CN110031932A - Integrated light emission component and assemble method - Google Patents

Integrated light emission component and assemble method Download PDF

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Publication number
CN110031932A
CN110031932A CN201910172277.5A CN201910172277A CN110031932A CN 110031932 A CN110031932 A CN 110031932A CN 201910172277 A CN201910172277 A CN 201910172277A CN 110031932 A CN110031932 A CN 110031932A
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CN
China
Prior art keywords
lens
shell
adapter
isolator
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910172277.5A
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Chinese (zh)
Inventor
郑盼
周日凯
付永安
朱虎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan Telecommunication Devices Co Ltd
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Wuhan Telecommunication Devices Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan Telecommunication Devices Co Ltd filed Critical Wuhan Telecommunication Devices Co Ltd
Priority to CN201910172277.5A priority Critical patent/CN110031932A/en
Publication of CN110031932A publication Critical patent/CN110031932A/en
Pending legal-status Critical Current

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Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122Basic optical elements, e.g. light-guiding paths
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/26Optical coupling means
    • G02B6/27Optical coupling means with polarisation selective and adjusting means
    • G02B6/2746Optical coupling means with polarisation selective and adjusting means comprising non-reciprocal devices, e.g. isolators, FRM, circulators, quasi-isolators
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/36Mechanical coupling means
    • G02B6/38Mechanical coupling means having fibre to fibre mating means
    • G02B6/3807Dismountable connectors, i.e. comprising plugs
    • G02B6/3897Connectors fixed to housings, casing, frames or circuit boards
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12083Constructional arrangements
    • G02B2006/12085Integrated
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12083Constructional arrangements
    • G02B2006/12102Lens
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12133Functions
    • G02B2006/12157Isolator

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

The invention discloses a kind of integrated light emission components, comprising: docking mould group, isolator, adapter;The docking mould group, is mounted in first shell, for connecting with optical fiber or fiber array;The adapter, is mounted in second shell;The isolator is mounted in the first shell or the second shell, and between the docking mould group and the adapter;Wherein, the first shell and the second shell physical connection.The present invention further simultaneously discloses a kind of assemble method of integrated light emission component.

Description

Integrated light emission component and assemble method
Technical field
The present invention relates to optical communication field more particularly to a kind of integrated light emission components and assemble method.
Background technique
In optical communication system, optical signal transmission can pass through multiple and different optical interfaces, and in each optical interface Different degrees of light reflection can be generated, the return light for reflecting generation may pass light source back along original optical path, and work as backhaul light intensity When degree is accumulated to a certain extent, it will affect optical communication system and stablize normal work.
Isolator is a kind of Passive Optical Components for only Unidirectional light being allowed to pass through.Isolator is that light is allowed to pass through to a direction And the passive device for preventing light from passing through round about.The effect of isolator is limited the direction of optical transport, makes light only It can one direction transmission.It can increase between FA (Fiber Array, fiber array) or optical fiber, and the contact pin component of adapter Line isolator can be isolated device isolation by the light of each optics end face echo reflection, to improve the echo of light emission component Loss.It is generally necessary to which the inside modules in light emission component carry out disk fibre, the installation of isolator could be completed.Due in light emitting The inside modules of component have carried out disk fibre, it may appear that the positioning of optical fiber is more difficult, fine risk of breaking.
Summary of the invention
The embodiment of the present invention provides a kind of integrated light emission component and assemble method.
The technical scheme of the present invention is realized as follows:
On the one hand, a kind of integrated light emission component is provided, comprising:
Dock mould group, isolator, adapter;
The docking mould group, is mounted in first shell, for connecting with optical fiber or fiber array;
The adapter, is mounted in second shell;
The isolator is mounted in the first shell or the second shell, and is located at the docking mould group and institute It states between adapter;
Wherein, the first shell and the second shell physical connection.
Further, the integrated light emission component further include:
Lens module, the light between the docking mould group and the adapter, for providing the docking mould group Line converges on the incident end face of the adapter.
Further, the lens module includes: the first lens and the second lens, wherein first lens are located at institute It states between docking mould group and second lens;
First lens, the light for providing the docking mould group converge to the mirror surface of second lens;
Second lens, the light for will transmit through first lens converge to the incident end face of the adapter On.
Further, second lens are between the isolator and the adapter, for will transmit through it is described every It is converged to from the light of device on the incident end face of the adapter.
Further, the isolator is between second lens and the adapter, for will transmit through described The light of one lens converges on the incident end face of the isolator.
Further, the docking mould group includes lock pin;
The lens module includes the third lens, wherein the third lens be located at the lock pin and the isolator it Between, the third lens are used to converge to the light that the lock pin transmits the incident end face of the isolator.
The present invention also provides a kind of assemble methods of integrated light emission component, comprising:
Docking mould group is mounted in first shell, wherein the docking mould group with optical fiber or fiber array for connecting;
Adapter is mounted in second shell;
Isolator is mounted in the first shell or the second shell, wherein it is described right that the isolator is located at It connects between mould group and the adapter;
First shell described in physical connection and the second shell.
