CN109974495A - Equalizing plate structure manufacturing method - Google Patents
Equalizing plate structure manufacturing method Download PDFInfo
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- CN109974495A CN109974495A CN201910105496.1A CN201910105496A CN109974495A CN 109974495 A CN109974495 A CN 109974495A CN 201910105496 A CN201910105496 A CN 201910105496A CN 109974495 A CN109974495 A CN 109974495A
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- equalizing plate
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- 238000004519 manufacturing process Methods 0.000 title abstract description 32
- 238000001704 evaporation Methods 0.000 claims abstract description 23
- 239000012530 fluid Substances 0.000 claims abstract description 22
- 238000000034 method Methods 0.000 claims description 14
- 238000009833 condensation Methods 0.000 claims description 3
- 230000005494 condensation Effects 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 239000010802 sludge Substances 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 2
- 238000003754 machining Methods 0.000 abstract description 18
- 230000008020 evaporation Effects 0.000 abstract description 4
- 238000010276 construction Methods 0.000 abstract description 3
- 238000000465 moulding Methods 0.000 description 10
- 238000004049 embossing Methods 0.000 description 5
- 238000005242 forging Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 4
- 238000005245 sintering Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000005266 casting Methods 0.000 description 3
- 230000015271 coagulation Effects 0.000 description 3
- 238000005345 coagulation Methods 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- 238000000748 compression moulding Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000005187 foaming Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000010010 raising Methods 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000010025 steaming Methods 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000009841 combustion method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0283—Means for filling or sealing heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20936—Liquid coolant with phase change
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Shaping Metal By Deep-Drawing, Or The Like (AREA)
Abstract
The present invention provides a kind of equalizing plate structure, include: an ontology, a working fluid, the ontology has a condensing zone and an evaporating area and a chamber, the condensing zone and the evaporating area are divided into the two sides of the chamber, the evaporation part has a first side and a second side, and the first side has a protrusion；The working fluid is filled in aforementioned cavity, and is formed the protrusion as support construction and increase structural strength by the mode of machining and be used, and enables it that manufacturing cost can be greatly reduced.
Description
The application is a divisional application, and it is in July, 2013 that female case, which is application No. is the 201310284895.1, applying date,
8 days, the Chinese invention patent application of entitled " equalizing plate structure and its manufacturing method ".
Technical field
The invention belongs to a kind of equalizing plate structure and its manufacturing methods, more particularly to one kind, and manufacturing cost can be greatly reduced
Equalizing plate structure and its manufacturing method.
Background technique
With existing electronic equipment gradually using frivolous as the publicity bragged about, thus each item all must with minification,
But the size reduction of electronic equipment is adjoint and come the heat that generates, becomes the major obstacle of electronic equipment Yu system enhancement performance.Nothing
It is constantly reduced by the semiconductor dimensions for forming electronic component, still constantly requires to increase performance.
When semiconductor dimensions reduce, as a result heat flux increases, and heat flux increases the caused challenge that product is cooling and is more than
Only all the increase of heat may be led because the increase of heat flux causes to overheat in different time and different length size
Cause electronic failure or damage.
So those skilled in the art are to solve the problems, such as the above-mentioned prior art because heat-dissipating space is narrow, with a kind of VC
(Vapor chamber) Heat Sink is placed in above chip and uses as radiator, in order to increase capillary limitation, utilizes copper post
The capillary structures such as coating sintering, sintering column, foaming column are used to support as reflux road, but due to lower wall thickness on micro- temperature-uniforming plate
Relatively thin (1.5mm or less is applied), using this above-mentioned capillary structure as the conventional construction of support in applying on micro- temperature-uniforming plate, meeting
Micro- temperature-uniforming plate is caused to have the ground of copper post, sintering column or foaming column to have support just now, and the place that remaining is not provided with forms and collapses
Limit or recess, cause the integral planar degree of micro- equalizing plate structure to be unable to maintain that with intensity, therefore cannot achieve slimming.
