CN110029332B - Chemical nickel plating solution and nickel plating method - Google Patents
Chemical nickel plating solution and nickel plating method Download PDFInfo
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- CN110029332B CN110029332B CN201910286943.8A CN201910286943A CN110029332B CN 110029332 B CN110029332 B CN 110029332B CN 201910286943 A CN201910286943 A CN 201910286943A CN 110029332 B CN110029332 B CN 110029332B
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
Abstract
The invention discloses a chemical nickel plating solution, which comprises a solution A, a solution B and a solution C which are respectively stored in a sealed manner, wherein the solution A comprises 4-8 parts of nickel sulfate, 9-17 parts of sodium hypophosphite, 5-11 parts of lactic acid, 6-15 parts of amino acid, 0.008-0.02 part of metal magnesium or metal lead and 50-90 parts of deionized water; the solution B comprises 3-7 parts of nickel sulfate, 3-7 parts of citric acid, 3-6 parts of potassium hypophosphite, 2-5 parts of carboxylic acid and 45-70 parts of deionized water; the solution C comprises 1-3 parts of nickel acetate, 2-6 parts of sodium borohydride, 4-7 parts of acetic acid, 3-5 parts of sodium dodecyl sulfate and 35-56 parts of deionized water; when in use, the volume ratio is 1: 1-2.5: 0.8-3 of solution A, solution B and solution C, filtering, mixing uniformly, and adjusting the pH value to 9-11. The invention also discloses a chemical nickel plating method. The nickel plating layer can reach 1000 microns, is compact, does not generate holes inside, has good corrosion resistance, prolongs the service life of a nickel plating part, has high bonding strength with a processing part, and has simple process flow and low processing cost.
Description
Technical Field
The invention belongs to the field of nickel plating solution and nickel plating process, and particularly relates to chemical nickel plating solution and a nickel plating method.
Background
Nickel plating is a method of depositing a layer of nickel on the surface of a metal part by oxidation-reduction, and the nickel-plated metal part has good corrosion resistance, good wear resistance and high glossiness, so that the aesthetic property and the physical property of the metal part are improved, and the nickel-plated metal part is almost suitable for nickel plating on all metal surfaces, so the nickel-plated metal part is widely applied.
However, the thickness of the coating achieved by the nickel plating solution and the nickel plating process in the current market can only be about 200 microns, the effect of a thicker coating cannot be achieved, and the application has limitation.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides the chemical nickel plating solution with the advantages of obviously increased plating layer thickness, compact plating layer, no holes, high corrosion resistance and high bonding strength between the plating layer and a metal workpiece, and the chemical nickel plating method using the chemical nickel plating solution.
The technical scheme adopted by the invention for solving the technical problems is as follows: a chemical nickel plating solution comprises a solution A, a solution B and a solution C which are respectively stored in a sealed manner, wherein the solution A comprises 4-8 parts of nickel sulfate, 9-17 parts of sodium hypophosphite, 5-11 parts of lactic acid, 6-15 parts of amino acid, 0.008-0.02 part of metal magnesium or metal lead and 50-90 parts of deionized water; the solution B comprises 3-7 parts of nickel sulfate, 3-7 parts of citric acid, 3-6 parts of potassium hypophosphite, 2-5 parts of carboxylic acid and 45-70 parts of deionized water; the solution C comprises 1-3 parts of nickel acetate, 2-6 parts of sodium borohydride, 4-7 parts of acetic acid, 3-5 parts of sodium dodecyl sulfate and 35-56 parts of deionized water; when in use, the volume ratio is 1: 1-2.5: 0.8-3 of solution A, solution B and solution C, filtering, mixing uniformly, and adjusting the pH value to 9-11.
Further, the solution A, the solution B and the solution C are added in the order of adding the solution A to the solution B, and the mixed solution is added to the solution C while being stirred.
Further, the solution A comprises 5-7 parts of nickel sulfate, 11-15 parts of sodium hypophosphite, 7-10 parts of lactic acid, 8-13 parts of amino acid, 0.01-0.016 part of metal magnesium or metal lead and 65-85 parts of deionized water, and the pH value is adjusted to 8-10.
Further, the solution B comprises 4-6 parts of nickel sulfate, 4-5 parts of citric acid, 4-5 parts of potassium hypophosphite, 2-4 parts of carboxylic acid and 60-68 parts of deionized water.
