CN110012595A - A kind of board structure of circuit and electronic equipment - Google Patents
A kind of board structure of circuit and electronic equipment Download PDFInfo
- Publication number
- CN110012595A CN110012595A CN201910349337.6A CN201910349337A CN110012595A CN 110012595 A CN110012595 A CN 110012595A CN 201910349337 A CN201910349337 A CN 201910349337A CN 110012595 A CN110012595 A CN 110012595A
- Authority
- CN
- China
- Prior art keywords
- layer
- pad
- static electricity
- signal wire
- board structure
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0257—Overvoltage protection
- H05K1/0259—Electrostatic discharge [ESD] protection
Abstract
The present invention provides a kind of board structure of circuit and electronic equipment, the board structure of circuit includes dielectric layer, static electricity shield layer and electronic component, the dielectric layer is equipped with signal wire connection pad and ground pad, gap is equipped between the signal wire connection pad and the ground pad, the static electricity shield layer is set to the side towards the ground pad of the dielectric layer, and abutted with the ground pad, the electronic component connect pad connection with the signal wire；Wherein, the dielectric layer and the static electricity shield layer are through with through-hole, and the hole wall of the through-hole is equipped with conductive layer, and the conductive layer connects pad connection with the signal wire for connecting the electronic component.Technical solution provided in an embodiment of the present invention solves the problems, such as that the existing ground line of existing circuit board is more and wiring is complicated.
Description
Technical field
The present invention relates to field of communication technology more particularly to a kind of board structure of circuit and electronic equipment.
Background technique
It is well known that electrostatic is ubiquitous, the electrostatic potential that human body carries is from up to several hectovolts to tens of thousands of volts, circuit board
During SMT (Surface Mount Technology, surface mounting technology) patch, carrying and transport, slightly handle not
When electrostatic can directly contribute electronic device breakdown, burn.Meanwhile carrier of the circuit board as electronic component, usually in circuit
Integrated electronics (such as chip, inductance, capacitor) carry out data processing on plate, when human body touching or circuit system have just powered off
When, since Electro-static Driven Comb discharges, it be easy to cause inside circuit system and generates electronics concussion, when the voltage of electronics concussion is excessive,
Can exceed that certain components can reactance voltage, formed circuit system electric discharge, ultimately cause the damage of component.
Currently, ground line would generally be set on circuit boards, the device protected on the guarantor path that electrostatic passes through or in needs
Increase dedicated ESD (Electro-Static discharge, Electro-static Driven Comb) device by part, electrostatic charge is allowed to be protected in arrival
Electronic device before pass through the device of these anti-ESD and imported into ground plane.But such design will use more connect
Ground wire and the dedicated anti-ESD device of increase cause existing circuit board to there is a problem of that ground line is more and is routed complexity.
Summary of the invention
The embodiment of the present invention provides a kind of board structure of circuit and electronic equipment, to solve ground connection existing for existing circuit board
The problem that line is more and wiring is complicated.
In a first aspect, the embodiment of the invention provides a kind of board structure of circuit, comprising:
Dielectric layer, the dielectric layer are equipped with signal wire connection pad and ground pad, the signal wire connection pad with
Gap is equipped between the ground pad；
Static electricity shield layer, the static electricity shield layer be set to the dielectric layer the side towards the ground pad, and with
The ground pad abuts；
Electronic component connect pad connection with the signal wire；
Wherein, the dielectric layer and the static electricity shield layer are through with through-hole, and the hole wall of the through-hole is equipped with conduction
Layer, the conductive layer connect pad connection with the signal wire for connecting the electronic component.
Second aspect, the embodiment of the invention also provides a kind of electronic equipment, including circuit board described in first aspect
Structure.
In technical solution provided in an embodiment of the present invention, static electricity shield layer, electrostatic protection are provided in board structure of circuit
Layer has anti-moment electrical overloads performance, which connect with ground pad, and static electricity shield layer runs through with dielectric layer to be had
Through-hole, the conductive layer in through hole wall are also just in contact with static electricity shield layer, and the conductive layer and the letter that connect electronic component
The connection pad connection of number line, when electronic component is generated high voltage by electrostatic, static electricity shield layer can be become by insulator
Electrostatic conducting ground is effectively protected electronic component from electrostatic damage by electric conductor.It is needed compared to existing
Ground plane is all arranged in each layer of dielectric layer, and the such design of the embodiment of the present invention need to only be arranged in the side of static electricity shield layer and connect
Ground pad can be grounded, and reduce the design of ground plane in board structure of circuit, be more advantageous to signal wire on board structure of circuit
Layout.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, needed in being described below to the embodiment of the present invention
Attached drawing to be used is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention,
For those of ordinary skill in the art, without any creative labor, it can also obtain according to these attached drawings
Take other attached drawings.
