied to the components is adjusted, and the components are prevented from being damaged due to the fact that the components are pressed too tightly.
Preferably, the bottom plate is provided with a positioning column, the cover plate is provided with a positioning hole matched with the positioning column, and the positioning column penetrates through the positioning hole for positioning. After a component needing to be subjected to wave soldering is inserted into the template, the template is placed on the bottom plate, the cover plate is changed on the template, and the positioning column on the bottom plate penetrates through the positioning hole in the cover plate to be positioned.
Preferably, the long edges at two sides of the bottom plate are provided with first fixing strips for preventing the bottom plate from deforming. First fixed strip is equipped with on the both sides long limit of bottom plate, and first fixed strip is for preapring for an unfavorable turn of events shape aluminium strip, has good heat-proof quality and prevents the ability of thermal deformation.
Preferably, the long sides of the two sides of the mold are provided with second fixing strips for preventing the mold from deforming. The second fixed strip is equipped with on the both sides long limit of mould, and the second fixed strip is for preapring for an unfavorable turn of events shape aluminium strip, has the effect that prevents the mould thermal deformation.
Preferably, four corners of the die are provided with fixed lock catches, height positioning columns are arranged beside the fixed lock catches, and horizontal adjusting screws are arranged at two ends of the long edge of the die. The die is fixed in the tin furnace through the fixed lock catch; the height between the jig and the die can be adjusted by adjusting the height positioning column on the die; the mould passes through its level of horizontal screw adjustment, makes mould and tool keep the level, avoids leading to the bad phenomenon of welding because of the height is inconsistent.
Preferably, the positioning frame is matched with a PCB board needing to be welded, the size of the groove and the size of the patch are matched with the size of a component on the PCB board needing to be welded, and the positions of the groove and the patch are the same as the positions of the component on the PCB board needing to be welded. The positioning frame arranged on the bottom plate is a positioning frame for grooving according to the appearance of the PCB and is used for positioning components on the PCB. The bottom plate is provided with grooves and patches with different heights according to the positions of the mounted patches and the mounted components, so that the mounted components are protected, the components are prevented from being heated and falling off or damaged when the wave crest is selected, and large-area tin connection caused by the fact that the soldering wave crest enters the mounted components when the soldering wave crest is too high is also prevented.
A method of using a selective wave soldering apparatus for an electric energy meter module, comprising the steps of:
s1: after the components are inserted on the template, the template is placed on the bottom plate, the cover plate is covered on the template, the cover plate is positioned through the positioning columns and the positioning holes, the components are tightly pressed on the PCB through the spring assemblies, and the bottom plate, the template and the cover plate are firmly buckled through the buckles;
s2: positioning according to a baffle plate of wave soldering equipment, integrally placing a positioned jig provided with a template on the die, adjusting the height between the jig and the die through the height positioning column, and adjusting the horizontal adjusting screw to keep the die and the jig horizontal;
s3: and spraying the soldering flux in a point spraying mode to perform selective wave soldering.
The invention has the beneficial effects that:
1. according to the invention, all components on the first surface are protected by arranging the plurality of positioning frames, the grooves and the patches on the bottom plate, and the patches and the flat-wave soldering connector components welded on one surface of the double-sided PCB are protected, so that the components are prevented from falling off or being damaged by heating when wave soldering is selected;
2. according to the invention, the spring assembly is arranged on the cover plate, so that when the cover plate is covered on the template, the inserted components can be pressed firmly by uniform force, the components are prevented from being jacked up, floated and inclined due to buoyancy of a soldering tin wave crest during welding, and the spring assembly has a pressure fine adjustment function, so that the components are protected from being damaged due to stress caused by over-tight pressing;
3. the nozzle on the die is designed into a hollow column shape, the size of the nozzle is correspondingly adjusted according to the jig, and only the nozzle is provided with tin spraying to weld points to be welded during wave crest so as to achieve the function of selective welding; meanwhile, the height of the nozzle is set to be 10 mm-50 mm, so that the component with the height higher than 10mm on the double-sided PCB can be processed, and the maximum processable component can reach 50mm of plug-in component;
4. according to the invention, the temperature sensor is designed on the die, and when the wave soldering temperature exceeds the range, a sound control alarm signal can be automatically sent out, so that an operator can maintain the equipment in time, and the normal operation of the equipment is ensured.