Further, the solution C comprises 1-2 parts of nickel acetate, 3-5 parts of sodium borohydride, 5-6 parts of acetic acid, 3-5 parts of sodium dodecyl sulfate and 45-52 parts of deionized water.
The invention also discloses a chemical nickel plating method, which comprises the following steps:
1) passivating the main plating tank and the auxiliary plating tank by using nitric acid with the concentration of 50-60%, cleaning the main plating tank and the auxiliary plating tank by using purified water, and isolating the main plating tank and the auxiliary plating tank;
2) adding 25-28L of purified water into the main plating tank, adding 2-4L of purified water into the auxiliary plating tank, and respectively measuring the pH value to ensure that nitric acid is not mixed into the main plating tank and the auxiliary plating tank;
3) adding 0.18-0.3L of nickel plating solution into the main plating tank through a first chemical feeding pipe, adjusting the water level in the main plating tank to be higher than that in the auxiliary plating tank at 86-94 ℃, dropwise adding ammonia water into the main plating tank at the speed of 1-10ml/s, and measuring the pH value to be 4.6-4.9;
4) adding 0.08-0.15L of nickel plating solution into the auxiliary plating tank through the second chemical feeding pipe, adjusting the water level in the auxiliary plating tank to be lower than that in the main plating tank at 86-94 ℃, dropwise adding ammonia water into the auxiliary plating tank at the speed of 1-10ml/s, and measuring the pH value to be 4.6-4.9;
5) communicating the main plating tank with the auxiliary plating tank, and circulating liquid in the main plating tank and the auxiliary plating tank through a filtering water inlet pipe and a filtering water outlet pipe by using filtering equipment;
6) putting a product to be processed into a main plating tank, monitoring the nickel content in the main plating tank, and supplementing the solution B and the solution C into an auxiliary plating tank at a rate of 8-12ml/min when the nickel content is detected to be less than or equal to 0.1 g/L;
7) and after the processed product stays in the main plating tank for 48-53 hours, taking out the processed product, putting the processed product into water at 75-85 ℃ for cleaning, drying the product, putting the dried product into the high temperature of 180-220 ℃ for 4.8-6 hours, and naturally cooling the product to obtain the product.
Preferably, the nitric acid concentration in the step 1) is 50%.
Preferably, 26L of purified water is added into the main plating tank in the step 2), and 2L of purified water is added into the auxiliary plating tank.
Preferably, 0.2L of nickel plating solution is taken in the step 3); 0.1L of nickel plating solution is taken in the step 4).
Preferably, the addition amount of the solution B and the solution C in the step 6) is 10 ml; the residence time in the step 7) is 50 hours
The invention has the beneficial effects that: 1) the nickel plating layer can reach 1000 microns, and is improved by 4-5 times compared with the prior nickel plating technology; 2) the nickel plating layer is compact, and no hole is generated inside; 3) the corrosion resistance is good, and the service life of the nickel-plated part is prolonged; 4) the nickel-plated layer has high bonding strength with the processing part, and the phenomenon of separation and delamination can not occur; 5) the process flow is simple, and the processing cost is relatively low.
Drawings
FIG. 1 is a photograph showing the nickel-plated products (vehicle-mounted mold, light guide plate, lens mold, HUD mold, and vehicle-mounted mobile phone mold) according to the present invention.
FIG. 2 is a first photograph of a nickel-plated product of the present invention.
FIG. 3 is a second photograph showing a nickel-plated product according to the present invention.
FIG. 4 is a third photograph showing a nickel-plated product of the present invention.
FIG. 5 is a fourth photograph showing a nickel-plated product of the present invention.
Detailed Description
In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example one
A chemical nickel plating solution comprises a solution A, a solution B and a solution C which are respectively stored in a sealed manner, wherein the solution A comprises 4 parts of nickel sulfate, 9 parts of sodium hypophosphite, 5 parts of lactic acid, 6 parts of amino acid, 0.01 part of metal magnesium or metal lead and 60 parts of deionized water, and the pH value is adjusted to be 8-10;
the solution B comprises 4 parts of nickel sulfate, 5 parts of citric acid, 4 parts of potassium hypophosphite, 5 parts of carboxylic acid and 50 parts of deionized water;
the solution C comprises 1 part of nickel acetate, 4 parts of sodium borohydride, 6 parts of acetic acid, 4 parts of sodium dodecyl sulfate and 45 parts of deionized water.