Further, the method also includes:
By way of press-fit, the lock pin in the adapter and the second shell are connected, and make the adapter In sleeve encircle the lock pin;
By way of press-fit, the seam allowance in the adapter and the second shell are connected.
Further, the method also includes:
First lens are mounted in the first shell or the second shell, the light that the docking mould group is provided It converges on the incident end face of the adapter;
Second lens are mounted in the first shell or the second shell, second lens is made to be located at described the Between one shell and the adapter, and the light through first lens is made to converge to the incident end face of the adapter On.
Further, the method also includes:
The third lens are mounted in the first shell or the second shell, are located at the third lens described right The light for connecing between the lock pin and the isolator in mould group, and transmitting the lock pin converges to the incidence end of the isolator On face.
Integrated light emission component and assemble method provided by the invention, comprising: docking mould group, isolator, adapter;It is described Mould group is docked, is mounted in first shell, for being connect with optical fiber or fiber array;The adapter, is mounted on second shell It is interior;The isolator is mounted in the first shell or the second shell, and is located at the docking mould group and the adaptation Between device;Wherein, the first shell and the second shell physical connection.First shell and second shell in the present invention is logical The mode for crossing physical connection is attached, make isolator be located at docking mould group and adapter between, docking mould group can with optical fiber or Fiber array connection.Directly by optical fiber will not with dock mould group or adapter is located at the intracorporal isolator of the same shell and is installed on It docks between mould group and adapter, if the optical fiber directly exposed module-external in light emission component, can be such that optical fiber is easily damaged And be not easy to transmit, thus need to carry out disk fibre in the inside modules of light emission component, and in the inside modules of light emission component The problems such as carrying out disk fibre, location difficulty, disconnected fibre can be caused.Method provided by the invention, it is complete by first shell and second shell At the installation of isolator, disk fibre is carried out compared to the inside modules in light emission component, is reduced as determine caused by disk is fine The risk for the problems such as position is more difficult, disconnected fine.
Detailed description of the invention
Fig. 1 is a kind of composed structure schematic diagram of COB light emission component provided in an embodiment of the present invention;
Fig. 2 is a kind of composed structure schematic diagram of the adapter assembly with FA provided in an embodiment of the present invention;
Fig. 3 is provided in an embodiment of the present invention a kind of to increase online isolator between FA and the contact pin component of adapter The composed structure schematic diagram of light emission component;
Fig. 4 is that one kind provided in an embodiment of the present invention increases isolator between light emitting chip and PLC chip in assembly Light emission component composed structure schematic diagram;
Fig. 5 is a kind of light emitting group that isolator is inserted between PLC chip rear end and FA provided in an embodiment of the present invention The composed structure schematic diagram of part;
Fig. 6 is a kind of composed structure schematic diagram of integrated light emission component provided in an embodiment of the present invention;
Fig. 7 is a kind of flow diagram of the assemble method of integrated light emission component provided in an embodiment of the present invention;
Fig. 8 is a kind of composed structure schematic diagram of integrated light emission component provided in an embodiment of the present invention;
Fig. 9 is a kind of composed structure schematic diagram of integrated light emission component provided in an embodiment of the present invention;
Figure 10 is a kind of composed structure schematic diagram of integrated light emission component provided in an embodiment of the present invention;
Figure 11 is a kind of composed structure schematic diagram of integrated light emission component provided in an embodiment of the present invention;
Figure 12 is a kind of composed structure schematic diagram of integrated light emission component provided in an embodiment of the present invention;
Figure 13 is a kind of composed structure schematic diagram of integrated light emission component provided in an embodiment of the present invention.
Specific embodiment
Understand in order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with attached drawing pair The embodiment of the present invention is described in detail.
For cost consideration, non-hermetically sealed encapsulation COB (Chip On Board, chip on board) light source applications are more.Using The job stability of COB light source sun adjuster part and reliability it is more demanding, particularly with multi-channel parallel optical device interior lights The working performance on road requires more harsh.
Fig. 1 is a kind of composed structure schematic diagram of COB light emission component provided in an embodiment of the present invention, comprising: laser Chipset 101, ceramic circuit board 102, back light detector group 103, preceding coupled lens group 104, PLC (Planar Lightwave Circuit, Planar Lightwave Circuit Technology) chip 105, tungsten copper substrate 106, PCB (Printed Circuit Board, printed circuit Plate) 108, the adapter assembly 107 with FA.Wherein, adapter assembly 107 includes: FA 107-1, optical fiber 107-2, with short fibre LC type adapter 107-3.
