CN110045159A - It is a kind of to pick and place the test bench for expecting convenient BGA package - Google Patents

It is a kind of to pick and place the test bench for expecting convenient BGA package Download PDF

Info

Publication number
CN110045159A
CN110045159A CN201910438604.7A CN201910438604A CN110045159A CN 110045159 A CN110045159 A CN 110045159A CN 201910438604 A CN201910438604 A CN 201910438604A CN 110045159 A CN110045159 A CN 110045159A
Authority
CN
China
Prior art keywords
pair
support plate
groove
side support
bga package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201910438604.7A
Other languages
Chinese (zh)
Other versions
CN110045159B (en
Inventor
徐俊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
He Huahui
Original Assignee
Hangzhou Yizheng Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hangzhou Yizheng Technology Co Ltd filed Critical Hangzhou Yizheng Technology Co Ltd
Priority to CN201910438604.7A priority Critical patent/CN110045159B/en
Publication of CN110045159A publication Critical patent/CN110045159A/en
Application granted granted Critical
Publication of CN110045159B publication Critical patent/CN110045159B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

The invention discloses a kind of test bench for picking and placing the convenient BGA package of material, probe supporting plate elastic lifting is arranged in lower limit slot;The upper surface of probe supporting plate forms several probes;Probe passes vertically through upper limit position groove lower wall;A pair of of side support plate synchronization lifting is arranged in upper limit position groove;The close one end in the upper surface of a pair of of side support plate has been separately formed limit resettlement groove;The separate one end in the upper surface of a pair of of side support plate has been separately formed symmetrically arranged swinging support plate before and after a pair;The columned pendulum guide rod of front-rear direction setting is formed between swinging support plate;The lower end for swinging cover board forms oscillation center bar;Oscillation center bar is articulated in the front-rear side walls lower end of the swing escape groove of corresponding side;Swing cover sheet metal forming has front and back to slide guide groove through the long hole shape being arranged;Pendulum guide rod front-rear direction is passed through to slide guide groove and slide setting and slided in guide groove.Originally the operator that issues an order picks and places BGA package conveniently, high production efficiency, stable testing.

