CN110072346B - Gold plating method for key sheet - Google Patents
Gold plating method for key sheet Download PDFInfo
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- CN110072346B CN110072346B CN201910394990.4A CN201910394990A CN110072346B CN 110072346 B CN110072346 B CN 110072346B CN 201910394990 A CN201910394990 A CN 201910394990A CN 110072346 B CN110072346 B CN 110072346B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
Abstract
The invention relates to a gold plating method for a key sheet, which is suitable for the key sheet with the thickness of less than 0.5mm of a single sheet, and comprises the following steps: selecting two key sheets meeting the requirements; step two, laminating treatment: aligning and pasting one surfaces, without key bonding pads, of the two key sheets selected in the first step back to back, wherein the overall thickness of the two pasted sheets is not less than 0.5 mm; and thirdly, plating gold on the whole laminated plate by adopting a thin plate gold plating method, and plating gold on the key surfaces of the two thin plates with the key bonding pads in the whole plate at the same time. The gold plating method for the key sheet has the advantages of simplicity, practicability, low production cost, high gold plating efficiency, wider application range of the sheet, suitability for batch popularization and the like.
Description
Technical Field
The invention relates to the technical field of gold plating of a key sheet with a key pad, in particular to a gold plating method of the key sheet.
Background
In some high-end electronic products, such as automobile central control panels, super books and the like, the P key position needs to adopt a gold plating process to enhance the wear-resisting effect. In order to prevent the migration of copper ions to the gold layer, nickel is plated before gold plating, and the influence of the potential difference of current during electroplating on the thickness of nickel is large, and if the design of an electroplating lead is not proper, a large potential difference is generated, so that the problems of uneven nickel thickness or over-specification nickel thickness and the like are caused. At present, the P-corresponding key pad used by the touch key panel has four common surface treatment methods and characteristics as follows:
① carbon oil has simple process, low cost, easy abrasion, and suitability for use in low-cost electronic devices with long service life;
② Nickel plating, which has relatively simple process, relatively low price, long service life, easy oxidation, and large resistance change, and is suitable for relatively low price;
③ immersion gold, which has high price, abrasion resistance and good performance, the whole pad, including the side surface, can be plated with nickel gold, can be used in various occasions, but the adhesion force is not as good as gold plating, and is easy to fall off after being used for a period of time;
④ the gold plating process has one more step than nickel plating, is very wear-resistant and high in price, and is often applied to high-end products or products with higher safety performance requirements, such as automobile electronic product keys like automobile central control panels.
Among the four surface treatment methods, gold plating is currently the most commonly used surface treatment method. The traditional gold-plated key board can not be plated with lead wires from the board edge like gold-plated fingers because the key pad is generally designed in the middle of the board. The traditional key board gold plating process comprises the following steps: cutting → drilling → copper plate plating → circuit pattern → pattern plating (copper plating + gold plating) → etching → solder mask → character → molding → test → FQ → packaging.
Because the key pad of the key board is generally designed on one surface of the board, the design that keys are arranged on two surfaces of the board is rare, and the nickel-gold plating can be conducted from the back surface of the keys through the through holes in order to prevent potential difference generated by improper design of an electroplating lead during gold plating. However, when the plate having a thickness of 0.5mm or less is plated with gold, the plate is likely to be jammed and discarded. Therefore, the surface treatment methods are mainly suitable for gold plating of key sheets with the thickness of more than 0.5 mm.
Disclosure of Invention
In order to solve the technical problems, the invention provides the gold plating method of the key sheet, which is simple and practical, low in production cost, high in gold plating efficiency, wider in sheet application range and suitable for batch popularization.
In order to achieve the above purpose, the following technical solutions are provided.
