CN110011061B - Bandpass frequency selective surface structure, shielding door and radome - Google Patents
Bandpass frequency selective surface structure, shielding door and radome Download PDFInfo
- Publication number
- CN110011061B CN110011061B CN201910342864.4A CN201910342864A CN110011061B CN 110011061 B CN110011061 B CN 110011061B CN 201910342864 A CN201910342864 A CN 201910342864A CN 110011061 B CN110011061 B CN 110011061B
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- printed circuit
- circuit board
- round hole
- frequency selective
- selective surface
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- 230000000737 periodic effect Effects 0.000 claims abstract description 34
- 239000007769 metal material Substances 0.000 claims abstract description 14
- 230000004044 response Effects 0.000 claims abstract description 11
- 230000005540 biological transmission Effects 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 239000011889 copper foil Substances 0.000 claims description 6
- 230000008878 coupling Effects 0.000 claims description 5
- 238000010168 coupling process Methods 0.000 claims description 5
- 238000005859 coupling reaction Methods 0.000 claims description 5
- 230000003993 interaction Effects 0.000 claims description 3
- 230000010287 polarization Effects 0.000 abstract description 4
- 238000003780 insertion Methods 0.000 abstract description 3
- 230000037431 insertion Effects 0.000 abstract description 3
- 238000012545 processing Methods 0.000 abstract description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006880 cross-coupling reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- E—FIXED CONSTRUCTIONS
- E06—DOORS, WINDOWS, SHUTTERS, OR ROLLER BLINDS IN GENERAL; LADDERS
- E06B—FIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES, FENCES OR LIKE ENCLOSURES IN GENERAL, e.g. DOORS, WINDOWS, BLINDS, GATES
- E06B5/00—Doors, windows, or like closures for special purposes; Border constructions therefor
- E06B5/10—Doors, windows, or like closures for special purposes; Border constructions therefor for protection against air-raid or other war-like action; for other protective purposes
- E06B5/18—Doors, windows, or like closures for special purposes; Border constructions therefor for protection against air-raid or other war-like action; for other protective purposes against harmful radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/42—Housings not intimately mechanically associated with radiating elements, e.g. radome
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
- H01Q15/0006—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
- H01Q15/0013—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices said selective devices working as frequency-selective reflecting surfaces, e.g. FSS, dichroic plates, surfaces being partly transmissive and reflective
- H01Q15/0026—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices said selective devices working as frequency-selective reflecting surfaces, e.g. FSS, dichroic plates, surfaces being partly transmissive and reflective said selective devices having a stacked geometry or having multiple layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/64—Heating using microwaves
- H05B6/6414—Aspects relating to the door of the microwave heating apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/64—Heating using microwaves
- H05B6/80—Apparatus for specific applications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2206/00—Aspects relating to heating by electric, magnetic, or electromagnetic fields covered by group H05B6/00
- H05B2206/04—Heating using microwaves
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Engineering & Computer Science (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Aerials With Secondary Devices (AREA)
Abstract
The invention discloses a band-pass frequency selective surface structure, a shielding door and an antenna housing, wherein the band-pass frequency selective surface structure is formed by tightly stacking a plurality of layers of printed circuit boards, the layers of printed circuit boards are respectively a top layer of printed circuit board, a middle layer of printed circuit board and a bottom layer of printed circuit board, the top layer of printed circuit board and the bottom layer of printed circuit board are both printed circuit boards, the middle layer of printed circuit board is a plurality of printed circuit boards, each printed circuit board is formed by splicing M and N identical periodic units, a first round hole is formed in the center of each periodic unit in the top layer of printed circuit board and the bottom layer of printed circuit board, and the side wall of each first round hole is plated with a metal material. The invention has the characteristics of double zero points in the aspect of frequency response, good frequency selectivity, small insertion loss and insensitivity to the polarization direction of electromagnetic waves, and has the characteristics of small quality, simple structure and easy processing in the aspect of physical structure.
Description
Technical Field
The invention relates to a frequency selective surface structure, in particular to a bandpass frequency selective surface structure, a shielding door and an antenna housing, belonging to the frequency selective surface technology.
