CN109926298B - Mode conversion ultrasonic transducer and manufacturing method thereof - Google Patents
Mode conversion ultrasonic transducer and manufacturing method thereof Download PDFInfo
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- CN109926298B CN109926298B CN201711364450.9A CN201711364450A CN109926298B CN 109926298 B CN109926298 B CN 109926298B CN 201711364450 A CN201711364450 A CN 201711364450A CN 109926298 B CN109926298 B CN 109926298B
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Abstract
The invention is applicable to the technical field of ultrasonic transduction, and discloses a mode conversion ultrasonic transducer and a manufacturing method thereof. The mode conversion ultrasonic transducer comprises a shell, a mode conversion piezoelectric patch and a circuit board, wherein the mode conversion piezoelectric patch is arranged in the shell, and the circuit board is connected with the mode conversion piezoelectric patch; the mode conversion piezoelectric patch comprises a plurality of piezoelectric blocks, one surface of the mode conversion piezoelectric patch is provided with a slot for the circuit board to be inserted into, the two sides of the slot are electrodes of the piezoelectric blocks, and the circuit board is inserted into the slot and connected with the electrodes. The manufacturing method is used for manufacturing the mode conversion ultrasonic transducer. According to the mode conversion ultrasonic transducer and the manufacturing method thereof provided by the invention, the electrodes of the piezoelectric blocks are led out by adopting the circuit board, the impedance consistency of each piezoelectric block is ensured, and grating lobes do not appear by utilizing a mode conversion mode, so that good sound field focusing performance is obtained.
Description
Technical Field
The invention belongs to the technical field of ultrasonic transduction, and particularly relates to a mode conversion ultrasonic transducer and a manufacturing method thereof.
Background
The core of the area array ultrasonic system is a two-dimensional area array ultrasonic transducer, and the current large-scale two-dimensional area array ultrasonic transducer has the problems of ensuring the simplicity of an array element vibration mode, the consistency of each array element, the simplicity and reliability of an array element lead method and no generation of serious side lobes and grating lobes in focusing deflection of a transducer sound field. A two-dimensional area array probe usually consists of one to thousands of individual piezoelectric array elements, and the length and width of each array element are very small, so that it is difficult to ensure the consistency of each array element and lead out the electrode of each piezoelectric array element. The positive negative pole lug connection to outside cable with piezoelectric array element is then, when ultrasonic transducer's array element number is comparatively huge, if adopt the full wiring mode for every array element independent wiring, make every array element all produce independent pulse signal, because the electrode of piezoelectric patch is unreliable to lead to the welded unreliable, and the uniformity of every array element lead wire also can not be guaranteed in the direct welding. And the traditional preparation scheme is difficult to ensure that the array element interval is smaller than the minimum interval required by not generating side lobes, and the ultrasonic transducer cannot be ensured to obtain a good focusing deflection sound field.
Disclosure of Invention
The present invention is directed to overcome the above-mentioned deficiencies of the prior art and to provide a mode-switching ultrasonic transducer and a method for manufacturing the same, wherein the ultrasonic transducer can obtain a good focused deflection sound field.
The technical scheme of the invention is as follows: a mode conversion ultrasonic transducer comprises a shell, a mode conversion piezoelectric patch and a circuit board, wherein the mode conversion piezoelectric patch is arranged in the shell, and the circuit board is connected with the mode conversion piezoelectric patch; the mode conversion piezoelectric patch comprises a plurality of piezoelectric blocks, one surface of the mode conversion piezoelectric patch is provided with a slot for the circuit board to be inserted into, the two sides of the slot are electrodes of the piezoelectric blocks, and the circuit board is inserted into the slot and connected with the electrodes.
Optionally, one surface of the circuit board is provided with a positive lead, the other surface of the circuit board is provided with a negative lead, and the circuit board is connected with a cable or a bus board.
Optionally, the number of the slots is at least two, each slot is arranged in parallel and divides each piezoelectric block into at least three rows, two sides of each slot are respectively provided with a positive electrode conducting layer and a negative electrode conducting layer, the positive electrode conducting layer is connected with one side surface of one row of the piezoelectric blocks, the negative electrode conducting layer is connected with one side surface of another adjacent row of the piezoelectric blocks, and two opposite side surfaces of the same row of the piezoelectric blocks are respectively provided with the positive electrode conducting layer and the negative electrode conducting layer.
Optionally, the bottom surface of the mode conversion piezoelectric sheet is provided with a matching layer.