As one of the preferable aspects of the present invention, a gold plating method for a key sheet, which is a gold plating method suitable for a key sheet having a thickness of 0.2mm < T <0.5mm for a single sheet, comprises the steps of,
step one, selecting a key sheet: selecting two key sheets meeting the requirements, wherein the surface of the key sheet, which is provided with the key pad, is a key surface, and the surface without the key pad is a key back surface;
secondly, designing the edges of the electroplated plate: the electroplating plate edges are designed to be conductive holes respectively formed in the edges of the two key sheet plates;
step three, attaching treatment: aligning and pasting one surfaces, without key bonding pads, of the two key thin plates selected in the first step back to back, wherein the overall thickness of the two pasted plates is not less than 0.5mm, gluing the edges of the two thin plates after pasting, sealing the edges of the plates by using a high-temperature adhesive tape, sealing only three edges of the plates by gluing, and reserving one edge with a narrower size as an electroplating conductive clamping plate for conducting current;
fourthly, whole plate gold plating treatment: and (2) gold plating is carried out on the whole laminated plate by adopting a conventional plate gold plating method, gold plating treatment is carried out on the key surfaces of the two thin plates with the key bonding pads in the whole plate at the same time, and the conventional circuit etching and dry film manufacturing procedures are also included before the gold plating treatment, and after the circuit etching is finished, the width of the copper foil at the position of the electroplating conductive clamping plate must be ensured to be more than 6mm so as to ensure that a good conduction effect is achieved. When the dry film is manufactured, a minimum copper exposing area with the width of 8mm is required to be arranged on the periphery of the plate edge of the back surface of the thin plate key so as to ensure that the two thin plates can conduct electricity after being attached.
Further, because of the key pad mostly all has to switch on the button back through the via hole, the button back must have the electric current to pass through, after guaranteeing two sheet metals laminating, the button back of two sheet metals all has the electric current to pass through, and above-mentioned electroplate the design of flange is for respectively at two electrically conductive holes of button sheet metal flange designs, specifically, electrically conductive hole is located between board outer contour line and the figure district contour line, the region is the copper skin region between board outer contour line and the figure district contour line, and copper skin region all around respectively has a set of electrically conductive punch combination of 4 at least hole formations. The number of the conductive holes in each group of conductive hole groups is 4-10. The diameter of the conductive holes is 0.5 mm-2.0 mm, and the distance between two adjacent conductive holes in each group of conductive holes is more than 0.3 mm. The straight line distance between the inner side hole edge of the conductive hole and the outline of the graph area is at least 3mm, and the straight line distance between the outer side hole edge of the conductive hole and the outline of the board is at least 5 mm.
The gold plating method of the key sheet is suitable for gold plating treatment of the key sheet with the thickness of a single sheet of 0.2mm < T <0.5mm, adopts a mode of pasting two sheets together to increase the thickness of the whole sheet, enables the thickness of the whole sheet to be more than 0.5mm, meets the requirements of the existing gold plating equipment, and adopts the technical scheme of carrying out gold plating treatment on the whole sheet by the existing gold plating equipment. The whole technical scheme is that two sheets are selected to be pasted together back to form a whole, and then the whole is subjected to gold plating treatment by adopting the existing gold plating equipment, and the method is ingenious in conception, simple and practical; in the production process, the process is simple and easy to operate, the production cost is not additionally increased, and meanwhile, the effective utilization of the thin plate is facilitated, so that the problem that the clamping plate is scrapped due to the gold plating of the thin plate is effectively avoided, and the production cost is saved; the two sheets are pasted together back to form an integral plate structure and then plated with gold, so that the gold plating treatment of the key panel of the two sheets can be completed at one time, the production efficiency is high, and is 2 times of the gold plating production efficiency of the sheet with the thickness of more than 0.5mm relative to the thickness of the single plate; this kind of with two sheets back to back laminating form whole back again whole mode of carrying out gilding after whole, simple and practical, suitable popularization in batches.