Fig. 1 is a kind of cross-sectional view of board structure of circuit provided in an embodiment of the present invention；
Fig. 2 is that the first signal wire connects pre-determined distance between pad and ground pad in the board structure of circuit of Fig. 1 offer
Schematic diagram；
Fig. 3 is that electrostatic is moved towards schematic diagram when electronic component is by electrostatic on the board structure of circuit of Fig. 1 offer.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are some of the embodiments of the present invention, instead of all the embodiments.Based on this hair
Embodiment in bright, those of ordinary skill in the art's acquired every other implementation without creative efforts
Example, shall fall within the protection scope of the present invention.
The embodiment of the invention provides a kind of board structure of circuit, please refer to Fig. 1, and the board structure of circuit includes dielectric layer
105, static electricity shield layer 106 and electronic component 101, dielectric layer 105 are equipped with signal wire connection pad 102 and ground pad
107, it is equipped with gap between the signal wire connection pad 102 and the ground pad 107, static electricity shield layer 106 is set to medium
The side towards ground pad 107 of layer 105, and static electricity shield layer 106 is abutted with ground pad 107, the electronic component
101 connect the connection of pad 102 with signal wire；Wherein, dielectric layer 105 and static electricity shield layer 106 are through with through-hole 104, and through-hole
104 hole wall is equipped with conductive layer 1041, and conductive layer 1041 connects pad 102 with the signal wire for connecting electronic component 101 and connects
It connects.In the embodiment of the present invention, signal wire, which connects, is equipped with gap between pad 102 and ground pad 107, also allows for signal wire company
Connecing pad 102 will not be in contact with ground pad 107, it is ensured that signal wire connects the normal work of electronic component 101 on pad 102
Make.Wherein, conductive layer 1041 is preferably conductive metal, such as copper, can be on the hole wall of through-hole 104 coated copper to form copper
Layer.Since through-hole 104 penetrates through dielectric layer 105 and static electricity shield layer 106, then the layers of copper on 104 hole wall of through-hole also will with it is quiet
Electric protective layer 106 abuts；It is connected in addition, the layers of copper also connects pad 102 with the signal wire for connecting electronic component 101.Electrostatic
Protective layer 106 has anti-moment electrical overloads performance, such as when being generated high voltage (> 250V) by electrostatic, static electricity shield layer
106 can become electric conductor by insulator, to realize that electrostatic conducts.Specifically, it is generated when electronic component 101 by electrostatic high
When voltage, the electrostatic of generation is transferred to static electricity shield layer 106 along signal wire connection pad 102, layers of copper, due to electrostatic protection
Layer 106 is abutted with ground pad 107, and electrostatic can also be conducted from static electricity shield layer 106 to ground pad 107, is grounded,
The function of electrostatic protection is played, to play a protective role to electronic component 101.
Preferably, the material of static electricity shield layer 106 is pressure sensitive, and pressure sensitive can be inorganic silicon, metal oxide
Pressure sensitive, polymer voltage mutant materials etc..Pressure sensitive has non-linear conductive characteristic, in low-voltage state, pressure-sensitive material
The resistivity of material is very high, is insulator；When voltage rises, and reaches preset voltage value, the resistivity of pressure sensitive can be anxious
It falls sharply low, becomes electric conductor.In the embodiment of the present invention, when electronic component 101 is generated high voltage by electrostatic, pressure sensitive
Electric conductor is become by insulator, the electrostatic of conduction to static electricity shield layer 106 can also be conducted to ground pad 107, be played
The function of electrostatic protection.
Optionally, as shown in Figure 1, board structure of circuit includes multilayer dielectricity layer 105, at least the one of each layer of dielectric layer 105
Side is equipped with signal wire and connects pad 102, to realize the arrangement of electronic component 101 and its signal wire on board structure of circuit.Wherein,
Static electricity shield layer 106 is set between any two layers of dielectric layer 105, and ground pad 107 is folded in static electricity shield layer 106 and medium
Between layer 105, there is gap between the signal wire connection pad 102 on ground pad 107 and dielectric layer 105.Wherein, ground connection weldering
The material of disk 107 can be copper, and ground pad 107 can be the fritter copper sheet in static electricity shield layer 106 and connect in turn
Ground pad 107 would not also occupy dimensional space too big in board structure of circuit, so that can be laid out more on board structure of circuit
More signal wires connects pad 102, the signal wire arrangement being also just more advantageous on board structure of circuit.
It should be noted that board structure of circuit other than the through-hole 104 through dielectric layer 105 and static electricity shield layer 106, is gone back
Including the blind hole 103 set on dielectric layer 105, can be in blind hole 103 filled with conductive material, such as copper.
