CN110001013A - Cut off board - Google Patents
Cut off board Download PDFInfo
- Publication number
- CN110001013A CN110001013A CN201810011073.9A CN201810011073A CN110001013A CN 110001013 A CN110001013 A CN 110001013A CN 201810011073 A CN201810011073 A CN 201810011073A CN 110001013 A CN110001013 A CN 110001013A
- Authority
- CN
- China
- Prior art keywords
- excision
- module
- microscope carrier
- product
- materials
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/38—Cutting-off equipment for sprues or ingates
- B29C45/382—Cutting-off equipment for sprues or ingates disposed outside the mould
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
- Processing Of Solid Wastes (AREA)
Abstract
A kind of excision board, including a body, a microscope carrier, a drive module, a fixed module, an excision module and a pusher module.Microscope carrier is for carrying a product.Drive module is configured at body, and drives microscope carrier actuation between a first position and a second position.Fixed module is configured at body, the product carried to suppress microscope carrier.Excision module is configured at body, to cut off a materials and parts of the product suppressed by fixed module.Pusher module is configured at body, to release the materials and parts cut off by excision module.
Description
Technical field
The present invention relates to a kind of excision board, especially a kind of materials and parts cut off board.
Background technique
In the manufacturing process of portable electronic devices, plastic casing is usually that plastic material is used to be molded by injection molding machine
It completes.After the completion of injection molding, needs additionally to shear note gate location, extra material head is removed.In general injection molding
In industry, the shearing work for infusing cast gate, which has been realized in, automatically or semi-automatically to be changed, and passes through machinery weight automatically or semi-automatically
Renaturation and accurately repetition shear action, to improve productivity and quality.
However, operator needs that processed product is placed in board by hand-held in existing shear history
It is interior, cause operational danger.In addition, the material head under shearing still can be trapped in inside board.To maintain the suitable of board running
Freely, operator still needs to clean by manual type, can equally jeopardize the safety of personnel.
Summary of the invention
The purpose of the present invention is to provide a kind of excision boards, to promote the safety in utilization of operator.
In order to achieve the above object, the present invention provides a kind of excision board, it is used to cut off a materials and parts of a product.The buster
Platform includes a body, a microscope carrier, a drive module, a fixed module, an excision module and a pusher module.Wherein, the load
Platform is the body to be configured at along a first path, and be used to carry the product.The drive module is then configured at the body, and drives
The microscope carrier is along the first path actuation between a first position and a second position.The fixed module is configured at the body, uses
To suppress the product that the microscope carrier is carried.The excision module is configured at the body, to cut off by fixed module compacting
The materials and parts of the product.The pusher module is configured at the body, to release the materials and parts cut off by the excision module.
In one embodiment of this invention, which is electrically coupled to the microscope carrier, with drive the microscope carrier along this first
Between the first position and the second position, which is located at the engine body exterior for path actuation, so that the product is put,
And the second position is located at the internal body, so that the fixed module suppresses the product.
In one embodiment of this invention, which more drives the microscope carrier along the first path actuation in this first
It sets, between the second position and a third place, which is located at the engine body exterior, for cutting off the product of the materials and parts
Taking-up.
In one embodiment of this invention, after the excision unit cuts off the materials and parts from the product, the pusher module
Actuation is to release the materials and parts, and the drive module drives the microscope carrier to move to the third place from the second position, and working as should
After product is removed, which drives the microscope carrier to move to the first position from the third place.
In one embodiment of this invention, the fixed module be suitable for moved along one second path, with compacting be located at this second
The product that the microscope carrier of position is carried.
In one embodiment of this invention, the excision module be suitable for moved along a third path, with excision be located at this second
The materials and parts of the product of position.
In one embodiment of this invention, when the microscope carrier is located at the second position, the fixed module and the excision module
Position is in the two sides of the microscope carrier respectively, and second path and the third path are located in identical axial direction.
In one embodiment of this invention, which includes that an excision part and a locating part, the excision part have
One first end and a second end, the locating part have a third end and one the 4th end, the excision part this
One end is equipped with an excision unit, and the second end of the excision part is articulated in the third end of the locating part, the locating part
The 4th end for limiting the materials and parts, and the excision unit is using the articulated section of the second end and the third end as axis phase
4th end is rotated.
