CN110011686B - 无线通信互连***及其壁挂式套件 - Google Patents
无线通信互连***及其壁挂式套件 Download PDFInfo
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- CN110011686B CN110011686B CN201811585694.4A CN201811585694A CN110011686B CN 110011686 B CN110011686 B CN 110011686B CN 201811585694 A CN201811585694 A CN 201811585694A CN 110011686 B CN110011686 B CN 110011686B
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16M—FRAMES, CASINGS OR BEDS OF ENGINES, MACHINES OR APPARATUS, NOT SPECIFIC TO ENGINES, MACHINES OR APPARATUS PROVIDED FOR ELSEWHERE; STANDS; SUPPORTS
- F16M13/00—Other supports for positioning apparatus or articles; Means for steadying hand-held apparatus or articles
- F16M13/02—Other supports for positioning apparatus or articles; Means for steadying hand-held apparatus or articles for supporting on, or attaching to, an object, e.g. tree, gate, window-frame, cycle
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4284—Electrical aspects of optical modules with disconnectable electrical connectors
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- G—PHYSICS
- G08—SIGNALLING
- G08C—TRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
- G08C17/00—Arrangements for transmitting signals characterised by the use of a wireless electrical link
- G08C17/02—Arrangements for transmitting signals characterised by the use of a wireless electrical link using a radio link
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7088—Arrangements for power supply
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
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- H—ELECTRICITY
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- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
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- H—ELECTRICITY
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- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/40—Transceivers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
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- H04W4/00—Services specially adapted for wireless communication networks; Facilities therefor
- H04W4/70—Services for machine-to-machine communication [M2M] or machine type communication [MTC]