An electroless nickel plating method comprises the following steps:
1) passivating the main plating tank and the auxiliary plating tank by using nitric acid with the concentration of 50%, cleaning the main plating tank and the auxiliary plating tank by using purified water, and isolating the main plating tank and the auxiliary plating tank;
2) adding 26L of purified water into the main plating tank, adding 2L of purified water into the auxiliary plating tank, and respectively measuring the pH value to ensure that nitric acid is not mixed into the main plating tank and the auxiliary plating tank;
3) adding 0.09L of the solution A into 0.11mL of the solution B, mixing and stirring, and adding into 0.1L of the solution C to prepare a chemical nickel plating solution;
4) adding the 0.2L nickel plating solution into a main plating tank through a first chemical feeding pipe, adjusting the water level in the main plating tank to be higher than the water level in an auxiliary plating tank, controlling the temperature to be 86 ℃, dropwise adding ammonia water into the main plating tank at the speed of 5ml/s, and measuring the pH value to be within the range of 4.6-4.9;
5) adding 0.1L of nickel plating solution into the auxiliary plating tank through the second chemical feeding pipe, adjusting the water level in the auxiliary plating tank to be lower than that in the main plating tank, controlling the temperature to be 89 ℃, dropwise adding ammonia water into the auxiliary plating tank at the speed of 8mL/s, and measuring the pH value to be within the range of 4.6-4.9;
6) communicating the main plating tank with the auxiliary plating tank, and circulating liquid in the main plating tank and the auxiliary plating tank through a filtering water inlet pipe and a filtering water outlet pipe by using filtering equipment;
7) placing a product to be processed, such as an optical mold made of stainless steel, into a main plating tank, monitoring the nickel content in the main plating tank, and supplementing 10ml of solution B and 10ml of solution C into an auxiliary plating tank at a speed of 8ml/min when the nickel content is detected to be less than or equal to 0.1g/L, wherein the circulating stirring speed is 2 cycles/min for the auxiliary plating tank, and the circulating stirring speed is 1.5 cycles/min for the main plating tank;
8) and (3) after the processed product stays in the main plating tank for 50 hours, taking out the processed product, putting the processed product into water at 78 ℃ for cleaning, drying the product, putting the dried product into high temperature of 190 ℃ for 5 hours, and naturally cooling the product to obtain the product.
Example two
A chemical nickel plating solution comprises a solution A, a solution B and a solution C which are respectively stored in a sealing way, wherein the solution A comprises 7 parts of nickel sulfate, 12 parts of sodium hypophosphite, 8 parts of lactic acid, 10 parts of amino acid, 0.012 part of metal magnesium or metal lead and 80 parts of deionized water, and the pH value is adjusted to be 8-10;
the solution B comprises 5 parts of nickel sulfate, 4 parts of citric acid, 5 parts of potassium hypophosphite, 3 parts of carboxylic acid and 40 parts of deionized water;
the solution C comprises 2 parts of nickel acetate, 5 parts of sodium borohydride, 5 parts of acetic acid, 3 parts of sodium dodecyl sulfate and 35 parts of deionized water.