Description

It is a kind of to pick and place the test bench for expecting convenient BGA package
Technical field
The present invention relates to integrated circuit packing testing fields, and in particular to a kind of to pick and place the test for expecting convenient BGA package Seat.
Background technique
Semiconductor element is processed to semiconductor chip packaging, such as BGA package by a series of encapsulation engineerings, processes At semiconductor chip packaging, providing to passing through electric checking engineering before user;In above-mentioned electric checking engineering, utilize The electrical characteristic of test jack inspection semiconductor chip packaging.Herein, test jack is directly returning each semiconductor element The device on test equipment is electrically connected in road.
When test, operator is placed on BGA package in detection slot, side wall is then carried out, finally out of detection slot BGA package is taken out, since the gap size between encapsulation and the side wall of detection slot is limited, so operator picks and places BGA package It is not very convenient, the efficiency of test is affected in this way.
Summary of the invention
The purpose of the present invention is existing equipment operators to pick and place the technical problem of BGA package inconvenience, provides one kind and takes The test bench of the convenient BGA package of blowing.
The technical scheme to solve the above technical problems is that a kind of pick and place the test bench for expecting convenient BGA package, Support base and test including rectangular-shape take discharging device;The upper surface center of support base forms the upper limit of rectangle channel-shaped Slot, lower end surface center form the lower limit slot of rectangle channel-shaped;The left and right sidewall upper end of upper limit position groove has been separately formed swing and has kept away Allow slot;It includes probe supporting plate, a pair of of side support plate and a pair of of swing cover board that test, which takes discharging device,;Probe supporting plate elasticity liter Drop is arranged in lower limit slot;The upper surface of probe supporting plate forms several probes;Probe passes vertically through the upper limit from bottom to top The lower wall of position slot;When probe supporting plate is in the top, the upper end of probe is more than the lower wall of upper limit position groove;It is a pair of collateral Fagging synchronization lifting is arranged in upper limit position groove;The close one end in the upper surface of a pair of of side support plate has been separately formed limit placement Slot;When a pair of of side support plate is in the top, the lower wall for limiting resettlement groove is located at the top of support base;A pair of of side support plate The separate one end in upper surface be separately formed symmetrically arranged swinging support plate before and after a pair;It is formed between swinging support plate The columned pendulum guide rod of front-rear direction setting;The lower end for swinging cover board forms oscillation center bar;The pivot joint of oscillation center bar In the front-rear side walls lower end of the swing escape groove of corresponding side;Swing cover sheet metal forming has front and back to lead through the sliding for long hole shape of setting Slot;Pendulum guide rod front-rear direction is passed through to slide guide groove and slide setting and slided in guide groove;When a pair of of side support plate is in most When lower end, a pair swings cover board and is in horizontality;When a pair of of side support plate is in the top, a pair swings cover board and is located at one To the two sides of the separate side wall of limit resettlement groove.
As a preferred embodiment of the above technical solution, a pair of of pendulum guide rod is in the top of the left and right sides of a pair of of side support plate; When a pair of of side support plate is in bottom, the lower end surface that a pair swings cover board abuts against the upper surface of a pair of of side support plate.
As a preferred embodiment of the above technical solution, it is uniform to be respectively fixed with several front and backs for the lower wall left and right ends of upper limit position groove Fixed lifting cylinder;A pair of of side support plate is separately fixed at the upper end of the piston rod of the lifting cylinder of corresponding side.
As a preferred embodiment of the above technical solution, lifting cylinder is at least one.
As a preferred embodiment of the above technical solution, lower capping plate is fixed with by a pair of screws on the lower end surface of support base;It visits Several equally distributed pressure springs are fixed on the lower end surface of needle support plate;The lower end of pressure spring abuts against the upper surface of lower capping plate.
As a preferred embodiment of the above technical solution, a pair of screws countersunk head is arranged.
As a preferred embodiment of the above technical solution, the left and right sidewall lower end of lower limit slot has been separately formed lifting guide groove;Lifting Several lifting guide pillars being vertically arranged are separately formed on the upper side wall of guide groove;The left and right end face lower part of probe supporting plate respectively at Type has lifting guide block;Lifting guide block is set in vertically on the lifting guide pillar of corresponding side.
The beneficial effects of the present invention are: operator picks and places BGA package conveniently, high production efficiency, stable testing.
Detailed description of the invention
The structural schematic diagram of section when Fig. 1 is pick-and-place BGA package of the invention;
The structural schematic diagram of section when Fig. 2 is working condition of the invention.
In figure, 10, support base;100, upper limit position groove;101, escape groove is swung;102, lower limit slot;103, guide groove is gone up and down; 104, lifting guide pillar;11, lower capping plate;20, test takes discharging device;21, lifting cylinder;22, side support plate;220, limit peace Set slot;221, swinging support plate;222, pendulum guide rod;23, cover board is swung;231, oscillation center bar;24, probe supporting plate; 241, guide block is gone up and down;25, probe;26, pressure spring.
