CN110033920A - Stacked inductance device - Google Patents

Stacked inductance device Download PDF

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Publication number
CN110033920A
CN110033920A CN201810025775.2A CN201810025775A CN110033920A CN 110033920 A CN110033920 A CN 110033920A CN 201810025775 A CN201810025775 A CN 201810025775A CN 110033920 A CN110033920 A CN 110033920A
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CN
China
Prior art keywords
coil
inductance
circle
stacked
staggeredly
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Granted
Application number
CN201810025775.2A
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Chinese (zh)
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CN110033920B (en
Inventor
颜孝璁
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Realtek Semiconductor Corp
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Realtek Semiconductor Corp
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Priority to CN201810025775.2A priority Critical patent/CN110033920B/en
Publication of CN110033920A publication Critical patent/CN110033920A/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type 
    • H01F17/0006Printed inductances
    • H01F17/0013Printed inductances with stacked layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/2847Sheets; Strips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/30Fastening or clamping coils, windings, or parts thereof together; Fastening or mounting coils or windings on core, casing, or other support
    • H01F27/306Fastening or mounting coils or windings on core, casing or other support

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

A kind of stacked inductance device, it includes the first inductance unit and the second inductance units being configured on the first inductance unit.First inductance unit includes first coil and the second coil.First coil is configured at the first side of the first inductance unit.Second coil is configured at second side of the first inductance unit.First opening of the second coil is configured at the first side of stacked inductance device.Second inductance unit includes tertiary coil and the 4th coil.Tertiary coil is configured at the first side of the second inductance unit, and the first side of the second inductance unit corresponds to the first side of the first inductance unit.Second opening of tertiary coil is configured at second side of stacked inductance device.4th coil is configured at second side of the second inductance unit, and second side of the second inductance unit corresponds to second side of the first inductance unit.

