CN110048026B

CN110048026B - OLED panel manufacturing system and device for forming temporary matching unit

Info

Publication number: CN110048026B
Application number: CN201810045316.0A
Authority: CN
Inventors: 孔杰; 居宇涵
Original assignee: Vision Technology Co ltd
Current assignee: Hefei Shiya Technology Co ltd
Priority date: 2018-01-17
Filing date: 2018-01-17
Publication date: 2022-09-30
Anticipated expiration: 2038-01-17
Also published as: CN110048026A

Abstract

An OLED panel manufacturing system and a device for forming a temporary matching unit, wherein the OLED panel manufacturing system comprises a plurality of cluster operation chambers, a plurality of conveying chambers, a plurality of process treatment chambers, a plurality of temporary bonding chambers and a plurality of de-bonding chambers, wherein each cluster operation chamber is connected with at least one process treatment chamber; adjacent cluster operating chambers are connected by a transfer chamber; each transfer chamber is connected to at least one temporary bonding chamber and at least one de-bonding chamber. The temporary bonding chamber of the OLED panel manufacturing system is separated from the process treatment chamber, so that the process adaptability of the OLED panel manufacturing system is improved, and the temporary bonding chamber realizes bonding of the evaporation shadow mask and the substrate through UV glue, thereby meeting the requirement of counterpoint bonding of the evaporation shadow masks made of different materials and the substrate.

Description

OLED panel manufacturing system and device for forming temporary matching unit

Technical Field

The invention relates to the field of OLED manufacturing, in particular to an OLED panel manufacturing system and a device for forming a temporary matching unit.

Background

Organic Light-Emitting Diode (OLED) display panels have the advantages of self-luminescence (without backlight), high contrast, thin thickness, wide viewing angle, fast response speed, applicability to flexible panels, wide temperature range, simple structure and process, and are becoming more and more popular in the industry.

The primary color scheme of an OLED display panel is to fabricate a display unit that displays white light, and then use corresponding color filters in cooperation. According to the technical scheme, the color filter is required to be introduced, and due to the fact that the color filter shields the display sub-pixels, about 80% of light is lost in the color filter, so that the light-emitting power consumption and the brightness performance of the OLED display panel cannot gradually meet the requirements of micro-display wearable application. In addition, in the technical scheme, the microcavity length of the red, green and blue sub-pixels with different wavelengths cannot be independently modulated, and the selectivity of the color filter is reduced, so that the main display performances of the OLED display panel, such as visual angle color shift, dynamic and static contrast, color gamut width and the like, are greatly reduced.

Therefore, the technical solution of directly forming three primary color sub-pixels is proposed in the industry. According to the technical scheme, since a color filter is not needed, the light-emitting loss of each sub-pixel is small, and the light-emitting power consumption and the brightness performance of the OLED display panel are excellent. Moreover, the OLED display panel can independently modulate the microcavities of the red, green and blue three-seed pixels with different wavelengths, so that the corresponding OLED display panel has superior display main performances such as large-viewing-angle color cast, dynamic and static contrast, color gamut width and the like.

In the production process of the OLED display panel, one of the most important processes is to evaporate an organic layer (light-emitting material) onto a substrate according to the requirements of a driving matrix to form structures such as each light-emitting display unit. In the process, a metal shadow mask (or a mask) and an evaporation source are needed, the existing metal shadow mask is made of invar alloy, when evaporation is carried out, the metal shadow mask and a substrate are aligned, then a magnetic plate penetrates through the substrate, the metal shadow mask is adsorbed on the surface of the substrate by the magnetic force generated by the magnetic plate, and then the evaporation process is carried out.

The magnetic adsorption mode enables the alignment and evaporation process of the metal shadow mask and the substrate to be carried out only in the same cavity of the OLED panel manufacturing equipment, namely an alignment system (the alignment system is used for aligning the shadow mask and the substrate) and an evaporation system (the evaporation system is used for forming an organic light-emitting material layer on the substrate by taking the metal shadow mask as a mask after alignment) of the existing OLED panel manufacturing equipment are integrated in one process cavity, so that the process adaptation performance of the existing OLED panel manufacturing equipment is poor, and the existing OLED panel manufacturing equipment cannot adopt the shadow mask made of non-metal materials to manufacture the OLED panel.

Disclosure of Invention

The invention solves the problem how to improve the process adaptability of OLED panel manufacturing equipment and realize the manufacturing of OLED panels by adopting a shadow mask made of non-metallic materials.

In order to solve the above problems, the present invention provides a system for manufacturing an OLED panel, comprising: the device comprises a plurality of cluster operation chambers, a plurality of transfer chambers, a plurality of process treatment chambers, a plurality of temporary bonding chambers and a plurality of de-bonding chambers, wherein each cluster operation chamber is connected with at least one process treatment chamber; adjacent cluster operating chambers are connected through a transfer chamber; each transfer chamber is connected with at least one temporary bonding chamber and at least one debonding chamber; the temporary bonding chamber is at least used for storing an evaporation shadow mask, and after the evaporation shadow mask is aligned with the substrate conveyed into the chamber, the substrate and the evaporation shadow mask are bonded together through UV glue to form a temporary matching structure; the transfer chamber is at least used for transferring the substrate or the temporary pairing structure among the cluster operation chamber, the temporary bonding chamber and the debonding chamber; the cluster operation chamber is at least used for transferring the temporary pairing structure between the process treatment chambers and the transfer chamber; the process treatment chamber is at least used for forming an organic material layer on the surface of the substrate exposed by the evaporation shadow mask by taking the evaporation shadow mask on the temporary matching structure as a mask when the temporary matching structure is conveyed into the process treatment chamber; the debonding chamber is at least used for debonding the substrate and the evaporation shadow mask through laser irradiation when the substrate is conveyed to the debonding chamber after the organic material layer is formed on the substrate of the temporary matching structure, so that the substrate on which the organic material layer is formed is separated from the evaporation shadow mask.

Optionally, the temporary bonding chamber includes: the device comprises an alignment unit, a first clamping unit, a dispensing unit, a UV light irradiation unit and a storage unit, wherein the alignment unit is used for aligning the substrate and the shadow mask; the first clamping unit is used for clamping the substrate and the evaporation shadow mask, and after the substrate and the evaporation shadow mask are aligned, the substrate and the evaporation shadow mask are in contact joint; the dispensing unit is used for spraying UV glue after the substrate is in contact with and attached to the evaporation shadow mask, and filling the UV glue between the substrate and the evaporation shadow mask; the UV light irradiation unit is used for emitting UV light, and filling UV glue between the substrate and the evaporation shadow mask for irradiation, so that the UV glue is cured, and the substrate and the evaporation shadow mask are bonded together to form a temporary matching structure; the storage unit is used for storing the evaporation shadow mask.

Optionally, the substrate includes a pixel region and a cofferdam region surrounding the pixel region, and a cofferdam structure is formed on a part of the surface of the cofferdam region; the vapor deposition shadow mask includes: a substrate; the grating film layer is positioned on the front surface of the substrate, and a plurality of openings which are arranged in an array are formed in the grating film layer; a recess in the substrate through a thickness of the substrate, the recess exposing the plurality of openings in the grating film layer and the grating film layer between adjacent openings.

Optionally, the first clamping unit enables the surface of the evaporation shadow mask with the cofferdam structure on the substrate to contact and attach.

Optionally, the dispensing unit fills UV glue between the substrate outside the cofferdam structure and the evaporation shadow mask.

Optionally, the UV glue ejected by the dispensing unit is a UV glue that generates a glue connection reaction when irradiated by UV light, so that the substrate is bonded with the evaporation shadow mask, and the glue connection molecules are fused when irradiated by laser light, so that the substrate and the evaporation shadow mask are subjected to debonding.

Optionally, the wavelength of the UV light emitted by the UV light irradiation unit is greater than or equal to 365nm, and the irradiation energy is greater than 1000mj/cm ² 。

Optionally, the dispensing unit fills UV glue between the substrate and the evaporation shadow mask, and the first clamping unit may further rotate the contact-bonded substrate and the evaporation shadow mask.

Optionally, the debonding chamber includes a laser irradiation unit and a second clamping unit, the laser irradiation unit is configured to emit laser and irradiate cured UV glue in the temporary matching structure, and the second clamping unit is configured to clamp the temporary matching structure and separate the substrate formed with the organic material layer from the evaporation shadow mask after the laser irradiates the cured UV glue.

Optionally, the laser is picosecond laser, and the pulse frequency is 100-1000 KHz.

Optionally, the number of the process chambers connected with each cluster operation chamber is more than or equal to 1.

Optionally, when the number of the process processing chambers connected to each cluster operation chamber is greater than or equal to 2, the process processing chambers of the process processing chambers connected to each cluster operation chamber are the same process processing chamber or different process processing chambers, or at least some process processing chambers have the same number, and other process processing chambers have other numbers.

Optionally, the process chambers connected to different cluster operation chambers are the same process chamber or different process chambers, or at least some of the process chambers connected to different cluster operation chambers are the same process chamber.

Optionally, when a certain cluster operation chamber is a target cluster operation chamber, the transfer chamber connected to the front end of the target cluster operation chamber is a front end transfer chamber, the transfer chamber connected to the rear end of the target cluster operation chamber is a rear end transfer chamber, the substrate and the evaporation shadow mask form a temporary matching structure in the temporary bonding chamber connected to the front end transfer chamber, and the temporary matching structure is transferred to the target cluster operation chamber through the front end transfer chamber; the target cluster operation chamber transfers the temporary pairing structure to a corresponding process chamber; forming an organic material layer on a substrate in a process chamber; the back end transfer chamber transfers the temporary bonding unit formed with the organic material layer from the target cluster operating chamber to a de-bonding chamber connected to the back end transfer chamber, in which the substrate formed with the organic material layer and the evaporation shadow mask are separated.

Optionally, when the plurality of process chambers connected to the target cluster operation chamber are the same process chamber, a plurality of temporary matching structures are sequentially formed in the temporary bonding chamber connected to the front end transfer chamber, the plurality of temporary matching structures are sequentially transferred to the plurality of process chambers connected to the target cluster operation chamber through the front end transfer chamber and the target cluster operation chamber, and the organic material layer is correspondingly formed on the substrate surface of the plurality of temporary matching structures.

Optionally, when the plurality of process chambers connected to the target cluster operation chamber are two different process chambers, a temporary matching structure is formed in a temporary bonding chamber connected to the front end transfer chamber, the temporary matching structure is transferred to one process chamber connected to the target cluster operation chamber through the front end transfer chamber and the target cluster operation chamber, an evaporation shadow mask is used as a mask, a first organic material layer is formed on the surface of the substrate of the temporary matching structure, the temporary matching structure formed with the first organic material layer is transferred to another process chamber connected to the target cluster operation chamber through the target cluster operation chamber, and a second organic material layer is formed on the surface of the first organic material layer of the substrate by using the same evaporation shadow mask as a mask.

Optionally, the cluster operation chamber includes a first cluster operation chamber, a second cluster operation chamber, a third cluster operation chamber, a fourth cluster operation chamber, a fifth cluster operation chamber, and a sixth cluster operation chamber, which are adjacent in sequence, the transfer chambers include a first transfer chamber, a second transfer chamber, a third transfer chamber, a fourth transfer chamber, a fifth transfer chamber, a sixth transfer chamber, and a seventh transfer chamber, the first transfer chamber is connected with the first cluster operation chamber, the second transfer chamber connects the first cluster operation chamber with the second cluster operation chamber, the third transfer chamber connects the second cluster operation chamber with the third cluster operation chamber, the fourth transfer chamber connects the third cluster operation chamber with the fourth cluster operation chamber, the fifth transfer chamber connects the fourth cluster operation chamber with the fifth cluster operation chamber, and the sixth transfer chamber connects the fifth cluster operation chamber with the sixth cluster operation chamber, the seventh transfer chamber is connected with the sixth cluster of operation chambers; each transfer chamber between adjacent cluster operating chambers is connected with at least one temporary bonding chamber and at least one de-bonding chamber; each cluster operation chamber is connected to at least one process chamber.

Optionally, the process chamber connected to the first cluster of operation chambers comprises at least one P-type doped hole transport layer chamber and at least one common hole transport layer chamber, the process treatment chamber connected with the second cluster of operation chambers comprises at least one blue light micro-cavity adjusting layer chamber and at least one blue light organic luminescent material layer chamber, the process treatment chamber connected with the third cluster of operation chambers comprises at least one green light microcavity adjusting layer chamber and at least one green light organic luminescent material layer chamber, the process treatment chamber connected with the fourth cluster of operation chambers comprises at least one red light microcavity adjusting layer chamber and at least one red light organic luminescent material layer chamber, the process chambers connected to the fifth cluster of process chambers include at least one electron transport layer chamber and at least one cathode layer chamber, and the process chambers connected to the sixth cluster of process chambers include at least one blanket chamber.

Optionally, the substrate is conveyed into a temporary bonding chamber connected to the first conveying chamber through the first conveying chamber, the temporary bonding chamber stores a first evaporation shadow mask, and in the temporary bonding chamber, the substrate and the first evaporation shadow mask are bonded to form a first temporary matching unit; then, the first temporary matching unit is conveyed into the cavity of the P-type doped hole transport layer through the first conveying cavity and the first cluster operation cavity, and the P-type doped hole transport layer is formed on the surface of the substrate through an evaporation process; then, the first temporary bonding unit is conveyed from the P-type doped hole transport layer cavity to the common hole transport layer cavity through the first cluster operation cavity, and a common hole transport layer is formed on the surface of the P-type doped hole transport layer through an evaporation process; then, the first temporary matching unit with the formed common hole transport layer is conveyed to a bonding removing chamber connected with a second conveying chamber through a first cluster operation chamber and the second conveying chamber, bonding removing is carried out, and a first evaporation shadow mask and the substrate with the formed common hole transport layer are separated; then, the second conveying chamber conveys the substrate with the formed common hole transport layer to a temporary bonding chamber connected with the second conveying chamber, a second evaporation shadow mask is stored in the temporary bonding chamber, and the substrate with the formed common hole transport layer and the second evaporation shadow mask are bonded to form a second temporary matching unit in the temporary bonding chamber; then, the second temporary matching unit is transmitted into the blue light microcavity adjusting layer cavity through a second transmission cavity and a second cluster operation cavity, and a blue light microcavity adjusting layer is formed on part of the surface of the common hole transport layer on the substrate through an evaporation process; then, a second temporary bonding unit is transmitted from the blue light microcavity adjusting layer cavity to the blue light organic light-emitting material layer cavity through a second cluster operation cavity, and a blue light organic light-emitting material layer is formed on the surface of the blue light microcavity adjusting layer through an evaporation process; then, the second temporary matching unit with the blue organic light emitting material layer is conveyed to a bonding removing chamber connected with a third conveying chamber through a second cluster operation chamber and the third conveying chamber, bonding removing is carried out, and a second evaporation shadow mask and the substrate with the blue organic light emitting material layer are separated; then, the substrate on which the blue organic light emitting material layer is formed is conveyed to a temporary bonding chamber connected with the third conveying chamber by a third conveying chamber, a third evaporation shadow mask is stored in the temporary bonding chamber, and the substrate on which the blue organic light emitting material layer is formed is bonded with the third evaporation shadow mask to form a third temporary matching unit in the temporary bonding chamber; then, the third temporary matching unit is transmitted into the green light microcavity adjusting layer cavity through a third transmission cavity and a third cluster operation cavity, and a green light microcavity adjusting layer is formed on the partial surface of the common hole transport layer on one side of the blue light organic light emitting material layer on the substrate through an evaporation process; then, a third temporary bonding unit is transmitted from the green light microcavity adjusting layer cavity to the green light organic light-emitting material layer cavity through a third cluster operation cavity, and a green light organic light-emitting material layer is formed on the surface of the green light microcavity adjusting layer through an evaporation process; then, the third temporary matching unit with the green organic light emitting material layer is conveyed to a bonding removing chamber connected with the fourth conveying chamber through a third cluster operation chamber and the fourth conveying chamber, bonding removing is carried out, and a third evaporation shadow mask and the substrate with the green organic light emitting material layer are separated; then, the fourth conveying chamber conveys the substrate on which the green organic light emitting material layer is formed to a temporary bonding chamber connected with the fourth conveying chamber, a fourth evaporation shadow mask is stored in the temporary bonding chamber, and the substrate on which the green organic light emitting material layer is formed and the fourth evaporation shadow mask are bonded to form a fourth temporary matching unit in the temporary bonding chamber; then, the fourth temporary pairing unit is transmitted into the red microcavity adjusting layer cavity through a fourth transmission cavity and a fourth cluster operation cavity, and a red microcavity adjusting layer is formed on part of the surface of the common hole transport layer on one side of the green organic light-emitting material layer on the substrate through an evaporation process; then, a fourth temporary bonding unit is transmitted from the red light microcavity adjusting layer cavity to the red light organic light-emitting material layer cavity through a fourth cluster operation cavity, and a red light organic light-emitting material layer is formed on the surface of the red light microcavity adjusting layer through an evaporation process; then, the fourth temporary matching unit with the red organic light-emitting material layer is conveyed to a bonding-removing chamber connected with the fifth conveying chamber through a fourth cluster operation chamber and the fifth conveying chamber, bonding removal is carried out, and a fourth evaporation shadow mask and the substrate with the red organic light-emitting material layer are separated; then, the substrate on which the red organic light emitting material layer is formed is conveyed to a temporary bonding chamber connected with the fifth conveying chamber by a fifth conveying chamber, a fifth evaporation shadow mask is stored in the temporary bonding chamber, and the substrate on which the red organic light emitting material layer is formed is bonded with the fifth evaporation shadow mask to form a fifth temporary matching unit in the temporary bonding chamber; then, the fifth temporary matching unit is conveyed into the electron transport layer chamber through a fifth conveying chamber and a fifth cluster operation chamber, and an electron transport layer covering the surfaces of the blue light organic light emitting material layer, the green light organic light emitting material layer and the red light organic light emitting material layer is formed on the substrate through an evaporation process; then, the fifth temporary bonding unit is conveyed from the electron transport layer cavity to the cathode layer cavity through the fifth cluster operation cavity, and a cathode layer is formed on the surface of the electron transport layer through an evaporation process; then, the fifth temporary matching unit forming the cathode layer is conveyed to a bonding releasing chamber connected with the sixth conveying chamber through a fifth cluster operation chamber and the sixth conveying chamber to be released from bonding, and a fifth evaporation shadow mask and the substrate forming the cathode layer are separated; then, the sixth conveying chamber conveys the substrate on which the cathode layer is formed to a temporary bonding chamber connected with the sixth conveying chamber, a sixth evaporation shadow mask is stored in the temporary bonding chamber, and the substrate on which the cathode layer is formed and the sixth evaporation shadow mask are bonded to form a sixth temporary matching unit in the temporary bonding chamber; next, the sixth temporary matching unit is transferred into the coating layer chamber through the sixth transfer chamber and the sixth cluster operation chamber, and a coating layer is formed on the surface of the cathode layer on the substrate through an evaporation process.

