CN109917953B - Display device and preparation method thereof - Google Patents
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Abstract
The application discloses display device and preparation method thereof, the display device includes: the display panel comprises a first side and a second side which are arranged in an opposite way, wherein the first side is provided with a display area and a non-display area, the non-display area is positioned at the periphery of the display area, the non-display area comprises a first non-display area and a second non-display area, the first non-display area and the display area are arranged in a coplanar way, and the second non-display area is bent from the first non-display area to the second side of the display panel; a touch layer on the first side of the display panel; the display panel comprises a first side and a second side, wherein the first side of the display panel is provided with a display binding pad and a touch binding pad, and the display binding pad and the touch binding pad are located in the second non-display area and located on two opposite sides of the display area. Through the mode, the probability that the lead connected with the display binding pad or the touch binding pad is broken in the bending area can be reduced.
Description
Technical Field
The present disclosure relates to display technologies, and particularly to a display device and a manufacturing method thereof.
Background
The display device with touch function is the simplest, convenient and widely applied man-machine interaction mode at present. Generally, a display device with touch function includes a display panel and a touch layer disposed on one side of the display panel, wherein the touch layer provides the touch function and the display panel provides the display function. One side of the display panel is generally provided with a touch binding pad and a display binding pad, the touch layer is connected with the touch binding pad through a plurality of touch leads, and the display panel is connected with the display binding pad through a plurality of display leads.
Disclosure of Invention
The inventor of the present application finds, in a long-term research process, that the display panel includes a display area and a non-display area located around the display area, and the touch bonding pad and the display bonding pad in the current display device are disposed in the non-display area that is bent toward a side of the display panel where the touch layer is not disposed, and the touch bonding pad and the display bonding pad are located on the same side of the display area. The design method enables the touch lead and the display lead to be stacked up and down, and further leads to that when the binding pad is bent to the back of the screen body, the touch lead or the display lead positioned outside the bending area is subjected to large tensile stress and is easy to break.
The technical problem mainly solved by the application is to provide a display device and a manufacturing method thereof, which can reduce the probability of breakage of a lead connected with a display binding pad or a touch binding pad in a bending area.
In order to solve the technical problem, the application adopts a technical scheme that: provided is a display device including: the display panel comprises a first side and a second side which are arranged in an opposite way, wherein the first side is provided with a display area and a non-display area, the non-display area is positioned at the periphery of the display area, the non-display area comprises a first non-display area and a second non-display area, the first non-display area and the display area are arranged in a coplanar way, and the second non-display area is bent from the first non-display area to the second side of the display panel; a touch layer on the first side of the display panel; the display panel comprises a first side and a second side, wherein the first side of the display panel is provided with a display binding pad and a touch binding pad, and the display binding pad and the touch binding pad are located in the second non-display area and located on two opposite sides of the display area.
In order to solve the above technical problem, another technical solution adopted by the present application is: there is provided a method of manufacturing a display device, the method including: providing a display panel, wherein the display panel comprises a first side and a second side which are arranged oppositely, the first side is provided with a display area and a non-display area, the non-display area is positioned at the periphery of the display area, the non-display area comprises a first non-display area and a second non-display area, the first non-display area and the display area are arranged in a coplanar manner, and the second non-display area is bent from the first non-display area to the second side of the display panel; arranging a display binding pad and a touch binding pad on the first side of the display panel, wherein the display binding pad and the touch binding pad are positioned in the second non-display area and on two opposite sides of the display area; forming a touch layer on the first side of the display panel.
The beneficial effect of this application is: different from the prior art, the display device that this application provided includes display panel, display panel includes first side and second side, and first side is provided with the display area and is located the peripheral non-display area of display area, and the non-display area includes first non-display area and second non-display area, and first non-display area sets up with the display area coplane, and the second non-display area is crooked from first non-display area to display panel's second side, shows that to bind pad and touch-control to bind the pad and be located the second non-display area, and be in the relative both sides of display area. Because the display binding pad and the touch binding pad are positioned at two opposite sides of the display area, the display lead wire connected with the display binding pad and the touch lead wire connected with the touch binding pad do not have the problem of up-down stacking between the display lead wire and the touch lead wire; compared with the existing design mode, the design mode provided by the application has the advantages that the tensile stress applied to the touch lead or the display lead positioned outside the bending area is reduced, so that the probability of fracture of the subsequent display lead or the touch lead can be reduced.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts. Wherein:
FIG. 1 is a schematic diagram of a display device according to an embodiment of the present application;
FIG. 2 is a schematic structural diagram of an embodiment of a touch layer shown in FIG. 1;
fig. 3 is a schematic structural diagram of an embodiment of a method for manufacturing a display device according to the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1, fig. 1 is a schematic structural diagram of an embodiment of a display device according to the present application, where the display device 1 includes a display panel 10 and a touch layer 12.