An electroless nickel plating method comprises the following steps:
1) passivating the main plating tank and the auxiliary plating tank by using 55% nitric acid, cleaning the main plating tank and the auxiliary plating tank by using purified water, and isolating the main plating tank and the auxiliary plating tank;
2) adding 25L of purified water into the main plating tank, adding 4L of purified water into the auxiliary plating tank, and respectively measuring the pH value to ensure that nitric acid is not mixed into the main plating tank and the auxiliary plating tank;
3) adding 0.09L of the solution A into 0.09mL of the solution B, mixing and stirring, and adding into 0.09L of the solution C to prepare a chemical nickel plating solution;
4) adding the 0.18L nickel plating solution into a main plating tank through a first chemical feeding pipe, adjusting the water level in the main plating tank to be higher than the water level in an auxiliary plating tank, controlling the temperature to be 89 ℃, dropwise adding ammonia water into the main plating tank at the speed of 10ml/s, and measuring the pH value to be within the range of 4.6-4.9;
5) adding 0.11L of nickel plating solution into the auxiliary plating tank through the second chemical feeding pipe, adjusting the water level in the auxiliary plating tank to be lower than that in the main plating tank, controlling the temperature to be 90 ℃, dropwise adding ammonia water into the auxiliary plating tank at the speed of 10mL/s, and measuring the pH value to be within the range of 4.6-4.9;
6) communicating the main plating tank with the auxiliary plating tank, and circulating liquid in the main plating tank and the auxiliary plating tank through a filtering water inlet pipe and a filtering water outlet pipe by using filtering equipment;
7) placing a product to be processed, such as an optical mold made of stainless steel, into a main plating tank, monitoring the nickel content in the main plating tank, and supplementing 8ml of solution B and 8ml of solution C into an auxiliary plating tank at a speed of 10ml/min when the nickel content is detected to be less than or equal to 0.1g/L, wherein the circulating stirring speed is 2 cycles/min for the auxiliary plating tank, and the circulating stirring speed is 1.5 cycles/min for the main plating tank;
8) and (3) after the processed product stays in the main plating tank for 53 hours, taking out the processed product, putting the processed product into water at 80 ℃ for cleaning, drying the product, putting the dried product into the high temperature of 200 ℃ for 5.5 hours, and naturally cooling the product to obtain the product.
EXAMPLE III
A chemical nickel plating solution comprises a solution A, a solution B and a solution C which are respectively stored in a sealed mode, wherein the solution A comprises 6 parts of nickel sulfate, 14 parts of sodium hypophosphite, 10 parts of lactic acid, 12 parts of amino acid, 0.008 part of metal magnesium or metal lead and 90 parts of deionized water, and the pH value is adjusted to be 8-10;
the solution B comprises 7 parts of nickel sulfate, 6 parts of citric acid, 6 parts of potassium hypophosphite, 2 parts of carboxylic acid and 60 parts of deionized water;
the solution C comprises 3 parts of nickel acetate, 6 parts of sodium borohydride, 7 parts of acetic acid, 4 parts of sodium dodecyl sulfate and 50 parts of deionized water.
An electroless nickel plating method comprises the following steps:
1) passivating the main plating tank and the auxiliary plating tank by using nitric acid with the concentration of 60%, cleaning the main plating tank and the auxiliary plating tank by using purified water, and isolating the main plating tank and the auxiliary plating tank;
2) adding 27L of purified water into the main plating tank, adding 3.5L of purified water into the auxiliary plating tank, and respectively measuring the pH value to ensure that nitric acid is not mixed into the main plating tank and the auxiliary plating tank;
3) adding 0.09L of the solution A into 0.14mL of the solution B, mixing and stirring, and adding into 0.19L of the solution C to prepare a chemical nickel plating solution;
4) adding the 0.3L of nickel plating solution into a main plating tank through a first chemical feeding pipe, adjusting the water level in the main plating tank to be higher than the water level in an auxiliary plating tank, controlling the temperature to be 92 ℃, dropwise adding ammonia water into the main plating tank at the speed of 4ml/s, and measuring the pH value to be within the range of 4.6-4.9;
5) adding 0.12L of nickel plating solution into the auxiliary plating tank through the second chemical feeding pipe, adjusting the water level in the auxiliary plating tank to be lower than that in the main plating tank, controlling the temperature to be 92 ℃, dropwise adding ammonia water into the auxiliary plating tank at the speed of 5mL/s, and measuring the pH value to be within the range of 4.6-4.9;
6) communicating the main plating tank with the auxiliary plating tank, and circulating liquid in the main plating tank and the auxiliary plating tank through a filtering water inlet pipe and a filtering water outlet pipe by using filtering equipment;
7) placing a product to be processed, such as an optical mold made of stainless steel, into a main plating tank, monitoring the nickel content in the main plating tank, and supplementing 10ml of solution B and 10ml of solution C into an auxiliary plating tank at a speed of 11ml/min when the nickel content is detected to be less than or equal to 0.1g/L, wherein the circulating stirring speed is 2 cycles/min for the auxiliary plating tank, and the circulating stirring speed is 1.5 cycles/min for the main plating tank;
8) and (3) after the processed product stays in the main plating tank for 51 hours, taking out the processed product, putting the processed product into water at 83 ℃ for cleaning, drying the product, putting the dried product into the high temperature of 220 ℃ for 4.8 hours, and naturally cooling the product to obtain the product.