When being generated evaporation by thermal domain by evaporation region, working fluid is converted to working fluid in above-mentioned temperature-uniforming plate by liquid
Steam state transforms into liquid by steam state condensation after the working fluid to the condenser zone of temperature-uniforming plate of steam state, then flows back into evaporating area
Domain continues cycling through, and the condenser zone of temperature-uniforming plate is usually shiny surface, or is the capillary structure aspect with sintering, steam state
Working fluid is after the condenser zone is condensed into liquid droplet shape, because the relationship of gravity or capillary structure makes reflowable extremely steaming
Region is sent out, but the structure of aforementioned known condenser zone is due to being to cause condensed liquid droplet that need to store up to certain in shiny surface
Volume hangs down according to gravity drip just now, causes its efficiency that flows back inadequate in fact, and because gaseous working fluid reflux rate is excessively slow, so that steaming
Fluid free in hair region and generate the state of dry combustion method, enable heat conduction efficiency be greatly reduced；If time for reinforcing working fluid
Stream efficiency then adds capillary structure then and is known indispensable structure, but this capillary structure (such as sintered body or grid) is set
The effect of setting, temperature-uniforming plate enabled to cannot achieve slimming.
Slimming hot plate, which mainly leads to overetched mode and opens up groove in the plate body, does capillary structure or in shape on plate body
At support construction, but since the shortcomings that etching is that precision is bad, and expends the time when processing, slimming hot plate or temperature-uniforming plate are enabled
Manufacturing cost can not reduce.
Summary of the invention
The present invention is to solve the disadvantage that the above-mentioned prior art, provides a kind of equalizing plate structure that can reduce manufacturing cost.
Another mesh of the invention it is to provide a kind of samming board fabrication method that temperature-uniforming plate manufacturing cost can be greatly reduced.
The present invention provides a kind of equalizing plate structure for the above-mentioned purpose, comprising: an ontology has a condensing zone and an evaporation
Area and a chamber, the condensing zone and the evaporating area are divided into the two sides of the chamber；One protrusion is selection by the evaporating area or cold
Any protrusion of coagulation zone is configured；One capillary structure is set to aforementioned cavity surface；One working fluid, is filled in aforementioned cavity
It is interior.
The protrusion has multiple convex bodys, and the convex body extends institute's structure from the evaporating area to the direction of the opposite evaporating area
At being corresponded at the periphery of the adjacent convex body of the ontology concave.
The protrusion has multiple convex bodys, and the convex body is to extend institute's structure from the condensing zone to the direction of the opposite condensing zone
At being corresponded at the periphery of the adjacent convex body of the ontology concave.
Before there is the ontology the corresponding lid merging of the first and second plate body described in one first plate body and one second plate body to define jointly
Chamber is stated, the condensing zone is set to the first plate body side, which is set to the second plate body side.
The ontology is a flat-shaped tube body.
The convex body has a free end, which is connected with the condensing zone, i.e., the described convex body and the condensation section
With aforementioned capillary structure.
The protrusion has multiple convex bodys, and the convex body is to extend institute's structure from the evaporating area to the direction of the opposite evaporating area
It is concave at being corresponded at, the ontology on the contrary other side of the convex body.
The protrusion has multiple convex bodys, and the convex body is to extend institute's structure from the condensing zone to the direction of the opposite condensing zone
It is concave at being corresponded at, the ontology on the contrary other side of the convex body.
The present invention provides a kind of equalizing plate structure manufacturing method for the above-mentioned purpose, is to comprise the steps of offer one the
One plate body and one second plate body；It is selected by way of machining in any molding at least one of aforementioned first and second plate body
Convex body；The corresponding lid of first and second plate body is closed, it is all around closed to and is vacuumized and inserted the operation of working fluid.
A kind of equalizing plate structure manufacturing method comprises the steps of and provides one first plate body and one second plate body；Pass through machine
The mode of tool processing is selected in any molding at least convex body of aforementioned first and second plate body；By the corresponding lid of the first and second plate body
It closes, it is all around closed to and is vacuumized and inserted the operation of working fluid.
