CN109959307B - Explosive foil integrated chip based on low-temperature co-fired ceramic and preparation process thereof - Google Patents
Explosive foil integrated chip based on low-temperature co-fired ceramic and preparation process thereof Download PDFInfo
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- CN109959307B CN109959307B CN201711418447.0A CN201711418447A CN109959307B CN 109959307 B CN109959307 B CN 109959307B CN 201711418447 A CN201711418447 A CN 201711418447A CN 109959307 B CN109959307 B CN 109959307B
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F42—AMMUNITION; BLASTING
- F42B—EXPLOSIVE CHARGES, e.g. FOR BLASTING, FIREWORKS, AMMUNITION
- F42B3/00—Blasting cartridges, i.e. case and explosive
- F42B3/10—Initiators therefor
- F42B3/12—Bridge initiators
- F42B3/121—Initiators with incorporated integrated circuit
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F42—AMMUNITION; BLASTING
- F42B—EXPLOSIVE CHARGES, e.g. FOR BLASTING, FIREWORKS, AMMUNITION
- F42B3/00—Blasting cartridges, i.e. case and explosive
- F42B3/10—Initiators therefor
- F42B3/12—Bridge initiators
- F42B3/124—Bridge initiators characterised by the configuration or material of the bridge
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F42—AMMUNITION; BLASTING
- F42B—EXPLOSIVE CHARGES, e.g. FOR BLASTING, FIREWORKS, AMMUNITION
- F42B3/00—Blasting cartridges, i.e. case and explosive
- F42B3/10—Initiators therefor
- F42B3/195—Manufacture
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Abstract
The invention discloses an explosive foil integrated chip based on low-temperature co-fired ceramic and a preparation process thereof. The exploding foil integrated chip comprises: the explosive-charging device comprises a ceramic substrate, a metal layer, a flying sheet layer, an accelerating chamber, a charging groove and an explosive column, and further comprises metal through holes and slurry in the ceramic substrate, a pad area on the back, a Pd/Ag layer and other structures which are convenient to connect with other parts. The ceramic substrate is used as a reflecting back plate in the integrated chip; the metal layer comprises a bridge region, a transition region and a conduction band; the flyer layer comprises a ceramic flyer formed by integrally sintering a raw porcelain strip and a Parylene C/W-Ti/Cu composite flyer; the acceleration chamber is used for providing an acceleration space for the flyer; the charge slots provide precise positioning for the placement of the charge. Compared with the prior art, the invention has the advantages that the low-temperature co-fired ceramic technology is utilized to ensure that the exploding foil initiator has higher integration degree and smaller volume, can realize batch production, improves the consistency of products and greatly reduces the cost.
Description
Technical Field
The invention relates to the technical field of low-energy micro ignition and initiation devices, in particular to an explosive foil integrated chip based on low-temperature co-fired ceramic and a preparation process thereof.
Background
The concept of Exploding Foil Initiator Systems (EFIs) was proposed by the lawrence liphor laboratory in the 20 th century in the 60's, also known as in-line safety initiation systems, which consist of a pulsed power unit and an Exploding Foil Initiator unit. The former mainly comprises a control circuit, a boosting module, a high-voltage capacitor, a high-voltage switch and the like, provides energy required by metal electric explosion for an exploding foil initiator unit, gives an ignition instruction, and conducts a loop through the high-voltage switch; the latter mainly comprises a back plate, an exploding foil, a flying sheet, an accelerating chamber and a insensitive explosive, wherein the flying sheet is sheared through metal electric explosion, and reaches a certain speed through the accelerating chamber, so as to impact an initiating explosive column. Due to the structural characteristics of the exploding foil initiator system, such as no sensitive explosive, no direct contact between the bridge foil and the explosive, the system can adapt to extreme environments such as static electricity, radio frequency, electromagnetism and the like, and has higher safety, the exploding foil initiator system draws wide attention of researchers in various countries.
With the development of the MEMS technology, the low energy, miniaturization and low cost of the detonation system become a mainstream trend, and how to combine the exploding foil initiator system with a new technology and a new technology becomes a problem to be solved urgently.