Specific embodiment
As shown in Figure 1 and Figure 2, a kind of to pick and place the test bench for expecting convenient BGA package, the support base 10 including rectangular-shape Discharging device 20 is taken with test;The upper surface center of support base 10 forms the upper limit position groove 100 of rectangle channel-shaped, lower end surface center Form the lower limit slot 102 of rectangle channel-shaped;The left and right sidewall upper end of upper limit position groove 100, which has been separately formed, swings escape groove 101; It includes probe supporting plate 24, a pair of of side support plate 22 and a pair of of swing cover board 23 that test, which takes discharging device 20,;Probe supporting plate 24 Elastic lifting is arranged in lower limit slot 102;The upper surface of probe supporting plate 24 forms several probes 25;Probe 25 from lower and On pass vertically through the lower wall of upper limit position groove 100;When probe supporting plate 24 is in the top, the upper end of probe 25 is more than the upper limit The lower wall of position slot 100;A pair of of 22 synchronization lifting of side support plate is arranged in upper limit position groove 100;A pair of of side support plate 22 it is upper The close one end in end face has been separately formed limit resettlement groove 220;When a pair of of side support plate 22 is in the top, resettlement groove is limited 220 lower wall is located at the top of support base 10;One end that the upper surface of a pair of of side support plate 22 is separate has been separately formed a pair The symmetrically arranged swinging support plate 221 in front and back;The columned swing of front-rear direction setting is formed between swinging support plate 221 Guide rod 222;The lower end for swinging cover board 23 forms oscillation center bar 231;The swing that oscillation center bar 231 is articulated in corresponding side is kept away Allow the front-rear side walls lower end of slot 101;It swings and slides guide groove 230 through the long hole shape of setting before and after cover board 23 forms;It swings 222 front-rear direction of guide rod is passed through to slide guide groove 230 and slide setting and slided in guide groove 230;At a pair of of side support plate 22 When bottom, a pair swings cover board 23 and is in horizontality;When a pair of of side support plate 22 is in the top, a pair of of swing cover Plate 23 is located at the two sides of the separate side wall of a pair of of limit resettlement groove 220.
As a preferred embodiment of the above technical solution, a pair of of pendulum guide rod 222 is in the left and right sides of a pair of of side support plate 22 Top;When a pair of of side support plate 22 is in bottom, the lower end surface that a pair swings cover board 23 abuts against a pair of of side support plate 22 Upper surface.
As a preferred embodiment of the above technical solution, the lower wall left and right ends of upper limit position groove 100 are respectively fixed with several front and backs Uniformly fixed lifting cylinder 21;A pair of of side support plate 22 is separately fixed at the upper of the piston rod of the lifting cylinder 21 of corresponding side End.
As a preferred embodiment of the above technical solution, lifting cylinder 21 is at least one.
As a preferred embodiment of the above technical solution, lower capping plate is fixed with by a pair of screws on the lower end surface of support base 10 11;Several equally distributed pressure springs 26 are fixed on the lower end surface of probe supporting plate 24;The lower end of pressure spring 26 abuts against lower capping The upper surface of plate 11.
As a preferred embodiment of the above technical solution, a pair of screws countersunk head is arranged.
As a preferred embodiment of the above technical solution, the left and right sidewall lower end of lower limit slot 102 has been separately formed lifting guide groove 103;It goes up and down and is separately formed several lifting guide pillars 104 being vertically arranged on the upper side wall of guide groove 103;A left side for probe supporting plate 24 Right side lower part has been separately formed lifting guide block 241;Lifting guide block 241 is set in vertically on the lifting guide pillar 104 of corresponding side.
Pick and place the working principle for expecting the test bench of convenient BGA package:
Original state is as shown in Figure 2: a pair of of side support plate 22 is in bottom, and a pair swings cover board 23 and is in horizontal State;
When work, a pair of of side support plate 22 is synchronous to be risen, and during this, a pair swings cover board 23 and becomes to incline from horizontality Ramp-like state, when a pair of of side support plate 22 is in the top, a pair swings cover board 23 and is located at the separate of a pair of of limit resettlement groove 220 Side wall two sides, then the spherical pin of BGA package is placed on downward in a pair of of limit resettlement groove 220, then a pair of collateral The synchronous decline of fagging 22, during this, a pair swings cover board 23 and becomes horizontality from heeling condition, and the upper end of probe 25 is first It is contradicted with the spherical pin of BGA package, but the swing cover board 23 of a pair of angled state limits BGA package and moves up disengaging at this time A pair of limit resettlement groove 220, under the action of pressure spring 26, the upper end of probe 25 is always maintained at and the spherical pin of BGA package Conflict state, when a pair of of side support plate 22 is in bottom, a pair swings cover board 23 and is in horizontality and abuts against BGA The upper surface of encapsulation can be tested in this way,
This process, operator pick and place BGA package conveniently, high production efficiency, stable testing.
The above content is only better embodiment of the invention, for those of ordinary skill in the art, according to the present invention Thought, there will be changes in the specific implementation manner and application range, and the content of the present specification should not be construed as to this hair Bright limitation.