It is described machining be selected as punch process or embossing processing or forging processing rolling roll over processing or marking processing or
Casting processing is any.
It is described selected by way of machining in any molding at least convex body of aforementioned first and second plate body this one
A step is had more after step, forms capillary structure in the corresponding side of first and second plate body.
The present invention provides a kind of equalizing plate structure manufacturing method, comprises the steps of and provides a flat tube body；Pass through machinery
The mode of processing is convex not in light-emitting diode body interior side molding at least one；It is the tube body is closed at both ends and vacuumized and inserted
The operation of working fluid.
It is described to be had more after light-emitting diode body interior side forms this step of an at least convex body by way of machining
There is a step to form a capillary structure in the tubular body.
The machining is selected to punch process or embossing processing or forging processing or processing or marking processing are rolled in rolling
Or casting processing is any.
The manufacturing cost of temperature-uniforming plate can be greatly reduced through the invention, and can further promote accuracy of manufacture person.
Detailed description of the invention
Fig. 1 is the stereogram exploded view of equalizing plate structure first embodiment of the present invention；
Fig. 2 is the three-dimensional combination figure of equalizing plate structure first embodiment of the present invention；
Fig. 3 is the cross-sectional view of equalizing plate structure first embodiment of the present invention；
Fig. 4 is the cross-sectional view of equalizing plate structure second embodiment of the present invention；
Fig. 5 is the cross-sectional view of equalizing plate structure 3rd embodiment of the present invention；
Fig. 6 is the cross-sectional view of equalizing plate structure fourth embodiment of the present invention；
Fig. 7 is the step flow chart of equalizing plate structure manufacturing method first embodiment of the present invention；
Fig. 8 is the step flow chart of equalizing plate structure manufacturing method second embodiment of the present invention；
Fig. 9 is the step flow chart of equalizing plate structure manufacturing method 3rd embodiment of the present invention；
Figure 10 is the step flow chart of equalizing plate structure manufacturing method fourth embodiment of the present invention.
[symbol description]
Ontology 11
First plate body lla
Second plate body llb
Protrusion 11l
Convex body 1111
Free end 11lla
Capillary structure 2
Working fluid 3
Condensing zone 112
Evaporating area 113
Chamber 114
Specific embodiment
Present invention is further described in detail with reference to the accompanying drawings and detailed description:
Above-mentioned purpose and its structure of the invention and characteristic functionally, the preferred embodiment according to institute's accompanying drawings is given
Explanation.
Fig. 1, Fig. 2, Fig. 3 are please referred to, for the stereo decomposing of equalizing plate structure first embodiment of the present invention and combination and section view
Figure, as shown, the equalizing plate structure, is to include: an ontology 11, a protrusion 111, a capillary structure 2, a working fluid 3；
The ontology 11 has a condensing zone 112 and an evaporating area 113 and a chamber 114, and the ontology 11 has more
The corresponding lid of first and second plate body 11a, 11b described in one first plate body lla and one second plate body llb merges defines aforementioned cavity jointly
114, the condensing zone 112 is set to the side the first plate body lla, which is set to the side the second plate body 11b, i.e. institute
It states condensing zone 112 and the evaporating area 113 is divided into two sides and the reciprocal correspondence of the chamber 114.
111 system of protrusion selection is any or both (evaporating area 113, cold by the evaporating area 113 or condensing zone 112
Coagulation zone 112) all protrusions are configured, and the embodiment of the present invention protrusion 111 is with multiple convex bodys 1111, and 1111 system of convex body is by this
Evaporating area 113 extends to the direction of the opposite evaporating area 113 to be constituted, and the convex body 1111 has a free end 11lla, should be certainly
It being connect by end 11lla with aforementioned condensing zone 112, system corresponds to concave at the periphery of the adjacent convex body 1111 of the ontology 11, this
1111 system of the convex body of embodiment is by pressing sludge ice method to be formed, therefore another side-line of the convex body 1111 is in flat condition.