Optionally, the piezoelectric blocks are provided with a plurality of rows and a plurality of columns, and the piezoelectric blocks between adjacent columns are connected by an insulator.
Optionally, the circuit board is a flexible circuit board, and/or the housing is made of a magnetically compatible material.
Optionally, the casing includes a housing and a top cover connected to the housing, the mode conversion piezoelectric patch is disposed in a flat bottom surface of the housing, the circuit board is perpendicular to the mode conversion piezoelectric patch and inserted into the slot, and the cable is inserted through the top cover and connected to the positive lead and the negative lead on two sides of the circuit board.
The embodiment of the invention also provides a manufacturing method of the mode conversion ultrasonic transducer, which comprises the following steps:
preparing a shell, a circuit board and a mode conversion piezoelectric patch which is provided with a slot, wherein two sides of the slot are provided with piezoelectric block electrodes;
disposing the mode converting piezoelectric patch within the housing;
and inserting a circuit board into the slot of the mode conversion piezoelectric patch to connect the circuit board with the electrode of the piezoelectric block.
Optionally, the preparing the mode-converting piezoelectric sheet includes the steps of:
preparing a piezoelectric sheet, forming a first separation groove on the front surface of the piezoelectric sheet along a first direction, and filling a conductive material in the first separation groove; forming a second isolation groove intersecting with the first isolation groove on the front surface of the piezoelectric plate along a second direction, and filling an insulating material in the second isolation groove;
removing the material with the set thickness on the back surface of the piezoelectric sheet, and arranging a matching layer on the back surface of the piezoelectric sheet;
and arranging slots on the conductive object along the first separation groove, so that the conductive object is separated by the slots into a positive conductive layer and a negative conductive layer which are attached to the side surfaces of the piezoelectric blocks in the adjacent rows.
Optionally, a plurality of positive leads and a plurality of negative leads are respectively disposed on two sides of the circuit board, when the circuit board is inserted into the slot, each positive lead is connected to the positive conductive layer on one side of each piezoelectric block in the same row through a conductive material, and each negative lead is connected to the negative conductive layer on one side of each piezoelectric block in another row through a conductive material; a cable is connected to the circuit board.
Optionally, the circuit board is a flexible circuit board.
Optionally, the mode conversion piezoelectric patch is placed in a casing with a plane at the bottom and flattened, and the circuit board is inserted into the slot before or after the mode conversion piezoelectric patch is installed in the casing.
According to the mode conversion ultrasonic transducer and the manufacturing method thereof provided by the invention, the electrodes of the piezoelectric blocks are led out in the width direction by adopting the circuit board (double-sided flexible circuit board), so that the impedance consistency of each piezoelectric block is ensured, and no grating lobe is generated by utilizing the mode conversion mode, so that good sound field focusing performance is obtained.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic perspective assembly view of a mode-converting ultrasonic transducer according to an embodiment of the present invention;
FIG. 2 is an exploded perspective view of a mode-switched ultrasound transducer according to an embodiment of the present invention;
FIG. 3 is an exploded perspective partial cross-sectional view of a mode-converting ultrasound transducer provided by an embodiment of the present invention;
fig. 4 is a schematic perspective view of a piezoelectric plate in a method for manufacturing a mode-conversion ultrasonic transducer according to an embodiment of the present invention;
FIG. 5 is a schematic perspective view of the piezoelectric plate shown in FIG. 4 after a first separation groove is formed therein;
FIG. 6 is a perspective view of the piezoelectric sheet of FIG. 5 after the first separation grooves are filled with a conductive material;
FIG. 7 is a schematic perspective view of the piezoelectric plate shown in FIG. 6 after a second slot is formed therein;
FIG. 8 is a perspective view of the piezoelectric sheet of FIG. 7 after the second slots are filled with insulation;
FIG. 9 is a perspective view of the piezoelectric patch of FIG. 8 with a set thickness of material removed from the back side;
FIG. 10 is a schematic perspective view of the piezoelectric plate of FIG. 9 with a matching layer on the back side;
FIG. 11 is a perspective view of the piezoelectric patch of FIG. 10 with slots formed in the front surface thereof to form a mode-switching piezoelectric patch;
fig. 12 is a perspective view of the circuit board in the present embodiment;
fig. 13 is a perspective view of the circuit board in the present embodiment;
fig. 14 is a perspective view illustrating the circuit board of the present embodiment being inserted into the slot of the mode-switching piezoelectric plate.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present.
