CN110072332A - A kind of metal core printed board and its manufacture craft - Google Patents

A kind of metal core printed board and its manufacture craft Download PDF

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Publication number
CN110072332A
CN110072332A CN201910429721.7A CN201910429721A CN110072332A CN 110072332 A CN110072332 A CN 110072332A CN 201910429721 A CN201910429721 A CN 201910429721A CN 110072332 A CN110072332 A CN 110072332A
Authority
CN
China
Prior art keywords
circuit board
printed circuit
top surface
heat sink
copper sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910429721.7A
Other languages
Chinese (zh)
Inventor
卢小燕
邓龙
任兴海
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SICHUAN HAIYING ELECTRONIC TECHNOLOGY Co Ltd
Original Assignee
SICHUAN HAIYING ELECTRONIC TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SICHUAN HAIYING ELECTRONIC TECHNOLOGY Co Ltd filed Critical SICHUAN HAIYING ELECTRONIC TECHNOLOGY Co Ltd
Priority to CN201910429721.7A priority Critical patent/CN110072332A/en
Publication of CN110072332A publication Critical patent/CN110072332A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • H05K1/021Components thermally connected to metal substrates or heat-sinks by insert mounting

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention discloses a kind of metal core printed board and its manufacture craft, it includes printed circuit board (1), copper sheet (2) and radiator, fluted (3) are opened up on the top surface of the printed circuit board (1), it is installed on the bottom surface of groove (3) and along its length multiple lower radiation tooths (4), copper sheet (2) are placed on the top surface of lower radiation tooth (4), copper sheet (2) is located in groove (3), radiator is provided at the top of the printed circuit board (1), radiator includes heat sink (6) and upper radiation tooth (7), heat sink (6) is set on the top surface of printed circuit board (1).The beneficial effects of the present invention are: the installation space of compact-sized, good heat dissipation effect, increase electric elements.