The invention is further described with reference to the following figures and examples.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic view of the construction of the base plate according to the present invention;
FIG. 2 is a schematic view of the structure of the cover plate of the present invention;
FIG. 3 is a schematic view of the structure of the mold of the present invention;
fig. 4 is a schematic view of the structure of the spring assembly of the present invention.
The reference numerals in the drawings are explained below.
The device comprises a bottom plate 1, a buckle 11, a positioning column 12, a positioning hole 13, a first fixing strip 14, a positioning frame 15, a spraying hole 16, a groove 17, a patch 18, a cover plate 2, a spring assembly 21, an installation rod 211, a spring 212, a pressing cap 213, a mold 3, a nozzle 31, a temperature sensor 32, a fixing lock catch 33, a height positioning column 34, a horizontal adjusting screw 35 and a second fixing strip 36.
Detailed Description
In order to explain technical contents, structural features, and objects and effects of the present invention in detail, the following detailed description is given with reference to the accompanying drawings in conjunction with the embodiments.
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention. In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
Referring to fig. 1, fig. 2, fig. 3 and fig. 4, a device for selective wave soldering of an electric energy meter module includes a fixture and a mold 3, wherein the fixture includes a bottom plate 1 and a cover plate 2; the cover plate 2 covers the bottom plate 1, and the bottom plate 1 is fixedly connected with the cover plate 2 through the buckles 11 on the two sides of the bottom plate; the bottom plate 1 is provided with a plurality of positioning frames 15, spray holes 16, grooves 17 and patches 18; a plurality of spring assemblies 21 are detachably arranged on the cover plate 2; a plurality of hollow columnar nozzles 31 corresponding to the positions of the spray holes 16 are arranged on the die 3, and the height of each nozzle 31 is 10-50 mm; a temperature sensor 32 is arranged on the die 3; the die 3 is fixedly arranged in a tin furnace, and the jig is arranged on the die 3.
The long sides of the two sides of the bottom plate 1 are provided with first fixing strips 14 for preventing the bottom plate 1 from deforming. The long sides of the mold 3 are provided with second fixing strips 36 for preventing the mold 3 from deforming. The positioning frame is matched with the PCB which needs to be welded, the sizes of the groove and the patch are matched with the sizes of the components on the PCB which needs to be welded, and the positions of the groove and the patch are the same as the positions of the components on the PCB which needs to be welded.
In this embodiment, the positioning frame formed on the bottom plate is a positioning frame that is grooved according to the shape of the PCB and is used for positioning components on the PCB, the bottom plate is provided with slots and patches of different heights according to the positions of the mounted patches and the components, the sizes and heights of the positioning frame, the slots and the patches are matched with the sizes and heights of the components on the template, and the positioning frame is not limited to the specific implementation modes given in the embodiment and the drawings in practical use.
The use method of the invention comprises the following steps:
s1: after a component is inserted into the template, the template is placed on the bottom plate 1, the cover plate 2 is covered on the template, the cover plate 2 is positioned through the positioning columns 12 and the positioning holes 13, the component is tightly pressed on the PCB through the spring assemblies 21, and the bottom plate 1, the template and the cover plate 2 are firmly buckled through the buckles 11;
s2: positioning according to a baffle plate of wave soldering equipment, integrally placing a positioned jig provided with a template on the die 3, adjusting the height between the jig and the die 3 through the height positioning column 34, and adjusting the horizontal adjusting screw 33 to keep the die 3 horizontal to the jig;
s3: and spraying the soldering flux in a point spraying mode to perform selective wave soldering.
Variations and modifications to the above-described embodiments may occur to those skilled in the art, which fall within the scope and spirit of the above description. Therefore, the present invention is not limited to the specific embodiments disclosed and described above, and some modifications and variations of the present invention should fall within the scope of the claims of the present invention. In addition, although specific terms are employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation, the use of the term being generic or similar to other means being encompassed by the invention.
Claims (7)
1. The utility model provides a device for selective wave-soldering of electric energy meter module, includes tool and mould (3), its characterized in that: the jig comprises a bottom plate (1) and a cover plate (2); the cover plate (2) covers the bottom plate (1), and the bottom plate (1) is fixedly connected with the cover plate (2) through buckles (11) on two sides of the bottom plate; the bottom plate (1) is provided with a plurality of positioning frames (15), spray holes (16), grooves (17) and patches (18); a plurality of spring assemblies (21) are detachably arranged on the cover plate (2); a plurality of hollow columnar nozzles (31) corresponding to the positions of the spray holes (16) are arranged on the die (3), and the height of each nozzle (31) is 10-50 mm; a temperature sensor (32) is arranged on the die (3); the mold (3) is fixedly arranged in a tin furnace, the jig is arranged on the mold (3), the positioning frame is matched with a PCB (printed circuit board) needing to be subjected to welding operation, the sizes of the groove and the patch are matched with the sizes of components on the PCB needing to be subjected to welding operation, and the positions of the groove and the patch are the same as the positions of the components on the PCB needing to be subjected to welding operation.
