CN109936927A - Circuit board renovation method and system - Google Patents

Circuit board renovation method and system Download PDF

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Publication number
CN109936927A
CN109936927A CN201910282824.5A CN201910282824A CN109936927A CN 109936927 A CN109936927 A CN 109936927A CN 201910282824 A CN201910282824 A CN 201910282824A CN 109936927 A CN109936927 A CN 109936927A
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CN
China
Prior art keywords
circuit board
repaired
packing material
material collecting
delivery platform
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910282824.5A
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Chinese (zh)
Inventor
纪其乐
原进良
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Otima Optical Technology (shenzhen) Co Ltd
Original Assignee
Otima Optical Technology (shenzhen) Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Otima Optical Technology (shenzhen) Co Ltd filed Critical Otima Optical Technology (shenzhen) Co Ltd
Priority to CN201910282824.5A priority Critical patent/CN109936927A/en
Publication of CN109936927A publication Critical patent/CN109936927A/en
Priority to CN201910614363.7A priority patent/CN110213901B/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/225Correcting or repairing of printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15Position of the PCB during processing
    • H05K2203/1572Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

The present invention provides a kind of circuit board renovation methods, comprising steps of S01, by multiple circuit board conveyings to be repaired to feeding device, S02, feeding device are by circuit board conveying to be repaired to intelligent rechecking device, S03, intelligent rechecking device recheck to circuit board to be repaired and marking of defects, S04, the circuit board conveying to be repaired rechecked will be completed to circuit board prosthetic device, S05, circuit board prosthetic device repair circuit board to be repaired, and S06, material collecting device will complete the circuit board block pattern row pattern repaired;Additionally provide a kind of circuit board repair system.The present invention passes through the Artifact on intelligent rechecking device realization automatic fitration circuit board to be repaired, and the work of retractable circuit board is accomplished manually by feeding device and material collecting device substitution, so that reinspection process is participated in without worker, reinspection labor intensity is high, quality is irregular, low efficiency to solving the problems, such as manually to carry out circuit board, improves the precision and efficiency of circuit board reparation.

Description

Circuit board renovation method and system
Technical field
The invention belongs to circuit board recovery technique fields, are to be related to a kind of circuit board renovation method and be more specifically System.
Background technique
Due to manufacturing process, in the production process of circuit board, inevitably it will appear for example: short-circuit, convex copper, open circuit The defects of, and these defects are can to complete to repair by circuit board prosthetic device (AMR), are thus needed in process of production Accurately find out the defect point on circuit board.Currently, generalling use automatic optics inspection (AOI) device in the market to circuit board Appearance checked, is found out and the position coordinates of marking of defects point.However, current automatic optics inspection technology can't be complete Avoid the problem that erroneous detection entirely, automatic optical detection device can by circuit board copper face oxidation, dust, copper wire turning set Error etc. between meter and practical etching is marked as true defect point, causes to need before circuit board is repaired manually to circuit Plate is once rechecked, and then the above Artifact point is filtered out, and thus be easy to cause the labor intensity of operator It improves, reinspection quality is irregular, and remediation efficiency reduces.
Summary of the invention
The purpose of the present invention is to provide a kind of circuit board renovation methods, including but not limited to solve manually to circuit board into The technical issues of row reinspection labor intensity is high, quality is irregular, low efficiency.
In order to solve the above technical problems, including the following steps: the embodiment of the invention provides a kind of circuit board renovation method
S01, will be on multiple circuit board conveyings to feeding device to be repaired;
Multiple circuit boards to be repaired are transported on intelligent rechecking device by S02, the feeding device one by one;
S03, the intelligent rechecking device are rechecked to the circuit board to be repaired and the circuit board for marking needs to repair lacks It falls into;
S04, it will complete on the circuit board conveying to be repaired to circuit board prosthetic device rechecked;
S05, the circuit board prosthetic device are according to the inspection result of the intelligent rechecking device to the circuit board to be repaired It is repaired;
S06, material collecting device will complete the circuit board block pattern row pattern repaired.
Further, the circuit board renovation method, further includes following steps:
S07, the circuit board to be repaired for completing single side reparation is overturn;
S08, repeat step S01 to step S06.
Further, in the step S02 further include:
Multiple circuit board neonychiums are transported to packing material one by one and collected on apparatus for temporary storage by S021, the feeding device.
Further, the step S06 includes:
S061, the material collecting device are collected from packing material and take out the circuit board neonychium on apparatus for temporary storage;
The circuit board for completing to repair is placed on the circuit board neonychium by S062, the material collecting device.
The present invention also provides a kind of circuit board repair systems, including feeding device, intelligent rechecking device, circuit board reparation Device and material collecting device;It is described intelligence rechecking device include:
First delivery platform, for carrying and transporting the circuit board to be repaired;
Mechanism is imaged, the top side of first delivery platform is set to;
First driving mechanism can drive the camera shooting mechanism in the plane for being parallel to first delivery platform along mutual Two vertical directions are mobile;And
First control mechanism, with first delivery platform, the camera shooting mechanism, first driving mechanism and the electricity The electrical connection of road plate prosthetic device, and artificial intelligence process software is mounted in first control mechanism.
