CN110006639A - A method of heat test is carried out using heater substitution thermal simulation part - Google Patents
A method of heat test is carried out using heater substitution thermal simulation part Download PDFInfo
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- CN110006639A CN110006639A CN201910252957.8A CN201910252957A CN110006639A CN 110006639 A CN110006639 A CN 110006639A CN 201910252957 A CN201910252957 A CN 201910252957A CN 110006639 A CN110006639 A CN 110006639A
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- heater
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M13/00—Testing of machine parts
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
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- Testing Resistance To Weather, Investigating Materials By Mechanical Methods (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
Abstract
The present invention relates to a kind of methods that using heater substitution there is the thermal simulation part of device housings to carry out heat balance test.In spacecraft first sample or thermal control star heat balance test, same to instrument size, simulating piece identical in quality are usually designed, heater is pasted inside it and simulates heat consumption.The heat consumption, thermal capacitance and external radiation characteristic of analog machine by this method.The new method of one kind is employed herein and directly simulates heat-producing device using heater under the premise of guarantee test validity.Design is combined with the sizable heater of equipment mounting surface or heater, so that its heating power is equal to equipment heat consumption and is met and change.Heat balance test can normally be carried out in the case where metal simulating piece need not be processed.
Description
Technical field
The present invention relates to a kind of methods of heat test, belong to spacecraft thermal test technical field.
Background technique
Heat balance test is one of large-scale experiment important in entire spacecraft development process, and there are two main purposes:
First is that temperature of the verifying thermal design under each limit high/low temperature operating condition meets the requirements situation;Second is that verifying CALCULATION OF THERMAL is correct
Property, necessary data are provided for thermal model amendment.In spacecraft first sample heat balance test or local cludy thermal balance
It is general to be simulated very in such a way that heater is pasted in mechanical simulation part inside for the equipment that there is no identification part in test
Surface state, mounting means, thermal capacitance and the heat condition of real equipment.
Mechanical simulation part is generally used for first sample mechanical test, the distribution of weight and mounting means of analog machine.Mechanical simulation
Part is generally manufactured using the aluminium alloy with device housings same material, and shape is consistent with equipment original shape.Inside milling sky, which reserves, to be added
The installation space of hot device, while its distribution of weight being made to match with original equipment.Mechanical simulation part is proposed according to thermal control/equipment side
It is required that being surface-treated, pitch-dark or black anodizing is generally sprayed.Need to redesign simultaneously the spacecraft deck board of development/
Mounting plate component, to match the power-thermal simulation part installation requirement newly gone into operation.
For the lead time, all power-thermal simulation part will be according to matched design, machining, surface treatment, heating
The step of device design production, heater installation and equipment are installed is implemented, mounting plate similarly needs to be designed accordingly,
The processes such as the manufacturing, surface treatment.It is takeed a long time on development progress, research fund is also required to more investment.
Certain platform new model spacecrafts borrow the previous used service module of platform model when carrying out first sample development
Cabin participates in whole star heat balance test.Since the device layout of old cabin and the device layout of current versions are different, in deck board
Pre-buried installation hole location cannot use, and analog machine cannot be installed.All devices in the old deck board equal nothing in heat balance test
Method install simulating piece, directly adopt film type electrical heater be pasted onto its correspond to equipment installed position simulate the equipment heat
Consumption.Heater is affixed directly in deck board using silicon rubber, and heater nearby pastes temperature transducer.
Summary of the invention
The object of the present invention is to provide a kind of methods for carrying out heat test using heater substitution thermal simulation part, adopt
It is mounted on cabin surface with simple heater, substitution mechanical simulation part+heater composition power-thermal simulation part is utilizing
Thermal design verifying is efficiently accomplished under conditions of original cabin.
The technical scheme adopted by the invention is that: a method of heat test being carried out using heater substitution thermal simulation part,
Include the following steps:
(1) deck board of satellite is surface-treated, is painted in cabin inside cabin plate surface, in cabin inside cabin plate surface painted areas
Equipment mounting surface is reserved according to equipment installation dimension and position;
(2) according to equipment heat consumption and power supply unit, target heater resistance value and size are set;
(3) heater is pasted at the equipment mounting surface reserved in step (1), is connected into back heater using conducting wire
Road, loop resistance value meet the target heater resistance value set in step (2);One temperature measuring point is set on the outside of each heater,
And the temperature measuring point is located in equipment mounting surface;
(4) it carries out heat balance test and the electric current of heater is adjusted according to the heat consumption under equipment different working modes, make to add
The heat that hot device generates is equal to equipment and corresponds to the heat consumption under operating mode;
(5) using the temperature measuring point being arranged in step (3), the temperature of each equipment each temperature measuring point under different working modes is measured
Spend the curve changed over time;
(6) model parameter in satellite thermal model is modified, so that the temperature results and step of the output of satellite analysis model
Suddenly the absolute difference of the test temperature in (5)≤threshold value a completes the amendment of satellite thermal model.