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- H—ELECTRICITY
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- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0004—Casings, cabinets or drawers for electric apparatus comprising several parts forming a closed casing
- H05K5/0008—Casings, cabinets or drawers for electric apparatus comprising several parts forming a closed casing assembled by screws
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- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0017—Casings, cabinets or drawers for electric apparatus with operator interface units
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- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0204—Mounting supporting structures on the outside of casings
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/03—Covers
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/38—Mechanical coupling means having fibre to fibre mating means
- G02B6/3807—Dismountable connectors, i.e. comprising plugs
- G02B6/3873—Connectors using guide surfaces for aligning ferrule ends, e.g. tubes, sleeves, V-grooves, rods, pins, balls
- G02B6/3885—Multicore or multichannel optical connectors, i.e. one single ferrule containing more than one fibre, e.g. ribbon type
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/421—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical component consisting of a short length of fibre, e.g. fibre stub
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4279—Radio frequency signal propagation aspects of the electrical connection, high frequency adaptations
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/048—Second PCB mounted on first PCB by inserting in window or holes of the first PCB
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
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- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
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Abstract
一种无线通信互连***及其壁挂式套件,所述壁挂式套件包括第一通信模组,所述第一通信模组包括第一主电路板模组以及第一辅电路板模组,所述第一主电路板模组设有用以无线传输极高频信号的第一集成电路组件,所述第一辅电路板模组设有用以至少传输电源的插座,所述第一辅电路板模组设于所述第一主电路板模组的中心位置,使得壁挂式套件使用方便并且对接可靠。
Description
【技术领域】
本发明有关一种无线通信互连***及其壁挂式套件,尤其涉及一种进行信号无线传输的无线通信互连***及其壁挂式套件。
【背景技术】