Fig. 2 is a kind of composed structure schematic diagram of the adapter assembly with FA provided in an embodiment of the present invention, comprising: FA Head or capillary 107-1, optical fiber 107-2, with short fibre LC type adapter 107-3, wherein with short fibre LC type adapter 107-3 It again include following components: ceramic rod 107-30, adapter metalwork 107-31, ceramic sleeve 107-32, metal seam allowance 107-33.Wherein, it is also silent sleeve that ceramic sleeve 107-32, which can be open sleeve,.Ceramic rod 107-30 and adapter metal Carry out press-fitting assembling between part 107-31, ceramic sleeve 107-32 cradles ceramic rod 107-30, metal seam allowance 107-33 and suitable It is assembled between orchestration metalwork 107-31 using press-fitting or glue technique for sticking.The both ends optical fiber 107-2 pass through ceramic rod 107-30 and capillary 107-1.
It is not provided with the device for reducing return loss in Fig. 1 and modular construction shown in Fig. 2, for optical communication system requirement High or optical chip is for reflecting the more sensitive component of return light, particularly with high speed device product, using may not be able to above expire The requirement of sufficient steady operation needs to improve on this basis, provide it is a kind of there is high return loss, high reliability, high integration, Low cost, the light emission component easily produced in batches.
Fig. 3 is provided in an embodiment of the present invention a kind of to increase online isolator between FA and the contact pin component of adapter The composed structure schematic diagram of light emission component.On the basis of light emission component shown in Fig. 1, increase online isolator 107-4, It is integrated with small short fibre that FA may be implemented, and be able to achieve AWG (Arrayed Waveguide Grating, Waveguide array light Grid) the oblique 8 ° of end faces of chip and FA oblique 8 ° of end faces seamless connection, it is more preferable for stability of layout;But online isolator cost Height, and since online isolator volume size is larger, and module volume is limited, such light emission component needs disk in inside modules Fibre, disk fibre are more difficult for the positioning of optical fiber, exist simultaneously the risk for the fibre that breaks.
Fig. 4 is that one kind provided in an embodiment of the present invention increases isolator between light emitting chip and PLC chip in assembly Light emission component composed structure schematic diagram.Increase isolator group 110 on the basis of light emission component shown in Fig. 1.And Usual optoisolator thickness is thicker, about 1.1mm, in this way for LD (Laser Diode, semiconductor laser) and PLC chip it Between coupled lens require that operating distance is longer, the distance at least 1.1mm in lens rear face to PLC chip light inlet, if Using the silicon lens of low cost, operating distance is shorter, can not place the space of isolator, glass aspheric can only be selected saturating in this way Mirror;And the non-globe lens higher cost of glass;And for multi-channel parallel emitting module, optical isolation need to be sequentially inserted into each channel Device undoubtedly also increases optical assembly cost, simultaneously because isolator own dimensions problem, component interchannel is away from cannot accomplish to compare It is small.Due to dimensional problem, isolator can only select built-in magnetic field isolator, there is magnet type objects in hot environment or processing procedure The phenomenon that contacting, being easy to appear demagnetization, to make isolator cisco unity malfunction.
Fig. 5 is a kind of light emitting group that isolator is inserted between PLC chip rear end and FA provided in an embodiment of the present invention The composed structure schematic diagram of part.Thus need to open PLC chip and the FA of integrated ferrule assembly points, centre insertion lens and Isolator.Increase coupled lens 111 and isolator 112 on the basis of Fig. 1.Coupled lens 111, isolator 112 after in the program And the FA head 107-1 of integrated contact pin is required to fall on substrate and be solidified, and undoubtedly increases the length of bottom cushion block 106 Degree considers that bottom cushion block 106 is nested into pcb board 108 generally in order to radiate, and can thus reduce can fabric swatch sky in pcb board Between, to increase certain difficulty to module design;Meanwhile device fabrication processes increase 1 secondary coupling curing process, so that device Manufacture craft is relatively cumbersome.
The drawbacks of being brought based on above-mentioned several method, the present invention is intended to provide a kind of novel high return loss band FA and adaptation The integral component of device assembly and a kind of light emission component structure with excellent performance, small size and low cost.It is whole Scheme high reliablity, productibility are strong, at low cost.
Fig. 6 is a kind of composed structure schematic diagram of integrated light emission component provided in an embodiment of the present invention, comprising:
Dock mould group 601, isolator 602, adapter 603;
The docking mould group 601, is mounted in first shell 604, for connecting with optical fiber or fiber array;
The adapter 603, is mounted in second shell 605;
The isolator 602 is mounted in the first shell 604 or the second shell 605, and is located at the docking Between mould group 601 and the adapter 603;
Wherein, 605 physical connection of the first shell 604 and the second shell.
Docking mould group 601 is mounted in first shell 604, for simple optical fiber or the light formed is arranged by multifiber Fibre array connection.
Adapter 603 is mounted on second shell 605;Pass through physical connection between first shell 604 and second shell 605 Mode connect, such as: mechanical engagement connection, by casing connection, by be welded to connect, by glue adhesion connect.