The capillary structure 2 is set to 114 surface of aforementioned cavity, i.e., before having between the described convex body 1111 and the condensing zone 112
Capillary structure 2 is stated, which is filled in aforementioned cavity 114.
Referring to Fig. 4, be for the cross-sectional view of equalizing plate structure second embodiment of the present invention, as shown, the present embodiment with
Aforementioned first embodiment part-structure technical characteristic is identical, therefore will not be described in great detail herein, only this example and aforementioned first embodiment
Not exist together be for the opposite other side of multiple convex bodys 1111 of the evaporating area 113 be concave.
Referring to Fig. 5, be equalizing plate structure 3rd embodiment of the present invention cross-sectional view, as shown, the present embodiment system and
Aforementioned first embodiment part-structure technical characteristic is identical, therefore will not be described in great detail herein, only this example and aforementioned first embodiment
Not exist together be to have multiple convex bodys 1111 for the protrusion 111, the convex body 1111 is that this is cold from the condensing zone 112 to opposite
The direction of coagulation zone 112, which extends, to be constituted, and is corresponded at the periphery of the adjacent convex body 1111 of the ontology 11 concave.
Referring to Fig. 6, be equalizing plate structure fourth embodiment of the present invention cross-sectional view, as shown, the present embodiment be with
Aforementioned first, second and third embodiment part-structure technical characteristic is identical, therefore will not be described in great detail herein, only this example with aforementioned first,
Two, not existing together for 11 system of ontology for three embodiments is a flat-shaped tube body.
Referring to Fig. 7, be equalizing plate structure manufacturing method first embodiment of the present invention step flow chart, and together refering to
Aforementioned FIG. 1 to FIG. 6, as shown, the equalizing plate structure manufacturing method, comprises the steps of
S1: one first plate body and one second plate body are provided；
One first plate body 11a is provided and one second plate body llb, described first and second plate body lla, llb be for thermal conductive property compared with
Good material, such as copper or aluminium material.
S2: it is selected by way of machining in any molding at least convex body of aforementioned first and second plate body；
Being selected in a manner of machining in any upper molding at least one of aforementioned first and second plate body 11a, 11b
Convex body 1111, the machining may be selected to be punch process or embossing processing or forging processing is any, and the punching press adds
Work also may be selected by press sludge ice method or compression moulding or raising method it is any in a manner of form the convex body.
S3: the corresponding lid of the first and second plate body is closed, it is all around closed to and is vacuumized and inserted the work of working fluid
Industry.
The corresponding lid of first and second plate body 11a, 11b is closed after convex body 1111 will be formed by machining, and by this first,
Two plate body lla, llb by weld or diffusion bonding in a manner of closed, and vacuumized and inserted working fluid 3 etc. and made
Industry.Referring to Fig. 8, be the step flow chart of equalizing plate structure manufacturing method second embodiment of the present invention, and together refering to the 1st~
6 figures, as shown, the equalizing plate structure manufacturing method, comprises the steps of
S1: one first plate body and one second plate body are provided；
S2: it is selected by way of machining in any molding at least convex body of aforementioned first and second plate body；
S3: the corresponding lid of the first and second plate body is closed, it is all around closed to and is vacuumized and inserted the work of working fluid
Industry.
The present embodiment part steps are identical as aforementioned first embodiment, therefore will not be described in great detail herein, and only the present embodiment is with before
Stating not existing together for first embodiment is for the step S2: selected by way of machining in aforementioned first and second plate body its
In a step S4 is had more after any this step of a molding at least convex body:.
The capillary structure 2 sintered powder structure can be selected be placed in grid body or open up the mode of groove in this first,
In addition capillary structure 2 is arranged in two plate body 11a, 11b.
