CN109995337B - Power amplifier and amplifying method - Google Patents
Power amplifier and amplifying method Download PDFInfo
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- CN109995337B CN109995337B CN201910124616.2A CN201910124616A CN109995337B CN 109995337 B CN109995337 B CN 109995337B CN 201910124616 A CN201910124616 A CN 201910124616A CN 109995337 B CN109995337 B CN 109995337B
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/20—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/68—Combinations of amplifiers, e.g. multi-channel amplifiers for stereophonics
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
Abstract
The application discloses a power amplifier and an amplifying method, comprising the following steps: the device comprises a signal input end, an input power dividing module, a plurality of power driving stage units, an interstage module, a plurality of power amplifying stage units, an output power combining module and a signal output end. The input power dividing module divides signals received by the signal input end into multiple paths, the multiple paths are amplified by the power driving units and then transmitted to the interstage module, the interstage module divides the received amplified signals into multiple frequency bands for multiplexing, the multiple paths are amplified by the power amplifying stage units and then transmitted to the output power clamping module to be combined into one path, and the paths are output through the signal output end. The interstage module has compact structure, can respectively control the position of the frequency point corresponding to each frequency band and the coupling strength of each frequency band by adjusting the size of each circuit of the interstage module, and has convenient operation and various functions.
Description
Technical Field
The present disclosure relates to the field of millimeter wave communication technologies, and in particular, to a power amplifier and an amplifying method.
Background
In recent years, millimeter wave resources are increasingly valued by researchers in both military and civilian fields as microwave low-frequency spectrum resources are gradually exhausted. The millimeter wave power amplifier is used as a key component in the millimeter wave communication system and mainly plays a role in improving the output power of the system. Because of the large area of the power amplifier chip, the wafer processing cost is high, and the multifunctional power amplifier design is always the target pursued by the current power amplifier chip products. Therefore, there is a need to provide a power amplifier technology that is versatile and of small construction.
Disclosure of Invention
In order to solve the above problems, embodiments of the present application provide a power amplifier and an amplifying method.
In one aspect, an embodiment of the present application proposes a power amplifier, including: a signal input end, an input power dividing module, a plurality of power driving stage units, an interstage module, a plurality of power amplifying stage units, an output power combining module and a signal output end which are connected in sequence, wherein
The input power dividing module is used for dividing the signals received from the signal input end into multiple paths and outputting the multiple paths of signals to the power driving stage units as a first group of multiple paths of signals;
the power stage driving units are used for amplifying the first group of multipath signals and then transmitting the amplified signals to the interstage module as a second group of multipath signals;
the interstage module is used for dividing the second group of multipath signals into a plurality of frequency bands and correspondingly outputting a third group of multipath signals;
the power amplification stage units are used for amplifying the third group of multipath signals to form a fourth group of multipath signals and transmitting the fourth group of multipath signals to the output power clamping block;
and the output power combining module is used for combining the fourth group of multipath signals into one path and sending the path to the signal output end for output.
Preferably, the signal input end and the signal output end are both GSG structures, and can be used for on-chip testing.
Preferably, the inter-stage module is configured to divide the second set of multiple signals into three frequency bands, allocate and match power between each power driving stage unit and each power amplifying stage unit, and match three frequency band impedances between each power driving stage unit and each power amplifying stage unit, and the inter-stage module includes a first power division matching unit and a second power division matching unit.
Preferably, the first power division matching unit is configured to filter the signal output by the first power driving stage unit, generate three frequency bands, divide the three frequency bands into two paths, correspondingly output a third group of multipath signals, and output the third group of multipath signals to the first power amplifying stage unit and the second power amplifying stage unit respectively;
the second power division matching unit is used for filtering signals output by the second power driving stage unit to generate three frequency bands, dividing the three frequency bands into two paths, correspondingly outputting a third group of multipath signals, and respectively outputting the third group of multipath signals to the third power amplifying stage unit and the fourth power amplifying stage unit.