Isolator 602 is mounted in the first shell 604 or the second shell 605, and is located at the docking mould group Between 601 and the adapter 603, so as in the case where not needing to carry out disk fibre, in optical fiber or fiber array, and it is adapted to The installation of isolator is completed between device.In addition, even if needing to connect each element in light emission component with optical fiber, it can also be by light Fibre is arranged in first shell or second shell, without carrying out disk fibre in the module of light hair component.If directly passed through Optical fiber will not with dock mould group or adapter is located at the intracorporal isolator of the same shell and is installed between docking mould group and adapter, The optical fiber directly exposed module-external in light emission component, can be such that optical fiber is easily damaged and be not easy to transmit, to need in light The inside modules of emitting module carry out disk fibre, and carry out disk fibre in the inside modules of light emission component, can cause location difficulty, break The problems such as fine.Method provided by the invention completes the installation of isolator by first shell and second shell, compared in light emitting The inside modules of component carry out disk fibre, reduce the risk as carrying out positioning the problems such as more difficult, disconnected fine caused by disk is fine;And Compared with needing to carry out disk fibre and could complete the installation of adapter, the step for carrying out disk fibre is saved, light emission component is simplified Installation process, improve the integrated efficiency of light emission component.
Isolator 602 is a kind of passive light for only Unidirectional light being allowed to pass through of nonreciprocity work based on Faraday rotation Device.It can be isolated well by optoisolator by the light of optical fiber echo reflection.The characteristic of isolator is: positive insertion loss Low, reverse isolation degree is high.Based on this, isolator 602 is set up in the side of optical transport, there is reduction to be reflected back to docking mould group The effect of Cheng Guang.
External magnetic field isolator can be selected in isolator 602, since isolator is arranged in the magnetic field of external magnetic field isolator Outside, compared with built-in magnetic field isolator, the influence to other elements in optical assembly is smaller, keeps the performance of optical assembly more steady It is fixed, reduce the phenomenon that contacting magnet type objects in hot environment or processing procedure due to built-in magnetic field isolator, cause demagnetization Possibility, and cost is relatively low.
Adapter 603 can be made of lock pin, ceramic sleeve, metal seam allowance etc..Wherein, lock pin can be used optical fiber ceramic and insert Core, the internal optional single mode optical fiber of optical fiber, can also be multimode fibre.Fiber stub end face can be the face PC, the face UPC or the face APC, Wherein, the fiber end face in the face PC and the face UPC is all plane, and the optical fiber in the face APC has 4 ° to 8 ° of an angle, such as 4 °, 6 ° or 8 °, the angle that the face APC has can reduce the probability of reflected light.Ceramic sleeve can be open sleeve, or silent sleeve, Wherein, open sleeve is more convenient for the installation and detection of lock pin, and ceramic sleeve encircles lock pin, to fix lock pin.
First shell 604 and second shell 605 can be the pipe sleeve to match with the structure snd size of its internal element or branch Support body.Metal can be selected for first shell 604 and second shell 605 or plastics are made, and such as selects 304 stainless steels.
Further, the integrated light emission component further include:
Lens module, the light between the docking mould group and the adapter, for providing the docking mould group Line converges on the incident end face of the adapter.
Said lens mould group includes at least one lens subassembly, and the numbers of lens can be according to the distance of optical transport, lens Physical property, performance requirement of light emission component etc. determine.The physical property of lens includes the focal length of lens, material etc..Generally The focal length on ground, lens is identical, and the performance requirement of light emission component is identical, and optical transmission distance is longer, and settable lens number is got over More, to guarantee under relatively long distance, light still can be converged preferably to the incident end face direction of adapter.
Plastic lens or glass lens can be selected in lens, can be spherical mirror or aspherical mirror, such as: (G is saturating by G-lens Mirror), C-lens (C lens), wherein cost is relatively low by C-lens.The optical transmission direction set as from docking mould group, through lens mould Group and isolator reach adapter.Lens module transmits the light for docking the offer of mould group along the optical transmission direction of setting, and It is converged to the incident end face of adapter, reduces the probability that light is transmitted to other directions, reduce light and be transferred to non-setting side To optical interface probability, thus reduce light the optical interface of non-direction initialization be reflected back docking mould group probability, Reduce docking mould group and receives the return light reflected by devices such as adapters.
Further, the lens module includes: the first lens and the second lens, wherein first lens are located at institute It states between docking mould group and second lens;
First lens, the light for providing the docking mould group converge to the mirror surface of second lens;
Second lens, the light for will transmit through first lens converge to the incident end face of the adapter On.
It include two lens in said lens mould group, the first lens are used to dock the light for the relatively diverging that mould group launches It is converted into the light of parallel transmission, the second lens are used to converge to the light of the parallel transmission incident end face of the adapter On.Compared to the light emission component that a lens are only arranged in lens module, which can be preferably by docking mould group hair Incoming light converges on the incident end face of adapter, improves the return loss of the light emission component.
The embodiment of the present invention may include following three kinds of technical solutions.Scheme one, isolator are located at docking mould group and first thoroughly Between mirror;Scheme two, isolator are between the first lens and the second lens;Scheme three, isolator are located at the second lens and fit Between orchestration.