Example four
A chemical nickel plating solution comprises a solution A, a solution B and a solution C which are respectively stored in a sealed mode, wherein the solution A comprises 5 parts of nickel sulfate, 15 parts of sodium hypophosphite, 7 parts of lactic acid, 13 parts of amino acid, 0.016 part of metal magnesium or metal lead and 85 parts of deionized water, and the pH value is adjusted to be 8-10;
the solution B comprises 6 parts of nickel sulfate, 3 parts of citric acid, 4 parts of potassium hypophosphite, 4 parts of carboxylic acid and 68 parts of deionized water;
the solution C comprises 1.5 parts of nickel acetate, 3 parts of sodium borohydride, 4 parts of acetic acid, 5 parts of sodium dodecyl sulfate and 56 parts of deionized water.
An electroless nickel plating method comprises the following steps:
1) passivating the main plating tank and the auxiliary plating tank by using nitric acid with the concentration of 50%, cleaning the main plating tank and the auxiliary plating tank by using purified water, and isolating the main plating tank and the auxiliary plating tank;
2) adding 26L of purified water into the main plating tank, adding 2.5L of purified water into the auxiliary plating tank, and respectively measuring the pH value to ensure that nitric acid is not mixed into the main plating tank and the auxiliary plating tank;
3) adding 0.09L of the solution A into 0.17mL of the solution B, mixing and stirring, and adding into 0.14L of the solution C to prepare a chemical nickel plating solution;
4) adding the 0.25L of nickel plating solution into a main plating tank through a first chemical feeding pipe, adjusting the water level in the main plating tank to be higher than the water level in an auxiliary plating tank, controlling the temperature to be 94 ℃, dropwise adding ammonia water into the main plating tank at the speed of 6ml/s, and measuring the pH value to be within the range of 4.6-4.9;
5) adding 0.15L of nickel plating solution into the auxiliary plating tank through the second chemical feeding pipe, adjusting the water level in the auxiliary plating tank to be lower than that in the main plating tank, controlling the temperature to be 94 ℃, dropwise adding ammonia water into the auxiliary plating tank at the speed of 9mL/s, and measuring the pH value to be within the range of 4.6-4.9;
6) communicating the main plating tank with the auxiliary plating tank, and circulating liquid in the main plating tank and the auxiliary plating tank through a filtering water inlet pipe and a filtering water outlet pipe by using filtering equipment;
7) placing a product to be processed, such as an optical mold made of stainless steel, into a main plating tank, monitoring the nickel content in the main plating tank, and supplementing 10ml of solution B and 10ml of solution C into an auxiliary plating tank at a speed of 12ml/min when the nickel content is detected to be less than or equal to 0.1g/L, wherein the circulating stirring speed is 2 cycles/min for the auxiliary plating tank, and the circulating stirring speed is 1.5 cycles/min for the main plating tank;
8) and (3) after the processed product stays in the main plating tank for 50 hours, taking out the processed product, putting the processed product into water at 80 ℃ for cleaning, drying the product, putting the dried product into the high temperature of 180 ℃ for 5 hours, and naturally cooling the product to obtain the product.
TABLE 1 comparison of the Properties of the nickel-plated products of the invention
As can be seen from Table 1, the corrosion resistance time of the optical mold prepared by the chemical nickel plating solution and the nickel plating method is remarkably increased, the thickness of the optical mold is 4-5 times of that of the nickel plating layer obtained by the conventional nickel plating method, and the bonding strength and the hardness of the optical mold are not influenced and are equivalent to those of the nickel plating layer obtained by the conventional nickel plating method.
As shown in FIGS. 1 to 5, various molds prepared by the electroless nickel plating solution and the nickel plating method of the present invention have thick plating layer, good gloss and excellent texture.
The foregoing detailed description is intended to illustrate and not limit the invention, which is intended to be within the spirit and scope of the appended claims, and any changes and modifications that fall within the true spirit and scope of the invention are intended to be covered by the following claims.
