CN109994442A - The electronic device of radiator and the application radiator - Google Patents
The electronic device of radiator and the application radiator Download PDFInfo
- Publication number
- CN109994442A CN109994442A CN201711481273.2A CN201711481273A CN109994442A CN 109994442 A CN109994442 A CN 109994442A CN 201711481273 A CN201711481273 A CN 201711481273A CN 109994442 A CN109994442 A CN 109994442A
- Authority
- CN
- China
- Prior art keywords
- heat radiation
- radiation module
- heat
- radiator
- radiating fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A kind of radiator, for radiating for two central processing units on a mainboard, the radiator includes one first heat radiation module and one second heat radiation module, first heat radiation module is arranged close to the inlet side of the mainboard, second heat radiation module is arranged close to the air side of the mainboard, first heat radiation module includes several first radiating fins disposed in parallel, second heat radiation module includes several second radiating fins disposed in parallel, first distance setting is spaced between every one first radiating fin, second distance setting is spaced between every one second radiating fin, the first distance is greater than the second distance.The present invention also provides a kind of electronic devices using the radiator.The inlet air temperature of second heat radiation module so can be effectively reduced, and can radiate to two central processing units and preferably, to realize preferable heat dissipation effect.
Description
Technical field
The present invention relates to a kind of radiator and the electronic devices of the application radiator.
Background technique
In general, the IC design of server internal can consume a large amount of electric energy, and the electric energy of these consumption will
It can be converted into heat and the temperature of internal system is caused to rise, therefore, can also make the central processing unit (Central on computer
Processing Unit, CPU) and periphery control chip temperature rise it is even more serious.
Currently, having the radiating mode of the server of double central processing units is by two identical radiators of setting to divide
It is other to radiate to double central processing units.However, since the performance of two radiators is identical, in the heat dissipation for being located at mainboard inlet side
The leaving air temp of device is higher, and so the inlet air temperature positioned at the radiator of mainboard air side is very high, so that mainboard outlet air
The heat dissipation effect of the radiator of side is bad, and then the heat dissipation that will be unfavorable for entire server system.
Summary of the invention
In view of above content, it is necessary to provide a kind of radiator and the electronic device using the radiator.
A kind of radiator, for radiating for two central processing units on a mainboard, the radiator includes
One first heat radiation module and one second heat radiation module, first heat radiation module and the second heat radiation module respectively correspond setting the
On one central processing unit and the second central processing unit, first heat radiation module is arranged close to the inlet side of the mainboard, described
Second heat radiation module is arranged close to the air side of the mainboard, and first heat radiation module includes several disposed in parallel first scattered
Hot fin, second heat radiation module include several second radiating fins disposed in parallel, between every one first radiating fin between
It is arranged every a first distance, second distance setting is spaced between every one second radiating fin, the first distance is greater than described
Second distance.
Further, in second heat radiation module quantity of the second radiating fin more than in first heat radiation module the
The quantity of one radiating fin, the air side of first heat radiation module is towards the inlet side of second heat radiation module.
Further, first heat radiation module further includes one first heat-conducting plate, and first heat-conducting plate is set to first
Between central processing unit and these first radiating fins, thus by heat caused by the first central processing unit conduct to these
It radiates on one radiating fin.
Further, second heat radiation module further includes one second heat-conducting plate, and second heat-conducting plate is set to second
Between central processing unit and these second radiating fins, thus by heat caused by the second central processing unit conduct to these
It radiates on two radiating fins.
Further, several first mounting holes and are respectively equipped on the corner of first heat-conducting plate and the second heat-conducting plate
First heat-conducting plate and the second heat-conducting plate are fixed on the mainboard by two mounting holes with matching fastener.
Further, the first distance is 2.13 millimeters, and the second distance is 1.6 millimeters.
Further, the quantity of the first radiating fin is 42 in first heat radiation module, second heat radiation module
In the second radiating fin quantity be 53.