In light emission component, the optical transmission direction set is reaches adaptation from docking mould group through lens module and isolator Device.The lens for including in lens module can be such that light transmits in the optical transmission direction of setting.Comparatively ideal situation, isolator is just It is the optical transmission direction of setting to transmission direction, the first lens convert the light for docking the relatively diverging that mould group launches in parallel The light of transmission, for the light ray parallel of the parallel transmission in the optical transmission direction of setting, the second lens further converge in light On the central point of the end face of lock pin.
In scheme two or scheme three, light is first converged via lens, using isolator;First through isolator in scheme one, It is converged again by lens.The technical solution of scheme two or scheme three, compared to the technical solution of scheme one, since light reaches It has first been converged before isolator, the transmission direction of the light after convergence can tend to the transmission line of setting, to have more Light by isolator, eventually arrive at adapter, reduce the light loss in optical transmission process, there is light emission component more preferable Performance.
Since the first lens are used to convert the light for docking the relatively diverging that mould group launches to the light of parallel transmission, in institute Optical transmission direction of the light ray parallel in setting of parallel transmission is stated, and isolator forward direction transmission direction is the optical transmission direction of setting Situation when, the technical solution in above-mentioned scheme two injects the biography of the light of isolator according to the technical solution in scheme three Defeated direction can the closer positive transmission direction with isolator eventually arrived at suitable to have more light by isolator Orchestration reduces the light loss in optical transmission process, and light emission component is made to have better performance.
Further, second lens are between the isolator and the adapter, for will transmit through it is described every It is converged to from the light of device on the incident end face of the adapter.
Further, the adapter includes lock pin;
The rear end face of second lens is parallel with the end face of the lock pin.
The setting of the rear end faces of second lens is parallel with the end face of lock pin, it can make to be transmitted across the light of the second lens preferably It converges on the end face of lock pin, so that more light are transferred on the end face of lock pin, and then improves the transmission of light emission component Efficiency.
Optionally, the rear end face of first lens is also parallel with the end face of the lock pin, the key light of first lens The key light overlapping of axles of axis and second lens, and the optical axis center of the optical axis center of first lens, second lens It is located in a straight line with the central point of the end face of the lock pin.In this way, when the optical transport that the primary optical axis of the first lens is setting When route, can preferably it be converged on the end face of lock pin through the light of above-mentioned first lens and the second lens transmission, to mention The efficiency of transmission of high light emission component.
Further, the adapter includes lock pin;
The focus of second lens is located on the incident end face of the lock pin.
Above scheme can make preferably to converge on the end face of lock pin by the light of the second lens transmission, to improve light The efficiency of transmission of emitting module.
Further, the adapter includes lock pin;
Spacing between the vertex of second lens and the incident end face of the lock pin is 0.01 millimeter to 0.5 millimeter.
The spacing of the incident end face on the vertex and lock pin of the second lens can be according to the focal length of the second lens, material and incident light The case where line, is determined, so that the light through the second lens can preferably converge to raising light emitting group on the end face of lock pin The efficiency of transmission of part.
Optionally, the focus of the second lens is located on the central point of the end face of the lock pin.
Further, the isolator is between second lens and the adapter, for will transmit through described The light of one lens converges on the incident end face of the isolator.
Further, the docking mould group includes lock pin;
The lens module includes the third lens, wherein the third lens be located at the lock pin and the isolator it Between, the third lens are used to converge to the light that the lock pin transmits the incident end face of the isolator.
Further, the lock pin coats flexible glue with the junction of optical fiber or fiber array;
The lock pin is assembled with the first shell by interference fit.
In the embodiment of the present invention, flexible glue is coated by the junction of lock pin and optical fiber or fiber array, to play protection light Fine or fiber array effect.
Further, the first shell and the second shell physical connection by way of adjusting sleeve pipe;
The adjusting sleeve is connect with the second shell clearance fit.
The adjusting sleeve is connect with the second shell clearance fit, between the adjusting sleeve and the second shell Adjustable range can be 0~50um.In the specific use process, first the distance between first shell and second shell can be carried out It adjusts, so that light emission component has preferable performance, then with welding, glue adhesion etc. connects first shell and second shell, With fixed distance between the two.
Further, the adapter includes lock pin;
The end face of the lock pin and the angle of vertical line are 4 ° to 8 °, wherein the vertical line is perpendicular to horizontal line.
Further, the adapter includes lock pin, sleeve and seam allowance;
The second shell is assembled by way of press-fit with the lock pin, and the sleeve encircles the lock pin, described Second shell is assembled by way of press-fit with the seam allowance.
Further, the first shell is connected with the second shell mechanical engagement, or, the first shell and described Second shell is welded to connect, or, the first shell by casing connection or, the first shell and the second shell pass through Body is connected with the second shell by glue adhesion.
It should be noted that said first shell is only that component more typical at present connects with the connection type of second shell Mode can be specifically chosen reasonable manner according to existing equipment, to realize the scheme in the present invention in practical applications.It is used Those skilled in the art it is conceivable that inter-module connection type it is within the scope of the present invention.