Preferably, the first power distribution matching unit and the second power distribution matching unit each include: the first input coupling feeder terminal, the second input coupling feeder terminal, the third input coupling feeder terminal, the first output coupling feeder terminal, the second output coupling feeder terminal, the third output coupling feeder terminal, the first dual-frequency SIR microstrip line, the second dual-frequency SIR microstrip line, the first single-branch microstrip transmission line and the second single-branch microstrip transmission line;
the first double-frequency SIR microstrip line and the second double-frequency SIR microstrip line of the first power division matching unit and the second power division matching unit are respectively connected with a first single-branch microstrip transmission line and a second single-branch microstrip transmission line;
the first input coupling feeder end, the second input coupling feeder end and the third input coupling feeder end of the first power division matching unit and the second power division matching unit are respectively connected with the first power driving stage unit and the second power driving stage unit;
the first output coupling feeder line end, the second output coupling feeder line end and the third output coupling feeder line end of the first power distribution matching unit and the second power distribution matching unit are respectively connected with the first power amplification stage unit and the second power amplification stage unit, and the third power amplification stage unit and the fourth power amplification stage unit.
Preferably, each of the input coupling feed terminals and each of the output coupling feed terminals corresponding thereto are used to control the coupling strengths of the three frequency bands.
Preferably, each dual-frequency SIR microstrip line and a single branch microstrip transmission line connected thereto are used for adjusting frequency points corresponding to each frequency band.
Preferably, each of the frequency bands is individually adjustable.
In a second aspect, an embodiment of the present application proposes a power amplifying method, including:
dividing signals received from the signal input into multiple paths to obtain a first group of multiple paths of signals;
amplifying the first group of multipath signals to obtain a second group of multipath signals;
dividing the second group of multipath signals into a plurality of frequency bands and dividing the frequency bands into multiple paths to obtain a third group of multipath signals;
amplifying the third group of multipath signals to obtain a fourth group of multipath signals;
and combining the fourth group of multipath signals into one path and outputting the path.
The embodiment of the application has the advantages that: the structure of the interstage module is compact by using an output coupling feeder line, an input coupling feeder line, a double-frequency SIR microstrip line and a single-branch microstrip transmission line; the device can work in a plurality of frequency bands simultaneously, and the positions of frequency points corresponding to the frequency bands and the coupling strength of the frequency bands can be controlled respectively by adjusting the sizes of the circuit structural units in the inter-stage modules, so that the device is convenient to operate and has multiple functions.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for the purpose of illustrating preferred embodiments and are not to be construed as limiting the application. Also, like reference numerals are used to designate like parts throughout the figures. In the drawings:
fig. 1 is a circuit diagram of a power amplifier provided in an embodiment of the present application;
fig. 2 is a schematic diagram of a power division matching unit of a power amplifier according to an embodiment of the present application;
fig. 3 is a schematic diagram of a dual-frequency SIR microstrip line of a power amplifier according to an embodiment of the present application;
fig. 4 is a schematic diagram of band adjustment of a power amplifier according to an embodiment of the present application;
fig. 5 is a schematic step diagram of a power amplifying method according to an embodiment of the present application.
Description of the reference numerals
101. First power driver stage unit 102 second power driver stage unit
201. First power amplifier stage unit 202 and second power amplifier stage unit
203. Third power amplifier stage unit 204 fourth power amplifier stage unit
3. Signal input terminal 4 signal output terminal
5. Input power dividing module 6 interstage module
61. First power division matching unit 62 and second power division matching unit
607. First double-frequency SIR microstrip 608 first single-branch microstrip transmission line
611. First input coupling feed line end 612 second input coupling feed line end
613. Third in-coupling feed line end 614 first out-coupling feed line end
615. Second output coupling feed line end 616 third output coupling feed line end
617. Second double-frequency SIR microstrip line 618, second single-branch microstrip transmission line
621. First input coupling feed line end 622 second input coupling feed line end
623. Third in-coupling feed line end 624 first out-coupling feed line end
625. Second output coupling feed line end 626 third output coupling feed line end
627. First dual-frequency SIR microstrip 637 and second dual-frequency SIR microstrip
628. First single-stub microstrip transmission line 638 and second single-stub microstrip transmission line
7. Output power die block TSV silicon through hole
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
As shown in fig. 1, a power amplifier according to an embodiment of the present application includes: the power amplifier comprises a signal input end (3), an input power dividing module (5), a first power driving stage unit (101), a second power driving stage unit (102), an interstage module (6), a first power amplifying stage unit (201), a second power amplifying stage unit (202), a third power amplifying stage unit (203), a fourth power amplifying stage unit (204), an output power closing module (7) and a signal output end (4).
The power amplifier comprises a signal input end (3), an input power dividing module (5), a plurality of power driving stage units, an interstage module (6), a plurality of power amplifying stage units, an output power clamping module (7) and a signal output end (4).