Background
The frequency selective surface (Frequency Selective Surface, FSS for short) is a two-dimensional structure periodically arranged by resonant cells, the frequency response of which depends not only on the frequency of the incident electromagnetic wave but also on the angle of incidence and the polarization direction of the incident electromagnetic wave. There are two types of conventional frequency selective surfaces, one is a band-pass type frequency selective surface composed of an arrangement of slit units, and the other is a band-stop type frequency selective surface composed of an arrangement of metal patches. The frequency selective surface has special frequency response to the space electromagnetic wave, so that the frequency selective surface has important application value in the civil and military fields, and the design of the high-performance frequency selective surface has important effect on the technical development.
As investigated and understood, the technology now known is:
1) The learner d.m. pozar proposed in 1990 a method of coupling two patch resonators with coupling holes to design a bandpass frequency selective surface that can form a frequency response characteristic with two transmission poles.
2) Scholars Sarabandi and Behdad propose to design a bandpass frequency selective surface using non-resonant devices, each metal layer constituting the frequency selective surface will not resonate for an incident electromagnetic wave of a determined frequency band, but the combination of multiple metal layers can be equivalent to a corresponding series or parallel LC circuit under the combined action of the electromagnetic wave to resonate, thereby forming a frequency selective surface with bandpass characteristics.
3) Scholars Luo Guoqing propose to use dielectric integrated waveguide (Substrate integrated waveguide, simply SIW) structures to design bandpass frequency selective surfaces. By using cavity modes of the dielectric integrated waveguide, corresponding transmission poles are introduced, and by cross-coupling between cavities, transmission zeroes are introduced to improve passband characteristics.
4) The learner Shen Zhongxiang proposed a three-dimensional bandpass frequency selective surface consisting of a two-dimensional periodic shielded microstrip array. Such a three-dimensional frequency selective surface has the obvious disadvantage that the machining and assembly is somewhat more difficult than a conventional two-dimensional frequency selective surface to achieve better frequency response characteristics.
Disclosure of Invention
A first object of the present invention is to solve the above-mentioned drawbacks of the prior art, and to provide a band-pass frequency selective surface structure, which has the characteristics of double zero points in terms of frequency response, good frequency selectivity, small insertion loss, insensitivity to the polarization direction of electromagnetic waves, and low mass, simple structure, and easy processing in terms of physical structure.
A third object of the present invention is to provide a shielding door comprising the above band pass frequency selective surface structure.
A third object of the present invention is to provide a radome comprising the above band-pass frequency selective surface structure.
The first object of the present invention can be achieved by adopting the following technical scheme:
The band-pass frequency selective surface structure is formed by tightly stacking a plurality of layers of printed circuit boards, wherein the layers of printed circuit boards are respectively a top layer of printed circuit board, a middle layer of printed circuit board and a bottom layer of printed circuit board, the top layer of printed circuit board and the bottom layer of printed circuit board are both printed circuit boards, the middle layer of printed circuit board is formed by splicing a plurality of printed circuit boards, each printed circuit board is formed by splicing M x N identical periodic units, a first round hole is formed in the center of each periodic unit in the top layer of printed circuit board and the bottom layer of printed circuit board, and the side wall of each first round hole is plated with a metal material; wherein M is more than or equal to 12, and N is more than or equal to 12.
Further, the radius of the first round hole is 7 mm-8 mm.
Further, the center of each periodic unit in the middle-layer printed circuit board is provided with a second round hole, the side wall of the second round hole is plated with a metal material, and the radius of the second round hole is larger than that of the first round hole.
Further, the radius of the second round hole is 17 mm-18 mm.
Further, four corners of each periodic unit are provided with quarter round holes, the side walls of the quarter round holes are plated with metal materials, and the radii of the quarter round holes at the four corners of the M times N periodic units are the same.
Further, the radius of the quarter round hole at the four corners of each periodic unit is 6 mm-7 mm.
Further, the thickness of each printed wiring board is 1 mm-2 mm.
Further, the middle layer printed circuit board is three printed circuit boards.
The second object of the invention can be achieved by adopting the following technical scheme:
A shield door comprising the bandpass frequency selective surface structure described above.