In one embodiment of this invention, which further includes one except materials and parts, set on the 4th end of the locating part
Portion, and the materials and parts be suitable for position this remove between materials and parts and the locating part for the excision part excision.
In one embodiment of this invention, which further includes a recycling module, cuts to receive the excision module
The materials and parts removed, the materials and parts are a material head.
In one embodiment of this invention, which includes a recycling guide groove and a recycling bin, when the microscope carrier position
When the second position, which is located between the recycling bin and the microscope carrier.
In one embodiment of this invention, which cuts off space and at least positioning piece, those locating pieces including one
Positioned at the excision spatial peripheral, and the product is adapted to abut against those locating pieces, and the materials and parts of the product are suitable for position in the excision
Space.
In one embodiment of this invention, which further includes a sensor, for incuding the configuration of the product.
In one embodiment of this invention, which further includes a heating line, is connected to the excision module.
In order to allow after above-mentioned purpose, technical characteristic and actual implementation it is incremental become apparent understandable, below will
Corresponding relevant schema is assisted preferably to implement example to be described in detail.
Detailed description of the invention
Fig. 1 is painted the schematic diagram of the excision board of one embodiment of the invention.
Fig. 2 to Fig. 4 is painted the flow diagram that the excision board of Fig. 1 cuts off a materials and parts of a product.
Fig. 5 is painted cross-sectional view of the excision board along I-I ' line of Fig. 3.
Fig. 6 is painted the partial enlarged view of the product of Fig. 2.
Fig. 7 is painted excision module, pusher module and the recycling module of the excision board of Fig. 1 in the enlarged drawing at another visual angle.
Fig. 8 to Fig. 9 is painted the flow diagram that the excision module of Fig. 7 cuts off the materials and parts of product.
Figure 10 is painted the excision part of the excision module of Fig. 7 and the enlarged drawing of locating part.
The excision part and locating part that Figure 11 is painted the excision module of Figure 10 are in the schematic diagram at another visual angle.
Wherein, appended drawing reference:
100: excision board
102: button
110: body
120: microscope carrier
122: excision space
124: locating piece
126: sensor
130: drive module
140: fixed module
150: excision module
152: excision part
152a: first end
152b: the second end
154: locating part
154a: third end
154b: the four end
156: excision unit
160: pusher module
170: removing materials and parts
180: recycling module
182: recycling guide groove
184: recycling bin
190: heating line
200: product
210: materials and parts
L1: first path
L2: the second path
L3: third path
P1: first position
P2: the second position
P3: the third place
Specific embodiment
The effect of to better understand feature of the invention, content and advantage and its can reach, hereby cooperates the present invention
Attached drawing, and detailed description are as follows with the expression-form of embodiment.
Fig. 1 is painted the schematic diagram of the excision board of one embodiment of the invention.Fig. 2 to Fig. 4 is painted the excision board of Fig. 1 to one
The flow diagram that one materials and parts of product are cut off.Fig. 5 is painted cross-sectional view of the excision board along I-I ' line of Fig. 3.Fig. 6 is painted
The partial enlarged view of the product of Fig. 2.Fig. 7 is painted excision module, pusher module and the recycling module of the excision board of Fig. 1 in another
The enlarged drawing at visual angle.Fig. 1 to Fig. 7 is please referred to, the excision board 100 of the present embodiment is used to cut off a materials and parts 210 of a product 200
(as shown in Figure 6).Wherein, product 200 is, for example, the plastic casing of an electronic device, and materials and parts 210 are, for example, to be located at note cast gate
One material head of position.As shown in Figure 1, in the present embodiment, excision board 100 mainly includes a body 110, a microscope carrier 120, one
Drive module 130, a fixed module 140, one excision module 150 and a pusher module 160, as shown in Fig. 2, the present embodiment exists
After product 200 is configured at microscope carrier 120, the product that microscope carrier 120 is carried first mainly is suppressed using fixed module 140
200, excision module 150 is reapplied to wipe out the materials and parts 210 of product 200.