The input power dividing module (5) is used for dividing the signals received from the signal input end (3) into multiple paths and outputting the multiple paths of signals to the power driving stage units as a first group of multiple paths of signals;
the power stage driving units are used for amplifying the first group of multipath signals and then transmitting the amplified signals to the interstage module (6) as a second group of multipath signals;
the interstage module (6) is used for dividing the second group of multipath signals into a plurality of frequency bands and correspondingly outputting a third group of multipath signals;
the power amplifying stage units are used for amplifying the third group of multipath signals to form a fourth group of multipath signals and transmitting the fourth group of multipath signals to the output power clamping block (7);
and the output power clamping block (7) is used for combining the fourth group of multipath signals into one path and sending the path to the signal output end (4) for output.
The signal input end and the signal output end are of GSG structure and can be used for on-chip test, and the signal input end and the signal output end comprise: 3 PAD interfaces and 2 TSV back holes.
The input power dividing module (5) is used for dividing the signal received by the signal input end (3) into two paths, and outputting the two paths of signals to the first power driving stage unit (101) and the second power driving stage unit (102) respectively as a first group of multipath signals.
The inter-stage module (6) is used for respectively generating three frequency bands for the second group of multipath signals, distributing and matching power between each power driving stage unit and each power amplifying stage unit, and matching three frequency band impedance between each power driving stage unit and each power amplifying stage unit, and the inter-stage module (6) comprises a first power distribution matching unit (61) and a second power distribution matching unit (62).
The first power division matching unit (61) is used for filtering signals (second group of multipath signals) output by the first power driving stage unit, generating three frequency bands, dividing the three frequency bands into two paths, correspondingly outputting a third group of multipath signals, and respectively outputting the third group of multipath signals to the first power amplifying stage unit (201) and the second power amplifying stage unit (202);
the second power division matching unit (62) filters the signals (the second group of multipath signals) output by the second power driving stage unit to generate three frequency bands, divides the three frequency bands into two paths, correspondingly outputs a third group of multipath signals, and outputs the third group of multipath signals to the third power amplifying stage unit (203) and the fourth power amplifying stage unit (204) respectively.
The first power division matching unit (61) and the second power division matching unit (62) have the same structure.
As shown in fig. 2, the first power division matching unit (61) includes: a first input coupling feed line end (611), a second input coupling feed line end (612), a third input coupling feed line end (613), a first output coupling feed line end (614), a second output coupling feed line end (615), a third output coupling feed line end (616), a first dual-frequency SIR microstrip line (607), a second dual-frequency SIR microstrip line (617), a first single-branch microstrip transmission line (608), and a second single-branch microstrip transmission line (618). The structure of the dual-band SIR microstrip line takes a second dual-band SIR microstrip line (617) as an example, and as shown in fig. 3, the structure includes three parts, i.e., a left part, a middle part and a right part. The left and right portions are of equal length.
The second power division matching unit (62) includes: a first in-coupling feed line end (621), a second in-coupling feed line end (622), a third in-coupling feed line end (623), a first out-coupling feed line end (624), a second out-coupling feed line end (625), a third out-coupling feed line end (626), a first dual-frequency SIR microstrip line (627), a second dual-frequency SIR microstrip line (637), a first single-branch microstrip transmission line (628), and a second single-branch microstrip transmission line (638).
The first double-frequency SIR microstrip line (607) of the first power division matching unit (61) is connected with the first single-branch microstrip transmission line (608), and the second double-frequency SIR microstrip line (617) is connected with the second single-branch microstrip transmission line (618). The first (61) and second (612) and third (613) input coupling feed lines of the first power split matching unit are connected to the first power drive stage unit (101). The first output coupling feed line end (614), the second output coupling feed line end (615) and the third output coupling feed line end (616) are connected with the first power amplifying stage unit (201) and the second power amplifying stage unit (202). The first dual-frequency SIR microstrip (607) is coupled to a first input coupling feed-line end (611), a second input coupling feed-line end (612), a first output coupling feed-line end (614) and a second output coupling feed-line end (615), and the second dual-frequency SIR microstrip (617) is coupled to the second input coupling feed-line end (612), the third input coupling feed-line end (613), the second output coupling feed-line end (615) and the third output coupling feed-line end (616).