Optionally, the process chamber connected to the first cluster of operation chambers comprises at least one P-type doped hole transport layer chamber and at least one common hole transport layer chamber, the process chambers connected to the second cluster of operation chambers include at least one common hole transport layer chamber and at least one blue organic light emitting material layer chamber, the process chambers connected to the third cluster of process chambers include at least one green microcavity tuning layer chamber and at least one green organic light-emitting material layer chamber, the process chamber connected with the fourth cluster of operation chambers comprises at least one red microcavity adjusting layer chamber and at least one red organic light-emitting material layer chamber, the process chambers connected to the fifth cluster of process chambers include at least one electron transport layer chamber and at least one cathode layer chamber, and the process chambers connected to the sixth cluster of process chambers include at least one blanket chamber.

Optionally, the substrate is conveyed into a temporary bonding chamber connected to the first conveying chamber through the first conveying chamber, the temporary bonding chamber stores a first evaporation shadow mask, and in the temporary bonding chamber, the substrate and the first evaporation shadow mask are bonded to form a first temporary matching unit; then, the first temporary matching unit is conveyed into the cavity of the P-type doped hole transport layer through the first conveying cavity and the first cluster operation cavity, and the P-type doped hole transport layer is formed on the surface of the substrate through an evaporation process; then, the first temporary bonding unit is transferred from the P-type doped hole transport layer cavity to a common hole transport layer cavity connected with the first cluster operation cavity through a first cluster operation cavity, and a first common hole transport layer is formed on the surface of the P-type doped hole transport layer through an evaporation process; then, the first temporary pairing unit with the first common hole transport layer is conveyed to a common hole transport layer cavity connected with the second cluster operation cavity through a first cluster operation cavity, a second conveying cavity and a second cluster operation cavity, a second common hole transport layer is formed on the surface of the first common hole transport layer through an evaporation process, and the first common hole transport layer and the second common hole transport layer form a hole transport layer; then, the temporary matching structure with the second common hole transport layer is conveyed to a bonding removing chamber connected with a second conveying unit through a second cluster operation chamber and a second conveying chamber, bonding removing is carried out, and the first evaporation shadow mask and the substrate with the second common hole transport layer are separated; then, the second conveying chamber conveys the substrate with the second common hole transport layer to a temporary bonding chamber connected with the second conveying chamber, a second evaporation shadow mask is stored in the temporary bonding chamber, and the substrate with the second common hole transport layer is bonded with the second evaporation shadow mask to form a second temporary matching unit in the temporary bonding chamber; then, the second temporary matching unit is transmitted to the blue light organic light-emitting material layer chamber through a second transmission chamber and a second cluster operation chamber, and the blue light organic light-emitting material layer is formed on part of the surface of the second common hole transport layer through an evaporation process; then, the second temporary matching unit with the blue organic light-emitting material layer is conveyed to a bonding removing chamber connected with a third conveying chamber through a second cluster operation chamber and the third conveying chamber, bonding removing is carried out, and a second evaporation shadow mask and the substrate with the blue organic light-emitting material layer are separated; then, the third conveying chamber conveys the substrate on which the blue organic light emitting material layer is formed to a temporary bonding chamber connected with the third conveying chamber, a third evaporation shadow mask is stored in the temporary bonding chamber, and the substrate on which the blue organic light emitting material layer is formed and the third evaporation shadow mask are bonded to form a third temporary matching unit in the temporary bonding chamber; then, the third temporary matching unit is transmitted into the green light microcavity adjusting layer cavity through a third transmission cavity and a third cluster operation cavity, and a green light microcavity adjusting layer is formed on the surface of part of the second layer common hole transport layer on one side of the blue light organic light emitting material layer on the substrate through an evaporation process; then, a third temporary bonding unit is transmitted from the green light microcavity adjusting layer cavity to the green light organic light-emitting material layer cavity through a third cluster of operation cavities, and a green light organic light-emitting material layer is formed on the surface of the green light microcavity adjusting layer through an evaporation process; then, the third temporary matching unit with the green organic light emitting material layer is conveyed to a bonding removing chamber connected with a fourth conveying chamber through a third cluster operation chamber and the fourth conveying chamber, bonding removing is carried out, and a third evaporation shadow mask and the substrate with the green organic light emitting material layer are separated; then, the fourth conveying chamber conveys the substrate on which the green organic light emitting material layer is formed to a temporary bonding chamber connected with the fourth conveying chamber, a fourth evaporation shadow mask is stored in the temporary bonding chamber, and the substrate on which the green organic light emitting material layer is formed and the fourth evaporation shadow mask are bonded to form a fourth temporary matching unit in the temporary bonding chamber; then, the fourth temporary pairing unit is transmitted into the red microcavity adjusting layer cavity through a fourth transmission cavity and a fourth cluster operation cavity, and a red microcavity adjusting layer is formed on the surface of part of the second layer common hole transport layer on one side of the green organic light-emitting material layer on the substrate through an evaporation process; then, a fourth temporary bonding unit is transmitted from the red light microcavity adjusting layer cavity to the red light organic light-emitting material layer cavity through a fourth cluster operation cavity, and a red light organic light-emitting material layer is formed on the surface of the red light microcavity adjusting layer through an evaporation process; then, the fourth temporary matching unit with the red organic light-emitting material layer is conveyed to a bonding-removing chamber connected with the fifth conveying chamber through a fourth cluster operation chamber and the fifth conveying chamber, bonding removal is carried out, and a fourth evaporation shadow mask and the substrate with the red organic light-emitting material layer are separated; then, the substrate on which the red organic light emitting material layer is formed is conveyed to a temporary bonding chamber connected with the fifth conveying chamber by a fifth conveying chamber, a fifth evaporation shadow mask is stored in the temporary bonding chamber, and the substrate on which the red organic light emitting material layer is formed is bonded with the fifth evaporation shadow mask to form a fifth temporary matching unit in the temporary bonding chamber; then, the fifth temporary matching unit is conveyed into the electron transport layer chamber through a fifth conveying chamber and a fifth cluster operation chamber, and an electron transport layer covering the surfaces of the blue light organic light emitting material layer, the green light organic light emitting material layer and the red light organic light emitting material layer is formed on the substrate through an evaporation process; then, the fifth temporary bonding unit is conveyed from the electron transport layer cavity to the cathode layer cavity through the fifth cluster operation cavity, and a cathode layer is formed on the surface of the electron transport layer through an evaporation process; then, the fifth temporary matching unit forming the cathode layer is conveyed to a bonding-releasing chamber connected with the sixth conveying chamber through a fifth cluster operation chamber and the sixth conveying chamber, bonding is released, and the fifth evaporation shadow mask and the substrate forming the cathode layer are separated; then, the sixth conveying chamber conveys the substrate on which the cathode layer is formed to a temporary bonding chamber connected with the sixth conveying chamber, a sixth evaporation shadow mask is stored in the temporary bonding chamber, and the substrate on which the cathode layer is formed and the sixth evaporation shadow mask are bonded to form a sixth temporary matching unit in the temporary bonding chamber; next, the sixth temporary matching unit is transferred into the coating layer chamber through the sixth transfer chamber and the sixth cluster operation chamber, and a coating layer is formed on the surface of the cathode layer on the substrate through an evaporation process.

Optionally, the alignment accuracy of the temporary bonding chambers is kept consistent.

The invention also provides an OLED panel manufacturing system, which comprises: the device comprises a cluster operation chamber, a plurality of transfer chambers, a plurality of process treatment chambers, a plurality of temporary bonding chambers and a plurality of de-bonding chambers, wherein the cluster operation chamber is connected with at least one process treatment chamber; the front section and the rear end of the cluster operation chamber are respectively connected with at least one conveying chamber; the conveying chamber connected with the front end of the cluster operation chamber is connected with at least one temporary bonding chamber, and the conveying chamber connected with the rear end of the cluster operation chamber is connected with at least one debonding chamber; the temporary bonding chamber is at least used for storing an evaporation shadow mask, and after the evaporation shadow mask is aligned with the substrate conveyed into the chamber, the substrate and the evaporation shadow mask are bonded together through UV glue to form a temporary matching structure; the transfer chamber is at least used for transferring the substrate or the temporary pairing structure among the cluster operation chamber, the temporary bonding chamber and the debonding chamber; the cluster operation chamber is at least used for transferring the temporary pairing structure between the process treatment chambers and the transfer chamber; the process treatment chamber is at least used for forming an organic material layer on the surface of the substrate exposed by the evaporation shadow mask by taking the evaporation shadow mask on the temporary matching structure as a mask when the temporary matching structure is conveyed into the process treatment chamber; the debonding chamber is at least used for debonding the substrate and the evaporation shadow mask through laser irradiation when the substrate is conveyed to the debonding chamber after the organic material layer is formed on the substrate of the temporary mating structure, so that the substrate on which the organic material layer is formed and the evaporation shadow mask are separated.

Optionally, the number of the process processing chambers is several, the several process processing chambers are the same process processing chamber, the front end and the rear end of the cluster operation chamber are respectively connected to one transfer chamber, the transfer chamber at the front end is connected to at least one temporary bonding chamber, and the transfer chamber at the rear end is connected to at least one de-bonding chamber.

Optionally, the number of the process processing chambers is several, the plurality of process processing chambers are the same process processing chamber, the front-end transfer chamber is connected with at least one temporary bonding chamber except for being connected with at least one temporary bonding chamber and is connected with at least one debonding chamber, and the rear-end transfer chamber is connected with at least one debonding chamber except for being connected with at least one temporary bonding chamber.

Optionally, the number of the process chambers is several, the several process chambers at least include two different process chambers, the front-end transfer chamber is connected to at least one temporary bonding chamber, and the rear-end transfer chamber is connected to at least one de-bonding chamber.

Optionally, the plurality of process chambers include two different process chambers, the front-end transfer chamber is connected to at least one temporary bonding chamber and is connected to at least one debonding chamber, and the back-end transfer chamber is connected to at least one temporary bonding chamber and is connected to at least one debonding chamber.

The present invention also provides an apparatus for forming a provisional mated unit, comprising: and the temporary bonding chamber is at least used for storing the evaporation shadow mask, and after the evaporation shadow mask is aligned with the substrate conveyed into the chamber, the substrate and the evaporation shadow mask are bonded together through UV glue to form a temporary matching structure.

Optionally, the temporary bonding chamber includes: the device comprises an alignment unit, a first clamping unit, a dispensing unit, a UV light irradiation unit and a storage unit, wherein the alignment unit is used for aligning the substrate and the shadow mask; the first clamping unit is used for clamping the substrate and the evaporation shadow mask, and after the substrate and the evaporation shadow mask are aligned, the substrate and the evaporation shadow mask are in contact joint; the dispensing unit is used for spraying UV glue after the substrate is in contact joint with the evaporation shadow mask, and filling the UV glue between the substrate and the evaporation shadow mask; the UV light irradiation unit is used for emitting UV light, and filling UV glue between the substrate and the evaporation shadow mask for irradiation, so that the UV glue is cured, and the substrate and the evaporation shadow mask are bonded together to form a temporary matching structure; the storage unit is used for storing the evaporation shadow mask.

Compared with the prior art, the technical scheme of the invention has the following advantages:

the OLED panel manufacturing system comprises: the device comprises a plurality of cluster operation chambers, a plurality of transfer chambers, a plurality of process treatment chambers, a plurality of temporary bonding chambers and a plurality of de-bonding chambers, wherein each cluster operation chamber is connected with at least one process treatment chamber; adjacent cluster operating chambers are connected through a transfer chamber; each transmission chamber is connected with at least one temporary bonding chamber and at least one debonding chamber, the temporary bonding chamber and the process treatment chamber are separated, after the evaporation shadow mask and the substrate transmitted into the chamber are aligned, the substrate and the evaporation shadow mask are bonded together through UV glue to form a temporary matching structure, so that the substrate and the evaporation shadow mask can be bonded without magnetic force, the formed temporary matching unit has high firmness through UV glue bonding, the temporary matching unit can be conveniently transmitted through the transmission chamber and the cluster operation chamber, and when the process treatment chamber is transmitted into the process treatment chamber through the temporary matching structure, the evaporation shadow mask on the temporary matching structure is used as a mask, an organic material layer is formed on the surface of the substrate exposed by the evaporation shadow mask through evaporation, so that the OLED panel manufacturing system ensures that the alignment bonding process of the evaporation shadow mask and the substrate is carried out in the process treatment chamber The outer completion is that the alignment process of the vapor plating shadow mask and the substrate and the vapor plating process are separately carried out, so that the formation of organic material layer in the processing chamber is not limited by the alignment bonding process between the vapor deposition shadow mask and the substrate, thereby the process treatment chamber for forming one organic material layer in the OLED panel manufacturing system can be easily transformed into the process treatment chamber for forming another organic material layer, the process adaptability of the OLED panel manufacturing system is improved, and the temporary bonding chamber can realize the counterpoint bonding of the vapor deposition shadow mask of the non-metal material and the substrate and the counterpoint bonding of the vapor deposition shadow mask of the metal material and the substrate in a UV adhesive bonding mode, and the debonding chamber can conveniently realize the separation of the evaporation shadow mask and the substrate through laser irradiation, thereby meeting the requirement of the alignment bonding of the evaporation shadow mask and the substrate made of different materials.

Further, the temporary bonding chamber includes: the device comprises an alignment unit, a first clamping unit, a dispensing unit and a UV light irradiation unit, wherein the alignment unit is used for aligning the substrate and the shadow mask; the first clamping unit is used for clamping the substrate and the evaporation shadow mask, and after the substrate and the evaporation shadow mask are aligned, the substrate and the evaporation shadow mask are in contact joint; the dispensing unit is used for spraying UV glue after the substrate is in contact with and attached to the evaporation shadow mask, and filling the UV glue between the substrate and the evaporation shadow mask; the UV light irradiation unit is used for emitting UV light, and filling UV glue between the substrate and the evaporation shadow mask for irradiation, so that the UV glue is cured, and the substrate and the evaporation shadow mask are bonded together to form a temporary matching structure; the storage unit is used for storing the evaporation shadow mask, so that the alignment bonding of the substrate and the evaporation shadow mask can be conveniently realized through the temporary bonding chamber to form a temporary matching unit.

Furthermore, the UV glue generates glue connection reaction when being irradiated by UV light, so that the substrate is bonded with the evaporation shadow mask, and the glue connection molecules are fused when being irradiated by laser, so that the substrate and the evaporation shadow mask are subjected to de-bonding UV glue, and therefore the temporary bonding and de-bonding steps of the substrate and the evaporation shadow mask can be conveniently and quickly realized.

Further, the wavelength of the UV light is 365nm or more, and may be 365nm or 395nm, and the irradiation energy is more than 1000mj/cm ² The UV light has low wave band energy (millijoule per square centimeter), has small excitation on the chemical potential energy of the organic luminescent material, does not reduce the service life of the OLED device, and can obtain reliable UV bonding performance.

Furthermore, the laser emitted by the laser irradiation unit is picosecond laser, and the pulse frequency is 100-1000KHz, so that cross-linking molecules in the cured UV glue can be quickly fused, the UV glue can still keep a cured state, and the substrate can be ensured to be separated from the evaporation shadow mask without transverse dislocation.

Further, each cluster operation chamber is connected with a plurality of same process treatment chambers, the process treatment chambers connected with different cluster operation chambers are different process treatment chambers, one cluster operation chamber is used as a cluster operation chamber, a plurality of process treatment chambers connected with a target cluster operation chamber are the same process treatment chambers, a transmission chamber connected with the front end of the target cluster operation chamber is a front end transmission chamber, when the transmission chamber connected with the rear end of the target cluster operation chamber is a rear end transmission chamber, a plurality of temporary matching structures are sequentially formed in a temporary bonding chamber connected with the front end transmission chamber, a plurality of temporary matching structures are sequentially transmitted into a plurality of process treatment chambers connected with the target cluster operation chamber through the front end transmission chamber and the target cluster operation chamber, and organic material layers are correspondingly formed on the substrate surfaces of the plurality of temporary matching structures, the rear-end conveying chamber conveys the temporary bonding unit with the organic material layer from the target cluster operation chamber to a de-bonding chamber connected with the rear-end conveying chamber, and in the de-bonding chamber, the substrate with the organic material layer is separated from the evaporation shadow mask, so that the substrate can pass through different temporary bonding chambers, cluster operation chambers, process treatment chambers and the de-bonding chamber in a flowing mode in the OLED panel manufacturing system to form different organic light-emitting material layers, and sequential batch manufacturing of the OLED panels is realized.

Further, when a certain cluster operation chamber is used as a cluster operation chamber, a plurality of process treatment chambers connected with a target cluster operation chamber are different process treatment chambers, a transfer chamber connected with the front end of the target cluster operation chamber is a front end transfer chamber, when a transfer chamber connected with the rear end of the target cluster operation chamber is a rear end transfer chamber, a temporary matching structure is formed in a temporary bonding chamber connected with the front end transfer chamber, the temporary matching structure is firstly transferred into one process treatment chamber connected with the target cluster operation chamber through the front end transfer chamber and the target cluster operation chamber, an evaporation shadow mask is used as a mask, a first organic material layer is formed on the surface of a substrate of the temporary matching structure, and then the temporary matching structure formed with the first organic material layer is transferred into the other process treatment chamber connected with the target cluster operation chamber through the target cluster operation chamber, forming a second organic material layer on the surface of the first organic material layer of the substrate by using the same evaporation shadow mask as a mask; and then the rear-end conveying chamber conveys the temporary bonding unit with the second organic material layer from the target cluster operation chamber to a de-bonding chamber connected with the rear-end conveying chamber, and in the de-bonding chamber, the substrate with the second organic material layer is separated from the evaporation shadow mask, so that the flow type treatment of forming at least two organic material layers on a plurality of substrates is realized when the OLED panel is manufactured, and only one alignment and bonding process is needed when the two organic material layers are formed, thereby saving the process time.

Further, at least some of the process chambers connected to different cluster operation chambers are the same process chamber, so that the organic material layer with a relatively thick thickness can be split into at least two layers with the same thickness, and the organic material layer with a corresponding thickness is grown in the process chambers connected to different cluster operation chambers (for example, the organic material layer with a portion of thickness is grown in the process chamber connected to one cluster operation chamber, and then the organic material layer with another portion of thickness is grown in the process chamber connected to another adjacent cluster operation chamber), so that the growth time difference of the organic material layers in the process chambers is relatively small or substantially the same, thereby reducing the influence of the growth of part of the organic material layer on the process takt time of the whole OLED manufacturing system.

Drawings

FIGS. 1 to 6 are schematic structural diagrams illustrating an OLED panel manufacturing system according to an embodiment of the present invention;

FIG. 7 is a schematic structural diagram of an evaporation shadow mask according to an embodiment of the present invention;

FIGS. 8-9 are schematic views of structures of a substrate according to an embodiment of the invention;

FIGS. 10 to 15 are schematic structural diagrams of a part of a chamber of an OLED panel manufacturing system according to an embodiment of the present invention when manufacturing an OLED panel;

FIG. 16 is a schematic structural diagram of an OLED panel according to an embodiment of the present invention;

FIG. 17 is a schematic diagram illustrating a manufacturing system of an OLED panel according to an embodiment of the present invention;

FIG. 18 is a schematic structural diagram of an OLED panel according to an embodiment of the present invention;

fig. 19 is a schematic structural diagram illustrating an OLED panel manufacturing system according to an embodiment of the invention.