Early exploding foil initiator units were assembled from discrete mechanical components, e.g. the back plate was made of sapphire, alumina ceramic, etc.; the metal bridge foil is coated on the ceramic substrate in a sputtering mode; the acceleration chamber is made of materials such as sapphire and stainless steel; the flyer is pasted on the bridge foil by adopting a polyimide film. The manual or mechanical alignment installation mode is easy to generate dislocation, so that the exploding foil initiator unit has low energy utilization efficiency and unreliable function. In addition, the conventional exploding foil initiator unit is structurally bulky, has high ignition energy, and is also difficult to miniaturize.
Disclosure of Invention
The invention aims to provide an explosive foil integrated chip unit based on low-temperature co-fired ceramic and a preparation method thereof, which have small volume and reliable function.
The technical solution for realizing the invention is as follows: an explosive foil integrated chip based on low-temperature co-fired ceramic is disclosed, the structure of the explosive foil integrated chip comprises a ceramic substrate, a metal layer, a flying sheet layer, a ceramic accelerating chamber, a charging groove and explosive columns, and also comprises metal through holes and slurry in the ceramic substrate, a pad area on the back, a Pd/Ag layer and other structures which are convenient to be connected with other parts; the ceramic substrate is used as a reflecting back plate, and the plasma generated by electric explosion moves upwards to shear the flying plate; the metal layer is sintered on the ceramic substrate and comprises a bridge area, a transition area and a conduction band, and the bridge area is an explosive foil; the transition region refers to a region between the bridge region and the conduction band, which is narrowed by a width; the ceramic acceleration chamber provides an acceleration space for the flyer layer; the explosive loading groove provides accurate positioning for explosive column placement.
Furthermore, the metal layer comprises various metal pastes of Au and Ag which are suitable for low-temperature co-fired ceramics; the explosive column adopts hexanitrostilbene HNS-IV, and the maximum density of the explosive column is 1.74g/cm390% -95%.
Further, the flyer layer is divided into two types: one is to take a raw porcelain band as a ceramic flying piece; the other is a Parylene C layer and a metal W-Ti/Cu layer which are used as the polymer-metal composite flyer.
Further, when the Parylene C layer is adopted as the flyer layer, a thin film is formed by thermal decomposition, cooling and repolymerization of the dimer raw material in a chemical vapor deposition mode and is deposited on a bridge area in the acceleration chamber; and the metal W-Ti/Cu layers are sequentially formed into films in a magnetron sputtering mode.
The preparation process of the low-temperature co-fired ceramic explosive foil integrated chip unit comprises the following specific steps,
firstly, directly using a raw porcelain band as a ceramic substrate and a flier layer, and manufacturing apertures required by an acceleration chamber and a medicine loading groove in a laser drilling mode;
secondly, manufacturing a metal layer and a pad area by utilizing a conductor paste printing process;
thirdly, connecting the front conduction band and the back pad area of the ceramic substrate in a micropore grouting mode;
fourthly, stacking each raw ceramic tape-metal unit layer by layer in the order of the ceramic substrate, the metal layer, the flier layer, the acceleration chamber and the explosive loading groove, aligning the positions of the raw ceramic tape-metal units, and then pressing;
fifthly, sintering at 900 ℃;
and sixthly, scribing after the temperature is cooled down, and separating the whole wafer into independent exploding foil units.
Furthermore, the thickness of the ceramic substrate, the accelerating chamber and the explosive loading groove is realized by overlapping the green ceramic tapes.
Furthermore, the metal in the bridge area can not be too thick, and is printed separately and then connected with the transition area in an overlapping mode.
Furthermore, the flying piece is formed by integrally sintering a green ceramic tape with the thickness of 50 mu m and an explosive foil integrated chip.
Furthermore, the number of the through holes in the ceramic substrate is not less than 5, so that the passing of large current is ensured; the material of the slurry in the through hole is Ag or Au.
Further, a Pd/Ag layer is required on the back pad region to ensure bonding with an external device.