The third object of the present invention can be achieved by adopting the following technical scheme:
A radome comprising a bandpass frequency selective surface structure as described above.
Compared with the prior art, the invention has the following beneficial effects:
1. The center of each periodic unit in the top-layer printed circuit board and the bottom-layer printed circuit board is provided with a round hole, the side wall of the round hole is plated with a metal material to respectively form two round resonant windows, and the band-pass frequency response characteristics of double transmission poles can be generated through the coupling of the round resonant windows.
2. The center of each periodic unit in the middle-layer printed circuit board is provided with a round hole, the side wall of the round hole is plated with a metal material, the radius of the round hole is larger than that of the round hole of each periodic unit in the top-layer printed circuit board and the bottom-layer printed circuit board, the round hole of the center of each periodic unit in the middle-layer printed circuit board, the copper foil on the upper surface of the uppermost printed circuit board of the middle-layer printed circuit board and the copper foil on the lower surface of the lowermost printed circuit board of the middle-layer printed circuit board form a metal cavity, and a non-resonant mode of TM110 is introduced through the metal cavity, so that a transmission zero point of a low stop band is introduced, and the transmission characteristic is improved.
3. The four corners of each periodic unit are provided with quarter round holes, when the four periodic units are spliced together, the four quarter round holes can form a whole circle, the whole circle of each layer of printed circuit board forms a plurality of round through holes, and the transmission zero points of a high stop band are introduced according to the principle of interaction with a high-order mode through the round through holes so as to improve the transmission characteristics.
Drawings
Fig. 1 is a schematic structural diagram of a bandpass frequency selective surface structure according to an embodiment of the invention.
Fig. 2 is a perspective view of a structure of each periodic unit stack of a multilayer printed wiring board in a bandpass frequency selective surface structure according to an embodiment of the invention.
Fig. 3 is a front-side block diagram of each periodic cell stack of a multilayer printed wiring board in a bandpass frequency selective surface structure according to an embodiment of the invention.
Fig. 4 is a side view of a schematic block diagram of each periodic cell stack of a multilayer printed wiring board in a bandpass frequency selective surface structure according to an embodiment of the invention.
Fig. 5 is an electromagnetic simulation plot of the frequency response of a bandpass frequency selective surface structure in accordance with an embodiment of the invention.
The device comprises a first printed circuit board, a second printed circuit board, a third printed circuit board, a fourth printed circuit board, a fifth printed circuit board, a first round hole, a round resonant window, a second round hole, a metal cavity, a quarter round hole and a round through hole, wherein the first printed circuit board, the second printed circuit board, the third printed circuit board, the fourth printed circuit board, the fifth printed circuit board, the first round hole, the round resonant window, the second round hole, the metal cavity, the quarter round hole and the round through hole are all arranged in sequence, and the round through hole is arranged in sequence.
Detailed Description
The present invention will be described in further detail with reference to examples and drawings, but embodiments of the present invention are not limited thereto.
Examples:
As shown in fig. 1 to 4, the present embodiment provides a band-pass frequency selective surface structure, which is formed by tightly stacking five printed circuit boards (Printed Circuit Board, abbreviated as PCBs), wherein the five printed circuit boards are printed circuit boards with copper coated on the upper and lower surfaces, and the five printed circuit boards are respectively a first printed circuit board 1, a second printed circuit board 2, a third printed circuit board 3, a fourth printed circuit board 4 and a fifth printed circuit board 5, wherein the first printed circuit board 1 forms a top layer printed circuit board, the second printed circuit board 2, the third printed circuit board 3 and the fourth printed circuit board 4 form an intermediate layer printed circuit board, the fifth printed circuit board 5 forms a bottom layer printed circuit board, each printed circuit board is 1.6mm, and the printed circuit boards are formed by splicing m×n identical periodic units; wherein M.gtoreq.12, N.gtoreq.12, the number of periodic units of 4*4 is shown in FIG. 1 of this example due to the greater number of periodic units.