Detailed Description

As background art, the process adaptability of the existing OLED panel manufacturing apparatus is poor, and the existing OLED panel manufacturing apparatus cannot adopt a shadow mask made of a non-metallic material to manufacture the OLED panel.

Research shows that the existing OLED panel manufacturing equipment integrates an alignment system and an evaporation system in a process chamber, and the OLED panel needs to form a plurality of organic material layers (such as a hole transport layer, a blue light, red light and green light microcavity length adjusting layer, a blue light, red light and green light organic light emitting material layer, an electron transport layer and the like) during manufacturing, and the alignment precision requirements are different during forming different organic material layers (such as a larger process window during forming the hole transport layer, so that the alignment precision is relatively lower, and a smaller process window during forming the blue light, red light and green light organic light emitting material layers, so that the alignment precision is relatively higher) The alignment system with higher integration precision of the process chamber for the red light organic light emitting material layer and the alignment system with lower integration precision of the process chamber for forming the hole transport layer), that is, the alignment systems with different accuracies and the corresponding evaporation systems are integrated in one process chamber, so that when the OLED panel is manufactured, the specific process chamber can only be used for forming the specific organic light emitting material layer, and the specific process chamber is difficult to be used for forming different organic material layers (that is, the process chamber for forming the hole transport layer is difficult to be transformed into the process chamber for forming the blue light organic light emitting material layer, the red light organic light emitting material layer and the green light organic light emitting material layer), so that the process adaptation performance of the OLED panel manufacturing equipment is poor.

In addition, in the prior art, when a metal shadow mask is adopted, a magnetic plate penetrates through a substrate, the metal shadow mask is adsorbed on the surface of the substrate by magnetic force generated by the magnetic plate, the magnetic plate adopts an electromagnet, the magnetic force is generated when the metal shadow mask is electrified and is adsorbed, and the magnetic force disappears when the power is off, so that the substrate is separated from the metal shadow mask.

In addition, the existing OLED panel manufacturing equipment has the problem of long process takt time in the process of manufacturing the OLED panel. Researches show that when the OLED panel is manufactured, a plurality of layers of organic material layers (such as a hole transport layer, a blue light, red light and green light microcavity length adjusting layer, a blue light, red light and green light organic light emitting material layer, an electron transport layer and the like) need to be formed, so that when the existing OLED panel manufacturing equipment is adopted to manufacture the OLED panel, different organic layers are formed in different process chambers in each time, and are aligned in the repeated process chambers, so that the process takt time of the whole OLED panel manufacturing process is longer.

Therefore, the invention provides an OLED panel manufacturing system, a temporary bonding chamber is separated from a process treatment chamber, the temporary bonding chamber bonds a substrate and an evaporation shadow mask together through UV glue after the evaporation shadow mask is aligned with the substrate conveyed into the chamber to form a temporary matching structure, so that the substrate and the evaporation shadow mask can be bonded without magnetic force, the formed temporary matching unit has high firmness through UV glue bonding, the temporary matching unit can be conveniently conveyed through a conveying chamber and a cluster operation chamber, when the process treatment chamber conveys the temporary matching structure into the process treatment chamber, the evaporation shadow mask on the temporary matching structure is used as a mask, an organic material layer is formed on the surface of the substrate exposed by the evaporation shadow mask through evaporation, therefore, the OLED panel manufacturing system of the application ensures that the alignment bonding process of the evaporation shadow mask and the substrate is completed outside the process treatment chamber, so that the alignment process of the evaporation shadow mask and the substrate and the evaporation process are separately carried out, which organic material layer is formed in the process treatment chamber is not limited by the alignment bonding process of the evaporation shadow mask and the substrate, thereby the process treatment chamber for forming one organic material layer in the OLED panel manufacturing system can be easily transformed into the process treatment chamber for forming another organic material layer, the process adaptability of the OLED panel manufacturing system is improved, and the temporary bonding chamber can realize the counterpoint bonding of the vapor deposition shadow mask of the non-metal material and the substrate and the counterpoint bonding of the vapor deposition shadow mask of the metal material and the substrate in a UV glue bonding mode, and the debonding chamber can conveniently realize the separation of the evaporation shadow mask and the substrate through laser irradiation, thereby meeting the requirement of contraposition bonding of the evaporation shadow mask and the substrate made of different materials.

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In describing the embodiments of the present invention in detail, the drawings are not to be considered as being enlarged partially in accordance with the general scale, and the drawings are only examples, which should not be construed as limiting the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in the actual fabrication.

FIGS. 1-6 are schematic structural diagrams of an OLED panel manufacturing system according to an embodiment of the present invention; FIG. 7 is a schematic structural diagram of an evaporation shadow mask according to an embodiment of the present invention; FIGS. 8 to 9 are schematic structural views of a substrate according to an embodiment of the present invention; FIGS. 10-15 are schematic structural diagrams of a part of a chamber of an OLED panel manufacturing system according to an embodiment of the present invention during the manufacture of an OLED panel; FIG. 16 is a schematic structural diagram of an OLED panel according to an embodiment of the present invention; FIG. 17 is a schematic diagram illustrating a manufacturing system of an OLED panel according to an embodiment of the present invention; FIG. 18 is a schematic structural diagram of an OLED panel according to an embodiment of the present invention; fig. 19 is a schematic structural diagram illustrating an OLED panel manufactured by the OLED panel manufacturing system according to an embodiment of the invention.

An embodiment of the present invention provides a system for manufacturing an OLED panel, referring to fig. 1, including: a plurality of cluster operation chambers 200, a plurality of transfer chambers 220, a plurality of process chambers 210, a plurality of temporary bonding chambers 230, a plurality of de-bonding chambers 240, wherein,

each cluster operation chamber 200 is connected to at least one process chamber 210;

adjacent cluster operation chambers 200 are connected by a transfer chamber 220;

each transfer chamber 220 is connected to at least one temporary bonding chamber 230 and at least one de-bonding chamber 240;

the temporary bonding chamber 230 is at least used for storing an evaporation shadow mask, and after the evaporation shadow mask is aligned with the substrate conveyed into the chamber (the temporary bonding chamber), the substrate and the evaporation shadow mask are bonded together through UV glue to form a temporary matching structure;

the transfer chamber 220 is used at least for transferring substrates or temporary mating structures between the cluster manipulation chamber 200, the temporary bonding chamber 230 and the debonding chamber 240;

the cluster operation chamber 200 is used at least for transferring temporary mating structures between process chambers 210, and between process chambers 210 and transfer chamber 220;

the processing chamber 210 is at least used for forming an organic material layer on the surface of the substrate exposed by the evaporation shadow mask by taking the evaporation shadow mask on the temporary matching structure as a mask when the temporary matching structure is conveyed into the processing chamber;

the debonding chamber 240 is at least used to debond the substrate and the evaporation shadow mask by laser irradiation while transferring to the debonding chamber after forming the organic material layer on the substrate of the temporary mating structure, so that the substrate on which the organic material layer is formed and the evaporation shadow mask are separated.

The number of the cluster operation chambers 200 in the OLED panel manufacturing system is at least 2 or greater than or equal to 2 (in this embodiment, several in the subsequent embodiments each indicate that the number is at least 2 or greater than or equal to 2), that is, the number of the cluster operation chambers 200 in the OLED panel manufacturing system may be 2, 3, 4, 5, 6, 7, 8, 9 or 10, in this embodiment, 5 cluster operation chambers 200 in the OLED panel manufacturing system are taken as an example, and each cluster operation chamber 200 is connected to a plurality of process chambers 210; adjacent cluster operating chambers 200 are connected by a transfer chamber 220.

Each cluster operation chamber 200 in the OLED panel manufacturing system is connected to at least one process chamber 210, i.e., each cluster operation chamber 200 may be connected to 1, 2, 3, 4, or 5 process chambers 210. The number of process chambers connected to different cluster operation chambers 200 may be the same or different. In the present embodiment, each cluster operation chamber 200 is connected to 4 process chambers 210 as an example.

The adjacent cluster operating chambers 200 are connected by the transfer chamber 220 to form a serial structure, as shown in fig. 1, when there are 5 cluster operating chambers 200, two adjacent cluster operating chambers 200 of the 5 cluster operating chambers 200 are connected by one transfer chamber 220 to form a serial structure, and the two cluster operating chambers 200 at two ends (two ends of the serial structure) are also connected with one transfer chamber 220 respectively, i.e. each cluster operating chamber needs to be connected with two transfer chambers 220.

In this embodiment, each transfer chamber 220 between adjacent cluster operation chambers is connected to at least one temporary bonding chamber 230 and at least one de-bonding chamber 240. One of the two transfer chambers 220 at both ends is connected to at least one temporary bonding chamber 230 (for example, the front or left transfer chamber 220 is connected to only one temporary bonding chamber 230 in fig. 1), and the other transfer chamber 220 is connected to at least one de-bonding chamber 240 (the rear or right transfer chamber 220 is connected to only one front or left transfer chamber 220 is connected to only one temporary bonding chamber 230). In other embodiments, both transfer chambers 220 at both ends may be connected to at least one temporary bonding chamber 230 and at least one de-bonding chamber 240.

The temporary bonding chamber 220 includes: the device comprises an alignment unit, a first clamping unit, a dispensing unit and a UV light irradiation unit, wherein the alignment unit is used for aligning the substrate and the shadow mask; the first clamping unit is used for clamping the substrate and the evaporation shadow mask, and after the substrate and the evaporation shadow mask are aligned, the substrate and the evaporation shadow mask are in contact joint; the dispensing unit is used for spraying UV glue after the substrate is in contact joint with the evaporation shadow mask, and filling the UV glue between the substrate and the evaporation shadow mask; the UV light irradiation unit is used for emitting UV light, and filling UV glue between the substrate and the evaporation shadow mask for irradiation, so that the UV glue is cured, and the substrate and the evaporation shadow mask are bonded together to form a temporary matching structure; the storage unit is used for storing the evaporation shadow mask. The substrate and the vapor deposition shadow mask will be described in detail below.

Referring to fig. 7, fig. 7 is a schematic structural diagram of an evaporation shadow mask according to an embodiment of the present invention, where the evaporation shadow mask includes: a substrate 101; a grating film layer 102 on the front surface of the substrate 101, wherein the grating film layer 102 has a plurality of openings 108 arranged in an array; a recess 111 in the substrate 101 through the thickness of the substrate 101, the recess 111 exposing the grating film layer between a number of openings in the grating film layer 102 and adjacent openings 108.

In one embodiment, the forming process of the evaporation shadow mask comprises the following steps: providing a substrate 101, wherein the substrate 101 comprises a front surface and an opposite back surface, and as shown in fig. 7, the upper surface of the substrate 101 is taken as the front surface, and the lower surface is taken as the back surface; forming a grating film layer 102 covering the front surface of the substrate 101; etching part of the grating film layer 102, forming a plurality of openings 108 arranged in an array in the grating film layer 102, wherein the openings 108 expose the front surface of the substrate 101; a portion of the substrate 101 is etched along the back side of the substrate 101, and a groove 111 is formed in the substrate 101 that exposes a number of openings 108 in the grating film layer 102 and the grating film layer between adjacent openings 108. The size of the opening formed in the grid film layer 108 of the evaporation shadow mask formed by the method can be smaller, and the side wall appearance of the opening is better.

The substrate 101 is made of a semiconductor material or glass, and the semiconductor material is silicon, germanium, silicon-on-insulator or germanium-on-insulator. The glass is toughened glass.

The material of the grid film layer 102 is silicon nitride, silicon oxide or silicon oxynitride.

In an embodiment, the grating film layer 102 may cover only the front surface of the substrate 101, in other embodiments, the grating film layer 102 covers the front surface of the substrate, and also covers the side surface and the back surface of the substrate, a plurality of openings are formed in the grating film layer 102 on the front surface of the substrate 101 as a mask layer during evaporation, the grating film layer on the back surface of the substrate 101 as a mask layer during etching the back surface of the substrate to form a groove, the grating film layer on the side surface of the substrate 101 protects the substrate on the side surface from being etched during etching the back surface of the substrate, so that the remaining substrate material can well support the grating film layer on the front surface of the substrate, and the grating film layer on the side surface of the substrate 101 and the grating film layer on the front surface of the substrate 101 are integrated, and then a groove is formed in the etched substrate, so that when the grating film layer with a plurality of openings on the front surface of the substrate 101 is suspended, the grating film layer with a plurality of openings and the substrate 101 have good adhesion and mechanical stability, the grid film layer with a plurality of openings is prevented from deforming and warping or separating from the edge, so that the openings in the grid film layer can still keep good appearance, and the position accuracy and good appearance of the light-emitting units formed in the vapor deposition process are guaranteed.

In one embodiment, the grid film 102 has a tensile stress to prevent the suspended grid film from deforming due to its own weight, thereby improving the position accuracy of the openings in the grid film and maintaining the good appearance of the sidewalls of the openings.

The material of grid film layer 102 is silicon nitride, the thickness of grid film layer 102 is 1-1.5 microns, the magnitude of tensile stress of grid film layer 102 is 100-400 Mpa, the surface roughness of grid film layer 102 is less than 20 nanometers, the deformation caused by the dead weight of the grid film layer is effectively overcome while ensuring the mechanical stability, mechanical strength and corrosion resistance of the subsequent suspended grid film layer, and an opening with a small size can be formed in the grid film layer with the thickness of 1-1.5 microns very simply and conveniently, the grid film layer is prevented from being damaged when being too thin in subsequent process treatment, and meanwhile, the substrate is prevented from being warped due to the fact that the stress is too large when the thickness is too thick.

The grid film layer with uniform thickness and large tensile stress can be simply and conveniently formed by the furnace tube low-pressure chemical vapor deposition process, in one embodiment, the temperature of the low-pressure furnace tube deposition process for forming the grid film layer 102 which covers the front surface, the back surface and the side surface of the substrate 101 and has tensile stress and is made of silicon nitride is more than 600 ℃, the pressure of a chamber is 0.2-7Torr, and the gas comprises silane gas and NH ₃ Wherein the silane gas is SiH ₄ 、SiH ₂ Cl ₂ 、Si ₂ H ₆ One or more of the above processes can simultaneously form the grating film 102 on the entire surface (front, back and side) of the substrate 101 when the grating film is formed by the low-pressure furnace tube deposition process, so that the thickness of the formed grating film is uniform, the surface roughness is low, the tensile stress at each position of the film is uniform, and the stress is easy to control.

The process for etching the grating film layer 102 is dry etching. The dry etching process may be an anisotropic plasma etching process. It should be noted that, since the subsequent UV light and laser light need to be transmitted through the substrate 101 on both sides of the groove 111, so as to irradiate the UV glue formed between the substrate and the substrate, the portions of the grating film layers on the front and back surfaces of the substrate corresponding to the positions where the UV light and laser light pass through may also be removed.

The evaporation shadow mask shown in fig. 7 is a shadow mask when a blue, red, green microcavity length-adjusting layer or a blue, red, green organic light-emitting material layer is formed.

It should be noted that, the structures of the evaporation shadow masks used as masks for forming different organic material layers (such as hole transport layer, blue light, red light, green light microcavity length-adjusting layer, blue light, red light, green light organic light emitting material layer, electron transport layer, cathode) are basically the same, and the most important difference is that there are differences in the number, positions and sizes of the openings 108 formed in the grid film layer 102, that is, different evaporation shadow masks can be designed according to the requirements of different organic material layers. That is, the structure of the vapor deposition shadow mask in the case of forming the hole transport layer, the electron transport layer, and the cathode is basically the same as that of the vapor deposition shadow mask shown in fig. 7.

Referring to fig. 8 and 9, fig. 8 and 9 are schematic structural diagrams of a substrate according to an embodiment of the present invention, wherein fig. 8 is a schematic structural diagram of a cross section of fig. 9 along a cutting line AB, and referring to fig. 8 and 9, a substrate 301 is provided, where a front surface of the substrate 301 includes a pixel region 31 and a bank region 32 surrounding the pixel region 31; part of the surface of the bank region 32 of the substrate 301 forms a

bank structure

302, 402, 502.

The substrate 301 serves as a carrier for forming the OLED, and the substrate includes a front surface and an opposite back surface, and as shown in fig. 8, the upper surface of the substrate 301 serves as the front surface, and the lower surface of the substrate 301 serves as the back surface.

The front surface of the substrate 301 includes a pixel region 31 and a bank region 32 surrounding the pixel region 31, the pixel region 31 is used for forming a light emitting unit and a corresponding circuit of the OLED, and the bank region 32 is used for forming a bank structure.

At least one of the substrate 301 and the substrate 101 (see fig. 7) is a transparent material, and the other material may be a transparent material or an opaque material. In an embodiment, the material of the substrate 301 is glass or a semiconductor material or other suitable materials, the glass is a transparent material, the material of at least one of the substrate 301 and the substrate 101 (refer to fig. 7) is glass, and a UV glue is formed subsequently, so that UV light and laser can irradiate the UV glue through the transparent substrate 301 and/or the substrate 101, so that the UV glue is cured (bonded) and debonded, so as to achieve temporary bonding and separation after temporary bonding of the substrate 301 and the evaporation shadow mask (substrate 101), and prevent the UV light and the laser from affecting the formed OLED light emitting unit during irradiation. The transparent material may be other transparent materials than glass.

In a specific embodiment, the material of the substrate 301 may be selected to be glass, and the material of the corresponding substrate 101 may be glass; or the material of the substrate 301 is glass, and the material of the corresponding substrate 101 is a semiconductor material; or the material of the base plate 301 is a semiconductor material, and the material of the corresponding substrate 101 is glass.

The

cofferdam structures

302, 402 and 502 play a role of supporting the base plate 301 and the substrate 101 when the base plate 301 and the substrate 101 are temporarily bonded, so that the base plate 301 and the substrate 101 keep a constant distance when bonded, and a light-emitting unit with a preset thickness and a good appearance is formed on the surface of the pixel region 31 of the base plate 301 through an evaporation process; on the other hand, the

dam structures

302, 402, 502 can limit the subsequently formed UV glue between the substrate 301 and the substrate 101 outside the dam structures, thereby preventing the subsequently formed UV glue from spreading to the pixel region 31 of the substrate 301 to affect the formation of the light emitting unit.

In an embodiment, the material of the

dam structures

302, 402, 502 is SiO ₂ SiN, SiON, TiN, TaN and metallic materials (such as Cu, Al, W). In one embodiment, the thickness of the

dam structures

302, 402, 502 is 0.4-0.6 μm.

In an embodiment, the forming process of the cofferdam structure 302 is: forming a cofferdam structure film layer (not shown in the figure) on the surface of the substrate 301; forming a patterned photoresist layer (not shown in the figure) on the surface of the cofferdam structure thin film layer; etching the cofferdam structure film by taking the graphical photoresist layer as a mask, and forming a cofferdam structure on part of the surface of the cofferdam structure area of the substrate; and removing the patterned photoresist layer.

