CN109930182A - A kind of method of wet process production nickel alloy precision parts - Google Patents

A kind of method of wet process production nickel alloy precision parts Download PDF

Info

Publication number
CN109930182A
CN109930182A CN201811607239.XA CN201811607239A CN109930182A CN 109930182 A CN109930182 A CN 109930182A CN 201811607239 A CN201811607239 A CN 201811607239A CN 109930182 A CN109930182 A CN 109930182A
Authority
CN
China
Prior art keywords
substrate
wet process
precision parts
solution
process production
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201811607239.XA
Other languages
Chinese (zh)
Inventor
朱俊涛
王洁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Platinum Geng Technology Co Ltd
Original Assignee
Shanghai Platinum Geng Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Platinum Geng Technology Co Ltd filed Critical Shanghai Platinum Geng Technology Co Ltd
Priority to CN201811607239.XA priority Critical patent/CN109930182A/en
Publication of CN109930182A publication Critical patent/CN109930182A/en
Pending legal-status Critical Current

Links

Landscapes

  • ing And Chemical Polishing (AREA)

Abstract

The invention discloses a kind of methods of wet process production nickel alloy precision parts, include the following steps, S1: substrate grinding, S2: pad pasting, S3: exposure, S4: development, S5: microalloy deposition, S6: demoulding and ultrasonic cleaning, S7: detection assembling;It is innovated from semiconductor wet process etch process reverse phase, increases material technology in conjunction with the wet process such as dry film and MEMS nickel alloy chemistry, by exposure, the complicated technologies such as development, micro- electroforming produce the high-accuracy components with complex figure;The present invention, which quick, inexpensive can obtain, has complex figure, the two dimension of precision size or 3-dimensional metal components, very wide in the fields application such as clockwork part, microelectronics, aerospace, sensor, has the huge market demand.