Claims (9)
1. An electroless nickel plating method of an electroless nickel plating solution, characterized by comprising the steps of:
1) passivating the main plating tank and the auxiliary plating tank by using nitric acid with the mass concentration of 50-60%, cleaning the main plating tank and the auxiliary plating tank by using purified water, and isolating the main plating tank and the auxiliary plating tank;
2) adding 25-28L of purified water into the main plating tank, adding 2-4L of purified water into the auxiliary plating tank, and respectively measuring the pH value to ensure that nitric acid is not mixed into the main plating tank and the auxiliary plating tank;
3) adding 0.18-0.3L of nickel plating solution into the main plating tank through a first chemical feeding pipe, adjusting the water level in the main plating tank to be higher than that in the auxiliary plating tank at 86-94 ℃, dropwise adding ammonia water into the main plating tank at the speed of 1-10ml/s, and measuring the pH value to be 4.6-4.9;
4) adding 0.08-0.15L of nickel plating solution into the auxiliary plating tank through the second chemical feeding pipe, adjusting the water level in the auxiliary plating tank to be lower than that in the main plating tank at 86-94 ℃, dropwise adding ammonia water into the auxiliary plating tank at the speed of 1-10ml/s, and measuring the pH value to be 4.6-4.9;
5) communicating the main plating tank with the auxiliary plating tank, and circulating liquid in the main plating tank and the auxiliary plating tank through a filtering water inlet pipe and a filtering water outlet pipe by using filtering equipment;
6) putting a product to be processed into a main plating tank, monitoring the nickel content in the main plating tank, and supplementing the solution B and the solution C into an auxiliary plating tank at a rate of 8-12ml/min when the nickel content is detected to be less than or equal to 0.1 g/L;
7) after the processed product stays in the main plating tank for 48-53 hours, the processed product is taken out and put into water with the temperature of 75-85 ℃ for cleaning, the processed product is dried and then put into the temperature of 180-220 ℃ for 4.8-6 hours, and the product is obtained after natural cooling;
the chemical nickel plating solution comprises a solution A, a solution B and a solution C which are respectively stored in a sealed mode, wherein the solution A comprises 4-8 parts of nickel sulfate, 9-17 parts of sodium hypophosphite, 5-11 parts of lactic acid, 6-15 parts of amino acid, 0.008-0.02 part of metal magnesium or metal lead and 50-90 parts of deionized water; the solution B comprises 3-7 parts of nickel sulfate, 3-7 parts of citric acid, 3-6 parts of potassium hypophosphite, 2-5 parts of carboxylic acid and 45-70 parts of deionized water; the solution C comprises 1-3 parts of nickel acetate, 2-6 parts of sodium borohydride, 4-7 parts of acetic acid, 3-5 parts of sodium dodecyl sulfate and 35-56 parts of deionized water; when in use, the volume ratio is 1: 1-2.5: 0.8-3 of solution A, solution B and solution C, filtering, mixing uniformly, and adjusting the pH value to 9-11.
2. An electroless nickel plating method according to claim 1, characterized in that: the solution A, the solution B and the solution C are added in the order of adding the solution A to the solution B, and the mixed solution is added to the solution C while being stirred.
3. An electroless nickel plating method according to claim 1, characterized in that: the solution A comprises 5-7 parts of nickel sulfate, 11-15 parts of sodium hypophosphite, 7-10 parts of lactic acid, 8-13 parts of amino acid, 0.01-0.016 part of metal magnesium or metal lead and 65-85 parts of deionized water, and the pH value is adjusted to 8-10.
4. An electroless nickel plating method according to claim 1, characterized in that: the solution B comprises 4-6 parts of nickel sulfate, 4-5 parts of citric acid, 4-5 parts of potassium hypophosphite, 2-4 parts of carboxylic acid and 60-68 parts of deionized water.
5. An electroless nickel plating method according to claim 1, characterized in that: the solution C comprises 1-2 parts of nickel acetate, 3-5 parts of sodium borohydride, 5-6 parts of acetic acid, 3-5 parts of sodium dodecyl sulfate and 45-52 parts of deionized water.
6. An electroless nickel plating method according to claim 1, characterized in that: the concentration of the nitric acid in the step 1) is 50%.
7. An electroless nickel plating method according to claim 1, characterized in that: in the step 2), 26L of purified water is added into the main plating tank, and 2L of purified water is added into the auxiliary plating tank.
8. An electroless nickel plating method according to claim 1, characterized in that: taking 0.2L of nickel plating solution in the step 3); 0.1L of nickel plating solution is taken in the step 4).
9. An electroless nickel plating method according to claim 1, characterized in that: the addition amount of the solution B and the solution C in the step 6) is 10 ml; the residence time in step 7) was 50 hours.
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