CN110001168A - A kind of antistatic carrier band and its manufacturing method - Google Patents
A kind of antistatic carrier band and its manufacturing method Download PDFInfo
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- CN110001168A CN110001168A CN201910292400.7A CN201910292400A CN110001168A CN 110001168 A CN110001168 A CN 110001168A CN 201910292400 A CN201910292400 A CN 201910292400A CN 110001168 A CN110001168 A CN 110001168A
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- carrier band
- antistatic
- feed back
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/302—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
- B32B27/365—Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/04—Homopolymers or copolymers of styrene
- C08L25/06—Polystyrene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/21—Anti-static
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/558—Impact strength, toughness
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/04—Antistatic
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Extrusion Moulding Of Plastics Or The Like (AREA)
Abstract
The present invention provides a kind of antistatic carrier band and its manufacturing methods, antistatic carrier band includes upper epidermis, middle layer and layer, the upper epidermis and layer respectively account for the 10~20% of gross mass, the middle layer accounts for the 60~80% of gross mass, the upper epidermis and layer are antistatic base-material, and the middle layer is the modification feed back of upper epidermis and layer antistatic base-material；The manufacturing method of antistatic carrier band includes: S1: raw material pre-treatment；S2: extruding sheet fused materials；S3: carrier band semi-finished product molding；S4: edge grinding is cut；S5: carrier band molding；S6: rear detection；S7: winding；Carrier band middle layer of the invention reduces the production cost of carrier band using modified feed back, without adding plasticizer, and makes carrier band environmental protection reliable, and the manufacturing method of the present invention improves the production efficiency of carrier band, it is ensured that the quality of carrier band.
Description
Technical field
The present invention relates to antistatic carrier band technical field more particularly to a kind of antistatic carrier band and its manufacturing methods.
Background technique
Carrier band is mainly used in carrying electronic component, has specific thickness, and determines thereon with specific dimensions
Position hole, electronic component are located at positioning hole, can carry out positioning protection to electronic component.With the continuous hair of electronic technology
Exhibition, for electronic component towards high-precision and miniaturization transformation, this requires carry precision with higher and preferably comprehensive
Can, the electronic component damage in carrier band is prevented, in this regard, the raw material and manufacturing process of carrier band are particularly important.Such as specially
It is polystyrene/poly- 3,4- that sharp " CN108329500A ", which discloses a kind of antistatic plastic carrier band and its production technology, inner layer,
Ethylenedioxy thiophene composite conducting material, antistatic surface layer are epoxy resin anti-static coatings, epoxy resin antistatic material
Including film forming agent and curing agent, have the characteristics that not environmentally with it is at high cost, the antistatic plastic carrier band production technology include with
Lower step: plastic pellet removal moisture drying continuously extrudes plate, high-speed vacuum plastics sucking moulding, consecutive tracking punching, surface anti-static
Processing, more plates position cutting, multi-layer compound winding, quality final inspection and joint sealing storage, and wherein surface anti-static processing is by punching
Carrier band blank surface afterwards is coated with epoxy resin anti-static coatings, there are anti-static coatings and carrier band adhesive force it is not strong,
It is easy to fall off, so that carrier band does not have anti-static effect, in addition, its quality final inspection is to carry out sample cutting inspection to every a roll of carrier band, only
The mode for taking sampling observation tests to carrier band, cannot ensure the quality of carrier band, and low efficiency.Patent
" CN104029405B " discloses a kind of manufacturing method of plastic carrier, the upper epidermis and layer of plastic carrier include PC, PS,
One of ABS, PC/ABS or a variety of, and add conductive agent and fire retardant, middle layer include PE, PP, PET and plasticizer,
Upper layer accounts for the 70~80% of gross mass, and middle layer accounts for the 20~30% of gross mass, high production cost and not environmentally, manufacture
Method mainly comprises the steps that sheet material manufacture, sheet material cutting and pocket form, punching one by one after sheet material is cut,
Production efficiency is low, and cannot be guaranteed the quality of carrier band.
In conclusion the carrier band of the prior art there are high production cost, not environmentally the shortcomings that, carrier band manufacturing method exists easy
So that carrier band do not have anti-static effect, production efficiency it is low and cannot be guaranteed carrier band quality the shortcomings that.