Compared with the prior art, the invention has the advantages that: (1) the invention utilizes the low-temperature co-fired ceramic to ensure that the integration degree of the exploding foil initiator is higher, the volume is smaller, the batch production can be realized, the product consistency is improved, and the cost is reduced; (2) the miniaturization and integration of the exploding foil detonating unit of the invention enable the circuit to be shorter, the ignition energy to be reduced and the energy utilization rate to be improved; (3) the in-situ processing technology of the low-temperature co-fired ceramic solves the alignment problem of the traditional acceleration chamber and improves the product rate; (4) the invention takes the green ceramic tape as the ceramic flying piece, thereby greatly reducing the manufacturing complexity of the exploding foil initiator; (5) the invention adopts the post-positioned polymer-metal composite flyer, which is beneficial to the test of flyer speed in the experimental stage, improves the rigidity of the flyer and is beneficial to the impact detonation of explosives.
Drawings
FIG. 1 is a perspective view of an exploded foil integrated chip;
FIG. 2 is a top view of an exploded foil integrated chip;
FIG. 3-a is a cross-sectional view of an exploded foil integrated chip A-A based on ceramic flyer, and FIG. 3-b is a cross-sectional view of an exploded foil integrated chip A-A based on parylene/W-Ti/Cu composite flyer;
FIG. 4-a is an exploded view of an exploded foil integrated chip based on ceramic flyer, and FIG. 4-b is an exploded view of an exploded foil integrated chip based on parylene/W-Ti/Cu composite flyer;
FIG. 5 is a schematic view of a metal layer;
FIG. 6 is a perspective view of a low temperature co-fired ceramic based exploding foil initiator;
FIG. 7 is a top view of a low temperature co-fired ceramic based exploding foil initiator;
FIG. 8 is a B-B cross-sectional view of a low temperature co-fired ceramic based exploding foil initiator;
fig. 9 is a graph of the effect of an integrated chip in a low temperature co-fired ceramic based exploding foil initiator before and after explosion.
Wherein, 1 is a ceramic substrate, 2 is a metal layer (2-a is a bridge area, 2-b is a transition area, 2-C is a conduction band), 3 is a flying chip layer (3-a is a Parylene C, 3-b is a W-Ti/Cu layer), 4 is an acceleration chamber, 5 is a charging groove, 6 is a explosive column, 7 is a metal via hole and slurry, 8 is a pad area, 9 is Pd/Ag, 10 is a copper strip coated with polyimide, 11 is a cap shell, 12 is a bottom shell, and 13 is epoxy resin glue.
Detailed Description
The invention is described in further detail below with reference to the figures and examples.
With reference to fig. 1 to 5, the explosive foil integrated chip unit according to the present invention includes a ceramic substrate 1, a metal layer 2, a flying chip layer 3, a ceramic acceleration chamber 4, a charge slot 5, and an explosive column 6, and further includes a metal via 7-a, a paste 7-b, a pad region 8 on the back, and a Pd/Ag layer 9 in the ceramic substrate 1, which are convenient for connection with other parts. The metal layer 2 is arranged on the ceramic substrate 1, the metal layer 2 comprises a bridge region 2-a, a transition region 2-b and a conduction band 2-c, and the transition region 2-b is a region from the conduction band 2-c to the bridge region 2-a and is narrowed by width; the flyer layer 3 is divided into two types, one is a ceramic flyer with a raw porcelain band, and the other is a polymer-metal composite flyer with a Parylene C layer 3-a and a metal W-Ti/Cu layer 3-b; the acceleration chamber 4 is arranged on the ceramic flying sheet layer 3 or the metal layer 2, and the center of the acceleration chamber is aligned with the center of the bridge area 2-a; the medicine loading groove 5 is arranged above the accelerating chamber 4, and the center of the medicine loading groove is coincided and aligned with the center of the accelerating chamber; the pad area 8 is arranged on the back of the ceramic substrate 1, and the Pd/Ag layer 9 covers under the pad area 8 and is connected with an external loop; the conduction band 2-c is connected with the pad region 8 through the via hole 7-a and the paste 7-b in the via hole; the Parylene C layer 3-a is coated on the bridge area 2-a in the accelerating chamber 4 in a chemical vapor deposition mode, and the metal W-Ti/Cu layer 3-b is deposited on the Parylene C layer 3-a in a magnetron sputtering film forming mode; the explosive column 6 is placed in the explosive charging groove 5.