In this embodiment, the dam structures 302, 402, and 502 are U-shaped or V-shaped structures that are poured on the surface of the substrate 301, and the openings of the U-shaped or V-shaped structures face the edge direction of the substrate 301, and during the subsequent dispensing process, the UV glue is filled in the U-shaped or V-shaped openings of the first dam structure 302, the second dam structure 402, and the third dam structure 502, so as to better prevent the UV glue from flowing to the pixel region of the substrate during the formation process and after the debonding process of the UV glue, and prevent the UV glue from contaminating the formed light emitting units; and because the UV glues inject in "U" type form or "V" type form opening for the combination ability of UV glue and cofferdam structure increases, when breaking bonding, the UV glue can be intact keep in "U" type form or "V" type form opening and can not outwards spill over, make the existence of UV glue after breaking bonding can not influence the bonding precision and the stability of follow-up step, therefore can need not carry out under the condition of extra UV glue washing step, directly carry out the manufacturing process of follow-up second luminescence unit and third luminescence unit, thereby saved the time of technology, improved the preparation efficiency. It should be noted that the first cofferdam structure, the second cofferdam structure and the third cofferdam structure may have other shapes, such as a rectangle shape, a concave shape with an outward opening, etc.

In other embodiments, the cofferdam structure may be an annular structure or a discrete block structure.

In this embodiment, the cofferdam structure is divided into three types of cofferdam structures, including a plurality of first cofferdam structures 302, second cofferdam structures 402 and third cofferdam structures 502, and the plurality of first cofferdam structures 302, second cofferdam structures 402 and third cofferdam structures 502 are alternately distributed and surround the pixel area 31. When the plurality of first bank structures 302, second bank structures 402, and third bank structures 502 are formed on the substrate 301, and the plurality of first bank structures 302, second bank structures 402, and third bank structures 502 are alternately arranged to surround the pixel region 31, the substrate and the vapor deposition shadow masks (the first vapor deposition shadow mask, the second vapor deposition shadow mask, the third vapor deposition shadow mask, the plurality of first bank structures 302, the second bank structures 402, and the third bank structures 502 are required to be sequentially formed when the organic material layer (light-emitting unit) emitting light of different colors (red light, green light, and blue light) and the organic material layer emitting light of different colors (red light, green light, and blue light) are sequentially formed, the organic material layer emitting light of different colors, the organic material layer emitting light of red light, and the organic material layer emitting light of blue light are formed, the second vapor deposition shadow mask, the organic material layer emitting light of green light, and the organic material layer emitting light of red light are required to be sequentially formed when the substrate and the organic material layer emitting light is formed on the substrate and the organic light-emitting device, Second vapor deposition shadow mask or third vapor deposition shadow mask) is bonded and debonded three times, each bonding only needs to form UV glue between the substrate outside the corresponding one of the dam structures (first dam structure 302, second dam structure 402 or third dam structure 502) and the corresponding vapor deposition shadow mask (one of the first vapor deposition shadow mask, second vapor deposition shadow mask and third vapor deposition shadow mask), specifically, in the first bonding (for example, in the case of blue organic material layer), only the UV glue is formed outside the first dam structure, no UV glue is formed outside the second dam structure and the third dam structure, in the corresponding second bonding (for example, in the case of green organic material layer), only the UV glue is formed outside the second dam structure, in the third bonding (for example, in the case of red organic material layer), only the UV glue is formed outside the third dam structure, therefore, after each debonding step, the next bonding step can be directly carried out without additionally adopting a cleaning process to remove the residual UV glue on the substrate after the bonding is released, so that the process time is saved, and the OLED manufacturing efficiency is improved. It should be noted that in other embodiments, the cofferdam structure may comprise only one type.

With continued reference to fig. 1, the alignment unit of the temporary bonding chamber 220 employs an optical alignment system for aligning the openings 108 of the grid film layer 101 on the evaporation shadow mask to the positions of the substrate 301 where the organic material layer is required. The alignment unit may adopt an existing optical alignment system for aligning two targets. In this embodiment, the plurality of temporary bonding chambers 220 (or the alignment units of the temporary bonding chambers) have the same alignment precision, the temporary bonding chambers 220 can meet the alignment bonding between different evaporation shadow masks and substrates to form temporary bonding units, and the temporary bonding chambers 220 and the process treatment chambers 210 are separated in this application, so that when an OLED panel is manufactured, in order to meet the process requirements, the OLED panel manufacturing system of this application can easily convert the process treatment chamber forming one organic material layer into the process treatment chamber forming another organic material layer by only changing the material of the evaporation source in the process treatment chamber, thereby effectively improving the process adaptability of the OLED panel manufacturing equipment.

In other embodiments, the temporary bonding chambers 220 (or the alignment units of the temporary bonding chambers) may have different alignment accuracies, for example, the alignment accuracy of some temporary bonding chambers 220 may be relatively higher, and the alignment accuracy of some temporary bonding chambers may be relatively lower, so as to achieve reasonable and effective configuration of the temporary bonding chambers 220 while meeting the requirement of OLED panel manufacturing.

The first clamping unit may include a plurality of mechanical walls and/or suction cups having a plurality of degrees of freedom (the plurality of mechanical walls and/or suction cups may move up and down, left and right, tilt, or rotate).

The first clamping unit not only can fix the substrate and the evaporation shadow mask, but also can enable the surface of the evaporation shadow mask with a cofferdam structure on the substrate to be in contact and joint

The dispensing unit at least comprises a spray head and a position adjusting unit connected with the spray head, UV glue is sprayed out from the spray head, and the position adjusting unit is used for adjusting the position of the spray head.

In this embodiment, the UV glue 303 is a UV glue that generates a glue connection reaction when irradiated by UV light to bond the substrate and the evaporation shadow mask, and fuses glue molecules to debond the substrate and the evaporation shadow mask when irradiated by laser light, so that the temporary bonding and debonding steps of the substrate 301 and the substrate 101 (evaporation shadow mask) can be conveniently and rapidly implemented, so that after one organic material layer is formed on the substrate, another organic material layer can be formed by using similar steps, and the separated evaporation shadow mask can be repeatedly utilized after being cleaned.

In one embodiment, the wavelength of the UV light is greater than or equal to 365nm, and can be 365nm and 395nm, and the irradiation energy is greater than 1000mj/cm ² (milliJoule per square centimeter), which may be 1000mj/cm ² 、1500mj/cm ² 、2000mj/cm ² The UV light has low waveband energy, has small excitation on the chemical potential energy of the organic light-emitting material, does not reduce the service life of an OLED device, and can obtain reliable UV bonding performance.

In one embodiment, the dispensing process of filling the UV paste 303 is performed simultaneously with the UV light irradiation for curing the UV paste, so as to improve the precision in bonding and prevent the contamination of the pixel region by the UV paste. In other embodiments, the dispensing process may be performed first, followed by the UV irradiation process.

The UV light irradiation unit at least comprises a UV light emission unit and a light intensity adjusting unit, the UV light emission unit is used for generating UV light, and the light intensity adjusting unit is used for adjusting the intensity of the UV light irradiating the UV glue.

Therefore, in the embodiment of the invention, when the temporary bonding chamber is separated from the process treatment chamber, the alignment bonding of the evaporation shadow mask and the substrate to form the temporary matching unit can be completed outside the process treatment chamber, the formed temporary matching unit has high firmness through UV glue bonding, and the transmission can be conveniently realized through the transmission chamber and the cluster operation chamber, so that the alignment of the evaporation shadow mask and the substrate and the evaporation process can be separately carried out, the process treatment chamber for forming a certain organic material layer can be easily transformed into the process treatment chamber for forming another organic material layer, the process adaptability of OLED panel manufacturing equipment is improved, and the alignment bonding of the evaporation shadow mask of a non-metal material and the substrate and the alignment bonding of the evaporation shadow mask of a metal material and the substrate can be realized through the temporary bonding chamber in a UV glue bonding mode, and the debonding chamber can conveniently realize the separation of the evaporation shadow mask and the substrate through laser irradiation.

The storage unit is used for storing the evaporation shadow masks, the number of the evaporation shadow masks stored in the storage unit is multiple, and the types of the evaporation shadow masks stored in the storage unit can be one or more.

The OLED panel manufacturing system may further include a recycling chamber for recycling the evaporation mask separated in the debonding chamber, cleaning and drying the recycled evaporation mask, and transferring the cleaned and dried evaporation mask to the temporary bonding chamber 220 for storage. The OLED panel manufacturing system may further include a main control unit and a plurality of sub-control units, where the main control unit is at least configured to send a control instruction to the plurality of sub-control units, and the plurality of sub-control units are configured to control operations of the chambers (for example, each transfer chamber, each process chamber, each temporary bonding chamber, each de-bonding chamber, and each recovery chamber have respective sub-control units).

Referring to fig. 1 and 10-12 in combination, a schematic view of the temporary mating structures formed in a certain temporary bonding chamber 230 is shown.

Referring to fig. 10, after the substrate 301 is transferred to the temporary bonding chamber 230, the first clamping unit clamps the substrate 301 and the evaporation shadow mask such that the front surface of the substrate 301 is opposite to the front surface of the first evaporation shadow mask, the alignment unit aligns the substrate 301 with the first evaporation shadow mask, the first clamping unit can enable the substrate 301 and the evaporation shadow mask during alignment, and after alignment, the first clamping unit enables the cofferdam structure 302 on the substrate 301 to contact and fix the evaporation shadow mask.

Next, referring to fig. 11, the dispensing unit discharges UV paste, fills UV paste 303 between the substrate 301 and the vapor deposition shadow mask, and fills UV paste 303 between the substrate 301 and the vapor deposition shadow mask outside the bank structure 302.

In one embodiment, the first clamping unit may rotate the substrate 301 and the evaporation shadow mask together while the nozzle of the dispensing unit remains stationary during filling the UV paste 303.

In another embodiment, the nozzle head of the dispensing unit may rotate along the outside of the substrate 301 and the evaporation shadow mask while the substrate 301 and the evaporation shadow mask remain stationary while the UV paste 303 is filled.

Next, referring to fig. 12, the UV light irradiation unit is configured to emit UV light 304, irradiate UV paste 303 filled between the substrate 301 and the evaporation shadow mask, cure the UV paste 303, and bond the substrate 301 and the evaporation shadow mask together to form a temporary mating structure.

With continued reference to fig. 1, the transfer chamber 220 includes at least a transfer arm or transfer stage that can have multiple degrees of freedom (up and down, left and right, and rotation).

The cluster manipulation chamber 200 may include at least a transfer arm that may have multiple degrees of freedom (up and down, left and right, and rotation).

The plurality of process chambers 210 are used to form an organic material layer on the substrate of the provisional mating unit, and the process chambers 210 may be used to form a hole transport layer, a blue light microcavity length adjusting layer, a red light microcavity length adjusting layer, a green light microcavity length adjusting layer, a blue light organic light emitting material layer, a red light organic light emitting material layer, a green light organic light emitting material layer, an electron transport layer, a cathode, or other suitable organic material layers. The hole transport layer, the blue light microcavity length-adjusting layer, the red light microcavity length-adjusting layer, the green light microcavity length-adjusting layer, the blue light organic light-emitting material layer, the red light organic light-emitting material layer, the green light organic light-emitting material layer, the electron transport layer and the cathode are all organic materials, and all the organic materials are different.

The debonding chamber 240 includes a laser irradiation unit for emitting laser to irradiate the cured UV glue in the temporary mating structure and a second clamping unit for clamping the temporary mating structure and separating the substrate formed with the organic material layer from the evaporation shadow mask after the laser irradiates the cured UV glue.

In an embodiment, the laser 312 emitted by the laser irradiation unit is picosecond laser with a pulse frequency of 100-.

The second clamping unit may include a plurality of mechanical walls and/or suction cups having a plurality of degrees of freedom (the plurality of mechanical walls and/or suction cups may move up and down, left and right, tilt, or rotate).

Referring to fig. 1, 13 and 14 in combination, the temporary matching unit formed with the organic material layer is transferred into the de-bonding chamber 240, the laser irradiation unit in the de-bonding chamber 240 emits laser light 312 to irradiate cured UV paste 303 in the temporary matching structure, and the second clamping unit clamps the temporary matching structure and separates the substrate 301 formed with the organic material layer from the evaporation shadow mask after the laser light 312 irradiates the cured UV paste.

The process chamber 210 described with reference to fig. 1 and 15 in combination comprises at least one evaporation source 11, said evaporation source 11 being capable of generating a gaseous organic material when heated, such that after the temporary counter-structure has been transferred to the process chamber 210, the gaseous organic material diffuses through the openings 108 formed in the evaporation shadow mask to the surface of the substrate 301, forming an organic material layer 305.

In the embodiment, one process chamber 210 has one evaporation source 11 therein, and the material of the evaporation source depends on the material of the organic material layer to be formed, for example, when a hole transport layer is to be formed, the material of the evaporation source 11 is an organic material corresponding to the material of the hole transport layer, and when a blue organic light emitting material layer is to be formed, the material of the evaporation source 11 is an organic material corresponding to the material of the blue organic light emitting material layer.

When the OLED panel manufacturing system is used for manufacturing an OLED panel and a certain cluster operation chamber shown in FIG. 1 is taken as a target cluster operation chamber, a transfer chamber connected with the front end of the target cluster operation chamber is a front end transfer chamber, a transfer chamber connected with the rear end of the target cluster operation chamber is a rear end transfer chamber, the substrate and the evaporation shadow mask form a temporary matching structure in a temporary bonding chamber connected with the front end transfer chamber, and the temporary matching structure is transferred to the target cluster operation chamber through the front end transfer chamber; the target cluster operation chamber transfers the temporary pairing structure to a corresponding process chamber; forming an organic material layer on a substrate in a process chamber; the back end transfer chamber transfers the temporary bonding unit formed with the organic material layer from the target cluster operating chamber to a de-bonding chamber connected to the back end transfer chamber, in which the substrate formed with the organic material layer and the evaporation shadow mask are separated. In the present application, the front end is up to the end of the substrate or the temporary mating structure, and the rear end is the end of the substrate or the temporary mating structure.

In one embodiment, when the number of the process chambers connected to each cluster operation chamber 200 is greater than or equal to 2, the process chambers connected to each cluster operation chamber 200 may be the same process chamber or different process chambers, or at least some of the process chambers may be the same number of process chambers, and some of the process chambers may be the same number of process chambers. The process chambers connected to different cluster operation chambers 200 may be the same process chamber or different process chambers, or at least some of the process chambers connected to different cluster operation chambers 200 may be the same process chamber (the same or different process chambers refer to the same or different organic material layers formed), which may be specifically classified into the following cases:

in one embodiment, each cluster operation chamber (200a-200e) is connected to a plurality of identical process chambers, and the process chambers connected to different cluster operation chambers (200a-200e) are different process chambers, specifically referring to fig. 2, such as 5

cluster operation chambers

200a, 200b, 200c, 200d, 200e shown in fig. 2, each cluster operation chamber (200a-200e) is connected to 4 identical process chambers (e.g., cluster operation chamber 200a is connected to 4 identical process chambers 210a, cluster operation chamber 200b is connected to 4 identical process chambers 210b in fig. 2, the identical process chambers in fig. 2 are identical process chambers, e.g., four identical process chambers 210a and four identical process chambers 210b are identical process chambers), while the process chambers connected to different cluster operation chambers 200 are different (e.g., the

process chambers

210a, 210b, 210c, 210d, 210e shown in figure 2 are different process chambers and the process chambers connected to cluster operation chamber 200a and cluster operation chamber 200b are different).

The same process chamber means that the same organic material layer may be formed, and the different process chambers means that the organic material layer is formed in the process chamber differently from other process chambers.

The

process chambers

210a, 210b, 210c, 210d, 210e are used to form different layers of organic material. In one embodiment, the organic material layers used to form the

process chambers

210a, 210b, 210c, 210d, 210e include a hole transport layer, a blue microcavity length tuning layer, a red microcavity length tuning layer, a green microcavity length tuning layer, a blue organic light emitting material layer, a red organic light emitting material layer, a green organic light emitting material layer, an electron transport layer, or a cathode. The process chamber can be configured to form the organic material layer accordingly according to actual requirements.

When one cluster operation chamber in FIG. 2 is taken as a cluster operation chamber, a plurality of process treatment chambers connected with a target cluster operation chamber are the same, a transfer chamber connected with the front end of the target cluster operation chamber is a front end transfer chamber, a transfer chamber connected with the rear end of the target cluster operation chamber is a rear end transfer chamber, a plurality of temporary matching structures are sequentially formed in a temporary bonding chamber connected with the front end transfer chamber, the plurality of temporary matching structures are sequentially transferred into a plurality of process treatment chambers connected with the target cluster operation chamber through the front end transfer chamber and the target cluster operation chamber, organic material layers are correspondingly formed on the surfaces of substrates of the plurality of temporary matching structures, and a temporary bonding unit formed with the organic material layers is transferred from the target cluster operation chamber to a de-bonding chamber connected with the rear end transfer chamber by the rear end transfer chamber, in the de-bonding chamber, the substrate with the organic material layer is separated from the evaporation shadow mask, so that the substrate can form different organic light-emitting material layers through different temporary bonding chambers, cluster operation chambers, process treatment chambers and de-bonding chambers in a flowing mode in an OLED panel manufacturing system to realize sequential batch manufacturing of OLED panels, and the process treatment chamber for forming one organic material layer is easily transformed into the process treatment chamber for forming another organic material layer in the OLED panel manufacturing system because the temporary bonding chambers and the process treatment chambers are separated, thereby improving the process adaptation performance of OLED panel manufacturing equipment.