Specifically, the display panel 10 includes a first side 100 and a second side 102 disposed opposite to each other, the first side 100 is disposed with a display area AA and a non-display area BB, and the non-display area BB is located at the periphery of the display area AA. The non-display area BB includes a first non-display area 20 and a second non-display area 22, the first non-display area 20 being disposed coplanar with the display area AA, the second non-display area 22 being curved from the first non-display area 20 toward the second side 102 of the display panel 10. The touch layer 12 is located on the first side 100 of the display panel 10. In this embodiment, the display panel 10 is provided with a display bonding pad 104 and a touch bonding pad 106 on the first side 100, and the display bonding pad 104 and the touch bonding pad 106 are located in the second non-display area 22 and on opposite sides of the display area AA.
The above design method enables the plurality of display leads connected with the display bonding pad 104 and the plurality of touch leads connected with the touch bonding pad 106 to be free from the problem of stacking up and down, and when the display bonding pad 104 and the touch bonding pad 106 are bent to the second side 102 of the display panel 1, compared with the traditional design method, the display leads and the touch leads provided by the present application have reduced tensile stress in the bending area, so that the probability of breakage of the subsequent display leads or touch leads can be reduced. In addition, the mode that this application provided can also provide sufficient space for follow-up display lead or touch-control lead, reduces the probability that the display lead or touch-control lead self piles up each other, and then further reduces the probability that the too big fracture of emergence of tensile stress when the display lead or touch-control lead are crooked in the bending region.
In an application scenario, please continue to refer to fig. 1, the second non-display area 22 includes a curved transition area 220 and a parallel extension area 222, two ends of the curved transition area 220 are respectively connected to the first non-display area 20 and the parallel extension area 222, the curved transition area 220 extends from the first non-display area 20 in a direction away from the touch layer 12, and the parallel extension area 222 extends from the curved transition area 220 in a direction facing the display area AA and parallel to the first non-display area 20, wherein the display bond pad 104 and the touch bond pad 106 are located in the parallel extension area 222. The curved transition region 220 is an arc, and the radian of the arc can be set according to actual requirements. Through the above design, the display bonding pad 104 and the touch bonding pad 106 can be bent to the back side (i.e., the second side 102) of the display panel 10, so that the width of the frame of the display device 1 can be reduced, and the requirement of a narrow frame can be met.
In the present embodiment, the display panel 10 may be an OLED display panel, a Micro-OLED display panel, or the like. The structure of the display panel 10 may be any one of the prior art, for example, the display panel 10 includes an array substrate 103, and a display bonding pad 104 and a touch bonding pad 106 are disposed on the array substrate 103. Of course, in other embodiments, the touch bonding pad 106 may be disposed in other areas, for example, the touch bonding pad 106 may be disposed at an edge of the touch layer 12, so long as it is ensured that orthographic projections of the touch bonding pad 106 and the display bonding pad 104 on the array substrate 103 are located at two opposite sides of the display area AA. The thin film transistor layer in the array substrate 103 is connected to the display bonding pad 104 through a plurality of display leads (not shown in fig. 1), the display bonding pad 104 is connected to one end of the corresponding first flexible circuit board 108, the other end of the first flexible circuit board 108 is connected to the display driver chip, and the display driver chip can control the display function of the display device 1 through the first flexible circuit board 108. The touch electrodes (not shown in fig. 1) in the touch layer 12 are electrically connected to the touch bonding pads 106 through a plurality of touch leads (not shown in fig. 1), the touch bonding pads 106 are connected to one end of the corresponding second flexible circuit board 101, the other end of the second flexible circuit board 101 is connected to the touch chip, and the touch chip determines the touch position information of the user by testing the capacitance change of the touch electrodes.
In addition, the display panel 10 provided by the present application may further include other structures, such as the light emitting layer 105, the encapsulation layer 107, and the substrate 109. The light emitting layer 105 is located on one side of the array substrate 103 close to the touch layer 12, and the encapsulation layer 107 is located between the light emitting layer 105 and the touch layer 12 and wraps the light emitting layer 105. The encapsulation layer 107 may be any encapsulation known in the art, such as a film encapsulation, a Frit-glass encapsulation, or the like. The substrate 109 is located on the side of the array substrate 103 away from the touch layer 12, and in this embodiment, the substrate 109 is a flexible substrate (e.g., polyimide, etc.).