Summary of the invention
To overcome following problems existing in the prior art: the carrier band high production cost of the prior art, not environmentally, carrier band system
Make method exist it is easier that carrier band do not have anti-static effect, production efficiency it is low and cannot be guaranteed carrier band quality the shortcomings that.This hair
It is bright to provide a kind of antistatic carrier band, it is characterised in that: including upper epidermis, middle layer and layer, the upper epidermis and following table
Layer respectively accounts for the 10~20% of gross mass, and it is quiet to prevent that the middle layer accounts for the 60~80% of gross mass, the upper epidermis and layer
Electric base-material, the middle layer are modified feed back, the modified feed back include 30% antistatic base-material, 60~65% feed back and
5~10% ABS.
On this basis, the antistatic base-material is one or both of antistatic PS or antistatic PC.
On this basis, the feed back is the feed back of the antistatic base-material of upper epidermis and layer.
A kind of manufacturing method of antistatic carrier band, it is characterised in that: comprise the steps of:
S1: raw material pre-treatment weighs each raw material of modified feed back in proportion, and each raw material of modified feed back are passed through
High mixer is uniformly mixed, and modified feed back and antistatic base-material are put into baking oven drying；
S2: the antistatic base-material after drying in S1 step is added in the hopper of coextruder extruding sheet fused materials,
Each raw material of modified feed back is added in the hopper of main extruder, the apparatus for baking of hopper is opened, sets extruder temperature of each section,
After extruder temperature of each section reaches setting value, extruder is opened, antistatic base-material and modified feed back pass through screw rod melting respectively
It is transported to after plasticizing in same mold, and is squeezed out through same die head, form sheet-shaped molten material；
S3: carrier band semi-finished product form, and the sheet-shaped molten material after squeezing out in S2 step is cast to shaping mould, form carrier band half
Finished product, by adjusting shaping mould to die head distance or adjustment screw revolving speed with adjust carrier band semi-finished product thickness, complete carrier band
Semi-finished product molding；
S4: cutting edge grinding, and the carrier band semi-finished product after forming in S3 step are passed through shaving die, the edge grinding cut out is recycled
And it crushes stand-by；
S5: carrier band molding: the carrier band semi-finished product after edge grinding will be cut in S4 step, and by hole punched device punching to form carrier band fixed
Position hole, cuts to form carrier band finished product using cutting device；
S6: rear detection: by the carrier band after the cutting in S5 step, tooling detects thickness and width after testing, will test work
Carrier band after dress detection detects the positions and dimensions of carrier band location hole by inclined aperture apparatus；
S7: the carrier band after detection is qualified in S6 step winding: is subjected to winding packaging.
On this basis, enter mold in the S2 step after screw rod fusion plastification of the antistatic base-material by coextruder
The upper epidermis and layer of carrier band are formed, modified feed back enters mold after the screw rod fusion plastification of main extruder and forms carrier band
Middle layer.
On this basis, the temperature of each section of extruder is 190~270 DEG C in the S2 step.
On this basis, in the S2 step open extruder before 3~5 minutes unlatching die heaters.
On this basis, the temperature of the die heater is set as 60~80 DEG C.
On this basis, shaping mould reaches set temperature in the S3 step, opens shaping mould switch, and shaping mould is clockwise
Rotation opens vacuum pump by shaping mould close to die head, opens high pressure valve.
On this basis, the drying temperature of antistatic base-material is 70~130 DEG C in the S1 step.
Compared with prior art, the beneficial effects of the present invention are:
1, carrier band upper epidermis of the invention and layer use antistatic base-material, it is ensured that the antistatic performance of carrier band, it will
The raw material of upper epidermis and the feed back of layer after modified as middle layer, so that middle layer and upper epidermis, layer have
There is preferable compatibility, without adding any plasticizer, and middle layer quality accounts for the overwhelming majority of carrier band gross mass, reduces
The production cost of carrier band, and make carrier band environmental protection reliable.
2, a small amount of ABS is added in middle layer raw material of the invention, ABS has preferable toughness and moulding processability,
So that middle layer has preferable toughness, and improve the moulding processability of middle layer so that middle layer and upper epidermis, under
Surface layer good fit, improves sealing effect.
3, the sheet that carrier band manufacturing method of the invention goes out upper epidermis, middle layer and layer superposition using coextrusion mold is molten
Melt material, sheet-shaped molten material is cast to molding mold forming and obtains carrier band semi-finished product, the edge grinding of excision carrier band semi-finished product will be cut
Except the carrier band semi-finished product of edge grinding are carried after hole punched device punching, cutting device cutting, manufacturing method is simple, imitates
Rate is high, rejection rate is low, and can collect edge grinding by crushing recycling and reusing, reduces production cost.