It should be noted that the terms of orientation such as left, right, up and down in the embodiments of the present invention are only relative to each other or are referred to the normal use state of the product, and should not be considered as limiting.
As shown in fig. 1 to 3, a mode conversion ultrasonic transducer according to an embodiment of the present invention includes a housing 1, a mode conversion piezoelectric plate 2, a circuit board 3, and a cable 4, where the mode conversion piezoelectric plate 2 is disposed in the housing 1, the circuit board 3 is connected to the mode conversion piezoelectric plate 2, and the cable 4 may be directly connected to the circuit board 3 or indirectly connected to the circuit board 3 through a bus circuit board (bus bar). The mode conversion piezoelectric sheet 2 may include a plurality of piezoelectric blocks 20 arranged in a matrix at intervals, one surface of the mode conversion piezoelectric sheet 2 is provided with a slot 201 for inserting the circuit board 3, two sides of the slot 201 are electrodes of the piezoelectric blocks 20, two surfaces of the circuit board 3 are provided with electrode leads, and the circuit board 3 is inserted into the slot 201 and connected with the electrodes of the piezoelectric blocks 20. Mode conversion piezoelectric plate 2 can adopt piezoceramics to make, utilize piezoceramics to have the characteristic of many vibration modes, design two-dimensional area array ultrasonic transducer through piezoceramics's mode conversion, the electrode of every array element (piezoelectric block 20) adopts circuit board 3 (two-sided flexible circuit board) to draw forth in the width direction, guarantee the uniformity of every array element (piezoelectric block 20) impedance, utilize mode conversion's mode, set up piezoelectricity combined material's electrode in the width direction (the width of this direction can set up and be less than not producing within the width that the acoustics parameter of grating lamella required, specifically can set for according to actual conditions), but the acoustic radiation direction of paying attention to is piezoelectric material's thickness direction, just so guarantee not to appear the grating lamella, obtain good focusing performance then.
Optionally, one side of the same slot 201 is a positive electrode conductive layer 211 of the same row of piezoelectric blocks 20, and the other side of the same slot 201 is a negative electrode conductive layer 212 of an adjacent row of piezoelectric blocks 20. One side of the circuit board 3 is provided with a plurality of groups of anode leads 31 which are uniformly distributed at intervals, and the other side of the circuit board 3 is provided with a plurality of groups of cathode leads 32 which are uniformly distributed at intervals. Each set of positive leads 31 is connected to the positive conductive layer 211 on one side of one of the piezoelectric blocks 20 directly or through a conductive connector (e.g., a conductive adhesive). Each set of negative leads 32 is connected to a negative conductive layer 212 on one side of the piezoelectric block 20, either directly or through a conductive connector (e.g., conductive adhesive). The circuit board 3 may be perpendicular to the mode conversion piezoelectric sheet 2 and inserted into the slot 201. Adjacent piezoelectric blocks 20, positive electrode conductive layer 211 and negative electrode conductive layer 212 in the same row are separated by an insulator 220, and the insulator 220 may be provided in a plurality of columns. The insulation 220 may be an insulating polymer or air. It should be noted that the rows and columns in the present embodiment are only relative concepts, and should not be understood as having a limiting effect.
Optionally, at least two slots 201 are provided, each slot 201 is disposed in parallel and divides each piezoelectric block 20 into at least three rows, two sides of each slot 201 are respectively a positive conductive layer 211 and a negative conductive layer 212 that are spaced from each other, the positive conductive layer 211 on one side of the slot 201 is in contact with one side of one row of piezoelectric blocks 20, and the negative conductive layer 212 on the other side of the slot 201 is in contact with one side of another adjacent row of piezoelectric blocks 20. Except for the piezoelectric blocks 200 at the edge, the piezoelectric blocks 20 in the same row have positive electrode conductive layers 211 and negative electrode conductive layers 212 on two opposite sides, and the piezoelectric blocks 20 may be arranged in a matrix, separated by the slots 201 and the electrode conductive layers in the row direction, and separated and connected by the insulators 220 in the column direction.
Optionally, the bottom surface of the mode conversion piezoelectric sheet 2 is provided with a matching layer 5. The thickness of the matching layer 5 is such that it meets the acoustic performance requirements. The matching layer 5 has the function of ensuring that the acoustic energy can be more effectively output on one hand; on the other hand, as a base of the composite material (mode-converting piezoelectric sheet 2), the composite material is supported after the cell partitions the electrode. Optionally, an acoustic lens may be provided on the surface of the matching layer 5, which may increase the focusing effect of the probe.