The exploding foil integrated chip unit is mainly prepared by low-temperature co-firing ceramic. The low-temperature co-fired ceramic technology is characterized in that a green ceramic tape is used as a circuit substrate material, required circuit patterns are manufactured on the green ceramic tape by utilizing the processes of laser drilling, micropore grouting, precise conductor paste printing and the like, and then the green ceramic tape is laminated together and sintered at the temperature of 900 ℃ to manufacture a three-dimensional circuit network. The preparation process of the integrated chip unit is as follows:
the method comprises the following steps that firstly, a laser drilling mode is utilized to drill a green porcelain strip, a metal through hole 7-a, an accelerating chamber 4 and a medicine loading groove 5 are sequentially made, and different height requirements are met by accumulating the green porcelain strips layer by layer;
secondly, selecting a 50-micron green porcelain tape as a ceramic flying piece;
thirdly, manufacturing the metal layer 2 and the pad area 8 on the back of the ceramic substrate 1 by using a conductor paste printing process, wherein the bridge area 2-a is required to be printed separately due to special requirements, and the bridge area and the transition area 2-b are overlapped;
fourthly, filling slurry 7-b into the metal via hole 7-a in the ceramic substrate 1;
fifthly, stacking each raw ceramic band-metal unit layer by layer in the sequence of the ceramic substrate 1, the metal layer 2, the acceleration chamber 4 and the medicine loading groove 5, aligning the raw ceramic bands and the metal units in position, and then pressing;
sixthly, sintering at 900 ℃;
and seventhly, scribing into independent units.
And finishing the manufacture of the explosive foil integrated chip based on the ceramic flying chip.
For the explosive foil integrated chip based on the Parylene C/W-Ti/Cu composite flyer, the second step can be omitted, and after the sixth step of high-temperature sintering, the following steps are also included:
depositing the Parylene C layer 3-a on the bridge area 2-a in the accelerating chamber 4 by using a chemical vapor deposition film forming method, wherein the place which does not need to be deposited can be protected by using an adhesive tape, and then removing the Parylene C layer 3-a after the deposition is finished; and growing a W-Ti/Cu layer 3-b on the Parylene C layer 3-a by utilizing a magnetron sputtering film forming method to serve as a second layer flyer.
Examples
In this embodiment, an exploding foil initiator is designed on the basis of an exploding foil integrated chip unit, and with reference to fig. 1 to 5, the exploding foil integrated chip unit includes a ceramic substrate 1, a metal Au layer 2, a Parylene C layer 3-a, a metal W-Ti/Cu layer 3-b, an acceleration chamber 4, a charge tank 5, and an explosive column 6, and further includes structures such as a metal via 7-a in the ceramic substrate 1, a paste 7-b, a pad region 8 on the back, and a Pd/Ag layer 9, which are convenient for connection with other parts. The ceramic substrate 1 is used as a back plate in an explosive foil integrated chip, the length, the width and the height of the ceramic substrate 1 are respectively 11mm multiplied by 7mm multiplied by 1mm, the metal Au layer 2 is arranged on the ceramic substrate 1 and has the thickness of 6-10 mu m, the metal Au layer 2 comprises a bridge region 2-a, a transition region 2-b and a conduction band 2-c, the bridge region 2-a is the part with the smallest cross section area in the metal Au layer 2, the area of the bridge region is 0.4mm multiplied by 0.4mm, the conduction band 2-c is the widest part in the metal Au layer 2, the width of the conduction band is 5mm, the transition region 2-b is the region between the bridge region 2-a and the conduction band 2-c, and the included angle between the bridge region 2-a and the transition region 2-b is 135 degrees; the accelerating chamber 4 is arranged above the metal Au layer 2, the size of the accelerating chamber 4 is phi 0.6mm multiplied by 0.4mm, and the center of the accelerating chamber is aligned with the center of the bridge area 2-a; the medicine loading groove 5 is arranged above the accelerating chamber 4, the size is phi 4mm multiplied by 0.5mm, and the center of the medicine loading groove is coincided and aligned with the center of the accelerating chamber 5; the pad area 8 is arranged on the back of the ceramic substrate 1, the thickness of the pad area is 6-10 mm, and the Pd/Ag layer 9 covers the pad area 8 and is connected with other external elements; the conduction band 5 is connected with the pad region 8 through the via hole 7-a and the paste 7-b in the via hole; the Parylene C layer 3-a is coated on the bridge area 2-a in the accelerating chamber 4 by means of chemical vapor deposition, and the deposition thickness is 25 mu m; the W-Ti/Cu layer 3-b is deposited on the Parylene C layer 3-a in a magnetron sputtering film forming mode, and the thicknesses of the W-Ti/Cu layer 3-b and the Parylene C layer 3-a are 100nm/2 mu m respectively; the explosive column 6 has the size phi of 4mm multiplied by 3mm and is arranged in the explosive loading groove 5.