Taking the process of forming a specific OLED panel by using the OLED panel manufacturing system shown in fig. 2 as an example, the transfer chamber 220a receives an external substrate, the transfer chamber 220a transfers the substrate into the temporary bonding chamber 230 connected to the transfer chamber 220a, and the substrate and the first evaporation shadow mask are bonded in alignment in the temporary bonding chamber 230 to form a first temporary mating structure; the transfer chamber 220a and the cluster operation chamber 200a transfer the first temporary mating structure to the process chamber 210a, forming a hole transport layer on the substrate exposed by the first evaporation shadow mask by evaporation; the cluster operation chamber 200a and the transfer chamber 220b transfer the first temporary pairing structure formed with the hole transport layer to the de-bonding chamber 240 connected to the transfer chamber 220b, in which the substrate formed with the hole transport layer is separated from the first evaporation shadow mask in the de-bonding chamber 240; the transfer chamber 220b transfers the substrate formed with the hole transport layer to a temporary bonding chamber 230 connected to the transfer chamber 220b, and the substrate and the second evaporation shadow mask are bonded in alignment in the temporary bonding chamber 230 to form a second temporary mating structure; the transfer chamber 220b and the cluster operation chamber 200b transfer the second temporary mated structure to the process chamber 210b, and form a blue organic light emitting material layer on a portion of the surface of the hole injection layer exposed by the second evaporation shadow mask by evaporation; the cluster operation chamber 200b and the transfer chamber 220c transfer the second temporary pairing structure on which the blue organic light emitting material layer is formed to the de-bonding chamber 240 connected to the transfer chamber 220c, in which the substrate on which the blue organic light emitting material layer is formed is separated from the second evaporation shadow mask in the de-bonding chamber 240; the transfer chamber 220c transfers the substrate on which the blue organic light emitting material layer is formed into a temporary bonding chamber 230 connected to the transfer chamber 220c, and the substrate and the third evaporation shadow mask are bonded in alignment in the temporary bonding chamber 230 to form a third temporary mating structure; the transfer chamber 220c and the cluster operation chamber 200c transfer the third provisional mated structure to the process chamber 210c, and form a green organic light emitting material layer by evaporating a portion of the hole injection layer surface on one side of the blue organic light emitting material layer; the cluster operation chamber 200c and the transfer chamber 220d transfer the third temporary paired structure for forming the green organic light emitting material layer to the de-bonding chamber 240 connected to the transfer chamber 220d, in which the substrate on which the green organic light emitting material layer is formed is separated from the third evaporation shadow mask in the de-bonding chamber 240; the transfer chamber 220d transfers the substrate on which the green organic light emitting material layer is formed into a temporary bonding chamber 230 connected to the transfer chamber 220d, and the substrate and the fourth evaporation shadow mask are bonded in alignment in the temporary bonding chamber 230 to form a fourth temporary mating structure; the transfer chamber 220d and the cluster operation chamber 200d transfer the fourth provisional mating structure to the process chamber 210d, and form a red organic light emitting material layer by vapor deposition on a portion of the hole injection layer surface at one side of the green organic light emitting material layer; the cluster operation chamber 200d and the transfer chamber 220e transfer the fourth temporary pairing structure of the organic light emitting material layer on which the red organic light emitting material layer is formed to the de-bonding chamber 240 connected to the transfer chamber 220e, in which the substrate on which the red organic light emitting material layer is formed is separated from the fourth evaporation shadow mask in the de-bonding chamber 240; the conveying chamber 220e conveys the substrate on which the red organic light emitting material layer is formed into a temporary bonding chamber 230 connected with the conveying chamber 220e, and a fifth temporary matching structure is formed by the substrate and a fifth evaporation shadow mask in a contraposition bonding mode in the temporary bonding chamber 230; the transfer chamber 220e and the cluster operation chamber 200e transfer the fifth provisional mating structure to the process chamber 210e, and form an electron transfer layer covering the surfaces of the red, green, and blue organic light emitting material layers by evaporation; the cluster operation chamber 200e and the transfer chamber 220f transfer the fifth temporary paired structure of the organic light emitting material layer on which the electron transport layer is formed to the de-bonding chamber 240 connected to the transfer chamber 220f, in which the substrate on which the electron transport layer is formed is separated from the fifth evaporation shadow mask in the de-bonding chamber 240, and the transfer chamber 220f sends the substrate on which the electron transport layer is formed out of the OLED panel manufacturing system.

It should be noted that, in the above process, the plurality of substrates may be subjected to streamlined manufacturing by the OLED panel manufacturing system at one time.

In another embodiment, each cluster operation chamber is connected to a plurality of different process chambers (the plurality of different process chambers means that at least one process chamber of the plurality of process chambers is different from other process chambers, for example, when a cluster operation chamber is connected to two process chambers, two process chambers are different, for example, when a cluster operation chamber is connected to three process chambers, one case is that the three process chambers are different, and the other case is that two process chambers are the same, and two other process chambers are different), and the process chambers connected to different cluster operation chambers are different process chambers.

In another embodiment, each cluster operation chamber is connected to a plurality of different process chambers (the plurality of different process chambers means that at least one process chamber of the plurality of process chambers is different from other process chambers, for example, when a cluster operation chamber is connected to two process chambers, two process chambers are different, for example, when a cluster operation chamber is connected to three process chambers, one case is that the three process chambers are different, and the other case is that two process chambers are the same, and two other process chambers are different), and the process chambers connected to different cluster operation chambers may be partially the same.

In another embodiment, some of the plurality of process chambers connected to some of the cluster operation chambers have the same number of process chambers, some of the plurality of process chambers have different number of process chambers, and the other some of the cluster operation chambers are all connected to the same process chambers, and the process chambers connected to different cluster operation chambers are different process chambers, specifically referring to fig. 3, such as 6 cluster operation chambers (200a-200f) shown in fig. 3, and each of the first five cluster operation chambers (200a-200e) (from left to right in fig. 3) is connected to 4 process chambers, wherein two of the process chambers are used for forming one organic material layer, and the other two process chambers are used for another organic material layer (the process chamber connected to the first cluster operation chamber 200a from left to right in fig. 3 includes two process chambers 210a and two process chambers Chamber 210b, the process chambers connected to the second cluster operation chamber 200b include two process chambers 210c and two process chambers 210d, wherein the process chambers with the same reference number in fig. 3 are the same process chamber and the process chambers with different reference numbers are the same process chamber, for example, the 2 process chambers with the reference number 210a are the same process chamber, the two process chambers with the reference number 210b are the same process chamber, the process chamber with the reference number 210a is different from the process chamber with the reference number 210b, the sixth cluster operation chamber 200f is connected to the two same process chambers 210j, and the process chambers connected to the different cluster operation chambers (200a-200f) are different (for example, the process chambers 210a, 210b, 210c, 210d, 210e, 210f, 210d, 210f shown in fig. 3), 210g, 210h, 210i, 210j are different process chambers).

The

process chambers

210a, 210b, 210c, 210d, 210e, 210f, 210g, 210h, 210i, 210j, 210k are used to form different layers of organic material. In one embodiment, the organic material layers used to form the

process chambers

210a, 210b, 210c, 210d, 210e, 210f, 210g, 210h, 210i, 210j include a hole transport layer, a blue microcavity length tuning layer, a red microcavity length tuning layer, a green microcavity length tuning layer, a blue organic light emitting material layer, a red organic light emitting material layer, a green organic light emitting material layer, an electron transport layer, or a cathode. The process chamber can be configured to form the organic material layer accordingly according to actual requirements.

When one cluster operation chamber of 200a-200e in fig. 3 is taken as a cluster operation chamber, a plurality of process treatment chambers connected with a target cluster operation chamber are different process treatment chambers, a transfer chamber connected with the front end of the target cluster operation chamber is a front end transfer chamber, a transfer chamber connected with the rear end of the target cluster operation chamber is a rear end transfer chamber, a temporary matching structure is formed in a temporary bonding chamber connected with the front end transfer chamber, the temporary matching structure is firstly transferred into one process treatment chamber connected with the target cluster operation chamber through the front end transfer chamber and the target cluster operation chamber, an evaporation shadow mask is taken as a mask, a first organic material layer is formed on the surface of a substrate of the temporary matching structure, and then the temporary matching structure formed with the first organic material layer is transferred into the other process treatment chamber connected with the target cluster operation chamber through the target cluster operation chamber, forming a second organic material layer on the surface of the first organic material layer of the substrate by using the same evaporation shadow mask as a mask; then the rear-end transfer chamber transfers the temporary bonding unit formed with the second organic material layer from the target cluster operation chamber to a de-bonding chamber connected with the rear-end transfer chamber, in the de-bonding chamber, the substrate formed with the second organic material layer and the evaporation shadow mask are separated, so that the streamlined process of forming at least two organic material layers on a plurality of substrates is realized when the OLED panel is manufactured, and only one alignment and bonding process is needed when the two organic material layers are formed, thereby saving the process time, and in the OLED panel manufacturing system, because the temporary bonding chamber and the process chamber are separated, the process chamber forming one organic material layer is easily modified into the process chamber forming another organic material layer (for example, the process chamber 210c in FIG. 3 is originally used for forming the blue microcavity lengthening layer, the process chamber 210c can be modified into the cavity transport layer), the process adaptability of OLED panel manufacturing equipment is improved.

In a specific embodiment, with continued reference to fig. 3, the cluster operation chambers include a first cluster operation chamber 200a, a second cluster operation chamber 200b, a third cluster operation chamber 200c, a fourth cluster operation chamber 200d, a fifth cluster operation chamber 200e, and a sixth cluster operation chamber 200f, which are sequentially adjacent to each other, the transfer chambers include a first transfer chamber 220a, a second transfer chamber 220b, a third transfer chamber 220c, a fourth transfer chamber 220d, a fifth transfer chamber 220e, a sixth transfer chamber 220f, and a seventh transfer chamber 220g, the first transfer chamber 220a is connected to the first cluster operation chamber 200a, the second transfer chamber 220b is connected to the first cluster operation chamber 200a and the second cluster operation chamber 200b, the third transfer chamber 220c is connected to the second cluster operation chamber 200b and the third cluster operation chamber 200c, the fourth transfer chamber 220d is connected to the third cluster operation chamber 200c and the fourth cluster operation chamber 200d, the fifth transfer chamber 220e connects the fourth cluster of operation chambers 200d and 200e, the sixth transfer chamber 220f connects the fifth cluster of operation chambers 200e and 200f, and the seventh transfer chamber 220g connects the sixth cluster of operation chambers 200 f; each transfer chamber (second transfer chamber 220b to sixth transfer chamber 220f) between adjacent cluster operation chambers is connected with at least one temporary bonding chamber 230 and at least one de-bonding chamber 240, two transfer chambers at both ends are connected with at least one temporary bonding chamber and the other is connected with at least one de-bonding chamber, the first transfer chamber 220a is connected with at least one temporary bonding chamber 230, and the seventh transfer chamber 220g is connected with at least one de-bonding chamber 240 (in another case, both transfer chambers at both ends may be connected with at least one temporary bonding chamber 230 and at least one de-bonding chamber 240, i.e., both first transfer chamber 220a and seventh transfer chamber 220g may be connected with at least one temporary bonding chamber 230 and at least one de-bonding chamber 240); the process chambers connected to the first cluster of operating chambers 200a include at least one P-type doped hole transport layer chamber 210a and at least one common hole transport layer chamber 210b, the process chambers connected to the second cluster of operating chambers 200b include at least one blue microcavity adjusting layer chamber 210c and at least one blue organic light emitting material layer chamber 210d, the process chambers connected to the third cluster of operating chambers 200c include at least one green microcavity adjusting layer chamber 210e and at least one green organic light emitting material layer chamber 210f, the process chambers connected to the fourth cluster of operating chambers 200d include at least one red microcavity adjusting layer chamber 210g and at least one red organic light emitting material layer chamber 210f, the process chambers connected to the fifth cluster of operating chambers 200d include at least one electron transport layer chamber 210h and at least one cathode layer chamber 210i, the process chambers connected to the sixth cluster of process chambers 200f include at least one blanket chamber 210 j.

In another embodiment, some of the plurality of process chambers connected to some of the cluster operation chambers may be the same process chambers, some of the plurality of process chambers may be different process chambers, and other of the plurality of cluster operation chambers may be the same process chambers, and the process chambers connected to different cluster operation chambers may be partially the same, specifically referring to fig. 4, such as 6 cluster operation chambers (200a-200f) shown in fig. 4, and 4 process chambers connected to each of the first five cluster operation chambers (200a-200e) (from left to right in fig. 4), wherein two of the process chambers are used for forming one organic material layer, and the other two process chambers are used for another organic material layer (the process chamber connected to the first cluster operation chamber 200a from left to right in fig. 4 includes two process chambers 210a and two process chambers 210b The process chambers connected to the second cluster operation chamber 200b include two process chambers 210c and two process chambers 210d, wherein the process chambers with the same reference number in fig. 4 are the same process chamber and the process chambers with different reference numbers are different, for example, the 2 process chambers with the reference number 210a are the same process chamber and the two process chambers with the reference number 210b are the same process chamber, the process chamber with the reference number 210a and the process chamber with the reference number 210b are different process chambers, the sixth cluster operation chamber 200f is connected to the two same process chambers 210j, and the process chambers connected to the different cluster operation chambers (200a-200f) may be partially the same (for example, the process chamber 210b connected to the first cluster operation chamber 200a and the process chamber 210b connected to the second cluster operation chamber 200b in fig. 4 are the same process chambers) .

In the fabrication process of the OLED panel, since the thicknesses of different organic material layers may be different, the time required to form an organic material layer having a greater thickness is longer, the shorter the time required to form the thinner organic material layers, when a number of substrates are subjected to a hydration process in an OLED panel manufacturing system, when a substrate is formed with a thicker layer of organic material in a process chamber, while other substrates form additional organic material layers of lower thickness in additional process chambers, after the organic material layer with a relatively thin thickness is formed, the organic material layer with a relatively thick thickness is still formed, therefore, the substrate corresponding to the thin organic material layer needs to wait for the formation of the substrate of the thick organic material layer in the corresponding process chamber, so that the process takt time of the whole system is affected, and the manufacturing efficiency is reduced. With the above OLED panel manufacturing system, since the process chambers connected to different cluster operation chambers may be partially the same, the organic material layer with a thicker thickness may be split into at least two layers with the same thickness, and the organic material layer with a corresponding thickness is correspondingly grown in different process chambers (for example, fig. 4 shows that the organic material layer with a part of thickness is grown in the process chamber 210b connected to the first cluster operation chamber 200a, and then the organic material layer with another part of thickness is grown in the process chamber 210b connected to the second cluster operation chamber 200 b), so that the growth time difference of the organic material layers in the process chambers is smaller or substantially the same, thereby reducing the influence of the growth of part of the organic material layer on the process takt time of the whole OLED manufacturing system.

In a specific embodiment, with continued reference to fig. 4, the cluster operation chambers include a first cluster operation chamber 200a, a second cluster operation chamber 200b, a third cluster operation chamber 200c, a fourth cluster operation chamber 200d, a fifth cluster operation chamber 200e, and a sixth cluster operation chamber 200f, which are sequentially adjacent to each other, the transfer chambers include a first transfer chamber 220a, a second transfer chamber 220b, a third transfer chamber 220c, a fourth transfer chamber 220d, a fifth transfer chamber 220e, a sixth transfer chamber 220f, and a seventh transfer chamber 220g, the first transfer chamber 220a is connected to the first cluster operation chamber 200a, the second transfer chamber 220b is connected to the first cluster operation chamber 200a and the second cluster operation chamber 200b, the third transfer chamber 220c is connected to the second cluster operation chamber 200b and the third cluster operation chamber 200c, the fourth transfer chamber 220d is connected to the third cluster operation chamber 200c and the fourth cluster operation chamber 200d, the fifth transfer chamber 220e connects the fourth cluster of operation chambers 200d and 200e, the sixth transfer chamber 220f connects the fifth cluster of operation chambers 200e and 200f, and the seventh transfer chamber 220g connects the sixth cluster of operation chambers 200 f; each transfer chamber (second transfer chamber 220b to sixth transfer chamber 220f) between adjacent cluster operation chambers is connected with at least one temporary bonding chamber 230 and at least one de-bonding chamber 240, two transfer chambers at both ends are connected with at least one temporary bonding chamber and the other is connected with at least one de-bonding chamber, the first transfer chamber 220a is connected with at least one temporary bonding chamber 230, and the seventh transfer chamber 220g is connected with at least one de-bonding chamber 240 (in another case, both transfer chambers at both ends may be connected with at least one temporary bonding chamber 230 and at least one de-bonding chamber 240, i.e., both the first transfer chamber 220a and the seventh transfer chamber 220g may be connected with at least one temporary bonding chamber 230 and at least one de-bonding chamber 240); the process chambers connected to the first cluster of operating chambers 200a include at least one P-type doped hole transport layer chamber 210a and at least one common hole transport layer chamber 210b, the process chambers connected to the second cluster of operating chambers 200b include at least one common hole transport layer chamber 210b and at least one blue organic light emitting material layer chamber 210d, the process chambers connected to the third cluster of operating chambers 200c include at least one green microcavity adjusting layer chamber 210e and at least one green organic light emitting material layer chamber 210f, the process chambers connected to the fourth cluster of operating chambers 200d include at least one red microcavity adjusting layer chamber 210g and at least one red organic light emitting material layer chamber 210f, the process chambers connected to the fifth cluster of operating chambers 200d include at least one electron transport layer chamber 210h and at least one cathode layer chamber 210i, the process chambers connected to the sixth cluster of process chambers 200f include at least one blanket chamber 210 j.

In another embodiment, referring to fig. 5, the cluster processing chambers 200 in the OLED panel manufacturing system are connected in a ring shape by corresponding transfer chambers 220, each transfer chamber 220 is connected to at least one temporary bonding chamber 230 and at least one debonding chamber 240, and each cluster processing chamber 200 is connected to at least one process chamber 210.

The definition of each chamber in the ring-shaped OLED panel manufacturing system is not described herein again, please refer to the corresponding partial definition of the serial OLED panel manufacturing system. The only difference between the annular OLED panel manufacturing system and the OLED panel manufacturing system is that two ends of the serial structure are respectively connected with one transmission chamber, and two ends of the annular structure only need one transmission chamber, namely the annular structure can save one transmission chamber and corresponding bonding-breaking chamber and temporary bonding chamber.

The annular OLED panel manufacturing system shown in fig. 5 can select one of the transfer chambers 220 to transmit and receive the substrate from the outside, and the manufacturing process of the substrate in the OLED panel manufacturing system is substantially the same as the manufacturing process in the OLED panel manufacturing system, and is not described herein again.

It should be noted that the transfer chambers at both ends of the OLED panel manufacturing system in the foregoing embodiments have one chamber for receiving the substrate from the outside and one chamber for sending the substrate to the outside. Each chamber can be provided with a corresponding vacuum unit as required, so that the vacuum of each chamber meets the requirements of the process, and each chamber can be provided with a window which can be closed and opened through control.

In another embodiment, referring to fig. 6, the OLED panel manufacturing system includes a cluster operation chamber 200, transfer chambers 220, process chambers 210, temporary bonding chambers 230, and de-bonding chambers 240, wherein,

the cluster operation chamber 200 is connected to at least one (at least one can represent one or more than one) process chamber 210;

the front section and the rear end of the cluster operation chamber 200 are respectively connected with at least one transfer chamber 220;

the transfer chamber connected to the front end of the cluster manipulation chamber 200 is connected to at least one temporary bonding chamber, and the transfer chamber connected to the rear end of the cluster manipulation chamber 200 is connected to at least one de-bonding chamber;

the temporary bonding chamber 230 is at least used for storing an evaporation shadow mask, and after the evaporation shadow mask is aligned with the substrate conveyed into the chamber, the substrate and the evaporation shadow mask are bonded together through UV glue to form a temporary matching structure;

the transfer chamber 220 is at least used to transfer substrates or temporary mating structures between the cluster manipulation chamber, the temporary bonding chamber and the debonding chamber;

the debonding chamber 240 is used at least to debond the substrate and the evaporation shadow mask by laser irradiation while transferring to the debonding chamber after forming the organic material layer on the substrate of the temporary counterpart structure, so that the substrate on which the organic material layer is formed and the evaporation shadow mask are separated.

It should be noted that, for the definition of each chamber in this embodiment, reference is made to the definition of the corresponding chamber in the foregoing embodiment, and details are not repeated here.