In this embodiment, the mode-switching piezoelectric sheet 2 may have a rectangular shape, the piezoelectric blocks 20 are arranged in a plurality of rows and a plurality of columns, and the piezoelectric blocks 20 between adjacent columns are connected and separated by the insulator 220.
Optionally, the circuit board 3 in this embodiment may be a flexible circuit board or a common PCB.
Alternatively, the housing 1 may be made of a magnetically compatible material, such as plastic, bakelite, etc.
Optionally, the casing 1 includes a casing 11 and a top cover 12 connected to the casing 11, a flat bottom surface is provided in the casing 11, the mode conversion piezoelectric patches 2 are disposed in the flat bottom surface of the casing 11, the circuit board 3 is inserted into the slot 201 perpendicular to the mode conversion piezoelectric patches 2, and the cable 4 is inserted through the top cover 12 and connected to the positive electrode lead 31 and the negative electrode lead 32 on both sides of the circuit board 3, which are arranged regularly. The housing 1 may be rectangular, cylindrical, etc.
As shown in fig. 1 to 3, an embodiment of the present invention further provides a method for manufacturing a mode conversion ultrasonic transducer, which can be used for manufacturing the above mode conversion ultrasonic transducer, and includes the following steps:
preparing a shell 1, a circuit board 3, a cable 4 and a mode conversion piezoelectric sheet 2 which is provided with a slot 201, wherein the two sides of the slot 201 are provided with piezoelectric block 20 electrodes;
the mode conversion piezoelectric sheet 2 is arranged in the shell 1;
inserting the circuit board 3 into the slot 201 of the mode conversion piezoelectric sheet 2, so that the circuit board 3 is connected with the electrodes of the piezoelectric block 20;
the cable 4 is connected to the circuit board 3.
Alternatively, the preparation of the mode-switching piezoelectric sheet 2 includes the steps of:
referring to fig. 3 to 8, a piezoelectric sheet 210 is prepared, a plurality of first grooves 231 are formed in the front surface of the piezoelectric sheet 210 along a first direction, the spacing and depth of the first grooves 231 can be determined by the acoustic characteristics of the transducer, the cut M rows of piezoelectric ceramic columns are determined by a set array element matrix, and a conductive material 230 (conductive polymer) is filled in the first grooves 231; the conductive polymer can be connected with the M rows of ceramic columns on one hand, and can be used for preparing electrodes (the positive electrode conductive layer 211 and the negative electrode conductive layer 212) of the piezoelectric material on the other hand. The piezoelectric material can be excited by the electrodes (the positive conductive layer 211 and the negative conductive layer 212) to stimulate the piezoelectric sheet 210 to generate ultrasonic radiation force. A plurality of second grooves 241 intersecting with the first grooves 231 are formed in the front surface of the piezoelectric sheet 210 along a second direction, the intervals and the depths of the second grooves 241 can be determined by the acoustic characteristics of the transducer, the N rows of piezoelectric ceramic columns are determined by a set array element matrix, and the second grooves 241 are filled with an insulator 220 (insulating polymer); the insulating polymer can be connected with the N columns of ceramic columns, can be used for inhibiting crosstalk interference among array elements (piezoelectric blocks 20), and can be used for dividing N columns of electrodes (conductive objects 230) to ensure that each array element (piezoelectric block 20) of the M x N piezoelectric ceramic column matrix has an independent positive electrode surface and an independent negative electrode surface (a positive conductive layer 211 and a negative conductive layer 212). The piezoelectric material (piezoelectric block 20) can be excited by the electrodes (positive and negative electrode surfaces) to stimulate the piezoelectric sheet 210 to generate ultrasonic radiation force. The first grooves 231 and the second grooves 241 may have the same depth.
Referring to fig. 9, a material with a set thickness on the back surface of the piezoelectric sheet 210 is removed, the piezoelectric sheet 210 is ground to at least the bottom surfaces of the first isolation groove 231 and the second isolation groove 241, as shown in fig. 10, and a matching layer 5 is further disposed on the back surface of the piezoelectric sheet 210, where the matching layer 5 serves to ensure that the acoustic energy can be more effectively output; on the other hand, as a substrate of the composite material (mode conversion piezoelectric sheet 2), the composite material is supported after the electrodes are divided by the grooves;
as shown in fig. 11, a slot 201 is disposed on the conductive object 230 along the first separation groove 231, so that the conductive object 230 is separated by the slot 201 into a positive conductive layer 211 and a negative conductive layer 212 attached to the side surface of the piezoelectric block 20 in the adjacent row.