Further, the light direction of the isolator is from the isolator towards the direction of the adapter.
Further, the docking mould group includes: capillary or fiber stub with optical fiber.
Fig. 7 is a kind of flow diagram of the assemble method of integrated light emission component provided in an embodiment of the present invention, comprising:
Step 701, docking mould group is mounted in first shell, wherein the docking mould group is used for and optical fiber or optical fiber Array connection;
Step 702, adapter is mounted in second shell;
Step 703, isolator is mounted in the first shell or the second shell, wherein the isolator position Between the docking mould group and the adapter;
Step 704, first shell described in physical connection and the second shell.
Further, the method also includes:
By way of press-fit, the lock pin in the adapter and the second shell are connected, and make the adapter In sleeve encircle the lock pin;
By way of press-fit, the seam allowance in the adapter and the second shell are connected.
Further, the method also includes:
First lens are mounted in the first shell or the second shell, the light that the docking mould group is provided It converges on the incident end face of the adapter;
Second lens are mounted in the first shell or the second shell, second lens is made to be located at described the Between one shell and the adapter, and the light through first lens is made to converge to the incident end face of the adapter On.
Further, the method also includes:
The third lens are mounted in the first shell or the second shell, are located at the third lens described right The light for connecing between the lock pin and the isolator in mould group, and transmitting the lock pin converges to the incidence end of the isolator On face.
Fig. 8 be a kind of composed structure schematic diagram of integrated light emission component provided in an embodiment of the present invention, comprising: FA or Capillary 201, optical fiber 202 can be single mode optical fiber, can also be multimode fibre, preferably single mode micro-bending optical fiber, collimator adapter Capillary 203, the lens 204 with alignment function can be aspheric lens, G-lens or C-lens, preferably low cost C- Lens, metal sleeve 205, isolator 206, preferably external magnetic field isolator, the lens 207 with alignment function can be non- Globe lens, G-lens or C-lens, preferably low cost C-lens, adapter metalwork 208, material preferably 304 stainless steels, band There is the ceramic insertion core 209 of optical fiber, the optional single mode optical fiber of internal optical fiber can also be multimode fibre, and the face APC has certain angle, excellent 6 ° or 8 °, ceramic sleeve 210 are selected, can be open sleeve, or silent sleeve, metal seam allowance 211.
Specifically, the head of FA first 201 is adapted to capillary 203 with optical fiber 202 and collimator and is attached for common process, C-lens lens 204 and 201,202,203 assemblys are coupled according to conventional collimator technique, C-lens lens 204 with It is fixed, is first pre-fixed using UV glue, then reinforced by structure glue by glue between capillary 203.It is excellent It selects and is fixed between C-lens lens 204 and capillary 203 by casing.
Then adapter metalwork 208 assembles in such a way that interference is press-fitted with the ceramic insertion core 209 with optical fiber, ceramics Sleeve 210 has ceramic insertion core 209 in arms, then metal seam allowance 211 and adapter metalwork 208 are assembled by press-fit, optional Reinforcement is carried out by a small amount of glue;C-lens lens 207 are assembled to adapter metalwork 208 by mechanical dimension's limit method In, lens rear face is parallel with the face ceramic insertion core APC, and the focus of lens 207 just focuses on ceramic insertion core incident end face, thoroughly It is at regular intervals between mirror 207 and ceramic insertion core 209, preferably 0.1~0.3mm;Isolator 206 and adapter metalwork 208 It is to be assembled by mechanical dimension, is fixed by press-fitting or glue mode, specifically, isolator installation direction needs to pay attention to entering light Direction, the end FA are entering light direction.
It is carried out between last metal sleeve 205 and adapter metalwork 208 by laser welding or glue technique for sticking It is fixed, it can be fixed in such a way that high-precision is assembled between c-lens lens 204 and metal sleeve 205, after can also coupling It is adhesively fixed by glue mode.
Fig. 9 be a kind of composed structure schematic diagram of integrated light emission component provided in an embodiment of the present invention, comprising: FA or Capillary 301, optical fiber 302 can be single mode optical fiber, can also be multimode fibre, preferably single mode micro-bending optical fiber, collimator adapter Capillary 303, the lens 304 with alignment function can be aspheric lens, G-lens or C-lens, preferably low cost C- Lens, lens casing 305, the preferred metal sleeve of material, isolator 306, preferably external magnetic field isolator, with alignment function Lens 307, can be aspheric lens, G-lens or C-lens, and preferably low cost C-lens, metal adjust sleeve 308, material It is preferred that 304 stainless steels, adapter metalwork 310, the ceramic insertion core 309 with optical fiber, the optional single mode optical fiber of internal optical fiber can also For multimode fibre, the face APC has certain angle, and preferably 6 ° or 8 °, ceramic sleeve 311 can be open sleeve, or silent Sleeve, metal seam allowance 312.