Further, the circuit board prosthetic device includes:
Second delivery platform is connected with first delivery platform, for carrying and transporting the circuit board to be repaired;
Repairing mechanism, is set to the top side of second delivery platform, and the repairing mechanism includes laser cutting machine, high speed At least one of revolving scraper, Repair Welding Machine;
Second driving mechanism can drive the repairing mechanism in the plane for being parallel to second delivery platform along mutual Two vertical directions are mobile, and go up and down along the direction perpendicular to second delivery platform;And
Second control mechanism, with first control mechanism, second delivery platform, the repairing mechanism and described The electrical connection of two driving mechanisms.
Further, the feeding device includes:
Third driving mechanism;
First elevating mechanism is set in the third driving mechanism, and the third driving mechanism can drive described first Elevating mechanism moves in the horizontal direction;And
First manipulator is set on first elevating mechanism, for grabbing circuit board to be repaired, first elevator Structure can drive first manipulator to rise or fall;
The structure of the material collecting device is consistent with the structure of the feeding device.
Further, the circuit board repair system further include:
Packing material collects apparatus for temporary storage, including packing material collecting mechanism and packing material holding structure, and the packing material is collected Mechanism is set to the side of the feeding device, is conveyed through the packing material come, the packaging for receiving first manipulator Object holding structure is set to the side of the material collecting device, grabs for keeping in packing material for second manipulator.
Further, the circuit board repair system further include:
First conveying device is set between the packing material collecting mechanism and the packing material holding structure, and being used for will Packing material is transported on the packing material holding structure from the packing material collecting mechanism.
Further, the circuit board repair system further include:
Turnover device is set to the side or the feeding of the circuit board prosthetic device and the intelligent rechecking device Between device and the material collecting device, for the circuit board overturning to be repaired of single side reparation will to be completed.
The beneficial effect of circuit board renovation method provided by the invention and system is: use intelligent rechecking device with it is upper Expect device, circuit board prosthetic device and material collecting device cooperation, is realized on automatic fitration circuit board to be repaired by intelligent rechecking device Artifact, and the work of retractable circuit board is accomplished manually by feeding device and material collecting device substitution, so that reinspection process It is participated in without worker, manually carries out that reinspection labor intensity is high, quality is irregular, efficiency to circuit board to efficiently solve Low technical problem reduces the labor intensity of worker, improves the precision and efficiency of circuit board reparation.
Detailed description of the invention
It to describe the technical solutions in the embodiments of the present invention more clearly, below will be to embodiment or description of the prior art Needed in attached drawing be briefly described, it should be apparent that, the accompanying drawings in the following description is only of the invention some Embodiment for those of ordinary skill in the art without any creative labor, can also be according to these Attached drawing obtains other attached drawings.
Fig. 1 is the work flow diagram of circuit board renovation method provided in an embodiment of the present invention;
Fig. 2 is the stereoscopic schematic diagram of circuit board repair system provided in an embodiment of the present invention;
Fig. 3 is the schematic top plan view of circuit board repair system provided in an embodiment of the present invention;
Fig. 4 be another embodiment of the present invention provides circuit board repair system sectional perspective schematic diagram;
Fig. 5 is the schematic top plan view for the circuit board repair system that yet another embodiment of the invention provides.
Wherein, each appended drawing reference in figure:
1-circuit board repair system, 10-feeding devices, 20-intelligent rechecking devices, 30-circuit board prosthetic devices, 40-material collecting devices, the 60-the first conveying device, the 70-the second conveying device, 80-third conveying devices, the 90-the four conveying It is device, 11-third driving mechanisms, the 12-the first elevating mechanism, the 13-the first manipulator, 14-feed mechanisms, 21-the first defeated Platform, 22-camera shooting mechanisms, the 23-the first driving mechanism, the 31-the second delivery platform, 32-repairing mechanisms, 33-the second is sent to drive Motivation structure, the 41-the four driving mechanism, the 42-the second elevating mechanism, the 43-the second manipulator, 44-receiving mechanisms, 51-packagings Object collecting mechanism, 52-packing material holding structures, 141-first supports, 142-third lifting assemblies, 441-second supports, 442-the four lifting assembly, 511-third brackets, the 512-the five lifting assembly, the 521-the four bracket, the 522-the six lifting Component.
Specific embodiment
In order to which technical problems, technical solutions and advantages to be solved are more clearly understood, tie below Accompanying drawings and embodiments are closed, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only To explain the present invention, it is not intended to limit the present invention.
It should be noted that when component is referred to as " being fixed on " or " being set to " another component, it can be directly another On a component or indirectly on another component.When a component is known as " being connected to " another component, it can be with It is directly or indirectly to be connected on another component.The orientation or position of the instructions such as term " on ", "lower", "left", "right" Relationship is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of describing, rather than the dress of indication or suggestion meaning It sets or element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as the limit to this patent System, for the ordinary skill in the art, can understand the concrete meaning of above-mentioned term as the case may be.Term " first ", " second " are used merely to facilitate description purpose, are not understood to indicate or imply relative importance or implicitly indicate The quantity of technical characteristic.The meaning of " plurality " is two or more, unless otherwise specifically defined.