Description

A kind of method of wet process production nickel alloy precision parts
Technical field
The present invention relates to close parts machining technical field, specially a kind of wet process makes nickel alloy precision parts Method.
Background technique
Precision parts refer to the higher parts machining classification of required precision, " precision " refer to tolerance ± Within 0.005 ㎜, it is generally used in the industries such as electronics, clock and watch, aviation.Existing processing technology fine etching and precision stamping skill Art and the laser processing technology Shortcomings in material, precision and batch production cost, cause tolerance larger, product closes Lattice rate is low, influences productivity effect.
Summary of the invention
The purpose of the present invention is to provide a kind of methods of wet process production nickel alloy precision parts, to solve above-mentioned back The problem of being proposed in scape technology.
To achieve the above object, the invention provides the following technical scheme: a kind of wet process makes nickel alloy precision parts Method, comprising the following steps:
S1: substrate grinding, S2: pad pasting, S3: exposure, S4: development, S5: microalloy deposition, S6: demoulding and ultrasonic cleaning, S7: Detection assembling.
Preferably, in the step S1, specific steps are as follows: choose planar metal base plate, substrate surface is cleaned and is ground, clearly Substrate is put into baking oven after washing and toasts drying, baking temperature is 150~180 DEG C;The substrate is stainless steel substrate, thickness For 4mm.
Preferably, in the step S2, specific steps are as follows: pad pasting process will be had using full-automatic or Semi-automatic film sticking machine There is the photosensitive dry film material of UV photocuring reaction, layer-by-layer hot pressing is in substrate surface;The dry film thickness in monolayer is 500 μm, hot pressing Afterwards pad pasting with a thickness of 600 μm.
Preferably, in the step S3, specific steps are as follows: the negative film film or light shield of complex precise figure will be had, with It vacuumizes form and is close to dry film surface, then use half directional light, directional light or point light source exposure machine, fluorescent tube is exposed using UV lamp pipe Light, UV light are irradiated on dry film from the clear area from figure, and photocuring reaction occurs for the dry film of corresponding position;The exposure machine function Rate is 100KW, and light exposure 4000C, UV lamp pipe is high-pressure sodium lamp.
Preferably, in the step S4, using developing machine, development operation carried out to the substrate exposed, when development is adjusted Photographic parameter are as follows:
Sodium carbonate or solution of potassium carbonate weight percent are 0.3~0.4%;
Speed: 0.2~2.0mm/s;
Pressure: 0.2~2.0kg;
The pH value of weak caustic solution: 7.5~9.0;
Temperature: 22.0~40.0 DEG C;
After development, it is rinsed being put into sodium carbonate or solution of potassium carbonate substantially, final substrate is stagnated 10 minutes or more Or it is toasted 9~10 minutes in 30~50 DEG C of baking oven.
Preferably, in the step S5, microalloy depositing device is by alloy deposition slot, anode and cathode, high-frequency direct-current or pulse Power supply, alloy deposition solution, temperature control instrument, circulating filtration equipment and rocking equipment composition, the alloy deposition solution are addition The nickel sulfamic acid solution mixed solution of sodium hypophosphite.
Preferably, in the step S5, operating procedure is that the substrate to have developed is fixed on tough cathode fixture, is put into In alloy deposition slot, solution height is more than substrate height in slot, connects power supply line, starts rocking equipment or so or shakes up and down Pendulum.
Preferably, in the step S6, specific steps are as follows: the substrate after completion alloy deposition is put into stripping chute, is taken off Substrate is taken out after the completion of mould, tweezer plays the nickel-based alloy flakes on substrate, is put into ultrasonic bath and cleans, by nickel-based alloy flakes After eliminating impurities in upper aperture are clean, nickel-based alloy flakes are placed on supporting plate, are dried;Solution in the stripping chute The component and parameter for including are as follows:
Sodium hydroxide or potassium hydroxide solution: weight percent is 1~10%;
PH=8.0~9.0;
Temperature: 80 DEG C;
Ultrasonic frequency: 22000HZ.
Preferably, in the step S7, specific steps are as follows: successively examine the nickel-base alloy sheet metal after cleaning, drying It looks into, checks relative dimensions precision, figure accuracy, aperture side wall smoothness, the nickel sheet thicknesses of complex precise figure, detection It finishes, qualified precision metallic components is packed according to specification.
Compared with prior art, the beneficial effects of the present invention are: the present invention is created from semiconductor wet process etch process reverse phase Newly, increase material technology in conjunction with the wet process such as dry film and MEMS nickel alloy chemistry, pass through exposure, the complicated technologies such as development, micro- electroforming To produce the high-accuracy components with complex figure;The present invention, which quick, inexpensive can obtain, has complex figure, size essence Close two dimension or 3-dimensional metal components, it is very wide in the fields application such as microelectronics, aerospace, sensor, there is huge city Field demand.
Detailed description of the invention
Fig. 1 is step flow diagram of the invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other Embodiment shall fall within the protection scope of the present invention.
Referring to Fig. 1, the present invention provides a kind of technical solution: a kind of side of wet process production nickel alloy precision parts Method, comprising the following steps:
S1: substrate grinding, S2: pad pasting, S3: exposure, S4: development, S5: microalloy deposition, S6: demoulding and ultrasonic cleaning, S7: Detection assembling.