In detail, as shown in Fig. 2, in the present embodiment, microscope carrier 120 is to be configured at body 110 along a first path L1,
And for carrying product 200.In addition, as shown in Figure 1, microscope carrier 120 for example cuts off space 122 and at least positioning piece equipped with one
124.These locating pieces 124 are located at around excision space 122, and product 200 is adapted to abut against these locating pieces 124, and product 200
Materials and parts 210 be suitable for position excision space 122 in, for excision module 150 wipe out.In addition, the microscope carrier 120 of the present embodiment may be used also
Including a sensor 126, for incuding the configuration of product 200.In other words, after product 200 is configured at microscope carrier 120, sensing
Device 126 is the configured inductive signal in microscope carrier 120 of capable of emitting product 200.Relatively, when product 200 takes out from microscope carrier 120
Later, sensor 126 can issue another inductive signal, and display product 200 is removed from microscope carrier 120.
In addition, the drive module 130 of the present embodiment, fixed module 140, excision module 150 and pusher module 160 are configurations
In body 110, and drive microscope carrier 120 along first path L1 actuation (such as Fig. 2 between a first position P1 and a second position P2
And shown in Fig. 3).Wherein, drive module 130 is, for example, and is made of components such as motor, cylinder, linear guides.Further
It says, drive module 130 is for example electrically coupled to microscope carrier 120, to drive microscope carrier 120 along first path L1 actuation in first position
Between P1 and second position P2.
In the present embodiment, first position P1 is, for example, and is located at outside body 110, so that operator sets product 200
It is put on microscope carrier 120.In addition, second position P2 is, for example, to be located inside body 110.In this way, when product 200 is placed in load
After platform 120, drive module 130 can drive microscope carrier 120 to be moved to second position P2 by first position P1.Preferably implement one
In example, after product 200 is placed in microscope carrier 120, such as it need to also be sensed by pressing double startup button 102 (such as Fig. 1) with allowing
Device 126 carries out sensing operation, and then senses that product 200 has been placed in microscope carrier 120.After completing above-mentioned sensing operation, cut
Except the energy operation of the beginning of board 100, microscope carrier 120 is moved to second position P2 by first position P1.
After microscope carrier 120 is driven to second position P2, the fixed module 140 of the present embodiment for example can be along one
Two path L2 are mobile (as shown in Figure 5), to suppress the product 200 carried positioned at the microscope carrier 120 of second position P2, in this implementation
In example, the second path L2 refers to the basipetal path of motion of fixed module 140.In turn, the product 200 carried in microscope carrier 120
After compacting by fixed module 140, excision module 150 can be moved along a third path L3, be located at second with excision
The materials and parts 210 of the product 200 of position P2, in the present embodiment, the second path L3 refer to the movement road of fixed module 140 from lower to upper
Diameter.It is noted that in the present embodiment, when microscope carrier 120 is located at second position P2, fixed module 140 and excision module
150 difference positions are in the two sides of microscope carrier 120, and the second path L2 and third path L3 is, for example, to be located in identical axial direction, the axis
To an e.g. gravity direction.
On the other hand, as shown in fig. 7, when excision module 150 cuts off the materials and parts for the product 200 suppressed by fixed module 140
After 210, pusher module 160 can release the materials and parts 210 cut off by excision module 150.In one embodiment of this invention, exist
After materials and parts 210 are released in 160 actuation of pusher module, drive module 130 can also drive microscope carrier 120 to move to from second position P2
One the third place P3.As shown in figure 4, in the present embodiment, first position P1 and the third place P3 are, for example, to be located at the second position
The two sides of P2.In addition, the third place P3 is also, for example, to be located at outside body 110, therefore operator can will cut off materials and parts 210
Product 200 is removed from microscope carrier 120.In turn, after product 200 is removed from microscope carrier 120, sensor 126 can issue product 200
The signal removed from microscope carrier 120.Therefore, the microscope carrier 120 for not carrying product 200 can be driven back again first by drive module 130
Position P1 (as shown in Figure 2), to carry out the processing operation of another product.