The display device 1 provided by the present application is further described below from the perspective of the touch layer 12. Referring to fig. 2, fig. 2 is a schematic structural diagram of an embodiment of the touch layer in fig. 1. The touch layer 12 is provided with a plurality of touch areas 120, and each touch area 120 is provided with a plurality of touch electrodes 1200. The touch electrodes 1200 in different touch areas 120 are disconnected from each other, and the touch electrodes 1200 in the same touch area 120 are also disconnected from each other.
In one embodiment, as shown in fig. 2, the touch electrode 1200 includes a transmitting electrode a extending along a first direction X and a receiving electrode B extending along a second direction Y, the first direction X is perpendicular to the second direction Y, and the touch layer 12 is divided into at least two (e.g., 2, 3, 4, etc.) touch areas 120 along at least one of the first direction X and the second direction Y. Compared with the conventional method, by the above design of the plurality of touch areas 120, the parasitic capacitance between each touch electrode 1200 and the display panel 10 (e.g., the electrode of the light emitting layer 105) is reduced, so that the driving load of the touch chip can be reduced. Preferably, the touch layer 12 is divided into at least two (e.g., 2, 3, 4, etc.) touch areas 120 along the first direction X and the second direction Y, respectively. The touch layer 12 is divided into P touch areas 120 along the first direction X, and the touch layer 12 is divided into Q touch areas 120 along the second direction Y, where the values of P and Q may be the same or different. In another embodiment, the first direction X and the second direction Y may not be perpendicular, that is, the first direction X and the second direction Y may be disposed in a non-parallel manner.
In another embodiment, in each touch area 120, each transmitting electrode a is composed of M interconnected first electrode blocks a, and each receiving electrode B is composed of N interconnected second electrode blocks B; m, N is a positive integer; the touch area 120 is composed of N transmitting electrodes a extending along the first direction X and M receiving electrodes B extending along the second direction Y. The values of M and N can range from 10 to 40 (e.g., 10, 20, 30, 40), and so forth. For a single touch area 120, the values of M and N may be the same or different. For the adjacent touch areas 120, the number of the first electrode blocks a in the adjacent touch areas 120 may be the same or different; the number of the second electrode blocks b in the adjacent touch areas 120 may be the same or different. The plurality of first electrode blocks a can be positioned in gaps of the plurality of second electrode blocks b, the plurality of first electrode blocks a can be connected through the first bridging part, and the plurality of second electrode blocks b can be directly and electrically connected to form a single-layer touch electrode structure; of course, in other embodiments, the first electrode blocks a and the second electrode blocks b may form a dual-layer touch electrode structure. The first electrode block a and the second electrode block b can be the same in shape or different in shape, and the first electrode block a and the second electrode block b can be in a diamond shape, a square shape, a circular shape, an oval shape and the like. Of course, in other embodiments, the transmitting electrode a and the receiving electrode B may be a whole strip-shaped electrode.
The operation mode corresponding to the structure of the touch layer 12 in fig. 2 may be a self-capacitance type or a mutual capacitance type. When the self-capacitance type working mode is adopted, the transmitting electrode A and the receiving electrode B are both used as sensing channels, and the touch chip judges whether touch occurs or not by detecting whether capacitance values of the sensing channels to the ground change or not. When the mutual capacitance type working mode is adopted, the touch chip can input driving signals to the transmitting electrode A row by row, then the touch chip receives induction signals of the electrode B row by row, and the touch chip judges whether mutual capacitance between the transmitting electrode A and the receiving electrode B changes or not to judge whether touch occurs or not.
In another embodiment, referring to fig. 2 again, the display device 1 provided by the present application further includes: one end of each first lead 30 is connected with the emitting electrode a, and the other end of each first lead 30 is directly led out from the touch area 120 to the touch binding area 106; and one end of each second lead wire 32 is connected to the receiving electrode B, and the other end of each second lead wire 32 is directly led out from the touch area 120 to the touch bonding area 106. The first lead 30 and the second lead 32 are the touch leads mentioned in the above embodiments. The conventional method for leading the first and second lead lines 30 and 32 out to the touch-sensing bonding area 106 is to extend the other ends of the first and second lead lines 20 and 32 to the edge of the touch-sensing layer 12, and then connect the other ends to the touch-sensing bonding area 106 from the edge. Compared with the conventional method, the method that the first lead 30 and the second lead 32 are directly led out from the touch area 120 to the touch bonding area 106 can reduce the width of the edge of the display device 1, and provide technical support for realizing a narrow frame.