Referring to Fig. 9, be equalizing plate structure manufacturing method 3rd embodiment of the present invention step flow chart, and together refering to
1st~6 figure, as shown, the equalizing plate structure manufacturing method, comprises the steps of
A1: a flat tube body is provided；
The flat tube body that at least one end is open shape is provided.
A2: an at least convex body is formed in light-emitting diode body interior side by way of machining；
Selecting to form an at least convex body 1111, the machinery in light-emitting diode body interior side in a manner of machining
Processing is to may be selected to be punch process or embossing processing or forging processing is any, and the punch process also may be selected floating to press
Flower method or compression moulding or any mode of raising method form convex body l111.
A3: the tube body is closed at both ends and vacuumized and inserted the operation of working fluid.
It will be in one end of open shape by the flat tube body after machining molding convex body to weld or the side of diffusion bonding
Formula is closed, and is vacuumized and inserted the operations such as working fluid.
Referring to Fig. 10, being the step flow chart of equalizing plate structure manufacturing method fourth embodiment of the present invention, and join together
FIG. 1 to FIG. 6 is read, as shown, the equalizing plate structure manufacturing method, comprises the steps of
A1: a flat tube body is provided；
A2: an at least convex body is formed in light-emitting diode body interior side by way of machining；
A3: the tube body is closed at both ends and vacuumized and inserted the operation of working fluid.
The present embodiment part steps system is identical as aforementioned third embodiment, therefore will not be described in great detail herein, only the present embodiment with
Not existing together for aforementioned first embodiment is for step A2: by way of machining at least in the molding of light-emitting diode body interior side
A step A4 is had more after this step of one convex body: forming a capillary structure 2 in the tubular body, the capillary structure 2 is optional
With sintered powder structure or it is placed in grid body or opens up the mode of groove in the tubular body in addition capillary structure 2 is set.
Machining described in above embodiments may be selected to be punch process or embossing processing or forging processing or rolling
It rolles over processing or marking processing or casting processing is any.
Equalizing plate structure and its manufacturing method through the invention can further provide for one kind can save manufacturing man-hours and
Promote the equalizing plate structure and manufacturing method of the accuracy of manufacture.
Claims (7)
1. a kind of equalizing plate structure, characterized by comprising:
There is one ontology a condensing zone and an evaporating area and a chamber, the condensing zone and the evaporating area to be divided into the chamber
Two sides, the ontology have one first plate body and one second plate body, and the corresponding lid merging of first and second plate body is defined aforementioned jointly
Chamber, the condensing zone are set to the first plate body side, which is set to the second plate body side；
One protrusion, the protrusion have plural convex body, which is extended from the condensing zone to the direction of the opposite condensing zone
It is constituted, the plural number convex body is by pressing sludge ice method to be formed, therefore the other side of the plural number convex body is in flat condition, and the ontology is adjacent should
It is corresponded at the periphery of plural convex body concave；
One first capillary structure, first capillary structure are set to the chamber surfaces of aforementioned second plate body, which supports
First capillary structure；
One working fluid, is filled in aforementioned cavity.
2. equalizing plate structure according to claim 1, which is characterized in that the ontology is a flat-shaped tube body.
3. equalizing plate structure according to claim 1, which is characterized in that the convex body has a free end, the plural number convex body
There is aforementioned capillary structure with the condensation section, which is not provided with capillary structure.
4. equalizing plate structure according to claim 1, which is characterized in that the protrusion has plural convex body, and the ontology is opposite
It is corresponded at the other side of the plural number convex body concave.
5. equalizing plate structure according to claim 1, which is characterized in that at the other side of the opposite plural number convex body of the ontology pair
It answers concave.
6. equalizing plate structure according to claim 1, which is characterized in that also have one second capillary structure, described second mao
Fine texture avoids the chamber surfaces that the plural number convex body is set to aforementioned first plate body.