Further, in the step S1, specific steps are as follows: planar metal base plate is chosen, substrate surface is cleaned and is ground, Substrate is put into baking oven after cleaning and toasts drying, baking temperature is 150~180 DEG C;The substrate is stainless steel substrate, thick Degree is 4mm.
Further, in the step S2, specific steps are as follows: pad pasting process, will using full-automatic or Semi-automatic film sticking machine Photosensitive dry film material with UV photocuring reaction, layer-by-layer hot pressing is in substrate surface;The dry film thickness in monolayer is 500 μm, heat Pad pasting with a thickness of 600 μm after pressure.
Further, in the step S3, specific steps are as follows: the negative film film or light shield of complex precise figure will be had, It is close to dry film surface in the form of vacuumizing, then uses half directional light, directional light or point light source exposure machine, fluorescent tube uses UV lamp pipe Exposure, UV light are irradiated on dry film from the clear area from figure, and photocuring reaction occurs for the dry film of corresponding position;The exposure machine Power is 100KW, and light exposure 4000C, UV lamp pipe is high-pressure sodium lamp.
Further, in the step S4, using developing machine, development operation carried out to the substrate exposed, tune when development Save photographic parameter are as follows:
Sodium carbonate or solution of potassium carbonate weight percent are 0.3~0.4%;
Speed: 0.2~2.0mm/s;
Pressure: 0.2~2.0kg;
The pH value of weak caustic solution: 7.5~9.0;
Temperature: 22.0~40.0 DEG C;
After development, it is rinsed being put into sodium carbonate or solution of potassium carbonate substantially, final substrate is stagnated 10 minutes or more Or it is toasted 9~10 minutes in 30~50 DEG C of baking oven.
Further, in the step S5, microalloy depositing device is by alloy deposition slot, anode and cathode, high-frequency direct-current or arteries and veins Power supply, alloy deposition solution, temperature control instrument, circulating filtration equipment and rocking equipment composition are rushed, the alloy deposition solution is to add Add the nickel sulfamic acid solution mixed solution of sodium hypophosphite.
Further, in the step S5, operating procedure is that the substrate to have developed is fixed on tough cathode fixture, is put Enter in alloy deposition slot, solution height is more than substrate height in slot, connects power supply line, starts rocking equipment or so or shakes up and down Pendulum.
1. it is further, in the step S6, specific steps are as follows: the substrate after completion alloy deposition is put into stripping chute In, substrate is taken out after the completion of demoulding, tweezer plays the nickel-based alloy flakes on substrate, is put into ultrasonic bath and cleans, by Ni-based conjunction After eliminating impurities on golden thin slice in aperture are clean, nickel-based alloy flakes are placed on supporting plate, are dried;The stripping chute The component and parameter that middle solution includes are as follows:
Sodium hydroxide or potassium hydroxide solution: weight percent is 1~10%;
PH=8.0~9.0;
Temperature: 80 DEG C;
Ultrasonic frequency: 22000HZ.
Further, in the step S7, specific steps are as follows: successively examine the nickel-base alloy sheet metal after cleaning, drying It looks into, checks relative dimensions precision, figure accuracy, aperture side wall smoothness, the nickel sheet thicknesses of complex precise figure, detection It finishes, qualified precision metallic components is packed according to specification.
Working principle:
In step sl, preprocessing processing is carried out to the substrate for playing the role of carrying, by the impurity of substrate surface, scratch and recessed Salient point is cleared up, and is avoided occurring fold and bubble in next step in pad pasting, after cleaning, is dried to being put into baking oven substantially It is dry.
In step s 2, using laminator to substrate surface pad pasting, the film of patch is that there is the photosensitive of UV photocuring reaction to do Membrane material, the layer-by-layer hot pressing of multilayer guarantee corrugationless and bubble after pad pasting in substrate surface.
In step s3, the negative film film that will have complex precise figure or light shield are pasted into dry film surface, uses UV later Lamp luminescence exposure, light are irradiated on film via the negative film film of complex precise figure or the transmission region of light shield, make film Solidification is formed and corresponding pattern on the negative film film or light shield of complex precise figure.
In step S4, using developing machine and weak caustic solution, weak caustic solution will not have the membrane material of photocuring molten on substrate Solution washes away, and the material of photocuring has the close figure of complexity with shape same on the film or light shield.
In step S5, place a substrate in alloy deposition slot, and be powered, it is logical by substrate and alloy deposition solution Electricity reacts, and causes deposition, to realize that alloy is accumulated;According to the thickness for the high-accuracy alloyed components of complexity to be made come It sets corresponding size of current and alloy deposition time, after alloy deposition thickness range to be achieved, that is, is automatically stopped alloy deposition Alloy deposition is completed in operation.
In step S6, substrate is demoulded, and takes out nickel-based alloy flakes, using being cleaned in ultrasonic bath;By nickel-base alloy After eliminating impurities on thin slice in aperture are clean, nickel-based alloy flakes are placed on supporting plate, after washing drying, that is, are completed Make components nickel-base alloy alloy deposition steel sheet metal piece process.
In step S7, the dimensions of nickel-base alloy sheet metal is checked, guarantees the qualification rate for selling product.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding And modification, the scope of the present invention is defined by the appended.