Specifically, the head of FA first 301 is adapted to capillary 303 with optical fiber 302 and collimator and is attached for common process, C-lens lens 304 and 301,302,303 assemblys are coupled according to conventional collimator technique, C-lens lens 304 with It is fixed, is first pre-fixed using UV glue, then reinforced by structure glue by glue between capillary 303.It can It selects and is fixed between C-lens lens 304 and capillary 303 by casing.
Then adapter metalwork 310 is assembled by way of press-fitting with the ceramic insertion core 309 with optical fiber, ceramic sleeve 311 have ceramic insertion core 309 in arms, then metal seam allowance 312 and adapter metalwork 310 are assembled by press-fit, optional to pass through A small amount of glue carries out reinforcement;Isolator 306 is assembled in adapter metalwork 310 by mechanical dimension, preferred isolator and pottery Porcelain lock pin is as close as possible, can choose small clear aperature isolator, in this way to obtain low cost.Specifically, isolator installation side To entering light direction is needed to pay attention to, the end FA is entering light direction.
Lens 304 and lens 307 are fitted into 305 liang of mother rib lateral rotundums of lens sleeve, process limiting stand by lens sleeve two sides Rank and high-precision round orifices orientation, centre are adhesively fixed using glue.
Metal adjusts sleeve 308 and is fixed with lens sleeve 305 by laser welding mode, and metal adjusts sleeve 308 and fits Orchestration metalwork 310 is fixed by laser welding or glue mode, and preferably laser welding penetrates weldering.Metal adjusts sleeve 308 Internal diameter is matched with 310 outer diameter of adapter metalwork, and reserving the gap 0~20um between the two can slide, according to 307 focal length of lens Adjust the relative position that metal adjusts sleeve 308 and adapter metalwork 310.
Figure 10 be a kind of composed structure schematic diagram of integrated light emission component provided in an embodiment of the present invention, comprising: FA or Person's capillary 401, optical fiber 402 can be single mode optical fiber, can also be multimode fibre, preferably single mode micro-bending optical fiber, ceramic insertion core 403, metal support 404, lens 405, can be globe lens, non-globe lens, and material can be glass, silicon, plastics etc., preferably 1:1 Sleeve 406, isolator 407, preferably external magnetic field isolator, the ceramic insertion core 408 with optical fiber are adjusted Deng than lens, metal, The optional single mode optical fiber of internal optical fiber, can also be multimode fibre, and the face APC has certain angle, preferably 6 ° or 8 °, adapter metalwork 409, ceramic sleeve 410 can be open sleeve, or silent sleeve, metal seam allowance 411.
Specifically, the head of FA first 401 is connect with 402 common process of optical fiber, and optical fiber 402 penetrates in ceramic insertion core 403, optical fiber It is fixed with ceramic insertion core junction coating flexible glue, plays protection optical fiber;Ceramic insertion core 403 and metal support 404 it Between assembled by interference press-fit, and the mounting groove of lens 405 is reserved in metal support, and ceramic insertion core 403 leans on Nearly 405 one end of lens can be the face PC, or the face APC, insertion core end face is apart from lens mounting surface distance according to type selecting lens Operating distance determines.Lens 405, which pass through, completes assembly between glue fixed form and metal support 404.
Then adapter metalwork 409 is assembled by way of press-fitting with the ceramic insertion core 408 with optical fiber, ceramic sleeve 410 have ceramic insertion core 408 in arms, then metal seam allowance 411 and adapter metalwork 409 are assembled by press-fit, optional to pass through A small amount of glue carries out reinforcement;Isolator 407 is assembled in adapter metalwork 409 by mechanical dimension, preferred isolator and pottery Porcelain lock pin is close as far as possible, can choose small clear aperature isolator, in this way to obtain low cost.Specifically, isolator installation side To entering light direction is needed to pay attention to, the end FA is entering light direction.
It is fixed between last metal support 404 and adjustable body 406 by laser welding process, metal adjusts sleeve 406 are fixed with adapter metalwork 409 by laser welding or glue mode, and preferably laser welding penetrates weldering.Metal is adjusted 406 internal diameter of sleeve is matched with 409 outer diameter of adapter metalwork, and reserving the gap 0~20um between the two can slide, according to selected The relative position of sleeve 308 and adapter metalwork 310 is adjusted with 405 focus adjustment metal of lens.
Figure 11 is a kind of composed structure schematic diagram of integrated light emission component provided in an embodiment of the present invention, comprising: laser Device chipset 101, ceramic circuit board 102, back light detector group 103, preceding coupled lens group 104, PLC chip 105, tungsten copper substrate 106, pcb board 108, the adapter integral component 200 with FA.It can be CWDM wavelength that wherein chip of laser group 101, which goes out light, It can be Lan-WDM wavelength.
Figure 12 is a kind of composed structure schematic diagram of integrated light emission component provided in an embodiment of the present invention, comprising: includes: Chip of laser group 101, ceramic circuit board 102, back light detector group 103, preceding coupled lens group 104, PLC chip 105, tungsten copper Substrate 106, pcb board 108, the adapter integral component 300 with FA.It can be CWDM wave that wherein chip of laser group 101, which goes out light, It is long, it can also be Lan-WDM wavelength.