Further, the center of each periodic unit in the top layer printed wiring board (first printed wiring board 1) and the bottom layer printed wiring board (fifth printed wiring board 5) has a first circular hole 6, the side wall of the first circular hole 6 is plated with a metal material, the radius thereof is 7.4mm, the first circular hole 6 of the top layer printed wiring board and the first circular hole 6 of the bottom layer printed wiring board respectively constitute two circular resonance windows 7, and since the thickness of each printed wiring board is 1.6mm, the thickness of the two circular resonance windows 7 is also 1.6mm, and the bandpass frequency response characteristics of the double transmission poles can be generated by the coupling of the circular resonance windows 7.
Further, the center of each periodic unit in the middle layer printed circuit board (the second printed circuit board 2, the third printed circuit board 3 and the fourth printed circuit board 4) is provided with a second round hole 8, the side wall of the second round hole 8 is plated with a metal material, the radius of the metal material is 17.4mm, the second round hole 8 in the center of each periodic unit in the middle layer printed circuit board, the copper foil on the upper surface of the second printed circuit board 2 and the copper foil on the lower surface of the fourth printed circuit board 4 form a metal cavity 9, and a non-resonance mode of the TM110 is introduced through the metal cavity 9, so that a transmission zero point with low stop band is introduced, and the transmission characteristic is improved.
Further, four corners of each periodic unit in the top layer printed wiring board (first printed wiring board 1), the middle layer printed wiring board (second printed wiring board 2, third printed wiring board 3 and fourth printed wiring board 4) and the bottom layer printed wiring board (fifth printed wiring board 5) are provided with quarter round holes 10, the side walls of the quarter round holes 10 are plated with metal materials with a radius of 6.5mm, when the four periodic units are spliced together, the four quarter round holes 10 form a whole circle, the whole circle of the five printed wiring boards form a plurality of circular through holes 11, and as the thickness of each printed wiring board is 1.6mm, the thickness of the circular through holes 11 is 8mm, and through the circular through holes 11, a transmission zero point of a high stop band is introduced according to the principle of interaction with a high order mode so as to improve the transmission characteristic.
The metal material plated on the side walls of the first round hole 6, the second round hole 8 and the quarter round hole 10 in this embodiment may be any one of aluminum, iron, tin, copper, silver, gold and platinum, or may be an alloy of any one of aluminum, iron, tin, copper, silver, gold and platinum, and a copper material is preferably used.
The electromagnetic simulation curve of the S parameter performance of the band-pass frequency selective surface structure of this embodiment is shown in fig. 5, where S11 is the return loss of the input port, and S21 is the forward transmission coefficient from the input port to the output port, and it can be seen from the figure that the band-pass frequency selective surface structure has two resonance points, forming a transmission passband of 9.42GHz-9.57GHz, and allowing electromagnetic waves with frequencies in this band to pass through the selective surface, while electromagnetic waves with frequencies outside this band cannot pass through the selective surface, and at the same time, transmission zeros on both sides of the band can effectively improve the roll-off characteristics outside the band, and improve the frequency selective characteristics.
The band-pass frequency selective surface structure of the embodiment can be used in the civil field, is particularly applied to a shielding door, and can be covered by a door body, the shielding door can be an electromagnetic shielding door which can be integrated into a building, and the shielding door can also be a microwave oven shielding door, so that microwave outside radiation in the oven is inhibited, and the safety of a user is ensured.
The band-pass frequency selective surface structure can be used in the military field, is particularly applied to an antenna housing, and can be covered by a skin layer, and the antenna housing can be a target radar antenna housing, so that the radar scattering cross section of a target is effectively reduced, and the electromagnetic stealth effect is realized.
In conclusion, the invention has the characteristics of double zero points in the aspect of frequency response, good frequency selectivity, small insertion loss and insensitivity to the polarization direction of electromagnetic waves, and has the characteristics of small mass, simple structure and easy processing in the aspect of physical structure.
The above-mentioned embodiments are only preferred embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can make equivalent substitutions or modifications according to the technical solution and the inventive concept of the present invention within the scope of the present invention disclosed in the present invention patent, and all those skilled in the art belong to the protection scope of the present invention.