Claims (9)

1. a kind of method of wet process production nickel alloy precision parts, it is characterised in that: the following steps are included:
S1: substrate grinding, S2: pad pasting, S3: exposure, S4: development, S5: microalloy deposition, S6: demoulding and ultrasonic cleaning, S7: Detection assembling.
2. a kind of method of wet process production nickel alloy precision parts according to claim 1, it is characterised in that: described In step S1, specific steps are as follows: choose planar metal base plate, substrate surface is cleaned and is ground, substrate is put into baking after cleaning Drying is toasted in case, baking temperature is 150~180 DEG C;The substrate is stainless steel substrate, with a thickness of 4mm.
3. a kind of method of wet process production nickel alloy precision parts according to claim 1, it is characterised in that: described In step S2, specific steps are as follows: pad pasting process, will be with the photosensitive of UV photocuring reaction using full-automatic or Semi-automatic film sticking machine Dry film material, layer-by-layer hot pressing is in substrate surface;The dry film thickness in monolayer is 500 μm, pad pasting with a thickness of 600 μm after hot pressing.
4. a kind of method of wet process production nickel alloy precision parts according to claim 1, it is characterised in that: described In step S3, specific steps are as follows: the negative film film or light shield of complex precise figure will be had, dry film table is close in the form of vacuumizing Then face uses half directional light, directional light or point light source exposure machine, fluorescent tube is exposed using UV lamp pipe, and UV light is saturating from figure Area pellucida is irradiated on dry film, and photocuring reaction occurs for the dry film of corresponding position;The exposure machine power is 100KW, and light exposure is 4000C, UV lamp pipe are high-pressure sodium lamp.
5. a kind of method of wet process production nickel alloy precision parts according to claim 1, it is characterised in that: described In step S4, using developing machine, development operation carried out to the substrate exposed, when development adjusts photographic parameter are as follows:
Sodium carbonate or solution of potassium carbonate weight percent are 0.3~0.4%;
Speed: 0.2~2.0mm/s;
Pressure: 0.2~2.0kg;
The pH value of weak caustic solution: 7.5~9.0;
Temperature: 22.0~40.0 DEG C;
After development, it is rinsed being put into sodium carbonate or solution of potassium carbonate substantially, final substrate is stagnated 10 minutes or more Or it is toasted 9~10 minutes in 30~50 DEG C of baking oven.
6. a kind of method of wet process production nickel alloy precision parts according to claim 1, it is characterised in that: described In step S5, microalloy depositing device is by alloy deposition slot, anode and cathode, high-frequency direct-current or the pulse power, alloy deposition solution, temperature Instrument, circulating filtration equipment and rocking equipment composition are controlled, the alloy deposition solution is the sulfamic acid for adding sodium hypophosphite Nickel solution mixed solution.
7. a kind of method of wet process production nickel alloy precision parts according to claim 6, it is characterised in that: described In step S5, operating procedure is that the substrate to have developed is fixed on tough cathode fixture, is put into alloy deposition slot, molten in slot Liquid height is more than substrate height, connects power supply line, starts rocking equipment or so or teeters.
8. a kind of method of wet process production nickel alloy precision parts according to claim 1, it is characterised in that: described In step S6, specific steps are as follows: the substrate after completion alloy deposition is put into stripping chute, is taken out substrate after the completion of demoulding, Tweezer plays the nickel-based alloy flakes on substrate, is put into ultrasonic bath and cleans, by the eliminating impurities on nickel-based alloy flakes in aperture After clean, nickel-based alloy flakes are placed on supporting plate, are dried;The component and parameter that solution includes in the stripping chute Are as follows:
Sodium hydroxide or potassium hydroxide solution: weight percent is 1~10%;
PH=8.0~9.0;
Temperature: 80 DEG C;
Ultrasonic frequency: 22000HZ.
9. a kind of method of wet process production nickel alloy precision parts according to claim 1, it is characterised in that: described In step S7, specific steps are as follows: the nickel-base alloy sheet metal after cleaning, drying is examined successively, checks complex precise figure Relative dimensions precision, figure accuracy, aperture side wall smoothness, nickel sheet thicknesses, detection finish, by qualified precision metallic Components are packed according to specification.
CN201811607239.XA 2018-12-27 2018-12-27 A kind of method of wet process production nickel alloy precision parts Pending CN109930182A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811607239.XA CN109930182A (en) 2018-12-27 2018-12-27 A kind of method of wet process production nickel alloy precision parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201811607239.XA CN109930182A (en) 2018-12-27 2018-12-27 A kind of method of wet process production nickel alloy precision parts

Publications (1)