As another preferred embodiment of the present invention, a gold plating method for a key sheet, the method is a gold plating method suitable for a key sheet with a single plate thickness of less than or equal to 0.2mm, and adds a step on the basis of the above method to implement gold plating treatment for a key sheet with a single plate thickness of less than or equal to 0.2mm, and specifically includes the following steps,
step one, selecting a key sheet: selecting two key sheets meeting the requirements, wherein the surface of the key sheet, which is provided with the key pad, is a key surface, and the surface without the key pad is a key back surface;
secondly, designing the edges of the electroplated plate: the electroplating plate edges are designed to be conductive holes respectively formed in the edges of the two key sheet plates;
thirdly, manufacturing an FR4 copper conductive plate: selecting an FR4 board with the thickness of more than 0.2mm, and carrying out copper deposition electroplating on the FR4 board according to a conventional copper deposition electroplating process, so that copper layers are coated on two surfaces of the FR4 board to form an FR4 copper-clad plate, even if the two surfaces of the FR4 board are both copper conductive surfaces;
step four, laminating treatment: respectively attaching one surface, without the key bonding pad, of the two key thin plates selected in the first step to copper conductive surfaces on two surfaces of an FR4 plate, wherein the overall thickness of the two attached plates and the FR4 plate is not less than 0.5 mm; the method comprises the following steps of (1) carrying out plate edge sealing adhesive treatment after two thin plates are attached to copper conductive surfaces on two sides of an FR4 plate, wherein the plate edge sealing adhesive treatment adopts a high-temperature adhesive tape for edge sealing, only three edges are sealed in the plate edge sealing adhesive treatment, and one edge with a narrow plate size is reserved for being used as an electroplating conductive clamping plate for conducting current;
fifthly, whole plate gold plating treatment: and (2) gold plating is carried out on the whole laminated plate by adopting a conventional plate gold plating method, gold plating treatment is carried out on the key surfaces of the two thin plates with the key bonding pads in the whole plate at the same time, and the conventional circuit etching and dry film manufacturing procedures are also included before the gold plating treatment, and after the circuit etching is finished, the width of the copper foil at the position of the electroplating conductive clamping plate must be ensured to be more than 6mm so as to ensure that a good conduction effect is achieved. When the dry film is manufactured, a minimum copper exposing area with the width of 8mm is required to be arranged on the periphery of the plate edge of the back surface of the thin plate key so as to ensure that the two thin plates can conduct electricity after being attached.
Further, because of the key pad mostly all has to switch on the button back through the via hole, the button back must have the electric current to pass through, after guaranteeing two sheet metals laminating, the button back of two sheet metals all has the electric current to pass through, and above-mentioned electroplate the design of flange is for respectively at two electrically conductive holes of button sheet metal flange designs, specifically, electrically conductive hole is located between board outer contour line and the figure district contour line, the region is the copper skin region between board outer contour line and the figure district contour line, and copper skin region all around respectively has a set of electrically conductive punch combination of 4 at least hole formations. The number of the conductive holes in each group of conductive hole groups is 4-10. The diameter of the conductive holes is 0.5 mm-2.0 mm, and the distance between two adjacent conductive holes in each group of conductive holes is more than 0.3 mm. The straight line distance between the inner side hole edge of the conductive hole and the outline of the graph area is at least 3mm, and the straight line distance between the outer side hole edge of the conductive hole and the outline of the board is at least 5 mm.
The gold plating method of the key sheet is suitable for gold plating treatment of the key sheet with the thickness of a single sheet less than or equal to 0.2mm, the back surfaces of the two sheets are respectively attached to the two copper conductive surfaces of the FR4 board, the overall thickness of the attached two sheets and the FR4 board is more than 0.5mm, the requirement of the existing gold plating equipment is met in a mode of increasing the thickness of the whole board, and the technical scheme of performing gold plating treatment on the whole board by adopting the existing gold plating equipment is adopted. The whole technical scheme is that two sheets are selected to be attached to two copper conductive surfaces of an FR4 board back to form a whole, and then the whole is subjected to gold plating treatment by adopting the existing gold plating equipment, and the method is ingenious in conception, simple and practical; in the production process, the process is simple and easy to operate, the production cost is not additionally increased, and meanwhile, the effective utilization of the thin plate is facilitated, so that the problem that the clamping plate is scrapped due to the gold plating of the thin plate is effectively avoided, and the production cost is saved; the two thin plates are attached to the copper conductive surfaces on the two sides of the FR4 plate back to form a whole plate structure, and then gold plating is carried out, so that the gold plating treatment of the key panel of the two thin plates can be completed at one time, the production efficiency is high, and the production efficiency is 2 times of that of the gold plating of the thin plate with the thickness of more than 0.5mm relative to the single plate; the way of attaching the two thin plates back to back on the two copper conductive surfaces of the FR4 plate to form a whole and then carrying out gold plating treatment on the whole is simple and practical and is suitable for batch popularization; the mode that the FR4 plate is additionally arranged in the middle and the two thin plates are attached to the FR4 plate back to back respectively enables the application and application range of the existing thin plate gold plating equipment and gold plating process to be wider, and the method is suitable for gold plating treatment of thin plates with the thickness of 0.2 mm.