7. equalizing plate structure according to claim 6, which is characterized in that also there is an at least third capillary structure, being set to should
Between first and second capillary structure, first, second and third capillary structure is groove, mesh, sintered powder, corpus fibrosum, wave
Plate is any.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910105496.1A CN109974495A (en) | 2013-07-08 | 2013-07-08 | Equalizing plate structure manufacturing method |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910105496.1A CN109974495A (en) | 2013-07-08 | 2013-07-08 | Equalizing plate structure manufacturing method |
| CN201310284895.1A CN104279899A (en) | 2013-07-08 | 2013-07-08 | Uniform temperature plate structure and manufacturing method thereof |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310284895.1A Division CN104279899A (en) | 2013-07-08 | 2013-07-08 | Uniform temperature plate structure and manufacturing method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN109974495A true CN109974495A (en) | 2019-07-05 |
Family
ID=52255033
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910105068.9A Pending CN109974494A (en) | 2013-07-08 | 2013-07-08 | Equalizing plate structure manufacturing method |
| CN201910105496.1A Pending CN109974495A (en) | 2013-07-08 | 2013-07-08 | Equalizing plate structure manufacturing method |
| CN201710222607.8A Pending CN107289800A (en) | 2013-07-08 | 2013-07-08 | Equalizing plate structure and its manufacture method |
| CN201310284895.1A Pending CN104279899A (en) | 2013-07-08 | 2013-07-08 | Uniform temperature plate structure and manufacturing method thereof |
| CN201910841706.3A Pending CN110567303A (en) | 2013-07-08 | 2013-07-08 | Temperature-equalizing plate structure with convex part and manufacturing method thereof |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910105068.9A Pending CN109974494A (en) | 2013-07-08 | 2013-07-08 | Equalizing plate structure manufacturing method |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710222607.8A Pending CN107289800A (en) | 2013-07-08 | 2013-07-08 | Equalizing plate structure and its manufacture method |
| CN201310284895.1A Pending CN104279899A (en) | 2013-07-08 | 2013-07-08 | Uniform temperature plate structure and manufacturing method thereof |
| CN201910841706.3A Pending CN110567303A (en) | 2013-07-08 | 2013-07-08 | Temperature-equalizing plate structure with convex part and manufacturing method thereof |
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Cited By (1)
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| CN112888267A (en) * | 2021-02-05 | 2021-06-01 | 华南理工大学 | Ultrathin flexible vapor chamber and manufacturing method |
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| CN107782187A (en) * | 2016-08-31 | 2018-03-09 | 浙江嘉熙科技有限公司 | Two-sided flat phase transformation suppresses heat sink and its manufacture method |
| CN107809880A (en) * | 2017-06-13 | 2018-03-16 | 奇鋐科技股份有限公司 | The manufacture method of heat-sink unit |
| CN107231780A (en) * | 2017-06-13 | 2017-10-03 | 奇鋐科技股份有限公司 | Heat abstractor and its manufacture method |
| CN109891178A (en) * | 2017-09-19 | 2019-06-14 | 华为技术有限公司 | The slim soaking plate formed by Sheet Metal Forming Technology |
| US10746479B2 (en) * | 2018-02-09 | 2020-08-18 | General Electric Company | Additively manufactured structures for thermal and/or mechanical systems, and methods for manufacturing the structures |
| CN111050523B (en) * | 2018-10-12 | 2022-03-15 | 宏达国际电子股份有限公司 | Thermal transfer module and method of manufacturing the same |
| CN110285699A (en) * | 2019-07-26 | 2019-09-27 | 联德精密材料（中国）股份有限公司 | A kind of compound temperature-uniforming plate and its manufacturing method |
| CN112444151B (en) * | 2019-09-03 | 2022-01-11 | 广州力及热管理科技有限公司 | Metal oxide slurry for manufacturing capillary structure of uniform temperature plate element |
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Also Published As
| Publication number | Publication date |
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| CN107289800A (en) | 2017-10-24 |
| CN104279899A (en) | 2015-01-14 |
| CN110567303A (en) | 2019-12-13 |
| CN109974494A (en) | 2019-07-05 |
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