4, carrier band manufacturing method of the invention detects after further including, after testing by all carrier band semi-finished product after cutting
The width and thickness of tooling detection carrier band, the positions and dimensions of carrier band location hole are detected using inclined aperture apparatus, are carried to every
It is detected with each carrier band location hole, it is ensured that the quality of carrier band.
5, carrier band manufacturing method of the invention goes out the fused materials of sheet, the fused materials curtain coating of sheet by coextrusion mold
To shaping mould, can be carried by adjusting the screw speed of the distance between shaping mould and extrusion die or adjustment extruder to adjust
The thickness of band, method of adjustment is simple, and the carrier band for being suitable for plurality of specifications manufactures.
6, apparatus for baking is set in the hopper of extruder of the invention, effectively can prevents raw material from making moist, ensure that load
The mechanical property and dimensional stability of band.
Specific embodiment
With reference to embodiments, the present invention will be described in further detail.It should be appreciated that specific reality described herein
Example is applied only to explain the present invention, is not intended to limit the present invention.
Embodiment 1:
A kind of antistatic carrier band that the embodiment of the present invention 1 provides, including upper epidermis, middle layer and layer, upper epidermis and
Layer respectively accounts for the 15% of gross mass, and middle layer accounts for the 70% of gross mass, and upper epidermis and layer are antistatic PS, and middle layer is
Modified feed back, modified feed back include feed back of antistatic PS and 5% of the antistatic PS of middle layer quality 30%, 65%
ABS。
Embodiment 2:
A kind of antistatic carrier band that the embodiment of the present invention 2 provides, including upper epidermis, middle layer and layer, upper epidermis and
Layer respectively accounts for the 15% of gross mass, and middle layer accounts for the 70% of gross mass, and upper epidermis and layer are antistatic PS, and middle layer is
Modified feed back, modified feed back include No. bis- feed backs of antistatic PS and 10% of the antistatic PS of middle layer quality 30%, 60%
ABS。
Embodiment 3:
A kind of antistatic carrier band that the embodiment of the present invention 3 provides, including upper epidermis, middle layer and layer, upper epidermis and
Layer respectively accounts for the 15% of gross mass, and middle layer accounts for the 70% of gross mass, and upper epidermis and layer are antistatic PC, and middle layer is
Modified feed back, modified feed back include feed back of antistatic PC and 5% of the antistatic PC of middle layer quality 30%, 65%
ABS。
Embodiment 4:
A kind of antistatic carrier band that the embodiment of the present invention 4 provides, including upper epidermis, middle layer and layer, upper epidermis and
Layer respectively accounts for the 15% of gross mass, and middle layer accounts for the 70% of gross mass, and upper epidermis and layer are antistatic PC, and middle layer is
Modified feed back, modified feed back include No. bis- feed backs of antistatic PC and 10% of the antistatic PC of middle layer quality 30%, 65%
ABS。
Carrier band upper epidermis of the invention and layer use antistatic base-material, it is ensured that the antistatic performance of carrier band, it will be upper
Raw material of the feed back of surface layer and layer after modified as middle layer, so that middle layer has with upper epidermis, layer
Preferable compatibility, without adding any plasticizer, middle layer quality accounts for the overwhelming majority of carrier band gross mass, reduces carrier band
Production cost, and make carrier band environmental protection reliable；Be added a small amount of ABS in middle layer raw material, ABS have preferable toughness and at
Type processing performance so that middle layer has preferable toughness, and improves the moulding processability of middle layer, so that middle layer
With upper epidermis, layer good fit, sealing effect is improved.