A kind of electronic device, including a radiator and a mainboard, the radiator are used for as two on the mainboard
A central processing unit radiates, the radiator include one first heat radiation module and one second heat radiation module, described first
Heat radiation module and the second heat radiation module, which respectively correspond, to be arranged on the first central processing unit and the second central processing unit, and described first
Heat radiation module is arranged close to the inlet side of the mainboard, and second heat radiation module is arranged close to the air side of the mainboard, institute
Stating the first heat radiation module includes several first radiating fins disposed in parallel, and second heat radiation module includes several is arranged in parallel
The second radiating fin, be spaced first distance setting between every one first radiating fin, between every one second radiating fin between
It is arranged every a second distance, the first distance is greater than the second distance.
Further, in second heat radiation module quantity of the second radiating fin more than in first heat radiation module the
The quantity of one radiating fin, the air side of first heat radiation module is towards the inlet side of second heat radiation module.
Further, the first distance is 2.13 millimeters, and the second distance is 1.6 millimeters, first radiating mould
The quantity of the first radiating fin is 42 in group, and the quantity of the second radiating fin is 53 in second heat radiation module.
Compared to the prior art, above-mentioned radiator and electronic device pass through the radiating fin in the first heat radiation module of setting
Quantity is less than the radiating fin quantity in the second heat radiation module, and the second distance between these second radiating fins is less than this
First distance between a little first radiating fins.The inlet air temperature of second heat radiation module, and energy so can be effectively reduced
To two central processing units and better heat dissipation.Further, it is also possible to reduce the flow resistance of system to increase air quantity, it is preferable to realize
Heat dissipation effect.
Detailed description of the invention
Fig. 1 is the state diagram of the better embodiment of electronic device.
Fig. 2 is the schematic diagram of the better embodiment of radiator in Fig. 1.
Fig. 3 is the stereogram exploded view of the better embodiment of electronic device.
Main element symbol description
Electronic device 100
Radiator 10
First heat radiation module 12
First radiating fin 122
First heat-conducting plate 124
Mounting hole 126,146
Second heat radiation module 14
Second radiating fin 142
Second heat-conducting plate 144
Mainboard 20
Central processing unit 22,24
The present invention that the following detailed description will be further explained with reference to the above drawings.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are some of the embodiments of the present invention, instead of all the embodiments.
It, below will be in conjunction with attached drawing and reality in order to enable the objectives, technical solutions, and advantages of the present invention to be more clearly understood
Apply mode, in the present invention radiator and application the radiator electronic device be described in further detail and
Related description.
Referring to FIG. 1, in a preferred embodiment of the present invention, a kind of electronic device 100 includes a radiator 10
An and mainboard 20.The radiator 10 is used for as two central processing unit (Central on the mainboard 20
Processing Unit, CPU) it radiates.In one embodiment, the electronic device 100 is a server.
Fig. 2 and Fig. 3 is please referred to, the radiator 10 includes one first heat radiation module 12 and one second heat radiation module 14.
The central processing unit 22 and described is respectively correspondingly arranged in first heat radiation module 12 and second heat radiation module 14
On central processing unit 24.
When mainboard works on power, the central processing unit 22 and the work of the central processing unit 24 will generate certain heat
Amount, first heat radiation module 12 and second heat radiation module 14 will be respectively the central processing unit 22 and the centre
Reason device 24 radiates.
First heat radiation module 12 is arranged close to the inlet side of the mainboard 20, and second heat radiation module 14 is close to institute
State the air side setting of mainboard 20.
First heat radiation module 12 includes several first radiating fins 122 disposed in parallel, second heat radiation module
14 include several second radiating fins 142 disposed in parallel, is spaced a first distance between every one first radiating fin 122 and sets
It sets, second distance setting is spaced between every one second radiating fin 142.The first distance is greater than the second distance.Institute
The quantity of the second radiating fin 142 in the second heat radiation module 14 is stated more than the first radiating fin in first heat radiation module 12
122 quantity.
Wherein, it is connected between every one first radiating fin 122 by U-shaped heat pipe, is led between every one second radiating fin 142
Cross U-shaped heat pipe connection.
The air side of first heat radiation module 12 is towards the inlet side of second heat radiation module 14.Specifically, institute
It is docked completely with the air inlet side of second heat radiation module 14 air outlet side for stating the first heat radiation module 12.
In this way, when the radiating fin quantity in first heat radiation module 12 is less than dissipating in second heat radiation module 14
When hot number of fins and the first distance are greater than the second distance, first heat radiation module 12 and second radiating mould
Heat dissipation performance between group 14 is different.
