CN110022642A - Printed circuit board and print circuit plates making method - Google Patents
Printed circuit board and print circuit plates making method Download PDFInfo
- Publication number
- CN110022642A CN110022642A CN201910350548.1A CN201910350548A CN110022642A CN 110022642 A CN110022642 A CN 110022642A CN 201910350548 A CN201910350548 A CN 201910350548A CN 110022642 A CN110022642 A CN 110022642A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- wall
- interfering bodies
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
This application discloses a kind of printed circuit boards and print circuit plates making method, wherein, printed circuit board includes printed circuit board medium and interfering bodies, interfering bodies is embedded in printed circuit board medium, via hole is disposed on printed circuit board medium, the outer wall of via hole is equipped with metal layer, interfering bodies includes inner and outer wall, so that the residual interference body that a part of interfering bodies is abraded rear exposure can interfere metal layer, printed circuit board further includes temperature-resistant insulation layer, and temperature-resistant insulation layer is coated on outside the outer wall of interfering bodies.
Description
Technical field
The present invention relates to art of printed circuit boards, in particular to a kind of printed circuit board and print circuit plates making
Method.
Background technique
Printed circuit board (PCB) is the substrate for carrying electronic component, is the specific carrying of electronic component interconnected relationship
And physics embodies, and is the important component of electronic product.
In general, the PCB design of electronic product and it is achieved in that unidirectional and positive, i.e., Electronics Engineer first passes through
Drawing principle figure embodies its design philosophy, and the connection relationship of schematic diagram and device information are then imported PCB, by drawing, adds
Work PCB, welding device realize its design philosophy.
But after the listing of certain electronic product, some practitioners can disassemble the product for this product of mountain vallage
Material object PCB is obtained, then by obtaining the device information on the PCB, patch coordinate information, the surface layer PCB copper sheet and the figure of route
The mode of shape and the information such as via hole aperture and location information, is copied as original product completely using above-mentioned All Files
Hardware circuit.Due to replicating hardware circuit in this way, research and development cost is not needed substantially, so duplication hardware circuit
Situation largely exists and can not prevent.
How to improve the above problem, is the emphasis of those skilled in the art's concern.
Summary of the invention
This application provides a kind of printed circuit boards and print circuit plates making method.
Wherein, first aspect provides a kind of printed circuit board, including printed circuit board medium and interfering bodies, the interference
Body is embedded in the printed circuit board medium, is disposed with via hole on the printed circuit board medium, on the hole wall of the via hole
Equipped with metal layer, the interfering bodies includes inner wall and outer wall, so that a part of the interfering bodies is abraded the surplus of rear exposure
The remaining interfering bodies can interfere the metal layer, and the printed circuit board further includes temperature-resistant insulation layer, described resistance to
High-temperature insulating layer is coated on outside the outer wall of the interfering bodies.
Wherein, second aspect provides a kind of production method of printed circuit board, including interfering bodies is embedded in previously prepared
Good printed circuit board medium；Via hole is arranged on the printed circuit board medium；Metal is set on the hole wall of the via hole
Layer；Wherein, the interfering bodies includes inner wall and outer wall, and the outer wall is coated with temperature-resistant insulation layer.
Wherein, the third aspect provides a kind of production method of printed circuit board, the printing applied to not via hole
In circuit board, including interfering bodies to be embedded in printed circuit board medium well prepared in advance；Wherein, the interfering bodies include inner wall with
Outer wall, the printed circuit board further include temperature-resistant insulation layer, and the temperature-resistant insulation layer is coated on the outer wall of the interfering bodies
Outside.
Detailed description of the invention
In order to illustrate more clearly of the technical solution in the application, required attached drawing in embodiment description will be made below
It is simple to introduce, it should be apparent that, drawings discussed below is only some embodiments of the present application, skill common for this field
For art personnel, without creative efforts, it is also possible to obtain other drawings based on these drawings.Wherein:
Fig. 1 shows the structural schematic diagram of the printed circuit board of one embodiment of the present of invention offer；
It is cutting for hollow interfering bodies and temperature-resistant insulation layer Fig. 2 shows the inside that one embodiment of the present of invention provides
Face schematic diagram；
There are the interfering bodies and temperature-resistant insulation layer of obturator in the inside that Fig. 3 shows one embodiment of the present of invention offer
Section schematic diagram；
Fig. 4 shows the cross-sectional of the printed circuit board of one embodiment of the present of invention offer；
Fig. 5 show another embodiment of the present invention provides printed circuit board production method flow chart.
