CN109955002A - A kind of ultra-fine solder stick of environment-friendly type and preparation method thereof - Google Patents
A kind of ultra-fine solder stick of environment-friendly type and preparation method thereof Download PDFInfo
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- CN109955002A CN109955002A CN201910210583.3A CN201910210583A CN109955002A CN 109955002 A CN109955002 A CN 109955002A CN 201910210583 A CN201910210583 A CN 201910210583A CN 109955002 A CN109955002 A CN 109955002A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
This application discloses ultra-fine solder sticks of a kind of environment-friendly type and preparation method thereof, it is made of third element alloy and scaling powder, its key points of the technical solution are that the third element alloy includes following components by weight percent: Sn 54.0%~64.5%, Bi 29.7%~39.8%, third element alloy 2.3~3.7%, scaling powder ratio are 2.0~2.6%；The third element alloy is by accounting for gallium (Ga) 0.05~0.1wt%, indium (In) 0.15~0.33wt% of solder stick total weight ratio, cobalt (Co) 0.15~0.24wt%, nickel (Ni) 1.7~3.32wt% composition；The scaling powder is constituted following weight percentage components by accounting for scaling powder: carrier 65~80%, activator 6~15%, surfactant 5~16%, thixotropic agent 1~2.85%, corrosion inhibiter 0.46~6.32%.The ultra-fine ultra-fine solder stick of solder stick environment-friendly type of leadless environment-friendly of the invention, fusing point is low, wetability is good, resistance to crack propagation, excellent corrosion resistance.
Description
[technical field]
The present invention relates to a kind of scolding tin wire material, the ultra-fine solder stick of more specifically a kind of environment-friendly type and its preparation side
Method.
[background technique]
The development of welding technique has been over 60 years, and with science and technology progress and constantly develop and
Innovation.Currently, the development of welding material product has been formed on ingredient develops to unleaded, Halogen, environmental protection, functionalization direction；?
Develop in product cost to reliable in quality, direction low in cost；It is narrower to micronization, distribution span in product size
Equal directions are developed, and the also gradually refinement and perfect of every evaluation technology index.In addition, with electronic product and its technology
The demand of development, product gradually develop to directions such as functionalization, low-temperature energy-savings.This development trend is to welding material product
The requirement of quality and manufacturing technology level will be more harsh and stringent.Common form of the solder stick product as electronics tin solder
One of, with the fast development of domestic electronics industry, also obtain great development, common solder stick product and external production
Condition ratio is simultaneously in no way inferior, but still has with external product in high-end application fields such as the products and micro computer more refined comparable
Gap, some are even completely dependent on import.For example, for spot pitch in the miniature electronic assembly for being less than or equal to Φ 0.2mm
(SMT), the weldment of wiring board, component, Miniature connector, infrared Wiring technology, required solder stick must be smaller than being equal to Φ
0.12mm, otherwise, two solder joints are easy for that bridging occurs, and cause element, line short.
The research and development and industrialization of ultra-fine environmental protection solder stick are the developing direction and the only way which must be passed of welding material, have good
Industry and market prospects." the highly reliable research and development and industrial application that superfine ring is mutually used in conjunction and protects solder stick of micro computer thin space "
Project, early period are limited in Guangdong HMD Electric Appliance Co., Ltd., Beijing Kang Puxiwei science and technology limit company and middle mountain Han Huaxi industry
Core technology breakthrough and patent of invention have been obtained on the basis of the collaborative innovation research that three, company carries out jointly.Item design
Member's profession is related to multiple such as materialogy, material processing, material technology, applied chemistry, chemistry, Machine Design, automation control
The high-quality talents of section, project cooperation unit are that the highly reliable superfine ring guarantor's solder stick that is mutually used in conjunction of state's inner microcomputer thin space is ground
Hair and industrial application industrial chain upstream and downstream faucet unit, hardware strength and have a strong R&D capacity, research of technique and industrialization
It is experienced, and gather the respective advantage division of labor and emphasize particularly on different fields, have complementary advantages, carries out project cooperation, established for the completion of this project
Solid theory and practice basis, substance and manpower basis and hardware foundation.
[summary of the invention]
That it is an object of the present invention to provide a kind of fusing points is low, wetability is good, and tissue stabilization, resistance to crack propagation, corrosion resistance
The ultra-fine solder stick of excellent leadless environment-friendly.
The present invention also provides a kind of preparation methods of the ultra-fine solder stick of environment-friendly type.