The air side of first heat radiation module 12 be lower leaving air temp, at this time second heat radiation module 14 into
Air temperature is lower, will so effectively improve the radiating efficiency of second heat radiation module 14.It can be reduced two simultaneously
The temperature of central processing unit 22 and 24.Further, it is also possible to which the flow resistance for reducing system is imitated with increasing air quantity with realizing preferably to radiate
Fruit.
In a better embodiment, first heat radiation module 12 further includes one first heat-conducting plate 124, and described first leads
Hot plate 124 is set between the central processing unit 22 and these first radiating fins 122, so that central processing unit 22 be produced
Raw heat is conducted to radiating on these the first radiating fins 122.
Second heat radiation module 14 further includes one second heat-conducting plate 144, and second heat-conducting plate 144 is set in described
Between central processor 24 and these second radiating fins 142, to conducting heat caused by central processing unit 24 to these
It radiates on second radiating fin 142.
In a better embodiment, the corner of first heat-conducting plate 124 is equipped with several mounting holes 126, with cooperation
First heat-conducting plate 124 is fixed on the mainboard 20 by fastener 30.The corner of second heat-conducting plate 144 is equipped with peace
Hole 146 is filled, second heat-conducting plate 144 is fixed on the mainboard 20 with matching fastener.
In a better embodiment, between these first radiating fins 122 between be divided into 2.13 millimeters, these second dissipate
1.6 millimeters are divided between hot fin 142.
The quantity of first radiating fin 122 is 42 in first heat radiation module 12.In second heat radiation module 14
The quantity of second radiating fin 142 is 53.
In a better embodiment, also settable one between first heat radiation module 12 and second heat radiation module
Guiding device (not shown), the air quantity the air side of the first heat radiation module 12 to be discharged are guided to the second heat radiation module 14
Inlet side.Wherein, the guiding device can be a fan.
Above-mentioned radiator 10 is less than the second heat radiation module by the radiating fin quantity in the first heat radiation module 12 of setting
Radiating fin quantity in 14, and the second distance between these second radiating fins 142 is less than these first radiating fins
First distance between 122.
So can be effectively reduced the inlet air temperature of second heat radiation module 14, and can to two central processing units 22 and
24 preferably heat dissipations.Further, it is also possible to reduce the flow resistance of system to increase air quantity, to realize preferable heat dissipation effect.
Finally it should be noted that the above examples are only used to illustrate the technical scheme of the present invention and are not limiting.This field
It is to be appreciated by one skilled in the art that can modify to technical solution of the present invention or equivalent replacement, without departing from the present invention
The spirit and scope of technical solution.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creativeness
Every other embodiment obtained, will all belong to the scope of protection of the invention under the premise of labour.
Claims (10)
1. a kind of radiator, for radiating for two central processing units on a mainboard, which is characterized in that the heat dissipation
Device includes one first heat radiation module and one second heat radiation module, and first heat radiation module and the second heat radiation module respectively correspond
It is arranged on the first central processing unit and the second central processing unit, first heat radiation module is set close to the inlet side of the mainboard
It sets, second heat radiation module is arranged close to the air side of the mainboard, and first heat radiation module includes several is arranged in parallel
The first radiating fin, second heat radiation module includes several second radiating fins disposed in parallel, every one first heat radiating fin
It is spaced first distance setting between piece, second distance setting, the first distance are spaced between every one second radiating fin
Greater than the second distance.
2. radiator as described in claim 1, which is characterized in that the number of the second radiating fin in second heat radiation module
Amount is more than the quantity of the first radiating fin in first heat radiation module, and the air side of first heat radiation module is towards described the
The inlet side of two heat radiation modules.
3. radiator as claimed in claim 2, which is characterized in that first heat radiation module further includes one first thermally conductive
Plate, first heat-conducting plate are set between the first central processing unit and these first radiating fins, thus by the first centre
Heat caused by reason device is conducted to radiating on these the first radiating fins.
4. radiator as claimed in claim 3, which is characterized in that second heat radiation module further includes one second thermally conductive
Plate, second heat-conducting plate are set between the second central processing unit and these second radiating fins, thus by the second centre
Heat caused by reason device is conducted to radiating on these the second radiating fins.