Description

Stacked inductance device
Technical field
This case relates to a kind of inductance, and in particular to a kind of stacked inductance device.
Background technique
The inductor of existing various kenels all has its superiority and inferiority, such as helical form (spiral-type) inductor, Its quality factor (Q value) is higher and has biggish mutual inductance value (mutual inductance), its right mutual inductance value and lotus root are closed Occur between coil, and for splayed configuration inductor, because secondly coil-induced magnetic direction on the contrary, its lotus root is closed and mutual inductance Value is to occur to close magnetic field in the lotus root of another coil, in addition, the area that splayed configuration inductor occupies in device is larger.Furthermore heap Though the area that stack-type transformer occupies is smaller, so compared with the transformer of other kenel, quality factor is unable to reach optimization, Therefore, the application range of above-mentioned inductor/transformer is all limited.
It can be seen that above-mentioned existing mode, it is clear that there are still inconvenient and defects, and have much room for improvement.It is above-mentioned in order to solve Problem, related fields there's no one who doesn't or isn't painstakingly seeks solution, but does not develop solution appropriate yet for a long time.
Summary of the invention
Summary of the invention be intended to provide this disclosure simplify abstract so that reader have to this disclosure it is basic Understand.The invention content is not the complete overview of this disclosure, and it is not intended in the important/pass for pointing out embodiment of this case Key elements or the range for defining this case.
One of this case content purpose is to provide a kind of stacked inductance device, so as to improve prior art the problem of.
In order to achieve the above object, one of this case content technology aspect is about a kind of stacked inductance device, it includes first Inductance unit and the second inductance unit.Second inductance unit is configured on the first inductance unit.First inductance unit includes the One coil and the second coil.First coil is configured at the first side of the first inductance unit.Second coil is configured at the first inductance list Second side relative to the first side of member.Second coil includes the first opening, is configured at the first side of stacked inductance device. Second inductance unit includes tertiary coil and the 4th coil.Tertiary coil is configured at the first side of the second inductance unit, the second electricity The first side for feeling unit corresponds to the first side of the first inductance unit.Tertiary coil includes the second opening, is configured at stacked Second side relative to the first side of inductance device.4th coil is configured at second relative to the first side of the second inductance unit Side, second side of the second inductance unit correspond to second side of the first inductance unit.
Therefore, according to the technology contents of this case, embodiment of this case provides a kind of stacked inductor device, uses and reaches preferable Electric characteristics.
After refering to following description, this case those of ordinary skill in the art, which works as, can will readily appreciate that this case Essence spirit and other goals of the invention and this case used by technological means and state sample implementation.
Detailed description of the invention
For the above and other purpose, feature, advantage and embodiment of this case can be clearer and more comprehensible, the explanation of institute's accompanying drawings It is as follows:
Fig. 1 is the schematic diagram that a kind of stacked inductance device is painted according to one embodiment of this case.
Fig. 2 is to be painted the part-structure of stacked inductance device as shown in Figure 1 a kind of according to another embodiment of this case to show It is intended to.
Fig. 3 is to be painted the part-structure of stacked inductance device as shown in Figure 1 a kind of according to this case another embodiment to show It is intended to.
Fig. 4 is to be painted the part-structure of stacked inductance device as shown in Figure 1 a kind of according to the another embodiment of this case to show It is intended to.
Fig. 5 is to be painted the part-structure of stacked inductance device as shown in Figure 1 a kind of according to another embodiment of this case to show It is intended to.
Fig. 6 is the schematic diagram that a kind of stacked inductance device is painted according to one embodiment of this case.
Fig. 7 is the experimental data figure that a kind of stacked inductance device is painted according to one embodiment of this case.
According to usual operation mode, various features are not drawn to scale with element in figure, drafting mode be in order to Specific features relevant to this case and element are presented in optimal manner.In addition, between different schemas, with the same or similar member Part symbol censures similar elements/components.
[symbol description]
1000: stacked inductance device
1000A: stacked inductance device
1100, the 1100A: the first inductance unit
1110,1110A: first coil
1112: first lap
1114: the second circles
1116: staggeredly at coupling
1120, the 1120A: the second coil
1122: third circle
1124: the four circles
1126: staggeredly at coupling
1128: the first openings
1130: the first staggeredly part
1190: adjacent
Staggeredly couple point at 1192: the first
1194: the first coupling sections
1200, the 1200A: the second inductance unit
1210,1210A: tertiary coil
1212: the second openings
1214, the 1214A: the first winding part
1220, the 1220A: the four coil
1224, the 1224A: the second winding part
1230: the second staggeredly part
1290: adjacent
Staggeredly couple point at 1292: the second
1294: the second coupling sections
C1, C2, C3, C4: curve
Specific embodiment
In order to keep the narration of this disclosure more detailed and complete, below for this case state sample implementation and specific reality It applies example and proposes illustrative description;But this not implements or uses the unique forms of this case specific embodiment.In embodiment Cover the feature of multiple specific embodiments and method and step and its sequence to these specific embodiments of construction and operation. However, can also reach identical or impartial function and sequence of steps using other specific embodiments.
Unless this specification is defined otherwise, the meaning and this case technical field of science and technology vocabulary used herein Middle tool usually intellectual understands identical as usual meaning.In addition, in the case of getting along well context conflict, this specification Singular noun used covers the complex number type of the noun;And also cover the singular type of the noun when used plural noun.