目前市面上的消费性电子产品如显示器、电视等一般作为接收端(Sink)与源端(Source)如计算机、机顶盒等之间经常通过HDMI线缆、Display Port线缆等信号线连接以进行数据、音频、视频等在内的各种信号传输,并且该等消费性电子产品还需单独设置的电源线与电源插座连接以供应电源。然而该等消费性电子产品在安装时不仅需要确保各种电源线、信号线连接正确,造成安装困难;而且各种电源线、信号线通过各种插头插拔配合长期使用后容易发生松动进而产生接触不良的现象。
因此,确有必要提供一种新的技术方案,以克服上述缺陷。
【发明内容】
本发明的目的在于提供一种使用方便的无线通信互连***及其壁挂式套件。
为实现上述目的,本发明采用如下技术方案:一种的壁挂式套件,包括第一通信模组,所述第一通信模组包括第一主电路板模组以及第一辅电路板模组,所述第一主电路板模组设有用以无线传输极高频信号的第一集成电路组件,所述第一辅电路板模组设有用以至少传输电源的插座,所述第一辅电路板模组设于所述第一主电路板模组的中心位置。
为实现上述目的,本发明还采用如下技术方案:一种无线通信互连***,包括壁挂式套件以及与所述壁挂式套件配合的面板套件,所述面板套件包括与所述第一通信模组对接配合的第二通信模组,所述第二通信模组包括第二主电路板模组以及第二辅电路板模组,所述第二主电路板模组设有与所述第一集成电路组件进行非接触式配合的第二集成电路组件,所述第二辅电路板模组设有与所述插座进行接触式配合的对接连接器,所述第二辅电路板模组设于所述第二主电路板模组的中心位置。
与现有技术相比,本发明具有如下有益效果:所述壁挂式套件的第一通信模组通过同时设置第一主电路板模组进行无线传输信号以及第一辅电路板模组进行电源供应,无需分开设置电源线及信号线,使用方便,并且所述第一主电路板模组使用无线传输技术,对接可靠。
【附图说明】
图1是本发明无线通信互连***中的壁挂式套件的立体示意图。
图2是图1另一角度的立体示意图。
图3是图1的部分分解示意图。
图4是图3中第一通信组件的分解示意图。
图5是图4另一角度的示意图。
图6是图4中第一通信模组的分解示意图。
图7是图6另一角度的分解示意图。
图8是图6中第一主电路板模组的分解示意图。
图9是图8另一角度的分解示意图。
图10是图6中第一辅电路板模组的分解示意图。
图11是图9另一角度的分解示意图。
图12是图6中第一辅电路板模组的剖面示意图。
图13是图7中光电转换模块次组件与QSFP连接器配合时的立体示意图。
图14是图13的立体分解图。
图15是本发明无线通信互连***中的面板套件安装至显示器上的立体示意图。
图16是图15的部分分解示意图。
图17是图15中面板套件与线缆连接时的示意图。
图18是图17另一角度的示意图。
图19是图17中面板套件的立体示意图。
图20是图19的部分分解示意图。
图21是图19中第二通信模组的部分分解示意图。
图22是图21另一角度的部分分解示意图。
图23是图19中第二辅电路板模组的部分分解示意图。
图24是图23另一角度的部分分解示意图。
图25是图19中第二辅电路板模组的剖面示意图。
【主要元件符号说明】
如下具体实施方式将结合上述附图进一步说明本发明。
【具体实施方式】
请参阅图1-4,本发明无线通信互连***包括相互对接的壁挂式套件100及面板套件300,所述壁挂式套件100可用于安装固定在墙体或座体等支撑物上,所述面板套件300可用于安装固定在电视或电脑显示屏等电子产品上,通过壁挂式套件100与面板套件300的对接进而可以实现电子产品的各种电源供应及信号传输。
请参阅图1-6所示,所述壁挂式套件100包括支架110及组装至支架110上的第一通信组件120。所述支架110在中心区域形成一圆形收容空间112,所述第一通信组件120收容组装在该收容空间112内。所述支架110上设有一水平仪111用于矫正该支架110的水平度。所述第一通信组件120包括第一背板132以及固定至第一背板132上的第一通信模组130。所述第一背板132设有若干贯穿的第一孔133及第二孔135,所述第一通信模组130通过螺钉137与第一孔133相配合进而固定到第一背板132上,所述第一背板132通过螺钉134穿过第二孔135并与支架110收容空间112的边缘114后方固定配合进而将第一背板132组装到支架110上。所述壁挂式套件100还包括一安装至支架110边缘114前方的盖体136,所述盖体136的中心设有贯穿的开口138。因此,所述盖体136和第一通信组件120共同将支架110的边缘114夹持在中间。
请进一步参阅图7-14所示,所述第一通信模组130包括第一主电路板模组140以及第一辅电路板模组200。所述第一主电路板模组140为电路板模组,其包括第一主电路板141以及若干安装至第一主电路板141的无线发射晶片模组。所述Keyssa为美国Keyssa科技公司的注册商标。第一主电路板141具有相对的结合面144和连接面146、位于中心位置并贯穿所述结合面144与连接面146的开口142以及位于开口142***的大致圆形的周边。所述无线发射晶片模组设置在结合面144上,其包括一对位于开口142两侧的一对第一无线发射晶片模组148以及一对位于开口142下方的一对第二无线发射晶片模组152,所述第一、第二无线发射晶片模组148、152内设有第一集成电路组件(IC Package)150、154用以将所述第一主电路板141的电信号转换成电磁信号以实现极高频信号的无线传输,本发明所称的极高频(Extremely high frequency,EHF)信号是指波长短于超高频(Super highfrequency,SHF)的电磁波信号,其波长范围为1mm到10mm。所述每一第一无线发射晶片模组148设置16个第一集成电路组件150以提升信号的带宽和速率,所述每一第二无线发射晶片模组152仅设有1个第一集成电路组件154以发射低速信号。