Claims (8)
1. A bandpass frequency selective surface structure characterized by: the printed circuit board is formed by closely stacking a plurality of layers of printed circuit boards, wherein the plurality of layers of printed circuit boards are respectively a top layer of printed circuit board, a middle layer of printed circuit board and a bottom layer of printed circuit board, the top layer of printed circuit board and the bottom layer of printed circuit board are both printed circuit boards, the middle layer of printed circuit board is a plurality of printed circuit boards, and each printed circuit board is formed by splicing M x N identical periodic units; wherein M is more than or equal to 12, and N is more than or equal to 12;
The center of each periodic unit in the top-layer printed circuit board and the bottom-layer printed circuit board is provided with a first round hole, the side wall of the first round hole is plated with a metal material, the first round hole of the top-layer printed circuit board and the first round hole of the bottom-layer printed circuit board respectively form two round resonance windows, and the band-pass frequency response characteristics of double transmission poles can be generated through the coupling of the round resonance windows;
the center of each periodic unit in the middle-layer printed circuit board is provided with a second round hole, the radius of the second round hole is larger than that of the first round hole, the side wall of the second round hole is plated with a metal material, the second round hole in the center of each periodic unit in the middle-layer printed circuit board, a copper foil on the upper surface of the second printed circuit board and a copper foil on the lower surface of the fourth printed circuit board form a metal cavity together, and a non-resonant mode of TM110 is introduced through the metal cavity, so that a transmission zero point of a low stop band is introduced, and the transmission characteristic is improved;
The four corners of each periodic unit in the top layer printed circuit board, the middle layer printed circuit board and the bottom layer printed circuit board are provided with quarter round holes, the side walls of the quarter round holes are plated with metal materials, the radiuses of the quarter round holes at the four corners of the M times N periodic units are the same, when the four periodic units are spliced together, the four quarter round holes form a whole circle to form a plurality of circular through holes, the radiuses of the circular through holes are smaller than the radiuses of the first round holes, and the transmission zero points of a high stop band are introduced through the circular through holes according to the interaction principle with a high-order mode so as to improve the transmission characteristics.
2. The bandpass frequency selective surface structure according to claim 1, characterized by: the radius of the first round hole is 7 mm-8 mm.
3. The bandpass frequency selective surface structure according to claim 1, characterized by: the radius of the second round hole is 17-18 mm.
4. The bandpass frequency selective surface structure according to claim 1, characterized by: the radius of a quarter round hole at four corners of each periodic unit is 6 mm-7 mm.
5. The bandpass frequency selective surface structure according to any one of claims 1-4, characterized by: the thickness of each printed circuit board is 1 mm-2 mm.
6. The bandpass frequency selective surface structure according to any one of claims 1-4, characterized by: the middle layer printed circuit board is three printed circuit boards.
7. A shielded door, characterized by: comprising a bandpass frequency selective surface structure according to any one of claims 1-6.
8. A radome, characterized in that: comprising a bandpass frequency selective surface structure according to any one of claims 1-6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910342864.4A CN110011061B (en) | 2019-04-26 | 2019-04-26 | Bandpass frequency selective surface structure, shielding door and radome |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910342864.4A CN110011061B (en) | 2019-04-26 | 2019-04-26 | Bandpass frequency selective surface structure, shielding door and radome |
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| CN110011061A CN110011061A (en) | 2019-07-12 |
| CN110011061B true CN110011061B (en) | 2024-04-26 |
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN209641841U (en) * | 2019-04-26 | 2019-11-15 | 华南理工大学 | Band logical frequency-selective surfaces structure, shield door and antenna house |
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| US10424847B2 (en) * | 2017-09-08 | 2019-09-24 | Raytheon Company | Wideband dual-polarized current loop antenna element |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN209641841U (en) * | 2019-04-26 | 2019-11-15 | 华南理工大学 | Band logical frequency-selective surfaces structure, shield door and antenna house |
Non-Patent Citations (1)
| Title |
|---|
| "Double-Layer Frequency Selective Surface for Terahertz Bandpass Filter";Xiong Ri-Hui等;《Journal of Infrared, Millimeter, and Terahertz Waves》;第1039-1045页 * |
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