The first double-frequency SIR microstrip line (627) of the second power division matching unit (62) is connected with the first single-branch microstrip transmission line (628), and the second double-frequency SIR microstrip line (637) is connected with the second single-branch microstrip transmission line (638). The first (621), second (622) and third (623) input coupling feed terminals of the second power split matching unit (62) are connected to the second power driver stage unit (102). The first output coupling feed line end (624), the second output coupling feed line end (625) and the third output coupling feed line end (626) are connected with the third power amplifying stage unit (203) and the fourth power amplifying stage unit (204). The first dual-frequency SIR microstrip (627) is coupled to a first input coupling feed-line end (621), a second input coupling feed-line end (622), a first output coupling feed-line end (624), and a second output coupling feed-line end (625), and the second dual-frequency SIR microstrip (637) is coupled to the second input coupling feed-line end (622), the third input coupling feed-line end (623), the second output coupling feed-line end (625), and the third output coupling feed-line end (626).
Each input coupling feed line end and each output coupling feed line end corresponding to the input coupling feed line end are used for controlling the coupling strength of three frequency bands. The smaller the gap between each input coupling feed-line end and each output coupling feed-line end and the corresponding double-frequency SIR microstrip line, the larger the coupling strength.
Each double-frequency SIR microstrip line and a single-branch microstrip transmission line connected with the double-frequency SIR microstrip line are used for adjusting frequency points corresponding to three frequency bands. The frequency points corresponding to the frequency bands can be independently adjusted.
Taking the first power division matching unit (61) as an example, as shown in fig. 4. The frequency point corresponding to the first frequency band is determined by a first length L1 and a second length L2 of the second dual-frequency SIR microstrip line (617). The middle part of the second double-frequency SIR microstrip line (617) is of a first length, and the lengths of the left part and the right part of the second double-frequency SIR microstrip line are equal. The frequency point corresponding to the second frequency band is determined by the second harmonic of the first frequency band, and the position of the second harmonic is determined by adjusting the impedance ratio. The impedance ratio is changed by adjusting the first width (W1) and the second width (W2) of the second dual-frequency SIR microstrip line (617), and the position of the second harmonic is controlled by changing the impedance ratio. The frequency point corresponding to the third frequency band is determined by the first length (L1), the second length (L2) and the third length (L3) of the second single-branch microstrip transmission line (618) of the second double-frequency SIR microstrip line (617). The power division matching unit is also used for adjusting power and distributing and matching power between each power driving stage unit and each power amplifying stage unit.
The output power clamping block (7) is used for combining signals (fourth group of multipath signals) output by the power amplification stage units into one path and outputting the path to the signal output end (4).
According to an embodiment of the present application, a power amplifying method is further provided, as shown in fig. 5, including:
dividing signals received from the signal input into multiple paths to obtain a first group of multiple paths of signals;
amplifying the first group of multipath signals to obtain a second group of multipath signals;
dividing the second group of multipath signals into a plurality of frequency bands and dividing the frequency bands into multiple paths to obtain a third group of multipath signals;
amplifying the third group of multipath signals to obtain a fourth group of multipath signals;
and combining the fourth group of multipath signals into one path and outputting the path.
Dividing the second set of multiplexed signals into a plurality of frequency bands and into multiple paths to obtain a third set of multiplexed signals, including:
according to the requirement, the length and the width of each double-frequency SIR microstrip line and the length of a single branch microstrip transmission line connected with the double-frequency SIR microstrip line are regulated to obtain each required frequency band;
and outputting all required frequency bands and dividing the frequency bands into multiple paths to obtain a third group of multiple paths of signals.
The power amplifier provided by the embodiment of the application uses the output coupling feeder line, the input coupling feeder line, the double-frequency SIR microstrip line and the single-branch microstrip transmission line, so that the interstage module structure is compact; the device can work in a plurality of frequency bands simultaneously, and the positions of frequency points corresponding to the frequency bands and the coupling strength of the frequency bands can be controlled respectively by adjusting the sizes of the circuit structural units in the inter-stage modules, so that the device is convenient to operate and has multiple functions.