Optionally, the step of providing the slot 201 may include the following steps: the conductive polymer filled in the first isolation groove 231 is divided along the central line thereof to form the insertion groove 201, and the cut insertion groove 201 is narrower than the first isolation groove 231 and cuts through the conductive polymer filled in the first isolation groove 231 in the depth direction. This allows the conductive polymer filled in the first grooves 231 to be divided into two parts, which are used as the electrodes (the positive electrode conductive layer 211 and the negative electrode conductive layer 212) of the piezoelectric blocks 20 that are adjacent to each other.
Alternatively, as shown in fig. 12 to 14, a plurality of positive leads 31 and a plurality of negative leads 32 are respectively disposed on two sides of the circuit board 3, the circuit board 3 is a double-sided circuit board, when the circuit board 3 is inserted into the slot 201, each positive lead 31 is respectively connected to the positive conductive layer 211 on one side of each piezoelectric block 20 in the same row through a conductive material or directly, and each negative lead 32 is respectively connected to the negative conductive layer 212 on one side of each piezoelectric block 20 in the other row through a conductive material or directly. The conductive material may be conductive paste, etc.
Alternatively, the circuit board 3 may be a double-sided flexible circuit board 3 or a common double-sided PCB board. The positive and negative electrode leads of the piezoelectric sheet 210 are led by using the double-sided circuit board 3, the corresponding electrode leads are arranged on both sides of the circuit board 3, and if the electrode on one side is defined as the positive electrode, the electrode on the corresponding side is defined as the negative electrode. Each double-sided circuit board 3 is once installed in a clamping groove of M-row cutting, small clearance fit or interference fit is formed between the circuit board 3 and the clamping groove, a certain mechanical contact is formed, and then the electrode lead of the circuit board 3 is bonded with the electrode conducting layers (the positive conducting layer 211 and the negative conducting layer 212) of the array element by using conducting materials. Therefore, on one hand, the positioning function can be achieved, and on the other hand, the conductivity of the electrode lead and the electrode conducting layer can be ensured. Finally, the electrode conducting layer of each array element can be led in such a way, and positive and negative electric signals are applied to two sides of the circuit board 3 so as to excite each array element to work.
Alternatively, the mode conversion piezoelectric plate 2 may be placed in the casing 1 having a plane at the bottom and flattened, the circuit board 3 is inserted into the slot 201 before the mode conversion piezoelectric plate 2 is installed in the casing 1 or after the mode conversion piezoelectric plate is installed in the casing 1, the electrode leads on both sides of the circuit board 3 are connected to the electrode conductive layers on both sides of the slot 201, and the positive and negative signal lines are connected to both sides of the circuit board 3. Of course, an additional wiring board (bus board) may be connected to each circuit board 3, and the cable 4 may be connected to the flexible circuit board 3. In the embodiment, the mode conversion piezoelectric pieces 2 (piezoelectric ceramics) of the M × N array on which the circuit board 3 is mounted are mounted in the shell 11, and the bottom surface of the matching layer 5 and the bottom surface of the shell 11 are mounted on the same plane and flattened, so that the flatness of the transducer can be ensured on one hand, and the consistency of a batch of prepared probes is ensured; on the other hand, the probe array element can be protected from being deformed easily and the inside of the probe array element is not damaged easily. The shell 11 is packaged and the circuit leads are processed to prepare the final mode conversion two-dimensional area array ultrasonic transducer.
According to the mode conversion ultrasonic transducer and the manufacturing method thereof provided by the embodiment of the invention, the characteristics that piezoelectric ceramics have a plurality of vibration modes are utilized, the vibration mode in the required sound radiation direction is selected, the pure vibration mode is designed and selected in the required sound radiation direction, the sound radiation direction A is the thickness direction of the mode conversion piezoelectric sheet 2, the electrode application direction B is perpendicular to the sound radiation direction A, the flexible circuit board 3 is adopted for leading out the electrode of each array element, the problem of unreliable welding is solved, and the impedance consistency of each array element is ensured. By using a mode conversion mode, the piezoelectric composite material can be prepared in such a way that the spacing between the ceramic columns is smaller than a certain value, so that no grating lobe is generated, and good focusing performance can be obtained. Moreover, by preparing the mode conversion electrode surfaces (the positive electrode conducting layer 211 and the negative electrode conducting layer 212), the clamping groove and the double-sided circuit board 3 lead, full wiring can be carried out on the two-dimensional area array, the problems of unreliable traditional ultrasonic welding, long consumed time and high cost are solved, and the method is more suitable for batch production of multi-array element two-dimensional area array ultrasonic transducers.