In an application scenario, referring to fig. 2 again, when the other ends of the first lead 30 and the second lead 32 are directly led out from the touch area 120 to the touch pad 106, the light emitting area needs to be avoided to avoid the influence on the light emitting effect. When the emitting electrode a and the receiving electrode B are made of a non-transparent conductive material (e.g., a metal material), the first lead 30 is led out from the inside or the edge of the emitting electrode a, and the second lead 32 is led out from the inside or the edge of the receiving electrode B, as long as the first lead 30 and the second lead 32 avoid the light emitting region; for example, as shown in fig. 2, the first lead 30 is drawn from the inside of the emitter electrode a. Certainly, in other application scenarios, the transmitting electrode a and the receiving electrode B may also be made of a transparent conductive material (e.g., ITO, etc.), in which case the first lead 30 needs to be led out from the edge of the transmitting electrode a, the second lead 32 needs to be led out from the edge of the receiving electrode B, and the first lead 30 and the second lead 32 need to avoid the light emitting area; that is, the first lead 30 in fig. 2 is changed to be led out from the edge of the emitter electrode a.
Referring to fig. 3, fig. 3 is a schematic flow chart of an embodiment of a method for manufacturing a display device according to the present application. The preparation method comprises the following steps:
s101: the display panel comprises a first side and a second side which are arranged oppositely, a display area and a non-display area are arranged on the first side, the non-display area is located on the periphery of the display area, the non-display area comprises a first non-display area and a second non-display area, the first non-display area and the display area are arranged in a coplanar mode, and the second non-display area is bent from the first non-display area to the second side of the display panel.
Specifically, referring to fig. 1, the display panel 10 may be formed in any conventional manner, and will not be described in detail herein. For example, the step S101 specifically includes: providing a substrate 109; forming an array substrate 103 on one side of the substrate 109; forming a light-emitting layer 105 on the side of the array substrate 103 away from the substrate 109; an encapsulation layer 107 is formed on the array substrate 103 away from the substrate 109, and the encapsulation layer 107 covers the light-emitting layer 105.
S102: and arranging a display binding pad and a touch binding pad on the first side of the display panel, wherein the display binding pad and the touch binding pad are positioned in the second non-display area and are positioned on two opposite sides of the display area.
Specifically, referring to fig. 1, in one embodiment, the display bonding pad 104 and the touch bonding pad 106 may be disposed on the array substrate 103. The method of forming the display bond pad 104 or the touch bond pad 106 may be: firstly, carrying out plasma cleaning and grinding treatment on a binding surface of a display binding pad 104 or a touch binding pad 106 to be formed on an array substrate 103; and then forming conductive silver paste on the binding surface, so that the display binding pad 104 or the touch binding pad 106 is formed.
S103: a touch layer is formed on the first side of the display panel.
Specifically, referring to fig. 1, in one embodiment, the touch layer 12 may be formed on a side of the package layer 107 of the display panel 10 away from the array substrate 103. Referring to fig. 2, the step S103 specifically includes: dividing the touch layer 12 to be formed into a plurality of touch areas 120; the touch electrodes 1200 are formed in each touch area 120, and the touch electrodes 1200 in different touch areas 120 are disconnected from each other. The touch electrode 1200 may be formed by: forming a transparent conductive material layer or a non-transparent conductive material layer on the package layer 107, and then forming a photoresist layer on the transparent conductive material layer or the non-transparent conductive material layer; exposing and developing the photoresist by using a mask plate; etching the transparent conductive material layer or the non-transparent conductive material layer by using an etching process to remove the area which is not covered by the photoresist; and removing the residual photoresist.
In this embodiment, the display panel is bent before step S102, and in other embodiments, both ends of the substrate may be bent away from the touch layer after step S103 to bend the display binding portion and the touch binding portion to the other side of the touch layer.
In summary, different from the situation of the prior art, the display device provided by the present application includes a display panel, the display panel includes a first side and a second side, and the first side is provided with a display area and a non-display area located at the periphery of the display area, the non-display area includes a first non-display area and a second non-display area, the first non-display area is disposed coplanar with the display area, the second non-display area is bent from the first non-display area to the second side of the display panel, and the display bonding pad and the touch bonding pad are located in the second non-display area and located at two opposite sides of the display area. Because the display binding pad and the touch binding pad are positioned at two opposite sides of the display area, the lead wires connected with the display binding pad and the lead wires connected with the touch binding pad are not stacked up and down; compared with the existing design mode, the touch control lead wire or the display lead wire positioned outside the bending area in the design mode provided by the application is reduced in tensile stress, so that the probability of breakage of the follow-up lead wire can be reduced.
The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.