Fig. 8 to Fig. 9 is painted the flow diagram that the excision module of Fig. 7 cuts off the materials and parts of product.Figure 10 is painted Fig. 7
Excision module excision part and locating part enlarged drawing.Figure 11 is painted the excision part and locating part of the excision module of Figure 10
Schematic diagram in another visual angle.Please also refer to Fig. 8 to Figure 11, wherein the visual angle of Fig. 8 and Fig. 9 is by 100 bottom of excision board
Excision module 150 is watched toward top by portion, and the visual angle of Figure 10 is that module 150 is cut off in Fig. 9 by view from left to right, the visual angle of Figure 11
To cut off the lateral plan that module 150 is turned left by the right side in Fig. 9.As shown in Figs. 8 to 11, the excision module of the present embodiment 150
It such as include an excision part 152 and a locating part 154.Cutting off part 152 has a first end 152a and a second end
152b.Locating part 154 has a third end 154a, one the 4th end 154b and a convex block 154c.Cut off the first of part 152
End 152a is equipped with an excision unit 156.The second end 152b of excision part 152 is articulated in the third end of locating part 154
154a.Wherein, in the present embodiment, the 4th end 154b of locating part 154 is for limiting materials and parts 210, and cut off unit 156 with
The second end 152b rotates for axis relative to the 4th end 154b with the articulated section of third end 154a.
In this way, which the present embodiment can be cut off the materials and parts 210 of product 200 by excision unit 156.By Fig. 8
With shown in Fig. 9 it is found that cut off part 152 when cutting off the rotation of part 152 and contradict to convex block 154c and stop rotating, the present embodiment
It is limited by locating part 154 come the materials and parts 210 to product 200, has the function that protection excision part 152 whereby.Then, such as
Shown in Fig. 9, rotated by the 4th end 154b of excision 156 relative limit part 154 of unit, it can be by the materials and parts 210 of product 200
Excision.Specifically, as shown in Fig. 8 and Figure 11, it is in rank that the excision board 100 of the present embodiment, which more may include one except materials and parts 170,
Scalariform except materials and parts 170 are set to the 4th end 154b of locating part 154, and is located between excision part 152 and excision unit 156.Cause
This, during materials and parts 210 are cut off, materials and parts 210 can more effectively be limited in except materials and parts 170 and locating part 154 it
Between come for excision part 152 cut off.It further says, after materials and parts 210 are removed, also can effectively be limited in except materials and parts
170 with locating part 154, can't with excision unit 156 rotation and be brought away from.In other words, the pusher module of the present embodiment
160 can successfully release materials and parts 210.
In a preferred embodiment, excision board 100 may also include a recycling module 180.Wherein, recycling module 180 is used
To receive the materials and parts 210 that excision module 150 is cut off.It further says, the recycling module 180 of the present embodiment includes that a recycling is led
Slot 182 and a recycling bin 184.Wherein, recycling bin 184 is, for example, to be located at outside body 110.When microscope carrier 120 is located at second
When setting P2, recycling guide groove 182 is i.e. between recycling bin 184 and the microscope carrier 120.In this way, be removed part in materials and parts 210
152 excisions, and pusher module 160, by after the release of materials and parts 210, materials and parts 210 understand recovered guide groove 182 and are led to recycling
Bucket 184.In other words, the materials and parts 210 of excision board 100 excision through the present embodiment understand recovered guide groove 182 and are led to position
Recycling bin 184 outside body 110.In this way, cut off inside board 100 i.e. will not materials and parts under residual resection, and grasp
Making personnel need not also clean manually, greatly improve and use upper safety.
In a preferred embodiment, as shown in Figure 10, excision board 100 may also include a heating line 190.The present embodiment
Heating line 190 be, for example, be connected to excision module 150.It further says, heating line 190 for example can connect to excision
Part 152 and locating part 154 at least one, allow materials and parts 210 to be cut off soften, in a manner of by heating with benefit excision work
The progress of industry.