In addition, about " coupling " used herein, can refer to two or multiple element mutually directly make entity or be electrically connected with Touching, or mutually put into effect indirectly body or in electrical contact is also referred to as two or multiple element mutual operation or movement.
Fig. 1 is the schematic diagram that a kind of stacked inductance device 1000 is painted according to one embodiment of this case.It should be noted that figure Stacked inductance device 1000 shown in 1 is 1200 heap of the first inductance unit 1100 and the second inductance unit to be included by it It stacks and is formed by overall structure and (opening of the first inductance unit 1100 and the second inductance unit 1200 is marked in figure Show in favor of distinguishing the two).To be apparent to the structure of above-mentioned stacked inductance device 1000, the formula of drawing hereby is disassembled into figure 2 and 1200 structure of the first inductance unit 1100 shown in Fig. 3 and the second inductance unit, and detailed description is as follows.Notably It is, although the opening of the first inductance unit 1100 and the second inductance unit 1200 of drawing formula in this case Fig. 1 is to be located at upper and lower two sides, In detail, the opening of the first inductance unit 1100 is located at upper right side in figure, and the opening of the second inductance unit 1200 is located in figure Lower left side.However, this case is not limited thereto, the opening of above-mentioned first inductance unit 1100 and the second inductance unit 1200 also may be used The left and right sides is set to according to actual demand, for example, the opening of the first inductance unit 1100 can be turn 90 degrees (as clockwise It is rotated by 90 °) and it is set to the right side in figure, and the opening of the second inductance unit 1200 can turn 90 degrees and (such as rotate clockwise 90 Degree) and it is set to the left side in figure.
Fig. 2 is the part knot that a kind of stacked inductance device 1000 as shown in Figure 1 is painted according to another embodiment of this case Structure schematic diagram.As shown, this is the first inductance unit 1100 of stacked inductance device 1000, this first inductance unit 1100 Include first coil 1110 and the second coil 1120.In in structure, first coil 1110 is configured at the first inductance unit 1100 First side (left side in such as figure).Second coil 1120 is then configured at second side relative to the first side of the first inductance unit 1100 (right side in such as figure).In addition, the second coil 1120 includes the first opening 1128, configure in the stacked inductance for corresponding to Fig. 1 The first side (upside in such as figure) of device 1000.
Fig. 3 is the part knot that a kind of stacked inductance device 1000 as shown in Figure 1 is painted according to this case another embodiment Structure schematic diagram.As shown, this is the second inductance unit 1200 of stacked inductance device 1000, this second inductance unit 1200 It is configured on the first inductance unit 1100 of Fig. 2, to form stacked inductance device 1000 shown in FIG. 1.Above-mentioned second electricity Feeling unit 1200 includes tertiary coil 1210 and the 4th coil 1220.In in structure, tertiary coil 1210 is configured at the second inductance The first side (left side in such as figure) of unit 1200, the first side of the second inductance unit 1200 corresponds to the first inductance unit of Fig. 2 1100 the first side.Tertiary coil 1210 includes the second opening 1212, is configured in the stacked inductance device for corresponding to Fig. 1 1000 second side (downside in such as figure) relative to the first side.In addition, the 4th coil 1220 is configured at the second inductance unit 1200 second side (in such as figure right side) relative to the first side, second side of the second inductance unit 1200 corresponding to Fig. 2 the Second side of one inductance unit 1100.
In one embodiment, the first inductance unit 1100 shown in Fig. 2 is configured at the first metal layer, and shown in Fig. 3 second Inductance unit 1200 is configured at the second metal layer of position on the first metal layer.In another embodiment, the first metal layer can be But it is not limited to super thick metal (Ultra Thick Metal, UTM) layer, second metal layer can be but be not limited to reroute layer (Re- Distribution Layer,RDL)。
Referring to Figure 2 together with Fig. 3, in some embodiments, first coil 1110 and the second coil 1120 are in adjacent 1190 staggeredly couple.In addition, tertiary coil 1210 and the 4th coil 1220 are staggeredly coupled in adjacent 1290.
Referring to Figure 2 together with Fig. 3, in some embodiments, first coil 1110 and the second coil 1120 are in adjacent 1190 are staggeredly coupled to the first staggeredly coupling 1192.In addition, tertiary coil 1210 and the 4th coil 1220 are in adjacent 1290 Staggeredly it is coupled to the second staggeredly coupling 1292.Please referring back to Fig. 1, first, which staggeredly couples point 1192 and second, staggeredly couples point 1292 is underlapped.
In one embodiment, referring to Fig. 2, first coil 1110 and the second coil 1120 are coupled to the first coupling section 1194.In addition, the first inductance unit 1100 further include first staggeredly part 1130, this first staggeredly part 1130 across first coupling section 1194 to couple first coil 1110 and the second coil 1120.In another embodiment, referring to Fig. 3, tertiary coil 1210 with 4th coil 1220 is coupled to the second coupling section 1294.In addition, the second inductance unit 1200 further include second staggeredly part 1230, this Second staggeredly part 1230 across second coupling section 1294 to couple tertiary coil 1210 and the 4th coil 1220.In some embodiments In, referring to Figure 2 together with Fig. 3, the first coupling section 1194, second coupling section 1294 is located at same with the first inductance unit 1100 Layer, such as all it is located at the first metal layer.First interlocks, and staggeredly part 1230 and the second inductance unit 1200 are located at together part 1130, second One layer, such as all it is located at second metal layer.
It is coiled at least two circles, third line respectively with Fig. 3, first coil 1110 and the second coil 1120 referring to Figure 2 together Circle 1210 and the 4th coil 1220 are coiled at least one circle respectively.