Compared with the prior art, the gold plating method of the key sheet has the following beneficial effects:
the key sheet gold-plating method has the advantages that the first, simple and practical technical scheme is that two sheets are selected to be pasted together back to back, or are pasted on two copper conductive surfaces of an FR4 board back to form a whole, and then the whole is subjected to gold-plating treatment by adopting the existing gold-plating equipment, and the method is ingenious in conception, simple and practical;
secondly, the production cost is low, the gold plating method for the key sheet has simple process and easy operation in the production process, does not increase the production cost additionally, is beneficial to effectively utilizing the sheet, further effectively avoids the problem that the clamping plate is scrapped due to the gold plating of the sheet, and saves the production cost;
thirdly, the gold plating efficiency is high, the gold plating method of the key sheet adopts two sheets of sheets to be attached back to form a whole plate structure, and then gold plating is carried out, so that the gold plating treatment of the key panel of the two sheets can be completed at one time, the production efficiency is high, and is 2 times of the gold plating production efficiency of the sheet with the thickness of more than 0.5mm relative to the thickness of a single plate;
fourthly, the thin plate has wider application range, and the gold plating method of the key thin plate adopts the mode of additionally arranging the FR4 plate in the middle and respectively attaching the two thin plates back to back on the FR4 plate, so that the application and application range of the existing thin plate gold plating equipment and gold plating process are wider, and the method is suitable for gold plating treatment of the thin plate with the thickness of 0.2 mm;
and fifthly, the method is suitable for batch popularization, and the method for gold plating of the key sheet has the advantages that two sheets are pasted together back to form a whole, and then the whole gold plating treatment is carried out, so that the method is simple and practical, and is suitable for batch popularization.
Drawings
FIG. 1 is a schematic plan view of a key sheet according to the gold plating method for the key sheet of the present invention;
FIG. 2 is a schematic side view of a key sheet according to an embodiment 1 of the gold plating method of the present invention;
fig. 3 is a schematic side view of a gold plating method for a key sheet according to embodiment 2 of the present invention.
Detailed Description
In the description of the present invention, it is to be understood that terms such as "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, which indicate orientations or positional relationships, are used based on the orientations or positional relationships shown in the drawings only for the convenience of describing the present invention and for the simplicity of description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
The gold plating method for the key sheet according to the present invention will be described in further detail with reference to the following embodiments and the accompanying drawings.
Example 1
As shown in fig. 1 and 2, a gold plating method for a key sheet having a single sheet thickness of 0.2mm < T <0.5mm, includes the steps of,
step one, selecting a key sheet: selecting a key sheet A and a key sheet B which meet requirements, wherein the key sheet A and the key sheet B are both provided with a key pad, and the surface without the key pad is a key surface;
secondly, designing the edges of the electroplated plate: the electroplating plate edge is designed to be provided with conductive holes D respectively at the plate edges of the key sheet A and the key sheet B;
step three, attaching treatment: aligning and attaching one side, without the key bonding pad, of the key sheet A and one side, without the key bonding pad, of the key sheet B selected in the first step together, wherein the overall thickness of the two attached plates is not less than 0.5mm, performing plate edge sealing treatment after the key sheet A and the key sheet B are attached, wherein the plate edge sealing treatment is performed by adopting a high-temperature adhesive tape, only three edges of the plate are sealed by the plate edge sealing treatment, and one side with a narrow plate size is reserved to be used as an electroplating conductive clamping plate for conducting current;
fourthly, whole plate gold plating treatment: and (2) gold plating is carried out on the whole laminated plate by adopting a conventional plate gold plating method, gold plating treatment is carried out on the key surface A1 with the key pad of the key plate A and the key surface B1 with the key pad of the key plate B in the whole plate at the same time, the conventional circuit etching and dry film manufacturing procedures are also included before the gold plating treatment, and after the circuit etching is finished, the width of the copper foil at the position of the electroplating conductive clamping plate must be ensured to be more than 6mm so as to ensure that a good conduction effect is achieved. When the dry film is manufactured, a minimum copper exposing area with the width of 8mm is required to be arranged on the periphery of the plate edge of the back surface of the thin plate key so as to ensure that the two thin plates can conduct electricity after being attached.