2. An apparatus for selective wave soldering of electric energy meter modules according to claim 1, characterized in that: spring unit (21) is including installation pole (211), spring (212) and pressure cap (213), spring (212) cover is established on installation pole (211), press cap (213) to install through the screw thread the top of installation pole (211).
3. An apparatus for selective wave soldering of electric energy meter modules according to claim 2, characterized in that: the bottom plate (1) is provided with a positioning column (12), the cover plate (2) is provided with a positioning hole (13) matched with the positioning column (12), and the positioning column (12) penetrates through the positioning hole (13) to be positioned.
4. An apparatus for selective wave soldering of electric energy meter modules according to claim 3, characterized in that: the four corners department of mould (3) is equipped with fixed hasp (33), fixed hasp (33) are other to be equipped with high reference column (34), the both ends on mould (3) long limit are equipped with horizontal adjusting screw (35).
5. An apparatus for selective wave soldering of electric energy meter modules according to claim 4, characterized in that: the long edges at two sides of the bottom plate (1) are provided with first fixing strips (14) for preventing the bottom plate (1) from deforming.
6. An apparatus for selective wave soldering of electric energy meter modules according to claim 5, characterized in that: and the long sides of the two sides of the die (3) are provided with second fixing strips (36) for preventing the die (3) from deforming.
7. Use of a device for selective wave soldering of electric energy meter modules according to claim 6, characterized in that: the method comprises the following steps: s1: after a component is inserted on the template, the template is placed on the bottom plate (1), the cover plate (2) is covered on the template, the cover plate (2) is positioned through the positioning columns (12) and the positioning holes (13), the component is tightly pressed on the PCB through the spring assembly (21), and the bottom plate (1), the template and the cover plate (2) are firmly buckled through the buckles (11); s2: positioning according to a baffle plate of wave soldering equipment, integrally placing a positioned jig provided with a template on the die (3), adjusting the height between the jig and the die (3) through the height positioning column (34), and adjusting the horizontal adjusting screw (35) to keep the die (3) and the jig horizontal; s3: and spraying the soldering flux in a point spraying mode to perform selective wave soldering.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910456008.1A CN110072349B (en) | 2019-05-29 | 2019-05-29 | Device for selective wave soldering of electric energy meter module and using method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910456008.1A CN110072349B (en) | 2019-05-29 | 2019-05-29 | Device for selective wave soldering of electric energy meter module and using method thereof |
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| CN110072349A CN110072349A (en) | 2019-07-30 |
| CN110072349B true CN110072349B (en) | 2020-10-20 |
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| CN110606275B (en) * | 2019-08-27 | 2021-04-27 | 烽火通信科技股份有限公司 | Protection layout method and structure for welding surface of machine disc |
| CN111085748A (en) * | 2019-12-25 | 2020-05-01 | 昆山明创电子科技有限公司 | Workpiece-hitting and furnace-passing jig |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5617990A (en) * | 1995-07-03 | 1997-04-08 | Micron Electronics, Inc. | Shield and method for selective wave soldering |
| CN2624585Y (en) * | 2003-05-15 | 2004-07-07 | 鸿富锦精密工业（深圳）有限公司 | Universal carrier |
| CN103934537B (en) * | 2014-03-24 | 2016-05-25 | 广东美的集团芜湖制冷设备有限公司 | Plug-in unit welding procedure and welding carrier on a kind of pcb board |
| CN204711363U (en) * | 2015-04-24 | 2015-10-21 | 深圳极智联合科技股份有限公司 | Wave soldering tool and welding structure |
| CN107866619A (en) * | 2016-09-26 | 2018-04-03 | 新昌县东茗乡德创机械厂 | Crest welder running limp speed preheating coordinates accessory part |
| CN206251449U (en) * | 2016-12-12 | 2017-06-13 | 腾捷（厦门）电子有限公司 | Circuit board tool with elastic component |
| CN206596292U (en) * | 2017-03-16 | 2017-10-27 | 惠州欣耀精密部件有限公司 | A kind of wave-soldering product supporting carrier |
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