Claims (10)
1. A display device, characterized in that the display device comprises:
the display panel comprises a first side and a second side which are arranged in an opposite way, wherein the first side is provided with a display area and a non-display area, the non-display area is positioned at the periphery of the display area, the non-display area comprises a first non-display area and a second non-display area, the first non-display area and the display area are arranged in a coplanar way, and the second non-display area is bent from the first non-display area to the second side of the display panel;
a touch layer on the first side of the display panel;
the display panel comprises a first side and a second side, wherein the first side of the display panel is provided with a display binding pad and a touch binding pad, and the display binding pad and the touch binding pad are located in the second non-display area and located on two opposite sides of the display area.
2. The display device according to claim 1, wherein the second non-display area includes a curved transition area and a parallel extension area, two ends of the curved transition area are respectively connected to the first non-display area and the parallel extension area, the curved transition area extends from the first non-display area to a direction away from the touch layer, the parallel extension area extends from the curved transition area to a direction toward the display area and parallel to the first non-display area, and wherein the display bonding pad and the touch bonding pad are located in the parallel extension area.
3. The display device according to claim 1,
the display panel comprises an array substrate, and the display binding pad and the touch binding pad are arranged on the array substrate.
4. The display device according to claim 1, wherein the touch layer has a plurality of touch areas disposed thereon, each touch area having a plurality of touch electrodes disposed therein, the touch electrodes including a transmitting electrode extending in a first direction and a receiving electrode extending in a second direction, the first direction being non-parallel to the second direction.
5. The display device according to claim 4, wherein the touch layer is divided into at least two touch areas in at least one of the first direction and the second direction.
6. The display device according to claim 5,
the touch layer is divided into at least two touch areas along the first direction and the second direction.
7. The display device according to claim 4,
in the touch area, each transmitting electrode is composed of M first electrode blocks which are connected with each other, and each receiving electrode is composed of N second electrode blocks which are connected with each other; m, N is a positive integer; wherein the touch area is composed of N transmitting electrodes extending along the first direction and M receiving electrodes extending along the second direction.
8. The display device according to claim 4, further comprising:
one end of each first lead is connected with the corresponding transmitting electrode, and the other end of each first lead is directly led out of the touch area to the corresponding touch binding pad;
one end of each second lead is connected with the receiving electrode, and the other end of each second lead is directly led out from the touch area to the touch binding pad.
9. A method of manufacturing a display device, the method comprising:
providing a display panel, wherein the display panel comprises a first side and a second side which are arranged oppositely, the first side is provided with a display area and a non-display area, the non-display area is positioned at the periphery of the display area, the non-display area comprises a first non-display area and a second non-display area, the first non-display area and the display area are arranged in a coplanar manner, and the second non-display area is bent from the first non-display area to the second side of the display panel;
arranging a display binding pad and a touch binding pad on the first side of the display panel, wherein the display binding pad and the touch binding pad are positioned in the second non-display area and on two opposite sides of the display area;
forming a touch layer on the first side of the display panel.
10. The method according to claim 9, wherein the forming a touch layer on the first side of the display panel comprises:
dividing the touch layer to be formed into a plurality of touch areas;
touch electrodes are respectively formed in each touch area, wherein the touch electrodes in different touch areas are disconnected with each other.
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| CN201910088155.8A CN109917953B (en) | 2019-01-29 | 2019-01-29 | Display device and preparation method thereof |
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| WO2021088037A1 (en) * | 2019-11-08 | 2021-05-14 | 京东方科技集团股份有限公司 | Array substrate and manufacturing method thereof, display panel, and display device |
| CN114063823A (en) * | 2021-11-23 | 2022-02-18 | Oppo广东移动通信有限公司 | Display device |
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Application publication date: 20190621 Assignee: Yungu (Gu'an) Technology Co., Ltd.|Bazhou Yungu Electronic Technology Co., Ltd.|Kunshan Institute of technology new flat panel display technology center Co., Ltd Assignor: Kunshan Guo Xian Photoelectric Co., Ltd. Contract record no.: X2019990000156 Denomination of invention: Display device and manufacturing method for same License type: Common License Record date: 20191030 |
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Effective date of registration: 20191205 Address after: No. 2 Xiangshan Avenue, Yongning Street, Zengcheng District, Guangzhou, Guangdong province (the core of Zengcheng economic and Technological Development Zone) Applicant after: Guangzhou Guoxian Technology Co., Ltd Address before: 215300, No. 1, Longteng Road, Kunshan Development Zone, Jiangsu, Suzhou, 4 Applicant before: Kunshan Guo Xian Photoelectric Co., Ltd. |
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