As shown in fig. 1 and 2, because of the key pad mostly all has to switch on the button back through the via hole, the button back must have the electric current to pass through, after guaranteeing two sheets of laminates, the button back of two sheets of sheets all has the electric current to pass through, and above-mentioned electroplate the design of flange is for respectively at two buttons of sheet flange design electrically conductive holes, specifically, electrically conductive hole is located between board outer contour line E and the figure district contour line F, the region is the copper skin region between board outer contour line E and the figure district contour line F, and copper skin region all around respectively has a set of electrically conductive punch combination of 4 at least hole formations. The number of the conductive holes in each group of conductive hole groups is 4-10. The diameter of the conductive holes is 0.5 mm-2.0 mm, and the distance between two adjacent conductive holes in each group of conductive holes is more than 0.3 mm. The straight line distance between the inner side hole edge of the conductive hole and the outline of the graph area is at least 3mm, and the straight line distance between the outer side hole edge of the conductive hole and the outline of the board is at least 5 mm.
With reference to fig. 1 and 2, the gold plating method for the key sheet of the present invention is suitable for gold plating of a key sheet with a thickness of 0.2mm < T <0.5mm, and adopts a technical scheme of attaching two sheets together to increase the thickness of the whole key sheet, so that the thickness of the whole key sheet is more than 0.5mm, thereby meeting the requirements of the existing gold plating equipment, and performing gold plating on the whole key sheet by using the existing gold plating equipment. The whole technical scheme is that two sheets are selected to be pasted together back to form a whole, and then the whole is subjected to gold plating treatment by adopting the existing gold plating equipment, and the method is ingenious in conception, simple and practical; in the production process, the process is simple and easy to operate, the production cost is not additionally increased, and meanwhile, the effective utilization of the thin plate is facilitated, so that the problem that the clamping plate is scrapped due to the gold plating of the thin plate is effectively avoided, and the production cost is saved; the two sheets are pasted together back to form an integral plate structure and then plated with gold, so that the gold plating treatment of the key panel of the two sheets can be completed at one time, the production efficiency is high, and is 2 times of the gold plating production efficiency of the sheet with the thickness of more than 0.5mm relative to the thickness of the single plate; this kind of with two sheets back to back laminating form whole back again whole mode of carrying out gilding after whole, simple and practical, suitable popularization in batches.
Example 2
Referring to fig. 1 and 3, a gold plating method for a key sheet with a thickness of less than or equal to 0.2mm on a monolithic plate is added with a step on the basis of the method of embodiment 1 to realize a gold plating process for a key sheet with a thickness of less than or equal to 0.2mm on a monolithic plate, and specifically includes the following steps,
step one, selecting a key sheet: selecting a key sheet A and a key sheet B which meet requirements, wherein the key sheet A and the key sheet B are both provided with a key pad, and the surface without the key pad is a key surface;
secondly, designing the edges of the electroplated plate: the electroplating plate edge is designed to be provided with conductive holes D respectively at the plate edges of the key sheet A and the key sheet B;
thirdly, manufacturing an FR4 copper conductive plate: selecting an FR4 board C with the thickness of more than 0.2mm, and carrying out copper deposition electroplating on the FR4 board C according to a conventional copper deposition electroplating process, so that copper layers are coated on two sides of the FR4 board C to form an FR4 copper-clad plate, even if two sides of the FR4 board C are copper conductive surfaces;
step four, laminating treatment: respectively attaching one surface, without the key bonding pad, of the key sheet A and the key sheet B selected in the first step to two copper conductive surfaces of an FR4 board, wherein the overall thickness of the two attached boards and the FR4 board is not less than 0.5 mm; the key sheet A and the key sheet B are respectively attached to copper conductive surfaces on two sides of an FR4 board and then subjected to board edge sealing glue treatment, the board edge sealing glue treatment is carried out by adopting a high-temperature adhesive tape for edge sealing, only three edges of the board are sealed by glue treatment, and one edge with a narrow size is reserved to be used as an electroplating conductive clamping plate for conducting current;
fifthly, whole plate gold plating treatment: and (2) gold plating is carried out on the whole laminated plate by adopting a conventional plate gold plating method, gold plating treatment is carried out on the key surfaces of the two thin plates with the key bonding pads in the whole plate at the same time, and the conventional circuit etching and dry film manufacturing procedures are also included before the gold plating treatment, and after the circuit etching is finished, the width of the copper foil at the position of the electroplating conductive clamping plate must be ensured to be more than 6mm so as to ensure that a good conduction effect is achieved. When the dry film is manufactured, a minimum copper exposing area with the width of 8mm is required to be arranged on the periphery of the plate edge of the back surface of the thin plate key so as to ensure that the two thin plates can conduct electricity after being attached.