Embodiment 5:
A kind of manufacturing method of antistatic carrier band of above-described embodiment 1 that the embodiment of the present invention 5 provides, including following step
It is rapid:
S1: raw material pre-treatment weighs feed back of antistatic PS, antistatic PS and ABS of modified feed back in proportion, and
It is uniformly mixed by high mixer, antistatic PS and modified feed back is put into baking oven drying, drying temperature is 85 DEG C, and drying time is
2 hours；
S2: the antistatic PS after drying in S1 step is added in the hopper of coextruder extruding sheet fused materials, will
Each raw material of modified feed back is added in the hopper of main extruder, opens the apparatus for baking of hopper, sets each section of temperature of main extruder
Degree is 200 DEG C, and 205 DEG C, 205 DEG C, 205 DEG C, 205 DEG C, 205 DEG C, 200 DEG C, the temperature of each section of coextruder is 200 DEG C, 205
DEG C, 205 DEG C, 205 DEG C, 205 DEG C, 205 DEG C, 200 DEG C, after extruder temperature of each section reaches setting value, extruder is opened, is opened
First three minute of extruder opens die heater, and the temperature of die heater is set as 70 DEG C；Screw rod of the antistatic PS Jing Guo coextruder
The upper epidermis and layer that carrier band is formed in mold are transported to after fusion plastification, modified feed back is melted by the screw rod of main extruder
The middle layer that carrier band is formed in same mold is transported to after plasticizing, upper epidermis, middle layer and layer are squeezed out through same die head, shape
Slabbing fused materials；
S3: carrier band semi-finished product molding opens shaping mould switch, shaping mould up time when the temperature of shaping mould reaches 70 DEG C
Needle rotation opens vacuum pump by shaping mould close to extruder die head, opens high pressure valve, the sheet-shaped molten after squeezing out in S2 step
Material is cast to shaping mould, and under the action of circumference tangential force, sheet-shaped molten material can be wrapped in molding mould surface, simultaneously
It is under the action of pull of vacuum, the sheet-shaped molten material induction type of rotation is intracavitary, when shaping mould goes to 150 ° of left sides from vacuum chamber
When right, high-pressure blast is blown out the carrier band in insert molding model cavity by mould inside duct, by adjusting shaping mould to die head
Distance or adjustment screw revolving speed with adjust carrier band semi-finished product thickness, complete carrier band semi-finished product molding；
S4: cutting edge grinding, and the carrier band semi-finished product after forming in S3 step are passed through shaving die, the edge grinding cut out is recycled
And it crushes stand-by；
S5: carrier band molding: the carrier band semi-finished product after edge grinding will be cut in S4 step, and by hole punched device punching to form carrier band fixed
Position hole, cuts to form carrier band finished product using cutting device；
S6: rear detection: by the carrier band after the cutting in S5 step, tooling detects thickness and width after testing, will test work
Carrier band after dress detection detects the positions and dimensions of carrier band location hole by inclined aperture apparatus；
S7: the carrier band after detection is qualified in S6 step winding: is subjected to winding packaging.
Embodiment 6:
The manufacturing method of any one antistatic carrier band of above-described embodiment 2 that the embodiment of the present invention 6 provides, including it is following
Step:
S1: raw material pre-treatment weighs No. bis- feed backs of antistatic PS, antistatic PS and ABS of modified feed back in proportion, and
It is uniformly mixed by high mixer, antistatic PS and modified feed back is put into baking oven drying, drying temperature is 90 DEG C, and drying time is
2 hours；
S2: the antistatic PS after drying in S1 step is added in the hopper of coextruder extruding sheet fused materials, will
Each raw material of modified feed back is added in the hopper of main extruder, opens the apparatus for baking of hopper, sets each section of temperature of main extruder
Degree is 205 DEG C, and 210 DEG C, 210 DEG C, 210 DEG C, 210 DEG C, 210 DEG C, 205 DEG C, the temperature of each section of coextruder is 205 DEG C, 210
DEG C, 210 DEG C, 210 DEG C, 210 DEG C, 210 DEG C, 205 DEG C, after extruder temperature of each section reaches setting value, extruder is opened, is opened
First three minute of extruder opens die heater, and the temperature of die heater is set as 70 DEG C；Screw rod of the antistatic PS Jing Guo coextruder
The upper epidermis and layer that carrier band is formed in mold are transported to after fusion plastification, modified feed back is melted by the screw rod of main extruder
The middle layer that carrier band is formed in same mold is transported to after plasticizing, upper epidermis, middle layer and layer are squeezed out through same die head, shape
Slabbing fused materials；
S3: carrier band semi-finished product molding opens shaping mould switch, shaping mould up time when the temperature of shaping mould reaches 70 DEG C
Needle rotation opens vacuum pump by shaping mould close to extruder die head, opens high pressure valve, the sheet-shaped molten after squeezing out in S2 step
Material is cast to shaping mould, and under the action of circumference tangential force, sheet-shaped molten material can be wrapped in molding mould surface, simultaneously
It is under the action of pull of vacuum, the sheet-shaped molten material induction type of rotation is intracavitary, when shaping mould goes to 150 ° of left sides from vacuum chamber
When right, high-pressure blast is blown out the carrier band in insert molding model cavity by mould inside duct, by adjusting shaping mould to die head
Distance or adjustment screw revolving speed with adjust carrier band semi-finished product thickness, complete carrier band semi-finished product molding；
S4: cutting edge grinding, and the carrier band semi-finished product after forming in S3 step are passed through shaving die, the edge grinding cut out is recycled
And it crushes stand-by；
S5: carrier band molding: the carrier band semi-finished product after edge grinding will be cut in S4 step, and by hole punched device punching to form carrier band fixed
Position hole, cuts to form carrier band finished product using cutting device；
S6: rear detection: by the carrier band after the cutting in S5 step, tooling detects thickness and width after testing, will test work
Carrier band after dress detection detects the positions and dimensions of carrier band location hole by inclined aperture apparatus；
S7: the carrier band after detection is qualified in S6 step winding: is subjected to winding packaging.