Specific embodiment
Below with reference to the attached drawing in the embodiment of the present application, technical solutions in the embodiments of the present application carries out clear, complete
Ground description, it is clear that described embodiments are only a part of embodiments of the present application, rather than whole embodiments.Based on this Shen
Please in embodiment, those of ordinary skill in the art's every other reality obtained under the premise of not making creative labor
Example is applied, shall fall in the protection scope of this application.
Fig. 1 is please referred to, the embodiment of the invention provides a kind of printed circuit board 100, which includes printing
Circuit board medium 110 and interfering bodies 120, interfering bodies 120 are embedded in printed circuit board medium 110.
Specifically, further including on printed circuit board 100 to make each interlayer of printed circuit board 100 realize electrical connection
Via hole 130, and the electroplated metal layer 135 on the hole wall of via hole 130, to realize that each interlayer of printed circuit board 100 is electrically connected
It connects, which includes but is not limited to layers of copper, and the hole wall of via hole 130 is hollow metal cylinder at this time, for this hollow gold
Belong to cylinder, can use and retain hollow or be filled using insulators such as resins.In the prior art, when practitioner wants
When obtaining the information of via hole 130, the information of via hole 130 is the location information and mistake for obtaining via hole 130 and being located at printed circuit board 100
The aperture information in hole 130 can abrade the line layer of printed circuit board 100, exposure printed circuit board medium 110, and use coal
Oily or other developers develop to printed circuit board 100, then with high-precision camera to printed circuit board medium 110 into
Row is taken pictures, right then using the contrast of the color between the metal layer 135 and printed circuit board medium 110 of 130 hole wall of via hole
Via hole 130 is identified, to obtain 130 information of via hole.
Therefore, in this application, printed circuit board 100 is replicated in order to prevent, so being arranged in printed circuit board 100
Interfering bodies 120 can abrade the part of interfering bodies 120, and make remaining interfering bodies when practitioner abrades line layer
120 exposures, and the shape of the remaining interfering bodies 120 after exposing is in circular ring shape, the color of the remaining interfering bodies 120 of exposure with
135 color of metal layer is identical, and diameter is also identical as the diameter of metal layer 135, makes to obtain 130 information of via hole to practitioner
At interference, duplication of the practitioner to printed circuit board 100 is prevented.
Shape in order to realize exposed interfering bodies 120 is also identical with metal layer 135, in the present embodiment, interfering bodies
120 shape is spherical or cylindricality, after practitioner abrades line layer, spherical or cylindrical interfering bodies 120 can be made to grind
Except part, remaining interfering bodies 120 is in a ring, all the same with shape and the color of metal layer 135, to interfere.
It should be noted that the identical diameter for being not necessarily referring to exposed interfering bodies 120 and metal layer 135 that this implementation is described
Internal diameter is completely the same, and refers to that the diameter of exposed interfering bodies 120 is roughly the same with the internal diameter of metal layer 135.
In the present embodiment, interfering bodies 120 can be divided into it is internal be it is hollow or it is internal have 127 two kinds of obturator, below with ball
For shape interfering bodies 120, two kinds of interfering bodies 120 are illustrated respectively.
The first, inside is hollow interfering bodies 120:
Referring to Fig. 2, the interfering bodies 120 includes inner wall 123 and outer wall 121, the diameter of outer wall 121 is straight with via hole 130
Diameter is identical, and the diameter of inner wall 123 is identical as the internal diameter of metal layer 135, is formed between the inner wall 123 and outer wall 121 of interfering bodies 120
First cavity, the inside of the inner wall 123 of interfering bodies 120 form the second cavity, and are filled in the first cavity and form metal layer
The identical interference layer 125 of the color of 135 material, the second cavity are hollow cavity.
In order to prevent after interfering bodies 120 is embedded in printed circuit board medium 110, cause on printed circuit board medium 110
Line layer short circuit situation generation, printed circuit board 100 further includes having temperature-resistant insulation layer 129, temperature-resistant insulation layer 129
It is wrapped in the outside of 120 outer wall 121 of interfering bodies, i.e. temperature-resistant insulation layer 129 is wrapped in 125 outside of interference layer, plays insulation and makees
With.Also, due to being that temperature reaches as high as 200 degrees Celsius in the pressing of printed circuit board 100, so 129 energy of temperature-resistant insulation layer
It is enough effectively to prevent when printed circuit board 100 presses, the case where interfering bodies 120 is deformed because of high temperature, in the present embodiment, this
Temperature-resistant insulation layer 129 includes but is not limited to glassy layer or rubber layer or resin layer.
Second, there is the interfering bodies 120 of obturator 127 in inside:
Referring to Fig. 3, the interfering bodies 120 equally includes inner wall 123 and outer wall 121, the diameter and via hole 130 of outer wall 121
Diameter it is identical, the diameter of inner wall 123 is identical as the internal diameter of metal layer 135, between the inner wall 123 and outer wall 121 of interfering bodies 120
The first cavity is formed, the inside of the inner wall 123 of interfering bodies 120 forms the second cavity, and filled with golden with formation in the first cavity
Belong to the identical interference layer 125 of color of the material of layer 135, the second cavity is filled with obturator 127, and the face of the obturator 127
Color is different from the interference color of material of layer 125.Also, since the via hole of printed circuit board 100 130 can be hollow or filling
There is resin material, in view of this, in the present embodiment, obturator 127 uses resin obturator 127, to cause more effectively
Interference.Of course, other materials with interference 125 first cavity of layer can also be used in obturator 127 in some other embodiments
The different obturator 127 of the color of material, the present embodiment do not do any restriction to this.
In order to prevent after interfering bodies 120 is embedded in printed circuit board medium 110, cause on printed circuit board medium 110
Line layer short circuit situation generation, printed circuit board 100 further includes having temperature-resistant insulation layer 129, temperature-resistant insulation layer 129
It is wrapped in the outside of 120 outer wall 121 of interfering bodies, i.e. temperature-resistant insulation layer 129 is wrapped in 125 outside of interference layer, plays insulation and makees
With.Also, since when printed circuit board 100 presses, temperature reaches as high as 200 degrees Celsius, so 129 energy of temperature-resistant insulation layer
It is enough effectively to prevent when printed circuit board 100 presses, the case where interfering bodies 120 is deformed because of high temperature, in the present embodiment, this
Temperature-resistant insulation layer 129 includes but is not limited to glassy layer or rubber layer or resin layer.
When due to obtaining 130 information of via hole, the main color by metal layer 135 obtains 130 information of via hole, will print
After the line layer of circuit board 100 abrades, either internal is hollow interfering bodies 120 or the internal interference for having obturator 127
A part of interfering bodies 120 can be abraded, expose the interfering bodies 120 of remainder by body 120, referring to Fig. 4, wherein, by
In interference 125 color of layer it is identical as the color of metal layer 135, thus exposed image in appearance, which, which can not be differentiated, is
Metal layer 135, which is interfering bodies 120, that is, cannot be distinguished via hole 130 and interfering bodies 120, so that via hole 130 can not be obtained
Information, and then connection relationship cannot be obtained.Or it regard interfering bodies 120 as via hole 130,130 information of via hole of mistake is obtained, from
And the connection relationship of mistake is finally obtained, and then replicate the printed circuit board 100 to make mistake, in some instances it may even be possible to cause short circuit, cause
Printed circuit board 100 is scrapped, and is answered to effectively prevent practitioner the printed circuit board 100 that embodiment provides
System.Also, printed circuit board 100 provided in this embodiment is compatible with the processing of existing printed circuit board 100, paster technique, institute
It is low in cost with easy to process.
It should be noted that in the present embodiment, printed circuit board medium 110 has resin material and glass fabric group
At hot pressing is with after, and resin material is heating and curing, to form printed circuit board medium 110.It is embedding in order to facilitate interfering bodies 120
Enter in printed circuit board medium 110, in the present embodiment, 120 position of interfering bodies is random to be placed in the gap of glass fabric,
Then resin material is heating and curing, and interfering bodies 120 is embedded in printed circuit board medium 110 to realize.
