CN109990640A - 一种开槽式流线肋型结构的换热板 - Google Patents

一种开槽式流线肋型结构的换热板 Download PDF

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CN109990640A
CN109990640A CN201910186489.9A CN201910186489A CN109990640A CN 109990640 A CN109990640 A CN 109990640A CN 201910186489 A CN201910186489 A CN 201910186489A CN 109990640 A CN109990640 A CN 109990640A
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streamline
herringbone
heat exchanger
fin
slot
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CN109990640B (zh
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唐桂华
李小龙
王思琦
范元鸿
杨丹蕾
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Anhui Run'an Sibian Energy Technology Co ltd
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Xian Jiaotong University
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • F28D9/0031—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by paired plates touching each other
    • F28D9/0037—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by paired plates touching each other the conduits for the other heat-exchange medium also being formed by paired plates touching each other
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00—Fins
    • F28F2215/08—Fins with openings, e.g. louvers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2250/00—Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
    • F28F2250/02—Streamline-shaped elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/345—Arrangements for heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)

Abstract

本发明公开了一种用于印刷电路板换热器的开槽式流线肋型结构的换热板，本发明通过在肋片上开设“人字形”流线槽，使一部分换热流体可以流入槽道并从肋片尾部流出，避免来流对肋片的垂直撞击，防止流动滞止区的产生，以改善该区域内局部阻力较大的现象，继而降低通道压降损失。同时，开槽区域可显著增加换热面积，使换热性能亦有所提升。

Description

一种开槽式流线肋型结构的换热板
技术领域
本发明属于换热器领域，具体涉及一种用于印刷电路板换热器的带有开槽式流线肋型结构的换热板。
背景技术
印刷电路板换热是一种耐高温高压的高效紧凑式换热器，通过化学蚀刻或机加工等方式在换热基板上加工出微细流道后，采用扩散焊接的方法将换热基板组合起来，得到换热芯体。在已有的印刷电路板换热器中，常用的通道型式为连续的直通道、“之字形”通道等，“之字形”通道可以显著强化换热性能但同时也导致了流动阻力。翼型肋片通道可以在保证换热性能的条件下，大幅降低流动阻力，因而得到了广泛应用。但是对于常规翼型肋片，来流会垂直撞击肋片前端，在肋片前端附近产生流动滞止区，在此区域内存在较大的速度梯度和压力梯度，会导致较大的局部阻力，从而影响换热器的综合性能。已有专利通过把肋片前端做成尖角来改善流动滞止区的影响，但改为尖角后，肋片前端扰动变小，会使换热性能下降。
发明内容
本发明的目的在于克服上述现有技术存在的缺陷和不足，提供了一种能够防止流动滞止区的产生，以改善该区域内局部阻力较大的现象，同时，可显著增加换热面积，使换热性能亦有所提升的带有“人字形”的开槽式流线肋型结构的换热板。
为达到上述目的，本发明采用的技术方案是：包括由若干肋片组成的基板，所述各肋片上均开设有“人字形”流线槽，所述“人字形”流线槽为对称翼型结构。
所述“人字形”流线槽的人字形宽度为其长度的15％～30％。
所述“人字形”流线槽的人字形头部自来流方向开设在肋片前端。
所述“人字形”流线槽前端为直通道，自中部分为两个分支通道，槽道整体呈对称的“人字形”布置。
所述分支通道为曲线通道，其中心线与所述直通道的中心线在连接处相切。
所述“人字形”流线槽的槽道宽度与肋片厚度之比为0.2～0.4。
所述“人字形”流线槽的直通道部分与肋片长度之比为0.3～0.6。
所述“人字形”流线槽的总长度与肋片长度之比范围为0.6～0.9。
所述“人字形”流线槽采用化学蚀刻或机加工的方法开设在肋片上。
本发明通过在肋片上均开设有“人字形”流线槽，使一部分换热流体可以流入槽道并从肋片尾部流出，避免来流对肋片的垂直撞击，防止流动滞止区的产生，以改善该区域内局部阻力较大的现象，继而降低通道压降损失。同时，开槽区域可显著增加换热面积，使换热性能亦有所提升。
附图说明
图1为本发明的结构示意图。
图2为本发明与传统翼型换热性能对比图。
图3为本发明与传统翼型阻力性能对比。
图4为本发明与传统翼型综合换热因子对比。
图5为本发明与传统翼型周围流线对比。
具体实施方式
为使本发明的目的、技术方案和优点更加清楚明白，以下结合具体实施例，并参照附图，对本发明作进一步的详细说明。
如图1所示，本发明提供了一种开槽式流线肋型结构的换热板，包括由若干肋片组成的基板，所述各肋片上均开设有“人字形”流线槽(下称HSF)，所述“人字形”流线槽为对称翼型结构，且“人字形”流线槽的人字形宽度为其长度的15％～30％。
本发明在已有翼型肋片(下称AFF)基础上，在肋片上开设有“人字形”流线槽，人字形头部自来流方向开设在肋片前端，“人字形”流线槽包括一个直通道1和两个分支通道2、3，槽道整体呈对称的“人字形”布置。其中，两个分支通道2、3为曲线通道，且分支通道2、3的中心线与直通道1中心线在连接处相切，使分支通道2、3和直通道1连接成光滑曲线。
其中“人字形”流线槽的槽道宽度与肋片厚度之比为0.2～0.4，所述“人字形”流线槽的直通道部分与肋片长度之比为0.3～0.6，所述“人字形”流线槽的总长度与肋片长度之比为0.6～0.9。
制作时，建议采用化学刻蚀或者精加工的方式在肋片上开设“人字形”流线槽，随后将加工出的肋片的金属板叠放起来，通过扩散焊接的方法将多个金属板连成整体，就得到了印刷电路板换热器的芯体，最后在换热器芯体两端加装封头以得到完整的印刷电路板换热器。
在肋片尺寸及排布方式相同的情况下，对包含AFF和HSF的印刷电路板换热器进行数值模拟，数值结果如图2、3所示。图2为两种肋片的换热性能对比，图3为两种肋片阻力性能对比。可以看出，HSF的传热性能优于已有AFF肋片，且阻力因子相对于AFF亦有显著下降。
两种肋片综合换热因子对比如图4所示，以AFF为基准，评价准则为等流量条件下的JF因子(JF＝(jHSF/jAFF)/(fHSF/fAFF))。可以看出，HSF的综合换热性能明显优于已有AFF。
图5给出了两种肋片附近的流线图，可以看出，在传统AFF前端，由于来流垂直撞击肋片，该区域存在较为明显的流动滞止现象，而在肋片前端开槽后，部分流体可流入HSF的槽道，从而显著改善该区域流动滞止现象，进而减小流动阻力。同时，流体进入槽道后，可与槽道侧面进行热量交换，相当于增大了换热面积，使HSF总换热效果也优于AFF。
需要注意的是，以上描述只是本发明的优选示例而已，但本发明并不仅限于此，任何在本发明的精神和原则之内，所做的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (9)