Now circuit board renovation method provided by the invention is illustrated.Referring to Fig. 1, the circuit board renovation method includes Following steps:
S01, will be on multiple circuit board conveyings to be repaired to feeding device 10;
Multiple circuit boards to be repaired are seriatim transported on intelligent rechecking device 20 by S02, feeding device 10;
The circuit board defect that S03, intelligent rechecking device 20 recheck circuit board to be repaired, and needs marked to repair;
S04, it will complete on the circuit board conveying to be repaired to circuit board prosthetic device 30 rechecked;
S05, circuit board prosthetic device 30 repair circuit board to be repaired according to the inspection result of intelligent rechecking device 20;
S06, material collecting device 40 fitly pile up the circuit board for completing to repair.
Specifically, by worker or manipulator, fitly level overlays feeding dress to multiple circuit boards to be repaired by initial survey It sets on 10, then circuit board to be repaired is seriatim transported on intelligent rechecking device 20 by feeding device 10, then intelligence reinspection dress 20 are set to verify the defect point on circuit board to be repaired according to the initial survey result of circuit board defect detection device, it will be on circuit board Copper face oxidation, dust, copper wire corner design and practical etching between the Artifacts such as error filter out, and mark true The defect point for just needing to repair, then intelligent rechecking device 20 fills the circuit board conveying to be repaired for completing reinspection to circuit board reparation It sets on 30, then circuit board prosthetic device 30 carries out the defect of circuit board to be repaired according to the reinspection result of intelligent rechecking device 20 It repairs, then material collecting device 40 fitly piles up the circuit board for completing to repair.
Circuit board renovation method provided by the invention is repaired using intelligent rechecking device 20 with feeding device 10, circuit board Apparatus for coating 30 and material collecting device 40 cooperate, and realize the Artifact on automatic fitration circuit board to be repaired by intelligent rechecking device 20, And the work for being accomplished manually retractable circuit board is substituted by feeding device 10 and material collecting device 40, so that reinspection process is not necessarily to Worker participates in, and manually carries out that reinspection labor intensity is high, quality is irregular, low efficiency to circuit board to efficiently solve Technical problem reduces the labor intensity of worker, improves the precision and efficiency of circuit board reparation.
Optionally, referring to Fig. 1, a kind of specific embodiment as circuit board renovation method provided by the invention, electricity Road plate restorative procedure further includes following steps:
S07, the circuit board to be repaired for completing single side reparation is overturn;
S08, repeat step S01 to step S06.
Specifically, when circuit board to be repaired is double-sided PCB, when material collecting device 40 will complete the electricity of single side reparation After road plate is fitly piled up, the circuit board conveying for completing single side reparation can then be filled to overturning by worker or manipulator It sets on (not shown), the circuit board to be repaired of overturning then will be completed on fitly level overlays by worker or manipulator Expect then to repeat step S01 to step S06 on device 10, until the completion reparation of circuit board prosthetic device 30 circuit board to be repaired is another Defect on one side, then material collecting device 40 fitly piles up the circuit board for completing two-sided reparation.Certainly, as the case may be and Demand, in other embodiments of the invention, step S07 can also be completed before step S06, and turnover device is repaired from circuit board Circuit board to be repaired is grabbed on apparatus for coating 30, is directly placed on intelligent rechecking device 20 after overturning, is then carried out step S03 extremely again Step S06, does not limit uniquely herein.
Further, as a kind of specific embodiment of circuit board renovation method provided by the invention, in step S06 In, material collecting device 40 is according to the reparation of circuit board prosthetic device 30 as a result, circuit board can be repaired and not completely according to complete Two classifications are repaired to be piled up.Since circuit board is other than the defect that short circuit, convex copper, open circuit etc. can be repaired, it is also possible to deposit In the defect that cannot be repaired by circuit board prosthetic device 30, these defects still will affect the normal use of circuit board, need to make It is further processed, therefore material collecting device 40 can repair two classifications to circuit with complete according to complete repair in step S06 Plate is piled up, so that and entire repair process more refines, and can carry out retest and classification to avoid to circuit board, Reduce artificial screening process, reduce human cost, improves production efficiency.
Further, as a kind of specific embodiment of circuit board renovation method provided by the invention, in step S02 Further include: multiple circuit board neonychiums are seriatim transported to packing material and collected on apparatus for temporary storage by S021, feeding device 10.Due to The surface of circuit board has been covered with fine components, therefore needs to protect it during stacking and transport, ability The common way in domain is that pad sets one layer of neonychium between the circuit board stacked at two pieces, to prevent from connecing between two pieces of circuit boards Touching and collision lead to the damage of circuit board.Feeding device 10 can be received in intelligent rechecking device 20 and packing material in step S02 It is moved back and forth between collection apparatus for temporary storage, in order by circuit board conveying to be repaired to intelligence rechecking device 20 and by circuit board neonychium It is transported to packing material to collect on apparatus for temporary storage, is conducive to the recycling of circuit board neonychium, eliminates and artificially collect neonychium Trouble, reduce production cost, improve production efficiency.