Second embodiment
Referring to Fig. 5, the embodiment of the invention provides a kind of 100 production method of printed circuit board, the printed circuit board 100
Production method the following steps are included:
Step S201, production is different from the color of the material of metal layer 135, diameter is identical with the internal diameter of metal layer 135
Obturator 127.
Since the via hole 130 of printed circuit board 100 can be filled using resin, so in the present embodiment, in order to prevent
Practitioner can identify simultaneously when identifying via hole 130 according to interference layer 125 and the color of obturator 127, so this reality
Apply example be preferably filled with body 127 color it is identical as the color of resin material.Further, in order to make the color of obturator 127 with
The solid colour filled in via hole 130, in the present embodiment, obturator 127 use resin obturator 127, to make to expose
The whole color of integral color and via hole 130 of interfering bodies 120 it is identical, of course, in some other embodiments,
The obturator 127 of other materials can be used, the present embodiment does not do any restriction to this.
Step S202 wraps up interference layer 125 identical with the material color of metal layer 135 outside obturator 127, is formed dry
Disturb body 120, wherein the diameter of interference 125 outer wall 121 of layer is identical as the diameter of via hole 130.
The interference layer 125 exposed is in a ring, all the same with shape, the color of exposed metal layer 135, to make to obtain employment
Member is also identified as via hole 130 in copying and printing circuit board 100, by interference layer 125, so that the via hole 130 for obtaining mistake is believed
Breath.Of course, in some other embodiments, hollow interfering bodies 120 can also be directly made, without making obturator
127。
Step S203 wraps up the temperature-resistant insulation layer 129 different from the material color of metal layer 135 outside interference layer 125.
In order to prevent after interfering bodies 120 is embedded in printed circuit board medium 110, cause on printed circuit board medium 110
Line layer short circuit situation generation, so interference layer 125 outside wrapped up temperature-resistant insulation layer 129, do not only reached absolutely
The effect of edge, and printed circuit board 100 can be prevented in pressing since high temperature interferes the production for the case where body 120 deforms
It is raw.
Interfering bodies 120 after package temperature-resistant insulation layer 129 is embedded in printed circuit board well prepared in advance by step S204
Medium 110.
Since printed circuit board 100 is made of resin material and glass fabric, so, in order to more easily by interfering bodies
In 120 insertion printed circuit board media 110, interfering bodies can be placed at random between the gap of uncured preceding glass fabric
120。
Step S205 carries out lamination to the printed circuit board medium 110 after insertion interfering bodies 120.
Step S206 carries out high-temperature laminating to 100 medium of printed circuit board after lamination.
Step S207 arranges via hole 130 on 100 medium of printed circuit board.
In order to make the line conduction between every layer of printed circuit board medium 110 after lamination, so after need to be to high-temperature laminating
Printed circuit board 100 carry out drilling processing, then by realizing route between every layer in 130 electroplating metal material layer of via hole
Conducting.
Metal layer is arranged on the hole wall of the via hole 130 in step S208.
On the hole wall of via hole 130 after electroplated metal layer, the route on 100 medium of printed circuit board between every layer can be made to lead
It is logical.In the present embodiment, metal layer is layers of copper, but in some other embodiments, and metal layer may be other materials layer,
The present embodiment does not do any restriction to this.
It should be noted that in the present embodiment, step S204 can complete independently, i.e. other steps are without elder generation more than step S204
Sequence afterwards.
In conclusion the present invention provides a kind of printed circuit board and print circuit plates making method, the printed circuit board
Including printed circuit board medium and interfering bodies, interfering bodies is embedded in printed circuit board medium, when related practitioner wants again
When printed wiring board using them product, when needing to obtain via hole aperture and the location information on the printed circuit board.Obtaining the printing
When via hole aperture on circuit board and location information, practitioner can first be abraded printed circuit board copper sheet, line layer, expose print
Printed circuit board medium, then again identifies via hole.When abrading printed circuit board copper sheet, line layer abrading, can grind simultaneously
Except a part of interfering bodies, and make the exposure of remaining interfering bodies, and filled between the inner wall and outer wall of the interfering bodies after exposing
The color of material layer is identical as the metal layer color of hole surface is crossed, the diameter of inner wall and outer wall also with the metal layer of crossing hole surface
Internal diameter with roughly same outer diameter, due to practitioner using intelligent terminal identification via hole information when, mainly pass through the face of metal layer
Color and shape, after being early included in interfering bodies, it is via hole which intelligent terminal, which can not tell, which is interfering bodies, to can not obtain
Via hole information is taken, and then connection relationship cannot be obtained；Prevent to enabling the printed circuit board effectively practitioner at
The printed circuit panel products of type are replicated.