Description

A kind of metal core printed board and its manufacture craft
Technical field
The present invention relates to a kind of metal core printed board and its manufacture crafts.
Background technique
The development of high-quality precision and sophisticated technology at any time at present, the miniaturization of device are the inexorable trends of electronic technology rapid development, by In the micromation of device and the application of High Density Packaging Technology, make on the surface of limited printed circuit board, is mounted with a large amount of Device and also the distance between device it is extremely short, the amount of electric elements heat dissipation is opposite to be concentrated again, and heat is not volatile, causes to print Circuit board temperature rise processed is increased, and will lead to device performance decline when serious, and complete machine running precision is poor.
Summary of the invention
The purpose of the present invention is to overcome the shortcomings of the existing technology, provides compact-sized one kind, good heat dissipation effect, increases electricity The metal core printed board and its manufacture craft of the installation space of device element.
The purpose of the present invention is achieved through the following technical solutions: a kind of metal core printed board, it include printed circuit board, Copper sheet and radiator open up fluted, on the bottom surface of groove and along its length side on the top surface of the printed circuit board To multiple lower radiation tooths are installed with, copper sheet is placed on the top surface of lower radiation tooth, copper sheet is located in groove, the printed circuit It is provided with radiator at the top of plate, radiator includes heat sink and upper radiation tooth, and heat sink is set to the top of printed circuit board On surface, it is installed with multiple upper radiation tooths on the bottom surface of printed circuit board and along its length, upper radiation tooth is located at groove It is interior, it is bonded with heat-conducting glue layer on the bottom surface of the printed circuit board, is bonded with nickel plate on the bottom surface of heat-conducting glue layer.
Multiple threaded holes are offered on the top surface of the printed circuit board.
Offer multiple through-holes corresponding with threaded hole on the heat sink, the heat sink through screw through through-hole and It is connected and fixed on printed circuit board with threaded hole.
The manufacture craft of the metal core printed board, it the following steps are included:
S1, using milling machine, Milling Process goes out groove on the top surface of printed circuit board, bottom surface of the worker in groove after processing The upper multiple lower radiation tooths of welding;
S2, worker are bonded heat-conducting glue layer on the bottom surface of printed circuit board, and nickel plate is then bonded in heat-conducting glue layer;
S3, worker are respectively mounted electric elements in the top surface and bottom surface of copper sheet, and copper sheet is placed in the top of lower radiation tooth On surface;
S4, worker use drilling machine auger shell pit on the top surface of printed circuit board, and in the corresponding position holes drilled through of heat sink, Then people is threadedly coupled through through-hole and by screw with threaded hole, and heat sink is fixed on to the top surface of printed circuit board On, to finally realize the production of metal core printed board.
The invention has the following advantages that the installation space of compact-sized, good heat dissipation effect, increase electric elements.
Detailed description of the invention
Fig. 1 is structural schematic diagram of the invention.
Specific embodiment
The present invention will be further described with reference to the accompanying drawing, and protection scope of the present invention is not limited to as described below:
As shown in Figure 1, a kind of metal core printed board, it includes printed circuit board 1, copper sheet 2 and radiator, the printed circuit It opens up fluted 3 on the top surface of plate 1, is installed on the bottom surface of groove 3 and along its length multiple lower radiation tooths 4, under Copper sheet 2 is placed on the top surface of radiation tooth 4, copper sheet 2 is located in groove 3, and heat dissipation dress is provided at the top of the printed circuit board 1 It sets, radiator includes heat sink 6 and upper radiation tooth 7, and heat sink 6 is set on the top surface of printed circuit board 1, printed circuit It is installed with multiple upper radiation tooths 7 on the bottom surface of plate 1 and along its length, upper radiation tooth 7 is located in groove 3, the printing It is bonded with heat-conducting glue layer 8 on the bottom surface of circuit board 1, nickel plate 9 is bonded on the bottom surface of heat-conducting glue layer 8.
Multiple threaded holes 10 are offered on the top surface of the printed circuit board 1.Offered on the heat sink 6 it is multiple with The corresponding through-hole of threaded hole 10, the heat sink 6 are connected and fixed on printing electricity through screw 11 through through-hole and with threaded hole 10 On road plate 1.
As shown in Figure 1, the manufacture craft of the metal core printed board, it the following steps are included:
S1, using milling machine, Milling Process goes out groove 3 on the top surface of printed circuit board 1, bottom table of the worker in groove 3 after processing Multiple lower radiation tooths 4 are welded on face;
S2, worker are bonded heat-conducting glue layer 8 on the bottom surface of printed circuit board 1, and nickel plate 9 is then bonded in heat-conducting glue layer 8;
S3, worker are respectively mounted electric elements in the top surface and bottom surface of copper sheet 2, and copper sheet 2 is placed in lower radiation tooth 4 On top surface;Due to the mountable electric elements in two faces of copper sheet 2, the installation number of electric elements is increased, is compared Tradition can be only installed on a face of printed circuit board, be greatly saved electric elements installation space;
S4, worker use drilling machine auger shell pit 10 on the top surface of printed circuit board 1, and bore in the corresponding position of heat sink 6 Through-hole, then people is threadedly coupled through through-hole and by screw 11 with threaded hole 10, and heat sink 6 is fixed on printed circuit board On 1 top surface, to finally realize the production of metal core printed board.
After generating amount of heat when electrical components work, heat is largely concentrated on copper sheet 2, and a part of heat is dissipated through upper Hot tooth 7 passes to heat sink 6, then passes to the external world by upper radiation tooth 7;Another part heat transfer to printed circuit board 1, then by Lower radiation tooth 4 passes to printed circuit board 1, then passes to heat-conducting glue layer 8 by printed circuit board 1, is finally transmitted by heat-conducting glue layer 8 To nickel plate 9, to realize two parts heat dissipation, heat build-up is avoided, has the characteristics that good heat dissipation effect, extends metal core The service life of printed board.
The above is only a preferred embodiment of the present invention, it should be understood that the present invention is not limited to described herein Form should not be regarded as an exclusion of other examples, and can be used for other combinations, modifications, and environments, and can be at this In the text contemplated scope, modifications can be made through the above teachings or related fields of technology or knowledge.And those skilled in the art institute into Capable modifications and changes do not depart from the spirit and scope of the present invention, then all should be in the protection scope of appended claims of the present invention It is interior.