Publication Number Publication Date
CN109930182A true CN109930182A (en) 2019-06-25

Family

ID=66984833

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811607239.XA Pending CN109930182A (en) 2018-12-27 2018-12-27 A kind of method of wet process production nickel alloy precision parts

Country Status (1)

Country Link
CN (1) CN109930182A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110703373A (en) * 2019-10-16 2020-01-17 中国科学院光电技术研究所 Method for manufacturing precise metal reflection grating
CN114571836A (en) * 2022-01-21 2022-06-03 浙江亚欣包装材料有限公司 Method for manufacturing micro-nano gold stamping plate

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101586247A (en) * 2009-06-22 2009-11-25 昆山美微电子科技有限公司 Binary electrodeposit processing method for metal atomizer plate
CN102094221A (en) * 2010-12-20 2011-06-15 昆山美微电子科技有限公司 Method for preparing SMT (surface mount technology) nickel-phosphorus alloy plate by dry-film wet process
CN107675214A (en) * 2017-09-14 2018-02-09 昆山美微电子科技有限公司 A kind of method that new electromolding alloy technique makes OLED evaporation covers FMM

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101586247A (en) * 2009-06-22 2009-11-25 昆山美微电子科技有限公司 Binary electrodeposit processing method for metal atomizer plate
CN102094221A (en) * 2010-12-20 2011-06-15 昆山美微电子科技有限公司 Method for preparing SMT (surface mount technology) nickel-phosphorus alloy plate by dry-film wet process
CN107675214A (en) * 2017-09-14 2018-02-09 昆山美微电子科技有限公司 A kind of method that new electromolding alloy technique makes OLED evaporation covers FMM

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110703373A (en) * 2019-10-16 2020-01-17 中国科学院光电技术研究所 Method for manufacturing precise metal reflection grating
CN114571836A (en) * 2022-01-21 2022-06-03 浙江亚欣包装材料有限公司 Method for manufacturing micro-nano gold stamping plate
CN114571836B (en) * 2022-01-21 2023-09-26 浙江亚欣包装材料有限公司 Manufacturing method of micro-nano gold stamping plate

Similar Documents

Publication Publication Date Title
CN102094221B (en) Method for preparing SMT (surface mount technology) nickel-phosphorus alloy plate by dry-film wet process
CN105186091B (en) A kind of production method of the extra small metal waveguide of terahertz wave band
CN107723752B (en) A kind of device and method of laser ablation glass mold layering micro electroforming
CN108231999B (en) Processing method of quartz resonator wafer
CN109930182A (en) A kind of method of wet process production nickel alloy precision parts
CN106575677B (en) The photovoltaic cell for being used to form the method for photovoltaic cell and being formed according to this method
CN107675214A (en) A kind of method that new electromolding alloy technique makes OLED evaporation covers FMM
CN105891939A (en) Novel injection molding light guide plate and machining process thereof
CN107193184A (en) A kind of method for preparing high-precision chromium plate mask plate circuitous pattern
CN108624922A (en) The method that electroformed layer uniformity is improved in metal microdevices LIGA forming processes
CN105676589A (en) Method for processing compact disc (CD) stripe on substrate surface by applying etching process
CN101403125B (en) Metal master mold for electroforming and use thereof
CN108445664A (en) A kind of backboard and preparation method thereof, backlight module and display device
CN103203973A (en) A production method for an electroformed stencil with mark points
CN105892084B (en) One kind is aluminized graduation element preparation method
CN103203980B (en) A kind of metal otter board with multiple step and preparation method thereof
CN103985948A (en) Low-loss manufacturing method of quartz probe
CN107819450B (en) Full quartz crystal resonator with improved packaging structure and preparation method thereof
CN210380790U (en) High fundamental frequency quartz wafer
CN103203952A (en) Production process of step stencil
CN111847847B (en) Preparation method of quartz pendulous reed
KR101180372B1 (en) Method of manufacturing micro-parts and micro-mold
CN100349047C (en) Passivation protection method for silicon-based liquid crystal aluminium reflection electrode
CN107177866A (en) The method that micro- radio frequency T-shaped power splitter is prepared in metallic substrates
TWI345656B (en) Method of manufacturing master of light-guide plates

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20190625

WD01 Invention patent application deemed withdrawn after publication