In a kind of embodiment of the embodiment of the present invention, static electricity shield layer 106 can be Nian Jie with dielectric layer 105.Example
Such as, it can be and increase adhesive membrane made of a pressure sensitive, the pressure sensitive between dielectric layer 105 and ground pad 107
Manufactured adhesive membrane i.e. static electricity shield layer 106, be also achieved that in this way static electricity shield layer 106 and dielectric layer 105 and with
Ground pad 107 is bonded.
In the another embodiment of the embodiment of the present invention, static electricity shield layer 106 be can be coated on dielectric layer 105
On.For example, a slim pressure sensitive is coated on dielectric layer 105, to form static electricity shield layer 106, then in electrostatic protection
Ground pad 107 and dielectric layer 105 are set on layer 106, to realize the connection of static electricity shield layer 106 Yu ground pad 107, with true
Static electricity shield layer 106 is protected after becoming conductive layer 1041 by insulator, the electrostatic of conduction to static electricity shield layer 106 can be conducted
To ground pad 107 to be grounded, it is ensured that the safety of electronic component 101 on board structure of circuit.
Optionally, static electricity shield layer 106 with a thickness of 1~25 μm, preferably lesser numerical value also allows for board structure of circuit
Integral thickness not will increase too much.
In the embodiment of the present invention, the quantity of dielectric layer 105 is at least one layer, at least one layer of referring in particular to Fig. 1 and Fig. 2
Include first medium layer 1051 in dielectric layer 105, first medium layer 1051 be located at ground pad 107 back to static electricity shield layer
106 side, it includes set on first between first medium layer 1051 and static electricity shield layer 106 that signal wire, which connects in pad 102,
Signal wire connects pad 1021, and the gap H is located between the first signal wire connection pad 1021 and ground pad 107.Also
It is to say, ground pad 107 will not be contacted with the first signal wire connection pad 1021, connect pad 1021 to avoid the first signal wire
Ground connection.
Optionally, referring to figure 2., at a distance from gap H of the first signal wire connection pad 1021 between ground pad 107
It is 15~200 μm, preferably lesser numerical value is also just avoided that between the first signal wire connection pad 1021 and ground pad 107
The problem of being restricted because of the layout quantity of signal wire connection pad 102 on the dielectric layer 105 caused by wide.
In addition, the first signal wire connection pad 1021 is connect with conductive layer 1041.In general, electronic component 101 is set to table
On the dielectric layer 105 of layer, referring in particular to Fig. 3, when electronic component 101 is generated high voltage by electrostatic, static electricity shield layer
106 can be become electric conductor by insulator, and the signal wire connection pad 102 for connecting electronic component 101 connects 104 hole of through-hole
Conductive layer 1041 on wall, the conductive layer 1041 connect the connection of pad 1021, in turn, electronic component 101 with the first signal wire
The electrostatic of upper generation is anti-along signal wire connection 102 → conductive layer of pad, 1041 → the first signal wire connection 1021 → electrostatic of pad
106 → ground pad of sheath 107 transmits, and final ground connection export is effectively protected electronic component 101, avoids electronics member device
Part 101 is also ensured that the safety of board structure of circuit by electrostatic breakdown.
In the embodiment of the present invention, static electricity shield layer 106, and the electrostatic are provided in the dielectric layer 105 of board structure of circuit
Protective layer 106 is connect with ground pad 107, and static electricity shield layer 106 runs through with dielectric layer 105 through-hole 104,104 hole wall of through-hole
On conductive layer 1041 be also just in contact with static electricity shield layer 106, and the conductive layer 1041 and the letter that connect electronic component 101
Number line connection pad 102 connects, and then when electronic component 101 is generated high voltage by electrostatic, static electricity shield layer 106 is by exhausted
Edge body becomes electric conductor, to realize the ground connection of electrostatic on electronic component 101, electronic component 101 is protected to damage from electrostatic
It is bad, in this way, board structure of circuit can be increased without additional Anti-static device, simplify the hardware design of board structure of circuit.Also,
It compared to existing needs that ground plane is all arranged in each layer of dielectric layer 105, the such design of the embodiment of the present invention only need to be quiet
The side setting ground pad 107 of electric protective layer 106 can be grounded, and reduce the design of ground plane in board structure of circuit,
It is more advantageous to the layout of signal wire on board structure of circuit.
The embodiment of the invention also provides a kind of electronic equipment, including board structure of circuit described in embodiment as above.This hair
The electronic equipment that bright embodiment provides includes all technical features of board structure of circuit in embodiment as above, and can reach identical
Technical effect, to avoid repeating, details are not described herein.
Wherein, electronic equipment may include: mobile phone, tablet computer, E-book reader, MP3 player, MP4 player,
Digital camera, pocket computer on knee, vehicle-mounted computer, desktop computer, set-top box, intelligent TV set, in wearable device
At least one of.