Figure 13 is a kind of composed structure schematic diagram of integrated light emission component provided in an embodiment of the present invention, comprising: this reality It applies example and three provides a kind of light emission component 700 of inexpensive, high return loss based on the above embodiment, it is as shown in figure 11, main to wrap Include: chip of laser group 101, ceramic circuit board 102, back light detector group 103, preceding coupled lens group 104, PLC chip 105, Tungsten copper substrate 106, pcb board 108, the adapter integral component 400 with FA.Wherein chip of laser group 101, which goes out light, to be CWDM wavelength can also be Lan-WDM wavelength.
The present invention proposes a kind of novel integral component with FA and adaptor interface, will be every by light path design It is placed between FA and adapter from device, increases the return loss of overall optics;Light emission component based on the integral component In, it realizes the seamless connection of FA and PLC chip, improves assembling reliability, while effectively control is reflected at chip of laser Return light, thus guarantee the long-term stable operation of the light emission component in high speed over long distances application, it is synchronous also to realize device and mould The miniaturization and high reliability of block.
The foregoing is only a preferred embodiment of the present invention, is not intended to limit the scope of the present invention.

Claims (10)

1. a kind of integrated light emission component, which is characterized in that the component includes:
Dock mould group, isolator, adapter;
The docking mould group, is mounted in first shell, for connecting with optical fiber or fiber array;
The adapter, is mounted in second shell;
The isolator is mounted in the first shell or the second shell, and be located at the docking mould group and it is described fit Between orchestration;
Wherein, the first shell and the second shell physical connection.
2. component according to claim 1, which is characterized in that
The integrated light emission component further include:
Lens module, between the docking mould group and the adapter, the light for providing the docking mould group converges On the incident end face for gathering the adapter.
3. component according to claim 2, which is characterized in that
The lens module includes: the first lens and the second lens, wherein first lens are located at the docking mould group and institute It states between the second lens;
First lens, the light for providing the docking mould group converge to the mirror surface of second lens;
Second lens, the light for will transmit through first lens converge to the incident end face of the adapter.
4. component according to claim 3, which is characterized in that
Between the isolator and the adapter, the light for will transmit through the isolator converges second lens Onto the incident end face of the adapter.
5. component according to claim 3, which is characterized in that
Between second lens and the adapter, the light for will transmit through first lens converges the isolator On the incident end face for gathering the isolator.
6. component according to claim 2, which is characterized in that
The docking mould group includes lock pin;
The lens module includes the third lens, wherein the third lens are between the lock pin and the isolator, institute The third lens are stated for the light that the lock pin transmits to be converged to the incident end face of the isolator.
7. a kind of assemble method of integrated light emission component, which is characterized in that the described method includes:
Docking mould group is mounted in first shell, wherein the docking mould group with optical fiber or fiber array for connecting;
Adapter is mounted in second shell;
Isolator is mounted in the first shell or the second shell, wherein the isolator is located at the docking mould Between group and the adapter;
First shell described in physical connection and the second shell.
8. assemble method according to claim 7, which is characterized in that the method also includes:
By way of press-fit, the lock pin in the adapter and the second shell are connected, and make in the adapter Sleeve encircles the lock pin;
By way of press-fit, the seam allowance in the adapter and the second shell are connected.
9. assemble method according to claim 7, which is characterized in that the method also includes:
First lens are mounted in the first shell or the second shell, the light convergence that the docking mould group is provided Onto the incident end face of the adapter;
Second lens are mounted in the first shell or the second shell, second lens is made to be located at the first shell Between body and the adapter, and converge to the light through first lens on the incident end face of the adapter.
10. assemble method according to claim 7, which is characterized in that the method also includes:
The third lens are mounted in the first shell or the second shell, the third lens is made to be located at the docking mould Between lock pin and the isolator in group, and the light for transmitting the lock pin converges to the incident end face of the isolator On.
CN201910172277.5A 2019-03-07 2019-03-07 Integrated light emission component and assemble method Pending CN110031932A (en)

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Application Number Priority Date Filing Date Title
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111025494A (en) * 2019-12-19 2020-04-17 宁波环球广电科技有限公司 Novel CWDM TOSA structure and manufacturing method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203012191U (en) * 2012-12-31 2013-06-19 深圳市光为光通信科技有限公司 Light emitting assembly
CN207992506U (en) * 2018-01-13 2018-10-19 深圳市迅特通信技术有限公司 A kind of fiber adapter for high-speed optical devices

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203012191U (en) * 2012-12-31 2013-06-19 深圳市光为光通信科技有限公司 Light emitting assembly
CN207992506U (en) * 2018-01-13 2018-10-19 深圳市迅特通信技术有限公司 A kind of fiber adapter for high-speed optical devices

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111025494A (en) * 2019-12-19 2020-04-17 宁波环球广电科技有限公司 Novel CWDM TOSA structure and manufacturing method thereof

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