In conclusion the present invention is mainly that microscope carrier is made to exist in this external first position and position in position using drive module
It is moved between the intrinsic second position.Therefore, product to be processed can be placed in microscope carrier in vitro at this by operator, and by
Microscope carrier and its processed product carried are sent to excision area (second position) by automated job.In this way, can be big
Width reduces operator in the risk of excision area operation.In addition, the setting of the present invention also recoverable module avoids excision area
Cleaning operation even more promotes the safety in utilization of operator.
Embodiment described above is merely illustrative of the invention's technical idea and feature, and purpose makes to be familiar with this field
Related technical personnel can understand the content of the present invention and implement it accordingly, when that cannot limit the scope of the patents of the invention with this, i.e.,
It is all according to equivalent change made by disclosed spirit or modification, the protection in appended claims of the present invention should be covered
In range.
Claims (14)
1. a kind of excision board, for cutting off a materials and parts of a product, which is characterized in that the excision board includes:
One body；
One microscope carrier is configured at the body, and the microscope carrier is for carrying the product；
One drive module is configured at the body, and the drive module is to drive the microscope carrier along a first path actuation in one first
Between position and a second position；
One fixed module is configured at the body, the product which is carried to suppress the microscope carrier；
One excision module, is configured at the body, the material of the excision module to cut off the product suppressed by the fixed module
Part；And
One pusher module, is configured at the body, and the pusher module is to release the materials and parts cut off by the excision module.
2. excision board as described in claim 1, which is characterized in that the drive module is electrically coupled to the microscope carrier, with driving
For the microscope carrier along the first path actuation between the first position and the second position, which is located at the engine body exterior,
For product storing, and the second position is located at the internal body, so that the fixed module suppresses the product.
3. excision board as claimed in claim 2, which is characterized in that the drive module more drives the microscope carrier along the first path
Between the first position, the second position and a third place, which is located at being somebody's turn to do for the opposite first position for actuation
Engine body exterior, for cut off the materials and parts the product taking-up.
4. excision board as claimed in claim 3, which is characterized in that cut off the materials and parts from the product in the excision unit
Afterwards, the pusher module actuation to be to release the materials and parts, and the drive module drive the microscope carrier from the second position move to this
Three positions, and after the product is removed, which drives the microscope carrier to move to the first position from the third place.
5. excision board as described in claim 1, which is characterized in that the fixed module is suitable for moving along one second path, with
Compacting is located at the product that the microscope carrier of the second position is carried.
6. excision board as claimed in claim 5, which is characterized in that the excision module is suitable for moving along a third path, with
Excision is located at the materials and parts of the product of the second position.
7. excision board as claimed in claim 6, which is characterized in that when the microscope carrier is located at the second position, the stent
Block and excision module difference position are in the two sides of the microscope carrier, and second path and the third path are located in identical axial direction.
8. excision board as described in claim 1, which is characterized in that the excision module includes an excision part and a limit
Part, the excision part have a first end and a second end, which has a third end and one the 4th end,
The first end of the excision part is equipped with an excision unit, and the second end of the excision part is articulated in the third of the locating part
End, the 4th end of the locating part is for limiting the materials and parts, and the excision unit is with the second end and the third end
Articulated section be axis rotated relative to the 4th end.
9. excision board as claimed in claim 8, which is characterized in that further include one except materials and parts, set on the locating part this
Four ends, and the materials and parts be suitable for position this remove between materials and parts and the locating part for the excision part excision.
10. excision board as described in claim 1, which is characterized in that a recycling module is further included, to receive the excision mould
The materials and parts of block excision.
11. excision board as claimed in claim 10, which is characterized in that the recycling module includes a recycling guide groove and one time
Bucket is received, when the microscope carrier is located at the second position, which is located between the recycling bin and the microscope carrier.
12. excision board as described in claim 1, which is characterized in that the microscope carrier is including an excision space and at least centainly
Position part, those locating pieces are located at the excision spatial peripheral, and the product is adapted to abut against those locating pieces, and the materials and parts of the product
Suitable for position in the excision space.
13. excision board as claimed in claim 12, which is characterized in that the microscope carrier further includes a sensor, for incuding this
The configuration of product.