Further, as a kind of specific embodiment of circuit board renovation method provided by the invention, step S06 packet Include: S061, material collecting device 40 are collected from packing material and take out circuit board neonychium on apparatus for temporary storage;S062, material collecting device 40 will The circuit board for completing to repair is placed on circuit board neonychium.Specifically, material collecting device 40 can be in circuit board prosthetic device 30 And packing material is collected and is moved back and forth between apparatus for temporary storage, collects from packing material take out circuit board neonychium on apparatus for temporary storage in order The circuit board of single side or two-sided reparation is completed with taking out from circuit board prosthetic device 30, and the circuit board is placed on It on circuit board neonychium, is so stacked alternately, is effectively prevented and is in contact between two pieces of circuit boards and collision leads to circuit board Damage.
Please see Fig. 2 to Fig. 4, the present invention also provides a kind of circuit board repair systems 1, including feeding device 10, intelligence Rechecking device 20, circuit board prosthetic device 30 and material collecting device 40;Wherein, intelligent rechecking device includes the first delivery platform 21, mechanism 22, the first driving mechanism 23 and the first control mechanism (not marking) are imaged, first delivery platform 21 is for carrying With transport circuit board to be repaired, the top side of the first delivery platform 21 is arranged in camera shooting mechanism 22, and the first driving mechanism 23 can drive Camera shooting mechanism 22 moves in the plane for being parallel to the first delivery platform 21 along orthogonal both direction, the first control mechanism It is electrically connected with the first delivery platform 21, camera shooting mechanism 22, the first driving mechanism 23 and circuit board prosthetic device 30, and the first control Artificial intelligence (AI) processing software is mounted in mechanism processed.
Specifically, the first delivery platform 21 may include be parallel to each other and compartment of terrain distribution at least two rollers and drive Moving part, roller can be sequentially connected by synchronous belt and gear set and actuator, and the first delivery platform 21 also may include conveying Band, at least two transmission shafts and actuator, the encirclement that transmission shaft is threaded through conveyer belt is intracavitary and tighten conveyer belt, and transmission shaft is logical It crosses synchronous belt and gear set and actuator is sequentially connected, certainly, as the case may be and demand, in other embodiments of the invention In, the first delivery platform 21 can also include other components, not limit uniquely herein;Imaging mechanism 22 includes camera and photograph Bright component;First driving mechanism 23 includes the first guide rail, the second guide rail, the first driving assembly and the second driving assembly, wherein the One guide rail is in vertical distribution with the second guide rail, and the first guide rail is erected at the top side of the first delivery platform 21, and the setting of the second guide rail exists The side of first delivery platform 21, the first guide rail are slidably connected by bracket and the second guide rail, and the setting of the first driving assembly is the On one guide rail, camera shooting mechanism 22 can be driven to move back and forth along the first guide rail, the second driving assembly is arranged on the second guide rail, can To drive the first guide rail to move back and forth along the second guide rail, the first driving assembly and the second driving assembly may include respectively screw rod, Sliding block and actuator, or including synchronizing wheel, synchronous belt, sliding block and actuator, herein, between screw rod, sliding block and actuator or Connection type between person's synchronizing wheel, synchronous belt, sliding block and actuator uses connection type customary in the art, and actuator can be with It is motor, rotary cylinder or hydraulic motor etc., certainly, as the case may be and demand, in other embodiments of the invention, First driving mechanism 23 can also include other components, not limit uniquely herein;First control mechanism may include control master Machine and display, wherein display is electrically connected with control host, is controlled in host and is mounted with artificial intelligence process software, the people Work Intelligent treatment software can by image data and database that camera acquires in real time qualification parameters and technical staff set Fixed fault-tolerant parameter is compared, and then the oxidation of real time filtering copper face, dust, copper wire corner design and practical etching error etc. are made At Artifact, confirmation short circuit convex copper, lacks the true defects such as weldering, and is based on deep learning function, passes through recording technique personnel couple The adjustment law of fault-tolerant parameter carries out self-teaching and improves the range of qualification parameters, and then improves the essence for excluding Artifact Exactness.
It is understood that circuit board repair system 1 may include one, two or more circuit board prosthetic device 30, it is serially connected between two or more circuit board prosthetic devices 30, each circuit board prosthetic device 30 has different reparations Function, and then the number of drawbacks reparation on circuit board to be repaired can be realized within an operation cycle.
Circuit board repair system 1 provided by the invention is repaired using intelligent rechecking device 20 with feeding device 10, circuit board Apparatus for coating 30 and material collecting device 40 cooperate, and realize the Artifact on automatic fitration circuit board to be repaired by intelligent rechecking device 20, And the work for being accomplished manually retractable circuit board is substituted by feeding device 10 and material collecting device 40, so that reinspection process is not necessarily to Worker participates in, and manually carries out that reinspection labor intensity is high, quality is irregular, low efficiency to circuit board to efficiently solve Technical problem reduces the labor intensity of worker, improves the precision and efficiency of circuit board reparation.