The exploding foil integrated chip unit is mainly prepared by low-temperature co-firing ceramic, and simultaneously integrates chemical vapor deposition, magnetron sputtering, stripping process and the like, and the preparation process comprises the following steps:
the method comprises the following steps that firstly, a laser drilling mode is utilized to drill a green porcelain band, a metal through hole 7-a, an accelerating chamber 4 and a medicine loading groove 5 are sequentially made, the green porcelain band is accumulated layer by layer according to the height requirement, and 10 layers, 4 layers and 5 layers are respectively needed when the green porcelain band is 100 microns thick;
secondly, manufacturing a metal Au layer 2 and a pad area 8 on the back of the ceramic substrate 1 by using a conductor paste printing process, wherein the bridge area 2-a part needs to be printed independently because of special requirements, and the bridge area and the transition area 2-b adopt a lap joint mode;
thirdly, filling slurry 7-b into the via hole 7-a in the ceramic substrate;
fourthly, stacking each raw ceramic band-metal unit layer by layer in the sequence of the ceramic substrate 1, the metal Au layer 2, the accelerating chamber 4 and the medicine loading groove 5, aligning the positions of the raw ceramic bands-metal units, and then pressing;
fifthly, sintering at 900 ℃;
sixthly, depositing a Parylene C layer 3-a on the bridge area 2-a in the accelerating chamber 4 by using a chemical vapor deposition film forming method, wherein the thickness of the Parylene C layer 3-a is 25 mu m, the place which does not need to be deposited can be protected by using an adhesive tape, and the Parylene C layer 3-a is removed after being deposited;
seventhly, growing a W-Ti/Cu layer 3-b on the Parylene C layer 3-a by using a magnetron sputtering film forming method, wherein the sputtering thickness is 100nm/2 mu m and the W-Ti/Cu layer is used as a second layer of flying sheet;
eighthly, adopting hexanitrostilbene HNS-IV as the explosive column 6, wherein the charging density is the theoretical maximum density of 1.74g/cm390% -95%.
On the basis, the foil explosion integrated chip is subjected to chip packaging to prepare the foil explosion initiator, as shown in fig. 6, 7 and 8. Welding a pad area 8 on the back of the chip by adopting a flat cable three-layer polyimide-sandwiched two-layer copper strip 10, and extending a lead; the top shell 11 and the bottom shell 12 are processed by kovar alloy, the kovar alloy is packaged along the appearance of the chip, epoxy resin glue 13 is filled in the gap at the back of the chip, and the top shell 11 and the bottom shell 12 are welded well by argon arc welding. And connecting the exploding foil initiator with an external pulse power unit, and carrying out safety test on the exploding foil initiator. Preliminary studies show that under the condition of electrifying 500V, the explosive is not detonated, and the flyer is not cut out through observing the appearance of the flyer. Under the conditions that the high-voltage ceramic capacitor of the main loop is 0.22 muF and the pressure is 1800V, the bridge foil is quickly vaporized and forms plasma, the Parylene C/W-Ti/Cu composite flyer is cut, and the hexanitrostilbene is smoothly initiated. As shown in figure 9 before and after the detonation of the exploding foil integrated chip, after the HNS-IV explosive column is detonated, a pit with the diameter of 8mm is left on the aluminum identification block, and the chip does not exist any more.