In the step 1), the paint of cabin inside cabin plate surface spray is that SR107 white paint or E51-M are pitch-dark.
In the step (1), if heat test Satellite uses existing deck board skeleton, and carried out at surface
Reason then carries out pad pasting processing to the equipment mounting surface not used now, it is desirable that the surface infrared emittance ε of institute's pad pastingH≥0.85。
In the step (2), target heater resistance value R=equipment heat consumption P/ electric current I2, guarantee electricity when analog machine heat consumption
Flow the rated capacity that I and voltage U is less than power supply unit.
In the step (2), the size of heater meets following require: there are temperature measuring point installation positions after mounting for heater
It sets, heater size >=10mm of four sides to equipment mounting surface edge after mounting.
In the step (6), model parameter includes equipment thermal contact resistance, the equivalent emissivity of multilayer module and Orbital heat flux
Value.
A=5 DEG C.
The advantages of the present invention over the prior art are that:
(1) present invention carries out heat balance test by saving power-thermal simulation part, can quickly assess thermal design scheme
Feasibility reasonability obtains approximate with installation simulating piece as a result, test error control in allowed limits, is formed effective
Test result.
(2) present invention saves the influence of power-thermal simulation part by the heat analysis emulation after test, confirmation, will be to thermal balance
The high request of test simulation is converted into a heat analysis simulation modification.It is flat using the available effective heat of method of the invention
Weigh test data, and carries out analysis model amendment using these data, achievees the purpose that heat balance test.
Detailed description of the invention
Fig. 1 is the techniqueflow chart that heat balance test is carried out according to the method for the present invention;
Fig. 2 is simulation heating device scheme of installation;
Fig. 3 is the heat analysis correction model using method of the invention.
Specific embodiment
In conjunction with attached drawing, invention is further explained.
As shown in Figure 1, the present invention proposes a kind of method for carrying out heat test using heater substitution thermal simulation part, including such as
Lower step:
1) deck board of satellite is surface-treated, in cabin, inside cabin plate surface spraying SR107 white paint or E51-M are pitch-dark,
Cabin inside cabin plate surface painted areas reserves equipment mounting surface according to equipment installation dimension and position;If heat test Satellite makes
With existing deck board skeleton, and surface treatment was carried out, then the equipment mounting surface not used now had been carried out at pad pasting
Reason, it is desirable that the surface infrared emittance ε of institute's pad pastingH≥0.85。
Radiating surface according to design point install coating or substitution coating, other thermal control states according to trystate normally into
Row.
2) equipment mating according to the spacecraft testing, that selection replaces test with heater, is typically chosen inheritance and compares
Good equipment, the lesser equipment of heat consumption and heat consumption changes small equipment.It is larger right newly to grind equipment, test middle or short term work and heat consumption
The relatively high equipment of the equipment and temperature control requirement of thermal capacitance sensitivity is general it is not recommended that directly being replaced with heater.
According to equipment heat consumption and power supply unit, target heater resistance value and installation dimension, heater resistance value R=equipment are set
Heat consumption P/ electric current I2, need to guarantee that electric current I and voltage U is less than the rated capacity of power supply unit when analog machine heat consumption.Heater
For size after mounting there are temperature measuring point installation site, the size of heater requires installation four sides of post-heater to equipment mounting surface
Size >=the 10mm at edge.
3) heater is pasted at the equipment mounting surface as shown in Figure 2 and Figure 3, reserved in step 1, will be heated using conducting wire
Device connects into circuit, and loop resistance value meets the target resistance value of the setting in step 2.One thermometric is set on the outside of each heater
Point, and the temperature measuring point is located in equipment mounting surface.
4) it carries out heat balance test and the electric current of heater is adjusted according to the heat consumption under equipment different working modes, make its production
Raw heat is equal to equipment and corresponds to the heat consumption under operating mode.
According to heat test arrangement and equipment operating mode before test, by the list by number of the heating circuit of alternate device, column
Its operating current in the various modes, short-term job will be listed working time and curent change out.
According to spacecraft operating mode, the electric current calculated, analog machine febrile state are loaded according to heat test operating condition.Prison
Survey the temperature measuring point temperature variations being arranged in equipment mounting surface.
5) using the temperature measuring point being arranged in step 3, each equipment is measured under different working modes, the temperature of each temperature measuring point
The curve changed over time.