Further, Fig. 2 and Fig. 3 are please referred to, a kind of specific implementation as circuit board repair system provided by the invention Mode, circuit board prosthetic device 30 include the second delivery platform 31, repairing mechanism 32, the second driving mechanism 33 and the second control Mechanism (does not mark), wherein the second delivery platform 31 is connected with the first delivery platform 21, for carrying and transporting circuit to be repaired Plate, the top side of the second delivery platform 31 is arranged in repairing mechanism 32, and repairing mechanism 32 includes laser cutting machine, high speed rotation At least one of scraper, Repair Welding Machine, the second driving mechanism 33 can drive repairing mechanism 32 being parallel to the second delivery platform It moves, and is gone up and down along the direction perpendicular to the second delivery platform 31, second along orthogonal both direction in 31 plane Control mechanism is electrically connected with the first control mechanism, the second delivery platform 31, repairing mechanism 32 and the second driving mechanism 33.Specifically Ground, the structure of the second delivery platform 31 are consistent with the structure of the first delivery platform 21;The structure and first of second driving mechanism 33 The structure of driving mechanism 23 is almost the same, and the two distinctive points are, the second driving mechanism 33 to the first driving mechanism more than 23 one Set drives repairing mechanism 32 along the lifting assembly of the direction lifting perpendicular to the second delivery platform 31, which may include Motor, screw rod and sliding block etc., the screw rod for driving the sliding block being fastenedly connected with repairing mechanism 32 to be arranged in a vertical direction by motor It moves back and forth, also may include telescopic cylinder and guide rail, drive repairing mechanism 32 to be arranged in a vertical direction by telescopic cylinder Guide rail move back and forth, certainly, as the case may be and demand, in other embodiments of the invention, the lifting assembly is also It may include straight line slide unit etc., do not limit uniquely herein;Repairing mechanism 32 includes laser cutting machine and/or high speed rotation scraper And/or Repair Welding Machine, at least one of circuit board defects such as short circuit, convex copper, open circuit can be repaired, be cut by laser herein Machine, high speed rotation scraper and Repair Welding Machine are that circuit board commonly used in the art repairs machine;Second control mechanism can be ability Common programmable logic controller (PLC) or computer, can receive the detection data of the first control mechanism, and control in domain The second delivery platform 31, repairing mechanism 32 and the second driving mechanism 33 is made to modify to the true defect point on circuit board to be repaired. Circuit board repair system 1 by circuit board prosthetic device 30 to circuit board to be repaired realization is automatically repaired function, reduce manpower at This, improves the reparation precision and efficiency of circuit board.
Optionally, referring to Fig. 5, a kind of specific embodiment as circuit board repair system provided by the invention, electricity Road plate repair system 1 further includes the 4th conveying device 90, and the setting of the 4th conveying device 90 is in feeding device 10, intelligence reinspection dress Set the side of 20, circuit board prosthetic device 30 and material collecting device 40, and respectively with feeding device 10, intelligent rechecking device 20, Circuit board prosthetic device 30 and material collecting device 40 are connected, and herein, intelligent rechecking device 20 includes the first workbench, camera shooting mechanism 22, the first driving mechanism 23 and the first control mechanism, circuit board prosthetic device 30 include the second workbench, repairing mechanism 32, Second driving mechanism 33 and the second control mechanism, first workbench and the second workbench are respectively used to carry circuit to be repaired Plate, but do not have transportation function.Specifically, the 4th conveying device 90 may include multiple-rotor mechanical arm and pallet, or packet Include multiple-rotor mechanical arm and fixture, wherein multiple-rotor mechanical arm includes at least three steering engines and at least three section linking arms, in pallet On be provided with multiple suckers, certainly, as the case may be and demand, in other embodiments of the invention, the 4th conveying device 90 can also include the other components that can be realized crawl circuit board, not limit uniquely herein.Circuit board repair system 1 in this way Circuit board to be repaired can be transported on intelligent rechecking device 20 from feeding device 10 by the 4th conveying device 90, or will be to It repairs circuit board to be transported on circuit board prosthetic device 30 from intelligent rechecking device 20, or by circuit board to be repaired from circuit board reparation Device 30 is transported on material collecting device 40, so that the structure of circuit board repair system 1 is more compact, significantly reduces intelligence The design difficulty of processing of energy rechecking device 20 and circuit board prosthetic device 30, can satisfy the layout requirements of more workshops, Expand the scope of application of circuit board repair system 1.