所述第一主电路板模组140还包括安装在第一主电路板141的连接面146上并围绕在开口142外的两对QSFP(Quad Small Form-factor Pluggable,四通道小型可插拔)连接器160,其中位于上方的一对QSFP连接器160以水平方式设置,位于下方的一对QSFP连接器160则相对倾斜设置并且相互之间形成一定夹角。所述第一主电路板模组140还包括与所述QSFP连接器160配合的光接收次组件(Receiver Optical Subassembly,ROSA)170,所述光接收次组件170包括光纤连接器174、与两对QSFP连接器160对接配合的两对光电转换模块次组件(Optical-Electronic Module Subassembly,OE Module Subassembly)176以及连接所述光纤连接器174与光电转换模块次组件176的光纤组件172。所述光纤连接器174可通过MPO适配器(Multi-fiber Push On Adapter,未图示)连接至机顶盒或控制盒的光发射次组件(Transmitter Optical Subassembly,TOSA,未图示)以进行光信号的传输,所述光信号经由两对光电转换模块次组件176转换成电信号并传输至4个QSFP连接器160;所述电信号通过4个QSFP连接器160经由第一主电路板141的连接面146传输至结合面144,并通过所述第一、第二无线发射晶片模组148、152转换成电磁信号进而实现极高频信号的无线传输。本发明上述两对QSFP连接器160的设置方式,即位于上方的一对QSFP连接器160以水平方式设置,位于下方的一对QSFP连接器160相对倾斜设置并且相互之间形成一定夹角,不仅方便光纤组件172的排布,也有利于更加优化第一主电路板141上的空间布局。
所述每个光电转换模块次组件176包括座体178、固定在座体178上的内电路板180以及一对安装在所述内电路板180上的光电转换模块(Optical-Electronic Module,OEModule)182。所述光纤组件172设有若干连接至所述光电转换模块182的光纤171。所述内电路板180包括设有若干金手指的对接部181,所述对接部181***至对应的QSFP连接器160以进行对接配合进而将转换后的电信号传输至QSFP连接器160。每个光电转换模块次组件176具有8个信号传输通道,因此4个光电转换模块次组件176共形成有32个信号传输通道,从而大大提升了信号传输的带宽和速率。所述第一无线发射晶片模组148设有32颗第一集成电路组件150对应于所述32个信号传输通道,进而将所有的电信号转换成电磁信号以实现极高频信号的无线传输。第一主电路板模组140还包括安装在第一主电路板141连接面146的电连接器143,所述第二无线发射晶片模组152对应连接所述电连接器143。
所述第一辅电路板模组200为电源电路板模组或弹簧顶针模组且设于所述第一主电路板模组140的中心位置,从而方便与电子产品进行对接,所述第一辅电路板模组200包括第一辅电路板202以及安装至第一辅电路板202的插座210。所述第一辅电路板202设有相对的结合面204和连接面206,所述第一辅电路板202的结合面204通过螺钉131组装固定在第一主电路板140的连接面146上。在本发明的实施例中,所述第一辅电路板组件200可以先安装至第一背板132上,然后再将第一主电路板140安装至第一背板132上并围绕在所述第一辅电路板202***。所述插座210延伸穿过所述第一主电路板140的开口142并超出所述结合面144。
所述插座210在本实施方式为弹簧顶针插座(Pogo Pin Socket),其包括收容在开口142内的绝缘本体220以及设于绝缘本体220上并暴露在所述第一主电路板140结合面144的弹簧顶针(Pogo Pin)222。所述弹簧顶针222具有轴向弹性,所述弹簧顶针222的前端延伸超过绝缘本体220的前表面221,并且所述弹簧顶针22的后端安装至所述第一辅电路板202的通孔208内。所述第一辅电路板模组200还包括安装在连接面206上的6个线对板连接器230(Wire-To-Board Connector,WTB Connector),多个电源线240电性和机械连接到所述线对板连接器230,以便通过第一辅电路板202进一步电性连接到所述弹簧顶针222。