The present invention is achieved by the following technical solutions:
A kind of ultra-fine solder stick of environment-friendly type, medicine core is made of third element alloy and scaling powder, is covered with outside the medicine core
Outer mold layer, the third element alloy include following components by weight percent:
The third element alloy is by accounting for gallium (Ga) 0.05~0.1wt% of solder stick total weight ratio, indium (In) 0.15
~0.33wt%, cobalt (Co) 0.15~0.24wt%, nickel (Ni) 1.7~3.32wt% composition；
The scaling powder is constituted following weight percentage components by accounting for scaling powder:
Carrier 65~80%,
Activator 6~15%,
Surfactant 5~16%,
Thixotropic agent 1~2.85%,
Corrosion inhibiter 0.46~6.32%.
Preferably, the theca externa compounds blending according to 2~1:1 with phenolic resin or polyurethane by zinc compound and is made.
Zinc compound is preferably zinc oxide, zinc fluoride, fluoboric acid Asia, and zinc compound is dissolved or is uniformly distributed in organic salt, metallizes
Object is closed in organic amino acid salt of melting with the presentation of positive and negative ion state, and eliminates the exposed zinc atom after surface oxides
Effect, occurs redox reaction in the new tin of zinc and kirsite Surface Realize, zinc metal layer, the new metal layer and aluminium and aluminium
Alloy reaches metallurgical bonding, and good with the solder wetting of melting
Preferably, the carrier be esterified rosin, graphene dispersing solution, propylene glycol mixture, the weight in scaling powder
Measuring percentage is respectively esterified rosin 55~72%, graphene dispersing solution 0.5~10%, propylene glycol 1~5%.
Preferably, the activator is succinic acid.Activator in the application uses succinic acid, being capable of shape in the reaction
At five heterocycle product intermediates, metal oxide film layer is promoted to react, and then promotes the pre- thermal response of solder.
Preferably, surfactant is one or both of oleic acid of pentaerythritol resin, polyethylene glycol 200 mixture,
Weight percent in scaling powder is respectively oleic acid of pentaerythritol resin 0~15%, and polyethylene glycol 200 is 0~5.7%.
Preferably, the thixotropic agent is water-soluble titanium acid esters, in triethanolamine borate, ethylene bis stearic acid amide
One or two kinds of mixtures, the weight percent in scaling powder are respectively water-soluble titanium acid esters 0~1%, triethanolamine boric acid
Ester 0.6~2%, ethylene bis stearic acid amide 0~0.6%.
Preferably, the corrosion inhibiter is methyl benzotriazazole, one or both of OP-10 mixture, in scaling powder
In weight percent be respectively methyl benzotriazazole 0~1.87%, OP-10 is 0~5%.The corrosion inhibiter of the application is welding
It is complexed to form stable non-corrosive substance with residuals in residue afterwards, can reduce postwelding residue butt welding point, electronics
The corrosion of component can reach effect free of cleaning.
A kind of preparation method of the ultra-fine solder stick of environment-friendly type, includes the following steps:
1), by weight Sn, Bi and each raw material of third element alloy is weighed, melting is heated to 380~400 DEG C, keep the temperature,
Stirring is stood, slagging-off, is poured and is outpoured Φ 84 × 180mm specification cylinder bar stock；
2) Φ 84 × 180mm bar stock, is packed into 350 tons of large deformation extruders that wire vent bore is Φ 9mm, while pressing 2.0
Rosin solder paste is packed into rosin bucket by~2.6% ratio；
3), control rosin barrel temperature is at 110 DEG C, and 100 DEG C of bar stock temperature, extruding force is in 150kg/cm2, wire vent speed
1.5m/min or so, adjustment rosin mouth is to neutral and gap size and the solder flux content for testing crin, up to thick tin silk core
Scaling powder content is 2.0~2.6 %；
4) the thick tin silk of Φ 9mm specification, is penetrated into 16 newly net forming roller mills, rolls out the solder stick of Φ 3.0mm；
5) the nearly finished product solder stick of the Φ 3.0mm of section subcircular successively, is penetrated into three 28 diamond drawing plates
Wire drawing machine, First wire drawing to Φ 0.8mm, second wire drawing to Φ 0.3mm, third platform are drawn into final finished solder stick Φ
0.10mm size, and coating processes are carried out after passing through second wire drawing machine completely, solder stick is quickly through by zinc compound etc.