It should be noted that, in this document, the relational terms of such as " first " and " second " or the like are used merely to one
A entity or operation with another entity or operate distinguish, without necessarily requiring or implying these entities or operation it
Between there are any actual relationship or orders.Moreover, the terms "include", "comprise" or its any other variant are intended to
Cover non-exclusive inclusion, so that the process, method, article or equipment for including a series of elements not only includes those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or setting
Standby intrinsic element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that
There is also other Matching Elements in the process, method, article or apparatus that includes the element.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, made any to repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.It should also be noted that similar label and letter exist
Similar terms are indicated in following attached drawing, therefore, once being defined in a certain Xiang Yi attached drawing, are then not required in subsequent attached drawing
It is further defined and explained.
Claims (10)
1. a kind of printed circuit board, which is characterized in that the printed circuit board includes printed circuit board medium and interfering bodies, described
Interfering bodies is embedded in the printed circuit board medium, and via hole, the hole of the via hole are disposed on the printed circuit board medium
Wall is equipped with metal layer, and the interfering bodies includes inner wall and outer wall, so that a part of the interfering bodies exposes after being abraded
The residue interfering bodies metal layer can be interfered, the printed circuit board further includes temperature-resistant insulation layer, institute
Temperature-resistant insulation layer is stated to be coated on outside the outer wall of the interfering bodies.
2. printed circuit board as described in claim 1, which is characterized in that the diameter phase of the diameter of the outer wall and the via hole
Together, the diameter of the inner wall is identical as the internal diameter of the metal layer, the material filled between the inner wall and outer wall of the interfering bodies
The color of layer is identical as the color of material for forming the metal layer, the inside of the inner wall be it is hollow or be filled with it is described interior
The different obturator of the color of material layer between wall and outer wall；
And/or the shape of the interfering bodies is spherical or cylindricality.
3. printed circuit board as described in claim 1, which is characterized in that the temperature-resistant insulation layer includes glassy layer or rubber
Layer or resin layer.
4. printed circuit board as described in claim 1, which is characterized in that the printed circuit board medium includes glass fibre
Cloth, the interfering bodies are placed in the gap of the glass fabric.
5. printed circuit board as claimed in claim 2, which is characterized in that the obturator is resin obturator.
6. a kind of print circuit plates making method, which is characterized in that the print circuit plates making method includes:
Interfering bodies is embedded in printed circuit board medium well prepared in advance；
Via hole is arranged on the printed circuit board medium；
Metal layer is set on the hole wall of the via hole；
Wherein, the interfering bodies includes inner wall and outer wall, and the outer wall is coated with temperature-resistant insulation layer.
7. print circuit plates making method as claimed in claim 6, which is characterized in that the diameter of the inner wall and the metal
The internal diameter of layer is identical, the material of the color and formation metal layer of the material layer between the inner wall and outer wall of the interfering bodies
Color is identical, when the inside of the inner wall of the interfering bodies is filled with the obturator different from the color of the material of the metal layer
When, before described the step of interfering bodies is embedded in printed circuit board medium well prepared in advance, the print circuit plates making
Method further include:
Make, diameter with the internal diameter of the metal layer identical obturator different from the color of the material of the metal layer；
Interference layer identical with the material color of the metal layer, the diameter of the interference layer outer wall are wrapped up outside the obturator
It is identical as the diameter of the via hole.
8. print circuit plates making method as claimed in claim 7, which is characterized in that it is described outside the obturator package with
After the step of material color of the metal layer identical interference layer, the print circuit plates making method further include:
The temperature-resistant insulation layer different from the material color of the metal layer is wrapped up outside the interference layer.