Embodiment 7:
A kind of manufacturing method of antistatic carrier band of above-described embodiment 3 that the embodiment of the present invention 7 provides, including following step
It is rapid:
S1: raw material pre-treatment weighs feed back of antistatic PC, antistatic PC and ABS of modified feed back in proportion, and
It is uniformly mixed by high mixer, antistatic PC and modified feed back is put into baking oven drying, drying temperature is 125 DEG C, drying time
It is 2.5 hours；
S2: the antistatic PC after drying in S1 step is added in the hopper of coextruder extruding sheet fused materials, will
Each raw material of modified feed back is added in the hopper of main extruder, opens the apparatus for baking of hopper, sets each section of temperature of main extruder
Degree is 265 DEG C, and 270 DEG C, 270 DEG C, 270 DEG C, 270 DEG C, 270 DEG C, 265 DEG C, the temperature of each section of coextruder is 265 DEG C, 270
DEG C, 270 DEG C, 270 DEG C, 270 DEG C, 270 DEG C, 265 DEG C, after extruder temperature of each section reaches setting value, extruder is opened, is opened
First three minute of extruder opens die heater, and the temperature of die heater is set as 70 DEG C；Screw rod of the antistatic PC Jing Guo coextruder
The upper epidermis and layer that carrier band is formed in mold are transported to after fusion plastification, modified feed back is melted by the screw rod of main extruder
The middle layer that carrier band is formed in same mold is transported to after plasticizing, upper epidermis, middle layer and layer are squeezed out through same die head, shape
Slabbing fused materials；
S3: carrier band semi-finished product molding opens shaping mould switch, shaping mould up time when the temperature of shaping mould reaches 70 DEG C
Needle rotation opens vacuum pump by shaping mould close to extruder die head, opens high pressure valve, the sheet-shaped molten after squeezing out in S2 step
Material is cast to shaping mould, and under the action of circumference tangential force, sheet-shaped molten material can be wrapped in molding mould surface, simultaneously
It is under the action of pull of vacuum, the sheet-shaped molten material induction type of rotation is intracavitary, when shaping mould goes to 150 ° of left sides from vacuum chamber
When right, high-pressure blast is blown out the carrier band in insert molding model cavity by mould inside duct, by adjusting shaping mould to die head
Distance or adjustment screw revolving speed with adjust carrier band semi-finished product thickness, complete carrier band semi-finished product molding；
S4: cutting edge grinding, and the carrier band semi-finished product after forming in S3 step are passed through shaving die, the edge grinding cut out is recycled
And it crushes stand-by；
S5: carrier band molding: the carrier band semi-finished product after edge grinding will be cut in S4 step, and by hole punched device punching to form carrier band fixed
Position hole, cuts to form carrier band finished product using cutting device；
S6: rear detection: by the carrier band after the cutting in S5 step, tooling detects thickness and width after testing, will test work
Carrier band after dress detection detects the positions and dimensions of carrier band location hole by inclined aperture apparatus；
S7: the carrier band after detection is qualified in S6 step winding: is subjected to winding packaging.