Constitute film forming molten liquid, 45~55 DEG C of solution temperature, solder stick surface cooling film forming, then by the water tank with rinse bath into
Row lightization and anti-oxidation processing；Cleaning agent selects the ST-010 type saponification liquor of 5-10%, and anti-oxidation covering selects 2-5%
Ten dihydroxystearic acid alcoholic solutions；
6) it is wound, packs and is put in storage after, the ultra-fine solder stick of drawing dries in the shade.
Preferably, the theca externa thickness is less than or equal to 0.01mm.
Compared with prior art, the present invention has the following advantages:
A kind of ultra-fine solder stick of environment-friendly type can improve the solidification and crystallization of solder by adding microelement in the alloy
State especially increases the crystal grain of tin element, increases the stability of scolding tin, promotes the synchronous solidification of solder joint, or makes solder joint
Subregion solidify and after avoiding solidification concentrate on a region and Great White Spot phenomenon, the addition energy of the metallic elements such as gallium, indium, cobalt occur
The inoxidizability for enough increasing solder stick, when solder is welded and is solidified, the phenomenon that reducing heterogeneous forming core and be combined into salt with solder flux,
The design of theca externa can further pre- anti-oxidation and tin element go bad, improve the inoxidizability of product, the ultra-fine weldering of production
Tin silk can satisfy micro computer thin space welding demand, produce especially for gas pulsed ignitor and home appliance controller
Product provide highly reliable welding interconnection material alloy billet and basic material mechanism foundation；
A kind of preparation method of the ultra-fine solder stick of environment-friendly type, using " large deformation extruding+newly net forming rolling+fine drawing
The method of+anti-oxidation processing online ", breaches the drawback that original preparation method production cycle is long, product waste rate is high, this Shen
Please technical method compared with ultra-fine solder stick prepared by conventional method, without draw greatly and in be pulled through journey and due in the process to base
The large deformation of material densifies, and makes that product lumber recovery is high, with short production cycle, quality guarantee period is long, and graphitiferous is added in component
The dispersion liquid of alkene, the lubricity of product when improving into silk reduce the loss to Xi Si and wire-drawing die, and in tin silk system
Graphene uniform is attached to tin silk table face during standby, and ultra-fine solder stick is effectively avoided to produce the low and easy broken string of effect during the preparation process
The problems such as, while theca externa rapid shaping is cooling, overcomes the phenomenon that tin silk table face is chapped, and avoids that embrittlement occurs.
[specific embodiment]
1~6 illustrates the ultra-fine solder stick of a kind of environment-friendly type of the invention in conjunction with specific embodiments:
Examples 1 to 6 the preparation method is as follows:
Table 1: each component weight forms in Examples 1 to 6:
Table 2: scaling powder weight percentage of each component forms in Examples 1 to 6:
The embodiment of Examples 1 to 2:
A kind of preparation method of the ultra-fine solder stick of environment-friendly type, includes the following steps:
1), by weight Sn, Bi and each raw material of third element alloy is weighed, melting is heated to 380~400 DEG C, keep the temperature,
Stirring is stood, slagging-off, is poured and is outpoured Φ 84 × 180mm specification cylinder bar stock；
2) Φ 84 × 180mm bar stock, is packed into 350 tons of large deformation extruders that wire vent bore is Φ 9mm, is pressed simultaneously
Rosin solder paste is packed into rosin bucket by 2.3% ratio；
3), control rosin barrel temperature is at 110 DEG C, and 100 DEG C of bar stock temperature, extruding force is in 150kg/cm2, wire vent speed
1.5m/min or so, adjustment rosin mouth is to neutral and gap size and the solder flux content for testing crin, up to thick tin silk core
Scaling powder content is 2.0~2.6 %；
4) the thick tin silk of Φ 9mm specification, is penetrated into 16 newly net forming roller mills, rolls out the solder stick of Φ 3.0mm,
The half module dimensions of roll:
The nearly finished product solder stick of the Φ 3.0mm of section subcircular is successively penetrated to the drawing of three 28 diamond drawing plates
Silk machine, First wire drawing to Φ 0.8mm, second wire drawing to Φ 0.3mm, third platform are drawn into final finished solder stick Φ
0.10mm size, and coating processes are carried out after passing through second wire drawing machine completely, solder stick is quickly through by zinc compound etc.
Constitute film forming molten liquid, 45 DEG C of solution temperature or so, solder stick surface cooling film forming, then by the water tank with rinse bath into
Row lightization and anti-oxidation processing；Cleaning agent selects 5% ST-010 type saponification liquor, and anti-oxidation covering selects 2%0 dihydroxy
Base stearic acid alcoholic solution, actual measurement theca externa thickness are less than qualification rate >=99.9% of 0.01mm；
First wire drawing machine artificial diamond mould is as follows with mould:
Second wire drawing machine artificial diamond mould is as follows with mould:
The micro- machine drawing natural diamond mould of third platform is as follows with mould:
6) it is wound, packs and is put in storage after, the ultra-fine solder stick of the Φ 0.50mm specification of drawing dries in the shade.
The embodiment of embodiment 3~4:
A kind of preparation method of the ultra-fine solder stick of environment-friendly type, includes the following steps:
1), by weight Sn, Bi and each raw material of third element alloy is weighed, melting is heated to 380~400 DEG C, keep the temperature,
Stirring is stood, slagging-off, is poured and is outpoured Φ 84 × 180mm specification cylinder bar stock；
2) Φ 84 × 180mm bar stock, is packed into 350 tons of large deformation extruders that wire vent bore is Φ 9mm, is pressed simultaneously
Rosin solder paste is packed into rosin bucket by 2.1% ratio；
3), control rosin barrel temperature is at 110 DEG C, and 100 DEG C of bar stock temperature, extruding force is in 150kg/cm2, wire vent speed
1.5m/min or so, adjustment rosin mouth is to neutral and gap size and the solder flux content for testing crin, up to thick tin silk core
Scaling powder content is 2.0~2.6 %；
4) the thick tin silk of Φ 9mm specification, is penetrated into 16 newly net forming roller mills, rolls out the solder stick of Φ 3.0mm,
The half module dimensions of roll:
5) the nearly finished product solder stick of the Φ 3.0mm of section subcircular successively, is penetrated into three 28 diamond drawing plates
Wire drawing machine, First wire drawing to Φ 0.8mm, second wire drawing to Φ 0.3mm, third platform are drawn into final finished solder stick Φ
0.10mm size, and coating processes are carried out after passing through second wire drawing machine completely, solder stick is quickly through by zinc compound etc.
Film forming molten liquid is constituted, 55 DEG C of solution temperature, solder stick surface cooling forms a film, then passes through the water tank with rinse bath and carry out light
Brightening and anti-oxidation processing；Cleaning agent selects 10% ST-010 type saponification liquor, and anti-oxidation covering selects 5%0 dihydroxy
Stearic acid alcoholic solution, actual measurement theca externa thickness are less than qualification rate >=99.9% of 0.01mm；
First wire drawing machine artificial diamond mould is as follows with mould:
Second wire drawing machine artificial diamond mould is as follows with mould:
The micro- machine drawing natural diamond mould of third platform is as follows with mould:
6) it is wound, packs and is put in storage after, the ultra-fine solder stick of drawing dries in the shade.
The embodiment of embodiment 5~6:
A kind of preparation method of the ultra-fine solder stick of environment-friendly type, includes the following steps:
1), by weight Sn, Bi and each raw material of third element alloy is weighed, melting is heated to 380~400 DEG C, keep the temperature,
Stirring is stood, slagging-off, is poured and is outpoured Φ 84 × 180mm specification cylinder bar stock；
2) Φ 84 × 180mm bar stock, is packed into 350 tons of large deformation extruders that wire vent bore is Φ 9mm, is pressed simultaneously
Rosin solder paste is packed into rosin bucket by 2.5% ratio；
3), control rosin barrel temperature is at 110 DEG C, and 100 DEG C of bar stock temperature, extruding force is in 150kg/cm2, wire vent speed
1.5m/min or so, adjustment rosin mouth is to neutral and gap size and the solder flux content for testing crin, up to thick tin silk core
Scaling powder content is 2.0~2.6 %；
4) the thick tin silk of Φ 9mm specification, is penetrated into 16 newly net forming roller mills, rolls out the solder stick of Φ 3.0mm,
The half module dimensions of roll:
5) the nearly finished product solder stick of the Φ 3.0mm of section subcircular successively, is penetrated into three 28 diamond drawing plates
Wire drawing machine, First wire drawing to Φ 0.8mm, second wire drawing to Φ 0.3mm, third platform are drawn into final finished solder stick Φ
0.10mm size, and coating processes are carried out after passing through second wire drawing machine completely, solder stick is quickly through by zinc compound etc.
Film forming molten liquid is constituted, 50 DEG C of solution temperature, solder stick surface cooling forms a film, then passes through the water tank with rinse bath and carry out light
Brightening and anti-oxidation processing；Cleaning agent selects 10% ST-010 type saponification liquor, and anti-oxidation covering selects 2%0 dihydroxy
Stearic acid alcoholic solution, actual measurement theca externa thickness are less than qualification rate >=99.9% of 0.01mm；
First wire drawing machine artificial diamond mould is as follows with mould:
Second wire drawing machine artificial diamond mould is as follows with mould:
The micro- machine drawing natural diamond mould of third platform is as follows with mould:
6) it is wound, packs and is put in storage after, the ultra-fine solder stick of drawing dries in the shade.
The resulting ultra-fine solder stick of 1~6 scheme of above-described embodiment is tested, such as table 3
Table 3: Examples 1 to 6 and commercially available solder stick actual test comparison
A kind of ultra-fine solder stick of environment-friendly type of the application, using " large deformation extruding+newly net forming rolling+fine drawing+
The method of online anti-oxidation processing ", breaches the drawback that original preparation method production cycle is long, product waste rate is high, the application
Technical method is pulled through journey in and due in the process to blank compared with ultra-fine solder stick prepared by conventional method, without drawing greatly
Large deformation densification, make that product lumber recovery is high, with short production cycle, quality guarantee period is long, containing graphene be added in component
Dispersion liquid, the lubricity of product when improving into silk reduces loss to Xi Si and wire-drawing die, and prepares in tin silk
Graphene uniform is attached to tin silk table face in the process, and ultra-fine solder stick is effectively avoided to produce low and easy broken string of effect etc. during the preparation process
Problem, while theca externa rapid shaping is cooling, overcomes the phenomenon that tin silk table face is chapped, and avoids that embrittlement occurs, by closing
Microelement is added in gold can improve the solidification and crystallization state of solder, especially increase the crystal grain of tin element, increase weldering
The stability of tin, promotes the synchronous solidification of solder joint, or solidify solder joint subregion and after avoiding solidification concentrate on a region and occur
Great White Spot phenomenon, the addition of the metallic elements such as gallium, indium, cobalt can increase the inoxidizability of solder stick, weld and solidify in solder
When, the phenomenon that reducing heterogeneous forming core and be combined into salt with solder flux, the design of theca externa can be further pre- anti-oxidation first with tin
Element is rotten, improves the inoxidizability of product, and the ultra-fine solder stick of production can satisfy micro computer thin space welding demand, especially
It is for gas pulsed ignitor and home appliance controller product.
Claims (9)
1. a kind of ultra-fine solder stick of environment-friendly type, medicine core is made of third element alloy and scaling powder, it is covered with outside the medicine core outer
Mold layer, it is characterised in that the third element alloy includes following components by weight percent:
Sn 54.0%~64.5%,
Bi 29.7%~39.8%,
Third element alloy 2.3~3.7%,
Scaling powder ratio is 2.0~2.6%；
The third element alloy by accounting for gallium (Ga) 0.05~0.1wt% of solder stick total weight ratio, indium (In) 0.15~
0.33wt%, cobalt (Co) 0.15~0.24wt%, nickel (Ni) 1.7~3.32wt% composition；
The scaling powder is constituted following weight percentage components by accounting for scaling powder:
Carrier 65~80%,
Activator 6~15%,
Surfactant 5~16%,
Thixotropic agent 1~2.85%,
Corrosion inhibiter 0.46~6.32%.
2. the ultra-fine solder stick of a kind of environment-friendly type according to claim 1, it is characterised in that: the theca externa is by zinc compound
Blending is compounded according to 2~1:1 with phenolic resin or polyurethane to be made.
3. the ultra-fine solder stick of a kind of environment-friendly type according to claim 1, it is characterised in that: the carrier be esterified rosin,
The mixture of graphene dispersing solution, propylene glycol, the weight percent in scaling powder are respectively esterified rosin 55~72%, graphite
Alkene dispersion liquid 0.5~10%, propylene glycol 1~5%.
4. the ultra-fine solder stick of a kind of environment-friendly type according to claim 1, it is characterised in that: the activator is succinic acid.
5. the ultra-fine solder stick of a kind of environment-friendly type according to claim 1, it is characterised in that: surfactant is pentaerythrite
One or both of olein, polyethylene glycol 200 mixture, the weight percent in scaling powder are respectively pentaerythrite oil
Sour rouge 0~15%, polyethylene glycol 200 are 0~5.7%.
6. the ultra-fine solder stick of a kind of environment-friendly type according to claim 1, it is characterised in that: the thixotropic agent is water-soluble titanium
One or both of acid esters, triethanolamine borate, ethylene bis stearic acid amide mixture, the weight percent in scaling powder
Than being respectively water-soluble titanium acid esters 0~1%, triethanolamine borate 0.6~2%, ethylene bis stearic acid amide 0~0.6%.
7. the ultra-fine solder stick of a kind of environment-friendly type according to claim 1, it is characterised in that: the corrosion inhibiter is methyl benzo
Triazole, one or both of OP-10 mixture, the weight percent in scaling powder are respectively methyl benzotriazazole 0
~1.87%, OP-10 are 0~5%.
8. a kind of preparation method of the ultra-fine solder stick of environment-friendly type, it is characterised in that include the following steps:
1), by weight Sn, Bi and each raw material of third element alloy is weighed, melting is heated to 380~400 DEG C, keep the temperature, stir,
It stands, slagging-off, pours and outpour Φ 84 × 180mm specification cylinder bar stock；
2) Φ 84 × 180mm bar stock, is packed into 350 tons of large deformation extruders that wire vent bore is Φ 9mm, while by 2.0~
Rosin solder paste is packed into rosin bucket by 2.6% ratio；
3), control rosin barrel temperature is at 110 DEG C, and 100 DEG C of bar stock temperature, extruding force is in 150kg/cm2, wire vent speed 1.5m/min
Left and right, adjustment rosin mouth is to neutral and gap size and the solder flux content for testing crin, until the scaling powder of thick tin silk core contains
Amount is 2.0~2.6%；
4) the thick tin silk of Φ 9mm specification, is penetrated into 16 newly net forming roller mills, rolls out the solder stick of Φ 3.0mm；
5), the nearly finished product solder stick of the Φ 3.0mm of section subcircular is successively penetrated to the wire drawing of three 28 diamond drawing plates
Machine, First wire drawing to Φ 0.8mm, second wire drawing to Φ 0.3mm, third platform are drawn into final finished solder stick Φ 0.10mm
Size, and coating processes are carried out after passing through second wire drawing machine completely, solder stick is constituted into quickly through by zinc compound etc.
Film molten liquid, 45~55 DEG C of solution temperature, solder stick surface cooling film forming, then lightization is carried out by the water tank with rinse bath
With anti-oxidation processing；Cleaning agent selects the ST-010 type saponification liquor of 5-10%, and anti-oxidation covering selects 2~5%0 dihydroxy
Stearic acid alcoholic solution；
6) it is wound, packs and is put in storage after, the ultra-fine anti-oxidation solder stick of the specification of drawing dries in the shade.
9. a kind of preparation method of the ultra-fine solder stick of environment-friendly type according to claim 8, it is characterised in that: the theca externa
Thickness is less than or equal to 0.01mm.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110802346A (en) * | 2019-11-18 | 2020-02-18 | 吴江市泰德电子有限公司 | Tin wire production process |
| CN111001963A (en) * | 2019-12-27 | 2020-04-14 | 苏州优诺电子材料科技有限公司 | Soldering tin wire capable of being welded at low temperature and preparation method thereof |
| CN114669910A (en) * | 2022-04-01 | 2022-06-28 | 中山翰华锡业有限公司 | Preformed soldering lug and preparation method thereof |
| CN114669908A (en) * | 2022-04-01 | 2022-06-28 | 中山翰华锡业有限公司 | High-reliability preformed soldering lug and preparation method thereof |
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| CN111001963A (en) * | 2019-12-27 | 2020-04-14 | 苏州优诺电子材料科技有限公司 | Soldering tin wire capable of being welded at low temperature and preparation method thereof |
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| CN114669908A (en) * | 2022-04-01 | 2022-06-28 | 中山翰华锡业有限公司 | High-reliability preformed soldering lug and preparation method thereof |
| CN114669910B (en) * | 2022-04-01 | 2023-08-18 | 中山翰华锡业有限公司 | Preformed soldering lug and preparation method thereof |
| CN114669908B (en) * | 2022-04-01 | 2023-08-18 | 中山翰华锡业有限公司 | High-reliability preformed soldering lug and preparation method thereof |
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