Referring to Fig. 2, in one embodiment, the first coil 1110 of the first inductance unit 1100 include first lap 1112 and Second circle 1114.In in structure, the second circle 1114 is configured at the periphery of first lap 1112, above-mentioned first lap 1112 and the second circle 1114 staggeredly couple in the first side (upside in such as figure) of the stacked inductance device 1000 of corresponding diagram 1.In addition, the first inductance list Second coil 1120 of member 1100 includes third circle 1122 and the 4th circle 1124.In in structure, the second circle 1114 is configured at third The periphery of circle 1122, second side of the stacked inductance device 1000 of above-mentioned third circle 1122 and the 4th circle 1124 in corresponding diagram 1 (downside in such as figure) staggeredly couples.
In one embodiment, the second coil 1120 first opening 1128 be located at the second coil 1120 third circle 1122 and 1126 opposite side (upside in such as figure) at the staggeredly coupling of 4th circle 1124.
Also referring to Fig. 1 to Fig. 3, tertiary coil 1210 is configured at 1114 top of the second circle of first coil 1110, the Four coils 1220 are configured at 1124 top of the second circle of the second coil 1120.
In one embodiment, referring to Fig. 3, tertiary coil 1210 includes the first winding part 1214, this first winding part 1214 are located at the opposite side (upside in such as figure) of the second opening 1212 of tertiary coil 1210.In addition, referring to Figure 2 together with figure 3, the first winding part 1214 is located at same at the staggeredly coupling of the first lap 1112 of first coil 1110 and the second circle 1,114 1116 Side (in such as figure upside), and the first winding part 1214 with 1116 weights at the staggeredly coupling of first lap 1112 and the second circle 1114 It is folded.
In another embodiment, referring to Fig. 3, the 4th coil 1220 includes the second winding part 1224, this second winding part 1224 positioned at the opposite side (downside in such as figure) of the first opening 1128 of the second coil 1120 of corresponding Fig. 2.In addition, please together Refering to Fig. 2 and Fig. 3, at the staggeredly coupling of the third circle 1122 and the 4th circle 1124 of the second winding part 1224 and the second coil 1120 1126 are located at the same side (downside in such as figure), and the second winding part 1224 does not enclose 1124 staggeredly coupling with third circle 1122 and the 4th Connect 1126 overlapping of place.
Also referring to Fig. 1 to Fig. 3, in 1120 adjacent 1190 of first coil 1110 and the second coil, or in third 1220 adjacent 1290 of coil 1210 and the 4th coil, first lap 1112, the tertiary coil 1210, First Line of first coil 1100 The second of circle 1110 encloses the first of the 1114, the 4th coil 1220, the second circle 1124 of the second coil 1120 and the second coil 1120 Enclose 1122 sequentials.
Also referring to Fig. 1 to Fig. 3, in 1120 adjacent 1190 of first coil 1110 and the second coil, or in third 1220 adjacent 1290 of coil 1210 and the 4th coil, first lap 1112, the tertiary coil 1210, First Line of first coil 1100 The second of circle 1110 encloses the first of the 1114, the 4th coil 1220, the second circle 1124 of the second coil 1120 and the second coil 1120 It is underlapped each other between circle 1122.
Fig. 4 is the part knot that a kind of stacked inductance device 1000 as shown in Figure 1 is painted according to the another embodiment of this case Structure schematic diagram.It is that the structure for being located at same metal layer is drawn into formula in same figure compared to Fig. 2, Fig. 4, in favor of understanding this case Structure.Fig. 5 is to be painted the part-structure of stacked inductance device 1000 as shown in Figure 1 a kind of according to another embodiment of this case to show It is intended to.It is that the structure for being located at same metal layer is drawn into formula in same figure compared to Fig. 3, Fig. 5, in favor of understanding the knot of this case Structure.Label in Fig. 4 and Fig. 5 identical person into Fig. 3 with Fig. 1 is for identical component, and the relationship of each component is in above-mentioned implementation Illustrate in example, is not repeated in this.It should be noted that being found out by Fig. 4 and Fig. 5, in stacked inductance device 1000, it is located at The structure of same layer is very symmetrical, and therefore, the related more general induction structure of electric characteristics is preferred.
Fig. 6 is the schematic diagram that a kind of stacked inductance device 1000A is painted according to one embodiment of this case.Compared to Fig. 1 institute The stacked inductance device 1000 shown, the first coil of the first inductance unit 1100A of the stacked inductance device 1000A of Fig. 6 1110A is staggeredly coupled to left side, the first winding part 1214A of the second inductance unit 1200A in figure and is also correspondingly configured in figure Left side.In addition, the second coil 1120A of the first inductance unit 1100A of the stacked inductance device 1000A of Fig. 6 is staggeredly coupled The right side in figure, the second winding part 1224A of the second inductance unit 1200A are also correspondingly configured at right side in figure.
Fig. 7 is the experimental data figure that a kind of inductance device is painted according to one embodiment of this case.This experimental data figure is It is bright under different frequency, the quality factor (Q) and inductance value of inductance device.As shown, curve C1 is the stack electricity of this case The quality factor curve graph of first inductance unit 1100 of induction device 1000, curve C2 are the stacked inductor device 1000 of this case The second inductance unit 1200 quality factor curve graph, curve C3 be this case the first inductance unit 1100 inductance value curve Figure, curve C4 are the inductance value curve graph of second inductance unit 1200 of this case.By the experimental data of Fig. 6 it is found that inductance device Quality factor can reach about 11.Therefore, the electric characteristics of the stacked inductor device 1000 of this case are preferable.It is more than right this case not It states the numerical value that embodiment is lifted to be limited, above-mentioned numerical value can be adjusted according to actual demand to reach optimal efficiency by practising its those skilled in the art.
By above-mentioned this case embodiment it is found that there are following advantages using this case.Embodiment of this case provides a kind of stack Inductance device is used and reaches preferable electric characteristics (such as inductance quality factor with higher), to promote stacked inductor dress The efficiency set.
Although disclosing the specific embodiment of this case in embodiment above, so it is not limited to this case, this case institute Belong in technical field and has usually intellectual, it is various when that can be carried out to it in the case of not departing from the principle and spirit of this case It changes and modification, therefore the protection scope of this case is when being subject to subsidiary claim institute defender.