The foregoing is merely a preferred embodiment of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions easily contemplated by those skilled in the art within the technical scope of the present application should be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (7)
1. A power amplifier, comprising: a signal input end, an input power dividing module, a plurality of power driving stage units, an interstage module, a plurality of power amplifying stage units, an output power combining module and a signal output end which are connected in sequence, wherein
The input power dividing module is used for dividing the signals received from the signal input end into multiple paths and outputting the multiple paths of signals to the power driving stage units as a first group of multiple paths of signals;
the power driving stage units are used for amplifying the first group of multipath signals and then transmitting the amplified signals to the interstage module as a second group of multipath signals;
the interstage module is used for dividing the second group of multipath signals into three frequency bands and correspondingly outputting a third group of multipath signals; the interstage module comprises a first power division matching unit and a second power division matching unit, wherein the first power division matching unit is used for filtering signals output by the first power driving stage unit to generate three frequency bands, dividing the three frequency bands into two paths, correspondingly outputting a third group of multipath signals, and respectively outputting the third group of multipath signals to the first power amplifying stage unit and the second power amplifying stage unit; the second power division matching unit is used for filtering the signals output by the second power driving stage unit to generate three frequency bands, dividing the three frequency bands into two paths, correspondingly outputting a third group of multipath signals, and respectively outputting the third group of multipath signals to the third power amplifying stage unit and the fourth power amplifying stage unit;
the first power distribution matching unit and the second power distribution matching unit each comprise: the first input coupling feeder terminal, the second input coupling feeder terminal, the third input coupling feeder terminal, the first output coupling feeder terminal, the second output coupling feeder terminal, the third output coupling feeder terminal, the first dual-frequency SIR microstrip line, the second dual-frequency SIR microstrip line, the first single-branch microstrip transmission line and the second single-branch microstrip transmission line; the first double-frequency SIR microstrip line and the second double-frequency SIR microstrip line of the first power division matching unit and the second power division matching unit are respectively connected with a first single-branch microstrip transmission line and a second single-branch microstrip transmission line; the first input coupling feeder end, the second input coupling feeder end and the third input coupling feeder end of the first power division matching unit and the second power division matching unit are respectively connected with the first power driving stage unit and the second power driving stage unit;
the first output coupling feeder line end, the second output coupling feeder line end and the third output coupling feeder line end of the first power division matching unit are respectively connected with the first power amplification stage unit and the second power amplification stage unit;
the first output coupling feeder end, the second output coupling feeder end and the third output coupling feeder end of the second power division matching unit are respectively connected with the third power amplification stage unit and the fourth power amplification stage unit;
the power amplification stage units are used for amplifying the third group of multipath signals to form a fourth group of multipath signals and transmitting the fourth group of multipath signals to the output power clamping block;
and the output power combining module is used for combining the fourth group of multipath signals into one path and sending the path to the signal output end for output.
2. A power amplifier according to claim 1, wherein the signal input and signal output are GSG structures, which can be used for on-chip testing.
3. A power amplifier according to claim 1, wherein the interstage module is configured to divide the second plurality of signals into three frequency bands, to divide and match power between each power driver stage unit and each power amplifier stage unit, and to match the impedance of the three frequency bands between each power driver stage unit and each power amplifier stage unit.
4. A power amplifier according to claim 1, wherein each of the input coupling feed terminals and each of the output coupling feed terminals corresponding thereto are configured to control coupling strengths of three frequency bands.
5. A power amplifier according to claim 1, wherein each of the dual-frequency SIR microstrip lines and a single branch microstrip transmission line connected thereto are used to adjust a frequency point corresponding to each of the frequency bands.
6. A power amplifier according to claim 1, wherein each of said frequency bands is individually adjustable.
7. A power amplification method using the power amplifier of any of claims 1-6, comprising:
dividing signals received from the signal input into multiple paths to obtain a first group of multiple paths of signals;
amplifying the first group of multipath signals to obtain a second group of multipath signals;
dividing the second group of multipath signals into a plurality of frequency bands and dividing the frequency bands into multiple paths to obtain a third group of multipath signals;
amplifying the third group of multipath signals to obtain a fourth group of multipath signals;
and combining the fourth group of multipath signals into one path and outputting the path.
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Address after: 215347 no.707, complex building, Kunshan Industrial Technology Research Institute, no.1699, Zuchongzhi South Road, Kunshan, Suzhou, Jiangsu Province Applicant after: Kunshan Microelectronics Technology Research Institute Address before: 215347 7th floor, IIR complex, 1699 Weicheng South Road, Kunshan City, Suzhou City, Jiangsu Province Applicant before: KUNSHAN BRANCH, INSTITUTE OF MICROELECTRONICS OF CHINESE ACADEMY OF SCIENCES |
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