As shown in fig. 1 and 3, because of the key pad mostly all has to switch on the button back through the via hole, the button back must have the electric current to pass through, after guaranteeing two sheets of laminates, the button back of two sheets of sheets all has the electric current to pass through, and above-mentioned electroplate the design of flange is for respectively at two buttons of sheet flange design electrically conductive holes, specifically, electrically conductive hole is located between board outer contour line E and the figure district contour line F, the region is the copper skin region between board outer contour line E and the figure district contour line F, and copper skin region all around respectively has a set of electrically conductive punch combination of 4 at least hole formations. The number of the conductive holes in each group of conductive hole groups is 4-10. The diameter of the conductive holes is 0.5 mm-2.0 mm, and the distance between two adjacent conductive holes in each group of conductive holes is more than 0.3 mm. The straight line distance between the inner side hole edge of the conductive hole and the outline of the graph area is at least 3mm, and the straight line distance between the outer side hole edge of the conductive hole and the outline of the board is at least 5 mm.
With reference to fig. 1 and 3, the gold plating method for the key sheet of the present invention is suitable for gold plating of a key sheet with a thickness of a single sheet less than or equal to 0.2mm, and the back surfaces of two sheets are respectively attached to two copper conductive surfaces of an FR4 plate, and the overall thickness of the attached two sheets and the FR4 plate is more than 0.5mm, so as to increase the overall thickness of the plate, meet the requirements of the existing gold plating equipment, and adopt the existing gold plating equipment to perform gold plating on the entire plate. The whole technical scheme is that two sheets are selected to be attached to two copper conductive surfaces of an FR4 board back to form a whole, and then the whole is subjected to gold plating treatment by adopting the existing gold plating equipment, and the method is ingenious in conception, simple and practical; in the production process, the process is simple and easy to operate, the production cost is not additionally increased, and meanwhile, the effective utilization of the thin plate is facilitated, so that the problem that the clamping plate is scrapped due to the gold plating of the thin plate is effectively avoided, and the production cost is saved; the two thin plates are attached to the copper conductive surfaces on the two sides of the FR4 plate back to form a whole plate structure, and then gold plating is carried out, so that the gold plating treatment of the key panel of the two thin plates can be completed at one time, the production efficiency is high, and the production efficiency is 2 times of that of the gold plating of the thin plate with the thickness of more than 0.5mm relative to the single plate; the way of attaching the two thin plates back to back on the two copper conductive surfaces of the FR4 plate to form a whole and then carrying out gold plating treatment on the whole is simple and practical and is suitable for batch popularization; the mode that the FR4 plate is additionally arranged in the middle and the two thin plates are attached to the FR4 plate back to back respectively enables the application and application range of the existing thin plate gold plating equipment and gold plating process to be wider, and the method is suitable for gold plating treatment of thin plates with the thickness of 0.2 mm.
The above embodiments are only specific embodiments of the present invention, and the description thereof is specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications are possible without departing from the inventive concept, and such obvious alternatives fall within the scope of the invention.