9. print circuit plates making method as claimed in claim 6, which is characterized in that interfering bodies is embedded in system in advance described
After the step of printed circuit board medium got ready, the print circuit plates making method further include:
The printed circuit board medium after multiple insertion interfering bodies is subjected to lamination and high-temperature laminating.
10. a kind of print circuit plates making method, which is characterized in that applied in the printed circuit board of not via hole, institute
Stating print circuit plates making method includes:
Interfering bodies is embedded in printed circuit board medium well prepared in advance；
Wherein, the interfering bodies includes inner wall and outer wall, and the printed circuit board further includes temperature-resistant insulation layer, the high temperature resistant
Insulating layer is coated on outside the outer wall of the interfering bodies.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910350548.1A CN110022642A (en) | 2017-07-04 | 2017-07-04 | Printed circuit board and print circuit plates making method |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710538937.8A CN107124828B (en) | 2017-07-04 | 2017-07-04 | Printed circuit board and print circuit plates making method |
| CN201910350548.1A CN110022642A (en) | 2017-07-04 | 2017-07-04 | Printed circuit board and print circuit plates making method |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710538937.8A Division CN107124828B (en) | 2017-07-04 | 2017-07-04 | Printed circuit board and print circuit plates making method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110022642A true CN110022642A (en) | 2019-07-16 |
Family
ID=59730920
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910350548.1A Withdrawn CN110022642A (en) | 2017-07-04 | 2017-07-04 | Printed circuit board and print circuit plates making method |
| CN201710538937.8A Expired - Fee Related CN107124828B (en) | 2017-07-04 | 2017-07-04 | Printed circuit board and print circuit plates making method |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710538937.8A Expired - Fee Related CN107124828B (en) | 2017-07-04 | 2017-07-04 | Printed circuit board and print circuit plates making method |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN110022642A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110022642A (en) * | 2017-07-04 | 2019-07-16 | 奇酷互联网络科技（深圳）有限公司 | Printed circuit board and print circuit plates making method |
| CN111726935A (en) * | 2020-07-17 | 2020-09-29 | 刘群 | Printed circuit board for computer and manufacturing method thereof |
| CN112698184A (en) * | 2020-12-17 | 2021-04-23 | 珠海杰赛科技有限公司 | Low resistance test method of PCB |
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| DE3120706A1 (en) * | 1981-05-25 | 1982-12-09 | Manfred 8200 Rosenheim Becker | Method of producing a drill tracing template for a copy-drilling machine which is intended for drilling printed-circuit boards |
| EP0101994B1 (en) * | 1982-08-30 | 1986-05-07 | International Business Machines Corporation | Printed circuit board modification process |
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| CN107124828B (en) * | 2017-07-04 | 2019-06-18 | 奇酷互联网络科技（深圳）有限公司 | Printed circuit board and print circuit plates making method |
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| WO2010100812A1 (en) * | 2009-03-02 | 2010-09-10 | 株式会社ビッズソリューション | Printed circuit board, electronic device, and method of producing printed circuit board |
| FR2983775B1 (en) * | 2011-12-08 | 2014-01-10 | Arjowiggins Security | SECURITY STRUCTURE INCORPORATING AN ELECTRONIC DEVICE |
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| CN205354524U (en) * | 2016-02-01 | 2016-06-29 | 温州豪格防伪科技有限公司 | Protect card membrane antifalsification label |
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| DE3120706A1 (en) * | 1981-05-25 | 1982-12-09 | Manfred 8200 Rosenheim Becker | Method of producing a drill tracing template for a copy-drilling machine which is intended for drilling printed-circuit boards |
| EP0101994B1 (en) * | 1982-08-30 | 1986-05-07 | International Business Machines Corporation | Printed circuit board modification process |
| CN105555017A (en) * | 2016-01-28 | 2016-05-04 | 深圳市华思通科技有限公司 | Encryption technology for preventing copying of PCB |
| CN107124828B (en) * | 2017-07-04 | 2019-06-18 | 奇酷互联网络科技（深圳）有限公司 | Printed circuit board and print circuit plates making method |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN107124828A (en) | 2017-09-01 |
| CN107124828B (en) | 2019-06-18 |
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Application publication date: 20190716 |