Claims (10)

1. a kind of stacked inductance device, includes:
One first inductance unit includes:
One first coil is configured at one first side of first inductance unit;And
One second coil is configured at second side relative to first side of first inductance unit, includes:
One first opening, is configured at one first side of the stacked inductance device;And
One second inductance unit is configured on first inductance unit, includes:
One tertiary coil is configured at one first side of second inductance unit, wherein the first side phase of second inductance unit Should be in first side of first inductance unit, wherein the tertiary coil includes:
One second opening, is configured at second side relative to first side of the stacked inductance device;
One the 4th coil is configured at second side relative to first side of second inductance unit, wherein second inductance The second side of unit corresponds to the second side of first inductance unit.
2. stacked inductance device according to claim 1, wherein first inductance unit is configured at a first metal layer, Second inductance unit is configured at a second metal layer of the position on the first metal layer.
3. stacked inductance device according to claim 1, wherein the first coil and second coil are handed in adjacent Mistake coupling, the tertiary coil and the 4th coil are staggeredly coupled in adjacent.
4. stacked inductance device according to claim 3, wherein the first coil and second coil are handed in adjacent Mistake is coupled to one first staggeredly coupling point, and the tertiary coil and the 4th coil are staggeredly coupled to one second staggeredly coupling in adjacent Contact, wherein this first staggeredly coupling point with this second staggeredly coupling it is underlapped.
5. stacked inductance device according to claim 1, wherein the first coil and second coil are coupled to one the One coupling section, wherein first inductance unit further include one first staggeredly part, this first staggeredly part across this first coupling section with Couple the first coil and second coil.
6. stacked inductance device according to claim 5, wherein the tertiary coil and the 4th coil are coupled to one the Two coupling sections, wherein second inductance unit further include one second staggeredly part, this second staggeredly part across this second coupling section with Couple the tertiary coil and the 4th coil.
7. stacked inductance device according to claim 6, wherein the first coupling section, the second coupling section and first are electric Sense unit is located on the same floor, wherein this first staggeredly part, second staggeredly part and second inductance unit are located on the same floor for this.
8. stacked inductance device according to claim 1, wherein the first coil and second coil be coiled into respectively to Few two circle, the tertiary coil and the 4th coil are coiled at least one circle respectively.
9. stacked inductance device according to claim 8, wherein the first coil of first inductance unit includes:
One first lap;And
One second circle, is configured at the periphery of the first lap, and wherein the first lap and second circle are in the stacked inductance device First top-cross mistake coupling;
Wherein second coil of first inductance unit includes:
One third circle;And
One the 4th circle, is configured at the periphery of the third circle, and wherein the third circle is with the 4th circle in the stacked inductance device The second side staggeredly couples.
10. stacked inductance device according to claim 8, wherein the first coil of first inductance unit includes:
One first lap;And
One second circle, is configured at the periphery of the first lap, and wherein the first lap and second circle are staggeredly coupled to the first coil With the opposite other side of the second coil sides adjacent;
Wherein second coil of first inductance unit includes:
One third circle;And
One the 4th circle, is configured at the periphery of the third circle, and wherein the third circle is staggeredly coupled to second coil with the 4th circle The opposite other side with the first coil sides adjacent.
CN201810025775.2A 2018-01-11 2018-01-11 Stacked inductor device Active CN110033920B (en)