Embodiment 8:
A kind of manufacturing method of antistatic carrier band of above-described embodiment 4 that the embodiment of the present invention 8 provides, including following step
It is rapid:
S1: raw material pre-treatment weighs No. bis- feed backs of antistatic PC, antistatic PC and ABS of modified feed back in proportion, and
It is uniformly mixed by high mixer, antistatic PC and modified feed back is put into baking oven drying, drying temperature is 125 DEG C, drying time
It is 2.5 hours；
S2: the antistatic PC after drying in S1 step is added in the hopper of coextruder extruding sheet fused materials, will
Each raw material of modified feed back is added in the hopper of main extruder, opens the apparatus for baking of hopper, sets each section of temperature of main extruder
Degree is 270 DEG C, and 275 DEG C, 275 DEG C, 275 DEG C, 275 DEG C, 275 DEG C, 270 DEG C, the temperature of each section of coextruder is 270 DEG C, 275
DEG C, 275 DEG C, 275 DEG C, 275 DEG C, 275 DEG C, 270 DEG C, after extruder temperature of each section reaches setting value, extruder is opened, is opened
First three minute of extruder opens die heater, and the temperature of die heater is set as 70 DEG C；Screw rod of the antistatic PC Jing Guo coextruder
The upper epidermis and layer that carrier band is formed in mold are transported to after fusion plastification, modified feed back is melted by the screw rod of main extruder
The middle layer that carrier band is formed in same mold is transported to after plasticizing, upper epidermis, middle layer and layer are squeezed out through same die head, shape
Slabbing fused materials；
S3: carrier band semi-finished product molding opens shaping mould switch, shaping mould up time when the temperature of shaping mould reaches 70 DEG C
Needle rotation opens vacuum pump by shaping mould close to extruder die head, opens high pressure valve, the sheet-shaped molten after squeezing out in S2 step
Material is cast to shaping mould, and under the action of circumference tangential force, sheet-shaped molten material can be wrapped in molding mould surface, simultaneously
It is under the action of pull of vacuum, the sheet-shaped molten material induction type of rotation is intracavitary, when shaping mould goes to 150 ° of left sides from vacuum chamber
When right, high-pressure blast is blown out the carrier band in insert molding model cavity by mould inside duct, by adjusting shaping mould to die head
Distance or adjustment screw revolving speed with adjust carrier band semi-finished product thickness, complete carrier band semi-finished product molding；
S4: cutting edge grinding, and the carrier band semi-finished product after forming in S3 step are passed through shaving die, the edge grinding cut out is recycled
And it crushes stand-by；
S5: carrier band molding: the carrier band semi-finished product after edge grinding will be cut in S4 step, and by hole punched device punching to form carrier band fixed
Position hole, cuts to form carrier band finished product using cutting device；
S6: rear detection: by the carrier band after the cutting in S5 step, tooling detects thickness and width after testing, will test work
Carrier band after dress detection detects the positions and dimensions of carrier band location hole by inclined aperture apparatus；
S7: the carrier band after detection is qualified in S6 step winding: is subjected to winding packaging.
Carrier band manufacturing method of the invention uses coextrusion mold, and upper epidermis, middle layer and following table are squeezed out from same mold
Sheet-shaped molten material is cast to molding mold forming and obtains carrier band semi-finished product, excision carrier band half by the sheet-shaped molten material of layer superposition
The carrier band semi-finished product for cutting off edge grinding are obtained carrying by the edge grinding of finished product after hole punched device punching, cutting device cutting
Product, manufacturing method is simple, high-efficient, rejection rate is low, and can collect edge grinding by crushing recycling and reusing, reduces
Production cost；The fused materials of sheet are cast to shaping mould, can by adjusting the distance between shaping mould and extrusion die or
The screw speed of extruder is adjusted to adjust the thickness of carrier band, method of adjustment is simple, and is suitable for the carrier band of plurality of specifications
Manufacture；Warp detects later after carrier band finished product molding, and by all carrier band semi-finished product after cutting, tooling detection is carried after testing
The width and thickness of band detects the positions and dimensions of carrier band location hole using inclined aperture apparatus, to every carrier band and each carrier band
Location hole is all detected, it is ensured that the quality of carrier band；In addition, apparatus for baking is set in the hopper of extruder, it can be effective
It prevents raw material from making moist, ensure that the mechanical property and dimensional stability of carrier band.