Claims (7)

1. a kind of pick and place the test bench for expecting convenient BGA package, it is characterised in that: support base (10) and survey including rectangular-shape Examination takes discharging device (20);The upper surface center of support base (10) forms the upper limit position groove (100) of rectangle channel-shaped, in lower end surface The heart forms the lower limit slot (102) of rectangle channel-shaped;The left and right sidewall upper end of upper limit position groove (100) has been separately formed swing evacuation Slot (101);It includes probe supporting plate (24), a pair of of side support plate (22) and a pair of of swing cover board that test, which takes discharging device (20), (23);The setting of probe supporting plate (24) elastic lifting is in lower limit slot (102);The upper surface of probe supporting plate (24) forms Several probes (25);Probe (25) passes vertically through the lower wall of upper limit position groove (100) from bottom to top;At probe supporting plate (24) When the top, the upper end of probe (25) is more than the lower wall of upper limit position groove (100);A pair of of side support plate (22) synchronization lifting is set It sets in upper limit position groove (100);One end that the upper surface of a pair of of side support plate (22) is close has been separately formed limit resettlement groove (220);When a pair of of side support plate (22) is in the top, the lower wall of limit resettlement groove (220) is located at support base (10) Top;The separate one end in the upper surface of a pair of of side support plate (22) has been separately formed symmetrically arranged swinging support plate before and after a pair (221);The columned pendulum guide rod (222) of front-rear direction setting is formed between swinging support plate (221);Swing cover board (23) lower end forms oscillation center bar (231);Oscillation center bar (231) is articulated in the swing escape groove (101) of corresponding side Front-rear side walls lower end;It swings and slides guide groove (230) through the long hole shape of setting before and after cover board (23) form;Pendulum guide rod (222) front-rear direction is passed through to slide guide groove (230) and slide setting and slided in guide groove (230);When a pair of of side support plate (22) when being in bottom, a pair swings cover board (23) and is in horizontality;When a pair of of side support plate (22) is in the top, A pair swings the two sides that cover board (23) are located at the separate side wall of a pair of of limit resettlement groove (220).
2. a kind of test bench for picking and placing the convenient BGA package of material according to claim 1, it is characterised in that: a pair is swung Guide rod (222) is in the top of the left and right sides of a pair of of side support plate (22);When a pair of of side support plate (22) is in bottom, The lower end surface that a pair swings cover board (23) abuts against the upper surface of a pair of of side support plate (22).
3. a kind of test bench for picking and placing the convenient BGA package of material according to claim 1, it is characterised in that: upper limit position groove (100) lower wall left and right ends are respectively fixed with the lifting cylinder (21) uniformly fixed several front and backs;A pair of of side support plate (22) it is separately fixed at the upper end of the piston rod of the lifting cylinder (21) of corresponding side.
4. a kind of test bench for picking and placing the convenient BGA package of material according to claim 3, it is characterised in that: lifting cylinder (21) it is at least one.
5. a kind of test bench for picking and placing the convenient BGA package of material according to claim 1, it is characterised in that: support base (10) lower capping plate (11) is fixed with by a pair of screws on lower end surface;Probe supporting plate (24) if lower end surface on be fixed with Do equally distributed pressure spring (26);The lower end of pressure spring (26) abuts against the upper surface of lower capping plate (11).
6. a kind of test bench for picking and placing the convenient BGA package of material according to claim 5, it is characterised in that: a pair of screws Countersunk head setting.
7. a kind of test bench for picking and placing the convenient BGA package of material according to claim 1, it is characterised in that: lower limit slot (102) left and right sidewall lower end has been separately formed lifting guide groove (103);It goes up and down and has been separately formed on the upper side wall of guide groove (103) Several lifting guide pillars (104) being vertically arranged;The left and right end face lower part of probe supporting plate (24) has been separately formed lifting guide block (241);Lifting guide block (241) is set on the lifting guide pillar (104) of corresponding side vertically.
CN201910438604.7A 2019-05-24 2019-05-24 Get test seat of BGA encapsulation of material convenient Expired - Fee Related CN110045159B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910438604.7A CN110045159B (en) 2019-05-24 2019-05-24 Get test seat of BGA encapsulation of material convenient