In one embodiment, the cluster tool 200 is connected to a plurality (2 or more) of process chambers 210, the cluster tool 200 is connected to a transfer chamber at the front end and the rear end, the transfer chamber 220 at the front end is connected to at least one temporary bonding chamber 230, and the transfer chamber 220 at the rear end is connected to at least one de-bonding chamber 240. The front end transfer chamber 220 is used for receiving a substrate transferred from the outside of the OLED panel manufacturing system and transferring the substrate to a temporary bonding chamber or a cluster operation chamber 200, the front end transfer chamber 220 is also used for transferring a temporary mating structure formed in the temporary bonding chamber to the cluster operation chamber 200, the cluster operation chamber 200 is used for transferring the substrate or the temporary mating structure to a corresponding process chamber 210, an organic material layer is formed on the substrate, the rear end transfer chamber 220 is used for transferring the temporary mating structure formed with the organic material layer to a de-bonding chamber 240, the substrate formed with the organic material and an evaporation shadow mask are separated in the de-bonding chamber 240, and the rear end transfer chamber 220 is also used for discharging the substrate formed with the organic material to the outside of the OLED panel manufacturing system. It should be noted that in other embodiments, the front end transfer chamber 220 may be connected to at least one de-bonding chamber 240 in addition to at least one temporary bonding chamber 230; the rear transfer chamber may be connected to at least one temporary bonding chamber 230 in addition to at least one de-bonding chamber 240, and at this time, the front transfer chamber may be a chamber for receiving an external substrate and may be a chamber for sending out a substrate after processing, and the rear transfer chamber may be a chamber for sending out a substrate after processing and may be a chamber for receiving an external substrate. Therefore, the above-mentioned OLED panel manufacturing system can satisfy the requirement of forming at least one organic material layer on the substrate, and can be divided into several cases, the first case: the plurality of process chambers 210 are the same process chamber, when the front end transfer chamber 220 is connected with at least one temporary bonding chamber 230, and the rear end transfer chamber 220 is connected with at least one de-bonding chamber 240, the front end transfer chamber receives an external substrate, the substrate is transferred into the temporary bonding chamber (in which an evaporation shadow mask is stored) connected with the front end transfer chamber, the substrate and the evaporation shadow mask stored in the temporary bonding chamber are aligned and bonded to form a temporary matching structure, the temporary matching structure is transferred to the process chambers through the front end transfer chamber and the cluster operation chamber 200 to form an organic material layer on the substrate, the temporary matching structure formed with the organic material layer is transferred to the de-bonding chamber connected with the rear end transfer chamber through the cluster operation chamber 200 and the rear end transfer chamber, and in the de-bonding chamber, the substrate with the organic material layer is separated from the evaporation shadow mask, and then the substrate with the organic material layer is conveyed to the outside by the rear-end conveying chamber, so that the flowing type processing of the organic material layer formed on the plurality of substrates is realized, and in the OLED panel manufacturing system, because the temporary bonding chamber and the process processing chamber are separated, the process processing chamber for forming one organic material layer is easily transformed into the process processing chamber for forming another organic material layer, and the process adaptability of OLED panel manufacturing equipment is improved.

In the second case: the plurality of process chambers 210 are the same process chamber, the front end transfer chamber 220 is connected with at least one temporary bonding chamber 230 and at least one de-bonding chamber 240, the rear end transfer chamber is connected with at least one de-bonding chamber 240, and when the at least one temporary bonding chamber 230 is connected, the front end transfer chamber and the rear end transfer chamber can simultaneously receive external substrates (a plurality of) and then transfer the substrates into the temporary bonding chamber (in which an evaporation mask is stored) connected with the front end transfer chamber (or the rear end transfer chamber), the substrates and the evaporation mask stored in the temporary bonding chamber form a temporary matching structure after being aligned and bonded, and the temporary matching structure is transferred to the plurality of process chambers through the front end transfer chamber (or the rear end transfer chamber) and the cluster operation chamber 200, forming an organic material layer on a substrate, and then transferring the temporary mated structure formed with the organic material layer to a debonding chamber connected to a front end transfer chamber (or a back end transfer chamber) through the cluster operation chamber 200 and the front end transfer chamber (or the back end transfer chamber), in the debonding chamber, the substrate on which the organic material layer is formed is separated from the evaporation shadow mask, and then the front-end transfer chamber (or the rear-end transfer chamber) transfers the substrate on which the organic material layer is formed to the outside, therefore, the treatment of forming the organic material layer on a plurality of substrates at the same time can be realized, the efficiency of the process is improved, and the OLED panel manufacturing system is separated from the process chamber due to the temporary bonding chamber, therefore, the process treatment chamber for forming one organic material layer can be easily transformed into the process treatment chamber for forming another organic material layer, and the process adaptability of the OLED panel manufacturing equipment is improved.

In a third case: the plurality of process chambers 210 include at least two different process chambers, for example, at least one first process chamber and at least one second process chamber, where the first process chamber and the second process chamber are used to form different organic material layers, the front transfer chamber 220 is connected to at least one temporary bonding chamber 230, and when the rear transfer chamber 220 is connected to at least one de-bonding chamber 240, the front transfer chamber receives an external substrate, and then the substrate is transferred into a temporary bonding chamber (in which an evaporation mask is stored) connected to the front transfer chamber, and after the substrate is aligned and bonded to the evaporation mask stored in the temporary bonding chamber, a temporary mating structure is formed, and the temporary mating structure is transferred to the first process chamber through the front transfer chamber and the cluster operation chamber 200, and the evaporation mask is used as a mask, forming a first organic material layer on a substrate by evaporation, then transferring a temporary mating structure formed with the first organic material layer to a second process chamber through a cluster operation chamber 200, forming a second organic material layer on the first organic material layer on the substrate by evaporation using the same evaporation shadow mask as a mask, then transferring the temporary mating structure formed with the second organic material layer to a de-bonding chamber connected to a rear end transfer chamber through the cluster operation chamber 200 and the rear end transfer chamber, separating the substrate formed with the second organic material layer from the evaporation shadow mask in the de-bonding chamber, then transferring the substrate formed with the second organic material layer to the outside by the rear end transfer chamber, in this case, implementing a flow process for forming at least two organic material layers on a plurality of substrates, and performing only one alignment and bonding process when forming two organic material layers, the time of the process is saved, and the temporary bonding chamber and the process treatment chamber are separated, so that the process treatment chamber for forming one organic material layer is easily transformed into the process treatment chamber for forming another organic material layer, and the process adaptability of the OLED panel manufacturing equipment is improved.

In a fourth case: the plurality of process chambers 210 include at least two different process chambers, for example, at least two first process chambers and at least two second process chambers, the first process chambers and the second process chambers are used for forming different organic material layers, the front-end transfer chamber 220 is connected to at least one temporary bonding chamber 230 and at least one de-bonding chamber 240, the rear-end transfer chamber is connected to at least one de-bonding chamber 240, and when the at least one temporary bonding chamber 230 is connected, the front-end transfer chamber and the rear-end transfer chamber can simultaneously receive external substrate(s), and then the substrate(s) are transferred into the temporary bonding chamber(s) connected to the front-end transfer chamber (or the rear-end transfer chamber) (where the evaporation shadow mask is stored), and the substrate(s) and the evaporation shadow mask stored in the temporary bonding chamber are aligned and bonded to form a temporary mating structure, transferring the provisional mating structure to a first process chamber through a front end transfer chamber (or a back end transfer chamber) and a cluster operation chamber 200 to form a first organic material layer on the substrate; then the provisional matched structure formed with the first organic material layer is transferred to a second process chamber through the cluster operation chamber 200, and a second organic material layer is formed on the first organic material layer on the substrate by evaporation using the same evaporation shadow mask as described above as a mask; then, the provisional mating structure on which the second organic material layer is formed is transferred to a de-bonding chamber connected to the front end transfer chamber (or the rear end transfer chamber) through the cluster operation chamber 200 and the front end transfer chamber (or the rear end transfer chamber), in the de-bonding chamber, the substrate on which the second organic material layer is formed is separated from the evaporation shadow mask, and then the front end transfer chamber (or the rear end transfer chamber) transfers the substrate on which the organic material layer is formed to the outside, so that the process of forming at least two organic material layers simultaneously for a plurality of substrates can be performed, the process efficiency can be improved, and the alignment and bonding processes can be performed only once when two organic material layers are formed, the process time can be saved, and the OLED panel manufacturing system can easily modify a process chamber for forming one organic material layer into a process chamber for forming another organic material layer because the provisional bonding chamber and the process chambers are separated, the process adaptability of OLED panel manufacturing equipment is improved.

Another embodiment of the present invention also provides an apparatus for forming a provisional mated unit, including: and the temporary bonding chamber is at least used for storing the evaporation shadow mask, and after the evaporation shadow mask is aligned with the substrate conveyed into the chamber, the substrate and the evaporation shadow mask are bonded together through UV glue to form a temporary matching structure.

In one embodiment, the temporary bonding chamber comprises: the device comprises an alignment unit, a first clamping unit, a dispensing unit, a UV light irradiation unit and a storage unit, wherein the alignment unit is used for aligning the substrate and the shadow mask; the first clamping unit is used for clamping the substrate and the evaporation shadow mask, and after the substrate and the evaporation shadow mask are aligned, the substrate and the evaporation shadow mask are in contact joint; the dispensing unit is used for spraying UV glue after the substrate is in contact with and attached to the evaporation shadow mask, and filling the UV glue between the substrate and the evaporation shadow mask; the UV light irradiation unit is used for emitting UV light, and filling UV glue between the substrate and the evaporation shadow mask for irradiation, so that the UV glue is cured, and the substrate and the evaporation shadow mask are bonded together to form a temporary matching structure; the storage unit is used for storing the evaporation shadow mask.

In an embodiment, the UV glue ejected by the dispensing unit is a UV glue that generates a glue connection reaction when irradiated by UV light to bond the substrate and the evaporation shadow mask, and fuses the glue connection molecules when irradiated by laser light to debond the substrate and the evaporation shadow mask.

In one embodiment, the UV light irradiation unit emits UV light with wavelength of 365nm or more and irradiation energy of 1000mj/cm or more ² 。

It should be noted that, regarding other definitions of the temporary bonding chamber, please refer to the definitions of the corresponding portions of the OLED panel manufacturing system, which are not described herein again.

Referring to fig. 16, an embodiment of the invention provides a structure of an OLED panel, which includes: a substrate 601, wherein a transparent conductive layer (the material of the transparent conductive layer is ITO) is provided on the surface of the substrate 601; a P-type doped hole transport layer 602 on the substrate 601; a common hole transport layer 603 on the surface of the P-type doped hole transport layer 602; a blue light microcavity adjusting layer 604 on a portion of the surface of the common hole transport layer 603; a green microcavity adjusting layer 605 located on a part of the surface of the common hole transport layer 603 on one side of the blue microcavity adjusting layer 604; the red light microcavity adjusting layer 606 is positioned on the partial surface of the common hole transport layer 603 on one side of the green light microcavity adjusting layer 605, the thickness of the blue light microcavity adjusting layer 604 is smaller than that of the green light microcavity adjusting layer 605, and the thickness of the green light microcavity adjusting layer 605 is smaller than that of the red light microcavity adjusting layer 606, so that different wavelengths of blue light, green light and red light are matched, and the display effect of the OLED panel is improved; a blue organic light emitting material layer 607 on the surface of the blue microcavity adjusting layer 604; a green organic light-emitting material layer 608 on the surface of the green microcavity adjusting layer 605; a red organic light emitting material layer 609 positioned on the surface of the red microcavity adjusting layer 606; an electron transport layer 610 covering the blue organic light emitting material layer 607, the green organic light emitting material layer 608, and the red organic light emitting material layer 609; a cathode 611 on the electron transport layer 610; a capping layer on the cathode 611. Fig. 16 is a schematic diagram showing only one RGB light-emitting unit of the OLED panel, and in practice, there are many RGB light-emitting units shown in fig. 16 in one OLED panel, and in the process of manufacturing the OLED panel, the RGB light-emitting units are simultaneously manufactured.

Fig. 17 is a schematic structural diagram illustrating a process of manufacturing the OLED panel shown in fig. 16 by using the OLED panel manufacturing system according to an embodiment of the present invention, and arrows with dotted lines in fig. 17 indicate a moving path of the substrate in the OLED panel manufacturing system.

With combined reference to fig. 16 and 17, the fabrication process includes: the substrate 601 is conveyed into a temporary bonding chamber 230 connected with the first conveying chamber 220 through a first conveying chamber 220a, a first evaporation shadow mask is stored in the temporary bonding chamber 230, and the substrate 601 and the first evaporation shadow mask are bonded to form a first temporary matching unit in the temporary bonding chamber 230; then, the first temporary matching unit is transferred into the P-type doped hole transport layer chamber 210a through the first transfer chamber 220a and the first cluster operation chamber 200a, and a P-type doped hole transport layer 602 is formed on the surface of the substrate 601 through an evaporation process with the first evaporation shadow mask as a mask; then, the first temporary bonding unit is transferred from the P-type doped hole transport layer chamber 210a to the common hole transport layer chamber 210b through the first cluster operation chamber 200a, and a common hole transport layer 603 is formed on the surface of the P-type doped hole transport layer 602 through an evaporation process by also using the first evaporation shadow mask as a mask; next, the first temporary pairing unit formed with the common hole transport layer 603 is transferred to the debonding chamber 240 connected to the second transfer chamber 220b through the first cluster operation chamber 200a and the second transfer chamber 220b, debonding is performed, and the first evaporation shadow mask and the substrate 601 formed with the common hole transport layer 603 are separated; next, the second transfer chamber 220b transfers the substrate 601 on which the common hole transport layer 603 is formed to a temporary bonding chamber 230 connected to the second transfer chamber 220b, in which a second evaporation shadow mask is stored, and in which the substrate on which the common hole transport layer 603 is formed and the second evaporation shadow mask are bonded to form a second temporary matching unit; next, the second temporary matching unit is transferred into the blue microcavity adjusting layer chamber 210c through the second transfer chamber 220b and the second cluster operation chamber 200b, and a blue microcavity adjusting layer 604 is formed on a part of the surface of the common hole transport layer 603 on the substrate by an evaporation process with a second evaporation shadow mask as a mask; then, a second temporary bonding unit is transmitted from the blue microcavity adjusting layer chamber 210c to the blue organic light emitting material layer chamber 210d through the second cluster operation chamber 200b, and a blue organic light emitting material layer 607 is formed on the surface of the blue microcavity adjusting layer 604 by an evaporation process with a second evaporation shadow mask as a mask; next, the second temporary pairing unit on which the blue organic light emitting material layer 607 is formed is transferred to the debonding chamber 240 connected to the third transfer chamber 220c through the second cluster operation chamber 200a and the third transfer chamber 220c to be debonded, and the second evaporation shadow mask and the substrate 601 on which the blue organic light emitting material layer 607 is formed are separated; next, the third transfer chamber 220c transfers the substrate 601 on which the blue organic light emitting material layer 607 is formed to a temporary bonding chamber 230 connected to the third transfer chamber 220c, in which a third evaporation shadow mask is stored, and in which the substrate 601 on which the blue organic light emitting material layer is formed is bonded to the third evaporation shadow mask to form a third temporary pairing unit; next, the third provisional matching unit is transferred into the green microcavity adjusting layer chamber 210e through the third transfer chamber 220c and the third cluster operation chamber 200c, and a green microcavity adjusting layer 605 is formed on a part of the surface of the common hole transport layer 603 on the side of the blue organic light emitting material layer 607 on the substrate 601 by an evaporation process with the third evaporation shadow mask as a mask; next, the third temporary bonding unit is transferred from the green microcavity adjustment layer chamber 210e to the green organic light emitting material layer chamber 210f through the third cluster of operation chambers 200c, and a green organic light emitting material layer 608 is formed on the surface of the green microcavity adjustment layer 605 through an evaporation process with a third evaporation shadow mask as a mask; next, the third temporary pairing unit formed with the green organic light emitting material layer 608 is transferred to the debonding chamber 240 connected to the fourth transfer chamber 220d through the third cluster operation chamber 200c and the fourth transfer chamber 220d, debonding is performed, and the third evaporation shadow mask and the substrate 601 formed with the green organic light emitting material layer are separated; next, the fourth transfer chamber 220d transfers the substrate 601 on which the green organic light emitting material layer is formed to the temporary bonding chamber 230 connected to the fourth transfer chamber 220d, in which a fourth evaporation shadow mask is stored, and in which the substrate 601 on which the green organic light emitting material layer is formed is bonded to the fourth evaporation shadow mask to form a fourth temporary matching unit; next, the fourth provisional matching unit is transferred into the red microcavity adjustment layer chamber 210g through the fourth transfer chamber 220d and the fourth cluster operation chamber 200d, and a red microcavity adjustment layer 606 is formed on a portion of the surface of the common hole transport layer 603 on the side of the green organic light emitting material layer 608 on the substrate 601 by an evaporation process using a fourth evaporation shadow mask as a mask; next, the fourth temporary bonding unit is transferred from the red microcavity adjusting layer chamber 210g to the red organic light emitting material layer chamber 210f through the fourth cluster operation chamber 200d, and a red organic light emitting material layer 609 is formed on the surface of the red microcavity adjusting layer 606 through an evaporation process with a fourth evaporation shadow mask as a mask; next, the fourth temporary pairing unit on which the red organic light emitting material layer is formed is transferred to the de-bonding chamber 240 connected to the fifth transfer chamber 220e through the fourth cluster operation chamber 200d and the fifth transfer chamber 220e, de-bonding is performed, and the fourth evaporation shadow mask and the substrate 601 on which the red organic light emitting material layer is formed are separated; next, the fifth transfer chamber 220e transfers the substrate 601 on which the red organic light emitting material layer is formed to the temporary bonding chamber 230 connected to the fifth transfer chamber 220e, in which the fifth evaporation shadow mask is stored, and in which the substrate 601 on which the red organic light emitting material layer is formed is bonded to the fifth evaporation shadow mask to form a fifth temporary pairing unit; next, the fifth provisional matching unit is transferred into the electron transport layer chamber 210h through the fifth transfer chamber 220e and the fifth cluster operation chamber 200e, and an electron transport layer 610 covering the surfaces of the blue organic light emitting material layer 607, the green organic light emitting material layer 608, and the red organic light emitting material layer 609 is formed on the substrate through an evaporation process using a fifth evaporation shadow mask as a mask; then, the fifth temporary bonding unit is transferred from the electron transport layer chamber 210h to the cathode layer chamber 210i through the fifth cluster operation chamber 200e, and a cathode layer 611 is formed on the surface of the electron transport layer 610 through an evaporation process with the fifth evaporation shadow mask as a mask; next, the fifth temporary pairing unit forming the cathode layer 611 is transferred to the debonding chamber 240 connected to the sixth transfer chamber 220f through the fifth cluster operation chamber 200e and the sixth transfer chamber 230f, debonding is performed, and the fifth evaporation shadow mask and the substrate 601 formed with the cathode layer 611 are separated; next, the sixth transfer chamber 220f transfers the substrate 601 on which the cathode layer is formed to the temporary bonding chamber 240 connected to the sixth transfer chamber 220f, in which a sixth evaporation shadow mask is stored, and in which the substrate 601 on which the cathode layer is formed and the sixth evaporation shadow mask are bonded to form a sixth temporary matching unit; next, the sixth temporary matching unit is transferred into the cover layer chamber 210j through the sixth transfer chamber 220f and the sixth cluster operation chamber 200f, and a cover layer 612 is formed on the surface of the cathode layer 611 on the substrate 601 through an evaporation process using the sixth evaporation shadow mask as a mask; the sixth temporary pairing unit formed with the capping layer 612 is transferred to the debonding chamber 240 connected to the seventh transfer chamber 220g through the sixth cluster operation chamber 200f and the seventh transfer chamber 220g to be debonded, separating the sixth evaporation shadow mask from the substrate 601 formed with the capping layer 612; the substrate 601 on which the cover layer 612 is formed is discharged through the seventh transfer chamber 220 g.