The preferred embodiment of the present invention has shown and described in above description, as previously described, it should be understood that the present invention is not office
Be limited to form disclosed herein, should not be regarded as an exclusion of other examples, and can be used for various other combinations, modification and
Environment, and can be changed within that scope of the inventive concept describe herein by the above teachings or related fields of technology or knowledge
It is dynamic.And changes and modifications made by those skilled in the art do not depart from the spirit and scope of the present invention, then it all should be appended by the present invention
In scope of protection of the claims.
Claims (10)
1. a kind of antistatic carrier band, it is characterised in that: including upper epidermis, middle layer and layer, the upper epidermis and layer
The 10~20% of gross mass are respectively accounted for, the middle layer accounts for the 60~80% of gross mass, and the upper epidermis and layer are antistatic
Base-material, the middle layer are modified feed back, and the modified feed back includes 30% antistatic base-material, 60~65% feed back and 5
~10% ABS.
2. a kind of antistatic carrier band according to claim 1, it is characterised in that: the antistatic base-material be antistatic PS or
One or both of antistatic PC.
3. a kind of antistatic carrier band according to claim 1, it is characterised in that: the feed back is upper epidermis and layer
The feed back of antistatic base-material.
4. a kind of manufacturing method of antistatic carrier band as described in claim 1, it is characterised in that: comprise the steps of:
S1: raw material pre-treatment weighs each raw material of modified feed back in proportion, each raw material of modified feed back is passed through high mixed
Machine is uniformly mixed, and modified feed back and antistatic base-material are put into baking oven drying；
S2: the antistatic base-material after drying in S1 step is added in the hopper of coextruder, will change by extruding sheet fused materials
Property feed back each raw material be added in the hopper of main extruder, open the apparatus for baking of hopper, set extruder temperature of each section, when squeezing
After machine temperature of each section reaches setting value out, extruder is opened, antistatic base-material and modified feed back pass through screw rod fusion plastification respectively
After be transported in same mold, and squeezed out through same die head, form sheet-shaped molten material；
S3: carrier band semi-finished product molding, the sheet-shaped molten material after squeezing out in S2 step are cast to shaping mould, formed carrier band half at
Product, by adjusting shaping mould to die head distance or adjustment screw revolving speed to adjust the thickness of carrier band semi-finished product, complete carrier band half
Finished product molding；
S4: cutting edge grinding, and the carrier band semi-finished product after forming in S3 step are passed through shaving die, by the edge grinding cut out recycling and powder
It is broken stand-by；
S5: carrier band molding: will cut the carrier band semi-finished product after edge grinding by hole punched device punching and form carrier band location hole in S4 step,
It cuts to form carrier band finished product using cutting device；
S6: rear detection: by the carrier band after the cutting in S5 step, tooling detects thickness and width after testing, will test tooling inspection
Carrier band after survey carries the positions and dimensions of location hole by the detection of inclined aperture apparatus；
S7: the carrier band after detection is qualified in S6 step winding: is subjected to winding packaging.
5. the manufacturing method of antistatic carrier band according to claim 4, it is characterised in that: antistatic base in the S2 step
Enter upper epidermis and layer that mold forms carrier band after expecting the screw rod fusion plastification by coextruder, modified feed back is by master
Enter the middle layer that mold forms carrier band after the screw rod fusion plastification of extruder.
6. the manufacturing method of antistatic carrier band according to claim 4, it is characterised in that: extruder in the S2 step
Temperature of each section is 190~270 DEG C.
7. the manufacturing method of antistatic carrier band according to claim 4, it is characterised in that: open and squeeze out in the S2 step
3~5 minutes unlatching die heaters before machine.
8. the manufacturing method of antistatic carrier band according to claim 7, it is characterised in that: the temperature of the die heater is set
It is 60~80 DEG C.
9. the manufacturing method of antistatic carrier band according to claim 4, it is characterised in that: shaping mould reaches in the S3 step
To set temperature, shaping mould switch is opened, shaping mould rotates clockwise, and by shaping mould close to die head, opens vacuum pump, opens high
Pressure valve.
10. the manufacturing method of antistatic carrier band according to claim 4, it is characterised in that: antistatic in the S1 step
The drying temperature of base-material is 70~130 DEG C.
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| CN201910292400.7A CN110001168A (en) | 2019-04-12 | 2019-04-12 | A kind of antistatic carrier band and its manufacturing method |
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| CN201910292400.7A CN110001168A (en) | 2019-04-12 | 2019-04-12 | A kind of antistatic carrier band and its manufacturing method |
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Application publication date: 20190712 |