14. excision board as described in claim 1, which is characterized in that further include a heating line, be connected to the excision mould
Block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810011073.9A CN110001013B (en) | 2018-01-05 | 2018-01-05 | Excision machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810011073.9A CN110001013B (en) | 2018-01-05 | 2018-01-05 | Excision machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110001013A true CN110001013A (en) | 2019-07-12 |
| CN110001013B CN110001013B (en) | 2021-05-28 |
Family
ID=67164538
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810011073.9A Active CN110001013B (en) | 2018-01-05 | 2018-01-05 | Excision machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110001013B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07205212A (en) * | 1994-01-14 | 1995-08-08 | Honda Motor Co Ltd | Gate cutter for mold |
| JP2000289050A (en) * | 1999-04-08 | 2000-10-17 | Nippon Steel Corp | Apparatus for recovering waste of plastic gate |
| CN2595553Y (en) * | 2003-02-11 | 2003-12-31 | 英群企业股份有限公司 | Automatic cutter for optical driver casing waste material |
| CN203994548U (en) * | 2014-06-11 | 2014-12-10 | 深圳市东方亮彩精密技术有限公司 | Two caves mould injection moulding regrinding automatic die cutter |
| CN107160646A (en) * | 2017-06-22 | 2017-09-15 | 北京日扬弘创科技有限公司 | Mouth of a river device for excising |
-
2018
- 2018-01-05 CN CN201810011073.9A patent/CN110001013B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07205212A (en) * | 1994-01-14 | 1995-08-08 | Honda Motor Co Ltd | Gate cutter for mold |
| JP2000289050A (en) * | 1999-04-08 | 2000-10-17 | Nippon Steel Corp | Apparatus for recovering waste of plastic gate |
| CN2595553Y (en) * | 2003-02-11 | 2003-12-31 | 英群企业股份有限公司 | Automatic cutter for optical driver casing waste material |
| CN203994548U (en) * | 2014-06-11 | 2014-12-10 | 深圳市东方亮彩精密技术有限公司 | Two caves mould injection moulding regrinding automatic die cutter |
| CN107160646A (en) * | 2017-06-22 | 2017-09-15 | 北京日扬弘创科技有限公司 | Mouth of a river device for excising |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110001013B (en) | 2021-05-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| NL2015103B1 (en) | Device and method for processing a flexible sheet. | |
| CN103476564B (en) | Workpiece removal and finishing device | |
| CN101357504B (en) | Pouring-head cutting device and method | |
| KR101192376B1 (en) | An apparatus for cutting the injection mold having a plate | |
| US7987753B2 (en) | Apparatus and method for cutting injection molded product | |
| CN202780785U (en) | Automatic sandpaper-sending device of polishing machine | |
| CN104908991A (en) | Automatic film coating machine | |
| CN110001013A (en) | Cut off board | |
| CN107877793A (en) | Mouth of a river excision equipment and mouth of a river cutting method | |
| CN206780900U (en) | One kind injection automatic shearing frock | |
| CN102649307A (en) | General milling device | |
| CN205443340U (en) | Drive skin machine | |
| CN207535243U (en) | Mouth of a river excision equipment | |
| KR20090122197A (en) | Apparatus, device and method for rubber-coating of cutting dies | |
| CN204869409U (en) | Full -automatic PET plastics easy open can slotting machine | |
| CN103568048B (en) | Air filter tube connector processing unit (plant) and method | |
| CN202911099U (en) | Sprue cutter device adopting saw bit for injection products | |
| US20070082583A1 (en) | Head for a robot ar intended to perform a deflashing or rouging operation | |
| CN105291385A (en) | Device for removing stub bar | |
| CN219856231U (en) | Antiseized sword cutting device with special-shaped wrapping bag adaptation | |
| CN220008077U (en) | Automatic collect die-cutting machine of waste material | |
| JP2954771B2 (en) | Deburring device for plastic molded products | |
| CN108214078B (en) | Waste aluminum recovery processor for machining leftover bits and pieces | |
| CN211074458U (en) | Automatic injection molding and detection production line for cutting slide block of film cutter | |
| CN219988241U (en) | Automatic cutting processing device of red plastic box of automobile triangle warning sign |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |