CN109950677A - A method of manufacture low-pass filter - Google Patents
A method of manufacture low-pass filter Download PDFInfo
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- CN109950677A CN109950677A CN201910253100.8A CN201910253100A CN109950677A CN 109950677 A CN109950677 A CN 109950677A CN 201910253100 A CN201910253100 A CN 201910253100A CN 109950677 A CN109950677 A CN 109950677A
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- pass filter
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Abstract
The present invention relates to wave filter technology fields, and in particular to a method of manufacture low-pass filter includes the steps that being embedded in stripline resonator circuit in the dielectric substrate；Wherein, the strip line that some or all of described stripline resonator circuit selects thickness to be greater than 100 microns.Low-pass filter obtained by the present invention reduces signal energy thermal losses during circuit transmission, to reach the low-loss purpose of drop.The miniaturization of equipment can be further realized.
Description
Technical field
The present invention relates to wave filter technology fields, and in particular to a method of manufacture low-pass filter.
Background technique
With the arriving of 5G communication era, the requirement to base station equipment weight and volume is smaller and smaller, due to small-sized
The advantages that change, low-loss and good temp characteristic, dielectric filter just like has become the inevitable option of 5G epoch base station equipment,
The application of middle ceramic waveguide filter is most representative.In the practical application of ceramic waveguide filter, it is often necessary to arrange in pairs or groups one
Low-pass filter for carrying out distal end inhibition uses, and forms a filter assembly, therefore the final performance of filter assembly is not
It is only dependent upon ceramic waveguide filter itself, it is also closely bound up with low-pass filter.
Low-pass filter for inhibiting harmonic wave and noise signal is one of the important component in wireless communication system, in order to
The overall volume for reducing filter assembly is arranged in pairs or groups the low-pass filter that uses with ceramic waveguide filter, mostly using small in size,
Strip line low-pass filter with good Planar integration degree.Common strip line low-pass filter manufacturing method is using double-deck
Pcb board technique suppresses to form strip line low-pass filter by two layers of medium substrate, wherein only single side on one layer of medium substrate
Metal layer of the covering for ground connection；After covering metal layer on one surface of another layer of dielectric-slab, etch to form strip line resonance
The circuit layer of device circuit, metal layer of the another side covering for ground connection, last two layers of medium substrate are with ungrounded one side
Involutory surface, pairing suppress to form strip line low-pass filter, also need setting via hole and pad one kind for band-like on medium substrate
The supplementary structure of the signal input/output interface of line low-pass filter and metallization VIA one kind for isolation signals.?
There is the metal parts such as the circuit layer that stripline resonator circuit will be formed using common burning porcelain technique one together with medium substrate
Molding production method, common ground are all that the strip-line circuit layer for forming stripline resonator circuit is embedded into medium substrate
In.
For filter, and volume and loss are often inversely proportional, and how loss are reduced on the basis of guaranteeing miniaturization
Become each equipment vendor and the focus broken through is sought by device producer.The ceramic waveguide wave filter technology that the 5G epoch are necessarily used
For, traditional solution be reduce ceramic filter part loss, such as using low-k ceramic material, make
With Multimodal technology etc., but use the material of low-k that volume can be made to increase to be unable to satisfy customer requirement；Using more
Mould technology sexual valence is poor, can production it is not high；In contrast, the optimization of low-pass filter part is ignored always, however band
Shape line low-pass filter is not without optimizable space.
It stands in the design angle of electronic system, current density is critically important index, and the performance and the magnitude of current of circuit are close
Correlation, and current density is determined by the dimension of object of conductor, its essence is shapes for the circuit layer in strip line low-pass filter
At the metal layer of specific pattern (being used to form stripline resonator circuit), structure size is originally very small, in addition
High frequency frequency domain (microwave band) uses, and due to skin effect, the conductive area of electric current can be more confined near surface, thus promotees
Increase current density, current density is excessively high, and the thermal losses of circuit increases, and then can overall performance bring to filter not
Sharp consequence.
Summary of the invention
Inventor reduce filtering device entirety power loss the problem of when, thinking is transformed into be typically ignored it is excellent
Change the power loss direction of low-pass filter, in the process inventors have found that by changing in low-pass filter during fabrication
Strip lines configuration (circuit layer is present in low-pass filter in the form of strip line), script is made of thin-layer metal membrane
Strip lines configuration longitudinally thickeies, and will not only change the filtering performance of low-pass filter script, but also can bring working condition
The decline of current density on entire strip line down, thereby reduce by current density it is excessively high and bring form of thermal energy
Signal power loss.Based on above-mentioned discovery, inventor changes existing for constituting the band-like of low-pass filter during manufacturing
Cable architecture, thereby completing the present invention.
Thus the present invention provides a kind of methods for manufacturing low-pass filter, including, it is embedded in strip line in the dielectric substrate
The step of resonator circuit；Wherein, the band that some or all of described stripline resonator circuit selects thickness to be greater than 100 microns
Shape line.
The principle of the present invention and beneficial effect are: for the angle of equivalent circuit, due to the enlarged in thickness of strip line
The cross-sectional area of strip line, so that circuit all-in resistance reduces, so that current density reduces；Or it can be from conductive surface product
For angle, common strip line thickness is lower than 2 ounces (72 microns) on existing PCB industry, strip line thickness in this programme
It is significantly increased so that the surface area of strip line entirety increases, so that current density reduces；Signal energy is during circuit transmission
Thermal losses reduces, to reach the low-loss purpose of drop.Low-pass filter loss reduces, so that the filtering unit complete machine in design
The surplus of loss increases, to reduce the design difficulty of dielectric waveguide filter part, dielectric waveguide filter part is able to
Using smaller volume, the cost of dielectric waveguide filter is not only reduced, the miniaturization of equipment can also be further realized.
Preferably, the thickness of the strip line is less than 250 microns.
Excessively high thickness is not only easy to manufacture, and cost is again higher, and needs thicker medium substrate that could cover.
Preferably, the strip line with a thickness of 144 microns.
The thickness sexual valence is relatively high, can preferably realize the reduction of loss, while will not bring excessively high cost.
Preferably, it is the strip line of rectangle that the strip line, which selects cross section,.
It was verified that selecting the strip line with rectangular section that can bring lower loss.
Further, the step of stripline resonator circuit is embedded in the medium substrate include, using upper substrate and
Lower substrate is combined to form the medium substrate, before pairing, the lower substrate to and face on to be arranged the strip line humorous
Shake device circuit.
This method is conducive to that stripline resonator circuit is embedded into medium substrate using existing mature technology, very sharp
In the production of extensive mass.
Further, the lower substrate to and face on to be arranged the stripline resonator circuit include taking in advance
The mode of machining processes the stripline resonator circuit, then is bonded in lower substrate interior surface layers.
Since the strip line in the present invention is thicker, common printing/method for chemially etching efficiency is lower, the side of machining
Formula is more suitable for.
Further, before pairing, the upper substrate to and face on open up and the stripline resonator circuit
The groove of cooperation.
Since the strip line in the present invention is thicker, so common pcb board direct pressing is not used, but the thing on upper substrate
First setting groove is for accommodating strip line, in this way, the medium substrate after pairing is more smooth, the combination of upper substrate and lower substrate
More closely.
Preferably, material selection Rogers's plate of the medium substrate.
The plate property is good, using also very extensive.
Preferably, the material selection copper of the strip line.
Signal transmission performance is good, and cost is the bottom of compared with.
Preferably, the thickness of the upper substrate and lower substrate selects 20~40mil.
It, will not the blocked up volume to increase low-pass filter while guaranteeing performance.
Detailed description of the invention
Fig. 1 is the explosive view of the strip line low-pass filter in the embodiment of the present invention.
Fig. 2 is the bottom view of the upper substrate in Fig. 1.
Fig. 3 is the top view of the lower substrate in Fig. 1.
Fig. 4 is the explosive view of the communication device in the embodiment of the present invention.
Specific embodiment
Appended drawing reference in Figure of description includes: upper substrate 1, the second pad 11, third pad 12, strip-line circuit layer
2, groove 20, output signal via hole 21, input signal via hole 22, lower substrate 3, the first pad 31, dielectric waveguide filter
4, low-pass filter 5, probe 6.
A kind of method for manufacturing low-pass filter is disclosed in the present embodiment, including, it is embedded in strip line in the dielectric substrate
The step of resonator circuit；Wherein, the band that some or all of described stripline resonator circuit selects thickness to be greater than 100 microns
Shape line.
In further embodiment, described the step of being embedded in stripline resonator circuit in the dielectric substrate includes using
Upper substrate and lower substrate are combined to form the medium substrate, before pairing, the lower substrate to and face on described in setting
Stripline resonator circuit.This method is conducive to that stripline resonator circuit is embedded into medium substrate using existing mature technology
In, it is very beneficial to the production of extensive mass.
In further embodiment, before pairing, the upper substrate to and face on open up it is with the strip line humorous
The groove that the device circuit that shakes cooperates.It is thicker by strip line in this present embodiment, so common pcb board direct pressing is not used, and
That groove is set in advance on upper substrate for accommodating strip line, in this way, the medium substrate after pairing is more smooth, upper substrate and
The combination of lower substrate is also more closely.
A low-pass filtering for using the strip lines configuration disclosed in this invention for reducing loss is shown in Fig. 1
Device.The low-pass filter is formed by two pieces of substrate bondings, is upper substrate 1, lower substrate 3 respectively；The material of 1 lower substrate 3 of upper substrate
It can be arbitrary medium material, the present embodiment preferably uses Rogers's plate, and thickness is optionally 20~40mil, excellent in this example
Choosing uses 30mil.1 upper and lower surface of upper substrate sees it is outer surface layer and interior surface layers respectively from top to bottom, wherein outer surface
Layer is full copper clad layers, and interior surface layers are no copper layer, and upper substrate 1 is additionally provided with the second pad 11, for connecting external signal.It is intermediate
Circuit layer 2 use copper material, cross section is rectangle, form strip line low-pass filter whole stripline resonators electricity
Road is only an example as shown in the figure, and strip lines configuration of the invention is suitable for the stripline resonator circuit of any pattern, can also be with
Only segment striplines resonator circuit is constituted using strip lines configuration disclosed in the present invention.
It is lower substrate interior surface layers and lower substrate outer surface layer that 3 upper and lower surface of lower substrate is seen respectively from top to bottom, wherein under
Substrate interior surface layers are no copper layer, and lower substrate outer surface layer is full copper clad layers, and circuit layer 2 is bonded in lower substrate inner surface in this example
On layer, copper thickness may be selected 100-250 microns, as shown in Fig. 2, offering in the interior surface layers of upper substrate close with circuit layer 2
The groove 20 of cooperation；As shown in figure 3, lower substrate 3 is additionally provided with the first pad 31, for connecting external signal.Input in figure
Signal conduction hole 22 and output signal via hole 21, for the connection of circuit layer 3 and input/output end port, input signal conducting
Hole 22 can be blind hole, extend to lower substrate interior surface layers (not penetrating lower substrate outer surface layer) by outer surface layer, can also
To be through-hole, 3 outer surface layer of lower substrate is extended directly to by outer surface layer.Output signal via hole 21 is equally also possible to blind
Hole extends to interior surface layers (not penetrating interior surface layers) by lower substrate outer surface layer, is also possible to through-hole, by lower substrate outside
Superficial layer extends directly to outer surface layer.The structure of stripline resonator circuit in the present embodiment makes it in the operating condition
Current density reduce, signal energy thermal losses during circuit transmission reduces, to reach the low-loss purpose of drop.Low pass filtered
The loss of wave device reduces, so that machine loss surplus increases, to reduce the design difficulty of dielectric filter part, and then drops
The low cost of dielectric filter.
Since circuit layer 2 is thicker, common printing/method for chemially etching efficiency is lower, and machining is taken in this example
It is bonded in lower substrate interior surface layers again after mode processing circuit layer 2.Specific method can be but not limited to cutting, grinding, swash
Light engraving etc..Correspondingly, can also be processed in the interior surface layers of originally smooth upper substrate 3 by way of machining recessed
Slot 20.
Technique by 3 consolidation of upper substrate 1 and lower substrate is then the technique of existing multi-layer PCB board, further table
Face cover copper, punched and via hole metallization etc. techniques be also the prior art, therefore not to repeat here.
By the way that in 0-14GHz, it is matched required for it to be measured low-pass filter 5 for the setting of Network Analyzer calibration frequency
Power loss (interior insertion loss) in the passband of dielectric waveguide filter is simultaneously compared with traditional strip line low-pass filter, is adopted
The loss range of decrease brought by low-pass filter 5 with different Cu thickness is as shown in table 1:
Table 1
| Copper thickness (micron) | Passband (GHz) | The range of decrease (dB) |
| 100 | 3.2~3.4 | 0.11 |
| 144 | 3.2~3.4 | 0.20 |
| 250 | 3.2~3.4 | 0.22 |
As seen from the table, when copper thickness reaches 100 microns, it is already possible to bring the loss of 0.11dB to decline, be increased to 144
When micron, it is already possible to bring the loss of 0.20dB to decline, and continue to mention high copper thickness to 250 microns, bring the loss of 0.22dB
Decline, the only more 0.02dB of copper thickness compared to 144 microns.So for the balance of cost, technology difficulty and performance, this reality
It applies and preferably uses relatively high 144 microns of the copper thickness of letter valence in example.
It is worth noting that, in certain embodiments, the stripline resonator circuit in low-pass filter 5 only partially uses
Strip lines configuration disclosed by the invention for reducing energy consumption is only one in the strip line of composition shape line resonator circuit
Part is thickened, correspondingly, only reinforcement just needs matched groove 20.
As shown in figure 4, the present embodiment also discloses a kind of communication device, the device include above-mentioned low-pass filter 5 with
And a dielectric waveguide filter 4, the dielectric waveguide filter 4 use ceramic dielectric.Specifically, low-pass filter 5 also collects
At signal input interface, third pad 12 passes through the strip line in low-pass filter 5 in the signal input interface and figure
Connection, third pad 12 are then connect with the input port of dielectric waveguide filter 4 by probe 6, dielectric waveguide filter 4 it is defeated
Outlet then passes through another probe 6 and connect with the second pad 11, and the signal for that will pass through dielectric filter filtering accesses low pass filtered
Wave device 5, and pass through the signal that low-pass filter 5 filters and be output to and the welding of the first pad 31 through output signal via hole 25 again
In route, i.e., signal conduction hole 25 be the communication device signal output end；The stub end insertion dielectric filter filtering of probe 6
Interior, small head end then passes through the hole insertion low pass filtered at the signal input through-hole 24 or 12 center of third pad at 11 center of the second pad
In wave device 5, and the strip line be connected in dielectric waveguide filter 4 and low-pass filter 5 in the longitudinal direction (is inputted for connection signal
The part of interface and the part for forming stripline resonator circuit).
The reduction of 5 power loss of low-pass filter, so that the surplus of filtering unit machine loss increases in design, thus
The design difficulty of ceramic waveguide filter segment is reduced, ceramic waveguide filter segment is able to using smaller volume, not only
The cost of ceramic filter is reduced, the miniaturization of equipment can also be further realized.It is calculated through inventor, after the present invention
Brought power loss surplus can make the size of ceramic waveguide filter segment that can at most reduce 30%, for filtering group
It is a significant progress for the miniaturization of part.
In the base station of 5G communication system, large-scale antenna array technology is used, numerous antenna for base station is by with antenna
The form of array integrates, and (transmits band to reduce wiring and the loss of transmission line bring, the duplexer of each antenna
Bandpass filter and collection of letters bandpass filter) also integrate together；After the communication device in the present embodiment, the space saved can
So that the aerial array is more compact, the space saved can also be used to that other assemblies to be installed, or do not changing original
In the case where having size, the filtering loss of signal is reduced, to improve the performance of entire aerial array.
The above are merely the embodiment of the present invention, the common sense such as well known specific structure and characteristic are not made excessively herein in scheme
Description, all common of technical field that the present invention belongs to before one skilled in the art know the applying date or priority date
Technological know-how can know the prior art all in the field, and have using routine experiment means before the date
Ability, one skilled in the art can improve in conjunction with self-ability under the enlightenment that the application provides and implement we
Case, some typical known features or known method should not become the barrier that one skilled in the art implement the application
Hinder.It should be pointed out that for those skilled in the art, without departing from the structure of the invention, if can also make
Dry modification and improvement, these also should be considered as protection scope of the present invention, these all will not influence the effect that the present invention is implemented and
Patent practicability.The scope of protection required by this application should be based on the content of the claims, the specific reality in specification
Applying the records such as mode can be used for explaining the content of claim.
Claims (10)
1. it is a kind of manufacture low-pass filter method, including, in the dielectric substrate be embedded in stripline resonator circuit the step of；Its
It is characterized in that, the strip line that some or all of described stripline resonator circuit selects thickness to be greater than 100 microns.
2. the method for manufacture low-pass filter according to claim 1, it is characterised in that: the thickness of the strip line is less than
250 microns.
3. it is according to claim 1 manufacture low-pass filter method, it is characterised in that: the strip line with a thickness of
144 microns.
4. the method for manufacture low-pass filter according to claim 1, it is characterised in that: the strip line selects cross section
For the strip line of rectangle.
5. the method for manufacture low-pass filter according to claim 1, it is characterised in that: described to be embedded in the dielectric substrate
The step of stripline resonator circuit includes being combined to form the medium substrate using upper substrate and lower substrate, before pairing,
The lower substrate to and face on the stripline resonator circuit is set.
6. the method for manufacture low-pass filter according to claim 5, it is characterised in that: before pairing, on described
Substrate to and face on open up with the stripline resonator circuit cooperation groove.
7. the method for manufacture low-pass filter according to claim 5, it is characterised in that: pair in the lower substrate
It include that the mode of machining is taken to process the strip line resonance in advance with the stripline resonator circuit is arranged on face
Device circuit, then be bonded in lower substrate interior surface layers.
8. the method for manufacture low-pass filter according to claim 1, it is characterised in that: the material of the medium substrate is selected
With Rogers's plate.
9. the method for manufacture low-pass filter according to claim 1, it is characterised in that: the material selection of the strip line
Copper.
10. the method for manufacture low-pass filter according to claim 1, it is characterised in that: the upper substrate and lower substrate
Thickness select 20~40mil.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910253100.8A CN109950677A (en) | 2019-03-29 | 2019-03-29 | A method of manufacture low-pass filter |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910253100.8A CN109950677A (en) | 2019-03-29 | 2019-03-29 | A method of manufacture low-pass filter |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4785271A (en) * | 1987-11-24 | 1988-11-15 | Motorola, Inc. | Stripline filter with improved resonator structure |
| CN1198259A (en) * | 1996-06-12 | 1998-11-04 | 菲利浦电子有限公司 | Ceramic stripline filter |
| CN107134609A (en) * | 2016-02-26 | 2017-09-05 | 株式会社藤仓 | The design method of wave filter and the wave filter |
| CN109066031A (en) * | 2018-09-21 | 2018-12-21 | 江苏贝孚德通讯科技股份有限公司 | Two road combiner of broadband based on single layer strip lines configuration |
-
2019
- 2019-03-29 CN CN201910253100.8A patent/CN109950677A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4785271A (en) * | 1987-11-24 | 1988-11-15 | Motorola, Inc. | Stripline filter with improved resonator structure |
| CN1198259A (en) * | 1996-06-12 | 1998-11-04 | 菲利浦电子有限公司 | Ceramic stripline filter |
| CN107134609A (en) * | 2016-02-26 | 2017-09-05 | 株式会社藤仓 | The design method of wave filter and the wave filter |
| CN109066031A (en) * | 2018-09-21 | 2018-12-21 | 江苏贝孚德通讯科技股份有限公司 | Two road combiner of broadband based on single layer strip lines configuration |
Non-Patent Citations (1)
| Title |
|---|
| 张力平 等: "《高功率低损耗六路功分器的设计与分析》", 《现代电子技术》 * |
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Application publication date: 20190628 |