More than, only a specific embodiment of the invention, but scope of protection of the present invention is not limited thereto, and it is any to be familiar with
Those skilled in the art in the technical scope disclosed by the present invention, can easily think of the change or the replacement, and should all cover
Within protection scope of the present invention.Therefore, protection scope of the present invention should be subject to the protection scope in claims.
Claims (8)
1. a kind of board structure of circuit characterized by comprising
Dielectric layer, the dielectric layer are equipped with signal wire connection pad and ground pad, the signal wire connection pad with it is described
Gap is equipped between ground pad；
Static electricity shield layer, the static electricity shield layer be set to the dielectric layer the side towards the ground pad, and with it is described
Ground pad abuts；
Electronic component connect pad connection with the signal wire；
Wherein, the dielectric layer and the static electricity shield layer are through with through-hole, and the hole wall of the through-hole is equipped with conductive layer, institute
It states conductive layer and connects pad connection with the signal wire for connecting the electronic component.
2. board structure of circuit according to claim 1, which is characterized in that the material of the static electricity shield layer is pressure-sensitive material
Material.
3. board structure of circuit according to claim 1, which is characterized in that the static electricity shield layer and the dielectric layer are viscous
It connects.
4. board structure of circuit according to claim 1, which is characterized in that the static electricity shield layer is coated on the dielectric layer
On.
5. board structure of circuit according to claim 1, which is characterized in that the static electricity shield layer with a thickness of 1~25 μm.
6. board structure of circuit according to claim 1, which is characterized in that the quantity of the dielectric layer is at least one layer, until
Include first medium layer in few one layer of dielectric layer, the first medium layer be located at the ground pad back to the electrostatic protection
The side of layer, it includes set on first between the first medium layer and the static electricity shield layer that the signal wire, which connects in pad,
Signal wire connects pad, and the gap is located at first signal wire connection pad and the ground pad.
7. board structure of circuit according to claim 6, which is characterized in that the distance in the gap is 15~200 μm.
8. a kind of electronic equipment, which is characterized in that including board structure of circuit of any of claims 1-7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910349337.6A CN110012595A (en) | 2019-04-28 | 2019-04-28 | A kind of board structure of circuit and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910349337.6A CN110012595A (en) | 2019-04-28 | 2019-04-28 | A kind of board structure of circuit and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110012595A true CN110012595A (en) | 2019-07-12 |
Family
ID=67174685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910349337.6A Pending CN110012595A (en) | 2019-04-28 | 2019-04-28 | A kind of board structure of circuit and electronic equipment |
Country Status (1)
| Country | Link |
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| CN (1) | CN110012595A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101116155A (en) * | 2005-01-10 | 2008-01-30 | 力特保险丝有限公司 | Electrostatic discharge protection for embedded components |
| CN101226798A (en) * | 2006-08-03 | 2008-07-23 | 库帕技术公司 | Transient voltage protection circuit boards and manufacturing method |
| TW200931616A (en) * | 2008-01-10 | 2009-07-16 | Ind Tech Res Inst | Electrostatic discharge protection structures |
| CN102187746A (en) * | 2008-08-22 | 2011-09-14 | 肖克科技有限公司 | Core layer structure having voltage switchable dielectric material |
| CN102713016A (en) * | 2009-10-29 | 2012-10-03 | 肖克科技有限公司 | Metal deposition |
| KR20170084394A (en) * | 2016-01-11 | 2017-07-20 | 주식회사 심텍 | Printed Circuit Strip substrate and method of manufacturing the same |
| CN207124800U (en) * | 2015-06-25 | 2018-03-20 | 株式会社村田制作所 | Resin substrate and electronic equipment |
-
2019
- 2019-04-28 CN CN201910349337.6A patent/CN110012595A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101116155A (en) * | 2005-01-10 | 2008-01-30 | 力特保险丝有限公司 | Electrostatic discharge protection for embedded components |
| CN101226798A (en) * | 2006-08-03 | 2008-07-23 | 库帕技术公司 | Transient voltage protection circuit boards and manufacturing method |
| TW200931616A (en) * | 2008-01-10 | 2009-07-16 | Ind Tech Res Inst | Electrostatic discharge protection structures |
| CN102187746A (en) * | 2008-08-22 | 2011-09-14 | 肖克科技有限公司 | Core layer structure having voltage switchable dielectric material |
| CN102713016A (en) * | 2009-10-29 | 2012-10-03 | 肖克科技有限公司 | Metal deposition |
| CN207124800U (en) * | 2015-06-25 | 2018-03-20 | 株式会社村田制作所 | Resin substrate and electronic equipment |
| KR20170084394A (en) * | 2016-01-11 | 2017-07-20 | 주식회사 심텍 | Printed Circuit Strip substrate and method of manufacturing the same |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190712 |