Claims (7)
1. A preparation process of an explosive foil integrated chip of low-temperature co-fired ceramic comprises a ceramic substrate (1), a metal layer (2), a flying chip layer (3), a ceramic acceleration chamber (4), a charge tank (5) and a explosive column (6), and further comprises a metal via hole (7-a) and slurry (7-b) in the ceramic substrate (1), a pad area (8) and a Pd/Ag layer (9) on the back, wherein the ceramic substrate (1) is used as a reflection back plate, and plasma generated by electric explosion moves upwards to shear the flying chip layer (3); the metal layer (2) is sintered on the ceramic substrate (1) and comprises a bridge region (2-a), a transition region (2-b) and a conduction band (2-c), and the bridge region (2-a) is an explosive foil; the transition region (2-b) refers to a region between the bridge region (2-a) and the conduction band (2-c) which is narrowed by a width; the ceramic acceleration chamber (4) provides an acceleration space for the flyer layer (3); the explosive charging groove (5) provides accurate positioning for placing the explosive column (6); the method is characterized in that: the process comprises the following specific steps of,
firstly, directly using a raw ceramic tape as a ceramic substrate (1) and a flying chip layer (3), and manufacturing apertures required by an acceleration chamber (4) and a charging groove (5) in a laser drilling mode;
secondly, manufacturing a metal layer (2) and a pad area (8) on the back by using a conductor paste printing process;
thirdly, connecting a front conduction band (2-c) of the ceramic substrate with a pad area (8) on the back by using a micropore grouting mode;
fourthly, stacking the ceramic substrate (1), the metal layer (2), the flier layer (3), the acceleration chamber (4) and the medicine loading groove (5) layer by layer in sequence, aligning the positions of the layers, and then pressing;
fifthly, sintering at 900 ℃;
and sixthly, scribing after the temperature is cooled down, and separating the whole wafer into independent exploding foil units.
2. The process for preparing an exploding foil integrated chip of low-temperature co-fired ceramic according to claim 1, wherein: the ceramic substrate (1), the accelerating chamber (4) and the charging groove (5) are overlapped in thickness through green ceramic tapes.
3. The process for preparing an exploding foil integrated chip of low-temperature co-fired ceramic according to claim 1, wherein: the metal of the bridge area (2-a) in the acceleration chamber cannot be too thick, and the bridge area is independently printed and then connected with the transition area (2-b) in an overlapping mode.
4. The process for preparing an exploding foil integrated chip of low-temperature co-fired ceramic according to claim 1, wherein: the flyer layer (3) is formed by integrally sintering a raw porcelain tape with the thickness of 50 mu m and an explosive foil integrated chip.
5. The process for preparing an exploding foil integrated chip of low-temperature co-fired ceramic according to claim 1, wherein: the number of the through holes (7-a) in the ceramic substrate (1) is not less than 5, so that the passing of large current is ensured; the material of the paste (7-b) in the via hole (7-a) is Ag or Au.
6. The process for preparing an exploding foil integrated chip of low-temperature co-fired ceramic according to claim 1, wherein: a Pd/Ag layer (9) is required above the pad area (8) on the back side to ensure the welding with an external device.
7. The process for preparing an exploding foil integrated chip of low-temperature co-fired ceramic according to claim 1, wherein: the metal layer (2) comprises Au paste or Ag paste; the explosive column (6) adopts hexanitrostilbene HNS-IV, and the maximum density of the explosive is 1.74g/cm390% -95%.
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| CN110373646B (en) * | 2019-08-07 | 2021-05-04 | 南京理工大学 | Micro-thruster charging method based on magnetron sputtering charging |
| CN113028905B (en) * | 2019-12-25 | 2023-05-05 | 南京理工大学 | In-situ integrated miniature detonation unit and laser flyer detonation device |
| CN112923800B (en) * | 2021-01-22 | 2022-07-22 | 南京理工大学 | Exploding foil chip based on electric explosion and plasma discharge coupling and preparation method thereof |
| CN112923801B (en) * | 2021-01-29 | 2022-05-20 | 南京理工大学 | Microchip exploding foil initiator prepared by PCB process and preparation method thereof |
| CN113267519B (en) * | 2021-05-19 | 2022-07-15 | 中国工程物理研究院激光聚变研究中心 | Transient process testing device for detonating explosive impacted by flyer |
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