Further, Fig. 2 and Fig. 3 are please referred to, a kind of specific implementation as circuit board repair system provided by the invention Mode, feeding device 10 include third driving mechanism 11, the first elevating mechanism 12 and the first manipulator 13;Wherein, first liter Descending mechanism 12 is arranged in third driving mechanism 11, and third driving mechanism 11 can drive the first elevating mechanism 12 in the horizontal direction Mobile, the first manipulator 13 is arranged on the first elevating mechanism 12, and for grabbing circuit board to be repaired, the first elevating mechanism 12 can be with The first manipulator 13 is driven to rise or decline;The structure of material collecting device 40 is consistent with the structure of feeding device 10.Specifically, it receives Expect that device 40 includes the 4th driving mechanism 41, the second elevating mechanism 42 and the second manipulator 43, wherein the 4th driving mechanism 41 Structure it is consistent with the structure of third driving mechanism 11, the structure one of the structure of the second elevating mechanism 42 and the first elevating mechanism 12 It causes, the structure of the second manipulator 43 is consistent with the structure of the first manipulator 13;Third driving mechanism 11 can be straight line slide unit, the One elevating mechanism 12 can be telescopic cylinder, certainly, as the case may be and demand, and in other embodiments of the invention, the Three driving mechanisms 11 may include telescopic cylinder and guide rail etc., and the first elevating mechanism 12 may include motor and cable wire etc., herein Do not limit uniquely, one end of the telescopic cylinder is slidably connected in the linear guide of the straight line slide unit, the telescopic cylinder it is another One end is fastenedly connected with the first manipulator 13, drives the first manipulator 13 along perpendicular by the telescopic moving of the piston rod of telescopic cylinder Histogram ramps up or declines, and the first manipulator 13 may include at least three mechanical fingers, be provided on each mechanical finger to Few first sucker, the first sucker are connected to by tracheae with the vacuum pump of external connection.When needing to grab circuit board, Third driving mechanism 11 first drives the first elevating mechanism 12 and the first manipulator 13 to be moved to the top of circuit board, and then first liter Descending mechanism 12 drives the first manipulator 13 to decline, until the first sucker on the first manipulator 13 touches the surface of circuit board, Then starting vacuum pump forms suction at the suction inlet of the first sucker and circuit board is sucked, and then the first elevating mechanism 12 drives Increase the first manipulator 13 and circuit board, circuit board crawl can be completed.Cost of labor is reduced in this way, improves circuit board The production efficiency of repair system.
In addition, in order to adapt to the layout requirements of different workshops, it can be in feeding device 10 and intelligent rechecking device 20 Between the second conveying device 70 is set, between circuit board prosthetic device 30 and material collecting device 40 be arranged third conveying device 80, Wherein, the structure of the second conveying device 70 is consistent with the structure of third conveying device 80, and feeding device 10 passes through the second conveying dress 70 are set by circuit board conveying to be repaired to intelligent rechecking device 20, circuit board prosthetic device 30 will be complete by third conveying device 80 It is exported at the circuit board of reparation, and material collecting device 40 is waited to grab, so that circuit board is in 1 corner of circuit board repair system Steering is more smooth, expands the scope of application of circuit board repair system 1.
Further, Fig. 3 and Fig. 4 are please referred to, a kind of specific implementation as circuit board repair system provided by the invention Mode, feeding device 10 can also include feed mechanism 14, meanwhile, material collecting device 40 can also include receiving mechanism 44, on this Expect that the structure of mechanism 14 is consistent with the structure of receiving mechanism 44.Specifically, feed mechanism 14 includes first support 141 and third liter Come down to a lower group part 142, receiving mechanism 44 includes second support 441 and the 4th lifting assembly 442, wherein the structure of first support 141 with The structure of second support 441 is consistent, and the structure of third lifting assembly 142 is consistent with the structure of the 4th lifting assembly 442, third liter Part 142 of coming down to a lower group can drive first support 141 to rise or decline along the vertical direction.Before circuit board repair system 1 starts, need First circuit board level to be repaired is overlayed in first support 141, after circuit board repair system 1 starts, third lifting assembly 142 It drives 141 ejection of first support circuit board to be repaired to rise, the circuit board to be repaired positioned at top is made to maintain same work always On face, circuit board to be repaired is grabbed convenient for the first manipulator 13, after circuit board to be repaired is completed to repair, the second manipulator 43 The circuit board that circuit board prosthetic device 30 exports is grabbed and is placed in second support 441, the 4th lifting assembly 442 drives Second support 441 drives circuit board decline, reserves enough placement spaces for next piece of circuit board, until the height that circuit board stacks Degree reaches preset working face, and circuit board repair system 1 can be reminded or neatly packed circuit board is transported out of receiving mechanism 44, Ensure that circuit board repair system 1 operates smoothness.
Further, please see Fig. 2 to Fig. 4, a kind of specific implementation as circuit board repair system provided by the invention Mode, circuit board repair system 1 further include that packing material collects apparatus for temporary storage (not marking), which collects apparatus for temporary storage and include Packing material collecting mechanism 51 and packing material holding structure 52, wherein the side of feeding device 10 is arranged in packing material collecting mechanism 51 Side is conveyed through the packing material come for receiving the first manipulator 13, and the side of material collecting device 40 is arranged in packing material holding structure 52 Side is grabbed for keeping in packing material for the second manipulator 43.Specifically, the structure of packing material collecting mechanism 51 and packing material storage The structure of mechanism 52 is consistent, and packing material collecting mechanism 51 includes third bracket 511 and the 5th lifting assembly 512, packing material storage Mechanism 52 includes the 4th bracket 521 and the 6th lifting assembly 522, wherein the structure of third bracket 511 and the 4th bracket 521 Structure is consistent, and the structure of the 5th lifting assembly 512 is consistent with the structure of the 6th lifting assembly 522, and the 5th lifting assembly 512 can be with Third bracket 511 is driven to rise or decline along the vertical direction.It is led in order to avoid mutually being scraped between two pieces of adjacent circuit boards It causes circuit board by secondary damage, a piece of neonychium (i.e. packing material), the protection can be placed between two pieces of adjacent circuit boards Pave the effect of protection and packaging.Feeding device 10 during feeding, the first manipulator 13 can by circuit board to be repaired and Neonychium is seriatim transported on intelligent rechecking device 20 and packing material collecting mechanism 51, process of the material collecting device 40 in rewinding In, neonychium can be grabbed first from packing material holding structure 52 and is placed in second support 441 by the second manipulator 43, be connect From circuit board prosthetic device 30 will complete repair circuit board grab and be placed on neonychium, so analogize, complete The block pattern row pattern of circuit board.