1.一种开槽式流线肋型结构的换热板，其特征在于：包括由若干肋片组成的基板，所述各肋片上均开设有“人字形”流线槽，所述“人字形”流线槽为对称翼型结构。
2.如权利要求1所述的开槽式流线肋型结构的换热板，其特征在于：所述“人字形”流线槽的人字形宽度为其长度的15％～30％。
3.如权利要求1所述的开槽式流线肋型结构的换热板，其特征在于：所述“人字形”流线槽的人字形头部自来流方向开设在肋片前端。
4.如权利要求1所述的开槽式流线肋型结构的换热板，其特征在于：所述“人字形”流线槽前端为直通道，自中部分为两个分支通道，槽道整体呈对称的“人字形”布置。
5.如权利要求4所述的开槽式流线肋型结构的换热板，其特征在于：所述分支通道为曲线通道，其中心线与所述直通道的中心线在连接处相切。
6.如权利要求4所述的开槽式流线肋型结构的换热板，其特征在于：所述“人字形”流线槽的槽道宽度与肋肋片厚度之比为0.2～0.4。
7.如权利要求4所述的开槽式流线肋型结构的换热板，其特征在于：所述“人字形”流线槽的直通道部分与肋片长度之比为0.3～0.6。
8.如权利要求4所述的开槽式流线肋型结构的换热板，其特征在于：所述“人字形”流线槽的总长度与肋片长度之比范围为0.6～0.9。
9.如权利要求1所述的开槽式流线肋型结构的换热板，其特征在于：所述“人字形”流线槽采用化学蚀刻或机加工的方法开设在肋片上。
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CN107388854A (zh) * 2017-07-26 2017-11-24 西安交通大学 一种基于3d打印技术的新型印刷电路板式换热器
CN107687780A (zh) * 2017-08-05 2018-02-13 中国科学院工程热物理研究所 带有流线形肋结构的换热板及包含其的印刷电路板换热器
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CN114234704A (zh) * 2021-12-14 2022-03-25 中国科学院工程热物理研究所 翼型结构、换热板、换热器及换热方法
CN114234704B (zh) * 2021-12-14 2024-05-17 中国科学院工程热物理研究所 翼型结构、换热板、换热器及换热方法
CN114353564A (zh) * 2022-01-12 2022-04-15 西安交通大学 一种开槽纺锤形翅片印刷电路板换热器芯体
CN114353564B (zh) * 2022-01-12 2023-12-15 西安交通大学 一种开槽纺锤形翅片印刷电路板换热器芯体

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