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910438604.7A CN110045159B (en) 2019-05-24 2019-05-24 Get test seat of BGA encapsulation of material convenient

Publications (2)

Publication Number Publication Date
CN110045159A true CN110045159A (en) 2019-07-23
CN110045159B CN110045159B (en) 2021-03-05

Family

ID=67283427

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910438604.7A Expired - Fee Related CN110045159B (en) 2019-05-24 2019-05-24 Get test seat of BGA encapsulation of material convenient

Country Status (1)

Country Link
CN (1) CN110045159B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110837038A (en) * 2019-11-14 2020-02-25 杭州易正科技有限公司 SOP packaging test fixture with inclined plate capable of being horizontally moved and pressed to limit position
CN110907805A (en) * 2019-12-11 2020-03-24 杭州易正科技有限公司 Integrated circuit packaging testing device of portable categorised ejection of compact
CN110931381A (en) * 2019-12-11 2020-03-27 杭州易正科技有限公司 Integrated circuit packaging testing device for continuous testing

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202159077U (en) * 2011-01-26 2012-03-07 微联解决方案株式会社 BGA test socket adapter provided with guiding part for guiding ball terminal and styluses
CN204289401U (en) * 2014-12-16 2015-04-22 深圳市慧为智能科技有限公司 A kind of bga chip manual detection device
CN105324672A (en) * 2013-06-28 2016-02-10 惠康有限公司 Socket device for testing semiconductor device
CN105334444A (en) * 2015-11-14 2016-02-17 苏州光韵达光电科技有限公司 Detection system of BGA chip
CN105353175A (en) * 2015-11-22 2016-02-24 苏州光韵达光电科技有限公司 BGA packaging test socket
CN205656212U (en) * 2016-05-19 2016-10-19 深圳市华科伟业电路科技有限公司 Stiff and straight pin type test jig of PCB
CN106561084A (en) * 2014-04-28 2017-04-12 黄东源 Socket apparatus for semiconductor device test
CN107976618A (en) * 2016-03-08 2018-05-01 赵令臣 A kind of method of work of BGA package test jack
US20180277449A1 (en) * 2017-03-27 2018-09-27 Renesas Electronics Corporation Manufacturing method of semiconductor device, inspection device of semiconductor device, and semiconductor device
CN109307834A (en) * 2018-11-15 2019-02-05 天津津航计算技术研究所 A kind of BGA test jack of flexible connection