5. radiator as claimed in claim 4, which is characterized in that on the corner of first heat-conducting plate and the second heat-conducting plate
It is respectively equipped with several first mounting holes and the second mounting hole, is consolidated first heat-conducting plate and the second heat-conducting plate with matching fastener
Due on the mainboard.
6. radiator as described in claim 1, which is characterized in that the first distance be 2.13 millimeters, described second away from
From being 1.6 millimeters.
7. radiator as claimed in claim 2, which is characterized in that the number of the first radiating fin in first heat radiation module
Amount is 42, and the quantity of the second radiating fin is 53 in second heat radiation module.
8. a kind of electronic device, including a radiator and a mainboard, the radiator is used for as two on the mainboard
Central processing unit radiates, which is characterized in that and the radiator includes one first heat radiation module and one second heat radiation module,
First heat radiation module and the second heat radiation module, which respectively correspond, to be arranged on the first central processing unit and the second central processing unit,
First heat radiation module is arranged close to the inlet side of the mainboard, and second heat radiation module is close to the air side of the mainboard
Setting, first heat radiation module includes several first radiating fins disposed in parallel, and second heat radiation module includes several
Second radiating fin disposed in parallel is spaced first distance setting, every one second heat radiating fin between every one first radiating fin
Second distance setting is spaced between piece, the first distance is greater than the second distance.
9. electronic device as claimed in claim 8, which is characterized in that the number of the second radiating fin in second heat radiation module
Amount is more than the quantity of the first radiating fin in first heat radiation module, and the air side of first heat radiation module is towards described the
The inlet side of two heat radiation modules.
10. electronic device as claimed in claim 9, which is characterized in that the first distance be 2.13 millimeters, described second away from
From being 1.6 millimeters, the quantity of the first radiating fin is 42 in first heat radiation module, second in second heat radiation module
The quantity of radiating fin is 53.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711481273.2A CN109994442A (en) | 2017-12-29 | 2017-12-29 | The electronic device of radiator and the application radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711481273.2A CN109994442A (en) | 2017-12-29 | 2017-12-29 | The electronic device of radiator and the application radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109994442A true CN109994442A (en) | 2019-07-09 |
Family
ID=67109922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711481273.2A Pending CN109994442A (en) | 2017-12-29 | 2017-12-29 | The electronic device of radiator and the application radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109994442A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005150132A (en) * | 2003-11-11 | 2005-06-09 | Toshiba Corp | Semiconductor cooling device |
| CN201607676U (en) * | 2010-04-16 | 2010-10-13 | 山东高效能服务器和存储研究院 | Fixing device of CPU radiator |
| CN102884877A (en) * | 2010-05-18 | 2013-01-16 | 古河电气工业株式会社 | Cooling device with a plurality of fin pitches |
| JP2013021140A (en) * | 2011-07-12 | 2013-01-31 | Furukawa Electric Co Ltd:The | Cooling apparatus |
| CN104142717A (en) * | 2013-05-10 | 2014-11-12 | 鸿富锦精密工业（深圳）有限公司 | Electronic device and air guide cover thereof |
| CN106028766A (en) * | 2016-08-02 | 2016-10-12 | 成都雷电微力科技有限公司 | Novel cooling fin runner structure |
-
2017
- 2017-12-29 CN CN201711481273.2A patent/CN109994442A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005150132A (en) * | 2003-11-11 | 2005-06-09 | Toshiba Corp | Semiconductor cooling device |
| CN201607676U (en) * | 2010-04-16 | 2010-10-13 | 山东高效能服务器和存储研究院 | Fixing device of CPU radiator |
| CN102884877A (en) * | 2010-05-18 | 2013-01-16 | 古河电气工业株式会社 | Cooling device with a plurality of fin pitches |
| JP2013021140A (en) * | 2011-07-12 | 2013-01-31 | Furukawa Electric Co Ltd:The | Cooling apparatus |
| CN104142717A (en) * | 2013-05-10 | 2014-11-12 | 鸿富锦精密工业（深圳）有限公司 | Electronic device and air guide cover thereof |
| CN106028766A (en) * | 2016-08-02 | 2016-10-12 | 成都雷电微力科技有限公司 | Novel cooling fin runner structure |
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Application publication date: 20190709 |