In other embodiments, after the cathode layer 611 is formed, the fifth temporary matching unit for forming the cathode layer 611 may be directly conveyed into the covering layer chamber 210j, and the covering layer 612 may be formed on the surface of the cathode layer 611 on the substrate 601 by an evaporation process using the fifth evaporation shadow mask as a mask.

Therefore, when the OLED panel manufacturing system is adopted to manufacture the OLED panel, the two organic material layers are formed by only carrying out one-side contraposition and bonding processes (for example, when a P-type doped hole transport layer 602 and a common hole transport layer 603 are formed, when a blue light microcavity adjusting layer 604 and a blue light organic light emitting material layer 607 are formed, when a green light microcavity adjusting layer 605 and a green light organic light emitting material layer 608 are formed, and when a red light microcavity adjusting layer 606 and a red light organic light emitting material layer 609 are formed), the process time is greatly saved.

Referring to fig. 18, another embodiment of the present invention further provides a structure of an OLED panel, where the OLED panel includes: a substrate 601, wherein a transparent conductive layer (the material of the transparent conductive layer is ITO) is provided on the surface of the substrate 601; a P-type doped hole transport layer 602 on the substrate 601; a common hole transport layer 603 on the surface of the P-type doped hole transport layer 602; a blue organic light emitting material layer 607 on a part of the surface of the common hole transport layer 603; a green microcavity adjusting layer 605 on a portion of the surface of the common hole transport layer 603 on the side of the blue organic light emitting material layer 607; the red light microcavity adjusting layer 606 is positioned on the partial surface of the common hole transmission layer 603 on one side of the green light microcavity adjusting layer 605, and the thickness of the green light microcavity adjusting layer 605 is smaller than that of the red light microcavity adjusting layer 606 so as to match the wavelengths of different blue light, green light and red light and improve the display effect of the OLED panel; a green organic light emitting material layer 608 on the surface of the green microcavity adjustment layer 605; a red organic light emitting material layer 609 positioned on the surface of the red microcavity adjusting layer 606; an electron transport layer 610 covering the blue organic light emitting material layer 607, the green organic light emitting material layer 608, and the red organic light emitting material layer 609; a cathode 611 on the electron transport layer 610; a capping layer on the cathode 611.

Fig. 18 is a schematic diagram showing only one RGB light-emitting unit of the OLED panel, and in practice, there are many RGB light-emitting units shown in fig. 18 in one OLED panel, and in the process of manufacturing the OLED panel, the RGB light-emitting units are simultaneously manufactured.

Fig. 19 is a schematic structural diagram illustrating a process of fabricating the OLED panel shown in fig. 17 by using the OLED panel fabrication system according to an embodiment of the present invention, and arrows with dotted lines in fig. 18 indicate a movement path of the substrate in the OLED panel fabrication system.

Referring to fig. 18 and 19 in combination, the manufacturing process includes: the substrate 601 is conveyed into a temporary bonding chamber 230 connected with the first conveying chamber 220a through the first conveying chamber 220a, wherein a first evaporation shadow mask is stored in the temporary bonding chamber, and the substrate 601 and the first evaporation shadow mask are bonded in the temporary bonding chamber to form a first temporary matching unit; then, the first temporary matching unit is transferred into the P-type doped hole transport layer chamber 210a through the first transfer chamber 220a and the first cluster operation chamber 200a, and a P-type doped hole transport layer 602 is formed on the surface of the substrate 601 through an evaporation process with the first evaporation shadow mask as a mask; then, the first temporary bonding unit is transferred from the P-type doped hole transport layer chamber 210a to the common hole transport layer chamber 210b connected with the first cluster operation chamber 200a through the first cluster operation chamber 200a, and a first common hole transport layer is formed on the surface of the P-type doped hole transport layer 602 through an evaporation process with the first evaporation shadow mask as a mask; next, the first temporary pairing unit formed with the first common hole transport layer is transferred to the common hole transport layer chamber 210b connected to the second cluster operation chamber 200b through the first cluster operation chamber 200a, the second transfer chamber 220b, and the second cluster operation chamber 200b, the common hole transport layer forms a second common hole transport layer on the surface of the first common hole transport layer through an evaporation process, and the first common hole transport layer and the second common hole transport layer constitute a common hole transport layer 603; next, the temporary mating structure formed with the second common hole transport layer (or the common hole transport layer 603) is transferred to the debonding chamber 240 connected to the second transfer unit 220b through the second cluster operation chamber 200b and the second transfer chamber 220b, debonding is performed, and the first evaporation shadow mask and the substrate formed with the second common hole transport layer are separated; next, the second transfer chamber 220b transfers the substrate 601 on which the second common hole transport layer is formed to the temporary bonding chamber 230 connected to the second transfer chamber 220b, in which the second evaporation shadow mask is stored, and in which the substrate 601 on which the second common hole transport layer is formed is bonded to the second evaporation shadow mask to form a second temporary matching unit; next, the second provisional pairing unit is transferred to the blue organic light emitting material layer chamber 210d through the second transfer chamber 220b and the second cluster operation chamber 200b, and a blue organic light emitting material layer 607 is formed on a part of the surface of the second common hole transport layer by an evaporation process using the second evaporation shadow mask as a mask; next, the second temporary pairing unit on which the blue organic light emitting material layer 607 is formed is transferred to the debonding chamber 240 connected to the third transfer chamber 220c through the second cluster operation chamber 200a and the third transfer chamber 220c to be debonded, and the second evaporation shadow mask and the substrate 601 on which the blue organic light emitting material layer 607 is formed are separated; next, the third transfer chamber 220c transfers the substrate 601 on which the blue organic light emitting material layer 607 is formed to a temporary bonding chamber 230 connected to the third transfer chamber 220c, in which a third evaporation shadow mask is stored, and in which the substrate 601 on which the blue organic light emitting material layer is formed is bonded to the third evaporation shadow mask to form a third temporary pairing unit; next, the third provisional matched unit is transferred into the green microcavity adjusting layer chamber 210e through the third transfer chamber 220c and the third cluster operation chamber 200c, and a green microcavity adjusting layer 605 is formed on a part of the surface of the common hole transport layer 603 on the side of the blue organic light emitting material layer 607 on the substrate 601 by an evaporation process using a third evaporation shadow mask as a mask; then, the third temporary bonding unit is transferred from the green microcavity adjustment layer chamber 210e to the green organic light-emitting material layer chamber 210f through the third cluster of operation chambers 200c, and a green organic light-emitting material layer 608 is formed on the surface of the green microcavity adjustment layer 605 through an evaporation process with the third evaporation shadow mask as a mask; next, the third temporary pairing unit formed with the green organic light emitting material layer 608 is transferred to the debonding chamber 240 connected to the fourth transfer chamber 220d through the third cluster operation chamber 200c and the fourth transfer chamber 220d, debonding is performed, and the third evaporation shadow mask and the substrate 601 formed with the green organic light emitting material layer are separated; next, the fourth transfer chamber 220d transfers the substrate 601 on which the green organic light emitting material layer is formed to the temporary bonding chamber 230 connected to the fourth transfer chamber 220d, in which a fourth evaporation shadow mask is stored, and in which the substrate 601 on which the green organic light emitting material layer is formed is bonded to the fourth evaporation shadow mask to form a fourth temporary matching unit; next, the fourth provisional matched unit is transferred into the red microcavity adjusting layer chamber 210g through the fourth transfer chamber 220d and the fourth cluster operation chamber 200d, and a red microcavity adjusting layer 606 is formed on a part of the surface of the common hole transport layer 603 on the green organic light emitting material layer 608 side on the substrate 601 by an evaporation process using a fourth evaporation shadow mask as a mask; next, the fourth temporary bonding unit is transferred from the red microcavity adjusting layer chamber 210g to the red organic light emitting material layer chamber 210f through the fourth cluster operation chamber 200d, and a red organic light emitting material layer 609 is formed on the surface of the red microcavity adjusting layer 606 through an evaporation process with a fourth evaporation shadow mask as a mask; next, the fourth temporary pairing unit on which the red organic light emitting material layer is formed is transferred to the de-bonding chamber 240 connected to the fifth transfer chamber 220e through the fourth cluster operation chamber 200d and the fifth transfer chamber 220e, de-bonding is performed, and the fourth evaporation shadow mask and the substrate 601 on which the red organic light emitting material layer is formed are separated; next, the fifth transfer chamber 220e transfers the substrate 601 on which the red organic light emitting material layer is formed to the temporary bonding chamber 230 connected to the fifth transfer chamber 220e, in which the fifth evaporation shadow mask is stored, and in which the substrate 601 on which the red organic light emitting material layer is formed is bonded to the fifth evaporation shadow mask to form a fifth temporary pairing unit; next, the fifth provisional matching unit is transferred into the electron transport layer chamber 210h through the fifth transfer chamber 220e and the fifth cluster operation chamber 200e, and an electron transport layer 610 covering the surfaces of the blue organic light emitting material layer 607, the green organic light emitting material layer 608, and the red organic light emitting material layer 609 is formed on the substrate through an evaporation process using a fifth evaporation shadow mask as a mask; next, the fifth temporary bonding unit is transferred from the electron transport layer chamber 210h to the cathode layer chamber 210i through the fifth cluster operation chamber 200e, and a cathode layer 611 is formed on the surface of the electron transport layer 610 through an evaporation process with the fifth evaporation shadow mask as a mask; next, the fifth temporary pairing unit forming the cathode layer 611 is transferred to the debonding chamber 240 connected to the sixth transfer chamber 220f through the fifth cluster operation chamber 200e and the sixth transfer chamber 230f, debonding is performed, and the fifth evaporation shadow mask and the substrate 601 formed with the cathode layer 611 are separated; next, the sixth transfer chamber 220f transfers the substrate 601 on which the cathode layer is formed to the temporary bonding chamber 240 connected to the sixth transfer chamber 220f, in which the sixth evaporation shadow mask is stored, and in which the substrate 601 on which the cathode layer is formed and the sixth evaporation shadow mask are bonded to form a sixth temporary matching unit; next, the sixth temporary matching unit is transferred into the cover layer chamber 210j through the sixth transfer chamber 220f and the sixth cluster operation chamber 200f, and a cover layer 612 is formed on the surface of the cathode layer 611 on the substrate 601 through an evaporation process using the sixth evaporation shadow mask as a mask; the sixth temporary pairing unit formed with the capping layer 612 is transferred to the debonding chamber 240 connected to the seventh transfer chamber 220g through the sixth cluster operation chamber 200f and the seventh transfer chamber 220g to be debonded, separating the sixth evaporation shadow mask from the substrate 601 formed with the capping layer 612; the substrate 601 on which the cover layer 612 is formed is discharged through the seventh transfer chamber 220 g.

In this embodiment, the thicker common hole transport layer is split into two layers (a first common hole transport layer and a second common hole transport layer) which respectively grow in the process processing chamber 210b connected to the first cluster operation chamber 200a and the process processing chamber 210b connected to the second cluster operation chamber 200b, and the growth time difference between the first common hole transport layer and the second common hole transport layer in the growth time of the organic material layer in the other process processing chambers is smaller or substantially the same, so that the influence of the growth of the common hole transport layer on the process takt time of the whole OLED manufacturing system is reduced, and the production efficiency is improved.

Although the present invention is disclosed above, the present invention is not limited thereto. Various changes and modifications may be effected by one skilled in the art without departing from the spirit and scope of the invention, as defined in the appended claims.

Claims

1. An OLED panel fabrication system, comprising: the device comprises a plurality of cluster operation chambers, a plurality of transfer chambers, a plurality of process treatment chambers, a plurality of temporary bonding chambers and a plurality of de-bonding chambers, wherein each cluster operation chamber is connected with at least one process treatment chamber;

adjacent cluster operating chambers are connected through a transfer chamber;

each transfer chamber is connected with at least one temporary bonding chamber and at least one debonding chamber;

the temporary bonding chamber is at least used for storing an evaporation shadow mask, and after the evaporation shadow mask is aligned with the substrate conveyed into the temporary bonding chamber, the substrate and the evaporation shadow mask are bonded together through UV glue to form a temporary matching structure;

the temporary bonding chamber comprises: the device comprises an alignment unit, a first clamping unit, a dispensing unit, a UV light irradiation unit and a storage unit, wherein the alignment unit aligns the substrate and the shadow mask by adopting an optical alignment system; the first clamping unit is used for clamping the substrate and the evaporation shadow mask, and after the substrate and the evaporation shadow mask are aligned, the substrate and the evaporation shadow mask are in contact joint; the dispensing unit is used for spraying UV glue after the substrate is in contact joint with the evaporation shadow mask, and filling the UV glue between the substrate and the evaporation shadow mask; the UV light irradiation unit is used for emitting UV light, and filling UV glue between the substrate and the evaporation shadow mask for irradiation, so that the UV glue is cured, and the substrate and the evaporation shadow mask are bonded together to form a temporary matching structure; the storage unit is used for storing the evaporation shadow mask;

the vapor deposition shadow mask includes: the substrate, at least one of the said base plate and the said substrate is a transparent material; the grating film layer is positioned on the front surface of the substrate and is provided with a plurality of openings arranged in an array; a groove in the substrate through a thickness of the substrate, the groove exposing the plurality of openings in the grating film layer and the grating film layer between adjacent openings; the substrate comprises a pixel area and a cofferdam area surrounding the pixel area, a part of the surface of the cofferdam area forms a cofferdam structure, and the cofferdam structure can limit the UV glue formed subsequently between the substrate and the substrate outside the cofferdam structure;

the transfer chamber is at least used for transferring the substrate or the temporary pairing structure among the cluster operation chamber, the temporary bonding chamber and the debonding chamber;

the cluster operation chamber is at least used for transferring the temporary pairing structure between the process treatment chambers and the transfer chamber;

the process treatment chamber is at least used for forming an organic material layer on the surface of the substrate exposed by the evaporation shadow mask by taking the evaporation shadow mask on the temporary matching structure as a mask when the temporary matching structure is conveyed into the process treatment chamber;

the debonding chamber is at least used for debonding the substrate and the evaporation shadow mask through laser irradiation when the organic material layer is formed on the substrate of the temporary matching structure and then is conveyed to the debonding chamber, so that the substrate with the organic material layer formed thereon is separated from the evaporation shadow mask.

2. The OLED panel manufacturing system of claim 1, wherein the first clamping unit contacts and attaches a surface of a bank-structured evaporation shadow mask on the substrate.

3. The OLED panel manufacturing system of claim 2, wherein the dispensing unit fills UV paste between the substrate outside the bank structure and the evaporation shadow mask.

4. The OLED panel manufacturing system of claim 1, wherein the UV glue dispensed by the dispensing unit is a UV glue that generates a glue reaction when irradiated by UV light to bond the substrate to the evaporation shadow mask, and fuses the glue molecules when irradiated by laser light to debond the substrate from the evaporation shadow mask.

5. The OLED panel manufacturing system of claim 1, wherein the UV light irradiation unit emits UV light having a wavelength of 365nm or more and irradiation energy of 1000mj/cm or more ² 。

6. The OLED panel manufacturing system of claim 1, wherein the dispensing unit fills UV paste between the substrate and the evaporation shadow mask, and the first clamping unit further rotates the contact-bonded substrate and the evaporation shadow mask.

7. The OLED panel manufacturing system of claim 1, wherein the debonding chamber includes a laser irradiation unit for emitting laser light to irradiate the cured UV paste in the temporary mating structure, and a second clamping unit for clamping the temporary mating structure and separating the substrate formed with the organic material layer from the evaporation shadow mask after the laser light irradiates the cured UV paste.

8. The OLED panel manufacturing system of claim 7, wherein the laser is picosecond laser with a pulse frequency of 100-.

9. The OLED panel manufacturing system of claim 1, wherein the number of process chambers connected to each cluster operation chamber is greater than or equal to 1.

10. The system for manufacturing the OLED panel according to claim 9, wherein when the number of the process chambers connected to each cluster operation chamber is greater than or equal to 2, the process chambers connected to each cluster operation chamber are the same process chamber or different process chambers, or at least some process chambers are the same in number, and some process chambers are the other process chambers.

11. The system for manufacturing an OLED panel as claimed in claim 10, wherein the process chambers connected to different cluster operation chambers are the same process chamber or different process chambers, or at least some of the process chambers connected to different cluster operation chambers are the same process chamber.

12. The OLED panel manufacturing system of claim 10, wherein when a cluster operation chamber is a target cluster operation chamber, a transfer chamber connected to a front end of the target cluster operation chamber is a front end transfer chamber, a transfer chamber connected to a rear end of the target cluster operation chamber is a rear end transfer chamber, the substrate and the evaporation shadow mask form a temporary mating structure in a temporary bonding chamber connected to the front end transfer chamber, and the temporary mating structure is transferred to the target cluster operation chamber through the front end transfer chamber; the target cluster operation chamber transfers the temporary pairing structure to a corresponding process chamber; forming an organic material layer on a substrate in a process chamber; the back end transfer chamber transfers the temporary bonding unit formed with the organic material layer from the target cluster operating chamber to a de-bonding chamber connected to the back end transfer chamber, in which the substrate formed with the organic material layer and the evaporation shadow mask are separated.

13. The OLED panel manufacturing system of claim 12, wherein when the plurality of process chambers connected to the target cluster operation chamber are the same process chamber, a plurality of temporary mating structures are sequentially formed in the temporary bonding chamber connected to the front end transfer chamber, the plurality of temporary mating structures are sequentially transferred to the plurality of process chambers connected to the target cluster operation chamber through the front end transfer chamber and the target cluster operation chamber, and the organic material layer is correspondingly formed on the substrate surfaces of the plurality of temporary mating structures.

14. The OLED panel manufacturing system of claim 12, wherein when the plurality of process chambers connected to the target cluster operation chamber are two different process chambers, forming a temporary matching structure in a temporary bonding chamber connected with the front end transmission chamber, firstly transmitting the temporary matching structure into a process treatment chamber connected with a target cluster operation chamber through the front end transmission chamber and the target cluster operation chamber, taking an evaporation shadow mask as a mask, forming a first organic material layer on the substrate surface of the temporary matching structure, and then transferring the temporary matching structure formed with the first organic material layer to another process chamber connected with a target cluster operation chamber through the target cluster operation chamber, and forming a second organic material layer on the surface of the first organic material layer of the substrate by using the same evaporation shadow mask as a mask.