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CN110033920B CN110033920B (en) 2021-11-02

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113690031A (en) * 2020-05-18 2021-11-23 瑞昱半导体股份有限公司 Stacked inductor device

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CN104769687A (en) * 2012-09-20 2015-07-08 马维尔国际贸易有限公司 Transformer circuits having transformers with figure eight and double figure eight nested structures
US20150270054A1 (en) * 2014-03-19 2015-09-24 Realtek Semiconductor Corp. Integrated stacked transformer
CN106571211A (en) * 2015-10-13 2017-04-19 瑞昱半导体股份有限公司 Integrated inductor structure and integrated transformer structure
CN106710847A (en) * 2015-07-15 2017-05-24 瑞昱半导体股份有限公司 Planar transformer and balance-unbalance converter structure
CN106783094A (en) * 2015-11-23 2017-05-31 联发科技股份有限公司 Inductor and electrical inductor assembly

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Publication number Priority date Publication date Assignee Title
CN102693956A (en) * 2011-03-21 2012-09-26 联发科技股份有限公司 Signal transforming circuit
CN104769687A (en) * 2012-09-20 2015-07-08 马维尔国际贸易有限公司 Transformer circuits having transformers with figure eight and double figure eight nested structures
US20150270054A1 (en) * 2014-03-19 2015-09-24 Realtek Semiconductor Corp. Integrated stacked transformer
CN106710847A (en) * 2015-07-15 2017-05-24 瑞昱半导体股份有限公司 Planar transformer and balance-unbalance converter structure
CN106571211A (en) * 2015-10-13 2017-04-19 瑞昱半导体股份有限公司 Integrated inductor structure and integrated transformer structure
CN106783094A (en) * 2015-11-23 2017-05-31 联发科技股份有限公司 Inductor and electrical inductor assembly

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113690031A (en) * 2020-05-18 2021-11-23 瑞昱半导体股份有限公司 Stacked inductor device
CN113690031B (en) * 2020-05-18 2023-11-21 瑞昱半导体股份有限公司 stacked inductor device

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