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202159077U (en) * 2011-01-26 2012-03-07 微联解决方案株式会社 BGA test socket adapter provided with guiding part for guiding ball terminal and styluses
CN105324672A (en) * 2013-06-28 2016-02-10 惠康有限公司 Socket device for testing semiconductor device
CN106561084A (en) * 2014-04-28 2017-04-12 黄东源 Socket apparatus for semiconductor device test
CN204289401U (en) * 2014-12-16 2015-04-22 深圳市慧为智能科技有限公司 A kind of bga chip manual detection device
CN105334444A (en) * 2015-11-14 2016-02-17 苏州光韵达光电科技有限公司 Detection system of BGA chip
CN105353175A (en) * 2015-11-22 2016-02-24 苏州光韵达光电科技有限公司 BGA packaging test socket
CN107976618A (en) * 2016-03-08 2018-05-01 赵令臣 A kind of method of work of BGA package test jack
CN205656212U (en) * 2016-05-19 2016-10-19 深圳市华科伟业电路科技有限公司 Stiff and straight pin type test jig of PCB
US20180277449A1 (en) * 2017-03-27 2018-09-27 Renesas Electronics Corporation Manufacturing method of semiconductor device, inspection device of semiconductor device, and semiconductor device
CN109307834A (en) * 2018-11-15 2019-02-05 天津津航计算技术研究所 A kind of BGA test jack of flexible connection

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110837038A (en) * 2019-11-14 2020-02-25 杭州易正科技有限公司 SOP packaging test fixture with inclined plate capable of being horizontally moved and pressed to limit position
CN110907805A (en) * 2019-12-11 2020-03-24 杭州易正科技有限公司 Integrated circuit packaging testing device of portable categorised ejection of compact
CN110931381A (en) * 2019-12-11 2020-03-27 杭州易正科技有限公司 Integrated circuit packaging testing device for continuous testing
CN110931381B (en) * 2019-12-11 2021-12-14 深圳市英赛尔电子有限公司 Integrated circuit packaging testing device for continuous testing

Also Published As

Publication number Publication date
CN110045159B (en) 2021-03-05

Similar Documents

Publication Publication Date Title
CN110045159A (en) It is a kind of to pick and place the test bench for expecting convenient BGA package
CN110045161A (en) A kind of test bench of BGA package
CN110045160A (en) A kind of test bench that the top of BGA package picks and places
CN102736018A (en) Printed circuit board (PCB) test tool
CN109103121A (en) Test bench for flat pin-free package chip
CN206684252U (en) A kind of Scanning Detction machine for being applied to TAB modules in LCD
CN207908586U (en) A kind of antenna measurement jig
CN212341375U (en) Electronic chip detection device for processing workshop
CN107957545A (en) FCT probe test instruments
CN209296854U (en) A kind of wire harness conduction detecting device
CN103851983A (en) Locating pin length detection machine
CN104345182B (en) A kind of multistation test fixture
CN206862269U (en) Semi-automatic detection crystalline substance brick end face squareness frock
CN208961302U (en) A kind of positive and negative testing agency of bonding machine nut
CN104897929A (en) Novel tipping test tool
CN213689712U (en) Circuit board testing device
CN212872009U (en) Anti pressure detection device of industry conveyer belt
CN205374651U (en) Short -circuit test carrier is opened to base plate
CN110931381B (en) Integrated circuit packaging testing device for continuous testing
KR20130124824A (en) Contact pin, and the socket for test of semiconductor package comprising the same
CN204964553U (en) Novel convertible test fixture
CN204228538U (en) A kind of three point bending test device for high speed tensile test machine
KR20140045627A (en) Test socket preventing warpage of semiconductor package
CN208239752U (en) A kind of liquid crystal display electrical measurement frame
CN101738298A (en) Falling-off test device and usage thereof

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
CB03 Change of inventor or designer information

Inventor after: He Huahui

Inventor before: Xu Jun

CB03 Change of inventor or designer information
TA01 Transfer of patent application right

Effective date of registration: 20210207

Address after: 510030 Room 203, No. 13, Manao Lane 2, Yuexiu District, Guangzhou City, Guangdong Province

Applicant after: He Huahui

Address before: Room 1303, building B, Kangxin garden, 569 Wensan Road, Xihu District, Hangzhou City, Zhejiang Province

Applicant before: HANGZHOU EZSOFT TECHNOLOGY Co.,Ltd.

TA01 Transfer of patent application right
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20210305

CF01 Termination of patent right due to non-payment of annual fee