Claims (4)

1. a kind of metal core printed board, it is characterised in that: it includes printed circuit board (1), copper sheet (2) and radiator, described It opens up on the top surface of printed circuit board (1) fluted (3), is installed on the bottom surface of groove (3) and along its length more A lower radiation tooth (4) is placed with copper sheet (2) on the top surface of lower radiation tooth (4), and copper sheet (2) is located in groove (3), the print It is provided with radiator at the top of circuit board (1) processed, radiator includes heat sink (6) and upper radiation tooth (7), and heat sink (6) is set It is placed on the top surface of printed circuit board (1), on the bottom surface of printed circuit board (1) and is installed on multiple along its length Radiation tooth (7), upper radiation tooth (7) are located in groove (3), are bonded with heat-conducting glue layer on the bottom surface of the printed circuit board (1) (8), nickel plate (9) are bonded on the bottom surface of heat-conducting glue layer (8).
2. a kind of metal core printed board according to claim 1, it is characterised in that: the top surface of the printed circuit board (1) On offer multiple threaded holes (10).
3. a kind of metal core printed board according to claim 1, it is characterised in that: offered on the heat sink (6) multiple Through-hole corresponding with threaded hole (10), the heat sink (6) connect solid through screw (11) through through-hole and with threaded hole (10) Due on printed circuit board (1).
4. the manufacture craft of metal core printed board described according to claim 1 ~ any one of 3, it is characterised in that: it include with Lower step:
S1, using milling machine, Milling Process goes out groove (3) on the top surface of printed circuit board (1), and worker is in groove (3) after processing Bottom surface on weld multiple lower radiation tooths (4);
S2, worker are bonded heat-conducting glue layer (8) on the bottom surface of printed circuit board (1), are then bonded nickel on heat-conducting glue layer (8) Plate (9);
S3, worker are respectively mounted electric elements in the top surface and bottom surface of copper sheet (2), and copper sheet (2) is placed in lower heat dissipation On the top surface of tooth (4);
S4, worker use drilling machine auger shell pit (10) on the top surface of printed circuit board (1), and the correspondence in heat sink (6) Position holes drilled through, then people is threadedly coupled through through-hole and by screw (11) with threaded hole (10), and heat sink (6) are fixed On the top surface of printed circuit board (1), to finally realize the production of metal core printed board.
CN201910429721.7A 2019-05-22 2019-05-22 A kind of metal core printed board and its manufacture craft Pending CN110072332A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910429721.7A CN110072332A (en) 2019-05-22 2019-05-22 A kind of metal core printed board and its manufacture craft

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910429721.7A CN110072332A (en) 2019-05-22 2019-05-22 A kind of metal core printed board and its manufacture craft

Publications (1)

Publication Number Publication Date
CN110072332A true CN110072332A (en) 2019-07-30

Family

ID=67371328

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910429721.7A Pending CN110072332A (en) 2019-05-22 2019-05-22 A kind of metal core printed board and its manufacture craft

Country Status (1)

Country Link
CN (1) CN110072332A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111683475A (en) * 2020-06-29 2020-09-18 四川海英电子科技有限公司 Production method of composite high-frequency circuit board

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2703295Y (en) * 2004-04-19 2005-06-01 佛山市国星光电科技有限公司 LED light source module for mark plate
CN103079356A (en) * 2012-12-27 2013-05-01 深圳市五株科技股份有限公司 Manufacturing process for copper-based printed circuit board with embedded circuits
CN108966483A (en) * 2018-08-01 2018-12-07 四川海英电子科技有限公司 A kind of manufacture craft of novel high thermal conductivity high-order high-density printed circuit board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2703295Y (en) * 2004-04-19 2005-06-01 佛山市国星光电科技有限公司 LED light source module for mark plate
CN103079356A (en) * 2012-12-27 2013-05-01 深圳市五株科技股份有限公司 Manufacturing process for copper-based printed circuit board with embedded circuits
CN108966483A (en) * 2018-08-01 2018-12-07 四川海英电子科技有限公司 A kind of manufacture craft of novel high thermal conductivity high-order high-density printed circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111683475A (en) * 2020-06-29 2020-09-18 四川海英电子科技有限公司 Production method of composite high-frequency circuit board

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Application publication date: 20190730

RJ01 Rejection of invention patent application after publication