所述弹簧顶针222共计24个,包括6个信号弹簧顶针S;7个电源弹簧顶针P12V、P52V;7个接地弹簧顶针G12V、G52V;以及4个检测弹簧顶针D。所有弹簧顶针222布置在围绕同一中心点的4个大小不同的同心圆内,且所述弹簧顶针222在4个同心圆从内向外的排布数量依次为4、6、8、4。如图13-14所示,其中电源弹簧顶针P12V、P52V排布在距离中心点最近的第一、第二同心圆内,而接地弹簧顶针G12V、G52V仅排布在第三同心圆内,而与其配合的面板套件300上的对接连接器同样采用类似同心圆的排布方式,这种将弹簧顶针222通过不同同心圆进行排布的方式使得壁挂式套件100和面板套件300在相互旋转配合时可以避免不同同心圆内的弹簧顶针222进行误接触,如电源弹簧顶针P12V、P52V和接地弹簧顶针G12V、G52V之间不会误接触而发生短路。距离中心点最远的第四同心圆内的4个弹簧顶针222为检测弹簧顶针D,且所述检测弹簧顶针D超出结合面204的高度不大于其他弹簧顶针的高度,以确保弹簧顶针222接触可靠。需要注意的是,相同的同心圆区域内的相邻两个弹簧顶针222之间的间隙应大于弹簧顶针222的直径,以确保在旋转配合期间弹簧顶针222与面板套件300的对接端子374之间不会发生短路。在其他实施例中,所述第一辅电路板202的最***区域可以的增加锁扣触点,以帮助确认壁挂式套件100与面板套件300之间的精准配合。
请参阅图15-25所示,显示器700(如电视)通常包括显示面板702、后壳704以及夹持在显示面板702和后壳704之间的边界密封件706。所述面板套件300及相关零部件安装在所述后壳704的内部,并且通过后壳704的开槽708暴露于外部以与所述壁挂式套件100对接配合。需要注意的是,图15-25虽然没有揭示壁挂式套件100中所示的支架110及盖体136结构,但该壁挂式套件100中所示的盖体136和支架110结构显然也可以应用在所述面板套件300中。
所述面板套件300包括第二通信组件302,所述第二通信组件302包括第二背板304以及固定至第二背板304上的第二通信模组310。所述第二通信模组310包括相互固定在一起的第二主电路板模组320和第二辅电路板模组360。所述第二主电路板模组320为电路板模组,其包括固定至第二背板304上的第二主电路板322以及若干安装至第二主电路板302的无线接收晶片模组。所述第二主电路板332设有开口323用于***述第二辅电路板模组360,所述第二主电路板322具有相对的结合面324和连接面326。所述无线接收晶片模组设置在结合面324上,其包括一对位于开口323两侧的一对第一无线接收晶片模组330以及一对位于开口323下方的一对第二无线接收晶片模组334,所述第一、第二无线接收晶片模组330、334用于与所述第一、第二无线发射晶片模组148、152配合以实现极高频信号的无线传输,第一、第二无线接收晶片模组330、334内设有第二集成电路组件(ICPackage)332用以将所述第一、第二无线发射晶片模组148、152发射的电磁信号的转换成电信号。第二集成电路组件332与所述第一集成电路组件150、154进行近距离非接触式配合。第一无线接收晶片模组330与第一无线发射晶片模组148配合以实现高速信号的传输,所述第二无线接收晶片模组334与第二无线发射晶片模组152配合以实现低速信号的传输。
对应地,所述第二主电路模组320包括两对LVDS(Low-Voltage DifferentialSignaling,低电压差分信号)连接器340用于电性连接至所述第一无线接收晶片模组330以接收所述第一无线接收晶片模组330转换的电信号。所述两对LVDS(Low-VoltageDifferential Signaling,低电压差分信号)连接器340安装在第二主电路板322的连接面326上,其中位于上方的一对LVDS连接器340相对倾斜设置并且相互之间形成一定夹角,而位于下方的一对LVDS连接器340则以水平方式设置,如此排布有利于更加优化第二主电路板322上的空间布局,以节省使用空间。
所述第二主电路板模组320的LVDS连接器340通过线缆500连接到显示器700的逻辑板(Timing-Control Board,T-CON Board,未图示),用于将电信号传输至逻辑板并显示相应的图像。换句话说,从壁挂式套件100上的第一、第二无线发射晶片模组148、152发射并由面板套件300上的第一、第二无线接收晶片模组330、334接收的信号可以经由LVDS连接器340进一步传送到逻辑板。第二主电路板模组320还包括一对设置在连接面326的上、下边缘的FFC(Flexible Flat Cable,柔性扁平线缆)连接器342,所述FFC连接器通过柔性扁平线缆(Flexible Flat Cable)510将信号传输到逻辑板。