Claims (8)
1. A gold plating method for a key sheet, characterized in that the method is a gold plating method for a key sheet having a thickness of 0.2mm < T <0.5mm for a single sheet, comprising the steps of,
step one, selecting a key sheet: selecting two key sheets meeting the requirements;
secondly, designing the edges of the electroplated plate: the electroplating plate edges are designed to be conductive holes respectively formed in the edges of the two key sheet plates;
step three, attaching treatment: aligning and pasting one surfaces, without key bonding pads, of the two key sheets selected in the first step back to back, wherein the overall thickness of the two pasted sheets is not less than 0.5 mm;
fourthly, whole plate gold plating treatment: and (3) gold plating is carried out on the whole laminated plate by adopting a conventional thin plate gold plating method, and gold plating treatment is carried out on the key surfaces of the two thin plates with the key bonding pads in the whole plate at the same time.
2. The method for plating gold on a key sheet according to claim 1, wherein the bonding step further comprises sealing the edges of the bonded sheet.
3. The method for gold-plating of a key sheet according to claim 2, wherein the plate edge sealing treatment is performed by using a high temperature adhesive tape, only three edges of the plate edge sealing treatment are sealed, and one edge with a narrower plate size is reserved for the electroplating of the conductive clamping plate for conducting current.
4. The method for gold-plating a key sheet as claimed in claim 3, wherein the width of the copper foil of the plated conductive clamping position must be ensured to be more than 6mm after the etching of the circuit.
5. The method of gold-plating a key sheet as claimed in claim 4, wherein said conductive holes are located between an outer contour line of the sheet and a contour line of the pattern area, and a copper sheet area is located between the outer contour line of the sheet and the contour line of the pattern area, and the copper sheet areas on the periphery each have a group of conductive holes formed by at least 4 holes.
6. The method of gold plating for a key sheet according to claim 5, wherein the number of the conductive holes in each set of the conductive holes is 4 to 10.
7. The method for gold-plating of a key sheet according to claim 6, wherein the diameter of the conductive holes is 0.5mm to 2.0mm, and the distance between two adjacent conductive holes in each group of conductive holes is 0.3mm or more.
8. The method of gold-plating a key sheet as claimed in claim 6, wherein the inner side hole edges of said conductive holes are at least 3mm from the line of the outline of the pattern section, and the outer side hole edges of said conductive holes are at least 5mm from the line of the outline of the sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910394990.4A CN110072346B (en) | 2019-05-13 | 2019-05-13 | Gold plating method for key sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910394990.4A CN110072346B (en) | 2019-05-13 | 2019-05-13 | Gold plating method for key sheet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110072346A CN110072346A (en) | 2019-07-30 |
| CN110072346B true CN110072346B (en) | 2020-07-21 |
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| CN202671691U (en) * | 2012-05-25 | 2013-01-16 | 大连崇达电路有限公司 | Thin plate electroplating splint clamp |
| CN203407089U (en) * | 2013-07-31 | 2014-01-22 | 东莞市若美电子科技有限公司 | Auxiliary production tool of thin plate |
| CN105483788A (en) * | 2015-11-30 | 2016-04-13 | 广东依顿电子科技股份有限公司 | Sheet stabilization method of sheet vertical electroplating |
| CN105704948A (en) * | 2016-03-28 | 2016-06-22 | 上海美维电子有限公司 | Manufacturing method of ultra-thin printed circuit board and ultra-thin printed circuit board |
| CN109152226A (en) * | 2018-11-06 | 2019-01-04 | 瑞华高科技电子工业园(厦门)有限公司 | A kind of method of ultra-thin single side FPC production |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202671691U (en) * | 2012-05-25 | 2013-01-16 | 大连崇达电路有限公司 | Thin plate electroplating splint clamp |
| CN203407089U (en) * | 2013-07-31 | 2014-01-22 | 东莞市若美电子科技有限公司 | Auxiliary production tool of thin plate |
| CN105483788A (en) * | 2015-11-30 | 2016-04-13 | 广东依顿电子科技股份有限公司 | Sheet stabilization method of sheet vertical electroplating |
| CN105704948A (en) * | 2016-03-28 | 2016-06-22 | 上海美维电子有限公司 | Manufacturing method of ultra-thin printed circuit board and ultra-thin printed circuit board |
| CN109152226A (en) * | 2018-11-06 | 2019-01-04 | 瑞华高科技电子工业园(厦门)有限公司 | A kind of method of ultra-thin single side FPC production |
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