Further, referring to Fig. 4, a kind of specific embodiment as circuit board repair system provided by the invention, Circuit board repair system 1 further includes the first conveying device 60, which is arranged in 51 He of packing material collecting mechanism Between packing material holding structure 52, for packing material to be transported to packing material holding structure 52 from packing material collecting mechanism 51 On.Specifically, the first conveying device 60 may include four rotor axis mechanical arms 61 and pallet 62, wherein four rotor axis mechanical arms 61 packet Four steering engines and four section linking arms are included, four steering engines are rotatably connected on two adjacent sections linking arm or linking arm and pallet 62 respectively Between, mobile pallet 62, overturning and lifting can be driven, is provided with multiple second suckers on pallet 62, which passes through Tracheae is connected to the vacuum pump of external connection.Certainly, as the case may be and demand, in other embodiments of the invention In, the structure of the first conveying device 60 can be similar with the structure of feeding device 10, equally include driving mechanism, elevating mechanism and Manipulator etc., does not limit uniquely herein.When needing to transport neonychium, four rotor axis mechanical arms 61 first drive pallet 62 to be moved to The top of packing material collecting mechanism 51 then drives pallet 62 to decline, and up to the second sucker and is placed on packing material collecting mechanism Neonychium contact on 51, then starts vacuum pump, and neonychium is sucked the second sucker, and then four rotor axis mechanical arms 61 drive Increase pallet 62 and overturn, is placed on neonychium on the surface of pallet 62, pallet 62 is then driven to be moved to packaging The top of object holding structure 52 then drives pallet 62 to overturn and declines, is then shut off vacuum pump, neonychium is discharged Onto packing material holding structure 52.The rate flow for improving packing material in this way not only reduces cost of labor, and reduces The packing cost of circuit board.
Further, referring to Fig. 4, a kind of specific embodiment as circuit board repair system provided by the invention, Circuit board repair system 1 further includes turnover device (not shown), and turnover device setting is in circuit board prosthetic device 30 and intelligence The side of rechecking device 20, or be arranged between feeding device 10 and material collecting device 40, for will complete single side reparation to Repair circuit board overturning.Specifically, the structure of turnover device can be consistent with the structure of the first transport device 60, including four turning engines Tool arm 61 and pallet 62, by pallet 62 from circuit board prosthetic device 30 or material collecting device 40 by complete single side reparation to Circuit board crawl is repaired, then drives pallet 62 to overturn the circuit board to be repaired by four rotor axis mechanical arms 61, and by the circuit to be repaired Plate is placed on intelligent rechecking device 20 or feeding device 10, carries out reparation process to the another side of circuit board to be repaired.In this way Using turnover device instead of artificial reverse circuit plate, cost of labor is reduced, improves the production effect of circuit board repair system Rate.Certainly, as the case may be and demand, in other embodiments of the invention, turnover device can be the machine of other structures Tool hand, or including components such as motor, shaft and roll-over tables, do not limit uniquely herein.
The above is only alternative embodiments of the invention, are not intended to restrict the invention.For those skilled in the art For member, the invention may be variously modified and varied.All within the spirits and principles of the present invention, it is made it is any modification, Equivalent replacement, improvement etc., should be included within scope of the presently claimed invention.

Claims (10)

1. circuit board renovation method, which comprises the steps of:
S01, will be on multiple circuit board conveyings to feeding device to be repaired;
Multiple circuit boards to be repaired are transported on intelligent rechecking device by S02, the feeding device one by one;
The circuit board defect that S03, the intelligent rechecking device are rechecked to the circuit board to be repaired and needs marked to repair;
S04, it will complete on the circuit board conveying to be repaired to circuit board prosthetic device rechecked;
S05, the circuit board prosthetic device carry out the circuit board to be repaired according to the inspection result of the intelligent rechecking device It repairs;
S06, material collecting device will complete the circuit board block pattern row pattern repaired.
2. circuit board renovation method as described in claim 1, which is characterized in that further include following steps:
S07, the circuit board to be repaired for completing single side reparation is overturn;
S08, repeat step S01 to step S06.
3. circuit board renovation method as claimed in claim 2, which is characterized in that in the step S02 further include:
Multiple circuit board neonychiums are transported to packing material one by one and collected on apparatus for temporary storage by S021, the feeding device.
4. circuit board renovation method as claimed in claim 3, which is characterized in that the step S06 includes:
S061, the material collecting device are collected from the packing material and take out the circuit board neonychium on apparatus for temporary storage;
The circuit board for completing to repair is placed on the circuit board neonychium by S062, the material collecting device.