所述第二辅电路板模组360固定安装至所述第二主电路板模组320。所述第二辅电路板模组360包括第二辅电路板362以及安装至第二辅电路板362的对接连接器370。所述第二辅电路板模组360具有相对的结合面364和连接面366,所述对接连接器370安装在第二辅电路板362的结合面364上。所述对接连接器370包括绝缘壳体372和设置在绝缘壳体372上的若干对接端子374。所述对接连接器370用于与壁挂式套件100上的插座210进行压接式配合,由于第一辅电路板模组200及第二辅电路板模组360分别位于对应第一主电路板模组140及第二主电路板模组320的中心位置,方便所述对接连接器230与所述插座210在旋转过程中进行接触式配合。因此,对接连接器370上的对接端子374排布方式如接地、信号、电源和检测等与弹簧顶针220相同,以便实现与插座210的对接配合,这里不再赘述。所述第二辅电路板模组360还包括一安装在连接面366上FFC连接器342以及安装在结合面364上的4个线对板连接器(Wire-To-Board Connector,WTB Connector)346,所述4个线对板连接器346位于第二辅电路板362的结合面362的上方区域以向上输送电源。因此与壁挂式套件100不同,其中壁挂式套件100的电源线240和光纤组件172都是从壁挂式套件100的底部向上延伸,而面板套件300中与LVDS连接器340相连接以进行信号传输的线缆500从面板套件300的底部向上延伸,而连接线对板连接器346的以进行电源信号传输的柔性扁平线缆510则从面板套件300的顶部向下延伸。
以上仅为本发明的较佳实施例而已,不应以此限制本发明的范围。即凡是依本发明权利要求书及本发明说明书内容所作的简单的等效变化与修饰,皆应仍属本发明专利涵盖的范围内。
Claims (9)
1.一种壁挂式套件,其特征在于:所述壁挂式套件包括第一通信模组,所述第一通信模组包括第一主电路板模组以及第一辅电路板模组,所述第一主电路板模组设有用以无线传输极高频信号的第一集成电路组件,所述第一辅电路板模组设有用以至少传输电源的插座,所述第一辅电路板模组设于所述第一主电路板模组的中心位置,所述第一主电路板模组包括第一主电路板,所述第一集成电路组件安装至所述第一主电路板上,所述第一辅电路板模组包括第一辅电路板,所述插座为弹簧顶针插座并安装至所述第一辅电路板上,所述第一主电路板设有前后相对的结合面和连接面,所述第一主电路板的中心位置设有贯穿所述结合面与连接面的开口,所述第一集成电路组件设于第一主电路板的结合面,所述第一辅电路板组装固定在第一主电路板的连接面上,所述插座设有收容在所述开口内的绝缘本体以及设于所述绝缘本体上并暴露在所述第一主电路板结合面的若干弹簧顶针。
2.如权利要求1所述的壁挂式套件,其特征在于:所述第一集成电路组件将所述第一主电路板的电信号转换成电磁信号。
3.如权利要求2所述的壁挂式套件,其特征在于:所述第一辅电路板设有前后相对的结合面与连接面,所述插座安装至第一辅电路板的结合面上;所述第一主电路板模组还包括安装在所述第一主电路板连接面并围绕在所述开口外的两对QSFP连接器,其中一对QSFP连接器呈水平设置,另外一对QSFP连接器相对倾斜设置并且相互之间形成一定夹角;所述第一辅电路板模组还包括若干安装至第一辅电路板的连接面上并围绕在所述弹簧顶针***的线对板连接器。
4.如权利要求3所述的壁挂式套件,其特征在于:所述第一主电路板模组还包括与所述QSFP连接器配合的光接收次组件;所述光接收次组件包括光纤连接器、与所述QSFP连接器对接配合的光电转换模块次组件以及连接所述光纤连接器与光电转换模块次组件的 光纤组件;所述光电转换模块次组件包括座体、固定在座体上的内电路板以及一对安装在所述内电路板上的光电转换模块,所述内电路板包括设有若干金手指以与QSFP连接器配合的对接部。
5.如权利要求2所述的壁挂式套件,其特征在于:所述弹簧顶针布置在围绕同一个中心点的若干大小不同的同心圆区域内,所述弹簧顶针包括分别位于不同的同心圆区域内的电源弹簧顶针、接地弹簧顶针以及检测弹簧顶针。
6.如权利要求1所述的壁挂式套件,其特征在于:所述壁挂式套件还包括支架以及固定在支架前后两侧的盖体及第一背板,所述支架的中心区域设有一前后贯穿的收容空间,所述第一通信模组夹持在所述支架与第一背板之间,并且所述第一通信模组的第一集成电路组件及插座收容在所述收容空间内;所述盖体的中心位置设有前后贯穿的开口,所述第一集成电路组件被所述盖体所遮蔽,所述插座收容在所述盖体的开口内。
7.一种无线通信互连***,其特征在于:包括如权利要求1-6中任一项所述的壁挂式套件以及与所述壁挂式套件配合的面板套件,所述面板套件包括与所述第一通信模组对接配合的第二通信模组,所述第二通信模组包括第二主电路板模组以及第二辅电路板模组,所述第二主电路板模组设有与所述第一集成电路组件进行非接触式配合的第二集成电路组件,所述第二辅电路板模组设有与所述插座进行接触式配合的对接连接器,所述第二辅电路板模组设于所述第二主电路板模组的中心位置。
8.如权利要求7所述的无线通信互连***,其特征在于:所述第二主电路板模组包括第二主电路板以及安装至第二主电路板的两对LVDS连接器,所述第二主电路板具有相对的结合面及连接面,所述第二集成电路组件安装至第二主电路板的结合面,所述两对LVDS连接器安装至第二主电路板的连接面,且其中一对LVDS连接器呈水平设置,另外一对LVDS连接器相对倾斜设置并且相互之间形成一定夹角。
9.如权利要求8所述的无线通信互连***,其特征在于:所述第二主电路板设有贯穿所述结合面及连接面的开口,所述第二辅电路板模组包括安装至第二主电路板连接面上的第二辅电路板,所述对接连接器安装至所述第二辅电路板模组并收容在第二主电路板的所述开口内。
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