The present invention is not limited to the above preferred embodiments, and any modification, equivalent replacement or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (12)
1. The mode conversion ultrasonic transducer is characterized by comprising a shell, a mode conversion piezoelectric sheet and a circuit board, wherein the mode conversion piezoelectric sheet is arranged in the shell, and the circuit board is connected with the mode conversion piezoelectric sheet; the mode conversion piezoelectric patch comprises a plurality of piezoelectric blocks, one surface of the mode conversion piezoelectric patch is provided with a slot for the circuit board to be inserted into, the two sides of the slot are electrodes of the piezoelectric blocks, and the circuit board is inserted into the slot and connected with the electrodes.
2. The mode-switching ultrasonic transducer of claim 1, wherein a positive lead is provided on one side of the circuit board, a negative lead is provided on the other side of the circuit board, and the circuit board is connected to a cable or a bus bar.
3. The ultrasonic transducer of claim 1, wherein the slots are at least two, each slot is disposed in parallel and divides each piezoelectric block into at least three rows, the slots are respectively provided with a positive conductive layer and a negative conductive layer on two sides, the positive conductive layer is connected to one side of one row of the piezoelectric blocks, the negative conductive layer is connected to one side of another adjacent row of the piezoelectric blocks, and two opposite sides of the piezoelectric blocks in the same row are respectively provided with a positive conductive layer and a negative conductive layer.
4. A mode converting ultrasound transducer according to claim 1, wherein the bottom surface of said mode converting piezoelectric patch is provided with a matching layer.
5. A mode converting ultrasonic transducer according to claim 1, wherein said piezoelectric blocks are arranged in a plurality of rows and columns, and said piezoelectric blocks between adjacent columns are connected by an insulator.
6. The mode-converting ultrasonic transducer of claim 1, wherein the circuit board is a flexible circuit board and/or the housing is made of a magnetically compatible material.
7. The ultrasonic transducer of claim 2, wherein the housing comprises a casing and a top cover connected to the casing, the mode converting piezoelectric patch is disposed in a flat bottom surface of the casing, the circuit board is inserted into the slot perpendicular to the mode converting piezoelectric patch, and the cable is inserted through the top cover and connected to the positive lead and the negative lead on two sides of the circuit board.
8. A method of manufacturing a mode-converting ultrasound transducer, comprising the steps of:
preparing a shell, a circuit board and a mode conversion piezoelectric patch which is provided with a slot, wherein two sides of the slot are provided with piezoelectric block electrodes;
disposing the mode converting piezoelectric patch within the housing;
and inserting a circuit board into the slot of the mode conversion piezoelectric patch to connect the circuit board with the electrode of the piezoelectric block.
9. The method of manufacturing a mode converting ultrasound transducer according to claim 8, wherein preparing said mode converting piezoelectric sheet comprises the steps of:
preparing a piezoelectric sheet, forming a first separation groove on the front surface of the piezoelectric sheet along a first direction, and filling a conductive material in the first separation groove; forming a second isolation groove intersecting with the first isolation groove on the front surface of the piezoelectric plate along a second direction, and filling an insulating material in the second isolation groove;
removing the material with the set thickness on the back surface of the piezoelectric sheet, and arranging a matching layer on the back surface of the piezoelectric sheet;
and arranging slots on the conductive object along the first separation groove, so that the conductive object is separated by the slots into a positive conductive layer and a negative conductive layer which are attached to the side surfaces of the piezoelectric blocks in the adjacent rows.
10. The method according to claim 9, wherein a plurality of positive leads and a plurality of negative leads are respectively disposed on two sides of the circuit board, and when the circuit board is inserted into the slot, each positive lead is connected to the positive conductive layer on one side of each piezoelectric block in a same row via a conductive material, and each negative lead is connected to the negative conductive layer on one side of each piezoelectric block in another row via a conductive material; a cable is connected to the circuit board.
11. The method of manufacturing a mode conversion ultrasound transducer according to claim 10, wherein the circuit board is a flexible circuit board.
12. The method of claim 10, wherein the mode-converting piezoelectric patch is placed in a housing having a flat bottom and pressed flat, and the circuit board is inserted into the slot before or after the mode-converting piezoelectric patch is placed in the housing.
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