6) according to the equipment state of test, adaptation is carried out according to heat test state to model.By equipment heat consumption generation
Enter thermal model, according to the thermometric point data recorded in heat test, thermal model is modified.
Modify the parameter in satellite thermal model, including the equivalent emissivity of equipment thermal contact resistance, multilayer module and outer
Heat flow value, so that the temperature results of satellite analysis model output and the absolute difference of the test temperature in step 5 are less than or equal to 5
DEG C, complete the amendment of satellite thermal model.Revised model again restores equipment to virtual condition, after being tested
Heat analysis.
The unspecified book of the present invention partly belongs to technology well known to those skilled in the art.
Claims (7)
1. a kind of method for carrying out heat test using heater substitution thermal simulation part, which comprises the steps of:
(1) deck board of satellite is surface-treated, cabin inside cabin plate surface paint, cabin inside cabin plate surface painted areas according to
Equipment installation dimension and position reserve equipment mounting surface;
(2) according to equipment heat consumption and power supply unit, target heater resistance value and size are set;
(3) heater is pasted at the equipment mounting surface reserved in step (1), heater is connected into circuit using conducting wire, returned
Roadlock value meets the target heater resistance value set in step (2);One temperature measuring point, and the survey are set on the outside of each heater
Warm spot is located in equipment mounting surface;
(4) heat balance test is carried out to adjust the electric current of heater according to the heat consumption under equipment different working modes, make heater
The heat of generation is equal to equipment and corresponds to the heat consumption under operating mode;
(5) using the temperature measuring point being arranged in step (3), measure the temperature of each equipment each temperature measuring point under different working modes with
The curve of time change;
(6) model parameter in satellite thermal model is modified, so that the temperature results of satellite analysis model output and step (5)
In test temperature absolute difference≤threshold value a, complete satellite thermal model amendment.
2. a kind of method for carrying out heat test using heater substitution thermal simulation part according to claim 1, feature exist
In: in the step 1), the paint of cabin inside cabin plate surface spray is that SR107 white paint or E51-M are pitch-dark.
3. a kind of method for carrying out heat test using heater substitution thermal simulation part according to claim 1 or 2, feature
It is: in the step (1), if heat test Satellite uses existing deck board skeleton, and had carried out surface treatment,
Pad pasting processing then is carried out to the equipment mounting surface not used now, it is desirable that the surface infrared emittance ε of institute's pad pastingH≥0.85。
4. a kind of method for carrying out heat test using heater substitution thermal simulation part according to claim 3, feature exist
In: in the step (2), target heater resistance value R=equipment heat consumption P/ electric current I2, guarantee analog machine heat consumption when electric current I and
Voltage U is less than the rated capacity of power supply unit.
5. a kind of method for carrying out heat test using heater substitution thermal simulation part according to claim 4, feature exist
In: in the step (2), the size of heater meets following require: heater there are temperature measuring point installation site, adds after mounting
Hot device size >=10mm of four sides to equipment mounting surface edge after mounting.
6. a kind of method for carrying out heat test using heater substitution thermal simulation part according to claim 1, feature exist
In: in the step (6), model parameter includes equipment thermal contact resistance, the equivalent emissivity of multilayer module and Orbital heat flux value.
7. a kind of method for carrying out heat test using heater substitution thermal simulation part according to claim 6, feature exist
In: a=5 DEG C.
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Cited By (4)
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CN111077855A (en) * | 2019-11-26 | 2020-04-28 | 上海空间电源研究所 | Be applied to spacecraft unit heat balance control system |
CN111220651A (en) * | 2020-03-26 | 2020-06-02 | 贵州梅岭电源有限公司 | Thermal battery working state thermal simulation equipment |
CN111661369A (en) * | 2020-06-16 | 2020-09-15 | 北京卫星环境工程研究所 | Layout method of thin film heater for spacecraft thermal test |
CN114386281A (en) * | 2022-01-13 | 2022-04-22 | 北京卫星环境工程研究所 | Automatic design method for test heating loop based on clustering |
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CN111077855A (en) * | 2019-11-26 | 2020-04-28 | 上海空间电源研究所 | Be applied to spacecraft unit heat balance control system |
CN111220651A (en) * | 2020-03-26 | 2020-06-02 | 贵州梅岭电源有限公司 | Thermal battery working state thermal simulation equipment |
CN111661369A (en) * | 2020-06-16 | 2020-09-15 | 北京卫星环境工程研究所 | Layout method of thin film heater for spacecraft thermal test |
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CN114386281A (en) * | 2022-01-13 | 2022-04-22 | 北京卫星环境工程研究所 | Automatic design method for test heating loop based on clustering |
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