15. The OLED panel manufacturing system of claim 11, wherein the cluster operation chambers comprise a first cluster operation chamber, a second cluster operation chamber, a third cluster operation chamber, a fourth cluster operation chamber, a fifth cluster operation chamber, and a sixth cluster operation chamber which are adjacent in sequence, the transfer chambers comprise a first transfer chamber, a second transfer chamber, a third transfer chamber, a fourth transfer chamber, a fifth transfer chamber, a sixth transfer chamber, and a seventh transfer chamber, the first transfer chamber is connected with the first cluster operation chamber, the second transfer chamber is connected with the first cluster operation chamber and the second cluster operation chamber, the third transfer chamber is connected with the second cluster operation chamber and the third cluster operation chamber, the fourth transfer chamber is connected with the third cluster operation chamber and the fourth cluster operation chamber, and the fifth transfer chamber is connected with the fourth cluster operation chamber and the fifth cluster operation chamber, the sixth transfer chamber connects the fifth cluster of operation chambers with the sixth cluster of operation chambers, and the seventh transfer chamber is connected with the sixth cluster of operation chambers; each transfer chamber between adjacent cluster operating chambers is connected with at least one temporary bonding chamber and at least one de-bonding chamber; each cluster operation chamber is connected to at least one process chamber.

16. The OLED panel production system of claim 15, wherein the process chambers connected to the first cluster of operating chambers comprise at least one P-doped hole transport layer chamber and at least one common hole transport layer chamber, the process chambers connected to the second cluster of operating chambers comprise at least one blue microcavity tuning layer chamber and at least one blue OLED material layer chamber, the process chambers connected to the third cluster of operating chambers comprise at least one green microcavity tuning layer chamber and at least one green OLED material layer chamber, the process chambers connected to the fourth cluster of operating chambers comprise at least one red microcavity tuning layer chamber and at least one red OLED material layer chamber, the process chambers connected to the fifth cluster of operating chambers comprise at least one electron transport layer chamber and at least one cathode layer chamber, the process chamber connected to the sixth cluster of process chambers includes at least one blanket chamber.

17. The OLED panel production system of claim 16 wherein the substrate is transported through the first transport chamber into a temporary bonding chamber coupled to the first transport chamber, the temporary bonding chamber having a first evaporation shadow mask stored therein, the substrate and the first evaporation shadow mask being bonded in the temporary bonding chamber to form a first temporary mating unit; then, the first temporary pairing unit is conveyed into the cavity of the P-type doped hole transport layer through the first conveying cavity and the first cluster operation cavity, and the P-type doped hole transport layer is formed on the surface of the substrate through an evaporation process; then, the first temporary bonding unit is conveyed from the P-type doped hole transport layer cavity to the public hole transport layer cavity through the first cluster operation cavity, and a public hole transport layer is formed on the surface of the P-type doped hole transport layer through an evaporation process; then, the first temporary matching unit with the formed common hole transport layer is conveyed to a bonding removing chamber connected with a second conveying chamber through a first cluster operation chamber and the second conveying chamber, bonding removing is carried out, and a first evaporation shadow mask and the substrate with the formed common hole transport layer are separated; then, the second conveying chamber conveys the substrate with the common hole transport layer to a temporary bonding chamber connected with the second conveying chamber, a second evaporation shadow mask is stored in the temporary bonding chamber, and the substrate with the common hole transport layer is bonded with the second evaporation shadow mask to form a second temporary matching unit in the temporary bonding chamber; then, the second temporary matching unit is transmitted into the blue light microcavity adjusting layer cavity through a second transmission cavity and a second cluster operation cavity, and a blue light microcavity adjusting layer is formed on part of the surface of the common hole transport layer on the substrate through an evaporation process; then, a second temporary bonding unit is transmitted from the blue light microcavity adjusting layer cavity to the blue light organic light-emitting material layer cavity through a second cluster operation cavity, and a blue light organic light-emitting material layer is formed on the surface of the blue light microcavity adjusting layer through an evaporation process; then, the second temporary matching unit with the blue organic light-emitting material layer is conveyed to a bonding removing chamber connected with a third conveying chamber through a second cluster operation chamber and the third conveying chamber, bonding removing is carried out, and a second evaporation shadow mask and the substrate with the blue organic light-emitting material layer are separated; then, the substrate on which the blue organic light emitting material layer is formed is conveyed to a temporary bonding chamber connected with the third conveying chamber by a third conveying chamber, a third evaporation shadow mask is stored in the temporary bonding chamber, and the substrate on which the blue organic light emitting material layer is formed is bonded with the third evaporation shadow mask to form a third temporary matching unit in the temporary bonding chamber; then, the third temporary matching unit is transmitted into the green light microcavity adjusting layer cavity through a third transmission cavity and a third cluster operation cavity, and a green light microcavity adjusting layer is formed on the partial surface of the common hole transport layer on one side of the blue light organic light emitting material layer on the substrate through an evaporation process; then, a third temporary bonding unit is transmitted from the green light microcavity adjusting layer cavity to the green light organic light-emitting material layer cavity through a third cluster operation cavity, and a green light organic light-emitting material layer is formed on the surface of the green light microcavity adjusting layer through an evaporation process; then, the third temporary matching unit with the green organic light emitting material layer is conveyed to a bonding removing chamber connected with the fourth conveying chamber through a third cluster operation chamber and the fourth conveying chamber, bonding removing is carried out, and a third evaporation shadow mask and the substrate with the green organic light emitting material layer are separated; then, the fourth transfer chamber transfers the substrate on which the green organic light emitting material layer is formed to a temporary bonding chamber connected with the fourth transfer chamber, a fourth evaporation shadow mask is stored in the temporary bonding chamber, and the substrate on which the green organic light emitting material layer is formed and the fourth evaporation shadow mask are bonded to form a fourth temporary matching unit in the temporary bonding chamber; then, the fourth temporary matching unit is transmitted into the red microcavity adjusting layer chamber through a fourth transmission chamber and a fourth cluster operation chamber, and a red microcavity adjusting layer is formed on part of the surface of the common hole transport layer on one side of the green organic light emitting material layer on the substrate through an evaporation process; then, a fourth temporary bonding unit is transmitted from the red light microcavity adjusting layer cavity to the red light organic light-emitting material layer cavity through a fourth cluster operation cavity, and a red light organic light-emitting material layer is formed on the surface of the red light microcavity adjusting layer through an evaporation process; then, the fourth temporary matching unit with the red organic light-emitting material layer is conveyed to a bonding-removing chamber connected with the fifth conveying chamber through a fourth cluster operation chamber and the fifth conveying chamber, bonding removal is carried out, and a fourth evaporation shadow mask and the substrate with the red organic light-emitting material layer are separated; then, the substrate on which the red organic light emitting material layer is formed is conveyed to a temporary bonding chamber connected with the fifth conveying chamber by a fifth conveying chamber, a fifth evaporation shadow mask is stored in the temporary bonding chamber, and the substrate on which the red organic light emitting material layer is formed is bonded with the fifth evaporation shadow mask to form a fifth temporary matching unit in the temporary bonding chamber; then, the fifth temporary matching unit is conveyed into the electron transport layer chamber through a fifth conveying chamber and a fifth cluster operation chamber, and an electron transport layer covering the surfaces of the blue light organic light emitting material layer, the green light organic light emitting material layer and the red light organic light emitting material layer is formed on the substrate through an evaporation process; then, the fifth temporary bonding unit is conveyed from the electron transport layer cavity to the cathode layer cavity through the fifth cluster operation cavity, and a cathode layer is formed on the surface of the electron transport layer through an evaporation process; then, the fifth temporary matching unit forming the cathode layer is conveyed to a bonding releasing chamber connected with the sixth conveying chamber through a fifth cluster operation chamber and the sixth conveying chamber to be released from bonding, and a fifth evaporation shadow mask and the substrate forming the cathode layer are separated; then, the sixth conveying chamber conveys the substrate on which the cathode layer is formed to a temporary bonding chamber connected with the sixth conveying chamber, a sixth evaporation shadow mask is stored in the temporary bonding chamber, and the substrate on which the cathode layer is formed and the sixth evaporation shadow mask are bonded to form a sixth temporary matching unit in the temporary bonding chamber; next, the sixth temporary matching unit is transferred into the coating layer chamber through the sixth transfer chamber and the sixth cluster operation chamber, and a coating layer is formed on the surface of the cathode layer on the substrate through an evaporation process.

18. The OLED panel production system of claim 15, wherein the process chambers connected to the first cluster of operating chambers comprise at least one P-doped hole transport layer chamber and at least one common hole transport layer chamber, the process chambers connected to the second cluster of operating chambers comprise at least one common hole transport layer chamber and at least one blue organic light emitting material layer chamber, the process chambers connected to the third cluster of operating chambers comprise at least one green microcavity adjusting layer chamber and at least one green organic light emitting material layer chamber, the process chambers connected to the fourth cluster of operating chambers comprise at least one red microcavity adjusting layer chamber and at least one red organic light emitting material layer chamber, the process chambers connected to the fifth cluster of operating chambers comprise at least one electron transport layer chamber and at least one cathode layer chamber, the process chamber connected to the sixth cluster of process chambers includes at least one blanket chamber.

19. The OLED panel production system of claim 16 wherein the substrate is transported through the first transport chamber into a temporary bonding chamber coupled to the first transport chamber, the temporary bonding chamber having a first evaporation shadow mask stored therein, the substrate and the first evaporation shadow mask being bonded in the temporary bonding chamber to form a first temporary mating unit; then, the first temporary matching unit is conveyed into the cavity of the P-type doped hole transport layer through the first conveying cavity and the first cluster operation cavity, and the P-type doped hole transport layer is formed on the surface of the substrate through an evaporation process; then, the first temporary bonding unit is transferred from the P-type doped hole transport layer cavity to a common hole transport layer cavity connected with the first cluster operation cavity through a first cluster operation cavity, and a first common hole transport layer is formed on the surface of the P-type doped hole transport layer through an evaporation process; then, the first temporary pairing unit with the first common hole transport layer is conveyed to a common hole transport layer cavity connected with the second cluster operation cavity through a first cluster operation cavity, a second conveying cavity and a second cluster operation cavity, a second common hole transport layer is formed on the surface of the first common hole transport layer through an evaporation process, and the first common hole transport layer and the second common hole transport layer form a hole transport layer; then, the temporary matching structure with the second common hole transport layer is conveyed to a bonding removing chamber connected with a second conveying unit through a second cluster operation chamber and a second conveying chamber, bonding removing is carried out, and the first evaporation shadow mask and the substrate with the second common hole transport layer are separated; then, the second conveying chamber conveys the substrate with the second common hole transport layer to a temporary bonding chamber connected with the second conveying chamber, a second evaporation shadow mask is stored in the temporary bonding chamber, and the substrate with the second common hole transport layer is bonded with the second evaporation shadow mask to form a second temporary matching unit in the temporary bonding chamber; then, the second temporary matching unit is conveyed to the blue light organic light emitting material layer chamber through a second conveying chamber and a second cluster operation chamber, and a blue light organic light emitting material layer is formed on part of the surface of the second common hole transport layer through an evaporation process; then, the second temporary matching unit with the blue organic light emitting material layer is conveyed to a bonding removing chamber connected with a third conveying chamber through a second cluster operation chamber and the third conveying chamber, bonding removing is carried out, and a second evaporation shadow mask and the substrate with the blue organic light emitting material layer are separated; then, the third conveying chamber conveys the substrate on which the blue organic light emitting material layer is formed to a temporary bonding chamber connected with the third conveying chamber, a third evaporation shadow mask is stored in the temporary bonding chamber, and the substrate on which the blue organic light emitting material layer is formed and the third evaporation shadow mask are bonded to form a third temporary matching unit in the temporary bonding chamber; then, the third temporary matching unit is transmitted into the green light microcavity adjusting layer cavity through a third transmission cavity and a third cluster operation cavity, and a green light microcavity adjusting layer is formed on the surface of part of the second layer common hole transport layer on one side of the blue light organic light emitting material layer on the substrate through an evaporation process; then, a third temporary bonding unit is transmitted from the green light microcavity adjusting layer cavity to the green light organic light-emitting material layer cavity through a third cluster operation cavity, and a green light organic light-emitting material layer is formed on the surface of the green light microcavity adjusting layer through an evaporation process; then, the third temporary matching unit with the green organic light emitting material layer is conveyed to a bonding removing chamber connected with the fourth conveying chamber through a third cluster operation chamber and the fourth conveying chamber, bonding removing is carried out, and a third evaporation shadow mask and the substrate with the green organic light emitting material layer are separated; then, the fourth transfer chamber transfers the substrate on which the green organic light emitting material layer is formed to a temporary bonding chamber connected with the fourth transfer chamber, a fourth evaporation shadow mask is stored in the temporary bonding chamber, and the substrate on which the green organic light emitting material layer is formed and the fourth evaporation shadow mask are bonded to form a fourth temporary matching unit in the temporary bonding chamber; then, the fourth temporary pairing unit is transmitted into the red microcavity adjusting layer cavity through a fourth transmission cavity and a fourth cluster operation cavity, and a red microcavity adjusting layer is formed on the surface of part of the second layer common hole transport layer on one side of the green organic light-emitting material layer on the substrate through an evaporation process; then, a fourth temporary bonding unit is transmitted from the red light microcavity adjusting layer cavity to the red light organic light-emitting material layer cavity through a fourth cluster operation cavity, and a red light organic light-emitting material layer is formed on the surface of the red light microcavity adjusting layer through an evaporation process; then, the fourth temporary matching unit with the red organic light-emitting material layer is conveyed to a bonding-removing chamber connected with the fifth conveying chamber through a fourth cluster operation chamber and the fifth conveying chamber, bonding removal is carried out, and a fourth evaporation shadow mask and the substrate with the red organic light-emitting material layer are separated; then, the substrate on which the red organic light emitting material layer is formed is conveyed to a temporary bonding chamber connected with the fifth conveying chamber by a fifth conveying chamber, a fifth evaporation shadow mask is stored in the temporary bonding chamber, and the substrate on which the red organic light emitting material layer is formed is bonded with the fifth evaporation shadow mask to form a fifth temporary matching unit in the temporary bonding chamber; then, the fifth temporary matching unit is conveyed into the electron transport layer chamber through a fifth conveying chamber and a fifth cluster operation chamber, and an electron transport layer covering the surfaces of the blue light organic light emitting material layer, the green light organic light emitting material layer and the red light organic light emitting material layer is formed on the substrate through an evaporation process; then, the fifth temporary bonding unit is conveyed from the electron transport layer cavity to the cathode layer cavity through the fifth cluster operation cavity, and a cathode layer is formed on the surface of the electron transport layer through an evaporation process; then, the fifth temporary matching unit forming the cathode layer is conveyed to a bonding-releasing chamber connected with the sixth conveying chamber through a fifth cluster operation chamber and the sixth conveying chamber, bonding is released, and the fifth evaporation shadow mask and the substrate forming the cathode layer are separated; then, the sixth conveying chamber conveys the substrate on which the cathode layer is formed to a temporary bonding chamber connected with the sixth conveying chamber, a sixth evaporation shadow mask is stored in the temporary bonding chamber, and the substrate on which the cathode layer is formed and the sixth evaporation shadow mask are bonded to form a sixth temporary matching unit in the temporary bonding chamber; next, the sixth temporary matching unit is transferred into the coating layer chamber through the sixth transfer chamber and the sixth cluster operation chamber, and a coating layer is formed on the surface of the cathode layer on the substrate through an evaporation process.

20. The OLED panel manufacturing system of claim 1, wherein the alignment accuracy of the plurality of temporary bonding chambers is consistent.

21. An OLED panel fabrication system, comprising: the device comprises a cluster operation chamber, a plurality of transfer chambers, a plurality of process treatment chambers, a plurality of temporary bonding chambers and a plurality of de-bonding chambers, wherein the cluster operation chamber is connected with at least one process treatment chamber;

the front section and the rear end of the cluster operation chamber are respectively connected with at least one conveying chamber;

the conveying chamber connected with the front end of the cluster operation chamber is connected with at least one temporary bonding chamber, and the conveying chamber connected with the rear end of the cluster operation chamber is connected with at least one debonding chamber;

the vapor deposition shadow mask includes: the substrate, at least one of the said base plate and the said substrate is a transparent material; the grating film layer is positioned on the front surface of the substrate and is provided with a plurality of openings arranged in an array; a groove in the substrate through a thickness of the substrate, the groove exposing the plurality of openings in the grating film layer and the grating film layer between adjacent openings; the substrate comprises a pixel area and a cofferdam area surrounding the pixel area, a cofferdam structure is formed on part of the surface of the cofferdam area, and the cofferdam structure can limit the UV glue formed subsequently between the substrate and the substrate outside the cofferdam structure;

the debonding chamber is at least used for debonding the substrate and the evaporation shadow mask through laser irradiation when the substrate is conveyed to the debonding chamber after the organic material layer is formed on the substrate of the temporary matching structure, so that the substrate on which the organic material layer is formed is separated from the evaporation shadow mask.

22. The OLED panel manufacturing system of claim 21, wherein the plurality of process chambers are identical process chambers, the cluster tool chambers are connected to a transfer chamber at a front end and a rear end, respectively, the transfer chamber at the front end is connected to at least one temporary bonding chamber, and the transfer chamber at the rear end is connected to at least one de-bonding chamber.

23. The OLED panel manufacturing system of claim 21, wherein the plurality of process chambers are identical process chambers, the front end transfer chamber is connected to at least one of the temporary bonding chambers except for being connected to at least one of the debonding chambers, and the back end transfer chamber is connected to at least one of the debonding chambers except for being connected to at least one of the temporary bonding chambers.

24. The OLED panel manufacturing system of claim 21, wherein the plurality of process chambers includes at least two different process chambers, the front transfer chamber being coupled to at least one temporary bonding chamber, and the back transfer chamber being coupled to at least one de-bonding chamber.

25. The OLED panel manufacturing system of claim 21, wherein the plurality of process chambers includes two different process chambers, a front end transfer chamber being connected to at least one temporary bonding chamber and to at least one de-bonding chamber, and a back end transfer chamber being connected to at least one de-bonding chamber and to at least one temporary bonding chamber.

26. An apparatus for forming a temporary pairing unit, comprising:

the vapor deposition shadow mask includes: the substrate, at least one in said base plate and said substrate is the transparent material; the grating film layer is positioned on the front surface of the substrate and is provided with a plurality of openings arranged in an array; a groove in the substrate through a thickness of the substrate, the groove exposing the plurality of openings in the grating film layer and the grating film layer between adjacent openings; the substrate comprises a pixel area and a cofferdam area surrounding the pixel area, a cofferdam structure is formed on part of the surface of the cofferdam area, and the cofferdam structure can limit the UV glue formed subsequently between the substrate and the substrate outside the cofferdam structure.

27. The apparatus for forming a temporary matching unit according to claim 26, wherein the UV glue dispensed by the dispensing unit is UV glue that undergoes a gluing reaction when irradiated with UV light to bond the substrate to the evaporation shadow mask and melts the gluing molecules when irradiated with laser light to debond the substrate from the evaporation shadow mask.

28. An apparatus for forming a provisional mating unit according to claim 27, wherein said UV light irradiation unit emits UV light having a wavelength of 365nm or more and irradiation energy of 1000mj/cm or more ² 。