5. circuit board repair system, which is characterized in that including feeding device, intelligent rechecking device, circuit board prosthetic device and Material collecting device;It is described intelligence rechecking device include:
First delivery platform, for carrying and transporting the circuit board to be repaired;
Mechanism is imaged, the top side of first delivery platform is set to;
First driving mechanism can drive camera shooting mechanism edge in the plane for being parallel to first delivery platform to be mutually perpendicular to Two directions it is mobile;And
First control mechanism, with first delivery platform, the camera shooting mechanism, first driving mechanism and the circuit The electrical connection of plate prosthetic device, and artificial intelligence process software is mounted in first control mechanism.
6. circuit board repair system as claimed in claim 5, which is characterized in that the circuit board prosthetic device includes:
Second delivery platform is connected with first delivery platform, for carrying and transporting the circuit board to be repaired;
Repairing mechanism, is set to the top side of second delivery platform, and the repairing mechanism includes laser cutting machine, high speed rotation At least one of scraper, Repair Welding Machine;
Second driving mechanism can drive repairing mechanism edge in the plane for being parallel to second delivery platform to be mutually perpendicular to Two directions it is mobile, and gone up and down along the direction perpendicular to second delivery platform;And
Second control mechanism drives with first control mechanism, second delivery platform, the repairing mechanism and described second The electrical connection of motivation structure.
7. circuit board repair system as claimed in claim 5, which is characterized in that the feeding device includes:
Third driving mechanism;
First elevating mechanism is set in the third driving mechanism, and the third driving mechanism can drive first lifting Mechanism moves in the horizontal direction;And
First manipulator is set on first elevating mechanism, and for grabbing circuit board to be repaired, first elevating mechanism can First manipulator is driven to rise or fall;
The structure of the material collecting device is consistent with the structure of the feeding device.
8. circuit board repair system as claimed in claim 7, which is characterized in that further include:
Packing material collects apparatus for temporary storage, including packing material collecting mechanism and packing material holding structure, the packing material collecting mechanism It is set to the side of the feeding device, is conveyed through the packing material come for receiving first manipulator, the packing material is deposited Laying mechanism is set to the side of the material collecting device, grabs for keeping in packing material for second manipulator.
9. circuit board repair system as claimed in claim 8, which is characterized in that further include:
First conveying device is set between the packing material collecting mechanism and the packing material holding structure, for that will pack Object is transported on the packing material holding structure from the packing material collecting mechanism.
10. circuit board repair system as claimed in claim 5, which is characterized in that further include:
Turnover device is set to the side or the feeding device of the circuit board prosthetic device and the intelligent rechecking device Between the material collecting device, for the circuit board overturning to be repaired of single side reparation will to be completed.
CN201910282824.5A 2019-04-10 2019-04-10 Circuit board renovation method and system Pending CN109936927A (en)

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CN109219261A (en) * 2018-10-23 2019-01-15 奥蒂玛光学科技(深圳)有限公司 The restorative procedure of circuit board automatic repariring equipment and circuit board
CN110455822A (en) * 2019-07-10 2019-11-15 苏州卓融新能源科技有限公司 A kind of detection method of pcb board defect
CN110579479A (en) * 2019-08-09 2019-12-17 康代影像科技(苏州)有限公司 PCB maintenance system and maintenance method based on false point defect detection
CN113784526A (en) * 2021-11-11 2021-12-10 四川英创力电子科技股份有限公司 Printed circuit board screen printing solder mask method
CN114308701A (en) * 2021-12-29 2022-04-12 广东炬森智能装备有限公司 Overhauling system and overhauling method of PCB (printed circuit board) thin plate
CN115656311A (en) * 2022-11-09 2023-01-31 中国人民解放军战略支援部队航天工程大学 Device and method for preparing metastable atomic beam of inert gas
CN110579479B (en) * 2019-08-09 2024-07-16 苏州康代智能科技股份有限公司 PCB overhaul system and overhaul method based on false point defect detection

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CN109219261A (en) * 2018-10-23 2019-01-15 奥蒂玛光学科技(深圳)有限公司 The restorative procedure of circuit board automatic repariring equipment and circuit board
CN110455822A (en) * 2019-07-10 2019-11-15 苏州卓融新能源科技有限公司 A kind of detection method of pcb board defect
CN110579479A (en) * 2019-08-09 2019-12-17 康代影像科技(苏州)有限公司 PCB maintenance system and maintenance method based on false point defect detection
WO2021027184A1 (en) * 2019-08-09 2021-02-18 苏州康代智能科技股份有限公司 Pcb maintenance system and maintenance method based on false point defect detection
CN110579479B (en) * 2019-08-09 2024-07-16 苏州康代智能科技股份有限公司 PCB overhaul system and overhaul method based on false point defect detection
CN113784526A (en) * 2021-11-11 2021-12-10 四川英创力电子科技股份有限公司 Printed circuit board screen printing solder mask method
CN114308701A (en) * 2021-12-29 2022-04-12 广东炬森智能装备有限公司 Overhauling system and overhauling method of PCB (printed circuit board) thin plate
CN115656311A (en) * 2022-11-09 2023-01-31 中国人民解放军战略支援部队航天工程大学 Device and method for preparing metastable atomic beam of inert gas

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